CN101276781A - 用于ic封装的组合倒置 - Google Patents

用于ic封装的组合倒置 Download PDF

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CN101276781A
CN101276781A CNA2007101422602A CN200710142260A CN101276781A CN 101276781 A CN101276781 A CN 101276781A CN A2007101422602 A CNA2007101422602 A CN A2007101422602A CN 200710142260 A CN200710142260 A CN 200710142260A CN 101276781 A CN101276781 A CN 101276781A
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tube core
wafer
band
mounting strap
substrate
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CN101276781B (zh
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J·A·巴扬
N·屠
A·波达
A·普拉布
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National Semiconductor Corp
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Abstract

描述了一种处理包括多个管芯的IC晶片的方法。焊料凸点形成在所述晶片的有源表面的键合焊盘上。所述凸点晶片的背面被粘合到第一安装带。在晶片仍固定到所述第一带的同时切割所述晶片，以提供多个独立的管芯。切割的管芯的有源表面然后被粘合到第二带，同时所述第一带仍然粘合到管芯的背面。所述第一带然后被去除。以这种方式，所述管芯的背面保持暴露并面朝上，同时所述管芯的有源表面粘合到所述第二带。所述方法允许使用不是针对用作倒装芯片贴片机而设计的常规贴片机。

Description

用于IC封装的组合倒置
技术领域
本发明一般涉及集成电路(IC)的封装。更具体而言，描述了一种用于处理IC管芯的方法。
背景技术
存在很多用于将集成电路(IC)管芯贴装到印刷电路板(PCB)的常规方法。通常，管芯被封装成塑料或陶瓷封装。这种封装通常使用金属化引线框。所述引线框一般包括多个与管芯上的相关键合焊盘电连接的引线。所述引线框还一般包括相关的金属化接触，用于将所述封装电连接到PCB上的接触。备选地，管芯本身上的键合焊盘可以直接连接到PCB上的接触。
一种类型的管芯已知为倒装芯片管芯。倒装芯片管芯一般具有在管芯的有源表面的键合焊盘上形成的焊料凸点。在从晶片切割之后，在贴装到合适的衬底之前，所述管芯一般被倒置。合适的衬底包括引线框、球栅阵列(BGA)和PCB。
尽管现有的倒装芯片封装方法和系统工作良好，但仍继续努力研发更有效的方法和系统来封装焊料凸点管芯。
发明内容
在一个实施例中，描述了一种处理包括多个集成电路管芯的集成电路晶片的方法。每个集成电路管芯包括有源表面和背面。多个键合焊盘形成在所述有源表面上。在所述方法中，所述晶片的背面被安装并粘合到第一可释放安装带。焊料凸点形成在所述键合焊盘上以形成凸点晶片。在一个实施例中，在所述第一可释放带被粘合到晶片的背面之前，在所述键合焊盘上形成焊料凸点。
在晶片仍然固定在所述第一可释放安装带上的同时，所述晶片被切割，以提供多个独立的凸点管芯。应当注意所述切割不完全切透第一可释放安装带。这样，被切割管芯的背面保持粘合到所述第一可释放安装带。被切割管芯的凸点有源表面然后被粘合到第二带，同时所述第一可释放安装带仍然粘合在被切割管芯的背面。然后该第一可释放安装带可以被释放并从管芯的背面去除。以这种方式，管芯的背面可以保持暴露且面朝上，同时管芯的凸点有源表面粘合到所述第二带。
在某些实施例中，独立的管芯从所述第二带拾取、对准并贴装到合适的衬底。举例来说，管芯上的键合焊盘可以通过焊料凸点贴装并电连接到引线框面板的引线。在一个优选实施例中，并不是针对用作倒装芯片贴片机而设计的常规贴片机可用于拾取、对准和放置管芯到所需的衬底。
附图说明
为更好地理解本发明，将结合附图在下面进行详细描述，附图中：
图1示出了根据本发明一个实施例的用于切割和贴装倒装芯片管芯的工艺流程图；
图2A-2E示出了图1工艺中的各个阶段。
贯穿附图，相同的参考数字表示相应的部分。
具体实施方式
本发明一般涉及集成电路(IC)封装。更具体而言，描述了一种用于处理IC管芯的方法。
在下面的描述中，提出了很多特定细节以提供本发明的彻底理解。然而对于本领域技术人员来说，很明显，可以在不具备某些或全部这些特定细节的条件下实施本发明。在其他实例中，并没有具体地描述已知的工艺步骤以避免混淆本发明。
下面的描述集中于使用引线框的倒装芯片类型管芯的封装。然而，可以预期，本发明可以有利地在将各种焊料凸点管芯封装成各种封装配置中实施，在所述封装配置中，管芯上的焊料凸点直接与衬底上的金属化接触电连接。
将参考图1-2描述本发明的各个实施例。本发明的方案提供了一种使用常规贴片机封装焊料凸点管芯的方法。更具体而言，描述了一种用于切割和制备用于贴装到合适衬底的焊料凸点管芯的方法，该方法使用并不针对配置用作倒装芯片贴片机的贴片机。
一般而言，倒装芯片贴片机明显比常规(非倒装芯片)贴片机更昂贵。举例来说，倒装芯片贴片机目前可能花费约高达$500,000，而相比而言，常规贴片机大约为$150,000～$200,000。而且，常规贴片机比倒装芯片贴片机明显更快。举例来说，常规贴片机可以每小时贴装高达10,000～15,000个管芯。相反，倒装芯片贴片机每小时能够贴装小于4,000个管芯。不过，倒装芯片贴片机确实提供了诸如处理高管脚数器件的能力这类的优点。然而，这些高管脚数能力对于很多应用并不需要。更具体而言，很多应用，例如，采用微型表面安装器件(SMD)的那些应用需要很少的管脚数。由此希望调整封装工艺，使得高速常规贴片机可用于拾取和放置管芯到衬底上。
首先参考图1，然后进一步参考图2A-2E的视图，将描述根据本发明一个实施例的切割和处理集成电路管芯的工艺100。提供了包括大量管芯的半导体晶片202。在一个实施例中，每个管芯被配置，以用作微型SMD。微型SMD可以被直接贴装到PCB，或备选地，可以在贴装到PCB之前被封装。在各个其他实施例中，每个管芯可以被配置，用于引线上倒装芯片(FCOL)封装，或者除此之外，用于包括球栅阵列(BGA)封装、平面栅格阵列(LGA)封装的很多其他类型封装的其中之一。
在102，晶片202的背面208被安装并粘合到晶片安装带210，如图2A所示。在一个优选实施例中，晶片安装带210是可释放带。举例来说，可释放安装带210可以是紫外(UV)可释放带，当暴露于UV光时，它失去其粘合性。在一个实施例中，在安装和粘合晶片到晶片安装带210之前，晶片202是有凸点的。焊料凸点204可以直接在管芯的有源表面206上的I/O焊盘上形成，或使用常规再分布技术形成于由I/O焊盘重新分布的其他键合焊盘上。此外，凸点底部金属化堆栈(UBM)可以先于焊料凸点在管芯的键合焊盘上形成。一般地，焊料凸点204意在被直接安装和贴装到诸如引线框或印刷电路板(PCB)之类的衬底的接触焊盘。
在104，晶片202被切割，产生很多独立的焊料凸点管芯212，如图2B所示。尽管图2B中所示出的剖面示出了晶片202仅被分割成6个管芯212，但应当理解的是，晶片上形成的管芯的数目可以明显更大。举例来说，晶片202可以包括数千个焊料凸点管芯212。在一个实施例中，晶片202被诸如排锯(gang-cutting saw)之类的晶片切割机切割。应当注意，带210不被完全切透，或另外地，它在切割管芯212的过程中被切割。可以预见，部分带210可以被切割，然而，优选地，始终没有穿透带的切割发生，使得所述带在切割之后保持完整。还应当注意管芯212的背面214保持粘合到带210。
在106，被整体切割的晶片和带210然后整个被倒置，使得管芯212的有源表面216面朝下，如图2C所示。晶片可以使用任意合适的装置倒置。接着，在108，如图2D所示，管芯212的有源表面216然后被安装并粘合到第二带218。在一个实施例中，该第二带218也是UV可释放带或其他可释放带。在本领域中已知UV释放带一般比其他常规晶片安装带提供更好的粘合性。假设带218一般仅接触管芯212的有源表面216上总表面积的一小部分可能是有利的。更具体而言，在一个实施例中，带218仅接触焊料凸点204。
在一个备选实施例中，在倒置管芯之前，第二带218可以被粘合到管芯212的有源表面216。接着，第一带210、管芯212以及第二带218可以同时被倒置。该实施例可以在倒置工艺过程中为切割的管芯212提供更好的稳定性。更具体而言，所述带和被切割晶片的弯曲可以减小。反过来，这可以减少在倒置工艺过程中管芯212从第一带分离或甚至由于与其他管芯接触而损害的可能性。尤其是，如果所述带和被分割的晶片在倒置过程中允许弯曲太多时，由于管芯间的接触，管芯212可能有缺口、破裂或被损坏。
在110，如图2E所示，第一可释放安装带210然后被释放并去除。举例来说，如果第一可释放安装带210是UV可释放安装带，则通过将该带暴露于UV辐射可以释放该带。所述方法由此允许管芯214被切割并倒置，而不改变它们彼此的相对位置。更具体而言，刚刚描述的方法允许倒置被切割晶片的管芯212的阵列，而不失去管芯配准。
在112，独立的管芯212然后可以被释放并从第二带218去除。接着，管芯212可以被卷带或被存储。在一个备选实施例中，管芯212可以被发送，用于贴装到衬底。尤其应当注意，管芯212的朝向允许使用常规贴片机来拾取管芯和放置管芯到所需的衬底。更具体而言，因为管芯212的背面214面朝上而不是面朝下，这样并不需要倒装芯片贴片机。倒装芯片贴片机一般由倒置特征表征，其中在贴片之前，拾取倒装芯片管芯，然后倒置。上述方法中，管芯212已经作为整体被一起倒置。
在贴片过程中，每个管芯212优选地由常规贴片机拾取。一般地，然后使用助焊剂制备焊料凸点204或衬底上的接触，管芯212将贴装到衬底上的所述接触。在一个实施例中，管芯212可以浸泡于一个助焊剂容器中以向焊料凸点204应用助焊剂。在另一个实施例中，衬底上的接触使用助焊剂制备。接着，管芯被对准并放置到衬底上。
在一个实施例中，所述衬底可以是引线框。在其他实施例中，管芯可以贴装到其他衬底。举例来说，在板上倒装芯片(FCOB)应用中，管芯可以被直接倒装芯片地贴装到印刷电路板(PCB)。在微型SMD技术中，管芯可以被直接贴装到PCB以及引线框。此外，在各种实施例中，在贴片之前，附加的焊膏可以应用到衬底上的接触。一般地，管芯212和衬底然后被放置在熔炉中，用于焊料的回流。焊料回流一般结束贴片工艺。器件然后可以使用模制材料封装并接着切割。
给定某些允许，根据所述方法，使用常规贴片机，期望每小时可以贴装约高达8,000个倒装芯片管芯。
用于解释目的，前面的描述使用了特定的术语以提供本发明彻底的理解。然而，对于本领域技术人员而言，很明显，并不需要这些特定细节来实行本发明。这样，前述描述的本发明特定实施例用于说明和描述目的。它们并不是穷举地，或它们并不是将本发明限制于所公开的精确形式。对于本领域技术人员而言，很明显，考虑到上面的讲授，可以进行很多修改和变化。
选择和描述了实施例，以最好地理解本发明的原理和它的实际应用，从而使熟知本领域技术的人员能够最好地利用本发明以及针对预期特定用途而做出各种改进的实施例。意图在于，本发明的范围由下面的权利要求和它们的等效表述限定。

Claims (13)

1.一种处理凸点集成电路晶片的方法，该晶片具有其中形成的多个集成电路管芯，每个集成电路管芯包括有源表面和背面，该有源表面具有多个键合焊盘，该键合焊盘具有位于其上的焊料焊盘，该方法包括：
粘合凸点晶片的背面到第一可释放安装带；
在所述晶片被固定到第一可释放安装带时切割所述晶片，以提供多个独立的凸点管芯，其中所述切割不完全切透该第一可释放安装带，且其中被切割管芯的背面保持粘合到该第一可释放安装带；
粘合所述被切割管芯的凸点有源表面到第二带，同时第一可释放安装带仍然粘合到该管芯的背面；以及
释放该第一可释放安装带并从管芯的背面去除该可释放安装带，由此使管芯的背面保持暴露并面朝上，同时管芯的凸点有源表面粘合到所述第二带。
2.权利要求1中所述的方法，进一步包括从该第二带拾取独立的管芯，对准和贴装所述独立的管芯到合适的衬底。
3.权利要求2中所述的方法，其中使用不是针对用作倒装芯片贴片机而设计的贴片机来完成拾取、对准和贴装，且其中所述贴片机并不倒置所述管芯。
4.权利要求2或3中所述的方法，进一步包括在贴装所述管芯到所述衬底之前，向所述衬底上的接触应用助焊剂。
5.权利要求2-4中任一项所述的方法，进一步包括在贴装所述管芯到所述衬底之前，向所述管芯的有源表面上的焊料凸点应用助焊剂。
6.权利要求2-5中任一项所述的方法，进一步包括使用模制材料封装管芯和衬底部分。
7.权利要求2-6中任一项所述的方法，其中所述衬底是引线框。
8.权利要求2-6中任一项所述的方法，其中所述衬底是印刷电路板。
9.前面权利要求中任一项所述的方法，进一步包括在切割之后且在粘合切割的管芯到所述第二带之前，使切割的管芯作为整体倒置过来。
10.前面权利要求中任一项所述的方法，其中所述第一可释放安装带是UV可释放带，所述方法进一步包括在粘合切割的管芯的凸点有源表面到所述第二带之后，通过暴露于UV光释放所述第一可释放安装带。
11.前面权利要求中任一项所述的方法，其中所述第二带是UV可释放带，所述方法进一步包括在去除所述第一带之后，通过暴露于UV光而释放所述第二带。
12.前面权利要求中任一项所述的方法，其中配置每个管芯，以用作微型表面安装器件。
13.前面权利要求中任一项所述的方法，进一步包括从所述第二带中去除管芯并卷带包装所述管芯。
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