CN101351501B - Epoxy resin composition - Google Patents
Epoxy resin composition Download PDFInfo
- Publication number
- CN101351501B CN101351501B CN2006800494804A CN200680049480A CN101351501B CN 101351501 B CN101351501 B CN 101351501B CN 2006800494804 A CN2006800494804 A CN 2006800494804A CN 200680049480 A CN200680049480 A CN 200680049480A CN 101351501 B CN101351501 B CN 101351501B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- weight
- parts
- composition
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Abstract
The present invention relates to an epoxy resin composition, in particular, to an epoxy resin composition suitable for use as an encapsulation agent for electrical parts such as drive- ICs mounted on a circuit board. The epoxy composition is a liquid phase at room temperature and includes 100 parts by weight of an epoxy resin having 2 or more glycidyl groups in the molecure, 10-50 parts by weight of a reactive diluent having one or more glycidyl groups in the molecure, 50-200 parts by weight of an anhydrous curing agent which is a liquid phase at room temperature with respect to 100 parts by weight of the epoxy resin and the reactive diluent, and 1-20 parts by weight of a latent curing accelerator with respect to 100 parts by weight of the epoxy resin, the reactive diluent, and the anhydrous curing agent, and whose viscosity at 25 DEG C is 250-500cps, gelation time at 150 DEG C is below 120 seconds.
Description
Technical field
The invention relates to a kind of composition epoxy resin, especially, is the composition epoxy resin that is suitable for as the sealing material of the electronic component that comprises the drive integrated circult (driver-ICs) that is installed on the circuit card about a kind of.
Background technology
At present, in order to tackle as the miniaturization of electronicss such as mobile telephone, notebook computer and wall-hanging TV, lightening trend, comprise that the flat-panel screens as liquid-crystal display (LCD), plasma display, electroluminescence device (EL) has been used as main display device, and the drive integrated circult that drives these electronic units (drives-IC) also needs miniaturization.Bare chip (barechips) is called as encapsulation (packaging) as the series of steps that driving-IC is installed on the circuit card.About the method for encapsulation, what use in the past is that (tape carrier package, TCP) process, this process are included in and form circuit on the polyimide film, and bare chip is installed, and bare chip is overturn downwards, and inject resin in the hole of circuit card in band year encapsulation.
Yet, the shortcoming of TCP method is, (flexibility) is low for the flexibility of packaging component, and on the weight, thickness, length and the size that reduce packaging component, be restricted, because with the thick polyimide film with after Copper Foil is connected with epoxy resin-based adhesive, just chip is installed on the circuit card.
In order to address this problem, developed and used crystal grain mantle structure dress (Chip On Flim recently, COF) bottom filling process (underfill process), this process comprises, by adhering to thin polyimide on the top of thin copper foil or at the surface sputtering copper layer of thin polyimide membrane, form and have super flexible insulating film, make the circuit card of flexibility by formation spongy lead road on insulating film, on the circuit card of flexibility, bare chip is installed, with the gap between resin infill panel and the bare chip.In this COF process, problem is, because the gap between plate and the bare chip is less than tens microns, and the resin of the existing TCP of being used for process contains a large amount of inorganic fillers and solvent, can not directly be applied to COF bottom filling process.In addition, because the gap between plate and the bare chip can be too narrow to below the 10 μ m, and the size of chip is increasing, therefore more and more needs to have better fillibility and even hardened encapsulating composition.
Summary of the invention
Therefore, the invention provides a kind of composition epoxy resin, said composition has better penetrance (penetrability) and filling capacity to the gap between plate and the bare chip, and can harden equably in all surfaces zone of chip.The present invention further provides a kind of composition epoxy resin, said composition has obtained outstanding productive rate by shortening heat set time, and has obtained outstanding operability (workability) by bubble and the volatiles that forms still less.The present invention further provides a kind of composition epoxy resin, said composition not only has good edge and forms ability (fillet forming ability) and sticking power, thereby make its junction circuit plate and bare chip securely, and under high temperature and high humidity, also have good temperature cycle ability (temperature cycling ability) and character, therefore can make Chip Packaging (chip package) with height reliability.
In order to reach purpose of the present invention, the invention provides a kind of composition epoxy resin, said composition at room temperature is liquid, and said composition contains: comprise 2 or more than the Resins, epoxy of 2 glycidyls (glycidyl group) in the molecule of 100 weight parts; Comprise 1 or in the molecule of 10-50 weight part more than the reactive thinner of 1 glycidyl; With respect to 100 parts by weight of epoxy resin and reactive thinner, content be the 50-200 weight part at room temperature be liquid anhydride curing agent; With with respect to 100 parts by weight of epoxy resin, reactive thinner and anhydride curing agent, content is the latent curing promotor of 1-20 weight part, and the viscosity of said composition under 25 ℃ is 250-500cps, and the gel time under 150 ℃ is 120 seconds or lower.
Embodiment
To do more detailed description to the present invention below.
The composition epoxy resin that the contriver passes through the underfill composite that is used for the COF process has carried out extensive studies, by the component of adjusting composition epoxy resin and gel time and the viscosity that content comes the control combination thing, has finished the present invention.According to the present invention, the major ingredient of composition epoxy resin comprises Resins, epoxy, reactive thinner, anhydride curing agent and latent curing promotor.
The Resins, epoxy that uses among the present invention at room temperature is liquid, comprise 2 or in the molecule more than 2 glycidyls (glycidyl group), can use various curable Resins, epoxy, for example, bisphenol A type epoxy resin and bisphenol f type epoxy resin can use separately or together.The concrete example of bisphenol A-type (diglycidylether) Resins, epoxy comprises Resins, epoxy YL-980 (Epikote YL-980, Japan Epoxy Resin Co.Ltd.), RE-310 (Nippon Kayaku Co.Ltd.), DER-332 (TheDow Chemical Company) etc.; The concrete example of Bisphenol F type (diglycidylether) Resins, epoxy comprises Resins, epoxy YL-983U (Epikote YL-983U, Japan Epoxy Resin Co.Ltd.), RE-304 (Nippon Kayaku Co.Ltd.)), RE-404 (Nippon Kayaku Co.Ltd.), RE-303S (Nippon Kayaku Co.Ltd.), etc.The effect of the reactive thinner that uses among the present invention is the viscosity that reduces composition, can use and comprise 1 or in the various molecules more than the compound of 1 glycidyl, for example, may be used singly or in combin alkyl monoglycidyl ether (alkylmonoglycidyl ether), butylphenyl glycidyl ether, alkyl phenolic group monoglycidyl ether (alkylphenol monoglycidyl ether), polyethyleneglycol diglycidylether (polyglycol diglycidylether), alkyl diglycidylether etc.Herein, the carbon number of alkyl is preferably 1-10, more preferably 1-4.The concrete example that contains the simple function group reactive thinner of 1 glycidyl in molecule comprises YED-111E (Japan Epoxy Resin Co.Ltd), YED-122 (Japan Epoxy Resin Co.Ltd), ED-501 (Adeka Corporation), ED-502 (Adeka Corporation), ED-509S (Adeka Corporation), ED-529 (Adeka Corporation), ED-518 (AdekaCorporation), or the like; The concrete example that contains the bifunctional reactive thinner of 2 glycidyls in molecule comprises YED-216 (Japan Epoxy Resin Co.Ltd), ED-503 (AdekaCorporation), ED-506 (Adeka Corporation), ED-523T (Adeka Corporation), ED-515 (Adeka Corporation), or the like; The concrete example of polyfunctional group reactive thinner comprises YED-205 (Japan Epoxy Resin Co.Ltd), ED-505R (Adeka Corporation), or the like.With respect to 100 parts by weight of epoxy resin, the consumption of reactive thinner is preferably the 10-50 weight part, more preferably the 20-40 weight part.If the reactive thinner that adds is less than 10 weight parts, the viscosity of composition can not sufficiently be reduced, if more than 50 weight parts, second-order transition temperature of composition (Tg) and mechanical property will be lowered.
The reaction of anhydride curing agent and Resins, epoxy is also solidified, so the viscosity of composition epoxy resin becomes 250-500cps, under the preferable case, use the liquid anhydride solidifying agent, wherein, be preferably the anhydride curing agent that in solidification process, produces less carbonic acid gas, for example pass through C
10Triolefin or the anhydride curing agent that makes of the reaction of diene and maleic anhydride.The concrete example of anhydride curing agent comprises 3,4-dimethyl-6-(2-methyl isophthalic acid-propenyl)-4-tetrahydrobenzene-1,2-dicarboxylic anhydride or it and 1-sec.-propyl-4-methyl bicycle [2.2.2] suffering-5-alkene-2, the mixture of 3-dicarboxylic anhydride.YH-306 (Japan Epoxy Resin Co.Ltd) and YH-307 (Japan Epoxy Resin Co.Ltd) can commercially obtain.With respect to 100 parts by weight of epoxy resin and reactive thinner, the suitable addition of anhydride curing agent is the 50-200 weight part, is preferably the 100-150 weight part.If the amount of the anhydride curing agent that adds is lower than 50 weight parts or is higher than 200 weight parts, residual responseless Resins, epoxy or responseless anhydride curing agent can destroy second-order transition temperature (Tg) and mechanical property.
The latent curing promotor of using among the present invention can be stored in the mixture of Resins, epoxy and anhydride curing agent, and when the reaction of anhydride curing agent caused by methods such as heating, this latent curing promotor can make said composition solidify.For example, can use amine compound, imidazolium compounds, modified amine compound and the modified imidazole compound of microencapsulation.The example of the commercially produced product of latent curing promotor comprises that MY-24, MY-H, MY-D (above-mentioned can be from AJINOMOTO-FINE-TECHNO CO., INC. obtain), Fujicure FXR-1020, FXR-1030, FXR-1080, FER-1110 (above-mentioned can be, INC. obtains), novacure HX-3088, HX-3722, HX-3748, HX-3921, HX-3941HP (above-mentioned can the acquisition) from ASAHI KASEI CHEMICALSCORPORATION from FUJI KASEI CO..With respect to 100 parts by weight of epoxy resin, reactive thinner and anhydride curing agent, the add-on of latent curing promotor is the 1-20 weight part, is preferably the 2-10 weight part.If the curing catalyst that adds is less than 1 weight part, the effect that increases solidification rate is very low.On the other hand, if add-on greater than 20 weight parts, the viscosity of composition increases, mechanical property is destroyed.According to the present invention, the liquid epoxy resin composition that is used to encapsulate has the low viscosity of 250-500cps under 25 ℃, is below 120 seconds at the gel time under 150 ℃, is preferably 80-120 second.Inorganic filler, coupling agent, defoamer, pigment, dyestuff, the curing catalyst that can in well known to a person skilled in the art scope, add any routine, etc.Liquid epoxy resin composition of the present invention can obtain every kind of composition thorough mixing by general known method, for example, uses helical mixer, multimixer etc. that every kind of uniform ingredients ground is mixed under vacuum condition.Heat curing-type one packet mode of the present invention (one-pack type) composition epoxy resin is particularly suitable for as flip-chip (flip chip) underfill composite, for example, in the COF encapsulation process, bare chips such as flip-chip are installed in when preparing semiconductor devices on the flexible polyimide circuit card.
Below, will do more detailed description to the present invention in conjunction with specific embodiments.The present invention is not subjected to the restriction of following embodiment, and clearly, those skilled in the art can make more variation to the present invention under the situation that does not depart from principle of the present invention and spirit.
Embodiment 1
Bisphenol f type epoxy resin (Japan Epoxy Resin Co.Ltd. with 70 weight parts, ProductName: Epikote YL 983U), the simple function group reactive thinner of 30 weight parts (Japan Epoxy Resin Co.Ltd., ProductName: YED-111E), the liquid anhydride solidifying agent of 120 weight parts (Japan Epoxy ResinCo.Ltd., ProductName: YH-306), the curing catalyst of 5 weight parts (Ajinomoto Fine TechnoCo.Ltd, ProductName: MY-24) and silane coupling agent (the Japan Unikasa of 2.0 weight parts, ProductName: A-187) mix, make the liquid encapsulation resin combination.
Embodiment 2
Bisphenol f type epoxy resin (Nippon Kayaku Co.Ltd with 70 weight parts, ProductName: RE-303S), the polyfunctional group reactive thinner of 30 weight parts (ASAHI DENKA CO.LTD., ProductName: ED-505R), the liquid anhydride solidifying agent of 130 weight parts (Japan Epoxy Resin Co.Ltd., ProductName: YH-307), 2.0 the silane coupling agent of weight part (GE TOSHIBA SILICONES, ProductName: A-187) and curing catalyst (the FUJI KASEI CO.LTD of 5 weight parts, ProductName: FXR-1020) mix, make the liquid encapsulation resin combination.
Comparative Examples 1
Bisphenol f type epoxy resin (Japan Epoxy Resin Co.Ltd. with 100 weight parts, Epikote YL 983U), liquid anhydride solidifying agent (the Japan Epoxy Resin Co.Ltd. of 90 weight parts ProductName:, ProductName: YH-306), curing catalyst (the FUJI KASEI CO.LTD of 0.5 weight part, ProductName: FXR-1040) with 2.0 weight part silane coupling agents (GE TOSHIBA SILICONES, ProductName: A-187) mix, make the liquid encapsulation resin combination.
Comparative Examples 2
Bisphenol f type epoxy resin (Nippon Kayaku Co.Ltd with 70 weight parts, ProductName: RE-303S), the polyfunctional group reactive thinner of 30 weight parts (A DEKA CORPORATION, ProductName: ED-505R), the liquid anhydride solidifying agent of 210 weight parts (Japan Epoxy Resin Co.Ltd., ProductName: YH-307), 2.0 the silane coupling agent of weight part (GE TOSHIBA SILICONES, ProductName: A-187) and curing catalyst (the AJINOMOTO FINE TECHNOCO.LTD of 0.9 weight part, ProductName: MY-H) mix, make the liquid encapsulation resin combination.
With breathe out base cone (Haake cone) and plate-on-plate viscosity instrumentation normal root according to embodiment 1 and 2 and the encapsulation that makes of Comparative Examples 1 and 2 with the viscosity of a packet mode liquid epoxy resin composition under 25 ℃; Under 150 ℃, a composition is dropped on the micro-slide, stir composition with wooden stick, use the fusing point metering facility of FISHERSCIENTIFIC CO.LTD company to measure the time that composition can't continue to stir, thereby determine gel time; (result is as shown in table 1 for Thermogravimetric analysis, TGA) 15 minutes weight of evaluation minimizing to utilize thermogravimetric analysis.In addition, the sheet glass that two sizes centre that is 2 * 2cm is provided with escapement is placed on 130 ℃ the hot-plate, thereby keep 20 microns gap, then by resin combination being dropped on the sheet glass, and estimate the time that is filled to the other side sheet glass, thereby the fillibility of evaluating resin.If gel time is lower than 10 seconds, be evaluated as " good ", if be higher than 10 seconds, be evaluated as " defective ", the result is as shown in table 1.
Table 1
| Embodiment 1 | Embodiment 2 | Comparative Examples 1 | Comparative Examples 2 | |
| Viscosity | ?340cps | ?320cps | ?580cps | ?300cps |
| Gel time | 85 seconds | 90 seconds | 210 seconds | 200 seconds |
| Weight reduces | ?2.1％ | ?2.3％ | ?5.2％ | ?4.5％ |
| Fillibility | Good | Good | Defective | Defective |
As can be seen from Table 1, compare with the composition epoxy resin in the Comparative Examples, encapsulation has outstanding viscosity and gel time with liquid epoxy resin composition among the embodiment.And when gel time was longer, the weight that shows reduced higher, and this is that in this case, what highly expect is to produce bubble between chip and plate because of the volatilization of the liquid anhydride that takes place before solidifying by reaction at Resins, epoxy.In addition, as can be seen, be higher than in viscosity under the situation of 500cps, need chien shih Resins, epoxy when longer to fill gap between chip and the plate, perhaps can take place incomplete the filling in gap.
As previously mentioned, composition epoxy resin of the present invention has better penetrance and bottom filling ability for the gap between film and bare chip, and can harden equably in all surfaces zone of chip.In addition, this composition epoxy resin has obtained outstanding productive rate by shortening heat set time, has obtained outstanding operability by bubble and the volatiles that forms still less, helps preparing the Chip Packaging with height reliability.
Claims (3)
1. composition epoxy resin, this composition epoxy resin contains:
100 parts by weight of epoxy resin, this Resins, epoxy at room temperature is liquid, comprise 2 or more than 2 glycidyls, described Resins, epoxy is selected from the group of being made up of bisphenol A type epoxy resin, bisphenol f type epoxy resin and their mixture in the molecule of this Resins, epoxy;
The reactive thinner of 10-50 weight part comprises 1 or more than 1 glycidyl in the molecule of this reactive thinner;
Anhydride curing agent, this anhydride curing agent at room temperature is liquid, with respect to 100 parts by weight of epoxy resin and reactive thinner, the content of this anhydride curing agent is the 50-200 weight part, and described anhydride curing agent is that the reaction by triolefin or diene and maleic anhydride makes; With
Latent curing promotor, with respect to 100 parts by weight of epoxy resin, reactive thinner and anhydride curing agent, the content of this latent curing promotor is the 1-20 weight part, described latent curing promotor being is selected from the compound of the microencapsulation in the group of being made up of amine compound and imidazolium compounds
Wherein, the viscosity of this composition epoxy resin under 25 ℃ is 250-500cps, and the gel time under 150 ℃ is 120 seconds or shorter.
2. composition epoxy resin according to claim 1 wherein, comprises a glycidyl in the molecule of described reactive thinner.
3. composition epoxy resin according to claim 1, wherein, described latent curing promotor being is selected from the compound of the microencapsulation in the group of being made up of modified amine compound and modified imidazole compound.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050129793A KR101148051B1 (en) | 2005-12-26 | 2005-12-26 | Epoxy resin composition |
| KR10-2005-0129793 | 2005-12-26 | ||
| KR1020050129793 | 2005-12-26 | ||
| PCT/KR2006/005676 WO2007075014A1 (en) | 2005-12-26 | 2006-12-22 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101351501A CN101351501A (en) | 2009-01-21 |
| CN101351501B true CN101351501B (en) | 2011-05-18 |
Family
ID=38218210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800494804A Expired - Fee Related CN101351501B (en) | 2005-12-26 | 2006-12-22 | Epoxy resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2009521589A (en) |
| KR (1) | KR101148051B1 (en) |
| CN (1) | CN101351501B (en) |
| TW (1) | TWI453229B (en) |
| WO (1) | WO2007075014A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100966260B1 (en) * | 2007-11-28 | 2010-06-28 | (주)에버텍엔터프라이즈 | Electrically Conductive Adhesive Compositions for Die Adhesion Having Enhanced Moisture Resistance and Reliability |
| KR101368986B1 (en) | 2007-12-28 | 2014-02-28 | 에스케이케미칼주식회사 | Epoxy Resin Composition for LCD driving element |
| TWI581042B (en) * | 2012-01-18 | 2017-05-01 | 三井化學股份有限公司 | Seal agent containing the composition, end-face seal agent for display device, display device and method for fabricating the same |
| CN103554835B (en) * | 2013-10-16 | 2015-09-09 | 太原理工大学 | The preparation method of low-temperature fast-curing enhancing epoxide resin material in a kind of |
| US10025182B2 (en) * | 2014-03-20 | 2018-07-17 | Zeon Corporation | Radiation-sensitive resin composition and electronic device |
| JP6283624B2 (en) * | 2015-05-28 | 2018-02-21 | 日東電工株式会社 | Hollow electronic device sealing sheet, hollow electronic device package manufacturing method, and hollow electronic device package |
| EP3395851B1 (en) | 2015-12-25 | 2021-03-10 | Toray Industries, Inc. | Epoxy resin composition, fiber-reinforced composite material, molded article, and pressure vessel |
| CN109385047B (en) * | 2018-10-31 | 2020-11-10 | 成都市冠宇复合材料制品有限公司 | Resin composition and preparation method thereof |
| KR102258362B1 (en) | 2020-10-19 | 2021-06-01 | 권용문 | Multipurpose soy sauce composition and manufacturing method therof |
| WO2023286499A1 (en) * | 2021-07-12 | 2023-01-19 | 旭化成株式会社 | Epoxy resin composition, film, film production method, and cured product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1237186A (en) * | 1997-07-24 | 1999-12-01 | 洛克泰特公司 | Thermosetting resin compositions useful as underfill sealants |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| CN1282105A (en) * | 2000-08-25 | 2001-01-31 | 中国科学院化学研究所 | Liquid epoxy composite for packaging semiconductor and its application |
| CN1358798A (en) * | 2000-12-13 | 2002-07-17 | 国家淀粉及化学投资控股公司 | High-temp. under mould-filling material with low heat generating in use |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6456719A (en) * | 1987-08-26 | 1989-03-03 | Sanyu Resin Kk | Casting resin composition for electronic parts |
| KR910010026B1 (en) * | 1988-12-19 | 1991-12-10 | 주식회사 럭키 | Liquid epoxy resin composition and preparation thereof |
| JPH0627183B2 (en) * | 1990-03-30 | 1994-04-13 | ソマール株式会社 | Liquid epoxy resin composition |
| KR940014615A (en) * | 1992-12-29 | 1994-07-19 | 김충세 | Thermosetting epoxy resin composition for FOCUS PACK encapsulant |
| JP3141970B2 (en) * | 1993-06-30 | 2001-03-07 | ソマール株式会社 | Liquid epoxy resin composition |
| JPH09151303A (en) * | 1995-09-25 | 1997-06-10 | Nissan Chem Ind Ltd | Epoxy resin composition |
| BR9906962A (en) * | 1998-01-16 | 2000-10-10 | Loctite R & D Limited | Curable compositions based on epoxy for use in the field of microelectronics |
| JP2000178411A (en) * | 1998-12-17 | 2000-06-27 | Hitachi Chem Co Ltd | Flame retardant epoxy resin composition and electrical part using the composition |
| CN1178287C (en) * | 1999-06-17 | 2004-12-01 | 洛克泰特公司 | Reworkable thermosetting resin composition |
| TWI229929B (en) * | 2001-01-29 | 2005-03-21 | Ube Industries | Underfill material for COF mounting and electronic components |
| JP2003002951A (en) * | 2001-06-25 | 2003-01-08 | New Japan Chem Co Ltd | Cured thin-film of liquid epoxy resin composition |
| JP2003026766A (en) * | 2001-07-13 | 2003-01-29 | New Japan Chem Co Ltd | Epoxy-based reactive diluent and liquid epoxy resin composition containing the same |
| JP4068406B2 (en) * | 2001-07-27 | 2008-03-26 | 昭和電工株式会社 | Polymerizable compound, method for producing the compound, polymerizable composition containing the compound, cured product obtained by curing the composition, and method for producing the cured product |
| JP2003160644A (en) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | Semiconductor sealing epoxy resin composition and semiconductor device |
| TW200508314A (en) * | 2003-06-04 | 2005-03-01 | Sekisui Chemical Co Ltd | A liquid crystal display device and curing resin composition, sealing material for the same |
| TW561162B (en) | 2003-06-11 | 2003-11-11 | Chang Chun Plastics Co Ltd | Epoxy resin composition for encapsulation of optical semiconductor device |
-
2005
- 2005-12-26 KR KR1020050129793A patent/KR101148051B1/en active IP Right Grant
-
2006
- 2006-12-21 TW TW095148201A patent/TWI453229B/en active
- 2006-12-22 CN CN2006800494804A patent/CN101351501B/en not_active Expired - Fee Related
- 2006-12-22 WO PCT/KR2006/005676 patent/WO2007075014A1/en active Application Filing
- 2006-12-22 JP JP2008548406A patent/JP2009521589A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| CN1237186A (en) * | 1997-07-24 | 1999-12-01 | 洛克泰特公司 | Thermosetting resin compositions useful as underfill sealants |
| CN1282105A (en) * | 2000-08-25 | 2001-01-31 | 中国科学院化学研究所 | Liquid epoxy composite for packaging semiconductor and its application |
| CN1358798A (en) * | 2000-12-13 | 2002-07-17 | 国家淀粉及化学投资控股公司 | High-temp. under mould-filling material with low heat generating in use |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平6-1830A 1994.01.11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009521589A (en) | 2009-06-04 |
| CN101351501A (en) | 2009-01-21 |
| KR20070068071A (en) | 2007-06-29 |
| TW200734367A (en) | 2007-09-16 |
| TWI453229B (en) | 2014-09-21 |
| WO2007075014A1 (en) | 2007-07-05 |
| KR101148051B1 (en) | 2012-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101351501B (en) | Epoxy resin composition | |
| KR101900534B1 (en) | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device | |
| KR100556981B1 (en) | Electronic component | |
| JP2007189210A (en) | Method of assembling flip-chip-type semiconductor device and semiconductor device produced by method | |
| US6469074B1 (en) | Composition of cyanate ester, epoxy resin and acid anhydride | |
| KR101181591B1 (en) | Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device | |
| JP2003502484A (en) | Controllable degradable compositions of heteroatom carbocyclic or epoxy resins and curing agents | |
| KR101308307B1 (en) | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | |
| JP3773022B2 (en) | Flip chip type semiconductor device | |
| WO2010070947A1 (en) | Resin paste for die bonding, method for producing semiconductor device, and semiconductor device | |
| JP2001055487A (en) | Encapsulant for flip chip type semiconductor device and flip chip type semiconductor device | |
| WO2007083397A1 (en) | Liquid epoxy resin composition and adhesive using the same | |
| EP1647052B1 (en) | Underfill and mold compounds including siloxane-based aromatic diamines | |
| JP2001200139A (en) | Liquid epoxy resin composition for semiconductor sealing | |
| JP2000327884A (en) | Underfill material for flip-chip semiconductor device | |
| JP4940486B2 (en) | Epoxy resin composition, semiconductor device and manufacturing method thereof | |
| KR100797614B1 (en) | Liquid epoxy resin composition for underfilling semiconductor device and semiconductor device using the same | |
| JP2000297201A (en) | Sealing material for flip tip type semiconductor apparatus and flip tip type semiconductor apparatus | |
| JP4888091B2 (en) | Liquid resin composition and semiconductor device | |
| JP4718824B2 (en) | Epoxy-based curable composition and method for producing electronic component | |
| JP2008112972A (en) | Resin paste for die bonding, method for manufacturing semiconductor device, and semiconductor device | |
| JP5135287B2 (en) | Epoxy resin composition, method for manufacturing semiconductor device, and semiconductor device | |
| JP5740555B2 (en) | Liquid epoxy resin composition and semiconductor device using the same | |
| JP2006096784A (en) | Resin composition for electronic component | |
| JP2004244524A (en) | Adhesive for electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SDS K. K. Free format text: FORMER OWNER: SK CHEMICALS CO., LTD. Effective date: 20140408 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140408 Address after: Gyeonggi Do, South Korea Patentee after: KK SDS Address before: Gyeonggi Do, South Korea Patentee before: SK Chemistry Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20151222 |
|
| EXPY | Termination of patent right or utility model |