CN101420006B - 用于制造一种辐射的、可表面安装的构件的方法 - Google Patents
用于制造一种辐射的、可表面安装的构件的方法 Download PDFInfo
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- CN101420006B CN101420006B CN2008101744530A CN200810174453A CN101420006B CN 101420006 B CN101420006 B CN 101420006B CN 2008101744530 A CN2008101744530 A CN 2008101744530A CN 200810174453 A CN200810174453 A CN 200810174453A CN 101420006 B CN101420006 B CN 101420006B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
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Abstract
Description
Claims (38)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10131698.4 | 2001-06-29 | ||
DE10131698A DE10131698A1 (de) | 2001-06-29 | 2001-06-29 | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028170849A Division CN100524849C (zh) | 2001-06-29 | 2002-04-25 | 可表面安装的辐射构件与其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN101420006A CN101420006A (zh) | 2009-04-29 |
CN101420006B true CN101420006B (zh) | 2012-08-29 |
Family
ID=7690112
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028170849A Expired - Fee Related CN100524849C (zh) | 2001-06-29 | 2002-04-25 | 可表面安装的辐射构件与其制造方法 |
CN2008101744530A Expired - Fee Related CN101420006B (zh) | 2001-06-29 | 2002-04-25 | 用于制造一种辐射的、可表面安装的构件的方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028170849A Expired - Fee Related CN100524849C (zh) | 2001-06-29 | 2002-04-25 | 可表面安装的辐射构件与其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7436002B2 (zh) |
EP (1) | EP1399978B1 (zh) |
JP (1) | JP2004534405A (zh) |
CN (2) | CN100524849C (zh) |
DE (1) | DE10131698A1 (zh) |
TW (1) | TWI338378B (zh) |
WO (1) | WO2003005458A1 (zh) |
Families Citing this family (83)
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KR101148332B1 (ko) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지 |
DE10326755A1 (de) * | 2003-06-13 | 2006-01-26 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Entladungslampe mit Zweibanden-Leuchtstoff |
US7462983B2 (en) * | 2003-06-27 | 2008-12-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | White light emitting device |
JP2005026302A (ja) * | 2003-06-30 | 2005-01-27 | Shin Etsu Handotai Co Ltd | 発光モジュール |
DE102004001312B4 (de) * | 2003-07-25 | 2010-09-30 | Seoul Semiconductor Co., Ltd. | Chip-Leuchtdiode und Verfahren zu ihrer Herstellung |
US7915085B2 (en) * | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
JP4370158B2 (ja) | 2003-12-24 | 2009-11-25 | シャープ株式会社 | 光結合器およびそれを用いた電子機器 |
DE10361801A1 (de) * | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
JP4181515B2 (ja) * | 2004-02-25 | 2008-11-19 | シャープ株式会社 | 光半導体装置およびそれを用いた電子機器 |
US7488990B2 (en) * | 2004-04-02 | 2009-02-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Using multiple types of phosphor in combination with a light emitting device |
US7348220B2 (en) * | 2004-04-30 | 2008-03-25 | Sumitomo Bakelite Co., Ltd. | Resin-encapsulated type semiconductor packages, and production method and apparatus therefor |
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JP2006024645A (ja) * | 2004-07-06 | 2006-01-26 | Rohm Co Ltd | 半導体発光装置 |
JP4348267B2 (ja) * | 2004-09-22 | 2009-10-21 | シャープ株式会社 | 光半導体装置、光通信装置および電子機器 |
US20060061261A1 (en) * | 2004-09-22 | 2006-03-23 | Kun-Chui Lee | White light emitting device |
US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
US8134292B2 (en) * | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
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DE102005009066A1 (de) * | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement |
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CN100485893C (zh) * | 2005-09-09 | 2009-05-06 | 鸿富锦精密工业(深圳)有限公司 | 影像感测芯片封装的制程和结构 |
JP2007165811A (ja) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
US7772604B2 (en) | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
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CN101554089A (zh) * | 2006-08-23 | 2009-10-07 | 科锐Led照明科技公司 | 照明装置和照明方法 |
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CN101622493A (zh) | 2006-12-04 | 2010-01-06 | 科锐Led照明科技公司 | 照明装置和照明方法 |
US8232564B2 (en) | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
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Also Published As
Publication number | Publication date |
---|---|
CN101420006A (zh) | 2009-04-29 |
US7436002B2 (en) | 2008-10-14 |
WO2003005458A1 (de) | 2003-01-16 |
EP1399978B1 (de) | 2015-06-24 |
US20040188697A1 (en) | 2004-09-30 |
TWI338378B (en) | 2011-03-01 |
CN1550047A (zh) | 2004-11-24 |
EP1399978A1 (de) | 2004-03-24 |
US20090011527A1 (en) | 2009-01-08 |
CN100524849C (zh) | 2009-08-05 |
JP2004534405A (ja) | 2004-11-11 |
DE10131698A1 (de) | 2003-01-30 |
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