CN101356853A - 集成麦克风 - Google Patents
集成麦克风 Download PDFInfo
- Publication number
- CN101356853A CN101356853A CN200680050789.5A CN200680050789A CN101356853A CN 101356853 A CN101356853 A CN 101356853A CN 200680050789 A CN200680050789 A CN 200680050789A CN 101356853 A CN101356853 A CN 101356853A
- Authority
- CN
- China
- Prior art keywords
- microphone
- circuit
- tube core
- deposition
- deposition materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0728—Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
Description
Claims (20)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75770306P | 2006-01-09 | 2006-01-09 | |
US60/757,703 | 2006-01-09 | ||
US11/535,804 | 2006-09-27 | ||
US11/535,804 US7795695B2 (en) | 2005-01-27 | 2006-09-27 | Integrated microphone |
PCT/US2006/048420 WO2007081504A1 (en) | 2006-01-09 | 2006-12-19 | Integrated microphone |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101356853A true CN101356853A (zh) | 2009-01-28 |
CN101356853B CN101356853B (zh) | 2012-08-29 |
Family
ID=37891631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800507895A Active CN101356853B (zh) | 2006-01-09 | 2006-12-19 | 集成麦克风 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7795695B2 (zh) |
CN (1) | CN101356853B (zh) |
WO (1) | WO2007081504A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103248994A (zh) * | 2012-02-06 | 2013-08-14 | 苏州敏芯微电子技术有限公司 | 集成电路与电容式微硅麦克风单片集成的制作方法及芯片 |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7795695B2 (en) * | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
KR101113366B1 (ko) * | 2008-02-20 | 2012-03-02 | 오므론 가부시키가이샤 | 정전 용량형 진동 센서 |
US8580596B2 (en) * | 2009-04-10 | 2013-11-12 | Nxp, B.V. | Front end micro cavity |
US8571249B2 (en) * | 2009-05-29 | 2013-10-29 | General Mems Corporation | Silicon microphone package |
US20110073967A1 (en) * | 2009-08-28 | 2011-03-31 | Analog Devices, Inc. | Apparatus and method of forming a mems acoustic transducer with layer transfer processes |
WO2011025939A1 (en) * | 2009-08-28 | 2011-03-03 | Analog Devices, Inc. | Dual single-crystal backplate microphone system and method of fabricating same |
EP2432249A1 (en) | 2010-07-02 | 2012-03-21 | Knowles Electronics Asia PTE. Ltd. | Microphone |
US8436435B2 (en) * | 2010-07-27 | 2013-05-07 | National Tsing Hua University | MEMS capacitive microphone |
DE102011005676A1 (de) * | 2011-03-17 | 2012-09-20 | Robert Bosch Gmbh | Bauteil |
TWI484835B (zh) | 2011-04-12 | 2015-05-11 | Pixart Imaging Inc | 微機電系統麥克風裝置及其製作方法 |
KR20140059242A (ko) | 2011-08-18 | 2014-05-15 | 노우레스 일렉트로닉스, 엘엘시 | 엠이엠에스 기기들을 위한 민감도 조절 장치 및 방법 |
US9485560B2 (en) | 2012-02-01 | 2016-11-01 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
US9402118B2 (en) | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
US9491539B2 (en) | 2012-08-01 | 2016-11-08 | Knowles Electronics, Llc | MEMS apparatus disposed on assembly lid |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US8692340B1 (en) | 2013-03-13 | 2014-04-08 | Invensense, Inc. | MEMS acoustic sensor with integrated back cavity |
US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
US9467785B2 (en) | 2013-03-28 | 2016-10-11 | Knowles Electronics, Llc | MEMS apparatus with increased back volume |
US9503814B2 (en) | 2013-04-10 | 2016-11-22 | Knowles Electronics, Llc | Differential outputs in multiple motor MEMS devices |
US9301075B2 (en) | 2013-04-24 | 2016-03-29 | Knowles Electronics, Llc | MEMS microphone with out-gassing openings and method of manufacturing the same |
US9711166B2 (en) | 2013-05-23 | 2017-07-18 | Knowles Electronics, Llc | Decimation synchronization in a microphone |
US10020008B2 (en) | 2013-05-23 | 2018-07-10 | Knowles Electronics, Llc | Microphone and corresponding digital interface |
US20180317019A1 (en) | 2013-05-23 | 2018-11-01 | Knowles Electronics, Llc | Acoustic activity detecting microphone |
US10028054B2 (en) | 2013-10-21 | 2018-07-17 | Knowles Electronics, Llc | Apparatus and method for frequency detection |
EP3000241B1 (en) | 2013-05-23 | 2019-07-17 | Knowles Electronics, LLC | Vad detection microphone and method of operating the same |
US9386370B2 (en) | 2013-09-04 | 2016-07-05 | Knowles Electronics, Llc | Slew rate control apparatus for digital microphones |
US9502028B2 (en) | 2013-10-18 | 2016-11-22 | Knowles Electronics, Llc | Acoustic activity detection apparatus and method |
US9147397B2 (en) | 2013-10-29 | 2015-09-29 | Knowles Electronics, Llc | VAD detection apparatus and method of operating the same |
US9352955B2 (en) * | 2014-03-27 | 2016-05-31 | Maxim Integrated Products, Inc. | MEMS pressure sensor with improved insensitivity to thermo-mechanical stress |
US9831844B2 (en) | 2014-09-19 | 2017-11-28 | Knowles Electronics, Llc | Digital microphone with adjustable gain control |
US9554214B2 (en) | 2014-10-02 | 2017-01-24 | Knowles Electronics, Llc | Signal processing platform in an acoustic capture device |
US9743191B2 (en) | 2014-10-13 | 2017-08-22 | Knowles Electronics, Llc | Acoustic apparatus with diaphragm supported at a discrete number of locations |
US9743167B2 (en) | 2014-12-17 | 2017-08-22 | Knowles Electronics, Llc | Microphone with soft clipping circuit |
CN107112012B (zh) | 2015-01-07 | 2020-11-20 | 美商楼氏电子有限公司 | 用于音频处理的方法和系统及计算机可读存储介质 |
TW201640322A (zh) | 2015-01-21 | 2016-11-16 | 諾爾斯電子公司 | 用於聲音設備之低功率語音觸發及方法 |
US10121472B2 (en) | 2015-02-13 | 2018-11-06 | Knowles Electronics, Llc | Audio buffer catch-up apparatus and method with two microphones |
US9866938B2 (en) | 2015-02-19 | 2018-01-09 | Knowles Electronics, Llc | Interface for microphone-to-microphone communications |
US9800971B2 (en) | 2015-03-17 | 2017-10-24 | Knowles Electronics, Llc | Acoustic apparatus with side port |
CN107534818B (zh) | 2015-05-14 | 2020-06-23 | 美商楼氏电子有限公司 | 麦克风 |
US10291973B2 (en) | 2015-05-14 | 2019-05-14 | Knowles Electronics, Llc | Sensor device with ingress protection |
US9478234B1 (en) | 2015-07-13 | 2016-10-25 | Knowles Electronics, Llc | Microphone apparatus and method with catch-up buffer |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
WO2017087332A1 (en) | 2015-11-19 | 2017-05-26 | Knowles Electronics, Llc | Differential mems microphone |
US10129651B2 (en) * | 2015-12-18 | 2018-11-13 | Robert Bosch Gmbh | Center-fixed MEMS microphone membrane |
WO2017105851A1 (en) | 2015-12-18 | 2017-06-22 | Knowles Electronics, Llc | Microphone with hydrophobic ingress protection |
US9516421B1 (en) | 2015-12-18 | 2016-12-06 | Knowles Electronics, Llc | Acoustic sensing apparatus and method of manufacturing the same |
US10158943B2 (en) | 2016-02-01 | 2018-12-18 | Knowles Electronics, Llc | Apparatus and method to bias MEMS motors |
US10362408B2 (en) | 2016-02-04 | 2019-07-23 | Knowles Electronics, Llc | Differential MEMS microphone |
WO2017136744A1 (en) | 2016-02-04 | 2017-08-10 | Knowles Electronics, Llc | Microphone and pressure sensor |
DE112017002666T5 (de) | 2016-05-26 | 2019-02-28 | Knowles Electronics, Llc | Mikrofoneinrichtung mit integriertem drucksensor |
US11104571B2 (en) | 2016-06-24 | 2021-08-31 | Knowles Electronics, Llc | Microphone with integrated gas sensor |
US10499150B2 (en) | 2016-07-05 | 2019-12-03 | Knowles Electronics, Llc | Microphone assembly with digital feedback loop |
US10206023B2 (en) | 2016-07-06 | 2019-02-12 | Knowles Electronics, Llc | Transducer package with through-vias |
US10153740B2 (en) | 2016-07-11 | 2018-12-11 | Knowles Electronics, Llc | Split signal differential MEMS microphone |
US9860623B1 (en) | 2016-07-13 | 2018-01-02 | Knowles Electronics, Llc | Stacked chip microphone |
US10257616B2 (en) | 2016-07-22 | 2019-04-09 | Knowles Electronics, Llc | Digital microphone assembly with improved frequency response and noise characteristics |
CN109641739B (zh) | 2016-07-27 | 2023-03-31 | 美商楼氏电子有限公司 | 微机电系统(mems)装置封装 |
US10979824B2 (en) | 2016-10-28 | 2021-04-13 | Knowles Electronics, Llc | Transducer assemblies and methods |
KR102371228B1 (ko) | 2016-11-24 | 2022-03-04 | 현대자동차 주식회사 | 마이크로폰 및 이의 제조방법 |
DE112017006148B4 (de) | 2016-12-05 | 2024-04-25 | Knowles Electronics, Llc | Rampenbildung der sensorleistung in einer mikroelektromechanischen systemvorrichtung |
US10315912B2 (en) | 2016-12-28 | 2019-06-11 | Knowles Electronics, Llc | Microelectromechanical system microphone |
CN110291718B (zh) | 2017-02-14 | 2023-04-07 | 美商楼氏电子有限公司 | 校准麦克风截止频率的系统和方法 |
EP3855129B1 (en) | 2017-03-22 | 2023-10-25 | Knowles Electronics, LLC | Interface circuit for a capacitive sensor |
CN110710225B (zh) | 2017-05-25 | 2021-05-11 | 美商楼氏电子有限公司 | 麦克风装置和制造麦克风装置的方法 |
DE112018003280T8 (de) | 2017-06-27 | 2020-04-02 | Knowles Electronics, Llc | Nachlinearisierungssystem und -verfahren unter verwendung eines trackingsignals |
DE112018003794T5 (de) | 2017-07-26 | 2020-05-07 | Knowles Electronics, Llc | Akustische entlastung in mems |
WO2019051211A1 (en) | 2017-09-08 | 2019-03-14 | Knowles Electronics, Llc | NOISE MITIGATION FOR A DIGITAL MICROPHONE |
DE112018005251T5 (de) | 2017-09-18 | 2020-06-18 | Knowles Electronics, Llc | System und verfahren zur optimierung von akustischen löchern |
WO2019060599A1 (en) | 2017-09-21 | 2019-03-28 | Knowles Electronics, Llc | MEMS DEVICE RAISED IN A MICROPHONE WITH INPUT PROTECTION |
US10591326B2 (en) | 2017-11-14 | 2020-03-17 | Knowles Electronics, Llc | Sensor package with ingress protection |
US11825266B2 (en) | 2018-03-21 | 2023-11-21 | Knowles Electronics, Llc | Dielectric comb for MEMS device |
CN112020865B (zh) | 2018-04-26 | 2022-06-17 | 美商楼氏电子有限公司 | 具有透声隔膜的声学组件 |
US10805702B2 (en) | 2018-05-18 | 2020-10-13 | Knowles Electronics, Llc | Systems and methods for reducing noise in microphones |
DE112019003110T5 (de) | 2018-06-19 | 2021-03-04 | Knowles Electronics, Llc | Mikrofonanordnung mit reduziertem Rauschen |
WO2019246151A1 (en) | 2018-06-19 | 2019-12-26 | Knowles Electronics, Llc | Transconductance amplifier |
DE112019004970T5 (de) | 2018-10-05 | 2021-06-24 | Knowles Electronics, Llc | Mikrofonvorrichtung mit Eindringschutz |
DE112019004979T5 (de) | 2018-10-05 | 2021-06-17 | Knowles Electronics, Llc | Verfahren zur Herstellung von MEMS-Membranen, die Wellungen umfassen |
WO2020072904A1 (en) | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance |
WO2020076846A1 (en) | 2018-10-09 | 2020-04-16 | Knowles Electronics, Llc | Digital transducer interface scrambling |
US11743647B2 (en) | 2018-12-11 | 2023-08-29 | Knowles Electronics, Llc. | Multi-rate integrated circuit connectable to a sensor |
WO2020154066A1 (en) | 2019-01-22 | 2020-07-30 | Knowles Electronics, Llc | Leakage current detection from bias voltage supply of mems microphone assembly |
US11197104B2 (en) | 2019-01-25 | 2021-12-07 | Knowles Electronics, Llc | MEMS transducer including free plate diaphragm with spring members |
WO2020160348A1 (en) | 2019-02-01 | 2020-08-06 | Knowles Electronics, Llc | Microphone assembly with back volume vent |
EP3694222A1 (en) | 2019-02-06 | 2020-08-12 | Knowles Electronics, LLC | Sensor arrangement and method |
US11778390B2 (en) | 2019-11-07 | 2023-10-03 | Knowles Electronics, Llc. | Microphone assembly having a direct current bias circuit |
DE102020133179A1 (de) | 2019-12-23 | 2021-06-24 | Knowles Electronics, Llc | Mikrofonanordnung, die eine gleichstromvorspannungsschaltung mit tiefer grabenisolation aufweist |
US11787690B1 (en) | 2020-04-03 | 2023-10-17 | Knowles Electronics, Llc. | MEMS assembly substrates including a bond layer |
US11240600B1 (en) | 2020-11-12 | 2022-02-01 | Knowles Electronics, Llc | Sensor assembly and electrical circuit therefor |
US11743666B2 (en) | 2020-12-30 | 2023-08-29 | Knowles Electronics, Llc. | Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor |
US11671775B2 (en) | 2020-12-30 | 2023-06-06 | Knowles Electronics, Llc | Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor |
US11916575B2 (en) | 2020-12-31 | 2024-02-27 | Knowleselectronics, Llc. | Digital microphone assembly with improved mismatch shaping |
US11909387B2 (en) | 2021-03-17 | 2024-02-20 | Knowles Electronics, Llc. | Microphone with slew rate controlled buffer |
US11897762B2 (en) | 2021-03-27 | 2024-02-13 | Knowles Electronics, Llc. | Digital microphone with over-voltage protection |
US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
CN216626054U (zh) * | 2021-12-22 | 2022-05-27 | 瑞声开泰科技(武汉)有限公司 | 一种mems麦克风 |
Family Cites Families (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE428081B (sv) | 1981-10-07 | 1983-05-30 | Ericsson Telefon Ab L M | Tilledningsram for en elektretmikrofon |
US4492825A (en) | 1982-07-28 | 1985-01-08 | At&T Bell Laboratories | Electroacoustic transducer |
US4558184A (en) | 1983-02-24 | 1985-12-10 | At&T Bell Laboratories | Integrated capacitive transducer |
US4524247A (en) | 1983-07-07 | 1985-06-18 | At&T Bell Laboratories | Integrated electroacoustic transducer with built-in bias |
US4533795A (en) | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US4853669A (en) | 1985-04-26 | 1989-08-01 | Wisconsin Alumni Research Foundation | Sealed cavity semiconductor pressure transducers and method of producing the same |
US4996082A (en) | 1985-04-26 | 1991-02-26 | Wisconsin Alumni Research Foundation | Sealed cavity semiconductor pressure transducers and method of producing the same |
US4744863A (en) | 1985-04-26 | 1988-05-17 | Wisconsin Alumni Research Foundation | Sealed cavity semiconductor pressure transducers and method of producing the same |
JPH0726887B2 (ja) | 1986-05-31 | 1995-03-29 | 株式会社堀場製作所 | コンデンサマイクロフオン型検出器用ダイアフラム |
US4783821A (en) * | 1987-11-25 | 1988-11-08 | The Regents Of The University Of California | IC processed piezoelectric microphone |
US4825335A (en) | 1988-03-14 | 1989-04-25 | Endevco Corporation | Differential capacitive transducer and method of making |
US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
US5188983A (en) | 1990-04-11 | 1993-02-23 | Wisconsin Alumni Research Foundation | Polysilicon resonating beam transducers and method of producing the same |
US5090254A (en) | 1990-04-11 | 1992-02-25 | Wisconsin Alumni Research Foundation | Polysilicon resonating beam transducers |
US5417111A (en) | 1990-08-17 | 1995-05-23 | Analog Devices, Inc. | Monolithic chip containing integrated circuitry and suspended microstructure |
US5326726A (en) | 1990-08-17 | 1994-07-05 | Analog Devices, Inc. | Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure |
US5314572A (en) | 1990-08-17 | 1994-05-24 | Analog Devices, Inc. | Method for fabricating microstructures |
EP0543901B1 (en) | 1990-08-17 | 1995-10-04 | Analog Devices, Inc. | Monolithic accelerometer |
US5113466A (en) | 1991-04-25 | 1992-05-12 | At&T Bell Laboratories | Molded optical packaging arrangement |
US5178015A (en) | 1991-07-22 | 1993-01-12 | Monolithic Sensors Inc. | Silicon-on-silicon differential input sensors |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5317107A (en) | 1992-09-24 | 1994-05-31 | Motorola, Inc. | Shielded stripline configuration semiconductor device and method for making the same |
US5303210A (en) | 1992-10-29 | 1994-04-12 | The Charles Stark Draper Laboratory, Inc. | Integrated resonant cavity acoustic transducer |
US5633552A (en) | 1993-06-04 | 1997-05-27 | The Regents Of The University Of California | Cantilever pressure transducer |
US5393647A (en) | 1993-07-16 | 1995-02-28 | Armand P. Neukermans | Method of making superhard tips for micro-probe microscopy and field emission |
JPH07111254A (ja) | 1993-10-12 | 1995-04-25 | Sumitomo Electric Ind Ltd | 半導体装置の製造方法 |
US5452268A (en) | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
US5596222A (en) | 1994-08-12 | 1997-01-21 | The Charles Stark Draper Laboratory, Inc. | Wafer of transducer chips |
US5956292A (en) | 1995-04-13 | 1999-09-21 | The Charles Stark Draper Laboratory, Inc. | Monolithic micromachined piezoelectric acoustic transducer and transducer array and method of making same |
US5692060A (en) | 1995-05-01 | 1997-11-25 | Knowles Electronics, Inc. | Unidirectional microphone |
NL1001733C2 (nl) | 1995-11-23 | 1997-05-27 | Stichting Tech Wetenschapp | Stelsel van een substraat en een opnemer. |
IL116536A0 (en) | 1995-12-24 | 1996-03-31 | Harunian Dan | Direct integration of sensing mechanisms with single crystal based micro-electric-mechanics systems |
WO1997039464A1 (en) | 1996-04-18 | 1997-10-23 | California Institute Of Technology | Thin film electret microphone |
US5740261A (en) | 1996-11-21 | 1998-04-14 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
DE19648424C1 (de) | 1996-11-22 | 1998-06-25 | Siemens Ag | Mikromechanischer Sensor |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US5923995A (en) | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
US6121552A (en) | 1997-06-13 | 2000-09-19 | The Regents Of The University Of Caliofornia | Microfabricated high aspect ratio device with an electrical isolation trench |
US5939633A (en) | 1997-06-18 | 1999-08-17 | Analog Devices, Inc. | Apparatus and method for multi-axis capacitive sensing |
US6122961A (en) | 1997-09-02 | 2000-09-26 | Analog Devices, Inc. | Micromachined gyros |
US5960093A (en) | 1998-03-30 | 1999-09-28 | Knowles Electronics, Inc. | Miniature transducer |
EP1093685A4 (en) | 1998-06-05 | 2004-09-01 | Knowles Electronics Llc | SOLID STATE RECEIVER |
US6291875B1 (en) | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
NL1009544C2 (nl) | 1998-07-02 | 2000-01-10 | Microtronic Nederland Bv | Stelsel bestaande uit een microfoon en een voorversterker. |
US6816301B1 (en) | 1999-06-29 | 2004-11-09 | Regents Of The University Of Minnesota | Micro-electromechanical devices and methods of manufacture |
US6703679B1 (en) | 1999-08-31 | 2004-03-09 | Analog Devices, Imi, Inc. | Low-resistivity microelectromechanical structures with co-fabricated integrated circuit |
US6522762B1 (en) | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US6732588B1 (en) | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
US6249075B1 (en) | 1999-11-18 | 2001-06-19 | Lucent Technologies Inc. | Surface micro-machined acoustic transducers |
DK1258167T3 (da) | 2000-02-24 | 2010-02-01 | Knowles Electronics Llc | Akustisk transducer med forbedret akustisk dæmper |
US7153717B2 (en) | 2000-05-30 | 2006-12-26 | Ic Mechanics Inc. | Encapsulation of MEMS devices using pillar-supported caps |
US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6987859B2 (en) | 2001-07-20 | 2006-01-17 | Knowles Electronics, Llc. | Raised microstructure of silicon based device |
AU2002213857A1 (en) | 2000-08-24 | 2002-03-04 | Fachhochschule Furtwangen | Electrostatic electroacoustical transducer |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US7166910B2 (en) | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US6741709B2 (en) | 2000-12-20 | 2004-05-25 | Shure Incorporated | Condenser microphone assembly |
WO2002052894A1 (en) | 2000-12-22 | 2002-07-04 | Brüel & Kjær Sound & Vibration Measurement A/S | A micromachined capacitive transducer |
US6847090B2 (en) | 2001-01-24 | 2005-01-25 | Knowles Electronics, Llc | Silicon capacitive microphone |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US6688169B2 (en) | 2001-06-15 | 2004-02-10 | Textron Systems Corporation | Systems and methods for sensing an acoustic signal using microelectromechanical systems technology |
US7023066B2 (en) * | 2001-11-20 | 2006-04-04 | Knowles Electronics, Llc. | Silicon microphone |
US7146016B2 (en) | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
US6677176B2 (en) | 2002-01-18 | 2004-01-13 | The Hong Kong University Of Science And Technology | Method of manufacturing an integrated electronic microphone having a floating gate electrode |
US6781231B2 (en) | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
US6667189B1 (en) | 2002-09-13 | 2003-12-23 | Institute Of Microelectronics | High performance silicon condenser microphone with perforated single crystal silicon backplate |
US6943448B2 (en) * | 2003-01-23 | 2005-09-13 | Akustica, Inc. | Multi-metal layer MEMS structure and process for making the same |
US7501703B2 (en) | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
US6713829B1 (en) | 2003-03-12 | 2004-03-30 | Analog Devices, Inc. | Single unit position sensor |
US7071017B2 (en) * | 2003-08-01 | 2006-07-04 | Yamaha Corporation | Micro structure with interlock configuration |
JP3103711U (ja) | 2003-10-24 | 2004-08-19 | 台湾楼氏電子工業股▼ふん▲有限公司 | 高効率コンデンサマイクロホン |
US6936524B2 (en) * | 2003-11-05 | 2005-08-30 | Akustica, Inc. | Ultrathin form factor MEMS microphones and microspeakers |
US7034393B2 (en) | 2003-12-15 | 2006-04-25 | Analog Devices, Inc. | Semiconductor assembly with conductive rim and method of producing the same |
US7138694B2 (en) | 2004-03-02 | 2006-11-21 | Analog Devices, Inc. | Single crystal silicon sensor with additional layer and method of producing the same |
US20050255677A1 (en) | 2004-05-17 | 2005-11-17 | Weigold Jason W | Integrated circuit with impurity barrier |
US7521363B2 (en) | 2004-08-09 | 2009-04-21 | Analog Devices, Inc. | MEMS device with non-standard profile |
US7346178B2 (en) * | 2004-10-29 | 2008-03-18 | Silicon Matrix Pte. Ltd. | Backplateless silicon microphone |
US7795695B2 (en) * | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
-
2006
- 2006-09-27 US US11/535,804 patent/US7795695B2/en active Active
- 2006-12-19 CN CN2006800507895A patent/CN101356853B/zh active Active
- 2006-12-19 WO PCT/US2006/048420 patent/WO2007081504A1/en active Application Filing
-
2010
- 2010-07-28 US US12/845,348 patent/US8169042B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103248994A (zh) * | 2012-02-06 | 2013-08-14 | 苏州敏芯微电子技术有限公司 | 集成电路与电容式微硅麦克风单片集成的制作方法及芯片 |
Also Published As
Publication number | Publication date |
---|---|
US20100289097A1 (en) | 2010-11-18 |
WO2007081504A1 (en) | 2007-07-19 |
US7795695B2 (en) | 2010-09-14 |
US8169042B2 (en) | 2012-05-01 |
CN101356853B (zh) | 2012-08-29 |
US20070087466A1 (en) | 2007-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101356853B (zh) | 集成麦克风 | |
US9938133B2 (en) | System and method for a comb-drive MEMS device | |
US7961897B2 (en) | Microphone with irregular diaphragm | |
US9681234B2 (en) | MEMS microphone structure and method of manufacturing the same | |
CN208337874U (zh) | 电声mems换能器、麦克风和电子设备 | |
JP6793208B2 (ja) | Memsマイクロホンおよびその準備方法 | |
WO2016192373A1 (zh) | Mems麦克风、压力传感器集成结构及其制造方法 | |
JP5869183B2 (ja) | 空気圧力センサを有する半導体パッケージ | |
US7816165B2 (en) | Method of forming a device by removing a conductive layer of a wafer | |
KR20080038038A (ko) | 전자 장치 및 마이크로폰 장치 | |
JP2008517523A (ja) | シリコンマイクロホン | |
CN105323686A (zh) | 微机电麦克风及其制造方法 | |
CN115924838A (zh) | 一种mems器件及其制备方法、电子装置 | |
US7863069B2 (en) | Method of forming an integrated MEMS resonator | |
US10604405B2 (en) | Forming a microelectromechanical systems (MEMS) device using silicon-on-nothing and epitaxy | |
TW201334576A (zh) | 麥克風元件及其製造方法 | |
CN109721021B (zh) | 一种mems器件及制备方法、电子装置 | |
CN107973266B (zh) | 一种mems器件及制备方法、电子装置 | |
KR20040046544A (ko) | 음향 감지 소자의 제조방법 | |
CN108217577B (zh) | 一种mems器件及制备方法、电子装置 | |
US20230328426A1 (en) | Co-located microelectromechanical system microphone and sensor with minimal acoustic coupling | |
TWI828149B (zh) | 微機電系統振動感測器及其製造方法 | |
US8687827B2 (en) | Micro-electro-mechanical system microphone chip with expanded back chamber | |
KR101615106B1 (ko) | Mems 마이크로폰 및 이의 제조방법 | |
US20130101143A1 (en) | Micro-electro-mechanical system microphone chip with an expanded back chamber |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: AMERICA ANALOG DEVICE INC. Free format text: FORMER NAME: ANALOG DEVICES INC. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Massachusetts, USA Patentee after: ANALOG DEVICES, Inc. Address before: Massachusetts, USA Patentee before: Analog Devices Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: INVENSENSE INC. Free format text: FORMER OWNER: AMERICA ANALOG DEVICE INC. Effective date: 20140128 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140128 Address after: American California Patentee after: Invensense Inc. Address before: Massachusetts, USA Patentee before: ANALOG DEVICES, Inc. |
|
TR01 | Transfer of patent right |