CN101315391B - Stretching type folding probe - Google Patents
Stretching type folding probe Download PDFInfo
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- CN101315391B CN101315391B CN2007101030894A CN200710103089A CN101315391B CN 101315391 B CN101315391 B CN 101315391B CN 2007101030894 A CN2007101030894 A CN 2007101030894A CN 200710103089 A CN200710103089 A CN 200710103089A CN 101315391 B CN101315391 B CN 101315391B
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Abstract
The invention relates to a tensile foldable probe, which comprises a fixing part, a foldable part, and a probe point part. The foldable part is provided with a plurality of horizontal sections and a plurality of vertical sections which extend from one side of the fixing part to be in continuously reversed bent connection; the probe point part which is formed by vertically extending at the predetermined distance to the fixing part through the free ends of the horizontal sections at the end of the foldable part, and the probe point part and fixing part are positioned on different axial lines; when the probe point part is contacted with an object to be tested, the foldable part is driven to be stretched, stretching elastic force is provided to allow the probe point and the object to be tested to maintain the electrical contact; the stress can be dispersed by each horizontal section, so as to increase the elastic deformation amount; meanwhile, the tensile foldable probe has better structural stability, so as to meet the requirement of high density probe distribution of micro probe point distance.
Description
Technical field
The present invention relates to probe, more detailed be meant a kind of stretching type folding probe.
Background technology
In semi-conductor industry, when making an integrated circuit (IC) chip but do not carry out as yet encapsulation procedure before, must be earlier through the circuit function of a trace routine test chip; Generally be to utilize a probe to be located between tester table and the chip to be measured, probe is then by the probe by various types, as rectilinear, cantilevered, spring probe ... Deng as with the contacting of chip chamber to be measured, to transmit signal in tester table and chip to be measured.
But the probe with most in the market is mainly single cantilever beam structure, and its advantage is that structure is simple, and needle point can approach to less needle gage, and low manufacturing cost; But because of the restriction of Material Strength and needle gage, for enough elastic deformation amounts and pin weight can be provided, it is long often need to possess an enough pin, and long pin length can't be in response to layout semiconductor test demand more and more closely.
For avoiding above-mentioned disappearance, then there is the dealer to research and develop a kind of leafy probe, as No. the 6672875th, United States Patent (USP), as shown in Figure 1, it has the cantilever 2 and a needle point 3 of a fixed part 1, majority, and these cantilevers 2 are to be to be connected in this fixed part 1 one sides with the one end side by side, and 3 at this needle point is connected on the one cantilever 2 contiguous free-ended end faces of the superiors; Though this kind structure can be by being out of shape so that the higher integral, flexible of more single semi-girder to be provided by rigidity that reduces each cantilever 2 and then reduction maximum stress, but 2 on each cantilever easily produces mutual friction and causes loss, make its fiduciary level relatively poor, moreover the heavy quantity that then need increase cantilever 2 of pin as if desiring to provide enough makes its complexity higher; Otherwise, to avoid multilayer cantilever number and providing under the consideration of enough cantilever rigidity, its cantilever pin length can't effectively be reduced, and can not satisfy the cloth pin demand of high density, low needle point distance.In brief, No. 6672875 disclosed leafy probe of United States Patent (USP) can't be taken into account the needs that reduce the structure maximum stress and improve the cloth pin density simultaneously.
In view of this, this United States Patent (USP) case also discloses the shortcoming that the leafy compression probe that other type is arranged can overcome aforesaid leafy probe No. 6672875, as shown in Figure 2, therefore its rigidity of folding elastic construction of the leafy compression probe of class is equivalent to many groups cantilever design in parallel, its integral rigidity reduces compared to single cantilever design, can shorten this pin length at the same time so that enough needle body rigidity to be provided; Again this while, via suitable design, the structures of many foldings can be dispersed in each horizontal beam spare with stress, can take into account simultaneously and reduce maximum stress and improve the long needs of cloth pin density shortening pin.
Yet the leafy compression probe that this United States Patent (USP) case is disclosed for No. 6672875 still has following disappearance:
1. this type of compression elastic body design is subject to the restriction of compression pin the ratio of width to height, the conventional springs design reference is restricted to 5 when the elastomeric width of compression and aspect ratio are excessive, the compression elastic body is easy to generate the side direction collapse, causes the not good situation of structural stability.In view of this, when facing tiny needle apart from demand, the needle body width of this leafy compression probe also must with reduction, yet because of limited compression elastic body the ratio of width to height principle of design, its pin is high can't be too high, and the leafy structure of multilayer promptly can't be arranged, add between each blade 4 and must reserve enough elastic compression deformation spaces, the number of leafy structure into is more limited with making, and then causes and can't bring into play the purpose that reduces maximum stress, makes the design's usefulness limited.
2. this preceding case emphasizes that designed needle point 5 and its fixed part 6 are positioned on the same Z-axis simultaneously, it is designed that its application is primarily aimed at the test probe of vertical start, possess small size lateral shift yet but can't satisfy, scratch chip surface oxide to be measured to promote the demand of electrical contact with this needle point pin trace that draws by this for some needs needle points.
Therefore, case of the present invention will propose a stretching type folding probe, not only can take into account and reduce max architecture stress and improve the cloth pin density and shorten the long demand of pin, also solve the disappearance of the leafy compression probe that the United States Patent (USP) case disclosed for No. 6672875 simultaneously.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of stretching type folding probe, is can effectively reduce maximum stress so that bigger regime of elastic deformation to be provided.
Another object of the present invention is to be to provide a kind of stretching type folding probe, can effectively reduce the long length of pin, puts density to improve probe.
Another object of the present invention is to provide a kind of stretching type folding probe, is effectively to mark the pin trace to determinand, improves test mass.
Edge this, the invention provides a kind of stretching type folding probe, include a fixed part, a folding part and a needle tip; This folding part, have one and extend first horizontal segment of a preset distance with horizontal direction from this fixed part one side, first vertical section, that extends a preset distance from this first horizontal segment free end vertical direction from this first vertical section free end second horizontal segment toward fixed part direction horizontal-extending one preset distance, one from this second horizontal segment free end toward vertical in the other direction second vertical section that extends a preset distance of fixed part, and one from this second vertical section free end toward fixed part the 3rd horizontal segment of horizontal-extending one preset distance in the other direction; This needle tip is to be formed by the vertical preset distance that extends of the past fixed part direction of the free end of the 3rd horizontal segment.
For further understanding and approval being arranged, enumerate following preferred embodiment now and cooperate graphic being described as follows feature of the present invention and characteristics:
Description of drawings
Fig. 1 is the structural representation of existing a kind of probe;
Fig. 2 is the structural representation of existing another kind of probe;
Fig. 3 is the structural perspective of a preferred embodiment of the present invention;
Fig. 4 is the stress deformation synoptic diagram of preferred embodiment shown in Figure 3;
Fig. 5 to Fig. 8 is the processing procedure synoptic diagram of a preferred embodiment of the present invention;
Fig. 9 and Figure 10 are the processing procedure synoptic diagram of another preferred embodiment of the present invention;
Figure 11 to Figure 15 is the present invention's processing procedure synoptic diagram of a preferred embodiment again;
Figure 16 and Figure 17 are other enforcement aspects of the present invention.
[primary clustering symbol description]
" have now "
Fixed part 1 cantilever 2 needle points 3
" the present invention "
Stretching type folding probe 10
Fixed part 11 folding parts 12 needle tips 13
First horizontal segment, 121 first vertical sections 122
Second horizontal segment, 123 second vertical sections 124
The 3rd horizontal segment 125
Dielectric layer 21 tanks 211 link slots 212
Probe needle body 242 second sacrifice layers 25
Stretching type folding probe 40
Second sacrifice layer, 43 circuit substrates 49
Embodiment
Please cooperate and consult Fig. 3, be that a preferred embodiment of the present invention provides a kind of stretching type folding probe 10, and it includes a fixed part 11, a folding part 12 and a needle tip 13 that is made into integration; This folding part 12 has one and extends first horizontal segment 121 of a preset distance from these fixed part 11 1 side horizontal directions, one extends first vertical section 122 of a preset distance from this first horizontal segment free end toward vertical direction, one second horizontal segment 123 from past fixed part 11 direction horizontal-extendings one preset distance of these first vertical section, 122 free ends, one from vertical in the other direction second vertical section 124 that extends a preset distance of the past fixed part 11 of these second horizontal segment, 123 free ends, reach the 3rd horizontal segment 125 from past fixed part negative side horizontal-extending one preset distance of these second vertical section, 124 free ends, this needle tip 13 is to be formed by the vertical preset distance that extends of the past fixed part direction of the free end of the 3rd horizontal segment 125; Be extended with the beam 15 that spreads out on this needle tip 13, and be provided with a needle point 14 in this beam that spreads out; This needle tip 13 and this fixed part 11 are that to be positioned at disalignment online.
Because pin trace length that the needle point pressurized is drawn and the distance dependent between needle point 14 and this fixed part 11, as the lever enlarge-effect, the pin trace length that the long more then needle point 14 of its distance is drawn is long more, therefore can and then adjust suitable pin trace length via the appropriate size between Finite Element design of Simulation needle point 14 and this fixed part 11, so that the test effect is better.
When fixed part 11 is fixed on the pedestal (not shown), and when being contacted on the determinand 19 by this needle tip 13, then can provide preferable and suitable elastic deformation as shown in Figure 4 by this folding part 12, and this folding part 12 also can be dispersed to stress on each horizontal segment 121,123,125 effectively, if keeping identical cloth pin density limits down with the same strength of materials, compared to other non-collapsible needle body design, collapsible needle body can provide bigger elastic deformation amount; Perhaps, require to design compared to other non-collapsible needle body when using identical needle body material at identical pin weight-normality lattice, collapsible needle body can be reduced each horizontal section length of folding part 12, and more is applicable to putting of array type.
Be with the maximum difference of the folding needle body of other compression that has disclosed, the present invention is drawing elastomer structure, institute's structural stability that causes is not good in the time of can avoiding compression elastic body the ratio of width to height excessive, and the problem of side direction collapse more is applicable to the test of tiny needle spacing easily.
In addition, during practice stretching type folding probe 10 of the present invention, at least one insulation projection 18 can be set on this needle tip 13, and when preventing to be subjected to undesired external interference, adjacent stretching type folding probe 10 has and touches mutually and situation of short circuit takes place as Figure 16, shown in Figure 17; Prove that via the Finite Element simulation result because the stress that born of needle tip 13 is lower, the stress that the addition of the projection 18 that therefore insulate can not influence performance of needle body elastic deformation or damaging property such as concentrates at problem; This kind insulation projection 18 can be in processing procedure and the making of needle body integral body, compares the easier enforcement of coating insulation film mode, and can also not have more wearing quality because of membrane stress influences the needle body rigidity.
Certainly this needle point also is formed directly on this needle tip.
Seeing also Fig. 5 to Fig. 8, is a kind of manufacture method of stretching type folding probe of the present invention, and it includes the following step:
Step a: as shown in Figure 5, be laid on the surface of a pedestal 22 by the made dielectric layer 21 of macromolecule material one, and this dielectric layer 21 and form a tank 211 and some link slots 212 with micro-photographing process; This tank 211 can also be realized by other processing mode such as Laser Processing, hot forming, machining with this link slot 212.
Step b: as shown in Figure 6, in this tank 211, lay one first sacrifice layer 23, in this link slot 212, lay the probe needle body 241 of part; This first sacrifice layer 23 can conventional semiconductor processing procedure deposited sacrificial material, electroforming, electroless plating or filling are sacrificed material and be shaped; This probe needle body 241 can electroforming, electroless plating, the modes such as conductive material, sputter, evaporation of inserting are shaped.
Step c: as shown in Figure 7, define one second sacrifice layer 25 continuously in the precalculated position, reach and in each second sacrifice layer 25, lay remaining probe needle body 242 continuously; Processing modes such as this second sacrifice layer 25 can micro-photographing process, Laser Processing, hot forming, machining are realized; Modes such as this probe needle body 242 can electroforming, electroless plating, filling conductive material, sputter, evaporation are shaped; After making each second sacrifice layer 25 and laying the probe needle body 242 of part, it flushes but each second sacrifice layer 25 of planarization makes both with this probe needle body 242 if necessary, so that follow-up processing procedure control or the size Control of piling up.
Steps d: as shown in Figure 8, remove this second sacrifice layer 25 and this first sacrifice layer 23; Promptly get the combination of stretching type folding probe of the present invention and this pedestal 22 and this dielectric layer 21.
The inside or the surface of this above-mentioned pedestal 22 possess wiring or contact, and are connected with this stretching type folding probe, and this pedestal more can further be connected with another probe card assembly assembling.
The surface of this above-mentioned dielectric layer 21 can also the conventional semiconductor processing procedure or mode such as printing form a conductive layer, this stretching type folding probe of this conductive layer and this is connected, and simultaneously with a connecting line and this pedestal or the electric connection of another external module.
As shown in Figure 7, this stretching type folding probe part probe needle body 241 is coated by this dielectric layer 21, for using, can promote low needle gage the connectivity between stretching type folding probe and the pedestal, for the probe structure of start repeatedly, can avoid the contact fatigue break between needle body and this pedestal 22, to promote the fiduciary level of product.
See also Fig. 9 and Figure 10, it is the manufacture method of another kind of stretching type folding probe of the present invention, it as shown in Figure 9, directly link definition goes out to have the multilayer sacrifice layer 32 of probe pattern on a pedestal 31, and in every layer of sacrifice layer 32, lay the probe needle body 33 of part, remove this sacrifice layer 32 at last again, the structure that promptly gets stretching type folding probe of the present invention and pedestal as shown in figure 10.Processing modes such as this sacrifice layer 32 can micro-photographing process, Laser Processing, hot forming, machining are realized; This probe needle body 33 can electroforming, electroless plating, the modes such as conductive material, sputter, evaporation of inserting are shaped; After making this sacrifice layer 32 and laying the probe needle body 33 of part, it flushes but this sacrifice layer 32 of planarization makes both with this probe needle body 33 if necessary, so that follow-up processing procedure control or the needle body size Control of piling up.
As shown in figure 10, this stretching type folding probe does not make the part needle body be embedded in the dielectric layer as shown in figure 12, processing procedure is simple relatively, but the contact between probe and the pedestal need possess stronger adhesion or the contact area can not be too small, to avoid the contact fatigue break.
Seeing also Figure 11 to Figure 15, is the manufacture method of the drawing folding probe of another kind of the present invention, and its step includes:
Step a: as shown in figure 11, get on the base material 42 that a surface is equipped with first sacrifice layer 41, on this first sacrifice layer 41, define a needle body profile that possesses stretching type folding probe with one second sacrifice layer 43; Modes such as this first sacrifice layer 41 can conventional semiconductor processing procedure deposition manufacture process, coating, printing, plating, change plating are made one to multiple layer film structure and are reached; Processing modes such as this second sacrifice layer 43 can micro-photographing process, Laser Processing, hot forming, machining are realized.
Step b: as shown in figure 12, laying a needle body metal 44, mode such as this needle body metal 44 can conventional semiconductor processing procedure depositing electrically conductive material, electroforming, electroless plating, filling conductive material, sputter, evaporation forms in this needle body profile of this second sacrifice layer 43.
But above-mentioned this second sacrifice layer 43 and these needle body metal 44 repeatedly stackings are up to reaching target size, if necessary can be after making this second sacrifice layer 43 and laying this needle body metal 44, this second sacrifice layer 43 of planarization makes both with this needle body metal 44, and it flushes, so that pile up processing procedure control or needle body size Control.
Step c: as Figure 13 and shown in Figure 14, remove second sacrifice layer 43 and first sacrifice layer 41, promptly get stretching type folding probe 40 of the present invention.
As shown in figure 15, this stretching type folding probe 40 can be connected with a circuit substrate 49, and connected mode can be reached by existing encapsulation joint, as welding, chip bonding, the brilliant joint of low temperature worker, conducting resinl joint etc.; Can also stretching type folding probe 40 be engaged with these circuit substrate 49 assemblings mechanism's plug-in unit mode.
The needle body of all embodiment of the present invention can be made up of more than one conductive material, can may need to select good, the low conductive material of being stained with stickiness of wearing quality as the needle point material on demand; Needle structure must select for use height to subdue the conductive material or the conduction composite of intensity (yield strength).
In addition, for reducing this stretching type folding probe height, can reduce or cast out the pillar position of this stretching type folding probe, and on the pedestal position below should stretching type folding probe is being provided with a tank, this tank make to be shaped outer divided by dielectric material as first embodiment describes, and more can reserve in advance when making substrate or directly in substrate surface processing grooving; This stretching type folding probe can be directly possessing on the substrate of tank with the directly whole making of the disclosed probe manufacturing method of this case embodiment, perhaps this stretching type folding probe is assembled with the substrate that juncture and this possess tank.
Claims (42)
1. stretching type folding probe is characterized in that including:
One fixed part;
One folding part, have one and extend first horizontal segment of a preset distance with horizontal direction from this fixed part one side, one extends first vertical section of a preset distance from this first horizontal segment free end vertical direction, one from this first vertical section free end toward second horizontal segment of fixed part direction horizontal-extending one preset distance, one from this second horizontal segment free end toward vertical in the other direction second vertical section that extends a preset distance of fixed part, and one from this second vertical section free end the 3rd horizontal segment toward fixed part negative side horizontal-extending one preset distance;
One needle tip is to be formed by the vertical preset distance that extends of the past fixed part direction of the free end of the 3rd horizontal segment.
2. according to the described stretching type folding probe of claim 1, it is characterized in that: this horizontal segment and this vertical section can repeat to increase several sections on demand, and the free end of this horizontal segment of least significant end is connected with this needle tip again.
3. according to the described stretching type folding probe of claim 1, it is characterized in that: also including an insulation projection, is to be arranged on this needle tip.
4. according to the described stretching type folding probe of claim 1, it is characterized in that: this needle tip extends the beam that spreads out, and this beam that spreads out is provided with a needle point.
5. according to the described stretching type folding probe of claim 4, it is characterized in that: this needle point can be via different beam length be adjusted of spreading out of design, so that this needle point is produced suitable pin trace length with this fixed part distance between the two.
6. according to the described stretching type folding probe of claim 1, it is characterized in that: this needle tip is provided with a needle point.
7. according to the described stretching type folding probe of claim 6, it is characterized in that: this needle point and this fixed part distance between the two can be adjusted via design, so that this needle point is produced suitable pin trace length.
8. according to the described stretching type folding probe of claim 1, it is characterized in that: be directly whole batch making on a pedestal.
9. according to the described stretching type folding probe of claim 1, it is characterized in that: be to engage assembling with a pedestal.
10. according to the described stretching type folding probe of claim 1, it is characterized in that: this fixed part is to be connected with a pedestal, and this base-plates surface possesses the elastic deformation space of a tank as this stretching type folding probe.
11. according to the described stretching type folding probe of claim 10, it is characterized in that: this tank is with the conventional semiconductor processing procedure or directly shapes made on pedestal.
12. according to the described stretching type folding probe of claim 1, it is characterized in that: this fixed part is connected with a pedestal, and this pedestal possesses majority circuit, and partial circuit is connected with this fixed part at least.
13. according to the described stretching type folding probe of claim 1, it is characterized in that: this fixed part is connected with a pedestal, and this base-plates surface possesses a dielectric layer, and this dielectric layer partly coats this fixed part.
14. according to the described stretching type folding probe of claim 1, it is characterized in that: this fixed part is connected with a pedestal, and the surface of this pedestal possesses a slot, inserts assembling for this fixed part and uses.
15. the manufacture method of a stretching type folding probe is characterized in that: include following steps:
Step a: be equipped with a substrate;
Step b: on this substrate, lay one first sacrifice layer;
Step c: on this first sacrifice layer, define one second sacrifice layer with a stretching type folding probe profile;
Steps d: in this stretching type folding probe profile, lay a needle body metal level;
Implement above-mentioned steps c～d one repeatedly to for several times up to reaching target size;
Step e: remove this first and second sacrifice layer and promptly get this stretching type folding probe; This stretching type folding probe, include a fixed part, one folding part and a needle tip, this folding part has one and extends first horizontal segment of a preset distance from this fixed part one side horizontal direction, and one extends first vertical section of a preset distance from this first horizontal segment free end toward vertical direction, one second horizontal segment from past fixed part direction horizontal-extending one preset distance of this first vertical section free end, one from vertical in the other direction second vertical section that extends a preset distance of the past fixed part of this second horizontal segment free end, reach the 3rd horizontal segment from past fixed part negative side horizontal-extending one preset distance of this second vertical section free end; This needle tip is to be formed toward the vertical preset distance that extends of fixed part direction by the 3rd horizontal segment free end.
16. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: after steps d, add this second sacrifice layer of planarization and both are flushed with the step of needle body metal level.
17. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: this first sacrifice layer is the membrane structure of one deck at least.
18. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: this first sacrifice layer is to be made by manufacture of semiconductor depositing electrically conductive film.
19. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: this first sacrifice layer is to be made by coating, electroless plating, the mode of electroplating one of them.
20. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: this second sacrifice layer and this stretching type folding probe profile are to define with micro-photographing process.
21. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: this stretching type folding probe profile is to be shaped by one of them mode of Laser Processing, machining, mould heat pressure.
22. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: wherein this needle body metal level in the steps d is to make in one of them mode of manufacture of semiconductor, plating, electroless plating.
23. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: wherein this needle body metal level in the steps d is to finish with filling conductive material in this stretching type folding probe profile.
24. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: wherein this needle body metal level is made with more than one conductive material.
25. the manufacture method according to the described a kind of stretching type folding probe of claim 15 is characterized in that: wherein this stretching type folding probe further engages with a pedestal.
26. the manufacture method of a stretching type folding probe of directly making on pedestal is characterized in that: include following steps:
Step a: prepare a pedestal;
Step b: define a sacrifice layer in this base-plates surface, make this sacrifice layer possess a needle body profile of part stretching type folding probe;
Step c: in this needle body profile, lay a needle body metal level;
Repeat to apply above-mentioned steps b～c and constitute a stretching type folding probe with this needle body metal level of multilayer;
Steps d: remove all sacrifice layers to discharge this stretching type folding probe; This stretching type folding probe, include a fixed part, one folding part and a needle tip, this folding part has one and extends first horizontal segment of a preset distance from this fixed part one side horizontal direction, and one extends first vertical section of a preset distance from this first horizontal segment free end toward vertical direction, one second horizontal segment from past fixed part direction horizontal-extending one preset distance of this first vertical section free end, one from vertical in the other direction second vertical section that extends a preset distance of the past fixed part of this second horizontal segment free end, reach the 3rd horizontal segment from past fixed part negative side horizontal-extending one preset distance of this second vertical section free end; This needle tip is to be formed toward the vertical preset distance that extends of fixed part direction by the 3rd horizontal segment free end.
27. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: this pedestal possesses circuit.
28. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: this sacrifice layer is to make with micro-photographing process.
29. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: this needle body profile is to make in one of them mode of mould heat pressure shaping, Laser Processing, machining.
30. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: this needle body metal level is that one of them the mode that is shaped with semiconductor technology depositing electrically conductive material, electrotyping process, electroless plating is made.
31. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: respectively this needle body metal level is made with more than one conductive material.
32. the manufacture method according to the described stretching type folding probe of claim 26 is characterized in that: the method for making of this pedestal comprises:
Step a ': be equipped with a substrate, this substrate surface possesses circuit junction;
Step b ': lay a dielectric layer, this dielectric layer possesses a tank and a link slot;
Step c ': in this tank, arrange one first sacrifice layer;
Steps d ': in this link slot, arrange a needle body metal level;
Apply step b '～d ' repeatedly to reaching target size up to this dielectric layer for several times.
33. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: wherein step c ' and steps d ' order can put upside down.
34. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: in steps d ' back adds this dielectric layer of planarization, first sacrifice layer flushes the three with the step of needle body metal level.
35. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: this tank of this dielectric layer and this link slot are to make in the mode of one of them of micro-photographing process, mould heat pressure shaping, Laser Processing, machining.
36. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: the mode of one of them that this first sacrifice layer is with semiconductor technology sacrificial material, filling expendable material, electroplate to be shaped, electroless plating is shaped is made.
37. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: this needle body metal level is made with more than one conductive material.
38. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: this needle body metal level is made in one of them mode of semiconductor technology deposits conductive material, filling conductive material, electroforming, electroless plating.
39. the manufacture method according to the described stretching type folding probe of claim 32 is characterized in that: further one conductive layer is set in this dielectric layer surface.
40. the manufacture method according to the described stretching type folding probe of claim 39 is characterized in that: this conductive layer engages a connecting line and is connected with the circuit of this substrate surface.
41. the manufacture method according to the described stretching type folding probe of claim 39 is characterized in that: this conductive layer engages a connecting line and is connected with another external circuit.
42. the manufacture method according to the described stretching type folding probe of claim 39 is characterized in that: this conductive layer is connected with this needle body metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101030894A CN101315391B (en) | 2007-05-28 | 2007-05-28 | Stretching type folding probe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101030894A CN101315391B (en) | 2007-05-28 | 2007-05-28 | Stretching type folding probe |
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| CN101315391A CN101315391A (en) | 2008-12-03 |
| CN101315391B true CN101315391B (en) | 2011-11-23 |
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| CN2007101030894A Expired - Fee Related CN101315391B (en) | 2007-05-28 | 2007-05-28 | Stretching type folding probe |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101865937B (en) * | 2009-04-20 | 2012-06-13 | 旺矽科技股份有限公司 | Multilayer probe set and manufacturing method thereof |
| JP5748709B2 (en) | 2012-06-05 | 2015-07-15 | 三菱電機株式会社 | Probe card |
| KR101558256B1 (en) * | 2015-05-18 | 2015-10-12 | 주식회사 기가레인 | A probe pin and assembly for fixing the probe pin |
| CN110226092A (en) * | 2016-12-16 | 2019-09-10 | 艾科塞拉公司 | Spring biased probes with folded portion and probe assembly |
| JP2019045232A (en) * | 2017-08-31 | 2019-03-22 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| CN114441813A (en) * | 2018-01-11 | 2022-05-06 | 欧姆龙株式会社 | Probe, inspection tool, inspection unit, and inspection device |
| JP2021028603A (en) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | Electric contact and electrical connection device |
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| US6023171A (en) * | 1997-08-13 | 2000-02-08 | International Business Machines Corporation | Dual-contact probe tip for flying probe tester |
| JP2000065859A (en) * | 1998-08-18 | 2000-03-03 | Seiko Epson Corp | Semiconductor inspecting device |
| CN1345087A (en) * | 2000-09-16 | 2002-04-17 | 株式会社鼎新 | Contact component and its manufacture and probe contact assembly using the contact component |
| JP2004095511A (en) * | 2002-09-04 | 2004-03-25 | Micronics Japan Co Ltd | Contact pin |
| CN1558243A (en) * | 2004-01-17 | 2004-12-29 | 张丽花 | Manufacturing method for probe sleeve and needle tube |
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| CN101315391A (en) | 2008-12-03 |
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