CN101132668B - Solder-paste coating method and instrument thereof - Google Patents
Solder-paste coating method and instrument thereof Download PDFInfo
- Publication number
- CN101132668B CN101132668B CN2006101150637A CN200610115063A CN101132668B CN 101132668 B CN101132668 B CN 101132668B CN 2006101150637 A CN2006101150637 A CN 2006101150637A CN 200610115063 A CN200610115063 A CN 200610115063A CN 101132668 B CN101132668 B CN 101132668B
- Authority
- CN
- China
- Prior art keywords
- holding part
- grid array
- ball grid
- tin cream
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000576 coating method Methods 0.000 title claims abstract description 49
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 107
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 239000006071 cream Substances 0.000 claims description 73
- 230000007480 spreading Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Abstract
This invention relates to a method and a tool for coating tin paste used in a BGA baseboard forming multiple balls on the surface to carry out reflow operation, which provides a body with a first surface and a second surface corresponding to each other, and a first containing part for setting the BGA baseboard is set on the first surface, a tool for coating tin paste of the second comtaining partis set on the second surface corresponding to the first part, in which, multiple balls between the first and second part on the base board corresponding to the BGA are set with a diversion part for guiding said paste, said BGA base board with said balls corresponding to said diversion part is set in the first containing part and the paste coated on the second containing part is guided to the multiple balls of the board via said diversion part by gravity.
Description
Technical field
The present invention relates to a kind of solder-paste coating method and instrument, more specifically, relate to and a kind ofly be applied to ball grid array (BGA) substrate that the surface is formed with a plurality of tin balls to carry out the solder-paste coating method and the instrument of reflow soldering (reflow) operation.
Background technology
Along with development of electronic technology, electronic component develops towards miniaturization and highly dense integrated direction, wherein, and ball grid array (Ball GridArray; BGA) element is widely used in the surface adhering technology (SMT), and along with the appearance of uBGA (miniature spherical net battle array arrange) and CSP (wafer-class encapsulation), the difficulty of SMT also is more and more big, and technological requirement is also more and more high.Because it is quite big that BGA reprocesses difficulty, the good welds of the existing BGA of historical facts or anecdotes is real to be all SMT engineering staffs' common issue.In BGA heavy industry operation (rework) process,, all need usually the hardened coating tin cream that the printed circuit board (PCB) (PCB) of desiring to combine with BGA in follow-up reflow soldering operation (reflow) carries out is repeatedly operated for improving the yield of heavy industry.And tradition is when carrying out the operation of this hardened coating tin cream, as shown in Figure 1, the operator is a steel disc 12 with a plurality of through holes 121, be fixed to printed circuit board (PCB) 11 with adhesive tape 13 after, promptly begin to carry out this hardened coating tin cream operation, thereby on this printed circuit board (PCB) 11, be pre-formed tin cream.
Yet the steel disc that this hardened coating tin cream operation is adopted is thinner, so the effect because of external force produces distortion down easily, thereby make when carrying out the operation of hardened coating tin cream, inhomogeneous by the tin cream that the through hole on this steel disc is coated on this printed circuit board (PCB), and need repeat repeatedly the operation of hardened coating tin cream.In addition, this steel disc is only to use adhesive tape to be fixed on this printed circuit board (PCB), its fixed effect is relatively poor, and when having other parts on every side, the fixing of this steel disc will become more difficult, correspondingly, when carrying out the operation of hardened coating tin cream, then improper because of the application of force easily, make that this steel disc is crooked, even and then cause the facts of the inhomogeneous hardened coating tin cream of the tin cream of coating on this printed circuit board (PCB) operation failure to take place.Moreover because the problem that aforesaid steel disc produced, operator itself also must have certain operating experience and technical ability, can carry out the operation of hardened coating tin cream, and must carry out this operation carefully, relatively then can cause the problem of inefficiency.
Therefore, how a kind of technology that above-mentioned existing hardened coating tin cream is operated the problem that is produced that solves is provided, to improve the uniformity after tin cream is coated with, also can make simultaneously the restriction that is not subjected to printed circuit board arrangement when being coated with the tin cream operation, and do not need the operator of specialty to carry out, and can have high efficiency advantage concurrently, the real problem that needs solution that become.
Summary of the invention
In view of above-mentioned prior art problems, main purpose of the present invention is to provide a kind of solder-paste coating method and instrument, to improve the uniformity after tin cream is coated with.
Another object of the present invention is to provide a kind of solder-paste coating method and instrument, can when being coated with the tin cream operation, not be subjected to the restriction of printed circuit board arrangement.
Another purpose of the present invention is to provide a kind of solder-paste coating method and instrument, does not need the operator of specialty can be coated with the tin cream operation.
For realizing above-mentioned main purpose and other purposes, the invention provides a kind of ball grid array (BGA) substrate that is applied to carry out reflow soldering (reflow) operation, and be formed with the solder-paste coating method of a plurality of tin balls on this ball grid array, it may further comprise the steps: a tin cream spreading implement is provided, this tin cream spreading implement has the first surface of mutual correspondence and the body of second surface, on this first surface to being provided with first holding part of using for this ball grid array base plate is set by ball grid array base plate, this second surface is to being provided with second holding part of using for the coating tin cream by first holding part, wherein, between this first holding part and second holding part a plurality of tin balls that should the ball grid array upper substrate are equipped with in order to guide the diversion division of this tin cream; With these a plurality of tin balls to should this ball grid array base plate being set in this first holding part by diversion division; Be coated with this tin cream in this second holding part and utilize gravity that this tin cream is guided to by this diversion division on a plurality of tin balls of this ball grid array base plate, thereby reach the purpose of this tin cream of coating on a plurality of tin balls of this ball grid array base plate.
With respect to aforesaid solder-paste coating method, the invention also discloses a kind of ball grid array (BGA) substrate that is applied to carry out reflow soldering (reflow) operation, and be the tin cream spreading implement that is formed with a plurality of tin balls on this ball grid array base plate, it comprises: have the first surface of mutual correspondence and the body of second surface; To being arranged on this first surface by ball grid array base plate, use for first holding part that this ball grid array base plate is set; To being arranged on this second surface by first holding part, use second holding part for the coating tin cream; And a plurality of tin balls on should ball grid array base plate are arranged between this first holding part and second holding part, be used to this ball grid array base plate with its a plurality of tin balls to should diversion division being arranged at this first holding part and being coated with this tin cream in utilizing gravity this tin cream to be guided on a plurality of tin balls of this ball grid array base plate behind this second holding part, thereby reach the diversion division of the purpose of this tin cream of coating on a plurality of tin balls of this ball grid array base plate.
Than prior art, solder-paste coating method of the present invention and instrument be first surface and first holding part on the second surface and second holding part by being arranged at this body respectively mainly, and be arranged at the respective outer side edges of the diversion division between this first holding part and second holding part, for this ball grid array base plate setting and carry out tin cream coating operation, thereby the problem that is produced in the solution prior art, promptly improve the uniformity after tin cream is coated with, also can make simultaneously the restriction that is not subjected to printed circuit board arrangement when being coated with the tin cream operation, and the operator who does not need specialty can be coated with the tin cream operation, and can have high efficiency advantage concurrently.
Description of drawings
Fig. 1 looks schematic diagram on being, in order to the hardened coating tin cream operation of explanation prior art;
Fig. 2 looks schematic diagram on being, in order to the example structure of tin cream spreading implement of the present invention to be described;
Fig. 3 is the A-A generalized section of Fig. 2, in order to the example structure of tin cream spreading implement of the present invention to be described; And
Fig. 4 A to 4D is a generalized section, in order to the embodiment steps flow chart of solder-paste coating method of the present invention to be described.
The main element symbol description
11 printed circuit board (PCB)s
12 steel discs
121 through holes
13 adhesive tapes
2 bodies
21 first surfaces
211 first holding parts
212 breach
22 second surfaces
221 second holding parts
23 diversion divisions
231 perforation
3 ball grid array base plates
31 tin balls
4 tin creams
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the disclosed content of this specification.The present invention also can be implemented or be used by other different specific embodiments, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
See also Fig. 2 and 3, look on being schematic diagram and should on look schematic diagram the A-A generalized section, in order to the example structure of tin cream spreading implement of the present invention to be described.What need be illustrated earlier is, the present invention is applied to ball grid array (BGA) substrate to carry out reflow soldering (reflow) operation, wherein, be formed with a plurality of tin balls on this ball grid array base plate, and this ball grid array base plate with and the structure that goes up formed a plurality of tin balls can understand easily in the technical field for this reason, and the technology contents of non-genus tin cream spreading implement of the present invention is not so give diagram in this.
Shown in Fig. 2 and 3, tin cream spreading implement of the present invention comprises body 2, first holding part 211, second holding part 221 and diversion division 23.Below promptly the above-mentioned parts of tin cream spreading implement of the present invention are elaborated:
This body 2, first surface 21 and second surface 22 with mutual correspondence; In present embodiment, the shape setting of this body 2 is by can knowing among the figure, and the aspect of its enforcement is not to exceed with shower in scheming, so no longer described in detail in this.
This first holding part 211 to being arranged on this first surface 21 by ball grid array base plate, is used for this ball grid array base plate is set; In present embodiment, this first holding part 211 is grooves, its size and shape are corresponding to this ball grid array base plate, for example be shown in the figure, but be not as limit, such as can utilize easily hand put or plant equipment with the ball grid array base plate setting and be sticked in the structural design of this first holding part 211, be all first holding part, 211 enforceable modes of the present invention, and its depth of groove is not limit, but, do not cause this ball grid array base plate to protrude for best with this ball grid array base plate setting and when being sticked in this first holding part 211.In addition, because applied ball grid array base plate is the tool handgrip in the present embodiment, therefore, first holding part 211 in the present embodiment is other to have additional the breach 212 that is communicated to this first holding part 211 again, ccontaining this handgrip when being used to this ball grid array base plate and being arranged at this first holding part 211.
This second holding part 221 is to should being arranged on this second surface 22 by first holding part 211, using for the coating tin cream; In present embodiment, this second holding part 221 is to be groove, its size and shape are corresponding to this first holding part 211, also promptly mutually should ball grid array base plate, and its depth of groove is not limit, but be coated with tin cream when operation to carry out craft or plant equipment, do not cause this tin cream to overflow and be the best.
This diversion division 23, a plurality of tin balls on should ball grid array base plate are arranged between this first holding part 211 and second holding part 221, be used to this ball grid array base plate with its a plurality of tin balls to should diversion division 23 being arranged at this first holding part 211 and being coated with this tin cream in utilizing gravity this tin cream to be guided on a plurality of tin balls of this ball grid array base plate behind this second holding part 211, thereby reach the purpose of this tin cream of coating on a plurality of tin balls of this ball grid array base plate; In present embodiment, this diversion division 23 is to be a plurality of perforation 231, the quantity of its a plurality of perforation 231 is that the quantity of a plurality of tin balls on should ball grid array base plate is decided (among the figure only with four perforation 231 as illustrating), and also decide with respect to a plurality of tin ball present positions on this ball grid array base plate the position that is provided with of its a plurality of perforation 231, and the aperture of its a plurality of perforation 231 is to be the best with a plurality of tin balls on can ccontaining this ball grid array base plate.
Please together consulting Fig. 4 (A) again to 4 (D), is generalized section, in order to the embodiment steps flow chart of solder-paste coating method of the present invention to be described.Shown in figure the 4th (A), solder-paste coating method of the present invention at first provides a tin cream spreading implement, this tin cream spreading implement has the first surface 21 of mutual correspondence and the body 2 of second surface 22, on this first surface 21 to being provided with first holding part of using for this ball grid array base plate 3 is set 211 by ball grid array base plate 3,22 pairs of this second surfaces should be provided with second holding part of using for coating tin cream 4 221 by first holding part 211, wherein, between this first holding part 21 and second holding part 22 a plurality of tin balls 31 on should ball grid array base plate 3 are equipped with diversion division 23 in order to guide this tin cream 4, what need be illustrated is, the detailed structure of this tin cream spreading implement is to describe in detail in aforesaid content, so repeat no more in this.
Continue shown in Fig. 4 (B), should this ball grid array base plate 3 be set in this first holding part 211 by diversion division 23 with 31 pairs in these a plurality of tin balls, also promptly, have facing of a plurality of tin balls 31 with this ball grid array base plate 3 and this ball grid array base plate 3 is set in this first holding part 211 by diversion division 23.
Continue shown in Fig. 4 (C), be coated with this tin cream 4 in this second holding part 221 and utilize gravity that this tin cream 4 is guided on a plurality of tin balls 31 of this ball grid array base plate 3 by this diversion division 23.
Last shown in Fig. 4 (D), promptly finish tin cream coating operation, thereby reach the purpose of this tin cream 4 of coating on a plurality of tin balls 31 of this ball grid array base plate 3.
In sum, solder-paste coating method of the present invention and instrument are main first surface and first holding part on the second surface and second holding parts by being arranged at this body respectively, and be arranged at the respective outer side edges of the diversion division between this first holding part and second holding part, for this ball grid array base plate setting and carry out tin cream coating operation.
Coating tin cream operation than prior art, the present invention is coated with the tin cream operation in printed circuit board (PCB), but on a plurality of tin balls on this ball grid array base plate, be coated with the tin cream operation, and by this first holding part, the setting of second holding part and diversion division, the good tin cream coating operating environment of this ball grid array base plate (can not produce distortion or fixing not good situation as steel disc of the prior art) is provided, therefore, the problem that can solve in the prior art to be produced, promptly improve the uniformity after tin cream is coated with, also can make simultaneously the restriction that is not subjected to printed circuit board arrangement when being coated with the tin cream operation, and the operator who does not need specialty can be coated with the tin cream operation, relatively, also can improve the efficient of coating tin cream operation.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and scope.So the scope of the present invention, should be listed as claims.
Claims (4)
1. a solder-paste coating method is applied to ball grid array BGA substrate to carry out the reflow soldering operation, wherein, is formed with a plurality of tin balls on this ball grid array, and this solder-paste coating method may further comprise the steps:
One tin cream spreading implement is provided, this tin cream spreading implement has the first surface of mutual correspondence and the body of second surface, on this first surface to being provided with first holding part of using for this ball grid array is set by ball grid array base plate, this second surface is to being provided with second holding part of using for the coating tin cream by first holding part, wherein, between this first holding part and second holding part a plurality of tin balls on should ball grid array base plate are equipped with in order to guide the diversion division of this tin cream;
With these a plurality of tin balls to should this ball grid array base plate being set in this first holding part by diversion division; And
Be coated with this tin cream in this second holding part and utilize gravity that this tin cream is guided to by this diversion division on a plurality of tin balls of this ball grid array base plate, thereby reach the purpose of this tin cream of coating on a plurality of tin balls of this ball grid array base plate.
2. solder-paste coating method according to claim 1, wherein, this first holding part is a groove.
3. solder-paste coating method according to claim 1, wherein, this second holding part is a groove.
4. solder-paste coating method according to claim 1, wherein, this diversion division is a plurality of perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101150637A CN101132668B (en) | 2006-08-23 | 2006-08-23 | Solder-paste coating method and instrument thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101150637A CN101132668B (en) | 2006-08-23 | 2006-08-23 | Solder-paste coating method and instrument thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101132668A CN101132668A (en) | 2008-02-27 |
| CN101132668B true CN101132668B (en) | 2010-09-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101150637A Expired - Fee Related CN101132668B (en) | 2006-08-23 | 2006-08-23 | Solder-paste coating method and instrument thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101132668B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917050A (en) * | 2014-04-22 | 2014-07-09 | 无锡市同步电子制造有限公司 | PCB special device manual printing method |
| CN109175590A (en) * | 2018-09-19 | 2019-01-11 | 锘威科技(深圳)有限公司 | Heat-pipe radiator tin cream bringing device and applying method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5787580A (en) * | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| US6050481A (en) * | 1997-06-25 | 2000-04-18 | International Business Machines Corporation | Method of making a high melting point solder ball coated with a low melting point solder |
-
2006
- 2006-08-23 CN CN2006101150637A patent/CN101132668B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5787580A (en) * | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| US6050481A (en) * | 1997-06-25 | 2000-04-18 | International Business Machines Corporation | Method of making a high melting point solder ball coated with a low melting point solder |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平7-335651A 1995.12.22 |
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| Publication number | Publication date |
|---|---|
| CN101132668A (en) | 2008-02-27 |
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Owner name: SUZHOU CHENCAI TEXTILE RESEARCH DEVELOPMENT CO., L Free format text: FORMER OWNER: YINGYEDA CO., LTD., TAIWAN Effective date: 20141224 |
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Effective date of registration: 20141224 Address after: 215228 Jiangsu City, Wujiang Province, Shengze Town, No. two West Ring Road, No. Shengze Textile Science and Technology Park, building 10, 1188 Patentee after: SUZHOU CHENCAI TEXTILE RESEARCH DEVELOPMENT CO., LTD. Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |
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Effective date of registration: 20160115 Address after: 215200, China Textile Science and Technology Pioneer Park, No. 1188 west two ring road, Shengze Town, Wujiang District, Jiangsu, Suzhou, 10 Patentee after: Suzhou favourite son's Information technology company limited Address before: 215228 Jiangsu City, Wujiang Province, Shengze Town, No. two West Ring Road, No. Shengze Textile Science and Technology Park, building 10, 1188 Patentee before: SUZHOU CHENCAI TEXTILE RESEARCH DEVELOPMENT CO., LTD. |
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Granted publication date: 20100922 Termination date: 20160823 |
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