CN101442088B - Method for shaping patch type LED optical lens model - Google Patents
Method for shaping patch type LED optical lens model Download PDFInfo
- Publication number
- CN101442088B CN101442088B CN2007101247548A CN200710124754A CN101442088B CN 101442088 B CN101442088 B CN 101442088B CN 2007101247548 A CN2007101247548 A CN 2007101247548A CN 200710124754 A CN200710124754 A CN 200710124754A CN 101442088 B CN101442088 B CN 101442088B
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- Prior art keywords
- optical lens
- led
- mould
- substrate
- type led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a method for forming an LED optical lens mould of a SMD type. The method is characterized by comprising the following steps: (1) dehumidifying and plasma cleaning an LED bracket; (2) replacing a corresponding optical lens mould in a mould making machine; (3) arranging a sheet steel which prevents gel from overflowing on the LED bracket; (4) putting the optical lens mould on the mould making machine, and adding transparent resin or transparent gel; (5) roasting in a oven; and (6) finally, cutting clubfoot. The sheet steel is a bulk substrate, wherein the substrate is distributed with holes which have the same thickness with a translucent shell on the LED bracket; the substrate is distributed with the holes in matrix form; and the substrate is a plate. The method has the advantages that the method makes transparent resin or transparent silica gel and the translucent shell on the LED plastic bracket form the optical lens one time, and speeds up the production, and makes the optical lens bond firmly and not easy to fall off.
Description
Technical field
The present invention relates to a kind of method for shaping patch type LED optical lens model.
Background technology
Paster type light emitting type (SMD LED) is a kind of novel surface-adhered type light emitting semiconductor device, and the encapsulation of paster type light emitting type generally has two kinds of structures: a kind of is PCB sheet-shaped LED (being commonly called as CHIP LED); Another kind of is metallo-plastic stand type LED (being commonly called as TOP LED).Stand type LED generally has the plane encapsulating and adds sticking two kinds of encapsulated types of optical lens, when requiring light-emitting area big, when the short product of the projection distance of light uses, can use plane encapsulating encapsulation type stand type LED, because of its lighting angle is big, generally about 120 degree; But requiring light more concentrated, when the projection distance of light is wanted product utilization far away, will use lighting angle little add optical lens package type stand type LED.
This optical lens package type stand type LED that adds, because LED plastic stent printing opacity housing is formed protrusion outside metal by two parts up and down, when designing mould, the bad design of glue-feeder is so be difficult to direct disposable mould model optical lens.Therefore, existing stand type LED optical lens has following two kinds of manufacture crafts that adopt secondary operation usually:
1. first mould model optical lens is filled layer of transparent resin or transparent silica gel again in LED plastic stent printing opacity housing the inside, promptly packing material is sticked on molded good optical lens again, makes after the baking above it is bonded in.
2. make the mould of an independent forming optical lens; Put the layer of transparent resin or pass through silica gel in LED plastic stent printing opacity housing the inside earlier; After treating that transparent resin or transparent silica gel in the plastic stent dried; Point is expired transparent resin or is passed through silica gel on the optical lens shaping position in making mould again; At last the full wafer support is positioned on the mould, on the optical lens shaping position in the just smooth corresponding mould of packing material of printing opacity housing the inside, lets the packing material (being optical lens) of the interior point of mould and the packing material of printing opacity housing the inside bond together.
From the above, adopt secondary operation to add sticking optical lens, flow chart is many, and speed of production is slow, and is difficult for volume production; Because optical lens is bondingly to get on, and is not very firm, therefore crossing high temperature when (as crossing Reflow Soldering), optical lens comes off easily.
Summary of the invention
The purpose of this invention is to provide and a kind ofly make transparent resin or transparent silica gel and LED plastic stent printing opacity housing disposal molding optical lens, can improve speed of production, make that optical lens is bonding firmly, the method for shaping patch type LED optical lens model of difficult drop-off.
The object of the invention is realized through following scheme.
A kind of method for shaping patch type LED optical lens model is characterized in that: said method for shaping patch type LED optical lens model is following:
1. led support is dehumidified and plasma cleans;
2. in the model board, change corresponding optical lens mould;
3. on led support, add the steel disc that prevents excessive glue;
4. put into and installed on the optical lens mould on the board adding transparent resin or transparent silica gel;
5. put into the baking box baking;
6. cut clubfoot at last.
Said steel disc is a bulk substrate, and it is porose to distribute on the substrate.
Said hole matrix formula is distributed on the substrate.
Said substrate is a flat board.
The present invention compared with prior art has the following advantages.
The present invention makes the steel disc that a slice conforms to printing opacity thickness of shell on the plastic LED support and can be supporting, after preventing plastic stent elder generation clubfoot, when carrying out mould model again; The pulling force of mould die sinking can make whole finished product come off, thus on the plastic stent of clubfoot not, add this steel disc, add that steel disc is supporting after; This moment this steel disc just with the plastic stent of clubfoot not on the printing opacity housing cooperate fully, can prevent the glue that overflows, after plastic stent adds steel disc; Let the printing opacity housing put into down and installed on the optical lens mould of model board; And have good positioning,, put into transparent resin or transparent silica gel again owing between steel disc and the mould slit is arranged; Transparent resin on the mould or silica gel slit entering thus thoroughly; Make its with the plastic stent of clubfoot not on printing opacity housing disposal molding optical lens, from steel disc, take out after the moulding, cut single finished product of clubfoot moulding again.Therefore, can the disposal molding optical lens, need not adopt secondary operation to add sticking optical lens.The present invention can adopt transparent resin or transparent silica gel and LED plastic stent printing opacity housing disposal molding optical lens, and flow chart is few, and speed of production is fast; Easy volume production; Optical lens and printing opacity housing have the good bonding effect, and optical lens thrust is big, difficult drop-off.
Description of drawings
Fig. 1 is the front view of LED plastic stent of the present invention and steel disc;
Fig. 2 is LED plastic stent of the present invention and the steel disc front view after supporting;
Fig. 3 is the half-finished front view after the LED plastic stent full wafer of the present invention moulding;
Fig. 4 is the front view of adopting surface mounted LED finished product of the present invention;
Fig. 5 adds portion's view of the adopting surface mounted LED encapsulating structure of sticking optical lens for adopting secondary operation;
Fig. 6 is portion's view of adopting surface mounted LED encapsulating structure of the present invention;
Fig. 7 is the patch type LED optical lens manufacture craft flow chart according to the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in further detail.
Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 and shown in Figure 7; Make a slice and the identical steel disc 2 of printing opacity thickness of shell on the adopting surface mounted LED plastic stent 1; Use steel disc and plastic stent supporting again; The printing opacity housing cooperates with steel disc fully, therefore can prevent that transparent resin or transparent silica gel from sticking on the printing opacity housing.
The dehumidifying of adopting surface mounted LED plastic stent semi-finished product is removed hiding moisture in the support promptly with the baking box baking, prevents to produce bubble; Clean with plasma again, remove dust in the support, guarantee the fineness in the support; Improve the adhesive property of transparent resin or transparent silica gel and plastic stent printing opacity housing, change corresponding optical lens mould in the model board, after preventing plastic stent elder generation clubfoot; When carrying out mould model again, the pulling force of mould die sinking can make whole finished product come off, and adds the steel disc of the glue that prevents to overflow at the stand type LED plastic stent of clubfoot not; Put into and install on the optical lens mould on the board, add transparent resin or transparent silica gel, make itself and adopting surface mounted LED plastic stent printing opacity housing disposal molding optical lens; Put into the baking box baking again, cut clubfoot at last, form single finished product.
Claims (4)
1. method for shaping patch type LED optical lens model, it is characterized in that: said method for shaping patch type LED optical lens model is following:
1. led support is dehumidified and plasma cleans;
2. in the model board, change corresponding optical lens mould;
3. on led support, add the steel disc that prevents excessive glue;
4. put into and installed on the optical lens mould on the board; Between steel disc and the optical lens mould slit is arranged; When adding transparent resin or transparent silica gel; Transparent resin on the optical lens or transparent silica gel can be got into by the slit, make transparent resin or transparent silica gel and led support one-shot forming optical lens;
5. put into the baking box baking;
6. cut clubfoot at last.
2. method for shaping patch type LED optical lens model according to claim 1 is characterized in that: said steel disc is a bulk substrate, be distributed with on the substrate with led support on the hole that conforms to of printing opacity thickness of shell.
3. method for shaping patch type LED optical lens model according to claim 2 is characterized in that: said hole matrix formula is distributed on the substrate.
4. method for shaping patch type LED optical lens model according to claim 2 is characterized in that: said substrate is a flat board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101247548A CN101442088B (en) | 2007-11-22 | 2007-11-22 | Method for shaping patch type LED optical lens model |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101247548A CN101442088B (en) | 2007-11-22 | 2007-11-22 | Method for shaping patch type LED optical lens model |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101442088A CN101442088A (en) | 2009-05-27 |
| CN101442088B true CN101442088B (en) | 2012-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101247548A Active CN101442088B (en) | 2007-11-22 | 2007-11-22 | Method for shaping patch type LED optical lens model |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102294781A (en) * | 2010-06-22 | 2011-12-28 | 禾晶能源科技股份有限公司 | Multi-cavity injection molding method for solar lenses |
| CN105429585A (en) * | 2015-12-15 | 2016-03-23 | 四川钟顺太阳能开发有限公司 | Secondary concentrator for concentrating solar cell module, receiver employing secondary concentrator and manufacturing method of secondary concentrator |
| DE102016223710B4 (en) * | 2016-11-29 | 2021-01-14 | Carl Zeiss Industrielle Messtechnik Gmbh | Method and device for producing a lighting device |
| CN109578843A (en) * | 2018-11-21 | 2019-04-05 | 中山市木林森电子有限公司 | A kind of Novel LED light bar manufacture craft |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
| CN1355571A (en) * | 2000-11-23 | 2002-06-26 | 诠兴开发科技股份有限公司 | Packaging method for LED |
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
| CN1822405A (en) * | 2005-01-20 | 2006-08-23 | 班斯集团公司 | LED assembly having overmolded lens on treated leadframe and method therefor |
| CN1825638A (en) * | 2005-02-23 | 2006-08-30 | 宏齐科技股份有限公司 | Mould and method for packing LED |
| CN101013689A (en) * | 2007-01-30 | 2007-08-08 | 深圳市共达光电器件有限公司 | LED packaging structure and packaging method |
-
2007
- 2007-11-22 CN CN2007101247548A patent/CN101442088B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
| CN1355571A (en) * | 2000-11-23 | 2002-06-26 | 诠兴开发科技股份有限公司 | Packaging method for LED |
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
| CN1822405A (en) * | 2005-01-20 | 2006-08-23 | 班斯集团公司 | LED assembly having overmolded lens on treated leadframe and method therefor |
| CN1825638A (en) * | 2005-02-23 | 2006-08-30 | 宏齐科技股份有限公司 | Mould and method for packing LED |
| CN101013689A (en) * | 2007-01-30 | 2007-08-08 | 深圳市共达光电器件有限公司 | LED packaging structure and packaging method |
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| Publication number | Publication date |
|---|---|
| CN101442088A (en) | 2009-05-27 |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: Four 11D room, 510000 floor, building B, 10 Fengshen Road, Huadu District, Guangdong, Guangzhou Patentee before: Guangzhou Hongli Tronic Co., Ltd. |