CN101356865A - 有源电极以及使用挠性电路制造它的方法 - Google Patents
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Abstract
本发明的名称是有源电极以及使用挠性电路制造它的方法。创造有效电极的方法,其包括提供具有由第一材料制成的电极(120)的挠性电路(100)和在挠性电路上提供第一掩模(200),第一掩模具有偏移区(305)和暴露电极的开口(220)。该方法还包括在偏移区(305)和开口(220)之上沉淀第二材料(300),第二材料不同于第一材料,以及在第二材料上提供第二掩模(400),第二掩模在位于偏移区之上的一部分第二材料上具有开口(405)。
Description
依据美国法典35中119章要求优先权
【0001】本专利申请要求于2006年2月27日提交并且转让于此受让人的美国临时申请第60/777,135的优先权权益,因此本文特别地引入全文以作参考。
发明领域
【0002】本发明通常涉及挠性电路技术(flex circuit technology)。更加具体地,本发明涉及使用挠性电路技术而创造电极。
发明背景
【0003】挠性电路被应用在微电子工业已经很多年。近几年,挠性电路被用于设计应用于体内应用的微电极。一个挠性电路设计包括在柔软电介质衬底(dielectric substrate)(例如:聚酰亚胺)上的叠片导电箔片(例如,铜)。使用掩模(masking)和光刻(photolithography)技术,在导电箔片上形成挠性电路。由于挠性电路的低生产成本,易于设计一体化以及在移动应用中的灵活性,因此其为期望的。
发明概述
【0004】本发明涉及制造有效电极(active electrode)的方法,所述方法可以包括提供具有电极的挠性电路——电极由第一材料制成——和提供在挠性电路之上的第一掩模(first mask),第一掩模具有偏移区和暴露电极的开口(opening)。该方法还包括在偏移区和开口之上沉积第二材料,第二材料不同于第一材料,以及在第二材料上提供第二掩模,第二掩模在一部分第二材料上具有开口,该部分位于偏移区之上。
【0005】本发明涉及电极,其可以包括衬底(substrate)——其具有第一材料制成的导电迹线(trace)——和位于导电迹线之上的第一掩模,第一掩模具有在一部分导电迹线之上的第一开口。电极还包括由第二材料制成并且位于一部分导电迹线之上和一部分第一掩模之上的目标材料(material of interest),以及包括在目标材料之上的第二掩模,第二掩模在一部分目标材料之上具有第二开口,第二开口偏移第一开口。
附图简述
【0006】当下面进行的详细描述与附图协同使用时,本发明的特征、目标、和优点将变得越发显而易见,其中:
【0007】图1为有效电极的剖面图,该有效电极是根据本发明的一个实施方式使用挠性电路而制造的。
【0008】图2为根据本发明的一个实施方式的挠性电路的俯视图。
【0009】图3为掩模的俯视图,掩模被用于覆盖根据本发明的一个实施方式的在图1中的挠性电路。
【0010】图4为俯视图,其显示被放置在根据本发明的一个实施方式的掩模开口之中和之上的一个或多个目标材料。
【0011】图5为掩模的俯视图,掩模被用于覆盖根据本发明的一个实施方式的在图4中的目标材料。
【0012】图6A和6B为俯视图,其显示了根据本发明不同实施方式的垂直和水平的偏移。
【0013】图7为流程图,显示了根据本发明的一个实施方式制造图1的电极的方法。
发明详述
【0014】本发明涉及使用挠性电路制造有效电极。挠性电路具有能被掩盖并且在聚酰亚胺衬底上能被成像的铜迹线。具有铜迹线的挠性电路具有低的制造成本。铜迹线的端部可以用第一目标材料(例如,金)进行电镀。第一掩模被用于建造有效电极的开口。第二目标材料(例如,石墨和/或铂)可以被沉积或被丝网印刷(screen-printed)到开口中和偏移区之上。第二掩模被用于覆盖处在所述开口之上的第二目标材料。在偏移区之上可以放置膜以形成有效电极。偏移区上的第二目标材料作用为扩散阻挡层(diffusion barrier),以防止,例如,电解液与铜迹线接触。偏移区防止铜迹线在正电势下氧化,正如在测量过氧化物的葡萄糖电极对银-氯化银的情况中。
【0015】图1为有效电极10的剖面图,该有效电极根据本发明的实施方式使用挠性电路100而制造。挠性电路100可以包括衬底105,一个或多个触点(contact)110,一个或多个迹线115,和一个或多个电极120(705)。为了例证目的,触点110,迹线115,和电极120被显示为不同的元件;但是,触点110,迹线115,和电极120被统称为迹线并且使用相同的材料(例如,铜)而形成。触点110,迹线115,和电极120被掩盖并且在衬底105上成像。掩模200被放置在挠性电路100(710)上。掩模200具有开口220,开口220暴露电极120并且接收目标材料300,其被用于形成有效电极10(715)。目标材料300还被放置在偏移区305中的掩模200之上。偏移区305被显示与开口220相邻。具有开口405的掩模400被沉积在目标材料300(720)上。开口405位于偏移区305之上并且被用作膜500(725)的放置。开口220沿第一轴或平面放置和开口405沿第二轴或平面放置。第一轴或平面与第二轴或平面是不重合的。因此,第一轴或平面与第二轴或平面垂直地和/或水平地偏移。图1和图6B显示了水平偏移,以及图6A显示了垂直偏移。水平的偏移可以沿衬底105的长度以及垂直的偏移可以沿衬底105的宽度。掩模200和/或目标材料300作用为扩散阻挡层以防止电解液从膜500进入与电极120接触的状态。偏移区305防止电极120具有不希望的电化学活性。
【0016】图2为根据本发明的实施方式的挠性电路100的俯视图。触点110,迹线115,和电极120由铜材料制成;并且通过掩模(masking)和光刻(photolithography)技术在衬底105上形成。衬底105可以是柔软电介质衬底例如聚酰亚胺。触点110可以被用于连接测量设备,例如稳压器。迹线115被用于从电极120传输电压或电流到触点110。例如,图1显示挠性电路100具有衬底105,三个触点110a-c,三个迹线115a-c,和三个电极120a-c。
【0017】图3为掩模200的俯视图,掩模被用于覆盖根据本发明的实施方式在图2中显示的挠性电路100。掩模200可以由电介质材料例如感光环氧材料或紫外线可固化环氧材料制成。掩模200具有开口210a-c和220a-c。在一个实施方式中,除触点110和/或电极120上的区域外,掩模200覆盖全部挠性电路100的上表面。因此,开口210a-c位于触点110a-c的正上方,以至于触点110a-c通过掩模200的开口210a-c被暴露。相似地,开口220a-c位于电极120a-c的正上方,以至于电极120a-c通过掩模200的开口220a-c被暴露。传统的平板印刷技术可以用于在挠性电路100上沉积或放置掩模200。
【0018】图4为俯视图,其显示被沉积在根据本发明的实施方式的掩模200开口220a-c之中和之上的一个或多个目标材料300a-c。目标材料300a-c为电极120a-c提供工作表面。相同的目标材料300或不同的目标材料300可以被沉积在每个开口220a-c之上。目标材料300可以是墨或由碳、金、石墨、铂、银-氯化银、铑、钯、其它金属以及具有特定电化学性质的其他材料制成的材料。例如,铂墨或材料可能被沉积在开口220a和220c之上以及银-氯化银墨或材料可以被沉积在开口220b上。一个或更多的目标材料300还可能被沉积在偏移区305a-c上而不是开口220a-c的正上方,其中偏移区305a-c与开口220a-c相邻。偏移区305a-c的尺寸随电极120a-c的具体应用和排列和构型而变化。在一个实施方式中,偏移区305a-c的尺寸分别为大约0.010英寸、0.003英寸和0.050英寸。
【0019】图5为掩模400的俯视图,掩模400被用于覆盖根据本发明的实施方式在图4中显示的目标材料300。掩模400可以由电介质材料例如感光环氧材料或紫外线可固化环氧材料制成。掩模400具有位于偏移区305上的开口405。在一个实施方式中,除偏移区305上方的区域外,掩模400覆盖目标材料300的全部上表面。因此,开口405可以位于目标材料300的正上方,其中目标材料位于偏移区305的正上方。传统的平板印刷技术可以用于在目标材料300上沉积或放置掩模400。
【0020】重回图1,膜500被沉积在开口405中并且被沉积在目标材料300(即工作表面)之上作为传感区域。膜500可包括,例如,葡糖氧化酶。膜500可以允许分子以一定的速率穿过,所以目标材料300能准确地测量,例如,在血液中的葡萄糖的水平。也就是,血液中的分子能以一定的速率穿过膜500而到达目标材料300,以得到血液中葡萄糖的具体测量值。膜500和/或目标材料300应适合于浸入含有目标种类(例如血)和/或电解质的流体或溶液中。触点110,迹线115,和/或电极120可能不适合于浸入含有目标种类(例如血)的流体或溶液中,因此应该通过具有适当电介质性质的适合密封剂保护。
【0021】尽管一些代表性的实施方式被描述并且在所附的附图中显示,应当理解,这样的实施方式仅仅是示例性的而并不限定宽广的发明,以及本发明并限于所描述和显示的具体的构造和排列,因此,除上述章节阐明的内容之外,多种其它变化、组合、删节、修正和置换是可能的。在本领域的那些技术人员将意识到,所描述的实施方式的多种改动和修正可以形成而没有脱离本发明的范围和精神。因此,应当理解,在所附权利要求的范围内,本发明可以如本文所具体描述之外的方式被实践。
Claims (20)
1.制造有效电极的方法,包括:
提供具有由第一材料制成的电极的挠性电路;
在所述挠性电路之上提供第一掩模,所述第一掩模具有偏移区和暴露所述电极的开口;
在所述偏移区和所述开口上沉积第二材料,所述第二材料不同于所述第一材料;和
在所述第二材料之上提供第二掩模,所述第二掩模在一部分的所述第二材料之上具有开口,所述部分位于所述偏移区之上。
2.根据权利要求1所述的方法,进一步包括在所述第二掩模的所述开口中提供膜。
3.根据权利要求1所述的方法,其中所述偏移区临近所述第一掩模的所述开口。
4.根据权利要求1所述的方法,其中所述第一材料是铜材料和第二材料选自碳、金、石墨、铂、银-氯化银、铑或钯材料。
5.根据权利要求1所述的方法,其中多个电极之一沿第一轴被放置并且所述偏移区沿第二轴被放置,所述第二轴与所述第一轴不一致。
6.根据权利要求1所述的方法,其中多个电极之一沿第一平面被放置并且所述偏移区沿第二平面被放置,所述第二平面与所述第一平面不一致。
7.根据权利要求1所述的方法,其中所述第一材料是铜以及所述第二材料不是铜。
8.制造电极的方法,包括:
提供其上具有导电迹线的衬底;
在所述导电迹线之上应用第一掩模,所述第一掩模在一部分所述导电迹线上具有第一开口;
在一部分所述导电迹线和一部分所述第一掩模之上应用目标材料;和
在所述目标材料上应用第二掩模,所述第二掩模在一部分所述目标材料上具有第二开口,所述第二开口偏移开所述第一开口。
9.根据权利要求8所述的方法,其中所述导电迹线由铜材料制成,以及所述目标材料由不是铜的材料制成。
10.根据权利要求8所述的方法,其中所述第一开口沿第一轴被放置并且第二开口沿第二轴被放置,所述第二轴与所述第一轴不一致。
11.根据权利要求8所述的方法,其中所述第一开口沿第一平面被放置并且第二开口沿第二平面被放置,所述第二平面与所述第一平面不一致。
12.根据权利要求8所述的方法,其中所述偏移在沿所述衬底长度的方向上。
13.根据权利要求8所述的方法,其中所述偏移在沿所述衬底宽度的方向上。
14.根据权利要求8所述的方法,其中所述导电迹线由铜材料制成,以及目标材料选自碳、金、石墨、铂、银-氯化银、铑或钯材料。
15.电极,包括:
衬底,其具有由第一材料制成的导电迹线;
第一掩模,其位于所述导电迹线上,所述第一掩模具有在一部分所述导电迹线上的第一开口;
目标材料,其由第二材料制成并且位于一部分所述导电迹线和一部分所述第一掩模之上;和
在所述目标材料上的第二掩模,所述第二掩模在一部分所述目标材料上具有第二开口,所述第二开口偏移开所述第一开口。
16.根据权利要求15所述的电极,其中所述第一开口沿第一轴被放置并且第二开口沿第二轴被放置,所述第二轴与所述第一轴不一致。
17.根据权利要求15所述的电极,其中所述第一开口沿第一平面被放置并且第二开口沿第二平面被放置,所述第二平面与所述第一平面不一致。
18.根据权利要求15所述的电极,其中所述偏移在沿所述衬底长度的方向上。
19.根据权利要求15所述的电极,其中所述偏移在沿所述衬底宽度的方向上。
20.根据权利要求15所述的电极,其中所述导电迹线由铜材料制成,以及所述目标材料由不是铜的材料制成。
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CN101356865B (zh) | 2012-06-06 |
JP5207387B2 (ja) | 2013-06-12 |
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JP2009528677A (ja) | 2009-08-06 |
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US20070200254A1 (en) | 2007-08-30 |
US8546701B2 (en) | 2013-10-01 |
ATE468006T1 (de) | 2010-05-15 |
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US20120037406A1 (en) | 2012-02-16 |
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