CN101583309A - 模块化多通道微电极阵列及其制造方法 - Google Patents
模块化多通道微电极阵列及其制造方法 Download PDFInfo
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- CN101583309A CN101583309A CNA2006800454192A CN200680045419A CN101583309A CN 101583309 A CN101583309 A CN 101583309A CN A2006800454192 A CNA2006800454192 A CN A2006800454192A CN 200680045419 A CN200680045419 A CN 200680045419A CN 101583309 A CN101583309 A CN 101583309A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/0404—Electrodes for external use
- A61N1/0472—Structure-related aspects
- A61N1/0476—Array electrodes (including any electrode arrangement with more than one electrode for at least one of the polarities)
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0534—Electrodes for deep brain stimulation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/04—Arrangements of multiple sensors of the same type
- A61B2562/043—Arrangements of multiple sensors of the same type in a linear array
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US72450105P | 2005-10-07 | 2005-10-07 | |
US60/724,501 | 2005-10-07 | ||
PCT/IB2006/053700 WO2007042999A2 (en) | 2005-10-07 | 2006-10-09 | Modular multichannel microelectrode array and methods of making same |
Publications (2)
Publication Number | Publication Date |
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CN101583309A true CN101583309A (zh) | 2009-11-18 |
CN101583309B CN101583309B (zh) | 2012-07-04 |
Family
ID=37943197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800454192A Active CN101583309B (zh) | 2005-10-07 | 2006-10-09 | 模块化多通道微电极阵列及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7941202B2 (zh) |
EP (1) | EP1931419B1 (zh) |
CN (1) | CN101583309B (zh) |
WO (1) | WO2007042999A2 (zh) |
Cited By (8)
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CN101950741A (zh) * | 2010-08-13 | 2011-01-19 | 上海交通大学 | 芯片电极多层互连结构的制备方法 |
CN103153392A (zh) * | 2010-08-25 | 2013-06-12 | 神经毫微股份公司 | 抗位移微电极、微电极束、和微电极阵列 |
CN104245044A (zh) * | 2012-04-20 | 2014-12-24 | 沙皮恩斯脑部刺激控制有限公司 | 独立的薄膜,尤其是用于神经应用的系统的独立的薄膜 |
CN105561469A (zh) * | 2015-12-12 | 2016-05-11 | 西安交通大学 | 一种植入式多功能双面微型脑电极阵列芯片 |
CN105675682A (zh) * | 2015-12-28 | 2016-06-15 | 中国人民大学 | 一种尺寸可控的纳米线微电极及其制备方法与应用 |
CN107198522A (zh) * | 2017-07-18 | 2017-09-26 | 中国人民解放军总医院第附属医院 | 一种用于记录脑深部信号的复合型电极 |
CN110680311A (zh) * | 2019-08-30 | 2020-01-14 | 北京航空航天大学 | 一种干电极脑电采集装置 |
CN114343656A (zh) * | 2022-01-10 | 2022-04-15 | 武汉衷华脑机融合科技发展有限公司 | 一种用于神经接口的微针 |
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WO2005039696A1 (en) * | 2003-10-21 | 2005-05-06 | The Regents Of The University Of Michigan | Intracranial neural interface system |
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US9014796B2 (en) | 2005-06-14 | 2015-04-21 | Regents Of The University Of Michigan | Flexible polymer microelectrode with fluid delivery capability and methods for making same |
EP1931419B1 (en) | 2005-10-07 | 2016-08-10 | NeuroNexus Technologies, Inc. | Modular multichannel microelectrode array |
US8195267B2 (en) | 2006-01-26 | 2012-06-05 | Seymour John P | Microelectrode with laterally extending platform for reduction of tissue encapsulation |
EP2091606B1 (en) * | 2006-12-13 | 2016-05-25 | Medtronic Bakken Research Center B.V. | First time right placement of a dbs lead |
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US8800140B2 (en) | 2014-08-12 |
US20110154655A1 (en) | 2011-06-30 |
WO2007042999A2 (en) | 2007-04-19 |
CN101583309B (zh) | 2012-07-04 |
EP1931419B1 (en) | 2016-08-10 |
EP1931419A4 (en) | 2009-12-02 |
US20070123765A1 (en) | 2007-05-31 |
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US7941202B2 (en) | 2011-05-10 |
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