CN101556931B - Wafer cassette - Google Patents

Wafer cassette Download PDF

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Publication number
CN101556931B
CN101556931B CN200910051563A CN200910051563A CN101556931B CN 101556931 B CN101556931 B CN 101556931B CN 200910051563 A CN200910051563 A CN 200910051563A CN 200910051563 A CN200910051563 A CN 200910051563A CN 101556931 B CN101556931 B CN 101556931B
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CN
China
Prior art keywords
wafer
block
supporting
wafer cassette
brilliant boat
Prior art date
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Active
Application number
CN200910051563A
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Chinese (zh)
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CN101556931A (en
Inventor
周维文
颜明辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huahong Grace Semiconductor Manufacturing Corp
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Shanghai Huahong Grace Semiconductor Manufacturing Corp
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Priority to CN200910051563A priority Critical patent/CN101556931B/en
Publication of CN101556931A publication Critical patent/CN101556931A/en
Application granted granted Critical
Publication of CN101556931B publication Critical patent/CN101556931B/en
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Abstract

The invention discloses a wafer cassette which comprises a plurality of wafer grooves; the wafer grooves respectively comprise a plurality of supporting units which are used for supporting the wafers;the supporting units comprise first supporting blocks and second supporting blocks, wherein, the second supporting blocks are arranged on the first supporting blocks and are smaller than the first su pporting blocks. The wafer cassette can prevent the wafer from tiny granule pollution caused by friction between the wafer and the wafer cassette, so as to ensure cleanness of the wafer without influencing evenness of wafer processing procedure and reducing the amount of wafers contained by the wafer cassette. Therefore, the wafer cassette can further ensure normal operation of subsequent processing equipments, ensure product yield and reduce production cost.

Description

Brilliant boat
Technical field
The present invention relates to field of semiconductor manufacture, particularly a kind of brilliant boat that is used to produce wafer.
Background technology
Along with the progress of science and technology, the semiconductor electronic product has been applied to the every field of social life, and these semiconductor electronic products all have semiconductor wafer, this shows, semiconductor wafer has the importance of highly significant in current life.
In the manufacture process of semiconductor wafer; Boiler tube is an indispensable equipment, and the diffusion process of for example wherein utilizing boiler tube is exactly a basic processing procedure, in the diffusion process; Be earlier the multi-disc wafer to be placed on the brilliant boat, brilliant boat be placed on carry out a batch manufacturing in the boiler tube again.For semiconductor wafer, same during the quality and the quantity of the wafer that goes out of an inherent device fabrication, largely have influence on the yields of producing and the manufacturing cost of semiconductor wafer.
Yet, in the prior art, in the technological process of making semiconductor wafer, have several factors possibly cause the production of semiconductor wafer to go wrong.See also Figure 1A, for example when being inserted into the wafer slot 120 of brilliant boat 100 to multi-disc wafer 110, owing between wafer 110 and the wafer slot 120 friction is arranged; Can produce small particle 130, brilliant boat is vertically placed, because the effect of gravity; When extracting wafer 110, wafer 110 and wafer slot 120 fricative particles 130 can drop on the following wafer 110; The surface that this will cause small particle 130 polluting wafers 110 sees also Figure 1B, and it is depicted as and receives the wafer 110 that particle 130 pollutes; And then can cause follow-up manufacturing process normally not carry out, influence yield of products, increase manufacturing cost.
Summary of the invention
The present invention is intended to solve in the prior art, and wafer is placed in the brilliant boat, because fricative molecule causes the technical problem of the pollution of wafer.
In view of this, the present invention provides a kind of brilliant boat, comprising: a plurality of wafer slots, comprise a plurality of support portions respectively, and be used for supporting wafer; Said support portion comprises: first back-up block; And second back-up block; Wherein said second back-up block is arranged on said first back-up block, and less than said first back-up block.
Further, said second back-up block and said first back-up block are positioned at the last supporting surface of said first back-up block.
Further, said a plurality of wafer slot is arranged in parallel and is identical at interval.
Brilliant boat provided by the present invention can not influence the silicon wafer process uniformity, not reduce under the prerequisite of brilliant boat placement wafer number; Avoid the fricative molecule polluting wafer of wafer and brilliant boat; Guarantee the cleanliness factor of wafer; Further guarantee the normal operation of subsequent technique equipment, guaranteed yield of products, reduced manufacturing cost.
Description of drawings
Figure 1A is depicted as the sketch map that employed brilliant boat in the prior art causes the dust granule polluting wafer;
Figure 1B is depicted as the sketch map of the wafer that receives particle contamination;
The sketch map of the brilliant boat that provides for one embodiment of the invention shown in Figure 2;
The sketch map of the support portion of the brilliant boat that provides for one embodiment of the invention shown in Figure 3.
Embodiment
For making the object of the invention, characteristic more obviously understandable, provide preferred embodiment and combine accompanying drawing, the present invention is described further.
Please participate in Fig. 2, it is depicted as the sketch map of the brilliant boat that one embodiment of the invention provides.This crystalline substance boat 200 comprises: a plurality of wafer slots 210, comprise a plurality of support portions 220 respectively, and be used for supporting wafer; Said support portion 220 comprises: first back-up block 222; And second back-up block 221; Wherein said second back-up block 221 is arranged on said first back-up block 222, and less than said first back-up block 222.
In the present embodiment, when being inserted into the wafer slot 210 of brilliant boat 200 to the multi-disc wafer, owing between wafer and the wafer slot 210 friction is arranged; Can produce small particle, brilliant boat is vertically placed, because the effect of gravity; When extracting wafer; The particle that the last supporting surface contact friction of second back-up block 221 of the support portion 220 of wafer and wafer slot 210 produces, because first back-up block 222 is greater than second back-up block 221, these particles drop to the supporting surface of first back-up block 222; And can not drop on the following wafer, this has just guaranteed the cleaning of crystal column surface.
In the present embodiment, said second back-up block 221 and said first back-up block 222 are positioned at the supporting surface of said first back-up block 222, are collected by the supporting surface of first back-up block 222 fully to guarantee particle.
In the present embodiment, said a plurality of wafer slots 210 are arranged in parallel, and identical at interval, and this has just guaranteed the quantity and the uniformity that wafer is placed, and wafer is being added man-hour, makes each wafer can both be in identical environment, has guaranteed the quality of wafer.
In the present embodiment, please combine referring to Fig. 3, it is depicted as the sketch map of the support portion of the brilliant boat that present embodiment provides.This support portion 300 comprises: first back-up block 310; And second back-up block 320, be arranged on said first back-up block 310, and less than said first back-up block 310.Said second back-up block 320 is positioned at said first back-up block, 310 supporting surfaces.When wafer is placed wafer slot, be last supporting surface supporting wafer, when extracting wafer by second back-up block 320; Can drop to the supporting surface of first back-up block 310 because of fricative particle; And can not drop on the wafer face, avoided wafer to receive particle contamination, guaranteed the cleaning of wafer.
The brilliant boat that the embodiment of the invention provided can not influence the silicon wafer process uniformity, not reduce under the prerequisite of brilliant boat placement wafer number; Avoid the fricative molecule polluting wafer of wafer and brilliant boat; Guarantee the cleanliness factor of wafer; Further guarantee the normal operation of subsequent technique equipment, guaranteed yield of products, reduced manufacturing cost.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.

Claims (2)

1. a brilliant boat is characterized in that, comprising:
A plurality of wafer slots comprise a plurality of support portions respectively, are used for supporting wafer;
Said support portion comprises: first back-up block; And second back-up block;
Wherein said second back-up block is arranged on said first back-up block, and less than said first back-up block;
Said second back-up block and said first back-up block are positioned at the supporting surface of said first back-up block.
2. brilliant boat according to claim 1 is characterized in that, said a plurality of wafer slots are arranged in parallel and are identical at interval.
CN200910051563A 2009-05-19 2009-05-19 Wafer cassette Active CN101556931B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200910051563A CN101556931B (en) 2009-05-19 2009-05-19 Wafer cassette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910051563A CN101556931B (en) 2009-05-19 2009-05-19 Wafer cassette

Publications (2)

Publication Number Publication Date
CN101556931A CN101556931A (en) 2009-10-14
CN101556931B true CN101556931B (en) 2012-09-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910051563A Active CN101556931B (en) 2009-05-19 2009-05-19 Wafer cassette

Country Status (1)

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CN (1) CN101556931B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560683B (en) * 2010-12-29 2015-09-30 有研半导体材料有限公司 A kind of prevent silicon chip from heat treatment process, collapsing limit method and quartz boat
CN114351256A (en) * 2020-10-13 2022-04-15 中国科学院微电子研究所 Wafer boat, disassembling tool and wafer processing equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1365512A (en) * 1999-07-29 2002-08-21 国际商业机器公司 Improved ladder boat for supporting wafers
US6638391B1 (en) * 2002-06-19 2003-10-28 United Microelectronics Corp. Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
CN1915760A (en) * 2005-08-15 2007-02-21 奇景光电股份有限公司 Chip tray

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1365512A (en) * 1999-07-29 2002-08-21 国际商业机器公司 Improved ladder boat for supporting wafers
US6638391B1 (en) * 2002-06-19 2003-10-28 United Microelectronics Corp. Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same
CN1915760A (en) * 2005-08-15 2007-02-21 奇景光电股份有限公司 Chip tray

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CN101556931A (en) 2009-10-14

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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING

Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI

Effective date: 20140520

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20140520

Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399

Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation

Address before: 201203 Shanghai Guo Shou Jing Road, Zhangjiang hi tech Park No. 818

Patentee before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai