CN101211882B - Printed circuit board and element module packaging structure and encapsulation method - Google Patents
Printed circuit board and element module packaging structure and encapsulation method Download PDFInfo
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- CN101211882B CN101211882B CN 200610171606 CN200610171606A CN101211882B CN 101211882 B CN101211882 B CN 101211882B CN 200610171606 CN200610171606 CN 200610171606 CN 200610171606 A CN200610171606 A CN 200610171606A CN 101211882 B CN101211882 B CN 101211882B
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- circuit board
- printed circuit
- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses an encapsulation structure of a printed circuit board and an element module, which consists of a base board of the printed circuit board and the element module. A through hole corresponding with the element module is arranged in the base board of the printed circuit board; the element module comprises a first and a second encapsulation surface; a first and a second encapsulation endpoint is positioned on the side edge of the first encapsulation surface; the element module is arranged on the through hole of the printed circuit board correspondingly; the first and second encapsulation endpoints of the first encapsulation surface in the element module are electrically contacted and encapsulated with the first and second welding spots on the first bearing surface of the printing circuit plate. Through welding and encapsulating respectively to the first and second encapsulation endpoints led by the first bearing surface of the element module, the invention reduces the wiring difficulty of the printed circuit board, simplifies the welding and encapsulating technology of the printing circuit plate. Furthermore, the element module can adopt the design of placing devices on double side which is conducive to reducing the assembling size, saving assembling space.
Description
[affiliated technical field]
The present invention relates to a kind of encapsulating structure of printed circuit board (PCB), relate in particular to the encapsulating structure and the method for packing thereof of a kind of printed circuit board (PCB) and component module, simplify packaging technology, reduce encapsulation difficulty.
[background technology]
Development of electronic technology makes that the integrated level of the element on the circuit board is more and more higher, thereby makes the welding encapsulation technology of printed circuit board (PCB) also need the development of the high integration of adaptive element.
The mode that the traditional printed circuit board (PCB) and the welding of element are mainly taked comprises: first kind of mode is to take the direct and printed circuit board (PCB) welding with element; The second way is that the sets of elements with core becomes functional module, the pin that the element of this functional module is relevant from periphery draw and with the printed circuit board (PCB) welding, adopt organic bond such as resin to seal.
The direct welding of above-mentioned first kind of printed circuit board (PCB) and element is applicable to element when integrated level is not high and the welding of printed circuit board (PCB), when if the integrated level of element is high, then can the small wiring difficulty of printed circuit board (PCB) that causes increase because of the potted element of components and parts, also improved simultaneously the requirement to the manufacture craft of printed circuit board (PCB), cost improves; The direct encapsulation of above-mentioned second kind of printed circuit board (PCB) and functional module, core or critical sets of elements are become functional module, reduced welding difficulty to a certain extent with printed circuit board (PCB), but, when the pin that this functional module is drawn is too much, cause the functional module area to increase, cause the wiring difficulty of printed circuit board (PCB) to increase simultaneously, be unfavorable for the miniaturization and the high integration design of printed circuit board (PCB).
Thereby, a kind of encapsulating structure and method for packing of simplifying printed circuit board (PCB) and component module is provided, reduce the wiring difficulty of printed circuit board (PCB), reduce the manufacture craft requirement of printed circuit board (PCB), then become pressing for of current production design flow chemical industry journey development.
[summary of the invention]
The invention provides the encapsulating structure of a kind of printed circuit board (PCB) and component module, simplify the packaging technology of printed circuit board (PCB), reduce the wiring difficulty of printed circuit board (PCB).
For achieving the above object, the invention provides the encapsulating structure of a kind of printed circuit board (PCB) and component module, comprise: component module, described component module comprises first encapsulating face and second encapsulating face relative with first encapsulating face, the side of first encapsulating face is provided with the first encapsulation end points, on first encapsulating face at the distance first encapsulation end points certain position place the second encapsulation end points is set, the zone that the second encapsulation end points inboard surrounds is protruded and is formed the component module zone, described component module zone is positioned at different planes and protrudes in first encapsulating face with first encapsulating face, on the described first encapsulation end points, under run through first encapsulating face; And printed circuit board (PCB), comprise first loading end and second loading end relative with first loading end, described printed circuit board (PCB) is provided with the upper and lower through hole that hollows out, first loading end is provided with on first loading end at certain position place of first pad, distance first pad and second pad is set, the upper and lower printed circuit board (PCB) that runs through of described first pad; The component module zone of first encapsulating face of described component module is placed in the through hole of described printed circuit board (PCB), first encapsulating face of described component module is carried on first loading end of printed circuit board (PCB), the first encapsulation end points of described first encapsulating face electrically contacts welding with first pad of first loading end of printed circuit board (PCB), the second encapsulation end points of described first encapsulating face electrically contacts welding with second pad of first loading end of printed circuit board (PCB), and the lower surface in the component module zone of described component module and second loading end of printed circuit board (PCB) flush or be higher than second loading end of printed circuit board (PCB).
It is a kind of based on the above-mentioned printed circuit board (PCB) and the method for packing of component module that the present invention also further provides, and comprising:
First encapsulating face of described component module is carried on first loading end of printed circuit board (PCB), and the module region at the middle part of described component module is placed in the through hole of printed circuit board (PCB);
The first encapsulation end points of first encapsulating face of described component module, the second encapsulation end points are aimed at and electrically contacted and weld with first pad, second pad of first loading end of printed circuit board (PCB) respectively.
From the above, the encapsulating structure of printed circuit board (PCB) of the present invention and component module is by offering the through hole that hollows out on printed circuit board (PCB), the component module zone of the last branch of first encapsulating face of component module is contained in the through hole, first, second pad of first, second welding end points and first loading end welds encapsulation respectively, the horizontal electrical signal transmission thereby the electric connection between realization component module and the printed circuit board (PCB) is gone forward side by side.The present invention is contained in the component module zone of component module the through hole of printed circuit board (PCB), first, second welding end points of drawing by component module welds encapsulation, reduce the wiring difficulty of printed circuit board (PCB), simplify the welding encapsulation technology of printed circuit board (PCB), be convenient to the welding encapsulation, reduce manufacturing cost.
In addition, the component module of the encapsulating structure of printed circuit board (PCB) of the present invention and component module can adopt the design of two-sided mask placement device, reduces the overall package height, helps dwindling module size, saves assembling space, ease of assembly.
[description of drawings]
Fig. 1 is the front view of first encapsulating face of the component module in the encapsulating structure of printed circuit board (PCB) of the present invention and component module.
Fig. 2 is the front view of second encapsulating face of the component module in the encapsulating structure of printed circuit board (PCB) of the present invention and component module.
Fig. 3 is the partial enlarged drawing of the first welding end points of component module among Fig. 1.
Fig. 4 is the schematic diagram of the first welding end points of the sandwich construction of the component module in the encapsulating structure of printed circuit board (PCB) of the present invention and component module.
Fig. 5 is the front view of first loading end of the printed circuit board (PCB) in the encapsulating structure of printed circuit board (PCB) of the present invention and component module.
Fig. 6 is the front view of second loading end of the printed circuit board (PCB) in the encapsulating structure of printed circuit board (PCB) of the present invention and component module.
Fig. 7 is the partial enlarged drawing of second pad of the printed circuit board (PCB) among Fig. 5.
Fig. 8 is a printed circuit board (PCB) of the present invention and front view after the encapsulating structure of component module is connected/welds.
Fig. 9 is the partial enlarged drawing after first first pad welding of welding end points and printed circuit board (PCB) of the component module among Fig. 8 encapsulates.
Figure 10 is the partial enlarged drawing after second second pad welding of welding end points and printed circuit board (PCB) of the component module among Fig. 8 encapsulates.
Figure 11 is a printed circuit board (PCB) of the present invention and the schematic diagram of side-looking after the encapsulating structure of component module is connected/welds.
Figure 12 is the enlarged diagram that the inboard at mark XII place among Figure 11 goes out.
Figure 13 is the enlarged diagram of the outside at mark XII place among Figure 11.
[embodiment]
Reach technological means and the effect that predetermined purpose is taked for further setting forth the present invention, below in conjunction with drawings and Examples, embodiment, architectural feature and effect thereof to the encapsulating structure and the method for packing of printed circuit board (PCB) of the present invention and component module are described in detail as follows.
See also Figure 11, the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module comprises component module 1 and printed circuit board (PCB) 2.In specific embodiment, can realize that the core of certain function, critical element design are integrated component module, as, with the integrated component module that is designed to image of reception, the processing module of image, with integrated component module that is designed to optical treatment of the treatment element of light signal etc.Printed circuit board (PCB) 2 is common printed circuit board (PCB), in concrete enforcement, can be the printed circuit board (PCB) that is designed to two-layer or two-layer above sandwich construction.
See also Fig. 1, component module 1 comprises first encapsulating face 11, second encapsulating face 12 relative with first encapsulating face 11.First encapsulating face, 11 edges are set up in parallel some first encapsulation end points 14, and the distance first encapsulation end points 14 is provided with the second encapsulation end points 13 of some rectangles on first encapsulating face 11 at certain position place, interval to the extension of the center of component module 1.The outer edge of the first encapsulation end points 14 forms the outermost border of component module 1, that is, the zone that the outermost edges of the first encapsulation end points 14 surrounds is the peripheral boundary zone 16 of component module 1.The second encapsulation end points 13 surrounds the interior surrounding edge boundary region I of component module 1.The zone that the inboard of the second encapsulation end points 13 of first encapsulating face 11 surrounds also comprises the marked region 15 of rectangle, is provided with circuit and element in the marked region 15, and circuit in the marked region 15 and component package form component module zone 19.The included zone of dotted line is the component module zone 19 that protrudes from first encapsulating face 11 of component module 1 among Fig. 1.Component module zone 19 is positioned at different planes with first encapsulating face 11, that is, component module zone 19 is vertically protruding in first encapsulating face 11 apart from first encapsulating face, 11 certain altitudes on the height.The area size of marked region 15 is slightly less than the area that second pad 13 of first encapsulating face 11 is surrounded.Some silk-screen signs 151 that marked region 15 keeps at a certain distance away and indicates, silk marks 151 are used to make things convenient for first, second number of pins that encapsulates end points 13,14 of component module 1 to discern.
Consult Fig. 3, the area size of second encapsulating face 12 of component module 1 is consistent with the area size of first encapsulating face 11.The outer side edges that component module 1 is run through in the outside of the first encapsulation end points 14 of first encapsulating face 11 surrounds the first encapsulation end points 14 of second encapsulating face 12.Second encapsulating face 12 also comprises the marked region 17 of rectangle, is provided with circuit and element in the marked region 17.The area size of marked region 17 is slightly smaller than the borderline region 16 of second encapsulating face 12, and is bigger than the marked region 15 of first encapsulating face 11.Marked region 17 is positioned on the different planes with second encapsulating face 12, thus make marked region 17 on vertical height the distance second encapsulating face certain altitude and convex protrusion in second encapsulating face 12.Marked region 17 comprises some silk-screen signs 172 of the silk-screen sign 171 of the first encapsulation end points 14 and the mark that keeps at a certain distance away, and silk-screen sign 172 is used to make things convenient for first of component module 1 to encapsulate the number of pins identification of end points 14.
In conjunction with consulting Fig. 3 and Fig. 4, for amplifying and the sandwich construction schematic diagram part of the first encapsulation end points 14 among Fig. 1.Ring seal dress pad 141 and outer shroud encapsulation welding tray 142 in the first encapsulation end points 14 comprises, interior ring seal dress pad 141 is clipped the semicircular welded disc that half forms for the through hole of circle, and the interior ring seal dress pad 141 upper and lower component modules 1 that run through, outer shroud encapsulation welding tray 142 is the pad that the printed wire of half runway shape forms.The semi-circular through hole pad of interior ring seal dress pad 141 be zinc-plated // heavy tin or/pad of turmeric, and the semi-circular through hole pad of interior ring seal dress pad 141 adopts anti-oxidation PROCESS FOR TREATMENT.Again in conjunction with Fig. 1, Fig. 2 as can be known, on the interior ring seal dress pad 141 of the first encapsulation end points 14 of the component module 1 of the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module, the outer ledge that runs through component module 1 down, as shown in Figure 4, component module 1 can adopt multiple-plate structure, and by run through first the encapsulation end points 14 interior weld all around dish electrically connect, the first encapsulation end points 14 that the pin of drawing from component module 1 forms and component external are carried out being being connected of electrical signals by 18 realizations of the through hole on the printed circuit board (PCB) 2, that is, electrically connect by the welding end points of through hole 18 with the signal line of each layer.
In conjunction with consulting Fig. 5 and Fig. 6, printed circuit board (PCB) 2 comprises first loading end 21, second loading end 22 relative with first loading end 21.First loading end 21 comprises second pad 23 that the inboard certain position place of first pad 24 that the edge near first loading end 21 surrounds, distance first pad 24 forms.First pad 24 is the welding end points that the printed wire of rectangle forms.The inside of the middle section of printed circuit board (PCB) 2 hollows out and forms square through hole II, promptly, the area size of this through hole II is consistent with component module zone 19 sizes of component module 1, that is, the inboard of second pad 23 is the size in component module zone 19 along the zone that surrounds.In addition, the area of through hole II also can be greater than the area in component module zone 19.First loading end 21 also comprises the marked region 27 of rectangle, and area is slightly larger than the area that first pad 24 is surrounded.First loading end 21 of printed circuit board (PCB) 2 also comprises some the silk-screen sign 272 and the aid identification character 273 of the silk-screen sign 271 of first pad 24 and the mark that keeps at a certain distance away.Silk-screen sign 272 and aid identification character 273 are used to make things convenient for the number of pins identification of first pad 24 of printed circuit board (PCB) 2.The zone that the outermost edge of printed circuit board (PCB) 2 surrounds is a circuit board peripheral boundary 26.
The area size of second loading end 22 of printed circuit board (PCB) 2 is consistent with the area size of first loading end 21.Apart from printed circuit board (PCB) peripheral boundary 26 a distance marked region 28 is set on second loading end 22, every interval certain position adopts silk marks to form silk-screen sign 281 and aid identification character 282 on the marked region 28, with the number of pins identification of second pad 23 that makes things convenient for printed circuit board (PCB) 2.Aim at welding during convenient the welding.The inner side edge of second pad 23 is along the 25 through hole II that surround printed circuit board (PCB) 2.
Please, be the partial enlarged drawing of second pad 23 among Fig. 5 in conjunction with consulting Fig. 7.Ring welded disc 231 and outer shroud welded disc 232 in second pad 23 comprises.The structure of second pad 23 is identical with the outer shroud pad configuration of component module 1, interior ring welded disc 231 is clipped half for the through hole of circle and is formed semicircular welded disc, and the interior ring welded disc 231 upper and lower printed circuit board (PCB)s 2 that run through, outer shroud welded disc 232 are the pad of the half runway shape that forms of the printed wire of circuit board.
See also Fig. 8, component module 1 and printed circuit board (PCB) 2 are welded encapsulation, first encapsulating face 11 of component module 1 is placed on the perforation square hole II of printed circuit board (PCB) 2, and the marked region 15 of the encapsulating face 11 of winning is contained in the through hole II, make second loading end 22 of circuit and printed circuit board (PCB) 2 in the marked region 17 of second encapsulating face 12 be positioned at above the through hole II.The first encapsulation end points 14 of first encapsulating face 11 of component module 1, the second encapsulation end points 13 respectively with first pad 24, the 23 corresponding welding of second pad of first loading end 21 of printed circuit board (PCB) 2, promptly, the semicircular first encapsulation end points 14 is realized electrical communication with the corresponding one by one welding of first pad 24 of rectangle, and the second encapsulation end points 13 of rectangle is realized electrically connecting with the corresponding one by one welding of semicircular second pad.The first encapsulation end points 14 of second encapsulating face 12 of component module 1 does not contact with printed circuit board (PCB) 2, and first pad 24 of second loading end 22 of printed circuit board 2 does not participate in the welding contact of component module 1.Thereby the circuit in the marked region 15 of first encapsulating face 11 of component module 1 is positioned at the space of the through hole II formation of printed circuit board (PCB) 2, and the marked region 17 of second encapsulating face 12 and second encapsulating face 12 is positioned at the top of through hole II.Hence one can see that, after component module 1 encapsulates with printed circuit board (PCB) 2 welding, the height that forms the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module only is the height sum of the circuit in the marked region 17 of second encapsulating face 12 of the height of printed circuit board (PCB) 2 and component module 1, as Figure 11 and shown in Figure 12.
In sum, the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module welds encapsulation respectively with first pad 24, second pad 23 of first loading end 21 of printed circuit board (PCB) 2 respectively with the first encapsulation end points 14 of first encapsulating face 11 of component module 1, the second encapsulation end points 13, reduced the packaging density of component module, reduce the packaging technology difficulty, help reducing the area of component module, increased the shock resistance of component module simultaneously, when module damage, encapsulating structure of the present invention also is convenient to the dismounting and change of component module, reduces maintenance cost.
The encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module is with key, the circuit package of core becomes component module 1, afterwards, the pin of element is drawn and is only formed the first encapsulation end points 14 on first encapsulating face 11 of component module 1, the second encapsulation end points 13, when the welding encapsulation, employing hollows out on printed circuit board (PCB) 2 offers the through hole II that the area size with second loading end 12 of component module 1 adapts to, make circuit in the marked region 15 of first encapsulating face 11 of component module 1 be contained in fully in the through hole II and not protruding second loading end 22 that exposes printed circuit board (PCB) 2, thereby, the whole height of the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module only is the height sum of the first welding end points more than 14 of first encapsulating face 11 of the height of printed circuit board (PCB) 2 and component module 1, the height that encapsulates when being compared to the welding of traditional component module and printed circuit board (PCB) is the height sum of component module and printed circuit board (PCB), the encapsulating structure 3 of printed circuit board (PCB) of the present invention and component module reduces packaging height, save assembling space, be beneficial to the miniaturization and the high integration design of printed circuit board (PCB).
Claims (11)
1. the encapsulating structure of printed circuit board (PCB) and component module comprises:
Component module, described component module comprises first encapsulating face and second encapsulating face relative with first encapsulating face, the side of first encapsulating face is provided with the first encapsulation end points, on first encapsulating face at the distance first encapsulation end points certain position place the second encapsulation end points is set, the zone that the second encapsulation end points inboard surrounds is protruded and is formed the component module zone, described component module zone is positioned at different planes and protrudes in first encapsulating face with first encapsulating face, upper and lower first encapsulating face that runs through of the described first encapsulation end points; And
Printed circuit board (PCB), comprise first loading end and second loading end relative with first loading end, described printed circuit board (PCB) is provided with the upper and lower through hole that hollows out, first loading end is provided with on first loading end at certain position place of first pad, distance first pad and second pad is set, the upper and lower printed circuit board (PCB) that runs through of described first pad;
The component module zone of first encapsulating face of described component module is placed in the through hole of described printed circuit board (PCB), first encapsulating face of described component module is carried on first loading end of printed circuit board (PCB), the first encapsulation end points of described first encapsulating face electrically contacts welding with first pad of first loading end of printed circuit board (PCB), the second encapsulation end points of described first encapsulating face electrically contacts welding with second pad of first loading end of printed circuit board (PCB), and the lower surface in the component module zone of described component module and second loading end of printed circuit board (PCB) flush or be higher than second loading end of printed circuit board (PCB).
2. the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module is characterized in that: the area of described through hole is more than or equal to the area in the component module zone of component module.
3. the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module, it is characterized in that: the first encapsulation end points of first encapsulating face of described component module comprises that interior ring seal dress pad reaches and the outer shroud encapsulation welding tray of interior ring seal dress pad electrical communication, and first pad of first loading end of described printed circuit board (PCB) comprises that interior ring welded disc reaches and the outer shroud welded disc of interior ring welded disc electrical communication.
4. the encapsulating structure of printed circuit board (PCB) according to claim 3 and component module, it is characterized in that: the interior ring seal dress pad of the described first encapsulation end points is the upper and lower semi-circular through hole pad that runs through component module, and the interior ring welded disc of described first pad is the upper and lower semi-circular through hole pad that runs through printed circuit board (PCB).
5. the encapsulating structure of printed circuit board (PCB) according to claim 4 and component module is characterized in that: the semi-circular through hole pad of ring seal dress pad and interior ring welded disc is the pad of zinc-plated or heavy tin or turmeric in described.
6. the encapsulating structure of printed circuit board (PCB) according to claim 5 and component module is characterized in that: the semi-circular through hole pad of ring seal dress pad and interior ring welded disc is anti-oxidation processing in described.
7. according to the encapsulating structure of claim 3 or 4 described printed circuit board (PCB)s and component module, it is characterized in that: the outer shroud encapsulation welding tray of the described first encapsulation end points and the outer shroud welded disc of described second pad are half racetrack.
8. the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module is characterized in that: described printed circuit board (PCB) is the circuit board of two-layer or sandwich construction, and described component module is the component module of sandwich construction.
9. the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module is characterized in that: first encapsulating face of described component module, second encapsulating face are marked with some silk-screen signs of marked region, the component module first encapsulation end points silk-screen sign and the mark that keeps at a certain distance away of components and parts placement.
10. the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module is characterized in that: first loading end of described printed circuit board (PCB), second loading end are marked with marked region, first pad silk-screen sign, some silk-screen signs of the mark that keeps at a certain distance away and the aid identification character of pin sequence number of component module.
11. the method for packing of the encapsulating structure of printed circuit board (PCB) according to claim 1 and component module:
First encapsulating face of described component module is carried on first loading end of printed circuit board (PCB), and the module region at the middle part of described component module is placed in the through hole of printed circuit board (PCB);
The first encapsulation end points of first encapsulating face of described component module and first pad of first loading end of printed circuit board (PCB) are electrically contacted second of welding, described first encapsulating face to be encapsulated end points and electrically contacts welding with second pad of first loading end of printed circuit board (PCB) respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610171606 CN101211882B (en) | 2006-12-31 | 2006-12-31 | Printed circuit board and element module packaging structure and encapsulation method |
| PCT/CN2007/001360 WO2008080274A1 (en) | 2006-12-31 | 2007-04-24 | Packaging structure of pcb and element module and packaging method of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610171606 CN101211882B (en) | 2006-12-31 | 2006-12-31 | Printed circuit board and element module packaging structure and encapsulation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101211882A CN101211882A (en) | 2008-07-02 |
| CN101211882B true CN101211882B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610171606 Expired - Fee Related CN101211882B (en) | 2006-12-31 | 2006-12-31 | Printed circuit board and element module packaging structure and encapsulation method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101211882B (en) |
| WO (1) | WO2008080274A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101982866B (en) * | 2010-09-09 | 2015-04-08 | 浙江致威电子科技有限公司 | Method for manufacturing fuse plugboard |
| CN102573289A (en) * | 2010-12-15 | 2012-07-11 | 相互股份有限公司 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
| CN102368483A (en) * | 2011-10-11 | 2012-03-07 | 常熟市广大电器有限公司 | Novel chip packaging structure |
| CN104133967A (en) * | 2014-08-01 | 2014-11-05 | 浪潮集团有限公司 | PCB packaging silk-screen printing setting and pin silk-screen printing positioning inspection method |
| CN110750905A (en) * | 2019-10-23 | 2020-02-04 | 深圳市元征科技股份有限公司 | PCB element packaging method, device, equipment and medium |
| CN111475992A (en) * | 2020-05-19 | 2020-07-31 | 深圳市元征科技股份有限公司 | Design method and device of printed circuit board and storage medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608262A (en) * | 1995-02-24 | 1997-03-04 | Lucent Technologies Inc. | Packaging multi-chip modules without wire-bond interconnection |
| CN1268245A (en) * | 1997-05-23 | 2000-09-27 | 阿尔平微型系统公司 | A system and method for packaging integrated circuits |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264915A (en) * | 1995-03-24 | 1996-10-11 | Sony Corp | Wiring board |
| JPH0918104A (en) * | 1995-06-30 | 1997-01-17 | Victor Co Of Japan Ltd | Printed board |
-
2006
- 2006-12-31 CN CN 200610171606 patent/CN101211882B/en not_active Expired - Fee Related
-
2007
- 2007-04-24 WO PCT/CN2007/001360 patent/WO2008080274A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608262A (en) * | 1995-02-24 | 1997-03-04 | Lucent Technologies Inc. | Packaging multi-chip modules without wire-bond interconnection |
| CN1268245A (en) * | 1997-05-23 | 2000-09-27 | 阿尔平微型系统公司 | A system and method for packaging integrated circuits |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平8-264915A 1996.10.11 |
| JP特开平9-18104A 1997.01.17 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101211882A (en) | 2008-07-02 |
| WO2008080274A1 (en) | 2008-07-10 |
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