CN101334155A - High radiation led lamp radiating module - Google Patents
High radiation led lamp radiating module Download PDFInfo
- Publication number
- CN101334155A CN101334155A CNA2008100712104A CN200810071210A CN101334155A CN 101334155 A CN101334155 A CN 101334155A CN A2008100712104 A CNA2008100712104 A CN A2008100712104A CN 200810071210 A CN200810071210 A CN 200810071210A CN 101334155 A CN101334155 A CN 101334155A
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- China
- Prior art keywords
- light emitting
- cooling base
- emitting diode
- heat elimination
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The utility model relates to a heat elimination module for a light emitting diode lamp of high heat dispersion, which comprises a light emitting diode, a heat elimination base of high heat conductivity used for arranging the light emitting diode and a circuit board, wherein, a wire connecting pin of the light emitting diode is conductively connected with a wiring circuit of the circuit board. The heat elimination module is characterized in that a holding groove used for embedding the circuit board is concavely arranged on the installing surface of the heat elimination base; a heat elimination end pin is assembled in the middle bottom part of the light emitting diode, and the light emitting diode is fixedly arranged on the installing surface of the heat elimination base through the hot conductive connecting of the heat elimination end pin of the light emitting diode; the heat elimination base is provided with a plurality of air convection passages which are arranged in parallel and vertical or parallel to the installing surface thereof to generate the wind tunnel effect. The light emitting diode is fixed on the heat elimination base provided with air convection passages through the hot conductive connecting of the heat elimination end pin at the bottom of the light emitting diode, thus the high temperature produced by the lamp is quickly transmitted to the inner and the outer surfaces of the heat elimination base through the air convection passages of the heat elimination base to be exchanged with the air outside in order to accelerate the elimination of the high temperature and to greatly improve the heat elimination effect, thereby being in favor of prolonging the service life and enhancing the energy saving efficiency of the light emitting diode.
Description
Technical field
The present invention relates to led lamp, specifically is a kind of high radiation led lamp radiating module.
Background technology
With reference to Fig. 1.Common led lamp is that light emitting diode 2 is fixedly mounted on the circuit board (PCB or aluminium wiring board) 3 of light fixture, again circuit board 3 is utilized insulating cement to be fixed on the cooling base 1 of high-cooling property, the P of light emitting diode 2, N wiring pin 22,23 electrically connect with circuit board 3 respectively, external circuit imposes direct current by P, the N level of 3 pairs of light emitting diodes 2 of circuit board, impels SMD-LED 2 to produce brightness.The heat that light emitting diode 2 produces is got rid of by cooling base 1 after circuit board 3 transmits.But, because printed circuit board (PCB) 3 is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, a large amount of heat energy that light fixture produces can't in time be dredged and be got rid of, directly cause light emitting diode 2 junction temperatures to raise, light fixture hot polymerization effect and thermal resistance are excessive, cause light emitting diode short and light decay phenomenon in 2 service lifes easily, and therefore improve energy consumption.
Summary of the invention
The present invention be for solve existing led lamp because of dispel the heat bad cause shorten service life, light decay and the high technical problem of power consumption, a kind of high radiation led lamp radiating module is provided.Purpose of the present invention is achieved through the following technical solutions:
High radiation led lamp radiating module comprises light emitting diode, is used for high-termal conductivity cooling base, the circuit board of device light emitting diode, and the two wiring pin and the circuit board wiring circuit of light emitting diode connect; It is characterized in that: be concaved with the storage tank that is used for the setting-in circuit board on the installed surface of described cooling base; The middle part, bottom of light emitting diode is equipped with a radiating end pin, and light emitting diode is installed on the cooling base installed surface by its radiating end pin, and its radiating end pin and cooling base installed surface thermal conductance connect fixing; Offer a plurality of layouts and perpendicular or parallel that are parallel to each other on the described cooling base in the air convection channel of its installed surface with the generation wind tunnel effect.
In cooling base week edge, each convection channel is respectively along running through cooling base perpendicular to cooling base installed surface direction uniformly at intervals for described air convection channel.
The cross-sectional profile of described cooling base is rounded, hexagon, square, rhombus or snowflake shape.
Described air convection channel is uniformly at intervals between the upper and lower end face of cooling base, each convection channel runs through cooling base along being parallel to cooling base installed surface direction respectively, and all air convection channel are positioned on the same plane that is parallel to the cooling base installed surface.
The both sides correspondence of described cooling base is concaved with the storage tank that is used for the setting-in circuit board, and correspondence is embedded with circuit board in two storage tanks; Cooling base central part between two storage tanks forms raised line; Described LED heat radiating end pin is adhesively fixed by welding or heat-conducting glue.
The present invention has the following advantages:
Above-mentioned high radiation led lamp radiating module, its light emitting diode connects by bottom radiating end pin thermal conductance and is fixed on the cooling base installed surface that the high-thermal conductive metal material makes, the heat energy that light emitting diode is produced is directly dispersed by the heat radiation cooling base of high heat conduction, a large amount of heat energy that light fixture produces are in time dredged by cooling base rapidly and are got rid of, the heat susceptor conductive performance is good, heat dissipation channel is unimpeded, thermal resistance is little, ensure the luminescent properties of light emitting diode well, prolong the service life of light emitting diode, cut down the consumption of energy greatly.On cooling base, offer a plurality of layouts and perpendicular or parallel that are parallel to each other in the air convection channel of its installed surface with the generation wind tunnel effect, the wind tunnel effect that air convection channel produces is quickened cross-ventilation and is improved radiating effect, and increased the area of dissipation that directly contacts greatly with extraneous air, the high heat that light fixture produces is passed to the inside and outside heat-delivery surface of cooling base rapidly via the air convection channel of cooling base, quicken the eliminating of high heat, help prolonging light emitting diode service life and play good energy-saving effect.In addition: the groove of cooling base both sides can hold the circuit board space of electrical circuit, helps the design and installation of light fixture control circuit.Cooling base also can optionally be done the design of different appearance and modelings, specification with the light fixture field of employment, to satisfy practical needs and to improve the visual art of light fixture.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described in further detail.
Fig. 1 is the structure cutaway view of existing led lamp.
Fig. 2 is the perspective view of first embodiment of the invention.
Fig. 3 is the cutaway view along A-A direction among the figure.
Fig. 4 is the structural representation of the cooling base among Fig. 3.
Fig. 5 is the vertical view of Fig. 2.
Fig. 6 is the vertical view one of the another kind of appearance and modeling of first embodiment of the invention.
Fig. 7 is the vertical view two of the another kind of appearance and modeling of first embodiment of the invention.
Fig. 8 is the perspective view of second embodiment of the invention.
Fig. 9 is the cutaway view along B-B direction among Fig. 8.
The specific embodiment
Embodiment 1: with reference to Fig. 2, Fig. 3, Fig. 5.High radiation led lamp radiating module comprises cooling base 1, at least one light emitting diode 2 (only illustrating among the figure), circuit board 3a, 3b.Cooling base 1 employing high-thermal conductive metal material such as aluminium, alloy etc. are one-body molded, and its end face middle part has the installed surface 11 that is used for device light emitting diode 2.
See Fig. 2 to Fig. 5.The cross-sectional profile of above-mentioned cooling base 1 is rounded, its week along on offer respectively along a plurality of air convection channel 4 that run through cooling base perpendicular to installed surface 11 directions of cooling base, air convection channel 12 is square perforation, between the adjacent air convection channel 4 by spaced walls 12 uniformly at intervals in week of cooling base 1 along last.Air convection channel 4 be located in cooling base installed surface 11 around, the both sides correspondence of cooling base installed surface 11 offers groove 1a, the 1b that is used to be installed in circuit board, cooling base central part between groove 1a, the 1b forms raised line 1c; Circuit board 3a, 3b are flush-mounted in respectively among groove 1a, the 1b.Light emitting diode 2 is striden and is located at circuit board 3a, 3b top, the bottom of light emitting diode 2 has the thermoelectric radiating end pin 2c that separates, radiating end pin 2c and raised line 1c end face directly welding are fixed or are bonded together by the heat conduction glue-line, and light emitting diode 2 is installed on cooling base 1 installed surface.The both sides of light emitting diode 2 have P, N wiring pin 2a, 2b, and P, N wiring pin 2a, 2b are electrically conducted with corresponding printed circuit board (PCB) 3a, 3b respectively and form the loop.
All above-mentioned air convection channel 12 can produce wind tunnel effect, quicken cross-ventilation and improve radiating effect, and increased the area of dissipation that cooling base 1 directly contacts with extraneous air greatly, the high heat that lamp luminescence diode 2 produces is via the inside and outside heat-delivery surface that is passed to cooling base along last air convection channel 4 rapidly in 1 week of cooling base, quicken the eliminating of high heat, help prolonging light emitting diode service life and play good energy-saving effect.Not influencing under the situation that circuit arrangement and light emitting diode install and use, also can on the medium position of cooling base, lay air convection channel.
As seen, the cross-sectional profile of cooling base 1 also can be designed to hexagon or square from Fig. 6, Fig. 7; But be not limited to shown in the figure, also can be designed to geometries such as rhombus, snowflake shape.
Embodiment 2: present embodiment as different from Example 1:
With reference to Fig. 8, Fig. 9.Air convection channel 4 on the cooling base 1 is uniformly at intervals between the installed surface 11 and lower surface of cooling base 1, each convection channel 4 runs through cooling base 1 along being parallel to cooling base installed surface 11 directions respectively, and all air convection channel 4 are positioned on the same plane that is parallel to cooling base installed surface 11.Air convection channel 4 is square perforation, and the same spaced walls of passing through is uniformly at intervals between the installed surface 11 and lower surface of cooling base 1 between the adjacent air convection channel 4.All the other structures are identical with embodiment 1, do not repeat them here.
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process with this, i.e. the equivalence of doing according to the present patent application claim and description changes and modification, all should still belong in the scope that patent of the present invention contains.
Claims (5)
1. high radiation led lamp radiating module comprises light emitting diode, is used for high-termal conductivity cooling base, the circuit board of device light emitting diode, and the two wiring pin and the circuit board wiring circuit of light emitting diode connect; It is characterized in that: be concaved with the storage tank that is used for the setting-in circuit board on the installed surface of described cooling base; The middle part, bottom of light emitting diode is equipped with a radiating end pin, and light emitting diode is installed on the cooling base installed surface by its radiating end pin, and its radiating end pin and cooling base installed surface thermal conductance connect fixing; Offer a plurality of layouts and perpendicular or parallel that are parallel to each other on the described cooling base in the air convection channel of its installed surface with the generation wind tunnel effect.
2. radiating module according to claim 1 is characterized in that: in cooling base week edge, each convection channel is respectively along running through cooling base perpendicular to cooling base installed surface direction uniformly at intervals for described air convection channel.
3. radiating module according to claim 2 is characterized in that: the cross-sectional profile of described cooling base is rounded, hexagon, square, rhombus or snowflake shape.
4. radiating module according to claim 1, it is characterized in that: described air convection channel is uniformly at intervals between the upper and lower end face of cooling base, each convection channel runs through cooling base along being parallel to cooling base installed surface direction respectively, and all air convection channel are positioned on the same plane that is parallel to the cooling base installed surface.
5. according to arbitrary described radiating module in the claim 1 to 4, it is characterized in that: the both sides correspondence of described cooling base is concaved with the storage tank that is used for the setting-in circuit board, and correspondence is embedded with circuit board in two storage tanks; Cooling base central part between two storage tanks forms raised line; Described LED heat radiating end pin is adhesively fixed by welding or heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100712104A CN101334155A (en) | 2008-06-10 | 2008-06-10 | High radiation led lamp radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100712104A CN101334155A (en) | 2008-06-10 | 2008-06-10 | High radiation led lamp radiating module |
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| Publication Number | Publication Date |
|---|---|
| CN101334155A true CN101334155A (en) | 2008-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100712104A Pending CN101334155A (en) | 2008-06-10 | 2008-06-10 | High radiation led lamp radiating module |
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| CN (1) | CN101334155A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010066091A1 (en) * | 2008-12-10 | 2010-06-17 | 上海三思电子工程有限公司 | Heat dissipating lamp holder and led pixel lamp |
| CN101858504A (en) * | 2009-04-13 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Illumination device |
| EP2250436A2 (en) * | 2008-03-02 | 2010-11-17 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
| CN102003685A (en) * | 2010-11-01 | 2011-04-06 | 深圳市华星光电技术有限公司 | Radiating structure for light-emitting source |
| CN102313175A (en) * | 2011-07-20 | 2012-01-11 | 沈阳立晶光电有限公司 | LED (light emitting diode) lighting module with thermoelectricity separation function |
| CN102812791A (en) * | 2010-02-05 | 2012-12-05 | 罗伯特·E·柯达戴克三世 | Thermal management system for electrical components and method of producing same |
| US8427036B2 (en) | 2009-02-10 | 2013-04-23 | Lumenetix, Inc. | Thermal storage system using encapsulated phase change materials in LED lamps |
| WO2013144052A1 (en) * | 2012-03-29 | 2013-10-03 | Osram Gmbh | Semiconductor lamp with heat sink |
| CN103629644A (en) * | 2012-08-27 | 2014-03-12 | 欧司朗股份有限公司 | Heat transfer block used for LED device, LED device and LED lamp |
| US8783894B2 (en) | 2010-02-12 | 2014-07-22 | Lumenetix, Inc. | LED lamp assembly with thermal management system |
| US9102857B2 (en) | 2008-03-02 | 2015-08-11 | Lumenetix, Inc. | Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled |
| WO2018227648A1 (en) * | 2017-06-13 | 2018-12-20 | 湖南粤港模科实业有限公司 | Light source structure with integrally packaged radiator and chip |
| CN114928990A (en) * | 2022-05-27 | 2022-08-19 | 滨海治润电子有限公司 | Heat radiation assembly for light emitting diode |
-
2008
- 2008-06-10 CN CNA2008100712104A patent/CN101334155A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9102857B2 (en) | 2008-03-02 | 2015-08-11 | Lumenetix, Inc. | Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled |
| EP2250436A2 (en) * | 2008-03-02 | 2010-11-17 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
| US8632227B2 (en) | 2008-03-02 | 2014-01-21 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
| EP2250436A4 (en) * | 2008-03-02 | 2012-01-04 | Lumenetix Inc | Heat removal system and method for light emitting diode lighting apparatus |
| WO2010066091A1 (en) * | 2008-12-10 | 2010-06-17 | 上海三思电子工程有限公司 | Heat dissipating lamp holder and led pixel lamp |
| US8427036B2 (en) | 2009-02-10 | 2013-04-23 | Lumenetix, Inc. | Thermal storage system using encapsulated phase change materials in LED lamps |
| CN101858504A (en) * | 2009-04-13 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Illumination device |
| CN102812791B (en) * | 2010-02-05 | 2015-09-30 | 布莱克唐克有限公司 | For heat management system and the production method thereof of electric component |
| CN102812791A (en) * | 2010-02-05 | 2012-12-05 | 罗伯特·E·柯达戴克三世 | Thermal management system for electrical components and method of producing same |
| US8783894B2 (en) | 2010-02-12 | 2014-07-22 | Lumenetix, Inc. | LED lamp assembly with thermal management system |
| CN102003685A (en) * | 2010-11-01 | 2011-04-06 | 深圳市华星光电技术有限公司 | Radiating structure for light-emitting source |
| CN102313175A (en) * | 2011-07-20 | 2012-01-11 | 沈阳立晶光电有限公司 | LED (light emitting diode) lighting module with thermoelectricity separation function |
| WO2013144052A1 (en) * | 2012-03-29 | 2013-10-03 | Osram Gmbh | Semiconductor lamp with heat sink |
| CN103629644A (en) * | 2012-08-27 | 2014-03-12 | 欧司朗股份有限公司 | Heat transfer block used for LED device, LED device and LED lamp |
| WO2018227648A1 (en) * | 2017-06-13 | 2018-12-20 | 湖南粤港模科实业有限公司 | Light source structure with integrally packaged radiator and chip |
| CN114928990A (en) * | 2022-05-27 | 2022-08-19 | 滨海治润电子有限公司 | Heat radiation assembly for light emitting diode |
| CN114928990B (en) * | 2022-05-27 | 2024-01-23 | 滨海治润电子有限公司 | Heat radiation assembly for light-emitting diode |
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Open date: 20081231 |