CN1015996B - 向制品上镀敷金属的方法及设备 - Google Patents
向制品上镀敷金属的方法及设备Info
- Publication number
- CN1015996B CN1015996B CN85108685.3A CN85108685A CN1015996B CN 1015996 B CN1015996 B CN 1015996B CN 85108685 A CN85108685 A CN 85108685A CN 1015996 B CN1015996 B CN 1015996B
- Authority
- CN
- China
- Prior art keywords
- goods
- plating
- solution
- roughly
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 230000008569 process Effects 0.000 title claims abstract description 36
- 238000000576 coating method Methods 0.000 title claims abstract description 28
- 239000011248 coating agent Substances 0.000 title claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 69
- 239000000126 substance Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 230000004913 activation Effects 0.000 claims abstract description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 238000007772 electroless plating Methods 0.000 claims description 14
- 230000032258 transport Effects 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004327 boric acid Substances 0.000 claims description 4
- 239000012279 sodium borohydride Substances 0.000 claims description 4
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 4
- SDVHRXOTTYYKRY-UHFFFAOYSA-J tetrasodium;dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)P([O-])([O-])=O SDVHRXOTTYYKRY-UHFFFAOYSA-J 0.000 claims description 4
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229960003280 cupric chloride Drugs 0.000 claims description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 238000010129 solution processing Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 10
- 229920003023 plastic Polymers 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 2
- 238000010924 continuous production Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 23
- 239000007788 liquid Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000000746 purification Methods 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 3
- 235000011941 Tilia x europaea Nutrition 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- HSMPDPBYAYSOBC-UHFFFAOYSA-N khellin Chemical compound O1C(C)=CC(=O)C2=C1C(OC)=C1OC=CC1=C2OC HSMPDPBYAYSOBC-UHFFFAOYSA-N 0.000 description 3
- 239000004571 lime Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZRRLFMPOAYZELW-UHFFFAOYSA-N disodium;hydrogen phosphite Chemical compound [Na+].[Na+].OP([O-])[O-] ZRRLFMPOAYZELW-UHFFFAOYSA-N 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013569 fruit product Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 229960004249 sodium acetate Drugs 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- NGSFWBMYFKHRBD-UHFFFAOYSA-N sodium;2-hydroxypropanoic acid Chemical compound [Na+].CC(O)C(O)=O NGSFWBMYFKHRBD-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Abstract
本发明提供了一种向塑料、陶瓷等扁平非金属表面的制品上镀敷金属的方法及设备。在镀敷金属之前,要将制品平放,沿水平作业线连续输送,并经过各种化学处理,然后将制品竖放,再用基本连续的形式,输经化学镀槽,镀上一薄层金属,然后再把制品平放,并经过一系列后处理。如果需要,可以再通过电镀槽,在薄层金属上再镀一层厚金属。
Description
在为电子工业制备的印刷线路板中,已经普遍采用了多层板、双面板等等,其上带有通孔,以便通过它焊接各种电子元件。一般此种焊接要采用能保证良好导电的方法。在这一过程中,要求作到从板的一面,通过板上通孔,导电到板的另一面。为此目的,要求用金属镀敷法,最好是用铜进行孔内镀。由于大多数印刷线路板的结构特征是一种层压板,包括用一层或几层玻璃纤维填充的塑料树脂夹心,并具有铜薄膜的外表面层,所以必需设法把印刷线路板表面上的铜膜层彼此联结,而这就最好用孔内镀敷。已知为了能更好地镀上铜,通孔要作化学处理。
由于工业操作需要更快地生产印刷线路板,所以已经发展了连续地,或基本连结地生产印刷线路板的方法。例如,美国专利4,015,706中公开的一种处理印刷线路板的方法,将板平放在一个工段,水平输送到另一个工段,如此安排是能满足于大多数的净化、漂洗、蚀刻、干燥等过程的。
但是,在印刷线路板上镀铜,特别是用化学镀法加工输送通过各个工段已经用其它方法处理过的线路板时,如要把化学镀法作为连续的或基本连续的一部分过程,则还需要一个比上述其它处理过程更长的处理过程,需要相当大的设备,占据大量的工业生产面积。
本发明的目的是提供一种可以大量缩减印刷线路板生产线总长度的化学镀法,而且能使全过程连续地或基本连续地进行,成为一个独立的生产作业。本发明的范围要比印刷线路板宽,包括导电、
电屏蔽及其它功能,往塑料、陶瓷及其它表面镀金属(或其它限于通常为扁平的平板材料具一定柔性的制品),各种处理步骤与印刷线路板的制备相同,即平放着输送,但是,在下一步消耗大量时间的镀金属作业中,印刷线路板要改成竖放,在操作中,仍基本连续运送,但降低了运送速度,然后,印刷线路板再一次调成普遍平放,线路板仍旧连续或基本连续输送通过以后的漂洗、防锈、干燥等作业。这样全部过程基本上保持着连续,但是,在镀敷金属过程中,线路板普遍竖放,它们实际上比在其它过程中靠得更近了,所以要在减速中运送,才能保持整个系统从始到终的总体运行速度,基本上一致。
可能要在印刷线路板上继续补充镀敷,最好采用电镀作业,其预处理及完工作业,与相应的工序一样。
除了印刷线路板外,待加工制品可以是其它形式的,例如在陶瓷上镀敷金属、塑料或电子设备、电子计算机设备构件镀敷或屏蔽金属,或屏蔽塑料等其它用途,以及向其它种类制品上镀金属。采用化学镀的薄金属镀层,不一定局限于铜,也可以是镍、钴、金、银或各种合金,而下一步的镀金属作业,包括上述的和(或)其它金属的厚层镀敷,最好使用电镀方法。
本发明中的制品是经高度稳定处理的,所以次品发生率很低,氧化发生率也很低,所以能连续地进行各种处理,而不中断,因为在发生事故而延迟的时间内,是容易发生氧化的,此外由于方法是基本连续的,也降低了劳动成本。
本发明的主要目的是提供一种向制品上化学镀敷金属的新方法。
本发明的进一步目的是提供一种向制品上化学镀敷金属的新设备。
本发明的另一个目的是提供一种向印刷线路板或其他制品上化学镀铜,或镀其他金属的新方法,与下一步的化学镀敷或电镀作业,或是分开,或是联合在一起。
本发明的另一个目的,是向印刷线路板或其它制品上,提供一个化学镀铜,或镀其它金属的新设备,与下一步的化学镀敷或电镀作业,或是分开,或是联合在一起。
本发明的其它目的,包括向非金属表面上,镀敷金属导电的镀层。
通过了解下列附图的简要说明、最佳实例的详细说明,以及附录中的权利要求以后,本发明的其它目的及优越性,对那些精通技术者,将会是十分明确的。
图1是方法系统中各工段的侧立面图,并把多工序进行分解说明,按照本发明,把待处理制品(印刷线路板)的过程流向,从左至右模拟成许多不同过程的工段。
图2是按照本发明的从制备步骤,特别是化学还原步骤,截自一个印刷线路板的放大的局部横切面图。
图3与图2相似,只是说明经过镀敷步骤以后,把铜镀在印刷线路板的通孔上。
图4是按照本发明可能实施的许多加工步骤或工段的示意流程图。
详细地参考附图,首先参照图1的许多工段,阐明了本发明的一个包括化学镀敷过程在内的较好实例。
图1中从左至右的设备,首先从纵向垂直剖面示意图中,可见一个标以数码10的进料工序,进料设备10在进料表面上接受待镀制品(较好的实例是印刷线路板),如图所示,从左至右运送通过图1中的设备。
进料设备可以按照美国专利4,015,706中公开的进料模式建造。此处引用专利中全部公开的内容作为依据。沿着预定的运输路线上,有旋转轮11,或是类似的旋转构件。印刷线路板此后即运送到一个或多个预处理工段或模块上去,总的标以数码12,即图上所示的示意断线13。工段12包括去油污工段,把化学品加到印刷线路板上,除掉其上的油脂或其它污斑,以及(或)作表面处理,防止油污。
此外,工段12可以包括一个或多个漂洗工段,和一个或更多的深腐蚀工段。图1设备的旋转构件11,最好象美国专利4,015,706中公开的全部通过公用的驱动机构来带动,从左至右输送印刷线路板通过设备。
工段12通常包括有进出口15和16的箱14,进出口最好呈狭长状,其上也可以有灵活的口盖(图中未示),防止不需的流体量出入此开口,或者,工段12中装有需用的液体17至预定的水平
线18。
参阅图中的工段12,还装有一个泵20(一般为电动),它通过溢流栅型21或喷射栅型22配套的敷料器,输送去污、漂洗、蚀刻或其它所需的溶液。若敷料器是溢流栅型的,则具有完全沿着设备的横向的细长沟槽23,施用液体即以帘或幕式流下。若敷料器是喷射栅型22,其结构可以是,例如依照美国专利3,905,827中公开的喷射栅型,或是任其他形式,但通常也要延伸过设备的横向,并有喷射液体的出口孔眼,液体用泵20通过输送管25送到该处。可以看到,可以使用一批压轮26,当印刷线路板沿着经向运送经过图1的设备时,使印刷线路板位于传送器或其它旋转构件11的上表面。这时印刷线路板正受到来自喷射栅22或溢流栅21的处理液的喷射或排放。
当印刷线路板在作业箱14中经过处理以后,按照初步处理技术,最好再送入一个或多个同样相连的活化箱30,最好与上述其它模式或工段,使用公用的驱动机构。在下面的后继工段、设备或舱31中,印刷线路板施用化学还原溶液之前,最好先施用化学活化溶液。
在工段30中,备有化学活化溶液,当印刷线路板沿着预定路线移动时,通常用泵31从储箱33底部的液槽32,把化学活化溶液通过输送管34送到适当的喷嘴35等处。当然喷嘴35也可用溢流栅来代替。
在工段30中备有的活化溶液,最好是一种用于加工钯离子的称作A.G·斯凯林(schering A·G)商品名涅奥根斯NEOGSNTH的碱性钯溶液。此溶液的pH值在7-12范围以内,操作温度为20至50℃,组成如下:
氯化钯10-400毫克钯/升
氢氧化钠3-20克/升
硼酸5-25克/升
配位组分5-100克/升
参考图2,表示具有玻璃纤维填充的塑料树酯内层结构41的印刷线路板40。板上具有铜的外层43(如果需要,还可有一层或多层铜的内层,图上未示),以及包含从外表面42到外表面43,和穿过印刷线路板的通孔40的内层部分44。图中示出处理印刷线路板过程的活化溶液45,为接受还原溶液而没有铜镀层的通孔部分44。
参照工段31,在储槽50底部的液槽51中备有还原溶液(示意性说明按照所要采用的方法的数量及类型可以包括一个或多个储槽),还原溶液用液槽51中的泵52通过输送管55根据需要送到喷嘴53或溢流栅54。
图2示意性地说明,当印刷线路板纵向送经工段31时,其上即施以化学还原剂或还原溶液。活化溶液的情况与上述的相同。
还原性溶液将把配位钯还原成金属钯,在以下的镀敷作业中,促进铜的快速镀敷。特定的还原性溶液可以是众所周知的A·G·斯凯林(Schering A·G)商品名涅奥根斯(NEOGANTH)。还原剂溶液的pH值在8-12范围内,操作温度为20-60℃,组成如下:
氢硼化钠0.1-5克/升
连二磷酸钠10-80克/升
通过各个工段的作业过程,是连续输送印刷线路板通过设备的。设备可以在不同位置上,在各工段之间的运输线上,设有检验组件和驱动组件以及输出组件60,在那里,印刷线路板在送到镀敷单元或工段62之前,通过最后处理单元的出口开孔61输出。
在开始把印刷线路板连续地送到敷镀工段62之前,要用快速的方法将印刷线路板从平放变成面对面地平行竖放。
工段62具有这样的方法,即把印刷线路板从输出工段60上的旋转构件59输送到一对相对旋转轮63和64之间的狭缝位置,旋转轮最好用上述各工段中驱动旋转构件11,59的同一个公用驱动机构(图上未示)传动。印刷线路板被捕集到夹65中时,旋转轮63和64使印刷线路板最左头66向上翘起,借此将其通过夹缝65向下输送,如图62工段中用虚线表示的左端部分。当输送时,印刷线路板将碰到一个曲线面67,它将印刷线路板按次序插到连续输送带82上的狭槽70中。靠模构件68用推动杆71带动,推动杆则用汽缸72驱动作出向上或向下的运动,如双箭头73所示,快速移动靠模构件68的位置,避免干挠刚进入竖放位置的插入到狭槽70中的印刷线路板向右移动。印刷线路板是靠狭槽侧面的摩擦接触卡住的。
用旋转轮64控制汽缸72的行动,用配套的现场监测,通过信号线75,用时间控制器或其它
配套的控制器76定时控制汽缸72的运转时间,使靠模构件68定时到位和离位。汽缸76的运转控制,可以是电动的,气动的、液压的等等,如果需要,还可以定时,通过控制线77,配套的时间控制器80与电动机78上的驱动时间进行协调。如果需要,时间控制器80可以控制输送带82的最左边上的制动轮81顺时针转动。
随着印刷线路板的这种竖放安排,同时随着靠模构件68向上移动,离开上行输送带82上相邻狭槽70之间的干挠位置,刚刚插入到输送带狭槽70中去的印刷线路板可以延着箭头83的方向向右移动,在所需的运送速度下通过镀槽84,上述运送速度要低于印刷线路板通过工段例如12、30、31时的运送速度。
必须指出,按照在工段62的储箱85中所要求镀敷的厚度,输送带82的纵向长度要能维持印刷线路板在工段62的镀液84中所需要的停留时间。
还必须指出,电动机78驱动着使竖放着的线路板连续地或是基本连续地水平移动通过工段62的机构。如果移动是连续的,则必须十分准确地协调靠模构件68的向上抽出,以及准确地定时控制输送带82上具有的横向狭槽70的适当位置,以便接受在其上安放的印刷线路板。但是,也可以采用一种在镀槽中,使竖放着的线路板基本连续水平移动,采用连续地“停一开”移动,每当一个横向狭槽70达到旋转轮81上通过中心的顶部死点位置时,输送带82就要暂停,此时靠模构件68正在图1所示的位置上,印刷线路板则用旋转轮63和64带动,准确投放到狭槽70中去。当印刷线路板刚刚置于狭槽70内的时候,汽缸72立即抽出靠模构件68,当靠模构件68刚离开竖放着的印刷线路板的顶端时,电动机78将重新起动推动输送带82纵向从左至右移动,如图1所示。每改变一个相当于“D”的移动量,也即邻近狭槽70之间的距离时,电动机78将停止运转,中断输送带和载于其上的所有竖放着的印刷线路板的运行,此时汽缸72向下驱动靠模构件68,再一次达到便于投送下一个印刷线路板到下一个狭槽70的靠模位置。当技术上采用“停一开”运动时,这种运转便相似于时钟机械的运行,即属基本连续式。不用说,如果采用特殊的运输带设备,并且以配套的连续或基本连续的驱动机械,有效地移动竖放的印刷线路板,使之通过镀液84等精确手段,上述方案也是可以改变的。此外,很明显,上述的特殊设备,如旋转轮63、64及靠模构件68及其有关部件,仅仅是为定位印刷线路板从平的到竖的位置上的一种可能性的设置。
当把印刷线路板运向储箱85的右端时,再用配套的再定位机械把它们从竖放改变到平放。图1示出了此种机械之一,其中包括有一对相对旋转轮90、91,二者之间转动形成一个夹缝92,以便挟入运送的印刷线路板,旋转轮91如图1所示,是顺时针驱动的,而旋转轮90则是逆时针方向转动,这样可以把一个印刷线路板提举并脱离输送带82的上部运行的槽口(如图中的虚线部分93),再嵌入到变向表面94,变向表面94是固定的,用来导向印刷线路板通过出口开孔96到位于储罐85出口的旋转构件95上去。
应当指出,图中的旋转轮90,是用一个相配的推拉式拉杆97带动的,该拉杆则用相配的汽缸98驱动,按照双箭头100的方向,上下移动,使之离开或归位,此点很象变向构件68的上下移动,把竖放着的线路板运到刚好进入夹缝92的前方。必须明确的是,要采用配套的时间控制工具101,联结在汽缸98并且通过配套的控制联线102、103与驱动轮91内联,协调旋转轮90、91的驱动与拉杆97的上下移动。
最好提供一种加热贮槽85中镀液84的手段,可以使用电或蒸汽或其它加热器104,使镀液84保持所需的温度。
镀液84由一种无电解铜溶液组成,可以是市售的A·G·斯凯林(Schering A·G)溶液,商品名为普林脱根斯(PRINTOGASNTH)。印刷线路板在镀液中停留时间,即沉积上一定厚度的无电解铜。
当镀液是一种铜溶液时,其pH值在10-13.5范围内,操作温度范围为20-70℃,组成如下:
氯化铜1-15克/升
乙二胺四乙酸5-25克/升
氢氧化钠5-15克/升
甲醛3-10克/升
镀敷速度2-10微米/小时
显然,把镀液84用例如镍、钴、银、金或一
种合金的无电解溶液代替无电解铜溶液,同样可以镀上其它的金属。例如,当镀液84是一种镍溶液时,其pH值在4-10之间,操作温度为20-95℃,组成如下:
硫酸镍5-50克/升;
亚磷酸氢钠10-50克/升;
氨1-50克/升;
氢氧化钠1-10克/升;
配位组分(酒石酸盐,例如乳酸钠或醋酸钠)20-80克/升
稳定剂0.01-5克/升
镀敷速度5-25微米/小时
图3表示一个印刷线路板105,其中包括中间填充玻璃纤维的加强塑料树脂夹心106,铜表层107和108,以及延伸通过相对表面108之间的通孔110上的铜镀层109,通过工段62,铜表面107和108也能镀上铜的镀层。通过线路板105的通孔的长度一般是其直径的数倍,与图3所示的无比例关系。
印刷线路板离开工段62以后,再一次平放着运送到配套的工段去,经漂洗、喷防锈液,再漂洗等作业,一般再经干燥作业。图1中工段110示意性地说明漂洗、防锈和再漂洗作业,作业箱111具有配套的进口96和出口112,并且具有驱动旋转构件113(最好与镀敷工段前面的几个工段中驱动旋转构件11、59等用同一个驱动机构)。在作业箱111中的液槽114内,用泵115通过配套的运输管线116运送漂洗、防锈等液体到配套的喷射设备117(根据需要,可以换成溢流栅),在其通过单工段或多工段110时,进行配套的浸湿作业。然后最好再将印刷线路板运送到干燥工段120的作业箱119中,用具有加热元件122的排气泵或风扇121,经配套管线123及伞帽124,送热风到经出料口125,再到卸料工序126的印刷线路板上去。
图4表示按照本发明对处理制品的综合过程安排。当然,图4所示的步骤或工段,即非对任一种待处理的特殊制品都是一样完整的显示,也不说明图4的显示最低限度所必需的步骤或工段,它仅仅是表明某些典型的步骤或工段。沿着箭头130所示的流程方向,可见第一个处理制品的典型步骤就是净化,接着是漂洗,其后是干燥、去油渍、检验和漂洗、浸蚀底物、漂洗、干燥、净化、漂洗、净化、漂洗、浸蚀净化,然后是蚀刻(对塑料或陶瓷构件的印刷线路板而论),其后为连续漂洗、预浸渍、活化、漂洗、还原、还原和检验步骤。就一个较好的单元操作系列而言,在作业线的某些位置上,一般要有一个驱动单元,该单元要具有从一个公用驱动机构上,带动所有的相连单元(或工段)的功能。最后一个检验步骤之后,制品就要送到上述化学镀敷作业中。此后,再经检验、漂洗、防锈、漂洗、干燥、擦光和检验作业。此后(或是根据需要,在化学镀敷之后的任一点上)制品将任经一个电镀过程(制品或是如131a那样平放着,或是如131b那样竖放着),或是根据需要,选经显影(imo-ging)过程132。电镀以后,制品通常要通过配套的相继作业,例如检验、漂洗、防锈、漂洗、并且沿着箭头133的方向,经受抗光蚀剂、显影、检验、蚀刻、漂洗、干燥及检验作业,然后送到图4所示箭头134处卸料。
如果制品是经显影过程132,则要沿着路线135,进行网屏印刷作业,或是沿着路线136,经抗光蚀和显影作业,然后送到图形镀敷系列137(竖放或平放),再经检验、净化、漂洗、酸蚀、镀铜、漂洗、酸蚀、镀锡铅或镀锡、漂洗、干燥及检验工序。此后制品要历经剥去干胶片膜或网屏印刷油墨,接着漂洗、检验、蚀刻、漂洗和检验作业,在138处卸料。
如前所述,进行加工的制品可以是塑料、陶瓷或其它非金属制品,这些制品不仅是为制作印刷线路板,也可以制成其它板材制品,包括保护屏及其它。把本发明用于向陶瓷上镀金属,可以用来制备用于高温条件下的电子电路。为了减少电气或电子设备的电磁干挠当把本发明的方法用于制备制品的保护屏时,就要在原料塑料板的前、后、两侧上加以镀敷,再用这些镀板制成制品,也可以直接把金属镀到其它需要屏蔽的制品上,例如塑料制品、玻璃纤维填充的塑料制品等。这种镀层包括如上所述的单独化学镀层,或是还包括电镀镀层在内。
按照本发明电镀时可以采用连续式的,或是间断式的(例如分批过程),但是,最好采用连续电镀。据此,当线路板是竖放的情况下,可参照美国专利4,402,799及4,402,800中所公开的内容,或是参照美国专利4,385,967,其中的线路
板是平放着电镀的。此处引用这些专利所公开的内容,作为依据。显然,为了达到本发明中平放或竖放着电镀平板的目的,也可以采用其它合适的设备。
按照本发明电镀所用的电解液可以是铜、锡、铅、钴、铁、银、金、钯或各种合金的电解液。当使用铜的电解液时,操作温度在20-50℃范围内,电解液的组成如下:
硫酸铜25-250克/升
硫酸50-400克/升
氯化钠40-100毫克/升
光亮剂1-10克/升
表面活性剂0.1-10克/升
电流密度0.5-10安/分米2
按照本发明,当电镀用镍的电解液时,操作温度在20-70℃范围内,电解液的组成如下:
硫酸镍100-300克/升
氯化镍50-200克/升
硼酸10-50克/升
光亮剂0.5-10克/升
表面活性剂0.1-10克/升
电流密度0.1-10安/分米2
显然,本发明可以实际用于那些在制品上需要金属导电镀层的地方。
当然,在完成许多处理过程,以及继镀敷过程之后完成的许多其它过程中,在现有的技术中,可以选用很多机械和设备。例如,从美国专利3,905,827中,可以采用各种喷射、泵送及贮槽作业;从美国专利3,776,800中,可以采用各种蚀刻及过滤作业;从美国专利3,801,387中,可以采用各种清除腐蚀剂的技术。此外,从美国专利4,017,982中,可以采用各种干燥技术;另外,按照美国专利4,015,706和4,046,248所述的原理,本发明中的各个处理工段,可以实施中联合在一起,使用通用的驱动机构。
此外,按照附录权利要求书中的规定,对方法中的其它改革与变化,显然要包括在本发明的权限以内。
Claims (21)
1、一种向大致扁平制品表面上镀敷金属的方法,其特征在于该方法包括如下步骤:
(a)提供至少具有大致扁平外表面的制品,而且一般具有非金属表面结构部分;
(b)沿预定路线,连续并且依次地运送制品;
(c)准备为在其表面上进行化学镀金属的制品,即在制品沿预定路线连结运送时,至少用一种化学溶液处理,并且至少漂洗一次;
(d)运送的步骤系沿大致水平路线,在第一运送速度下,使制品大致平放水平地移动,这是为在把制品运送到化学镀槽之前,沿着其预定路线至少运送制品的一部分;
(e)当把制品沿着预定路线运送时,将制品从大致平放变成大致竖放;和
(f)使制品依次表面对表面地基本连续移动,此时制品在大致竖放下,沿着大致水平的路线,在低于第一运送速度的第二运送速度下,通过化学镀金属溶液的镀槽,在其上镀敷一薄层金属镀层。
2、根据权利要求1的方法,其中包括当制品通过镀槽以后,把制品从大致竖放变成大致平放的步骤。
3、根据权利要求1的方法,其中包括当把制品沿着预定路线运送时,至少经过漂洗和干燥制品的后继步骤,同时是至少与第一运送速度相等的运送速度下,基本连续地移动的。
4、根据权利要求1的方法其中所述的制品是印刷线路板,板上至少有几个具有非金属表面部分的通孔。
5、根据权利要求1的方法,其中所述的化学镀金属溶液,是选自包括铜、镍、钴、银、金及其任一合金的溶液。
6、根据权利要求2的方法,其中包括当制品沿着大致水平的路线运送并把制品改回到大致平放以后漂洗制品的步骤,以及干燥制品的步骤,此时的制品是大致平放着,并且是在至少与第一运送速度相等的运送速度下,基本连续地移动。
7、根据权利要求1的方法,其中包括把制品运送通过一种电镀溶液时,在经化学镀槽中镀敷的薄金属镀层上,再镀以金属镀层的电镀步骤。
8、根据权利要求7的方法,其中所述的电镀溶液,是一种选自一组包括铜、锡、铅、镍、钴、铁、银、金、钯及其任一合金的金属溶液。
9、根据权利要求7的方法,其中所述的电镀步骤包括依次和基本连续地输送制品,使之通过一个电镀槽的步骤。
10、根据权利要求1的方法,其中准备制品的步骤包括至少向制品的非金属表面部分,施用化学还原溶液,以保进在其上镀敷金属。
11、根据权利要求10的方法,其中准备制品的步骤包括在施用还原溶液之前,把化学活化溶液,施用到制品的至少是非金属表面部分上去。
12、根据权利要求4的方法,其中制备板的步骤包括向板的至少非金属表面部分,施用由氯化钯、氢氧化钠、硼酸和一种配位组分组成的化学活化溶液;其后的步骤是向板的至少非金属表面部分施用由氢硼化钠和连二磷酸钠组成的化学还原溶液,以促进表面上镀敷铜;其中的化学镀金属溶液,是一种氯化铜、乙二胺四乙酸、氢氧化钠、甲醛以及稳定剂的溶液;包括在平板输送经过化学镀槽以后,将平板从大致竖放变成大致平放,在改回到大致平放以后,沿着大致水平路线输送时,接着是漂洗步骤,然后再干燥平板,此时的平板大致平放着,在与第一运送速度至少相同的运送速度下,基本连续移动着,还包括向经在化学镀槽中镀敷的薄金属镀层再镀敷金属镀层的电镀步骤,就是把平板依次基本连续地输送,通过一个含有硫酸铜、硫酸及氯化钠的电镀槽的步骤。
13、向大致扁平制品表面上镀敷金属的设备,其特征在于该设备包括:
(a)接受制品的装置,该制品至少具有一些大致扁平的外表面,而且一般具有非金属表面结构部分;
(b)沿着预定路线,连续并且依次运送制品的装置;
(c)准备为在其表面部分进行化学镀金属的制品的装置,即当制品沿着预定路线连续运送时,向其上施以至少一种化学溶液,并且至少漂洗一次的装置;
(d)运送的装置,包括在第一运送速度下,将制品沿着大致水平的路线,大致平放着移动的装置,这是为把制品运送到化学镀槽之前,沿着预定路线至少运送制品的一部分的装置。
(e)把制品沿着预定路线运送时,从大致平放变成大致竖放的装置;和
(f)把制品依次表面对表面地基本连续移动的装置,此时制品在大致竖放下,沿着大致水平的路线,在基本上低于第一运送速度的第二运送速度下,通过化学镀金属溶液的镀槽,在其上镀敷一薄层金属镀层。
14、根据权利要求13的设备,其中包括当制品通过镀槽以后,把制品从大致竖放变成大致平放的装置。
15、根据权利要求13的设备,其中包括当制品在沿着通过镀槽以后的预定路线上运送时,至少对制品漂洗和干燥的装置,此时制品是在至少与第一运送速度相同的运送速度下,基本连续地移动的。
16、根据权利要求14的设备,其中包括当制品沿着大致水平路线运送时,在把制品改回到大致平放以后漂洗制品的装置,以及干燥制品的装置,此时制品是大致平放着,并且是在至少与第一运送速度相同的运送速度下,基本连续移动的。
17、根据权利要求13的设备,其中包括电镀制品的装置,即把制品运送通过一种电镀溶液时,向经化学镀槽中镀敷的薄金属镀层上,再镀以金属镀层的电镀装置。
18、根据权利要求17的设备,其中所述的电镀装置包括依次和基本连续地输送制品通过电镀槽的装置。
19、根据权利要求13的设备,其中准备制品的装置包括至少向制品的非金属表面部分,施用化学还原溶液,以促进在其上镀敷金属的装置。
20、根据权利要求19的设备,其中准备制品的装置包括至少向制品的非金属表面部分,在施用化学还原溶液之前,施用化学活化溶液的装置。
21、根据权利要求13的设备,其中的制品是印刷线路板,板上至少带有几个具有非金属部分的通孔,其中准备板的装置包括向平板的至少非金属表面部分,施用一种化学活化溶液的装置,上述活化溶液由氯化钯、氢氧化钠、硼酸和一种配位组分组成,以及向平板的至少非金属表面部分,施用一种化学还原溶液的装置,以促进铜在其上的镀敷,上述化学还原溶液,由氢硼化钠和连二磷酸钠组成;其中所施用的一种化学镀金属溶液,由氢硼化钠和连二磷酸钠组成;其中所施用的一种化学镀金属溶液的装置包括施用一种氯化铜、乙二胺四乙酸、氢氧化钠、甲醛和一种稳定剂组成的溶液的装置,包括当把平板输送通过化学镀槽以后,把平板从大致放竖变成大致平放的装置,把平板改回大致平放以后,沿着大致水平的路线运送时,接着漂洗平板的装置、干燥平板的装置,此时制品大致平放着,并且是在至少与第一运送速度相同的运送速度下,基本连续移动;还包括电镀的装置,即把平板依次和基本连续地运送通过一种含有硫酸铜、硫酸及氯化钠的电镀溶液,以便在经化学镀槽中镀敷的薄金属镀层上,再镀以金属镀层。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US726,049 | 1985-04-23 | ||
US06/726,049 US4576685A (en) | 1985-04-23 | 1985-04-23 | Process and apparatus for plating onto articles |
Publications (2)
Publication Number | Publication Date |
---|---|
CN85108685A CN85108685A (zh) | 1986-10-22 |
CN1015996B true CN1015996B (zh) | 1992-03-25 |
Family
ID=24917013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN85108685.3A Expired CN1015996B (zh) | 1985-04-23 | 1985-11-29 | 向制品上镀敷金属的方法及设备 |
Country Status (15)
Country | Link |
---|---|
US (1) | US4576685A (zh) |
JP (1) | JPS61246372A (zh) |
CN (1) | CN1015996B (zh) |
AT (1) | AT395022B (zh) |
BE (1) | BE903914A (zh) |
BG (1) | BG60260B1 (zh) |
CH (1) | CH668270A5 (zh) |
DE (1) | DE3543286A1 (zh) |
FR (1) | FR2580671B1 (zh) |
GB (1) | GB2174107B (zh) |
IT (1) | IT1215167B (zh) |
LU (1) | LU86221A1 (zh) |
NL (1) | NL8503147A (zh) |
SE (1) | SE463625B (zh) |
SU (1) | SU1660595A3 (zh) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3631055C1 (de) * | 1986-09-12 | 1987-05-21 | Deutsche Automobilgesellsch | Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung |
DE3632378A1 (de) * | 1986-09-24 | 1988-03-31 | Schering Ag | Verfahren zum fuehren von plattenfoermigen gegenstaenden, sowie dazugehoerige vorrichtung |
US4775449A (en) * | 1986-12-29 | 1988-10-04 | General Electric Company | Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
DE3703542A1 (de) * | 1987-02-06 | 1988-08-18 | Schering Ag | Verfahren und anordnung zur beschickung von traggestellen in anlagen zum chemischen behandeln in baedern, insbesondere zum galvanisieren von plattenfoermigen gegenstaenden |
JPH02232391A (ja) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | アデイテイブ鍍金浴および方法 |
US4954226A (en) * | 1988-12-21 | 1990-09-04 | International Business Machines Corporation | Additive plating bath and process |
US4990224A (en) * | 1988-12-21 | 1991-02-05 | International Business Machines Corporation | Copper plating bath and process for difficult to plate metals |
US5091218A (en) * | 1989-03-06 | 1992-02-25 | Motorola, Inc. | Method for producing a metallized pattern on a substrate |
US4999079A (en) * | 1989-06-02 | 1991-03-12 | Chemcut Corporation | Process and apparatus for treating articles and preventing their wrap around a roller |
US5002616A (en) * | 1989-08-28 | 1991-03-26 | Chemcut Corporation | Process and apparatus for fliud treatment of articles |
US5077176A (en) * | 1990-07-30 | 1991-12-31 | At&T Bell Laboratories | Pre-plate cleaning process |
US5166037A (en) * | 1991-02-14 | 1992-11-24 | International Business Machines Corporation | Method of additive circuitization of circuit boards with high adhesion, voidless copper leads |
US5685970A (en) * | 1992-07-01 | 1997-11-11 | Gould Electronics Inc. | Method and apparatus for sequentially metalized polymeric films and products made thereby |
US5441618A (en) * | 1992-11-10 | 1995-08-15 | Casio Computer Co., Ltd. | Anodizing apparatus and an anodizing method |
JPH06260309A (ja) * | 1993-03-05 | 1994-09-16 | Murata Mfg Co Ltd | チップ状電子部品の製造方法 |
US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
WO1995016059A1 (fr) * | 1993-12-10 | 1995-06-15 | Taisho Kogyo Kabushiki Kaisha | Dispositif de traitement par immersion continue du type transfert horizontal |
US5720813A (en) | 1995-06-07 | 1998-02-24 | Eamon P. McDonald | Thin sheet handling system |
US5614264A (en) | 1995-08-11 | 1997-03-25 | Atotech Usa, Inc. | Fluid delivery apparatus and method |
US5904773A (en) * | 1995-08-11 | 1999-05-18 | Atotech Usa, Inc. | Fluid delivery apparatus |
US5658441A (en) * | 1995-12-18 | 1997-08-19 | Cfc, Inc. | Conveyorized spray plating machine |
DE19736805A1 (de) * | 1997-08-23 | 1999-02-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zur naßchemischen Behandlung von Teilen |
TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6517894B1 (en) * | 1998-04-30 | 2003-02-11 | Ebara Corporation | Method for plating a first layer on a substrate and a second layer on the first layer |
DE19830212A1 (de) * | 1998-07-07 | 2000-01-20 | Angew Solarenergie Ase Gmbh | Verfahren und Vorrichtung zum Behandeln von Gegenständen, insbesondere scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten |
EP0971051A1 (en) | 1998-07-09 | 2000-01-12 | Giacomo Borra | A machine for the electrophoretic re-painting or re-varnishing of thin metal objects |
US6773560B2 (en) | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
US7048841B2 (en) | 1998-12-07 | 2006-05-23 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
US6303010B1 (en) | 1999-07-12 | 2001-10-16 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
WO2000003072A1 (en) | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Method and apparatus for copper plating using electroless plating and electroplating |
US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
US6110345A (en) * | 1998-11-24 | 2000-08-29 | Advanced Micro Devices, Inc. | Method and system for plating workpieces |
US6309520B1 (en) * | 1998-12-07 | 2001-10-30 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
US6645356B1 (en) * | 1998-12-07 | 2003-11-11 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
WO2000040779A1 (en) | 1998-12-31 | 2000-07-13 | Semitool, Inc. | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
JP4288010B2 (ja) * | 1999-04-13 | 2009-07-01 | セミトゥール・インコーポレイテッド | 処理流体の流れ具合を向上させる処理チャンバを備えた加工物処理装置 |
US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
US7438788B2 (en) * | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7645366B2 (en) * | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
US6673216B2 (en) | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
KR100659544B1 (ko) * | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | 비아 필링 방법 |
US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
WO2001090434A2 (en) * | 2000-05-24 | 2001-11-29 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
WO2002023613A2 (en) * | 2000-09-15 | 2002-03-21 | Rodel Holdings, Inc. | Metal cmp process with reduced dishing |
CN100469948C (zh) * | 2000-10-03 | 2009-03-18 | 应用材料有限公司 | 一旦进入金属沉积用来倾斜基片的方法和相关设备 |
US20030010449A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Automatic wafer processing and plating system |
US20030089613A1 (en) * | 2001-11-15 | 2003-05-15 | Ching Chang Yu | Method of selectively electroplating by screen-plating technology |
US7118658B2 (en) * | 2002-05-21 | 2006-10-10 | Semitool, Inc. | Electroplating reactor |
US8465469B2 (en) * | 2002-09-12 | 2013-06-18 | Medtronic Vascular, Inc. | Reinforced catheter and methods of making |
US20050048210A1 (en) * | 2003-01-14 | 2005-03-03 | Sam Siau | Method for plating and plating solution therefor |
US20040146461A1 (en) * | 2003-01-29 | 2004-07-29 | Vincenzo Giuliano | Oral contrast media composition for computerized axial tomographic examinations and method |
US20050123681A1 (en) * | 2003-12-08 | 2005-06-09 | Jar-Wha Lee | Method and apparatus for the treatment of individual filaments of a multifilament yarn |
US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
US7581551B2 (en) * | 2004-09-01 | 2009-09-01 | Sanyo Electric Co., Ltd. | Cleaning apparatus |
DE102006054846C5 (de) * | 2006-11-20 | 2012-05-03 | Permatecs Gmbh | Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen |
KR100856873B1 (ko) * | 2007-01-05 | 2008-09-04 | 연세대학교 산학협력단 | 무전해도금용 촉매활성 방법 |
US20090238979A1 (en) * | 2008-03-21 | 2009-09-24 | William Decesare | Method of Applying Catalytic Solution for Use in Electroless Deposition |
FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
CN102453915B (zh) * | 2010-10-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及使用该蚀刻装置蚀刻基板的方法 |
CN102508583B (zh) * | 2011-09-30 | 2014-05-21 | 南京熊猫电子股份有限公司 | 电容式触摸屏金属引线的制备方法 |
CN102673053B (zh) * | 2012-06-05 | 2016-05-11 | 深圳市五株科技股份有限公司 | 覆铜板、印刷电路板及其制造方法 |
CN103786386B (zh) * | 2014-02-28 | 2016-08-17 | 厦门建霖工业有限公司 | 一种abs塑料表面涂层及其制备方法 |
CN104164689A (zh) * | 2014-07-30 | 2014-11-26 | 东莞市五株电子科技有限公司 | 一种水平前处理垂直连续式电镀设备 |
CN104862760A (zh) * | 2015-06-11 | 2015-08-26 | 重庆德凯覆铜板有限公司 | 铝板表面阳极氧化生产线 |
CN105018980A (zh) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | 一种印制电路板孔金属化离子液体镀金的电镀液及电镀方法 |
CN107087867B (zh) * | 2017-06-29 | 2018-12-14 | 绍兴上虞文丰礼品有限公司 | 一种便捷珠宝镀金装置 |
CN114222433B (zh) * | 2022-01-25 | 2022-08-09 | 东莞塘厦裕华电路板有限公司 | 一种印刷电路板湿化学处理设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2942719A (en) * | 1956-02-06 | 1960-06-28 | American Can Co | Apparatus for treating articles |
US3801387A (en) * | 1971-10-18 | 1974-04-02 | Chemcut Corp | Etchant remover apparatus and method |
US3905827A (en) * | 1971-10-18 | 1975-09-16 | Chemcut Corp | Etchant rinse method |
US4015706A (en) * | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US3776800A (en) * | 1971-12-06 | 1973-12-04 | Chemut Corp | Etching apparatus |
US3801478A (en) * | 1972-01-27 | 1974-04-02 | Cottbus Textilkombinat | Process of metallizing polymeric materials |
US4046248A (en) * | 1974-01-15 | 1977-09-06 | Chemcut Corporation | Connecting and alignment means for modular chemical treatment system |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
US4017982A (en) * | 1975-07-28 | 1977-04-19 | Chemcut Corporation | Drying apparatus |
US4402799A (en) * | 1981-10-02 | 1983-09-06 | Chemcut Corporation | Apparatus and method of treating tabs of printed circuit boards and the like |
US4402800A (en) * | 1981-10-02 | 1983-09-06 | Ash James J | Apparatus and method of treating tabs of printed circuit boards and the like |
US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
US4617204A (en) * | 1983-01-04 | 1986-10-14 | The United States Of America As Represented By The United States Department Of Energy | Chemical synthesis of thin films and supported crystals by oxidation of zintl anions |
US4454003A (en) * | 1983-01-06 | 1984-06-12 | Systems Engineering & Manufacturing Corp. | Printed circuit board component conveyor apparatus and process |
US4511597A (en) * | 1983-10-12 | 1985-04-16 | Kollmorgen Technologies Corporation | Method for depositing a metal on a surface |
JPS60218477A (ja) * | 1984-04-11 | 1985-11-01 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 無電解付着のための触媒化処理法 |
DE3423457A1 (de) * | 1984-06-26 | 1986-01-02 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von leiterplatten |
-
1985
- 1985-04-23 US US06/726,049 patent/US4576685A/en not_active Expired - Fee Related
- 1985-11-15 NL NL8503147A patent/NL8503147A/nl not_active Application Discontinuation
- 1985-11-22 IT IT8567980A patent/IT1215167B/it active
- 1985-11-29 JP JP60267569A patent/JPS61246372A/ja active Granted
- 1985-11-29 CN CN85108685.3A patent/CN1015996B/zh not_active Expired
- 1985-12-07 DE DE19853543286 patent/DE3543286A1/de active Granted
- 1985-12-11 SE SE8505859A patent/SE463625B/sv not_active IP Right Cessation
- 1985-12-16 AT AT0361585A patent/AT395022B/de not_active IP Right Cessation
- 1985-12-16 BG BG072728A patent/BG60260B1/bg unknown
- 1985-12-18 SU SU853990693A patent/SU1660595A3/ru active
- 1985-12-20 CH CH5467/85A patent/CH668270A5/de not_active IP Right Cessation
- 1985-12-20 FR FR8518956A patent/FR2580671B1/fr not_active Expired
- 1985-12-20 LU LU86221A patent/LU86221A1/fr unknown
- 1985-12-20 GB GB8531409A patent/GB2174107B/en not_active Expired
- 1985-12-20 BE BE0/216039A patent/BE903914A/fr not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN85108685A (zh) | 1986-10-22 |
BG60260B2 (en) | 1994-03-24 |
IT1215167B (it) | 1990-01-31 |
JPS61246372A (ja) | 1986-11-01 |
SE463625B (sv) | 1990-12-17 |
GB8531409D0 (en) | 1986-02-05 |
SU1660595A3 (ru) | 1991-06-30 |
SE8505859L (sv) | 1986-10-24 |
FR2580671B1 (fr) | 1989-07-28 |
CH668270A5 (de) | 1988-12-15 |
SE8505859D0 (sv) | 1985-12-11 |
BE903914A (fr) | 1986-04-16 |
DE3543286A1 (de) | 1986-10-23 |
JPH0571665B2 (zh) | 1993-10-07 |
NL8503147A (nl) | 1986-11-17 |
AT395022B (de) | 1992-08-25 |
IT8567980A0 (it) | 1985-11-22 |
ATA361585A (de) | 1992-01-15 |
US4576685A (en) | 1986-03-18 |
DE3543286C2 (zh) | 1993-08-19 |
GB2174107B (en) | 1989-04-19 |
BG60260B1 (bg) | 1994-03-24 |
FR2580671A1 (fr) | 1986-10-24 |
GB2174107A (en) | 1986-10-29 |
LU86221A1 (fr) | 1986-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1015996B (zh) | 向制品上镀敷金属的方法及设备 | |
CN107815723B (zh) | 一种减少vcp电镀线上陪镀板的方法 | |
US5374346A (en) | Electroplating process and composition | |
CN106835088A (zh) | 一种化学镍金生产线及生产工艺 | |
CN109023495A (zh) | 一种环形垂直连续玻璃电镀生产线 | |
CN107059097B (zh) | 一种电镀装置 | |
CN204849101U (zh) | 一种并列式防卡板电镀生产线 | |
CN108531945A (zh) | 一种新型镀锌流水线 | |
JP2004332019A (ja) | 化学処理装置 | |
CN209210961U (zh) | 一种环形垂直连续玻璃电镀生产线 | |
CN110331431A (zh) | 一种智能传送式电镀设备及其加工方法 | |
CN115613090A (zh) | 金属表面抗磨镀层的电镀工艺及其设备 | |
CN211546706U (zh) | Pcb板电镀线 | |
CN205774895U (zh) | Pcb板电镀线 | |
CN219930316U (zh) | 可对贵金属回收的电镀设备 | |
JPH07263843A (ja) | プリント配線板のメッキ方法及びメッキ装置 | |
CN212727582U (zh) | 一种用于高频微波的沉铜系统 | |
CN214937926U (zh) | 一种pcb板电镀挂架 | |
CN204335173U (zh) | 一种循环利用活化液的沉铜装置 | |
CN217536165U (zh) | 电路板化金前处理用微蚀设备 | |
CN204550754U (zh) | 一种应用于pcb垂直连续电镀线中的下料机构 | |
JPS59501633A (ja) | 無電解めっき液の処理方法と無電解めっき方法 | |
CN214515614U (zh) | 一种自动化层层组装机 | |
TWM597781U (zh) | Pcb板電鍍線 | |
CN201598332U (zh) | 一种印制线路板微蚀液在线循环装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C13 | Decision | ||
GR02 | Examined patent application | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |