CN101151207B - Display device and method of image formation - Google Patents
Display device and method of image formation Download PDFInfo
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- CN101151207B CN101151207B CN200680005842XA CN200680005842A CN101151207B CN 101151207 B CN101151207 B CN 101151207B CN 200680005842X A CN200680005842X A CN 200680005842XA CN 200680005842 A CN200680005842 A CN 200680005842A CN 101151207 B CN101151207 B CN 101151207B
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Images
Abstract
Improved apparatus and methods for spatial light modulation are disclosed which utilize optical cavities having both front and rear reflective surfaces. Light-transmissive regions are formed in the front reflective surface for spatially modulating light.
Description
Technical field
This invention relates generally to the spatial light modulation field, particularly, the present invention relates to have the display backlight that has improved.
Background technology
Optical modulator with machinery constitutes a kind of alternative replacement scheme that temptation is arranged that display is based on the display of liquid crystal technology.The optical modulator of machinery is quick must to be enough to good visual angle and large-scale color and gray scale display of video content.The optical modulator of machinery is achieved success in projection display applications.Yet use the backlit display of the optical modulator of machinery but also not have apparent brightness and the lower powered combination that enough temptation are arranged.When working with transmissive mode, the optical modulator of many machineries has the aperture diaphragm ratio in 10% to 20% scope, be merely able to this beholder send 10% to 20% can be from this light that obtains backlight, to produce image.Aperture diaphragm that this is mechanical and color filer combinations are reduced to optical efficiency about 5%, promptly are not superior to the available efficient of current colour liquid crystal display device.Need a kind of low-power displays that improves illumination efficiency.
Summary of the invention
Apparatus and method described here provide a kind of mechanical light modulators with illumination efficiency of having improved, make the mechanical actuation device (actuator) for use large-area display temptation being arranged portable.In some cases, the transmittance or the optical efficiency that are couple to mechanical modulator backlight can be brought up to 40% to 60% degree, and efficient is more than 10 times of typical efficiencies in the LCD in other words.In addition, apparatus and method described herein can be incorporated in small size, the high-resolution display, no matter and light modulation mechanism how, with the brightness that improves this display with reduce the power requirement that shows in using.
Optical modulator described here makes not only bright but also low-power of portable video display.Can enough switch this optical modulator apace, with service time the sequential color technology coloured image is provided and does not rely on chromatic filter.Can use to lack and construct this display, not only to form the mechanical shutter assembly but also form the necessary electrical connection of array address to three functional layer.
On the one hand, the present invention relates to a kind of spatial light modulator, this spatial light modulator comprises first reflective surface will and second reflective surface will.This first reflective surface will is confirmed a plurality of light transmission regions, such as aperture diaphragm, filter or Liquid crystal component.This second reflective surface will is at least in part in the face of this first reflective surface will and domain reflection-based to this transmitance region of being confirmed by this first reflective surface will.These reflective surface will can be mirror, dielectric somascope or function film.In one embodiment, this first reflective surface will is parallel to or is basically parallel to this second reflective surface will.In another embodiment, this reflective surface will at least in part each other laterally.The zone of the optics cavity of substantially transparent is confirmed in space between this first and second reflective surface will.
In one embodiment, this spatial light modulator comprises that the array of an optical modulator is used for optionally blocking this light transmission region.Block and to comprise, and be not limited to, partially or fully block, reflection, deflection, absorption or stop light to arrive the beholder of expection of the optical modulator in this space with other mode.In one embodiment, the array of this optical modulator comprises this first reflective surface will.A characteristic of this optical modulation element in the array of this optical modulator is that they can be controlled individually.In one embodiment, this optical modulation element can be based on the shutter assembly of MEMS, but and can be the shutter of bistable or deformation alternatively.In an implementation; This shutter assembly comprises the shutter that is coated with first film; This first film is used to absorb from a direction and is radiated at the light on this shutter, and this shutter is coated with second film, and this second film is used to reflect from another direction and is radiated at the light on this shutter.In one embodiment, this shutter moves in a plane, makes in a position basic shading light of this shutter pass the passage of corresponding transmitance region, and their allow light to pass this light transmission region in the second place.In another embodiment, this shutter moves out by the definite plane of the array of the shutter assembly that comprises this shutter at least in part.When basically in this plane, this shutter shading light passes the passage of corresponding light transmission region.When basically outside this plane, this shutter allows light to pass this light transmission region.In another embodiment, the array of this optical modulator comprises a plurality of liquid crystal cells.
In another embodiment, this spatial light modulator comprises photoconduction, is used for distribute light on whole optics cavity.This reflective surface will can directly be arranged on the front surface and surface, back of this photoconduction.As alternative replacement scheme, this front-reflection property surface can be arranged on the substrate that separates arranging this optical modulator above that.Similarly, this second reflective surface will can directly be couple to the rear side of this photoconduction, and it can be attached on the 3rd surface in other words.
This substrate that forms the array of this optical modulator above that can be transparent or opaque.For opaque substrate, pass this substrate etching aperture diaphragm, to form light transmission region.This substrate can directly be couple on this photoconduction, and perhaps it can use one or more pad or supporting member to separate with this photoconduction.In another embodiment, this spatial light modulator comprises scatterer or brightness enhancement film.This spatial light modulator can also comprise the light source such as light emitting diode.
On the other hand, the present invention relates to a kind of method that forms image.This method comprises and being incorporated into light in reflexive optics cavity.This reflexive chamber comprises a plurality of light transmission regions, through this light transmission region light this reflexive optics cavity of can overflowing.This method comprises that also the light through allowing to be introduced forms image through at least one this this reflexive optics cavity of light transmission region effusion.In one embodiment, the effusion of this light is by the control of the array of optical modulator, this optical modulator or block the light that passes light transmission region, or allow it to pass through.In another embodiment, this method comprises through the painted light source formation coloured image of a plurality of differences of alternately throwing light on.In going back an embodiment, this method comprises the part of reflected illumination at the surround lighting of the light transmission region that does not block.
Aspect another, the present invention relates to a kind of method of making space optical modulator, this method comprises the chamber that forms the substantially transparent with first and second opposite side, wherein can introduce light.This method also comprises first side that is couple to first reflective surface will in this transparent chamber, makes this first reflective surface will face the inside in this transparent chamber.In this first reflective surface will, form a plurality of light transmission regions.In addition, this method comprises second side that is couple to second reflective surface will in this transparent chamber, makes this second reflective surface will face the inside in this transparent chamber.
On the other hand, the present invention relates to a kind of method that forms image, this method is to be placed to the surround lighting that optionally reflection is received through reception environment light and being formed at least one on-chip shutter, to form this image.
An object of the present invention is to provide the apparatus and method that are used for display; The array that this display utilizes concentrator gathers light on the surface of mechanical light modulators or gathers to such an extent that pass the surface of mechanical light modulators, with contrast or the brightness that improves this display.
On the one hand, the present invention relates to a kind of display, be used for display image to the beholder.This display comprises the array of optical modulator and places the array of this optical modulator and the array of the reflective light funnel (funnel) between this beholder.The array of this reflective light funnel gathers light on some the corresponding optical modulators in the array of this optical modulator.In one embodiment, the array of this optical modulator optionally to this beholder's reverberation to show this image.In another embodiment, the array of this optical modulator to this beholder optionally light modulated to show this image.
On the other hand, the present invention relates to a kind of method of making display through the array that forms reflectivity or transmittance optical modulator.This method also comprises the array that forms the reflective light funnel through the array that on the sheet material of substantially transparent, forms depression.Each depression respectively has top, bottom and wall.The array that forms this reflective light funnel also is included in the film of deposition of reflective property on the wall of this depression, and forms open optical in the bottom of this depression and make the diameter of this open optical less than the diameter at the top of this depression.As alternative replacement scheme, can form the array of this reflective light funnel through the outside that applies the wall of this funnel type object with the array of material transparent formation funnel type object and with reflective membrane.
Description of drawings
Illustrative description through with reference to the accompanying drawings will be understood this system and method better, wherein:
Figure 1A is the equal proportion concept map according to the array of the optical modulator of illustrative embodiment of the present invention;
Figure 1B is the cross-sectional view according to the shutter assembly in the light modulator arrays that is included in Figure 1A of illustrative embodiment of the present invention;
Fig. 1 C is the isometric map according to the shutter layer of the shutter assembly of Figure 1B of illustrative embodiment of the present invention;
Fig. 1 D is the vertical view such as each functional layer of optical modulator of the optical modulator array of Figure 1A;
Fig. 2 is the cross-sectional view according to the optics cavity that is used for spatial light modulator of illustrative embodiment of the present invention;
Fig. 3 A-3D is the cross-sectional view according to alternative alternative shutter assembly of illustrative embodiment of the present invention;
Fig. 4 be according to illustrative embodiment of the present invention have first coating the cross-sectional view of shutter assembly of shutter;
Fig. 5 be according to illustrative embodiment of the present invention have second coating the cross-sectional view of shutter assembly of shutter;
Fig. 6 is the cross-sectional view of shutter assembly that is used for the elasticity actuator of light modulator arrays according to having of illustrative embodiment of the present invention;
Fig. 7 is the cross-sectional view of shutter assembly that is used for the deformation shutter of light modulator arrays according to having of illustrative embodiment of the present invention;
Fig. 8 A-8B is the cross-sectional view that is used for the opaque on-chip shutter assembly of light modulator arrays according to being structured in of illustrative embodiment of the present invention;
Fig. 9 is according to the cross-sectional view based on the spatial light modulator of liquid crystal of illustrative embodiment of the present invention;
Figure 10 is first cross-sectional view based on the spatial light modulator of shutter according to illustrative embodiment of the present invention;
Figure 11 is second cross-sectional view based on the spatial light modulator of shutter according to illustrative embodiment of the present invention;
Figure 12 A-12D is the cross-sectional view according to the the the 3rd, the 4th, the 5th and the 6th illustrative spatial light modulator based on shutter of illustrative embodiment of the present invention;
Figure 13 is the 7th cross-sectional view based on the spatial light modulator of shutter according to illustrative embodiment of the present invention;
Figure 14 A and 14D are the cross-sectional views according to two added space optical modulators of illustrative embodiment of the present invention;
Figure 15 is the cross-sectional view according to the additional shutter assembly of illustrative embodiment of the present invention;
Figure 16 is the cross-sectional view according to the another spatial light modulator of illustrative embodiment of the present invention;
Figure 17 is the illustrative Transflective property shutter assembly according to embodiment of the present invention;
Figure 18 is the second illustrative Transflective property shutter assembly according to embodiment of the present invention;
Figure 19 is the cross-sectional view according to the front-reflection property shutter assembly of illustrative embodiment of the present invention;
Figure 20 is the isometric map according to the fairly large display that is formed by optical modulator array of illustrative embodiment of the present invention;
Figure 21 A is the sketch map that is suitable for comprising the active gating matrix 2100 of the matrix that is used for address pixel in the display unit 100 into;
Figure 21 B is the isometric map of a part of this pel array that comprises the gating matrix of Figure 21 A.
Figure 22 is the concept nature isometric map according to the display unit of illustrative embodiment of the present invention;
Figure 23 is according to each shutter of the display unit of Figure 22 of illustrative embodiment of the present invention and the partial section of pixel components;
Figure 24 A and Figure 24 B are the vertical view of shutter layer under different actuator states according to the display unit of Figure 22 of illustrative embodiment of the present invention and Figure 23;
Figure 25 is the isometric map according to the shutter layer of the display unit of Figure 22-24B of illustrative embodiment of the present invention, is similar to the diagram of Figure 22, is illustrated in the concept nature of arranging this shutter assembly in this display unit and lays diagram;
Figure 26 A-26D be according to the concentrator array layer of the display unit of illustrative embodiment Figure 22 of the present invention-25 the different fabrication stages partial cross section view;
Figure 27 A-27C is that the concentrator array layer of display unit of the Figure 22-25 according to another illustrative embodiment of the present invention is in the partial cross section view of different fabrication stages;
Figure 28 is according to each shutter of the display unit of Figure 22-27C of illustrative embodiment of the present invention and the equal proportion partial cross section view of pixel components;
Figure 29 is according to each shutter of the display unit of Figure 22 that is implemented as transflective display-28 of illustrative embodiment of the present invention and the equal proportion partial cross section view of pixel components;
Figure 30 is according to each shutter of the display unit of Figure 22 that is implemented as transmissive display-28 of illustrative embodiment of the present invention and the equal proportion partial cross section view of pixel components.
The specific embodiment
In order to provide to overall understanding of the present invention, now some illustrative embodiment will be described, comprise the device and the method that are used for spatial modulation light.Yet; The one of ordinary skilled in the art will be understood that; System and method described herein can suitably adapt to the application that is directed against and revise; And apparatus and method described herein can be used for other application that is fit to, and suchlike other replenish and revise and do not depart from its scope.
Figure 1A is the equal proportion concept map of the array 100 (being also referred to as " optical modulator array 100 ") according to the optical modulator of illustrative embodiment of the present invention.Optical modulator array 100 comprises a plurality of shutter assembly 102a-102d that arrange by row and column (general designation " shutter assembly 102 ").Generally, shutter assembly 102 has two states, promptly opens and close (although in order to realize that gray scale can adopt part to open).Shutter assembly 102a and 102d are in open state, allow light to pass through.Shutter assembly 102b and 102c are in closed condition, the path of shading light.Through optionally setting the state of shutter assembly 102a-102d, just can utilize optical modulator array 100 to form the image 104 of Projection Display or display lamp backlight 105 illuminations.In optical modulator array 100, each shutter assembly 102 is corresponding to the pixel in the image 104 106.In the implementation that substitutes, optical modulator array comprises each three shutter assembly that color is specific of each pixel.Through the shutter assembly of one or more optionally open corresponding with pixel particular color, this shutter assembly can produce the colour element in this image.
The state of each shutter assembly 102 can use a kind of passive matrix addressing scheme to be controlled.Each shutter assembly 102 is by a row electrode 108 and two column electrode 110a (" row open electrode ") and 110b (" row closed electrode ") control.In optical modulator array 100, all shutter assemblies 102 in the given row are shared a single row electrode 108.Shutter assemblies 102 all in the given row are shared public capable open electrode 110a and public capable closed electrode 110b.The active array addressing scheme also is possible.In the voltage condition that active array addressing (wherein by means of thin film transistor (TFT) array control pixel and switched voltage) must keep being applied in the cycle of whole video frame with stable manner is useful.Can have only a column electrode to constitute the realization of active array addressing with every pixel.
In the scheme of this passive matrix addressing; In order to change over a kind of opened state to the state of a shutter assembly 102 from a kind of closing state; Promptly for open shutter assembly 102; Optical modulator array 100 applies electromotive force to the corresponding row electrode 108 of row of the optical modulator array 100 that is positioned at shutter assembly 102; And go open electrode 110a accordingly to the row of the optical modulator array 100 that is positioned at shutter assembly 102 and apply one second electromotive force, this second electromotive force has antipole property in some cases.In order to change over closing state to the state of shutter assembly 102 from opened state; Promptly in order to close shutter assembly 102; Optical modulator array 100 applies electromotive force to the corresponding row electrode 108 of row of the optical modulator array 100 that is positioned at shutter assembly 102; And go closed electrode 110b accordingly to the row of the optical modulator array 100 that is positioned at shutter assembly 102 and apply second electromotive force, this second electromotive force has antipole property in some cases.In an implementation, shutter assembly is crossed predetermined switching threshold and the change state in response to the electrical potential difference that is applied to this row electrode and one of this column electrode 110a or 110b.
In an implementation, in order to form image, optical modulator array 100 is set the state of each shutter assembly 102 of delegation with the time sequencing order.For given row, optical modulator array 100 at first applies electromotive force and applies the pulse electromotive force to all row electrodes 108 through the capable closed electrode 110b to correspondence closes each shutter assembly 102 in this row.Then optical modulator array 100 through apply electromotive force to row open electrode 110a and in comprising the row that will be opened the row electrode 108 of the row of shutter assembly apply electromotive force open light will through the shutter assembly that passes through 102.In an alternative alternative mode of operation; Be replaced in and sequentially close every capable shutter assembly 102; Be located at correct position to all row in the optical modulator array 100 with after forming an image 104, optical modulator array 100 is through side by side apply an electromotive force with all row electrodes 108 and reset all shutter assemblies 102 simultaneously all capable closed electrode 110b overallly.In another alternative alternative mode of operation, optical modulator array 100 abandon resetting shutter assembly 102 and only changing to showing that a successive image 104 needs the state of the shutter assembly 102 of change state.
Except row electrode 108 and column electrode 110a and 110b, each shutter assembly comprises a shutter 112 and an aperture diaphragm 114.For a pixel 106 in the illumination image 104, be arranged to this shutter make it to have no and significantly allow light to pass aperture diaphragm 114 with blocking to the beholder.In order to keep a pixel not luminous, arrange this shutter 112 to such an extent that make it the passage that shading light passes aperture diaphragm 114.This aperture diaphragm 114 is by the etched zone of reflective material that is passed in each shutter assembly, such as row electrode 108, forms.This aperture diaphragm 114 can be filled the dielectric substance material.
Figure 1B is one the cross-sectional view (referring to the line A-A ' among following Fig. 1 D) in the shutter assembly 102 of Figure 1A, and the supplementary features of shutter assembly 102 are shown.Referring to Figure 1A and Figure 1B, shutter assembly 102 is formed on the substrate 116, and this substrate quilt is shared with other shutter assemblies 102 of optical modulator array 100.Substrate 116 can support nearly 4,000,000 shutter assembly, is arranged to up to about 2000 row with up in about 2000 row.
Such as preamble description, shutter assembly 102 comprises a row electrode 108, a row open electrode 110a, a capable closed electrode 110b, a shutter 112 and an aperture diaphragm 114.Row electrode 108 is formed by a kind of continuous basically reflective metal layer, and this continuous basically reflective metal layer promptly places the row metal level 118 on the substrate 116.Row metal level 118 works to be used for the row electrode 108 of row of the shutter assembly 102 of optical modulator array 100.The continuity of being interrupted row metal level 118 is with row electrode 108 electric insulations in the shutter assembly 102 of other row in a row electrode 108 and the optical modulator array 100.As stated, each shutter assembly 102 respectively comprises and passes 118 etchings of row metal level to form the aperture diaphragm 114 in transmitance zone.
This shutter assembly comprises a row metal layer 120, and this row metal layer was opened by the interlayer and the row metal level of one or more dielectric substance material or metal in 118 minutes.Row metal layer 120 forms two by the delegation's shutter assembly in the optical modulator array 100 102 shared two column electrode 110a and 110b.Row metal layer 120 also plays the light that reflection is passed the slit in the row metal level 118 rather than passed through aperture diaphragm 114.Row metal level and row metal layer are between about 0.1 and 2 micron thick.In (hereinafter explanation) the alternative alternative implementation shown in Fig. 1 D, row metal layer 120 can be in the below of the row metal level 118 in the shutter assembly 102.
The assembly of shutter 102 comprises one the 3rd functional layer, is called shutter layer 122, and this shutter layer comprises shutter 112.Shutter layer 122 can form with metal or semiconductor.Metal or semiconductor cross logical 124 and are electrically connected to the column electrode 110a and the 110b of row metal level 118 and row metal layer 120 on the part on the shutter layer 122.Shutter layer 122 was opened through lubricant, vacuum or air and row metal layer in 120 minutes, and the free degree of motion is provided for shutter 112.
Fig. 1 C is the isometric map according to the shutter layer 122 of illustrative embodiment of the present invention.With reference to 1B and 1C two figure, except shutter 112, shutter layer 122 also comprises four shutter strong points 126, two row strong point 128a and 128b and two actuator 130a and 130b, and each respectively comprises the beam of two opposed compliances.Shutter 112 comprises the part 132 of blocking, and alternatively, as shown in Fig. 1 C, also is included in shutter aperture diaphragm 134.Under opened state, or shutter 112 leaves aperture diaphragm 114, or shutter aperture diaphragm 134 is positioned at the top of aperture diaphragm 134, thereby allows light to pass shutter assembly 102.Under closing state, shield portions 132 places the top of this aperture diaphragm, and shading light passes the passage of shutter assembly 102.In alternative alternative implementation, shutter assembly 102 can comprise additional aperture diaphragm 114, and shutter 112 can comprise a plurality of shutter aperture diaphragms 134.For example, shutter 112 can be designed with a series of shutter aperture diaphragms 134 of doing narrow groove, and wherein the gross area of shutter aperture diaphragm 134 equals the area of the single shutter aperture diaphragm 134 shown in Fig. 1 C.In such implementation, can reduce shutter desired amount of exercise of motion between open and closing state significantly.
Each actuator 130a and 130b form with the beam of two opposed compliances.The beam of first pair of compliance, promptly shutter actuator beam 135 physically and electrically is connected to each end of shutter 112 on the shutter strong point 126 at each angle that is arranged in shutter assembly 102.The shutter strong point 126 and then be electrically connected to row metal level 118.The beam of second pair of compliance, actuator beam 136a and 136b stretch out from each row strong point 128a and 128b at once.Row strong point 128a crosses energising via one and is connected to capable open electrode 110a.Row strong point 128b is connected to capable closed electrode 110b by crossing energising.Shutter actuator beam 135 is formed by the plated metal such as Au, Cr or Ni with row actuator beam 136a and 136b (collectively being called " actuator beam 135 and 136 "); Perhaps form by semiconductor such as polysilicon or non-crystalline silicon; Perhaps; If be formed on a kind of top of buried oxide (being also referred to as the silicon on the insulator), then form by monocrystalline silicon.Actuator beam 135 and 136 is patterned into about 1 to 20 micron wide size, makes that actuator beam 135 and 136 is compliances.
Fig. 1 D is the vertical view according to the various functional layers of the optical modulator array 100 ' of illustrative embodiment of the present invention.In the different phase of accomplishing, optical modulator array 100 ' comprises 12 shutter assemblies, 102 ' a-102 ' l.Shutter assembly 102 ' a and 102 ' b include only the row metal level 118 ' of optical modulator array 100 '.Shutter assembly 102c '-102 ' f includes only the row metal layer 120 ' (open electrode and row closed electrode at once) of optical modulator array 100 '.Shutter assembly 102 ' g and 102 ' h comprise row metal level 118 ' and row metal layer 120 '.Opposite with the shutter assembly 102 among Figure 1B, row metal level 118 ' is arranged on the top of row metal layer 120 '.Shutter assembly 102 ' i-l describes all three functional layers of shutter assembly 102 ', at once metal level 120 ', row metal level 118 ' and shutter metal level 122 '.Row metal level 118 ' by seeing through the shutter aperture diaphragm 134 ' that is included among shutter assembly 102 ' i and the 102 ' k is indicated, and shutter assembly 102 ' i and 102 ' k close.Indicated by the row metal level that in shutter aperture diaphragm 134 ', can see 118 ' aperture diaphragm 114 ', shutter assembly 102 ' j and 102 ' l are in open position.
In other alternative alternative implementation, shutter assembly can every pixel comprise a plurality of aperture diaphragms and corresponding shutter and actuator (for example between 1 to 10).When changing the state of this shutter assembly, the actuator number that is encouraged can depend on the switched voltage that is applied, and perhaps depends on the particular combination that is selected with the row and column electrode of accepting switched voltage.Wherein through being provided at the switched voltage between the minimum and the highest switched voltage, the implementation of partly opening aperture diaphragm by simulated mode also is possible.These alternative alternative implementations provide the improvement means that produce gray scale.
For the start of shutter assembly 102, apply electromotive force in response to row electrode 108 to shutter assembly 102, likewise use the electromotive force that is applied to apply voltage as the shutter strong point 126, shutter 112 and shutter actuator beam 135.When applying voltage, also for applying voltage with corresponding capable actuator beam 136a or 136b corresponding to row strong point 128a or 128b for one of column electrode 110a or 110b.If the electrical potential difference between capable actuator beam 136a that draws or 136b and its opposed actuator beam 135 surpasses predetermined switching threshold; Row actuator beam 136a or 136b attract its opposed shutter actuator beam 135, thereby change the state of shutter assembly 102.
Along with being pulled in actuator beam 135 and 136 together their crooked or change states.The every pair of actuator beam 135 and 136 (promptly; Row actuator beam 134a or 134b with and opposed shutter actuator beam 135) can have two alternately and one of stable curvature form; Be pulled in together with parallel in shape or curvature; Be held separately with stable manner, its curvature is invested opposite symbol.Thereby every pair all is that machinery is bistable.The every pair of actuator beam 135 and 136 is stable two positions, one be shutter 112 in " opening " position, and second be that shutter 112 is in " closing " position.In case actuator beam 135 and 136 reaches one of this settling position, need not apply power or voltage to any of row electrode 108 or two column electrode 110a or 110b shutter 112 is remained on this stable position.For this stable position that shutter 112 is moved out need apply the voltage that is higher than predetermined threshold.
No matter although shutter assembly 102 is all to be energy stabilization in open position or in the position of closing, a stable position can have lower energy state than another stable position.In one implementation, shutter device 102 is designed to make that the closed position has the energy state lower than the release position.Therefore can apply low-energy reset pulse to any pixel or all pixels, to reset into whole array the state of its minimum stress, just corresponding to complete black image.
More specifically, the deposited on top multilayer material (typically between metal and dielectric substance, alternately depositing) at substrate forms storehouse.After adding one deck or multilayer material on this storehouse, composition on the top of the layer of this storehouse, mark is removed or is retained in the material on this storehouse from this storehouse.Then to composition storehouse apply various etching techniques, comprise that wet etching and/or dry ecthing are to remove undesired material.This etch process can and apply this etched time quantum based on the layer in this etched chemical composition, this storehouse and from the perhaps a plurality of layers of a layer of this storehouse, remove material.This manufacturing process can comprise layering (layering), composition and etched a plurality of iteration.
This technology also comprises a release steps.For the free degree that provides parts in the finished product device, to move, insert expendable material in the storehouse of the material near-end of the moving component in will being formed on the finished product device.Most of this expendable material is removed in etching, thereby makes that these parts can freely-movable.
After discharging,, thereby can when contact, between the parts of motion, not transmit electric charge the surface insulation of the shutter of this motion.This can through thermal oxide accomplish and/or through the conformal chemical vapour deposition (CVD) such as Al
2O
3, Cr
2O3, TiO
2, HfO
2, V
2O
5, Nb
2O
5, Ta
2O
5, SiO
2, or Si
3N
4And so on insulator accomplish, perhaps through using the deposition techniques materials similar such as ald to accomplish.Through chemical transformation technology, for example to fluoridize or this surface of having insulated of hydrogenation, the surface that chemically passivation has been insulated is to prevent the problem such as static friction between the contact surface.
Fig. 2 is the cross-sectional view that is used for according to an optics cavity 200 that is used for spatial light modulator of illustrative embodiment of the present invention.Optics cavity 200 comprises 202 and back reflection property surfaces 204, a front-reflection property surface.Front-reflection property surface 202 comprises a light transmission region array 206, and light 208 is through this light transmission region array optics cavity 200 of can overflowing.Light 208 gets into optics cavity 200 from one or more light source 210.Light 206 reflects till one of this light transmission region 206 is passed in its reflection between preceding and back reflection property surface 202 and 204.Additional reflective surface will can be added in side along this optics cavity.
In an implementation, preceding and back reflection property surface 202 and 204 through or deposit a kind of metal at a glass substrate or on a plastic substrate or semiconductor forms.In other implementation, preceding and back reflection property surface 202 and 204 through or on the top of a dielectric substance film plated metal or semiconductor form, this dielectric substance film is arranged to be structured in one of on-chip a series of films.Reflective surface will 202 and 204 has about reflectivity more than 50%.For example, reflective surface will 202 and 204 can have 70%, 85%, 96% or higher reflectivity.
More smooth substrate and more the fine powder metal draw higher reflectivity.Can or obtain smooth surface through the polished glass substrate through the shape that is molded as plastics on smooth wall.As alternative replacement scheme, can water cast glass or plastics and make through settling liquid/air interface to form smooth surface.Can pass through multiple gas phase deposition technology, comprise splash, evaporation, ion plating, laser ablation or chemical vapour deposition (CVD), form meticulous powdered-metal film.To the effective metal of this reflective application, include, without being limited to Al, Cr, Au, Ag, Cu, Ni, Ta, Ti, Nd, Nb, Si, Mo and/or its alloy.
As replacement scheme, this reflective surface will can and be arranged between any one in a series of films on its top through the photoconduction in optics cavity 200 to be inserted low-refraction dielectric substance material and forms.Index of refraction between this photoconduction and this film changes the situation that causes the inner total reflection in this photoconduction, thereby can be to be bordering on the incident light of the enough low incidence angle of 100% efficient reflection.
In this replacement scheme, reflective surface will 202 or 204 can be used mirror, such as the dielectric somascope forms.The dielectric somascope manufactures the storehouse of the dielectric substance film that between the material of high and low index of refraction, replaces.Part from each this incident light of boundary reflection of index of refraction change.Through the THICKNESS CONTROL of this dielectric layer certain fixing mark or multiple, and, can produce reflectivity and surpass 98% clean reflective surface will through increasing from the reflection at a plurality of parallel interfaces to wavelength.Some dielectric somascope has the reflectivity greater than 99.8%.The dielectric somascope can be customization design accepting presetted wavelength scope in the visible-range, and accept predetermined ranges of incidence angles.As long as this manufacturing can be controlled the slickness in this dielectric substance film stack, under this condition, just can have to surpass 99% reflectivity.This storehouse can comprise 20 to 500 films.
In another replacement scheme, first and second reflective surface will 202 or 204 are included in the optics cavity 200 as the parts that separate.The stainless steel or the aluminum slice of polishing maybe be just enough for this purpose.And possibly on the surface of continuous sheet material or roll of plastic, produce the metal surface or the dielectric somascope of reflection.Then can the sheet of reflectivity plastics be attached to admittedly or sticking card to the miscellaneous part of optics cavity 200.
Light transmissive regional 206 are arranged to an array, the pixel of the formation image of using with formation.In illustrative embodiment, light transmissive regional 206 spaced apart about 100 to about 350 microns.This light transmissive zone is being elongated or rectangle in shape, and wherein bigger size is about 50 to about 300 microns, and narrower size is between 2 to 100 microns, although other shape and size also can be fit to.For the projection display, this pitch can be as small as 20 microns, and the aperture diaphragm width is little of 5 microns simultaneously.The area on the front-reflection property surface 202 that is occupied by light transmission region 206 is called transmittance in this article with the ratio of the gross area on front-reflection property surface 202.The illustrative embodiment of optics cavity 200 has the transmittance between about 5% to about 50%.Usually, there is the spatial light modulator of so low transmittance can launch the light that is not enough to form usable image.In order to guarantee that from the more light 208 of optics cavity 200 emissions, surperficial 202 and 204 several of preceding and back reflection property are reverberation 208 back and forth, till the light that is reflected 208 passes a light transmission region 206, perhaps till light 208 is lost its energy owing to reflection.The surface of high reflectance causes more light 208 to overflow to form image from optics cavity 200.
Following table 1 is listed the percentage (with regard to efficient) of the light 208 of the introducing optics cavity 200 of overflowing through light transmission region 206 as far as several transmittances/reflectivity couple.
Table 1
When using optics cavity 200 to form transmissive displays basic, one or more light source 210 is introduced light in the optics cavity 200.Light source 210 can be any suitable type, for example, is included in United States Patent(USP) No. 4,897, any kind that discloses in 771 and No.5,005,108, these two whole disclosures of patent by reference mode and be incorporated herein.Particularly; Light source 201 can be a kind of arc lamp, one also can be colored, optical filtering or painted incandescent lamp, lens (lens end) lamp, a line lamp (line light), Halogen lamp LED, a light emitting diode (LED), a kind of led chip, neon lamp, fluorescent tube, from the fiber optic conduit of a long-range light emitted, laser instrument or laser diode, perhaps other suitable light sources.In addition, this light source can be the perhaps combination of the radiation source 210 of a plurality of colours of LED of a plurality of colours, distributes with light or the white light output that desirable colour is provided.For example can adopt the light of a plurality of colors, such as the LED of different color (red, blue, green), perhaps adopt to have the single led of a plurality of color chips, to distribute through intensity generation white light or the output of any other colored light that changes each each other colourama.Can be at the proximal end arrangement reflector of light source 210, with the light of launching from optics cavity 200 to optics cavity 200 reflections 208.In an implementation, three light sources 210, i.e. red light source 210, a green light source 210 and a blue-light source 210 with the frequency of 20 to 600Hz scopes alternately, are introduced light 208 advance in the optics cavity 200 sequentially.Surpass the scope that the frequency of 100Hz can be discovered greater than human eye usually, thereby colored image is provided.
Fig. 3 A is the linear cross-sectional view at a shutter assembly 300 of open position.Shutter assembly 300 be formed on thickness from about 0.3mm to the transparent substrate 302 of about 2mm.For example substrate 302 can be used a kind of glass or plastics manufacturing.The glass that is suitable for comprises Pyrex, and perhaps other can tolerate the glass up to the technological temperature that perhaps surpasses 400 degrees centigrade.The plastics that are applicable to substrate 302 for example comprise PETG (PET), perhaps polytetrafluoroethylene (PTFE) (PETF), and perhaps other can tolerate the plastics of the substantially transparent of the temperature that surpasses 200 ℃.Other available substrate material comprises quartz and sapphire, and they are understood that to tolerate the temperature above 800 ℃.
The orlop of shutter assembly 300 is called " row metal level " 304, plays the front-reflection property surface 202 of this optics cavity of Fig. 2.In the process of making shutter assembly 300, pass row metal level 304 etching aperture diaphragms 306 to form light transmission region such as light transmission region shown in Figure 2 206.Aperture diaphragm 306 can be circular, oval-shaped, polygonal, spiral or irregular in shape generally.This aperture diaphragm occupies about 5% to about 25% of the area that is exclusively used in specific shutter assembly 300 in this light modulator arrays.Be different from aperture diaphragm 306, row metal level 304 is continual basically.Aperture diaphragm 306 is filled with dielectric substance material 307.Be applicable to that the example dielectric substance material that comprises in the shutter assembly 300 into comprises SiO
2, Si
3N
4And Al
2O
3
Following one deck mainly is made up of dielectric material 307, opens row metal level 304 and the column electrode 308a and the 308b branch that are arranged on the last layer.Dielectric layer 316 can be 0.3 to 10 micron thick.The top layer of shutter assembly 300 comprises the shutter strong point 312, two row strong points 313, two actuator and shutters 310.The beam of this actuator is not shown, because the cross section of shutter assembly 300 is to meet at this row actuator beam and the row strong point 313 and shutter actuator beam and shutter 310 meet that the position (for example, referring to the line B-B ' among Fig. 1 D) located gets.This top layer is bearing in the top of this lower level by this strong point 312, thus shutter 310 freely-movables.
In substituting implementation, column electrode 308a and 308b be arranged in the shutter assembly 300 lower than row metal level 304 layer.In another implementation, shutter 310 and actuator can be in be lower than row metal level 304 or be lower than column electrode 308a and 308b layer in.
As described with reference to Figure 1B, the actuator that is included in this shutter assembly can be designed to mechanical bistable.As alternative replacement scheme, this actuator can be designed to have only a stable position.In other words, when not applying being used as power of certain form, such actuator turns back to preposition, no matter be open, still closes.In such some implementations, shutter assembly 300 comprises single column electrode 308, and this column electrode causes that this actuator is released shutter 310 perhaps to pull out its stable position when energising.
Fig. 3 B is the cross-sectional view according to the second alternative alternative shutter assembly 300 ' that is in the release position of illustrative embodiment of the present invention.Second shutter assembly 300 ' comprises a substrate 302 ', row metal level 304 ', aperture diaphragm 306 ', column electrode 308 ' a and 308 ' b, a shutter 310 ', two actuator, a shutter strong point 312 ' and two capable strong points 313 '.The beam of actuator is not shown, because the cross section of shutter assembly 300 ' is taken at capable actuator beam and the row strong point 313 ' meets and shutter actuator beam and shutter 310 ' meet position.(for example referring to the line B-B` among Fig. 1 D).
In shutter assembly 300 ', the additional gap of etching in row metal level 304 '.The different piece electricity of row metal level 304 ' is separated in this gap, thereby can on each part, apply different voltages with different.For example; Can be between row metal level 304 ' and column electrode 308a ' and 308b ' to cause the parasitic capacitance that occurs in order reducing, can be optionally on the part 314 that directly serves as a contrast at the row metal level 304 ' of column electrode 308a ' and 308b ' and the strong point 312 ' below, to apply voltage because of it is overlapping.
Fig. 3 C the 3rd substitutes shutter assembly 300 according to another of illustrative embodiment of the present invention " cross-sectional view.Shutter assembly 300 " comprise a substrate 302 ", a row metal level 304 ", an aperture diaphragm 306 ", column electrode 308 " a and 308 " b, a shutter 310 ", two actuator, a shutter strong point 312 " and two capable strong points 313 ".The beam of this actuator is not shown, because shutter assembly 300 " cross section at this row actuator beam and the row strong point 313 " place of meeting and this shutter actuator beam and shutter 310 " position of meeting obtains.(for example referring to the line B-B ' among Fig. 1 D).Shutter assembly 300 " comprise be arranged in substrate 302 " on reflectance coating 316.Reflectance coating 316 works to be combined to shutter assembly 300 " the front-reflection property surface of optics cavity.Only if aperture diaphragm 306 " be formed on the aperture diaphragm 306 so that light transmission region to be provided in the reflectance coating 316 ", reflective membrane is continual basically.Dielectric layer 318 is reflective membrane 316 and row metal level 304 " separate.At least one additional dielectric layer 318 is with row metal level 304 " with two column electrode 308a " and 308b " separate.Making the 3rd alternative alternative shutter assembly 300 " technical process in, etching row metal level 304 " be positioned at column electrode 308 with removal " and 308b " metal of below to be to reduce column electrode 308a " and 308 " and row metal level 304 " ' between the potential electric capacity that possibly form.At row metal level 304 " in the slit 320 that forms be filled with dielectric substance.
Fig. 3 D is another the alternative alternative shutter assembly 300 in the position of closing according to being in of illustrative embodiment of the present invention " ' cross-sectional view.The 4th alternative alternative shutter assembly 300 " ' comprise a substrate 302 " ', a row metal level 304 " ', an aperture diaphragm 306 " ', column electrode 308a " ' and 308b " ', a shutter 310 " ', two actuator, a shutter strong point 312 " ' and two capable strong points 313 " '.The beam of actuator is not shown, because shutter assembly 300 " ' cross section at this row actuator beam and the row strong point 313 " ' place of meeting and this shutter actuator beam and the shutter 310 " ' position of meeting obtains.(for example referring to Fig. 1 D line B-B ').Shutter assembly 102,300,300 ' and 300 with the front explanation " opposite, the most dielectric substance materials that when making up the 4th alternative alternative shutter assembly 300
, use remove through one or more etching step.
The space that was occupied by this dielectric substance material in the past can use a kind of lubricant to fill to reduce friction and to stop shutter assembly 300 " ' the parts of motion between adhesion.This lubricating fluid is processed as the viscosity that is preferably lower than 10 centipoises and has preferably in the relative dielectric constant more than 2.0 and about 10
4The dielectric breakdown strength that V/cm is above.Such machinery and electrical characteristics are effective on the needed voltage of this shutter of motion between the position that is reduced in opening and closes.In an implementation, this lubricant preferably has low index of refraction, preferably is lower than about 1.5.In another implementation, this lubricant has the index of refraction that the index of refraction with substrate 302 is complementary.Suitable lubricated deionized water, methyl alcohol, ethanol, silicone oil, fluorinated silicone oil, dimethyl siloxane, dimethyl silicone polymer, HMDO and the diethylbenzene of including, but are not limited to.
Fig. 4 be according to illustrative embodiment of the present invention have a coating the cross-sectional view of a kind of shutter assembly 400 of shutter 402.Shutter assembly 400 is shown as the general structure of the shutter assembly 300 that has shown in Fig. 3 A.Yet shutter assembly 400 can be taked any shutter assembly 102,300,300 ', 300 of above description " or 300 " ' form or any below the form of other shutter assembly of describing.
A reflectance coating 404 is coated in the bottom of shutter 402, passes shutter assembly 400 to back reflective light 406 with time in the position of closing when shutter 402.Suitable reflectance coating 404 includes, but are not limited to Al, Cr or the Ni of smooth deposition.If film 404, deposits such film 404 greater than about 0.2 micron thick and provides 95% or higher reflectance for shutter.As alternative replacement scheme, in the time of on being deposited on smooth dielectric substance surface, amorphous or polysilicon can provide enough height to be used for the reflectivity of this application.
The top, coat of shutter 402 has light absorping film 408, is radiated at the reflection of the surround lighting 410 on the top of shutter assembly 400 with reduction.This light absorping film 408 can deposit in order to the mode that produces coarse or microporous surface and/or the anodic oxidation several metal forms, and this metal is Cr, Ni or Au or Si for example.As alternative replacement scheme, light absorping film 408 can comprise allyl resin or vinyl, and this allyl resin or vinyl comprise pigment absorption.In the alternative alternative implementation of shutter assembly 400, absorbing film 408 can be applied on the entire top surface of shutter assembly 400 or on the basic entire top surface.
Fig. 5 be according to illustrative embodiment of the present invention have second coating the cross-sectional view of shutter assembly 500 of shutter 502.Shutter assembly 500 is shown as the general structure with first alternative alternative shutter assembly 300 shown in Fig. 3 A.Yet shutter assembly can be taked any shutter assembly 102,300,300 ', 300 of above description " or 300 " ' form or any below the form of other shutter assembly of describing.In shutter assembly 500, the top of shutter 502 and bottom all apply with the light absorping film 504 such as light absorping film 408.Position absorption in that the light absorping film on the bottom of shutter 502 504 is being closed is radiated at the light on the shutter 502.Optical cavity for such as the optics cavity 200 of Fig. 2 comprises shutter assembly 500, and the light intensity that sends from optics cavity and the image of formation are irrelevant.Luminous intensity is irrelevant with the ratio of the shutter that can be in position open or that close in other words.
Fig. 6 is the cross-sectional view such as the shutter assembly 600 of the elasticity start of the optical modulator array of light modulator arrays 102 that is used for according to illustrative embodiment of the present invention.The shutter assembly 600 of elasticity start comprises a row metal level 602, single column electrode 604, a flexible member 606 and a shutter 608.Flexible member 606 provides a kind of restoring force, and this restoring force keeps shutter 608 to be in open position, leaves the aperture diaphragm 610 of the correspondence in the row metal level 602.In this release position, light 612 can pass aperture diaphragm 610.To single column electrode 604 power of switched voltage antagonism flexible member 606 is provided, thereby pushes the position of closing above aperture diaphragm 610 to shutter 608.In this position of closing, aperture diaphragm 610 outgoing are passed in 612 changes of shutter 608 block light.In an alternative alternate embodiment, shutter assembly 600 can comprise that breech lock is locked in the position of closing to shutter 608 and makes after shutter 608 is closed, and can remove to be added in the voltage on the electrode 604 and can not open shutter 608.Open shutter 608 will discharge this breech lock.In another implementation of shutter assembly 600, this flexible actuator is tended to remain on the position of closing to shutter 608.Apply the position that voltage advances to open to shutter 608 motions to column electrode 604.
But Fig. 7 be according to the shutter that has deformation 701 of illustrative embodiment of the present invention be used for optical modulator array the cross-sectional view of shutter assembly 700.Shutter assembly 700 comprises row metal level 702 and is formed on the column electrode 704 on the substrate 708.The shutter 701 of deformation replaces that to be displaced to the opposite side of shutter assembly 700 from a side of shutter assembly 700 open and close, in response to column electrode 704 is applied voltage and deformation.The shutter 701 of deformation forms to such an extent that make the shutter 701 of this deformation keep residual stresses, causes the shutter 701 of deformation to be tending towards scrolling and goes out the plane that it is included in this optical modulator array wherein.Through between column electrode 704 and row metal level 702, applying with switched voltage, the shutter 701 of deformation is attracted to substrate 708, thereby covers the aperture diaphragm 710 that is formed in the row metal level 702.The actuator of deformable or hinge type is existing explanation in affiliated technical field, for example is illustrated in United States Patent(USP) No. 4,564, in 836 and No.6,731,492.
Fig. 8 A is the cross-sectional view according to the shutter assembly 800 that has the opaque substrate 802 such as silicon that is used for optical modulator array of illustrative embodiment of the present invention.The thickness of opaque substrate 802 about 200 microns to the scope of about 1mm.Although shutter assembly 800 is similar to the shutter assembly 300 shown in Fig. 3 A, shutter assembly 800 can be taked among Fig. 3-7 any shutter assembly 300,300 ', 300 of explanation ", 300 " ', any one essentially identical form of 400,500,600 or 700.Pass whole opaque substrate 802 etching aperture diaphragms 804.In an implementation, use anisotropic dry ecthing for example the auxiliary CFCl of ion or ion being arranged
3In the gas, form aperture diaphragm 804.Shutter assembly 800 can also comprise the reflective coating 810 that is deposited on opaque substrate 802 sides that are opposite to the row metal level.
Fig. 8 B is the cross-sectional view according to second shutter assembly 800 ' that has opaque substrate 802 ' that is used for optical modulator array of illustrative embodiment of the present invention.Compare with the shutter assembly 800 among Fig. 8 A, etch away the downside of opaque substrate 802`, be formed on the chamber 806 of below of the aperture diaphragm 804 ' of shutter assembly 800 '.Chamber 806 makes the light that sends from angle in a big way can pass aperture diaphragm 804 ' effusion.This bigger scope is provided for brighter image and bigger visual angle.
The shutter assembly of describing among Fig. 1 and Fig. 3-8 relies on the electrostatic force start.A plurality of alternative alternative actuator force application mechanisms can design in the shutter assembly, include, without being limited to use electromagnetic actuator, thermoelasticity actuator, piezoelectric actuator and electrostriction actuator.Can use other shutter motions of controllably blocking aperture diaphragm to include, without being limited to slip, rotation, bending, pivot, hinge movement or flutter (flapping); All motions or in the plane of this reflective surface will or transverse to this surface.
Fig. 9 is based on the cross-sectional view of the spatial light modulator 900 of liquid crystal.The array 901 that comprises liquid crystal cells 902 based on the spatial light modulator 900 of liquid crystal.Liquid crystal cells 902 is included in 904 pairs of opposed transparency electrodes on the either side of a layer of liquid crystal molecule 906.On a side of liquid crystal array 901, comprise polarizer 908 based on the optical modulator 900 of liquid crystal.On the offside of array 901, comprise analyzer 910 based on the spatial light modulator 900 of liquid crystal.If thereby not interfere, the light that passes polarizer 908 can be interdicted by analyzer 910 with filtering.In addition during voltage, the liquid crystal molecule 906 between the electrode 904 self aligns with the electric field that is drawn, and redirects the light that passes polarizer 908 between transparent electrode 904, thereby it can pass analyzer 910.Polarizer 908 places on the top on front-reflection property surface 911, and this forms a plurality of light transmission regions 913.Array 901 is attached to such as on the optics cavity of optics cavity 200 and comprise cover plate 912.Cover plate will be described with reference to Figure 11 in further detail.
Each liquid crystal cells 902 can have corresponding red, green or blue specific filter.As alternative replacement scheme, a plurality of lamps of the sequential working that can describe with reference to figure through preamble provide aberration.
Most of LCDs (LCD) are designed to have the resolution ratio of 80 to 110 points of per inch, and pixel wide is in 250 to 330 microns scope.In such LCD display, promptly use active matrix or thin film transistor (TFT) (TFT) addressing or switching, the transmittance of this LCD is in 75% to 90% scope.Yet; For the high-resolution applications (for example to file display or the projection display) of desirable resolution ratio at 300 to 500 points of per inch; And be merely in pixel under the situation of 50 micron diameters, the required expense of TFT addressing may be limited to 30% to 50% to available transmittance.Therefore, because loss aperture diaphragm ratio, such high resolution display typically suffers lower illumination efficiency than the corresponding display of its low resolution.Optics cavity through using preamble to describe constitutes LCD, even in high-resolution LCD display, also can obtain higher illumination efficiency.
Figure 10 is first cross-sectional view based on the spatial light modulator 1000 of shutter according to illustrative embodiment of the present invention.Optical modulator 1000 based on shutter comprises light modulator arrays 1002, optics cavity 1004 and light source 1006.Optical modulator array 1002 can comprise any shutter assembly 300,300 ', 300 that preamble is described in Fig. 3-8 ", 300 " ', 400,500,600,700,800 or 800 '.In this first spatial modulator 1000 based on shutter, optics cavity 1004 forms by having the photoconduction 1008 of front surface with the surface, back.Front-reflection property surface 1010 directly is deposited on the front surface of photoconduction 1008 and second reflective surface will 1012 directly is deposited on the back surface of photoconduction 1008.
Photoconduction 1008 can use glass or the transparent plastic such as Merlon or polyethylene to form.Photoconduction 1008 be about 300 microns thick to 2mm.Photoconduction 1008 is evenly distributed in the light 1014 that is introduced in the optics cavity 1004 on the surface on front-reflection property surface 1010 basically.Photoconduction 1008 reaches such distribution by means of one group of inner total reflection and through scrupulous ground arranged light dispersing element 1016.Light-scattering component 1016 can be formed in the rear side of photoconduction 1018 or on, be guided out light 1014 again photoconduction 1008 and pass the light transmission region 1019 that is formed in the front-reflection property surperficial 1010 with auxiliary.
Figure 11 is second cross-sectional view based on the spatial light modulator 1100 of shutter according to illustrative embodiment of the present invention.As first comprising light modulator arrays 1102, optics cavity 1104 and light source 1106 based on the optical modulator 1100 of shutter among Figure 10 based on the spatial light modulator 1000, the second of shutter.In addition, second spatial light modulator comprises a cover plate 1108.
In an implementation, can on cover plate 1108, deposit the chromatic filter of allyl resin for example or vinyl form.This filter can deposit to be similar to the mode that is used to form black matrix 1110, but the substitute is, and this filter is patterned at open aperture diaphragm light transmission region 1116 tops of optics cavity 1104.This resin red, green or blue pigment that can alternately mix.
Interval between optical modulator array 1102 and the cover plate 1108 is lower than 100 microns, and may diminish to 10 microns perhaps below 10 microns.Except that certain situation, at predetermined point, optical modulator array 1102 does not preferably contact with cover plate 1108, because the work of contact possibility stray light modulation array 1102.This can keep by means of pad or the post that 2 to 20 microns high photoetching form at interval; This pad or post place between each correct modulator of light modulator arrays 1102, and perhaps this metallic plate pad that can insert through the edge around the device of this combination at interval keeps.
Figure 12 A is the 3rd cross-sectional view based on the spatial light modulator 1200 of shutter according to illustrative embodiment of the present invention.The 3rd spatial light modulator 1200 based on shutter comprises optics cavity 1202, light source 1204 and light modulator arrays 1206.In addition, the 3rd spatial light modulator 1204 based on shutter comprises cover plate 1207, the cover plate of for example describing with reference to Figure 11 1108.
In the 3rd optical modulator 1200 based on shutter, optics cavity 1202 comprises the part towards the rear that photoconduction 1208 and light are transferred array 1206.Optical modulator array 1206 is formed on the substrate 1210 of himself.Photoconduction 1208 and substrate 1210 both each all respectively have front side and rear side.Light modulator arrays 1206 is formed on the front side of substrate 1210.With the form of second metal level, the back reflection property of face forward surface 1212 is deposited on the rear side of photoconduction 1208, to form second reflective surface will of optics cavity 1202.As alternative replacement scheme, optics cavity 1202 comprises the rear that is positioned at photoconduction 1208 and basic side the 3rd surface to the rear side of photoconduction 1208.In such implementation, face forward, rear reflective surface 1212 is deposited on the 3rd surface of front portion of space-oriented optical modulator 1200, be replaced on the rear side that directly is deposited on photoconduction 1208.Photoconduction 1208 comprises a plurality of light-scattering components 1209, the light-scattering component of for example describing with reference to Figure 10 1016.Such as the situation among Figure 10, this light-scattering component with predetermined graphical distribution photoconduction 1208 on the side at rear on whole optics cavity, to produce even light distribution more.
In an implementation, photoconduction 1208 keeps to such an extent that closely contact each other with substrate 1210.They preferably form with the material with similar index of refraction, thereby on its interface, avoid reflection.Keep photoconduction 1208 and substrate 1210 spaced apart at the medium and small bearing of another implementation or gasket material with predetermined spacing, thereby photoconduction 1208 and substrate 1210 decoupling optically each other.Photoconduction 1208 and the substrate 1210 spaced apart air gaps 1213 that are formed between photoconduction 1208 and the substrate 1210 that cause.This air gap promotion in the lip-deep inner total reflection of its face forward, promotes the distribution of light 1214 in this photoconduction before thereby at light-scattering component 1209 light 1214 is pointed to optical modulator array 1206 shutter assemblies in photoconduction 1208.As alternative replacement scheme, this gap between photoconduction 1208 and substrate 1210 can be filled with vacuum, one or more gas of choosing or liquid.
Figure 12 B is the 4th cross-sectional view based on the spatial light modulator 1200 ' of shutter according to illustrative embodiment of the present invention.Spatial light modulator 1200, the four spatial light modulators 1200 ' as Figure 12 A comprise optics cavity 1202 ', light source 1204 ', optical modulator array 1206 ' and cover plate 1207 ', the cover plate of for example describing with reference to Figure 11 1108.Optics cavity 1202 ' is included in the back reflection property surface 1212 ' of the reflective surface will towards the rear, photoconduction 1208 ' and face forward in the optical modulator array 1206 '.Light modulator arrays 1206 ' as in the 3rd spatial light modulator 1200, the four spatial light modulators 1200 ' is formed on the substrate 1210 ', and this substrate separates with photoconduction 1208 '.
In the 4th spatial light modulator 1200 ', photoconduction 1208 ' was opened by diffuser 1218 and brightness enhancement film with substrate 1210 ' in 1220 minutes.Scatterer 1218 helps the optical angle of the light 1214 ' of randomization scattering to form phantom image to improve uniformity and to reduce from light source 1204 or optical modulator array 1206.In an implementation, brightness enhancement film 1220 comprises the array of optical prism, and this optical prism is molded as thin plastic sheet, and plays a part to be gathered into narrow illumination circular cone to light.Brightness enhancement film 1220 will pass light that light transmission region 1222 the leaves photoconduction 1208 ' beholder that leads again with the angle that tilts, thereby cause the brightness of identical input power lower edge optical axial obviously to increase.
Figure 12 C is the 5th spatial light modulator 1200 based on shutter according to illustrative embodiment of the present invention " cross-sectional view.Spatial light modulator 1200 as Figure 12 A; The 5th spatial light modulator 1200 based on shutter " comprise an optics cavity 1202 ", a light source 1204 ", an optical modulator array 1206 " and a cover plate 1207 ", the cover plate of for example describing 1108 with reference to Figure 11.Optics cavity 1202 " be included in optical modulator array 1206 " in the reflective surface will towards the rear, a photoconduction 1208 " and the back reflection property surface 1212 of a face forward ".As in the 3rd spatial light modulator 1200, the five spatial light modulators 1200 " optical modulator array 1206 " be formed on substrate 1210 " on, this substrate and photoconduction 1208 " separate.
In the 5th spatial light modulator 1200 " in, photoconduction 1208 " and substrate 1210 " opened in 1224 minutes by microlens array.Microlens array 1224 will pass light transmission region 1222 ' with the angle that tilts and leave photoconduction 1208 " the light beholder that leads again, thereby cause the brightness of identical input power lower edge optical axial obviously to increase.
In addition; Because in the 5th spatial light modulator 1200 based on shutter " in; light modulator arrays 1206 " be formed on himself substrate 1210 " on; with photoconduction 1208 " separate photoconduction 1208 " can use mouldable plastics to constitute, not can be used for constituting optical modulator array 1210 and do not limit " the plastics of manufacturing process cross degree warm in nature.Thereby, can molded light guide 1208 " and with basically the light source that is used for introducing light 1204 " be encapsulated in optics cavity 1202 ".Light source 1204 " be encapsulated in photoconduction 1208 " in light 1214 is provided " to photoconduction 1208 " and in the improvement that is coupled.Similarly, dispersing element 1209 ＂ can directly be incorporated in photoconduction 1208 " mould in.
Figure 12 D is the 6th spatial light modulator 1200 based on shutter according to illustrative embodiment of the present invention " ' cross-sectional view.Spatial light modulator 1200 as Figure 12 A; The 6th spatial light modulator 1200 based on shutter " ' comprise an optics cavity 1202 " ', a light source 1204 " ', a light modulator arrays 1206 " ' and a cover plate 1207 " ', the cover plate of for example describing 1108 with reference to Figure 11.Optics cavity 1202 " a reflective surface will, a photoconduction 1208 in ' be included in optical modulator array 1206 " ' towards the rear " the back reflection property surface 1212 of a face forward ', " ', scatterer 1218 " ' and a brightness enhancement film 1220 " '.
At optical modulator array 1206 " ' and cover plate 1207 between the space fill with lubricant 1224, such as the lubricant of describing with reference to Fig. 3 D.Cover plate 1207 " ' be attached to admittedly on the shutter assembly 1206 with epoxy resin 1225.This epoxy resin should have and is preferably lower than about 200 ℃ solidification temperature, and it should have the thermal coefficient of expansion that is preferably lower than every degree centigrade of 50ppm and should be humidity.The epoxy resin of example is the EPO-TEK B9021-1 that is sold by EpoxyTechnology company.This epoxy resin also plays seal lubrication agent 1224.
Sheet metal or molded plastic assembly support 1226 around the edge cover plate 1207 " ', optical modulator array 1206 " ' and optics cavity 1204 " ' keep together.The fastening rigidity of assembly support 1226 usefulness screws or tenon sheet with the device that increases this combination.In some implementations, through epoxy resin pouring composition with light source 1204 " ' be molded in the appropriate location.
Figure 13 is the 7th cross-sectional view based on the spatial light modulator 1300 of shutter according to illustrative embodiment of the present invention.The 7th spatial light modulator 1300 based on shutter comprises a substrate 1302 and photoconduction 1306, on this substrate, forms an optical modulator array 1304.Optical modulator array 1304 comprises a front-reflection property surface of the optics cavity 1310 of spatial light modulator 1300.A kind of reflective material deposition perhaps sticks to the rear side of this photoconduction, to play back reflection property surface 1308.The rear side of photoconduction 1306 is made the angle, perhaps with respect to the front side moulding of photoconduction 1308 to promote the even distribution of light in optical modulator array 1304.Yet back reflection property surface 1308 is but still partly in the face of front-reflection property surface.
Figure 14 A is the cross-sectional view according to the another kind of spatial light modulator 1400 of illustrative embodiment of the present invention.This spatial light modulator 1400 comprises a substrate 1402, on this substrate, forms an optical modulator array 1404.Optical modulator array comprises the reflective surface will as the front-reflection property surface 1405 of optics cavity.Spatial light modulator 1400 also comprises the back reflection property surface 1406 of basic side to the rear side of optical modulator array 1404.Light source 1408 places the substrate 1402 that forms optical modulator array 1404 above that and the space between the back reflection property surface 1406.The plastics with substantially transparent can also be filled in this space, and light source 1408 is embedded in the plastics of this substantially transparent.
Figure 14 B is the cross-sectional view of another spatial light modulator 1400 ' that is similar to the spatial light modulator 1400 of Figure 14 A.This spatial light modulator 1400 ' comprises a substrate 1402 ', on this substrate, forms an optical modulator array 1404 '.Optical modulator array 1404 ' comprises the reflective surface will as the front-reflection property surface 1405 of optics cavity.Spatial light modulator 1400 ' also comprises back reflection property surface 1406 '.Back reflection property surface 1406 ' be make corrugated, do veined, perhaps be shaped to promotion by this reflective surface will (be back reflection property surface 1406 ' with the optical modulator array 1404 ' that is combined to spatial light modulator 1400 ' in reflective surface will) distribution of light in the optics cavity that forms.
Figure 15 is the cross-sectional view that light is transferred the another kind of shutter assembly 1500 of array that is used for according to illustrative embodiment of the present invention.Shutter assembly 1500 comprises a row metal level 1502, two column electrode 1504a and 1504b, a shutter 1506, is structured on the substrate 1509.Shutter assembly 1500 also comprises one or more light-scattering component 1508.As other implementations, pass row metal level 1502 etching aperture diaphragms 1510 at above-mentioned shutter assembly.Light-scattering component 1510 can comprise the shape of substrate 1509 or any change of how much states, for example through alligatoring, apply the perhaps surface of treatment substrate 1509.For example, light-scattering component can comprise that yardstick is at the about 1 remaining thing of composition to about 5 microns row metal 1502.Light-scattering component 1508 helps to extract owing to inner total reflection is captured in the light 1512 in the substrate 1508.When the light 1512 that is hunted down like this shines one of dispersing element 1508 last time, the angle of the light path of light 1512 changes.If it is sufficiently sharp-pointed that the angle of the light path of light 1512 becomes, it will pass substrate 1509.If shutter 1506 is in open position, the light 1512 of scattering just can pass aperture diaphragm 1510, and proceeds to the beholder as the part of image.
Figure 16 is the cross-sectional view according to the another spatial light modulator 1600 of illustrative embodiment of the present invention.Spatial light modulator 1600 comprises on the rear reflective surface that is formed on substrate 1604, in the face of the inner optical modulator array 1602 of optics cavity 1606.Each optical modulation element 1608 of forming optical modulator array 1602; The shutter assembly 300,300 ', 300 of explanation in Fig. 3-8 for example ", 300 " ', 400,500,600,700,800 and 800 ' or Fig. 9 in the liquid crystal cells 902 described; All be modified, with the side of putting upside down reflection or light absorbing optical modulation element 1608 comparing of describing with reference to Fig. 4 and Fig. 5.
Optics cavity 1606 comprises front-reflection property surface 1610, back reflection property surface 1612 and photoconduction 1614.Introduce light in the optics cavity by light source 1613.Front-reflection property surface 1610 is disposed on the surface of face forward of photoconduction 1614, and a basic continuous high reflectance layer is provided, and definite light transmission region 1616.Front-reflection property surface 1610 was opened by transparent gap 1618 and optical modulator array in 1602 minutes.Gap 1618 is preferably than the narrow width of light transmission region, and is for example narrow about 100 microns.Gap 1618 can be too narrow to about 10 microns wide, perhaps even narrower.
In an implementation, gap 1618 can be filled with lubricant 1612, for example with reference to the described lubricant of Fig. 3 D.Lubricant 1620 can have the index of refraction that the index of refraction with photoconduction 1614 matees basically, to promote extracting light from photoconduction 1614.
Spatial light modulator 1600 can be abandoned cover plate alternatively because this shutter assembly by substrate 1604 around protection.If the omission cover plate can apply black matrix, for example the black matrix 1110 of Figure 11 on the surface of the face forward of substrate 1604.
Figure 17 is the cross-sectional view that can be incorporated into the Transflective property shutter assembly 1700 in the space light modulator of describing among Figure 10-15 1000,1100,1200,1300,1400 and 1500 according to illustrative embodiment of the present invention.Transflective property shutter assembly 1700 usefulness form image by the light and 1,703 two of the surround lightings of the light emitted that places shutter assembly 1700 rears.Transflective property shutter assembly 1700 comprises a row metal level 1702, two column electrode 1704a and 1704b and shutters 1706.Transflective property shutter assembly 1700 comprises and passes row metal level 1702 etched aperture diaphragms 1708.The yardstick of row metal level 1702 is stayed on the surface of aperture diaphragm 1708 in about 1 to 5 micron part, to play Transflective property element 1710.A light absorping film 1712 covers the top surface of shutter 1706.
When this shutter is in the position of closing, the surround lighting 1703 that light absorping film 1712 absorbs on the top surface that is radiated at shutter 1706.When shutter 1706 was in the position of the opening shown in Figure 17, the shutter assembly 1700 of Transflective property passed this transmittance shutter assembly through the light 1701 that both allows to come from special light source and also allows to come from institute's reflected ambient and pass this Transflective property shutter assembly and work to forming image.The small size of Transflective property element 1710 causes some random figure of surround lighting 1703 reflections.
Transflective property shutter assembly 1700 covers with a cover plate 1714, and this cover plate comprises black matrix 1716.Should deceive matrix absorption light, thereby stop surround lighting 1703 basically, only if surround lighting 1703 is opened in the aperture diaphragm that is never covered 1708 reflections to beholder's reflected back.
Figure 18 is the cross-sectional view according to the second Transflective property shutter assembly 1800 in the space light modulator 1000,1100,1200,1300,1400 and 1500 that can be incorporated into explanation among Figure 10-15 of illustrative embodiment of the present invention.Transflective property shutter assembly 1800 comprises a row metal level 1802, two column electrode 1804a and 1804b and shutters 1806.Transflective property shutter assembly 1800 also comprises and passes row metal level 1702 etched aperture diaphragms 1808.The yardstick of row metal level 1802 is stayed on the surface of aperture diaphragm 1808 to about 20 microns at least a portion about 5, plays Transflective element 1810.Light absorping film 1812 covers the top surface of shutter 1806.When this shutter is in the position of closing, the surround lighting 1803 that light absorping film 1812 absorbs on the top surface that is radiated at shutter 1806.When shutter 1806 was in open position, the element 1810 of Transflective property was radiated at the surround lighting 1803 on the aperture diaphragm 1808 to beholder's reflected back part.Compare with Transflective property element 1710, the bigger yardstick of Transflective property element 1810 produces more a plurality of specific reflective-modes, thereby basically directly comes from the surround lighting at this beholder rear to this beholder's reflected back.
Transflective property shutter assembly 1800 covers with a cover plate 1814, and this cover plate comprises black matrix 1816.Should deceive matrix absorption light, thereby stop surround lighting 1803 basically, only if the aperture diaphragm that surround lighting 1803 is never covered 1808 reflections are opened to beholder's reflected back.
Referring to Figure 17 and 18 liang of figure; Even the Transflective property element 1710 and 1810 that is arranged in aperture diaphragm 1708 and 1808 is arranged, surround lighting 1703 and 1803 some parts still pass corresponding Transflective property shutter assembly 1700 and 1800 aperture diaphragm 1708 and 1808.When Transflective property shutter assembly 1700 and 1800 is incorporated in the spatial light modulator of describing like preamble with optics cavity and light source, the surround lighting 1703 that passes aperture diaphragm 1708 and 1808 and 1803 these optics cavity of entering and with by the light of this light source introducing by utilization again.In alternative alternative Transflective property shutter assembly, the aperture diaphragm in this row metal level is filled the material with half reflection property half transmitting property at least in part.
Figure 19 is the cross-sectional view according to the front-reflection property shutter assembly 1900 of illustrative embodiment of the present invention.Front-reflection property shutter assembly 1900 can be used in the reflective light modulation array.Front-reflection property shutter assembly 1900 is to beholder's reflect ambient light 1902.Thereby the array that in spatial light modulator, uses front-reflection property shutter assembly 1900 has been got rid of when in the environment with a large amount of surround lightings 1902, observing the needs to the light source of special use.Front-reflection property shutter assembly 1900 can be taked the shutter assembly 300,300 ', 300 explained among basic and Fig. 3-8 ", 300 " ', 400,500,600,700,800 or 800 ' identical form.Yet, being replaced in the shutter assembly 300,400,500,600,700 of the aperture diaphragm that comprises that permission light passes through or 800 row metal level, this row metal level comprises the reflective surface will of the below, position that is in the shutter 1904 of closing.The layer of reflectivity shutter assembly 1900 forefronts comprises being applied to the front surface of shutter 1904 in the light absorping film 1908 at least.Thereby when closing shutter 1904, the light 1902 that is radiated on the reflectivity shutter assembly 1900 is absorbed.When open shutter 1904, at least a portion that is radiated at the light 1902 on the reflectivity shutter assembly 1900 from the row metal level that exposes 1910 towards the beholder to back reflective.As alternative replacement scheme, row metal level 1910 can be coated with absorbing film, and the front surface of shutter 1908 can be overlying in the reflective membrane.In this way only when closing this shutter just towards this beholder to back reflective light.
As other shutter assemblies and the optical modulator of preamble explanation, reflectivity shutter assembly 1900 can cover the cover plate 1910 that applies black matrix 1912 on it to have.Black matrix 1912 cover cover plates 1910 not with the opposed part in the release position of shutter.
Figure 20 is the equal proportion diagram of spatial light modulator 2000 according to comprising of illustrative embodiment of the present invention of a plurality of optical modulator array 2002.The size of above-described several optical modulator array 2002 to a certain extent, is benefited from the restriction of the semiconductor fabrication that constitutes them.Yet photoconduction 2004 can form in much bigger significantly scale with reflective membrane 2006.Comprise that a plurality of spatial light modulators that are arranged in the optical modulator array 2002 that one or more photoconduction 2004 tops are adjacent to arrange can produce bigger image, thereby avoided these restrictions.
As stated, the shutter assembly in the disclosed in front shutter assembly can be controlled by active matrix.Figure 21 A is the notion diagram that is suitable for being included in the active gating matrix 2100 in the address pixel array 2140 in the display unit 100 (" array 2140 ").Each pixel 2101 comprises flexible shutter assembly 2102, such as the shutter assembly 122 of Fig. 1 C, by actuator 2103 controls.Each pixel also comprises an aperture diaphragm layer 2150 that aperture diaphragm hole 2154.Can adopt shutter assembly with control this shutter assembly circuit other electric and mechanical configurations and do not depart from the scope of the present invention.
Gating matrix 2100 can manufacture a kind of lip-deep diffusion of the substrate 2104 that forms shutter assembly 2102 above that or the circuit of thin film deposition.Gating matrix 2100 comprises the scan line interconnection 2106 and the data interconnect 2108 that is used for every row pixel 2101 of gating matrix 2100 of the every capable pixel 2101 that is used for gating matrix 2100.Each scan line interconnection 2106 is electrically connected to the pixel 2101 in the corresponding pixel column 2101 writing enable voltage source 2107.Each data interconnect 2108 is electrically connected to the pixel 2101 in the corresponding pixel column 2101 to data voltage source (" Vd source ") 2109.In gating matrix 2100, data voltage Vd provides the major part of the energy of start shutter device 2102 needs.Thereby the start voltage source is also played in this data voltage source 2109.
Figure 21 B is the isometric map of a part that comprises the pel array 2140 of gating matrix 2100.Referring to Figure 21 A and 21B, for each pixel 2101 or each shutter assembly in the pel array 2140, gating matrix 2100 comprises transistor 2110 and capacitor 2112.The grid of each transistor 2110 is electrically connected to the scan line interconnection 2106 of the row of the array 2140 that pixel 2101 is arranged in.The source electrode of each transistor 2110 is electrically connected to its corresponding data interconnect 2108.The actuator 2103 of each shutter assembly all comprises two electrodes.One of electrode of the drain electrode of each transistor 2110 and corresponding capacitor 2112 is electrically connected parallelly connectedly and is connected to one of electrode of corresponding actuator 2103.Another electrode of capacitor 2112 and another electrode of actuator 2103 are connected to a common potential or earth potential.
At work, in order to form image, gating matrix 2100 is through apply voltage V to each scan line interconnection 2106 successively
WeSequentially write each row that enables in the array 2140.For writing the row that enables, the grid of the transistor 2110 of the pixel in this row 2101 is applied V
WeMake electric current can pass through data interconnect 2108 and flow through this transistor, apply electromotive force with actuator 2103 to shutter assembly 2102.When this row is write when enabling data voltage V
dOptionally be applied on the data interconnect 2108.In the implementation of analog gray scale is provided, is positioned at these pixel 2101 brightness of writing the scan line interconnection 2106 that enables and the intersection point place of data interconnect 2108 and changes the data voltage that puts on each data interconnect 2108 explicitly with desirable.In the implementation of digital control scheme was provided, this data voltage was selected as or the relative voltage of amplitude (promptly closely voltage) or equal or exceed V
At(start threshold voltage).In response to data interconnection 2108 is applied voltage V
At, the actuator start in the corresponding shutter assembly 2102 is opened in the shutter in the shutter assembly 2102.Even putting on the voltage of data interconnect 2108 stops to apply voltage V to row in gating matrix 2100
WeAlso keep later on and be stored in the capacitor 2112 of pixel 2101.Therefore need not wait for and keep the voltage V on the row
MePermanent to being enough to start shutter assembly 2102; Such start can begin to carry out after this writes enable voltage from the row removal.Voltage in the capacitor 2112 in the row stores into basically always to be write till complete the frame of video, and in some implementation, store into always this row write new data till.
In various implementations, the actuator that shutter assembly is corresponding with it can be made into bistable together.In other words, the shutter in the shutter assembly may reside in the position (for example open or close) of two balances, and any is only required a spot of power or does not require power fully they remain in two positions.More specifically, shutter assembly can be that machinery is bistable.In case, do not require electric energy or keep voltage to keep this position the shutter set of shutter assembly.Mechanical stress on the physical component of this shutter assembly can keep this shutter in position.
The actuator that shutter assembly is corresponding with it can also be made electric bi-stable together.In the shutter assembly of an electric bi-stable; There is a voltage that is lower than the start voltage of this shutter assembly; If be applied to an actuator of closing (this shutter or opening simultaneously or close) to this voltage; Keep this actuator to close and keep this shutter on the throne, though on this shutter the opposite power of effect.This opposite power can be passed through a spring, and perhaps this corresponding power can be passed through an opposed actuator effect, for example " opens " and perhaps " closes " actuator.
The pixel 2101 of array 2140 is formed on the substrate 2104.This array comprises and is arranged in this on-chip aperture diaphragm layer 2150 that this aperture diaphragm layer comprises one group of aperture diaphragm hole 2154 of each pixel 2101 in the array 2140.Align with shutter assembly 2102 in each pixel in aperture diaphragm hole 2154.
Matrix 2140 can be through pressing following sequence of steps manufacturing.At first on transparent substrate 2104, deposit and aperture diaphragm layer 2150 of composition.Then make this gating matrix, comprise the array of thin film switch or transistor 2110 at the top of aperture diaphragm 2150, together with capacitor 2112 and interconnection, such as scan line interconnection 2106 or data interconnect 2108, make together.The technology that is used for making transistor 2110 and capacitor 2112 can be to make typically known technology in the technical field of the active matrix array that LCD uses.In last step, form little-electromechanical (perhaps MEMS) shutter assembly at the top of this thin film switch array.
In a simple implementation, this aperture diaphragm layer 2150 insulate through dielectric layer and this gating matrix between two parties.Aperture diaphragm layer 2150 can comprise the thin-film material of processing with the active matrix that will make above it compatiblely, but need not be electrically connected to this active matrix.Aperture diaphragm hole 2154 totally can be circle, ellipse, polygon, spirality or irregularly shaped in shape.
In another implementation, aperture diaphragm layer 2150 is electrically connected to this gating matrix.This connection can pass that crossing of between two parties dielectric layer is logical carries out by means of etching, electrically contacts thereby make interconnection in this gating matrix cause this aperture diaphragm layer.If aperture diaphragm layer 2150 comprises conductive material, so it just can play the effect of base plane or common interconnect to this gating matrix.
In other implementations of this display, the aperture diaphragm layer that separates need be as the first step manufacturing in the sequence.The ground that replaces can be used in and make the identical thin-film material that uses in active matrix or the passive matrix and directly the aperture diaphragm layer is manufactured on the glass substrate with identical procedure of processing, as typically known in the affiliated field.Only need to change mask design or pixel layout, to adapt to the formation in aperture diaphragm hole.
In another implementation, this aperture diaphragm layer is as the last step manufacturing in the processing sequence.Attached to the top that still is suspended on this shutter assembly on this substrate generally, the below slot milling is used for the free displacement of this shutter assembly to this aperture diaphragm layer rigidly.
Figure 22-30 relates to the additional display unit based on MEMS.Particularly, the shutter device based on MEMS of Figure 22-30 comprises concentrator.Figure 22 is the equal proportion notion diagram according to the reflection display device A10 of illustrative embodiment of the present invention, and this reflection display device comprises the array A100 (being also referred to as " optical modulator array A100 ") of optical modulator, the array A150 (being also referred to as " optically focused array A150 ") of concentrator.As alternative replacement scheme, display unit A10 can form Transflective property or radioparent display.These embodiments will further be described with reference to Figure 29 and Figure 30.Optical modulator array A100 comprise by row and column (although can also adopt the segmentation that does not have row and column display and without departing from the spirit and scope of the present invention) a plurality of shutter assembly 102a-102u (general designation " shutter assembly A102 ") of arranging.Generally, shutter assembly A102 has two states, promptly opened state and closing state (although can adopt partly open to invest gray scale, for example will below in that kind of explanation in further detail).Each shutter assembly A102 comprises shutter A112, is used for optionally covering the corresponding surfaces A that exposes 114.Shutter assembly A102a-c, A102e-m and 102p-u are in opened state, are exposed to the light that passes optically focused array A150 to its corresponding surfaces A that exposes 114.Shutter assembly A102d, A102n and A102o are in closing state, block to pass optically focused array A150 and be radiated at the light on its corresponding surfaces A that exposes 114.Generally, device A10 optionally sets the state of shutter assembly A102, to come to the face A103 reflected back that is used to form image A 104 and the light beam of the environment light source A107 of beholder's homonymy (for example can also referring to Fig. 7).As alternative replacement scheme, be replaced in environment at device A10, can light source A107 be provided with integrated preceding light.
In one embodiment of the invention, each shutter assembly A102 of optical modulator array A100 can be corresponding to the image pixel A106 in the image A 104.As stated, each shutter assembly A102 comprises shutter A112 and the surfaces A 114 that can expose.In an implementation, the surface of facing the shutter A112 of light source A107 is reflexive, and the surfaces A 114 that can expose is light absorption.For the pixel of throwing light on, shutter A12 closes with to surfaces A 103 reverberation at least in part.Surfaces A 114 reverberation that in an alternative alternate embodiment, can expose in the face of the surperficial absorbing light of the shutter A112 of light source A107.In this implementation, pixel A106 is the brightest when shutter A112 is open fully, and the darkest when shutter A112 closes fully.
In each alternate embodiment, display unit A10 can adopt a plurality of shutter assembly A102 to each image pixel A106.For example, this display unit can comprise three or four shutter assembly A102 that color is proprietary by every image pixel A106.Through optionally opening the corresponding proprietary shutter assembly A102 of one or more color with specific pixel A106, this display unit can produce the colour element A106 in the image A 104.In another example, display unit A10 comprises shutter assembly A102, and this shutter assembly can be used to provide to a plurality of parts of every pixel A 106 open or closed condition, so that the gray scale in the image A 104 to be provided.
The surfaces A 114 that can expose can be in every way with film, deposit or any other suitable material or its combination or its disappearance, reflection or absorbing light, and this depends on the implementation of desirable shutter assembly A102.Similarly, each shutter A112 can be provided with from it reverberation or in it light absorbing surface, thereby the surfaces A that exposes that is associated with it 114 combines, and like institute's hopes, correctly reflects perhaps absorbing light by assembly A102 to the beholder.Some materials will further describe with reference to Figure 23 like this.In other more another implementation; Display unit A10 can comprise other forms of optical modulator; For example micro mirror, filter, polarizer, liquid crystal modulation unit, interferometer and other proper device are used to replace shutter assembly A102 light modulated and form image.
Optically focused array A150 comprises the array of optical element; Be used for gathering each optical modulator to light, increase or be radiated at the percentage that shutter A112 went up or be radiated at the surround lighting on the surfaces A 114 that can expose with the position of depending on shutter A112 at light modulator arrays A 100.Can in optically focused array A150, various types of optical elements be provided, for example, comprise the lens of reflexive smooth funnel, high-NA and other nonimaging optics device.In the illustrative embodiment shown in Figure 22, optically focused array A150 comprises the array of reflective light funnel A152.Each funnel A152 is associated with corresponding shutter assembly A102 separately, is used for a specific zone of gathering the shutter assembly A102 corresponding with funnel A152 to the light of launching from environment light source A107.Each reflectivity funnel A152 preferably includes the first open optical A156 that points to surperficial A103, point to the second open optical A154 of its shutter assembly A102 that is associated and be connected to the first open optical A156 wall A158 of the second open optical A154.
Preferably do the size of the first open optical A156 to such an extent that be matched with the size of the pixel A 106 that is associated, and preferably do the size of the second open optical A154 to such an extent that be matched with or be slightly smaller than the size of the surfaces A that exposes 114 of its shutter assembly A102 that is associated.Wall A158 preferably highly reflective and the first open optical A156 be preferably more than the second open optical A154; Thereby with maximum possibility; The environment light beam that comes from environment light source A107 can get into funnel A152 at the first open optical A156 from a wide angular range, and reflexes on the optically focused zone of shutter assembly A102 through the second open optical A154.This has increased the percentage of the operational image of the light that forms the modulation that obtains each shutter assembly A102, thereby improves the contrast of display unit A10.And owing to assemble the surround lighting A107 that has improved percentage at the reflecting element upper hopper of shutter assembly A102, display unit A10 can provide brightness and the illumination efficiency that has increased, and exempts simultaneously backlight and needs secondary power.
Wall A158 can be straight, bending, CPC (compound parabolic gatherer) shape, or its suitable combination that the optics high-effective concentration of surround lighting A107 is provided and draws high fill factor.Wall A158 can be conical, perhaps can comprise a plurality of sides, and this depends on the size and dimension of this funnel open optical.Open optical A154 and 156 can be different shape and size and without departing from the spirit and scope of the present invention.For example, open optical A156 can be hexagonal, and open optical A154 can be circular.Wall A158 can be provided with reflexive inner surface or be provided with transparent inner surface and external reflectance property coating (describing in more detail with reference to Figure 26 A-27C like hereinafter).
Figure 23 is the cross-sectional view of one of shutter-funnel assemblies of the combination of Figure 22, and the additional characteristic of display unit A10 is shown.Referring to Figure 22 and 23, display unit A10 can also be included in cover plate A109 and the filter array layer A111 between this beholder and the optically focused array A150.Cover plate A109 is used for several functions, comprises that protection optical modulator array A100 does not receive machinery and environmental nuisance.Cover plate A109 can be thin transparent plastic, such as Merlon or sheet glass.In certain embodiments, this cover plate can apply with composition with light absorbing material, be also referred to as black matrix A120.Black matrix A120 can be used as the thick film allyl resin or the vinyl that comprise pigment absorption and is deposited on the cover plate A109.Black matrix A120 can absorb the surround lighting of some incident, thereby increases the contrast of the image A 104 that is formed by device A10.Black matrix A120 can also be as absorbing with the light of revealing or continuous mode of time is overflowed.The top surface A103 of cover plate A109 can be to beholder's display image A104.
In an implementation, can be deposited on the chromatic filter that filter array A111 on the cover plate A109 can comprise allyl resin for example or vinyl form or thin-film dielectric bodily form formula.Filter can deposit to be similar to the mode that is used to form black matrix A120; Yet; The substitute is; This filter is patterned on the first open optical A156 or the second open optical A154 of cone A152 of optically focused array A150, and the shutter assembly A102 special-purpose for color provides suitable chromatic filter.For example, display unit A10 can comprise a plurality of groupings (for example, a red shutter assembly, a green shutter assembly and blue shutter assembly of the shutter assembly A 102 that a plurality of three perhaps a plurality of colors are special-purpose; A red shutter assembly, a green shutter assembly, a blue shutter assembly and a white shutter assembly; A blue or green shutter assembly, a dark red shutter assembly and a yellow shutter assembly or the like.Although-any other quantity and/or color scheme that shutter assembly can be provided is used to form image pixel without departing from the spirit and scope of the present invention), each sub-pixel that makes the special-purpose shutter assembly A102 of color that divides into groups be associated can form image pixel A106.Color sub-pixel more than three can be arranged, to constitute an image pixel completely.Through the special-purpose shutter assembly A102 of one or more color in optionally open and the specific pixel corresponding packet, display unit A10 can produce the image pixel A106 of the various colors of image A 104.
These chromatic filters can use several modes to make.For example, can use abundant known photoetching technique, the step of using when being similar to the parts of the passive matrix of making this shutter and gating matrix or active matrix, the material of the selective absorptivity of composition on the surface of display.Have disperse metal and metal oxide material or more usually the material of special-purpose absorbent material can be photosensitive and can confirm as photoresist.As alternative replacement scheme, such absorbent core can apply with a kind of form of film and follow with abundant known photoetching and etch process composition.And can be on this substrate the film of the interference pattern of composition based thin film layer, for example be used on representational red, indigo plant and green pixel, forming interference light filter.The colorized optical filtering material can also use the organic dyestuff of disperse in the resin of polyethylene propylene acid resin for example etc. to form.
The height of the open optical of funnel A152, thickness, shape and diameter can and be used according to used material and change.When the height of the wall 158 of funnel A152 is compared with the difference in size between open optical A154 and the A156 when very little; The gradient of wall A158 is relatively little (promptly; Wall A158 is basically parallel to surfaces A 103); And funnel A152 action as the back reflective device generally, this is at first not gather light on the reflectivity zone of shutter assembly A102 through reflect most of surround lighting A107 to the beholder.On the other hand; When the height of the wall 158 of funnel A152 is compared with the difference in size between open optical A154 and the A156 when very big; The gradient of wall A158 is relatively big (promptly; Wall A158 is basically perpendicular to surfaces A 103) owing to cause luminous intensity significantly to be lost from the light beam of wall A158 multipath reflection surround lighting A107.In a preferred embodiment, the diameter of the first open optical A156 can be 75 microns to 225 microns scope, and preferably 150 microns; The diameter of the second open optical A154 can be 25 microns to 75 microns scope, and preferably 50 microns; And the height of cone A152 can be 100 microns to 300 microns scope, and preferably 200 microns, the scope that for example draws is from about gradient of 3.5 to 4.
In addition; Lens arra can be provided with lens A157; Be used for focusing on corresponding separately funnel A152 to the surround lighting of sending; Therefore and focus on the shutter assembly A102 that is associated, thereby not only reduced number of times of opening from wall A158 reflection but also the probability (attention) that reduces the back reflective path in order to illustrate the clear lens A157 that among Figure 22, do not illustrate.The lens A157 that is arranged in the first open optical A156 place of funnel A152 can help the light of the oblique incidence that comes from an environment light source A107 guide and optically focused in funnel A152 thereby to the reflector space of shutter assembly A102.For example, the chromatic filter of matrix A 111 can be fixed to the bottom side of lens A157, as shown in Figure 23.As shown in Figure 26, can be as formation lens and optics funnel structure in single molding process.
Colorized optical filtering can also carry out in other positions of display unit A10.Except in cover plate A109, for example, color filter array A111 can be applied to the second open optical A154 place of each reflective light funnel A152.It is preferred especially that this embodiment possibly added in the implementation that is filled with hard transparent optical material (like what will describe in more detail with reference to Figure 26 A-27C) at this funnel A152.Filter array A111 can be alternately at the regional near-end of the reflectivity that is applied to shutter assembly A102.Generally, the filter A111 of filter array can be in the light path of the given pixel between the reflective surface will of surfaces A 103 and shutter assembly A102 any place.
Reflectivity wall A158 has and is higher than about 50% reflectivity.For example, reflectivity wall A158 can have 70%, 85%, 92%, 96% or higher reflectivity.More smooth substrate and meticulousr powdered-metal can produce more high reflectance.Smooth surface can obtain through the form that is molded as plastics smooth wall.Do not have the fine powder metal film of inclusion to form through multiple gas phase deposition technology, these technology comprise splash, evaporation, ion plating, laser ablation or chemical vapour deposition (CVD).This reflectivity is used effective metal include, without being limited to Al, Cr, Au, Ag, Cu, Ni, Ta, Ti, Nd, Nb, Rh, Si, Mo and/or its any alloy or combination.
As replacement scheme, reflectivity wall A158 can form with mirror, such as the dielectric somascope.The dielectric somascope manufactures the storehouse of dielectric substance film, and this dielectric substance film replaces between high and low index of refraction material.The part of incident light is reflected from each interface of index of refraction change.Through having the clean reflective surface will that surpasses 98% reflectivity to the THICKNESS CONTROL of dielectric layer to certain fixing mark of this wavelength or multiple and through increasing reflection, can making from a plurality of parallel interfaces.Some dielectric somascope has the reflectivity greater than 98.8%.The dielectric somascope can be customization design to accept presetted wavelength scope and predetermined ranges of incidence angles in the visible-range.As long as make the slickness that to control in this dielectric substance film stack the reflectivity above 99% just can be arranged under this condition.For example, this storehouse can comprise 20 to 500 films.
The state of each shutter assembly A102 can use passive addressed scheme control.Each shutter assembly A102 is by a row electrode A 108 and two column electrode A110a (" row open electrode ") and A110b (" row closed electrode ") control.In optical modulator array A100, all the shutter assembly A102 in the given row share single row electrode 108.All shutter assembly A102 in the row share public capable open electrode A110a and public capable closed electrode A110b.
It is described with reference to Figure 21 A and 21B to be similar to preamble, and the active array addressing scheme also is fine.In the voltage condition that active array addressing (wherein through thin film transistor (TFT) array or metal-insulator-metal (" MIM ") diode array control pixel and switched voltage) must keep being applied in the cycle of whole video frame with stable manner is useful.Can have only a column electrode to constitute the realization of source matrix addressing with every capable shutter assembly.
Referring to Figure 22 and Figure 23, shutter assembly A102 is formed on the substrate A116 of glass, silicon or thermoplastic polymer, and other shutter assemblies A102 of this substrate and optical modulator array A100 is shared.Substrate A116 can support nearly 4,000,000 shutter assembly, is arranged in up to about 2000 row with up in about 2000 row.For example use and in an array, to arrange a plurality of substrates for signage.
Optical modulator array A100 with and parts shutter assembly A102 use the micro-processing technology of standard well known in the art to form, comprising: photoetching; Etching technique is removed such as wet chemical etching, dry ecthing and photoresist; The thermal oxide of silicon; Electroplate and electroless plating; Diffusion technique, such as boron, phosphorus, arsenic and antimony diffusion; Ion is implanted; Film deposition, for example evaporation (heated filament, electronics beam, glisten and cover and step covers), splash, chemical vapor deposition (CVD), epitaxy (evaporation mutually, liquid phase and molecular beam), plating, serigraphy and stratification." microelectronics is made introduction (Addison-Wesley publishing company, Reading Mass, 1988) referring to the Jaeger work generally; People such as Runyan work semiconductor integrated circuit technique technology (Addison-Wesley publishing company, Reading Mass, 1988); 1987-1998IEEE microelectromechanical systems proceeding; Rai-Choudhury edits " micro-lithography, little processing and little manufacturing manual (MM) (SPIE optical engineering publishing house, Bellingham, Washington, 1997).
More specifically, the deposited on top multilayer material (typically between metal and dielectric substance, alternately depositing) at substrate forms storehouse.Layer that on this storehouse, adds after one deck or the multilayer material to this storehouse applies composition, and mark is removed or is retained in the material on this storehouse from this storehouse.Then to composition storehouse apply various etching techniques, comprise that wet etching and/or dry ecthing are to remove undesired material.This etch process can also and apply this etched time quantum based on the layer in this etched chemical composition, this storehouse and from the perhaps a plurality of layers of a layer of this storehouse, remove material.This manufacturing process can comprise tiling, composition and etched a plurality of iteration.
This technology also comprises release steps.For the free degree that provides parts in the finished product device, to move, insert expendable material in the storehouse of the material near-end of the moving component in will being formed on the finished product device.Etching or other of short duration (fugitive) phase technology are removed most of this expendable material, thereby make that these parts can freely-movable.
After having discharged,, thereby can when contact, between moving component, not transmit electric charge the surface insulation of this motion shutter.This can through thermal oxide accomplish and/or through the conformal chemical vapour deposition (CVD) such as Al
2O
3, Cr
2O3, TiO
2, HfO
2, V
2O
5, Nb
2O
5, Ta
2O
5, SiO
2, or Si
3N
4And so on insulator accomplish, perhaps through using the deposition techniques materials similar such as ald to accomplish.Through chemical transformation technology, for example to fluoridize or surface that hydrogenation has been insulated, the surface that chemically passivation has been insulated is to prevent such as the problem that between contact surface, rubs.
Two compliance electrode actuator are configured for driving the actuator type that is suitable for of the shutter A112 among the shutter assembly A102.Should be pointed out that and can use other dissimilar actuator, comprise non-pair of compliance electrode actuator, be used for driving shutter assembly A102 shutter A112 and without departing from the spirit and scope of the present invention.Generally, two compliance beam electrode actuator by two or more at least in part the beam of compliance form.At least two of this beam are played electrode (being also referred to as " beam electrode ").In response to applying voltage at beam electrode two ends, this beam electrode attracts each other because of the electrostatic force that draws.Two beams all are compliance at least in part in two compliance beams.In other words, at least some parts of each beam can be deflections or crooked to help sill bolt to together.In some implementations, through comprising that ripple is crooked or the connection of pinning reaches this compliance.Certain part of this beam can be substantially rigid or be fixed on the appropriate location.Preferably, the major part at least of this beam is a compliance.
Two compliance electrode actuator have superiority with respect to other actuator well known in the art.Static comb drives and to be very suitable for long relatively apart from start, but but is merely able to produce weak relatively power.But parallel-plate or flat-topped ridge actuator can produce big relatively power require gap little between this parallel-plate or beam, and therefore only start on relatively little distance.People such as R.Legtenberg (Journal of MicroelectromechanicalSystem v.6, p.257,1997) show to use crooked electrode actuator can how to produce big relatively power and draw big relatively displacement.Yet the desired voltage of initiation start is but still considerably big in the article of Legtenberg.As illustrated in this article, deflection can reduce this voltage through making these two electrodes can both move perhaps.
In a shutter assembly based on two compliance beam electrode actuator, a shutter is couple at least one beam of two compliance beam electrode actuator.Along with one of this beam in this actuator when another beam draws, the beam that is drawn this shutter that also moves.When so carrying out, this shutter moves to the second place from primary importance.In one of these positions, this shutter for example through be not limited to interdict, reflection, absorption, optical filtering, polarization, diffusion or otherwise change characteristic or the light path of this light and interact with light in the light path.This shutter can apply film with reflexive or light absorption to improve its interference pattern.For example; The optical effect complementary mode of the surfaces A 114 that can expose to provide with this shutter, through be not limited to interdict, reflection, absorption, optical filtering, polarization, diffusion or otherwise change characteristic or the light path of this light and interact with light in this light path.
Figure 24 A and 24B are respectively at the plane of open state and buttoned-up status fully according to the shutter assembly A102 of illustrative embodiment of the present invention.Shutter assembly A102 utilizes two compliance beam electrode actuator starts.Referring to Figure 23,24A and 24B; Shutter assembly A102 light modulated with come in and go out through motion shutter A112 controllably between this beholder and the surfaces A 114 that can expose the light path of light form image, this shutter A112 comprises two and half A112a of shutter portion and the A112b that block.When closing, the basic shading light of A112a of shutter portion and A112b makes it not shine on the surfaces A 114 that can expose.In an implementation, being replaced in A112a of shutter portion and A112b is approximate same size, and A112a of shutter portion or A112b be greater than another A112a of shutter portion or A112b, and independently start they.Thereby through optionally open zero, one or whole two A112a of shutter portion and A112b, shutter assembly A102 can be provided for 4 gray levels (for example turn-off, 1/3rd open, 2/3rds open, and standard-sized sheet).
Shutter A112a and A112b each all by one basically the solid on plane form.In fact shutter A112a and A112b can take Any shape, and though be the rule or irregular, thereby in the position of closing, shutter A112a and A112b block the light path of leading to the surfaces A 114 that can expose fully.In addition; Shutter A112a must have the width consistent with the width on this surface that can expose with A112b; Thereby, can absorb or reflect enough light with the deepening or the pixel of throwing light on respectively by the surfaces A that can expose 114 in this open position (as shown in Figure 24 A).
As shown in Figure 24 A and the 24B, each of shutter A112a and A112b (shutter A112) is couple to each the end of two load beam A208.Load support point A210 physically is connected to substrate A122 to load beam A208 in the opposed end of each load beam A208 and is electrically connected to a load beam A208 and is formed on this on-chip drive circuit.Load beam A208 and load support point A210 play mechanical support together, are bearing in shutter A112 the top that is formed at this on-chip surfaces A that exposes 114.
Shutter assembly A102 comprises a pair of drive beam A212 and a pair of drive beam A214, arranges one of along the both sides of each load beam A210 for every pair each one.Drive beam A212 and A214 and load beam A210 form actuator together.Drive beam A212 plays the shutter open electrode, and another drive beam A214 plays the shutter close electrode.Be positioned at drive beam A212 and A214 and physically and electrically be connected to the circuit that forms on the substrate A122 to each drive beam A212 and A214 near the driving strong point A216 and the A218 of the end of shutter A112.In this embodiment, the reservation of other ends of drive beam A212 and A214 and most of length does not receive to support and keeps freely-movable in other words.
Load beam A208 and drive beam A212 and A214 are compliances.In other words, they are enough flexible and flexible, thereby can be them from its (" static ") position or curved shape that does not receive stress to certain available degree at least, and have no significant fatigue or split off.Because load beam A208 and drive beam A212 and A214 are only at one end supported, so the freely-movable in response to applied force of the major part of the length of beam A208, A212 and A214, bending, deflection or deformation.For example, can provide ripple (for example at the ripple A208a on the beam A208) to overcome because the axial stress that the preshrunk weak point of this deflection causes and higher deflection is provided under given voltage.
Display unit A10 is through applying electromotive force start shutter assembly A102 (promptly change the state of shutter assembly A102) from controllable voltage source to drive beam A212 or A214 via its respective drive strong point A216 or A218; The beam A208 that loads simultaneously is conductively coupled to ground or certain different electromotive force, causes producing voltage at the two ends of beam A208, A212 and A214.This controllable voltage source, such as passive or active matrix array driver are via being conductively coupled to load beam A208 like the illustrated passive perhaps active matrix of preamble.Display unit A10 can be additionally or alternatively applies electromotive force via the load support point A210 of shutter assembly A102 to load beam A208, to increase this voltage.Electrical potential difference between drive beam A212 or A214 and the load beam A218, no matter positive and negative or earth potential all will produce electrostatic force between this beam, this makes shutter laterally in this plane of movement, move.
The laying of shutter assembly or pixel arrangement need not be limited to the constraint of square array.Can also use rectangle, prismatic or hexagonal pel array reaches fine and close laying, for example, all these can be used for video and image display colour.
Figure 25 illustrate a kind of shutter assembly lay in the pel array into maximize in the fine and close array aperture diaphragm than and minimize the method for driving voltage.Figure 25 illustrates a kind of a kind of laying A400 of the shutter assembly 102 based on two compliances airtight (zipper) electrode actuator, should be laid in substrate A122 based on shutter assembly of the airtight electrode actuator of two compliances and go up with three shutter assembly A102 formation image pixel A106 of rectangle generally.Three shutter assembly A102 of each pixel A 106 can be independently or are collectively controlled.
Preferably, shutter assembly A102 closely is packaged together, and as far as possible little dead band is arranged betwixt so that the fill factor that has improved to be provided.As shown in Figure 25, can utilize the part of the gap intersection shutter assembly A102 between the adjacent shutter assembly A102.If hope, the intersection arrangement of laying A400 can be mapped to the square arrangement of row and column.As shown in the figure, the repetitive sequence of row A420a, 420b and 420c can each each the sub-pixel of chromatic filter A111 (being respectively red, green and blue for example) is associated with having specifically.Also have, the fork row is included among the single column electrode A430 in two of shutter assembly A102.Should can be used in the hexagon encapsulation that pixel A 106 is provided by interior fork.
In other alternative implementation, display unit A102 can comprise a plurality of (for example between 1 to 10) corresponding surfaces A that exposes 114 and corresponding shutter A112 by every image pixel A106.When changing the state of such image pixel A106, the actuator quantity of excitation can depend on the switched voltage that is applied or be elected to be the particular combination of the row and column electrode of accepting switched voltage.Can also there be some implementations can partly open aperture diaphragm through being provided at the middle switched voltage of minimum and the highest switched voltage with simulated mode.For example, these alternative alternative real implementations provide the improvement means that produce the space gray scale.
The funnel A152 of optically focused array A150 can use very large gang polymer for example acrylic acid, acid imide, acetate and so on, and little molded, embossment of the epoxy resin that solidifies of plastics, glass or UV or fusible pattern casting.Littlely moldedly can comprise the technology that disappears mutually, such as photoetching and etching, perhaps the embossment technology is wherein done anti-graphics in hard material, and then alignment and be pressed into soft material on this surface, and this soft material then can solidify or harden.As replacement scheme, for example can use can photoimaging material, such as the many of Novalac or PMMA or polyimide can be auxiliary crosslinked down or break off its crosslinked polymer and make funnel A152 at light.For example consult Alex Ning on November 17th, 1998, the glass lens of Ph.d etc. is to glass lens: the factor that consider (part that SPIE ' accurate plastics ' short-term training course is annotated); In November, 2005 5-11, the paper of IMECE2005 compilation, little fusible pattern of works such as Julian M.Lippmann is cast molded: the method that is used to produce the injection molding hollow component; With in the plane of pass through polymer fusible pattern casting manufacturing of work such as Julian M.Lippmann in 2005, empty micropin.
Referring to Figure 26 A-26D; In one embodiment; For example can be through at first using Merlon, polyethyl methacrylate, silica alkyl polymer (" PDMS "); Perhaps polyimides or any other suitable material molded filled circles cone A152 and optional lens arrangement form the array A150 (for example referring to Figure 26 A) of funnel A152, then can, preferably from the downside of array A150; On the outside of each cone A152 and lower surface, apply reflective layer (for example referring to Figure 26 B), to form reflexive wall A158.Then polishing falls to be coated in the reflective layer of the bottom of cone A152, with the second open optical A154 (for example referring to Figure 26 C) that each cone is provided.Alternatively; Can be Merlon, polyethyl methacrylate, silica alkyl polymer (" PDMS "); Perhaps polyimides or any other suitable material are provided as the backfill A155 between the cone A152, thereby form single filler piece (for example referring to Figure 26 D) to them.For example, all be formed in the embodiment in the layer at cone A152, lens A157 and cover plate A109, filter array A111 can be located at the second open optical A154 place of each cone A152.
Referring to Figure 27 A-27C; Alternatively in another embodiment; For example; The array of depressions of hollow funnel A152 form can be formed among the sheet A153 of materials A 155 of Photoimageable, and the material of this Photoimageable is the polymer (referring to Figure 27 A) of Novalac or PMMA or polyimides and so on for example.Can be coated in reflective material on the inboard of each depression to form reflexive wall A158 (referring to Figure 27 B) then.At last; And alternatively; Can be for example Merlon, polyethyl methacrylate, silica alkyl polymer (" PDMS "); Perhaps polyimides or any other suitable material are provided as the backfill A159 in the cone A152, thereby form single filler piece (for example referring among Figure 27 C by the zone of dotted line) to them.In an alternative alternate embodiment of this method, can on whole sheet A153, punching out cave in, prevent that reflective material from accumulating in the place, tip of hollow funnel A152, forms second open optical thereby no longer need remove any material.
Figure 28 is the equal proportion partial cross section view according to shutter, funnel and the pixel components of a combination shown in Figure 22 of illustrative embodiment of the present invention, and other characteristics of the display unit A1010 when being implemented as reflection display device A1010 to display unit are shown.Reflection display device A1010 can be with the reflective light modulation array that the array that comprises reflectivity shutter assembly A1102 is arranged.Reflectivity shutter assembly A1102 (notes for simplicity of illustration through filter array A111 and cover plate A109; The part of layer A111 and sheet A109 is not shown in Figure 28; Comprise lens A157) come from the surround lighting (for example, typical environment light beam A702) of environment light source A107 to beholder reflection.
Reflectivity shutter assembly A1102 can take the essentially identical form of shutter assembly A102 with Figure 22-25.Towards the surface, forefront of beholder's reflectivity shutter assembly A1102, comprise the front surface of shutter A1112a and 1112b at least, coating is with light absorping film A1152.Thereby when shutter A1112 closed, the light A702 that is gathered on reflectivity shutter assembly A1102 by funnel A152 was absorbed by film A1152.When shutter A1112 (as shown in Figure 28) during part open at least, at least a portion of gathering the light on reflectivity shutter assembly A1102 through funnel A152 from the reflective surface will A1015 (surfaces A 1114 that for example can expose) that exposed as directional beam to beholder's reflected back.Reflective surface will A1015 can have and is higher than about 50% reflectivity.For example reflective surface will A1015 can have 70%, 85%, 92%, 96% or higher reflectivity.More smooth substrate and meticulousr powdered-metal can produce more high reflectance.Smooth surface can obtain through the form that is molded as plastics smooth wall.Do not have the powder particle metal film of inclusion to form through multiple gas phase deposition technology, these technology comprise splash, evaporation, ion plating, laser ablation or chemical vapour deposition (CVD).This reflectivity is used effective metal include, without being limited to Al, Cr, Au, Ag, Cu, Ni, Ta, Ti, Nd, Nb, Rh, Si, Mo and/or its any alloy or combination.
As replacement scheme, reflective surface will A1015 can form with mirror, such as the dielectric somascope.The dielectric somascope is manufactured into the storehouse of dielectric substance film, and this dielectric substance film replaces between high and low index of refraction material.The part of incident light is reflected from each interface of index of refraction change.Through having the clean reflective surface will that surpasses 98% reflectivity to the THICKNESS CONTROL of this dielectric layer to certain fixing mark of this wavelength or multiple and through increasing from the reflection at a plurality of parallel interfaces, can making.Some dielectric somascope has the reflectivity greater than 99.8%.The dielectric somascope can be customization design accepting presetted wavelength scope in the visible-range, and accept predetermined ranges of incidence angles.As long as the slickness that this manufacturing can be controlled in this dielectric substance film stack just can have the reflectivity above 99% under this condition.For example, this storehouse can comprise about 20 to about 500 films.As alternative replacement scheme, layer A1118 can be coated with absorbefacient film, and the front surface of shutter A1112 can cover with reflective membrane.In this way, only just pass through funnel A152 to this beholder's reflected light when part is closed at least at shutter A1112.
Reflective surface will A1015 can do slightly, is used to eliminate dazzle so that diffusivity to be provided above that.This do slightly can be carried out through any one of several technologies, comprises the technology of machinery, chemistry or deposition.Doing thick this reflective surface will makes the light that is reflected advance funnel A152 with different scattered through angles; Thereby and be reflected into the light beam A 703 ' of diffusion to this beholder, thereby create the visual angle of broad and improve the ratio of scattering (lambert) orienting reflex with different angles.
For example absorbing film A1152 can form with metal film.Most light absorbing certain marks of metal film and reflect remaining part.Effectively some metal alloys include, without being limited to MoCr, MoW, MoTi, MoTa, TiW and TiCr on absorbing light.The metal film that rough surface is arranged with above-mentioned alloy or simple metal such as Ni and Cr formation is also effective on absorbing light.Such film can be through the sputter deposited manufacturing in hyperbar (surpassing in the splash gaseous environment of 20 millitorrs (mtorr)).Coarse metal film can also spray application manufacturing through the spray liquid or the plasma of disperse metallic particles, then carries out the thermal sintering step.Add dielectric layer such as dielectric layer 404 then, to prevent the metallic particles spallation or to peel off.
Semi-conducting material, for example noncrystalline or polycrystalline Si, Ge, CdTe, InGaAs, deflocculated graphite (carbon) and alloy such as SiGe also on absorbing light effectively.These materials can be deposited as film that thickness surpasses 500nm to prevent any light transmission of passing this film.Metal oxide or nitride also can on absorbing light effectively include, but are not limited to CuO, NiO, Cr
2O
3, AgO, SnO, ZnO, TiO, Ta
2O
5, MoO
3, CrN, TiN or TaN.If prepare or deposit this oxide (normally through splash or evaporation) if especially this depositing operation produces the oxygen disappearance in dot matrix with the mode of non-stoichiometryization, the absorption of these oxides or nitride will improve.Situation as semi-conducting material is such, and this metal oxide should be deposited as thickness and surpass 500nm to prevent to pass the light transmission of this film.
One type be called ceramic-metallic material also can be on absorbing light effectively.Cermet typically is made up of the little metallic particles that is suspended in oxide or the nitride substrate.Example is included in Cr
2O
3Cr particle in the matrix is perhaps at SiO
2Cr particle in the matrix.Other metallic particles that are suspended in the matrix can be Ni, Ti, Au, Ag, Mo, Nb and carbon.Other host materials comprise TiO
2, Ta
2O
5, Al
2O
3And Si
3N
4
Can also between suitable thin-film material, use the interference of light of destruction property to found the multilayer absorbing structure.The typical realization relates to oxide that suitable reflexive metal is arranged or nitride local reflex layer.This oxide can be metal oxide, for example CrO
2, TiO
2, Al
2O
3Or SiO
2, or a kind of nitride such as Si
3N
4And this metal can be proper metal such as Cr, Mo, Al, Ta, Ti.In an implementation, in order to absorb the light that gets into from substrate, the thin layer of the metal oxide that at first deposition 10-500nm scope is thick on the surface of substrate A402 deposits the thick metal level of 10-500nm then.In another implementation, in order to absorb the light that gets into from the substrate rightabout, at first deposit this metal level, deposit this metal oxide then.Basically equal 0.55 micron divided by 1/4th of the refractive index of this oxide skin(coating) if this thickness of oxide layer is chosen as, can optimize the absorbability of double-deck storehouse under above-mentioned two kinds of situation.
In another implementation, depositing metal layers on substrate, deposit gage has been calculated the suitable oxide skin(coating) of thickness then.At the deposited on top skim metal of this oxide, make that this thin metal is (thickness is less than 0.2 micron) of partial reflection then.Thereby reflection and the black matrix effect of generation that sends from the substrate metal level interfered on the local reflex meeting meeting that this metal level sends destruction property ground.If this thickness of oxide layer be chosen as equal 0.55 micron basically will maximize absorption divided by 1/4th of the refractive index of this oxide skin(coating).
Figure 29 is the local isometric cross section according to the part A 2010 of the Transflective property display of illustrative embodiment of the present invention.Transflective property display unit A2010 is similar to reflection display device A10, but the combination of the transmitted light that Transflective property display unit is launched by reflected ambient with from the A105 backlight that integrates (integral) produces image.
Transflective property display unit A2010 can be with Transflective property optical modulator array is arranged; Comprise Transflective property shutter assembly array A2102; Be used for both modulating come from environment light source A107 by the light (for example typical backlight beam A801) of A105 emission backlight also modulation surround lighting (for example; Typical environment light beam A802) to form image, these two kinds of light all (are noted, for illustrative simplicity towards the beholder through filter array layer A111 and cover plate A109; The part of layer A111 and sheet A109 comprises that lens A157 does not illustrate in Figure 29)
Transflective property shutter assembly A2102 can take the essentially identical form with the shutter assembly A102 of Figure 22-25.Yet the layer A2118 of shutter assembly A2102 comprises a reflective surface will A2015 and one or more radioparent aperture diaphragm A2018; Reflective surface will A2015 is passed in this one or more radioparent aperture diaphragm etching below the position of the shutter A2112 that closes, collectively to form the surfaces A 2114 that can expose.Reflective surface will A2015 has from about 2 microns belows that are retained in the shutter A2112 that closes to about 20 microns at least a portion.Towards the layer of the forefront of this beholder's Transflective property shutter assembly A2102, comprise the front surface of shutter A2112a and A2112b at least, with the film A2152 coating of light absorption.Thereby when closing shutter A2112, the surround lighting A802 that is gathered on Transflective property shutter assembly A2102 by funnel A152 is absorbed by film A2152.Similarly, when closing shutter assembly A2112, the light of the transmittance aperture diaphragm A2018 transmission in the surfaces A 2114 that can expose is interdicted.When opening shutter A2112 at least in part (as shown in Figure 29); Transflective property shutter assembly A2102 passes through funnel A152 to this beholder's transmission through the transmittance aperture diaphragm A2018 of at least one percentage in the surfaces A 2114 that can expose that both allows backlight emission light A801; At least one percentage of also allowing to gather the surround lighting A802 on Transflective property shutter assembly A2102 from surfaces A 2015 reflections of this reflecting surface that has exposed or the surfaces A 2114 that can expose through funnel A152 towards this beholder's reflected back, and work to forming image.The size of the surfaces A 2015 of reflecting surface that this has exposed or the surfaces A 2114 that can expose is compared greatly with transmittance aperture diaphragm A2018; Just produce the directionality of reflection, thereby the surround lighting that comes from environment light source A107 is basically directly towards this beholder's reflected back.Yet, as preamble with respect to surfaces A 1015 described, reflective surface will or surfaces A 2105 can be done coarse, to provide diffusivity to eliminate dazzle and to widen the visual angle of display A2010 above that.
Gather the funnel A152 on the reflective surface will A2015 that one or more between the transmittance aperture diaphragm A2018 that is arranged on the surfaces A 2114 that can expose have exposed to surround lighting A802 even have to be designed for, certain part of surround lighting A802 also can be passed the aperture diaphragm A2018 of Transflective property shutter assembly A2102.When Transflective property shutter assembly A2102 was combined in the spatial light modulator with optics cavity and light source, the surround lighting A802 that passes aperture diaphragm A2018 got into optics cavity and is utilized again with the light A801 that is introduced by A105 backlight.In an alternative alternative Transflective property shutter assembly; Transmittance aperture diaphragm in this surface that can expose is filled with the material of half reflection property half transmitting property at least in part; Perhaps; As alternative replacement scheme, but whole area exposed A2114 can be formed to obtain forming reflexive and radioparent identical clean effect as the part in this zone by half transmitting property half reflection property material.
Figure 30 is the local isometric cross section according to the transmittance display unit A3010 part of illustrative embodiment of the present invention.Such as display unit A10 and A2010, transmittance display unit A3010 comprises the array of shutter assembly A3102 and the array of concentrator.The display unit A10 and the A2010 that describe with the front are opposite, and in display unit A3010, the array of optical modulator places between the array and beholder of concentrator.Transmittance shutter assembly A3102 modulation is by the light (for example, typical backlight beam A901) of A105 backlight to beholder's emission.Notice that for illustrative simplicity, color filter layer A111 and cover plate A109 do not illustrate in Figure 30.Filter A111 can be in display unit A3010 any place between the place ahead of backlight and display unit A3010.
Transmittance shutter assembly A3102 can take the essentially identical form with the shutter assembly A102 of Figure 22-25.Yet the layer A3118 of shutter assembly A3102 comprises transmissive surface A3018, the surfaces A 3114 that this transmissive surface can expose with formation below the position of the shutter A3112 that closes.Towards the layer of the forefront of this beholder's transmittance shutter assembly A3102, comprise the front surface of shutter A3112a and A3112b at least, apply with light absorping film A3152.Thereby when closing shutter A3112, surround lighting A902 is absorbed by film A3152, so not towards this beholder's reflected back.When opening shutter A3112 at least in part (as shown in Figure 30), transmittance shutter assembly A3102 works to forming a kind of image to this beholder's transmission through transmissive surface A3018 (surfaces A 3114 that can expose) through at least one percentage that allows backlight beam A901.Can apply additional light blocking zone around transmittance aperture diaphragm A3114, thereby make and to pass this optical modulation layer from this diffused light non-modulated of sending backlight.
Shown in figure; The funnel A152 of optically focused array A150 is located between shutter assembly A3102 and the A105 backlight, is used for getting into the first open optical A156 and passing the transmittance zone (the transmissive surface A3018 of the surfaces A 3114 that can expose) that the backlight beam A901 of the second open optical A154 gathers transmittance shutter assembly A3102.Thereby the array of use transmittance shutter assembly A3102 has increased the percentage of the formation of light (being backlight beam A901) on the modulation surface that send, that gather this display unit (surfaces A 3114 that can the expose) image from A105 backlight in the display unit A3010 that such funnel A152 configuration is arranged.The work that this array of light funnel A152 can also play this front-reflection face backlight utilizes in order to light backlight to be provided again, has cancelled the needs to the reflecting layer that separates.The light that gets into this funnel with the angle that does not cause making it arriving surfaces A 3114 will be gone out that this funnel gets into to back reflective should be backlight directly with utilization again, till it reaches the angle that causes exporting.
Should be understood that; Use optically focused array of the present invention to carry out device shown and method although utilize reflective light funnel array (for example funnel A152) to describe, the invention still further relates to array that the optical element (promptly not being funnel) that utilizes other types gathers the light of available formation image optical modulator display unit and method with the contrast that maximizes this display.This for example can accomplish through substitute each reflexive smooth funnel A152 with the high-NA diaphragm lens with the display unit that preamble is described.For example,, can utilize the lens of a high-NA diaphragm according to an alternative alternate embodiment of the present invention, be similar to shown in Figure 23 lens A157, and do not need the cone A152 among the array A150.Also have, both use lens A157 also to make with light funnel A152 although many implementations of this paper explanation disclose, in many realizations, these lens are optional.
Those skilled in the art only will know or be sure of the embodiment and the many of practice of this paper explanation are equal to daily experience.Therefore will be understood that to the invention is not restricted to the embodiment that this paper discloses, but will from claims of law permission ground extensive interpretation, understand.
The present invention can not depart from spirit of the present invention or its fundamental characteristics with other specific forms enforcements.Therefore the embodiment in the preceding text will all think to explain the present invention in all respects, rather than restriction the present invention.
Claims (34)
1. display unit comprises:
One first reflective surface will, this first reflective surface will limits a plurality of light transmission regions,
One second reflective surface will, this second reflective surface will be at least in part in the face of this first reflective surface will and to this first reflective surface will reverberation,
In a photoconduction, this photoconduction chamber between this first and second reflective surface will, be used for making light entirely to be distributed in this chamber, and
A light modulator arrays is used for optionally blocking and leaves this photoconduction and pass the light of these a plurality of light transmission regions towards the front side of this display unit, and wherein the optical modulator in this light modulator arrays is corresponding to the light transmission region separately of these a plurality of light transmission regions.
2. display unit as claimed in claim 1, wherein one of these reflective surface will form with one of a mirror, a dielectric somascope and a metal film.
3. display unit as claimed in claim 1, wherein at least one in these light transmission regions comprises an aperture diaphragm.
4. display unit as claimed in claim 1, wherein this light modulator arrays comprises one of following: a plurality of optical modulator or a plurality of shutter assemblies based on MEMS based on MEMS.
5. display unit as claimed in claim 1, wherein this first reflective surface will is parallel to and is opposite to this second reflective surface will.
6. display unit as claimed in claim 1, wherein relative this second reflective surface will of this first reflective surface will is horizontal at least in part.
7. display unit as claimed in claim 1; Wherein this light modulator arrays comprises a plurality of shutters that are arranged in the plane; At least one this shutter have in this plane a correspondence that allows light to pass these a plurality of light transmission regions the zone a primary importance and in this plane, block from a second place of the light of second reflective surface will reflection.
8. display unit as claimed in claim 1; Wherein this light modulator arrays comprises a plurality of shutters that are arranged in the plane; At least one this shutter has a primary importance of in this plane, blocking from the light of this second reflective surface will reflection; With a second place, at least a portion of this shutter is passed the zone of a correspondence of these a plurality of light transmission regions with permission light outside this plane in this second place.
9. display unit as claimed in claim 1, wherein this first reflective surface will is arranged on the surface of this photoconduction.
10. display unit as claimed in claim 9 comprises a substrate arranging this light modulator arrays above that.
11. display unit as claimed in claim 10, wherein this substrate is transparent.
12. display unit as claimed in claim 10 comprises a pad, is used to keep this photoconduction and this substrate predetermined spacing that is spaced from each other, thereby forms a gap.
13. display unit as claimed in claim 10, wherein this photoconduction is couple on this substrate.
14. display unit as claimed in claim 1 comprises a substrate arranging this first reflective surface will and this light modulator arrays on it.
15. display unit as claimed in claim 14, wherein this first reflective surface will comprises a reflective membrane.
16. display unit as claimed in claim 1, wherein this second reflective surface will is disposed on this photoconduction and the opposed side, the side of approaching this first reflective surface will most this photoconduction.
17. display unit as claimed in claim 1, wherein this light modulator arrays comprises Liquid crystal component.
18. display unit as claimed in claim 1 comprises a light source that is used for being incorporated into light this photoconduction.
19. display unit as claimed in claim 18, wherein this light source comprises a light emitting diode.
20. display unit as claimed in claim 18, wherein this light source comprises a plurality of light sources, the light of at least three kinds of colors of each this light emitted wherein a kind of.
21. display unit as claimed in claim 1 comprises a substrate arranging this first reflective surface will on it except that this photoconduction.
22. display unit as claimed in claim 21, wherein this photoconduction is separated by a gap with fills with air with this substrate.
23. display unit as claimed in claim 1, wherein the optical modulator in this light modulator arrays is one to one corresponding to the light transmission region of these a plurality of light transmission regions.
24. display unit as claimed in claim 1, wherein this array separates a gap with this first reflective surface will, and it is wide that this gap is less than or equal to 100 μ m.
25. display unit as claimed in claim 24, it is wide that wherein this gap is less than or equal to 10 μ m.
26. display unit as claimed in claim 1 comprises a pad, is used to keep the spaced apart predetermined spacing of this array and this first reflective surface will, thereby forms a gap.
27. display unit as claimed in claim 1 comprises fluid, this fluid is filled the gap that remains between this first reflective surface will and this array at least in part.
28. display unit as claimed in claim 27, wherein this fluid comprises liquid.
29. display unit as claimed in claim 28, wherein this liquid is lubricant.
30. display unit as claimed in claim 28, wherein these optical modulators comprise mechanical mems optical modulator, and this liquid is at least in part around this machinery mems optical modulator.
31. like each described display unit in the claim 10,14 and 21, also comprise a cover plate, this cover plate separates a gap with this substrate.
32. display unit as claimed in claim 31, wherein this array is formed on the side of the front side of carrying this display unit of this substrate.
33. display unit as claimed in claim 1, wherein at least one this light transmission region has a corresponding filter.
34. a method that forms image comprises the light modulator modulates light of use according to the display unit of arbitrary aforementioned claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110347954.6A CN102419958B (en) | 2005-02-23 | 2006-02-23 | Display device |
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| US11/218,690 | 2005-09-02 | ||
| US11/218,690 US7417782B2 (en) | 2005-02-23 | 2005-09-02 | Methods and apparatus for spatial light modulation |
| PCT/US2006/006761 WO2006091904A2 (en) | 2005-02-23 | 2006-02-23 | Methods and apparatus for spatial light modulation |
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| CN201410404726.1A Division CN104134409A (en) | 2005-02-23 | 2006-02-23 | Methods for forming image |
| CN201110347954.6A Division CN102419958B (en) | 2005-02-23 | 2006-02-23 | Display device |
| CN201110347955.0A Division CN102401993B (en) | 2005-02-23 | 2006-02-23 | Display apparatus and spatial light modulation |
| CN201110347953.1A Division CN102401992B (en) | 2005-02-23 | 2006-02-23 | Method of forming image |
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| CN101151207B true CN101151207B (en) | 2012-01-04 |
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| CN2006800058237A Expired - Fee Related CN101128766B (en) | 2005-02-23 | 2006-02-23 | Display apparatus and methods for manufacture thereof |
| CN200810085750.8A Expired - Fee Related CN101256279B (en) | 2005-02-23 | 2006-02-23 | Display method and apparatus |
| CN2009102036295A Expired - Fee Related CN101576656B (en) | 2005-02-23 | 2006-02-23 | Display methods and apparatus |
| CN2006800058222A Expired - Fee Related CN101151206B (en) | 2005-02-23 | 2006-02-23 | Methods and apparatus for actuating displays |
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| CN2009102036295A Expired - Fee Related CN101576656B (en) | 2005-02-23 | 2006-02-23 | Display methods and apparatus |
| CN2006800058222A Expired - Fee Related CN101151206B (en) | 2005-02-23 | 2006-02-23 | Methods and apparatus for actuating displays |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101256279B (en) | 2014-04-02 |
| CN101128765A (en) | 2008-02-20 |
| CN101128765B (en) | 2010-12-01 |
| CN101151207A (en) | 2008-03-26 |
| CN101151206A (en) | 2008-03-26 |
| CN101256279A (en) | 2008-09-03 |
| CN101128766A (en) | 2008-02-20 |
| CN101576656B (en) | 2012-05-30 |
| CN101128766B (en) | 2011-01-12 |
| CN101576656A (en) | 2009-11-11 |
| CN101151206B (en) | 2011-10-05 |
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