CN101350335B - Open window type ball grid array semiconductor packaging piece and web board structure used thereby - Google Patents
Open window type ball grid array semiconductor packaging piece and web board structure used thereby Download PDFInfo
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- CN101350335B CN101350335B CN2007101361581A CN200710136158A CN101350335B CN 101350335 B CN101350335 B CN 101350335B CN 2007101361581 A CN2007101361581 A CN 2007101361581A CN 200710136158 A CN200710136158 A CN 200710136158A CN 101350335 B CN101350335 B CN 101350335B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention discloses a window-opened type ball grid array semiconductor packing piece and a screen plate structure for the application of the packing piece and provides a base plate which is provided with a through-hole and a screen plate which is provided with an opening, wherein the opening of the screen plate is corresponding to the periphery of the through-hole of the base-plate, and one side of the opening is in a crippling shape, which is close to the through-hole, thereby a gluing layer can be coated on the surface of the base plate through the opening of the screen plate in a printing mode, and one side of the gluing layer is in a crippling shape, which is close to the through-hole of the base plate, thereby a semiconductor chip can be arranged on the gluing layer and fixed on the base plate after being heated and solidified, and then the wiring operation and the package die pressing operation can be carried out, thereby the window-opened type ball grid array semiconductor packing piece is made, since the side of the gluing layer is in the crippling shape, which is close to the through-hole of the base plate and is not in the traditional straight line shape, thereby the supporting surface of the semiconductor chip can be prolonged to disperse the stress, and the problem that the crack of the semiconductor chip occurs during the making process can be avoided.
Description
Technical field
(ball grid array, BGA) semiconductor package part particularly relate to a kind of windowing type ball grid array (window BGA, WBGA) the web plate structure of semiconductor package part and application thereof to the present invention relates to a kind of ball grid array.
Background technology
For meeting the compact development trend of electronic product now, effectively dwindle simultaneously the semiconductor package part size, industry develops and a kind of open window type ball grid array semiconductor packaging piece, it is characterized in that employed substrate offers at least one through hole that runs through, supply chip to connect and place on the substrate, and be electrically connected to substrate by the bonding wire that passes through hole in the mode that covers this through hole.The advantage of this kind packaging part is the chip that goes for central welding pad type (Central-Pad Type), as, DRAM (Dynamic Random Access Memory) (Dynamic Random Access Memory, DRAM), use the shortening wire length, increase electrical quality, and must reduce the integral thickness of packaging part.
See also Figure 1A to Fig. 1 C, the method for making that promptly shows a kind of existing open window type ball grid array semiconductor packaging piece, it mainly provides a substrate 10 that offers consistent reach through hole 100, and film (tape) 11 sticked in around this substrate through-hole 100 one by one, for semiconductor chip 12 glutinous ends that place on this film 11 and cover through hole 100, and the weld pad 120 that makes this semiconductor chip 12 is revealed in this through hole 100, then by a plurality of weld pad 120 and this substrates 10 that electrically connect this semiconductor chip 12 in the bonding wire 13 of this through hole 100 that pass, and carry out Encapsulation Moulds and press operation, to form the packing colloid 14 of this semiconductor chip 12 of bag and bonding wire 13, on this substrate 10, plant a plurality of soldered balls 15 at last, to form an open window type ball grid array semiconductor packaging piece.Relevant technology such as United States Patent (USP) the 6th, 218,731,6,144,102,6,486,536,6,657, No. 132 disclose.
But the aforementioned film that utilizes must stick in film the glutinous mode that places substrate of chip cost height not only one by one around this substrate through-hole in processing procedure, and fix this chip by heating film and chip form simultaneously, causes fabrication steps also comparatively complicated.
Defective in view of aforementioned processing procedure, United States Patent (USP) the 6th, 190,943 and 6,689, disclose a kind of screen painting mode of utilizing No. 638 one adhesive is coated this substrate surface, then semiconductor chip is placed on this adhesive, with by heating platform with this adhesive melting, and be fixed on this substrate through semiconductor chip is sticked together, use to exempt and use expensive film, save simultaneously and need paste the numerous and diverse processing procedure of film on substrate one by one.
Yet, see also Fig. 2 A, show that existing open window type ball grid array semiconductor packaging piece encapsulates the schematic diagram of molding operation, be to connect the substrate 20 that is equipped with semiconductor chip 22 and finishes routing with one to be positioned in the encapsulating mould 26, to insert potting resin 24; Please cooperate in addition and consult Fig. 2 B, be to show that confession semiconductor chip 22 is fixed in adhesive 21 floor map on the substrate 20, since the adhesive 21 of this B-stage for a kind of be the viscose of base material (Epoxy-base) with epoxy resin, and it is that straight line is distributed in around these substrate 20 through holes 200 with stencil printing, therefore behind baking-curing, will form hard support, but so will make the semiconductor chip part that is positioned at substrate 20 through holes 200 places form vacant state relatively, thereby in the encapsulation molding operation, to cause semiconductor chip 22 that great stress concentration phenomenon is arranged in the sideline of adhesive 21 because of the stowing pressure (packing pressure) (shown in the arrow of Fig. 2 A) of mould stream, even cause semiconductor chip generation rhegma problem C.
Therefore, how to develop and a kind ofly can effectively prevent the chip rhegma, must simplify fabrication steps simultaneously and reduce the open window type ball grid array semiconductor packaging piece and the method for making thereof of processing procedure cost, be the semiconductor required problem of urgently facing in research and development field of being correlated with in fact.
Summary of the invention
Because aforementioned and other problem, a purpose of the present invention is to provide the web plate structure of a kind of open window type ball grid array semiconductor packaging piece and application thereof, is avoided taking place when the encapsulation molding operation chip rhegma problem.
Another object of the present invention is to provide the web plate structure of a kind of open window type ball grid array semiconductor packaging piece and application thereof, simplified fabrication steps and reduce the processing procedure cost.
For reaching above-mentioned and other purpose, the invention provides a kind of open window type ball grid array semiconductor packaging piece, comprising: substrate, this substrate have first and second relative surface, and are formed with and run through this first and second surperficial through hole; The gluing layer is formed at around the through hole of this substrate first surface, and wherein this gluing layer is to be bended in the side near this through hole; Semiconductor chip, at interval this gluing layer and connect and place this substrate body first surface and cover this through hole one end; Bonding wire passes this through hole to electrically connect this semiconductor chip and substrate second surface; Packing colloid coats this semiconductor chip and bonding wire; And soldered ball, plant in this substrate second surface.
In addition, the present invention also by a kind of web plate structure that is used for open window type ball grid array semiconductor packaging piece, comprises a body; And an opening that runs through this body surface, wherein around the through hole of this opening corresponding to windowing type ball grid array substrate, and this opening is to be bended with respect to the side near this through hole.
Therefore, the web plate structure of open window type ball grid array semiconductor packaging piece of the present invention and application thereof, provide and have substrate that runs through through hole and the web plate that is provided with opening, wherein this web plate opening is corresponding to around this substrate through-hole, and this opening is to be bended with respect to the side near this through hole, thereby utilize mode of printing that the gluing layer is coated this substrate surface by the opening of web plate, and this gluing layer is in the bended that is shaped as near this substrate through-hole side, semiconductor chip is placed on this gluing layer, and via heating, semiconductor chip is fixed on this substrate, carry out routing and encapsulation molding operation again, to make open window type ball grid array semiconductor packaging piece, wherein because this gluing layer is to be bended but not the traditional line shape to shape that should the substrate through-hole side, the supporting surface of semiconductor chip will be elongated, with dispersive stress, and then strengthen the ability that semiconductor chip is resisted stress, avoid taking place in the processing procedure semiconductor chip rhegma problem.
Description of drawings
Figure 1A to Fig. 1 C is the method for making generalized section of existing open window type ball grid array semiconductor packaging piece;
The generalized section of semiconductor chip rhegma problem takes place in Fig. 2 A when encapsulating molding operation for existing open window type ball grid array semiconductor packaging piece;
Fig. 2 B is for being fixed in the adhesive floor map on the substrate for semiconductor chip;
Fig. 3 A is the generalized section of open window type ball grid array semiconductor packaging piece of the present invention;
Fig. 3 B is for being fixed in gluing layer plane schematic diagram on the substrate for semiconductor chip among the present invention; And
Fig. 4 is the web plate schematic diagram that windowing type ball grid array is partly led packaging part that is used for of the present invention.The component symbol explanation
10 substrates, 100 through holes
11 films, 12 semiconductor chips
120 weld pads, 13 bonding wires
14 packing colloids, 15 soldered balls
20 substrates, 200 through holes
21 adhesives, 22 semiconductor chips
24 potting resins, 26 encapsulating moulds
C rhegma 30 substrates
300 through holes, 301 first surfaces
303 welderings of 302 second surfaces refer to
304 solder ball pads, 31 gluing layers
32 semiconductor chips, 320 weld pads
321 active surfaces, 322 non-active surfaces
33 bonding wires, 34 packing colloids
35 soldered balls, 40 web plates
410 bodies, 420 openings
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.
See also Fig. 3 A, be the generalized section of open window type ball grid array semiconductor packaging piece of the present invention.
This open window type ball grid array semiconductor packaging piece includes: substrate 30, and this substrate 30 has opposite first 301 and second surface 302, and is formed with the through hole 300 that runs through this first and second surface 301,302; Gluing layer 31 is formed at around the through hole 300 of these substrate 30 first surfaces 301, and wherein this gluing layer 31 is to be bended corresponding to the side near this through hole 300; Semiconductor chip 32, at interval this gluing layer 31 and connect and place this substrate first surface 301 and cover this through hole 300 1 ends; Bonding wire 33 passes this through hole 300 to electrically connect this semiconductor chip 32 and substrate 30 second surfaces 302; Packing colloid 34 coats this semiconductor chip 32 and bonding wire 33; And soldered ball 35, plant in this substrate 30 second surfaces 302.
This substrate 30 for example is the spherical grid array type substrate, it has opposite first 301 and second surface 302, and be formed with and run through this first and second surperficial through hole 300, around substrate second surface 302 corresponding through holes 300, be formed with a plurality of welderings and refer to (finger) 303, and be formed with a plurality of solder ball pads (ball pad) 304 again in substrate second surface 302.
Please cooperate in addition and consult Fig. 3 B, show for semiconductor chip 32 and be fixed in gluing layer 31 floor map on the substrate 30, this gluing layer 31 is a B-stage glue for example, is that the web plate 40 by as shown in Figure 4 is printed on this substrate first surface 301.
This web plate 40 comprises a body 410, and the opening 420 that runs through these body 410 surfaces, wherein these opening 420 positions are around the through hole 300 corresponding to windowing type ball grid array substrate 30, and this opening 420 is to be bended with respect to the side near this substrate through-hole 300, so that this web plate 40 is placed on the substrate first surface 301, and through printing coating gluing layer 31 around the through hole 300 of this substrate first surface 301, wherein this gluing layer 31 is to be bended corresponding to the side near this through hole 300.
This semiconductor chip 32 for example is DRAM (Dynamic Random Access Memory) (Dynamic RandomAccess Memory, DRAM) chip, it has relative active surface 321 and non-active surface 322, be provided with a plurality of weld pads (pad) 320 in this active surface 321, and these weld pad 320 positions are for these substrate through-hole 300 places, for this semiconductor chip 32 with active surface 321 (face-down) mode this gluing layer 31 and connect and place substrate first surface 301 and cover this through hole 300 1 ends at interval down, and the weld pad 320 that makes this semiconductor chip 32 is revealed in this through hole 300, make gluing layer 31 melted by heating and cooling curing of this B-stage to toast processing procedure after, this semiconductor chip 32 is bonded on this substrate 30, wherein since 31 pairs on this gluing layer should substrate through-hole 300 sides shape be to be bended but not the traditional line shape, the supporting surface of semiconductor chip will be elongated, with dispersive stress, avoid taking place in the successive process semiconductor chip 32 rhegma problems.
Then the bonding wire 33 by passing this through hole 300 refers to 303 with the weld pad 320 that electrically connects this semiconductor chip active surface 321 and the weldering of this substrate second surface 302, on this substrate 30, form the packing colloid 34 that coats this semiconductor chip 32 and bonding wire 33 again, and plant ball (ball implanting) operation, on the solder ball pad 304 of this substrate second surface 302, to plant soldered ball 35, to make open window type ball grid array semiconductor packaging piece of the present invention.
Therefore, the web plate structure of open window type ball grid array semiconductor packaging piece of the present invention and application thereof, provide and have substrate that runs through through hole and the web plate that is provided with opening, wherein this web plate opening is corresponding to around this substrate through-hole, and this opening is to be bended with respect to the side near this through hole, thereby utilize mode of printing that the gluing layer is coated this substrate surface by the opening of web plate, and this gluing layer is in the bended that is shaped as near this substrate through-hole side, semiconductor chip is placed on this gluing layer, and via heating, semiconductor chip is fixed on this substrate, carry out routing and encapsulation molding operation again, to make open window type ball grid array semiconductor packaging piece, wherein because this gluing layer is to be bended but not the traditional line shape to shape that should the substrate through-hole side, the supporting surface of semiconductor chip will be elongated, with dispersive stress, and then strengthen the ability that semiconductor chip is resisted stress, avoid taking place in the processing procedure semiconductor chip rhegma problem.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (8)
1. open window type ball grid array semiconductor packaging piece comprises:
Substrate, this substrate has opposite first and second surface, and is formed with and runs through this first and second surperficial through hole;
The gluing layer is formed at around the through hole of this substrate first surface, and wherein this gluing layer is to be bended in the side near this through hole;
Semiconductor chip, at interval this gluing layer and connect and place this substrate first surface and cover this through hole one end;
Bonding wire passes this through hole to electrically connect this semiconductor chip and substrate second surface;
Packing colloid coats this semiconductor chip and bonding wire; And
Soldered ball plants in this substrate second surface.
2. open window type ball grid array semiconductor packaging piece according to claim 1 wherein, is formed with a plurality of welderings around the corresponding through hole of this substrate second surface and refers to, connect for bonding wire, and this substrate second surface is formed with a plurality of solder ball pads, for planting soldered ball.
3. open window type ball grid array semiconductor packaging piece according to claim 1, wherein, this gluing layer is to be printed on this substrate first surface by web plate.
4. open window type ball grid array semiconductor packaging piece according to claim 3, wherein, this web plate comprises a body, and the opening that runs through this body surface, wherein around the through hole of this aperture position corresponding to windowing type ball grid array substrate, and this opening is to be bended with respect to the side near this substrate through-hole.
5. open window type ball grid array semiconductor packaging piece according to claim 1, wherein, this gluing layer is a B-stage glue.
6. open window type ball grid array semiconductor packaging piece according to claim 1, wherein, this semiconductor chip has relative active surface and non-active surface, be provided with a plurality of weld pads in this active surface, and this bond pad locations is for this substrate through-hole place, with active surface mode this gluing layer and connect and place the substrate first surface and cover this through hole one end at interval down, and make the weld pad of this semiconductor chip be revealed in this through hole for this semiconductor chip.
7. open window type ball grid array semiconductor packaging piece according to claim 1, wherein, this semiconductor chip is the DRAM (Dynamic Random Access Memory) chip.
8. web plate structure that is applied to open window type ball grid array semiconductor packaging piece comprises:
One body; And
The opening that runs through this body surface, wherein this aperture position is around the through hole corresponding to windowing type ball grid array substrate, and this opening is to be bended with respect to the side near this substrate through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101361581A CN101350335B (en) | 2007-07-19 | 2007-07-19 | Open window type ball grid array semiconductor packaging piece and web board structure used thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101361581A CN101350335B (en) | 2007-07-19 | 2007-07-19 | Open window type ball grid array semiconductor packaging piece and web board structure used thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101350335A CN101350335A (en) | 2009-01-21 |
| CN101350335B true CN101350335B (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007101361581A Active CN101350335B (en) | 2007-07-19 | 2007-07-19 | Open window type ball grid array semiconductor packaging piece and web board structure used thereby |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369655A (en) * | 2017-07-13 | 2017-11-21 | 睿力集成电路有限公司 | A kind of window-type ball grid array package assembling |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5854512A (en) * | 1996-09-20 | 1998-12-29 | Vlsi Technology, Inc. | High density leaded ball-grid array package |
| US6190943B1 (en) * | 2000-06-08 | 2001-02-20 | United Test Center Inc. | Chip scale packaging method |
| US6689638B2 (en) * | 2001-08-27 | 2004-02-10 | Chipmos Technologies (Bermuda) Ltd. | Substrate-on-chip packaging process |
| CN1549319A (en) * | 2003-05-23 | 2004-11-24 | ��Ʒ���ܹ�ҵ�ɷ�����˾ | Open-window type ball grid array semiconductor packaging elements and its producing method and used chip bearing elements |
-
2007
- 2007-07-19 CN CN2007101361581A patent/CN101350335B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5854512A (en) * | 1996-09-20 | 1998-12-29 | Vlsi Technology, Inc. | High density leaded ball-grid array package |
| US6190943B1 (en) * | 2000-06-08 | 2001-02-20 | United Test Center Inc. | Chip scale packaging method |
| US6689638B2 (en) * | 2001-08-27 | 2004-02-10 | Chipmos Technologies (Bermuda) Ltd. | Substrate-on-chip packaging process |
| CN1549319A (en) * | 2003-05-23 | 2004-11-24 | ��Ʒ���ܹ�ҵ�ɷ�����˾ | Open-window type ball grid array semiconductor packaging elements and its producing method and used chip bearing elements |
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| Publication number | Publication date |
|---|---|
| CN101350335A (en) | 2009-01-21 |
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