CN101082405B - LED light-emitting component - Google Patents
LED light-emitting component Download PDFInfo
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- CN101082405B CN101082405B CN2007100750262A CN200710075026A CN101082405B CN 101082405 B CN101082405 B CN 101082405B CN 2007100750262 A CN2007100750262 A CN 2007100750262A CN 200710075026 A CN200710075026 A CN 200710075026A CN 101082405 B CN101082405 B CN 101082405B
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- led
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- fluorescent material
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- flaring
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Abstract
This invention discloses a sort of LED flaring element which adopt the complex flaring technique of fluorescent powder, it makes the LED flaring wafer of metal base plate embark locate in a transparent cover, the transparent cover is full of liquid in order that the liquid can submerge the whole surface of LED flaring wafer and it accession fluorescent powder in the liquid, so the fluorescent powder equably disperse in the liquid of the surface of LED flaring wafer. This invention ameliorates the method of the distribution of the external fluorescent powder, it effectively avoids the phenomenon that the fluorescent powder in the surface of LED flaring wafer heat up in the high temperature and reduces the aging of the fluorescent powder and reduce the light attenuation greatly.
Description
Technical field
The present invention relates to a kind of LED light-emitting component that adopts fluorescent material recombination luminescence technology.
Background technology
Japanese Ri Ya chemical company (Nichia Chemical) in 1996 discovery can be made white light source with yttrium-aluminium-garnet (YAG) the phosphor powder matching blue LED of jaundice spectrum row.Utilize blue lED to be basic light source; A part of blue light that blue led is sent is used for excitated fluorescent powder; Make fluorescent material send green-yellow light or ruddiness and green glow, another part blue light transmits, and forms white light by the yellow-green light of fluorescent material or the blue light of ruddiness and green glow and transmission.
At present, also in the special phosphor of exploitation purple light and ultraviolet light series, the emission wavelength of this type fluorescent material is 370～420nm to people, utilizes the method that applies, and the LED of this type phosphor powder matching purple light or ultraviolet light also can produce white light LEDs.Same principle, the different light that can produce other colors that cooperate of base light and fluorescent material, the principle of LED fluorescent material recombination luminescence technology that Here it is.
For the ease of describing, all add that with blue-light LED chip corresponding fluorescent material produces white light the present invention is described below.
Generally using at present blue-ray LED to add the technology that the fluorescent material recombination luminescence produces white light all adopts coating method to realize; Common technology is with the surface that is coated in the LED wafer after fluorescent material and the glue mixing; Therefore the size of fluorescent powder grain, the uniformity of coating, the thickness of fluorescence coating etc. all are difficult to controlled; Not only light efficiency can be influenced, and color parameter and spatial light intensity distribution and colour temperature Ra value can be changed.Because the LED wafer is cuboid, light intensity changes decay rapidly with angle, the spectral space skewness, and superimposed with the uncontrollability effect that the coating technology of fluorescent material produces, can there be problems such as serious colour cast in the edge.
In addition, the method for packing of existing fluorescent material recombination luminescence LED is behind the coating fluorescent powder layer phosphor powder layer to be solidified, and the fluorescent material of LED wafer surface is solid-state form, and seals with transparent resin.When LED worked, because of the current density of the PN junction of the wafer of flowing through is bigger, the temperature of wafer surface was very high; About 300～400 degree make the solid phosphor of LED wafer surface be in the heat state for a long time like this, have quickened the aging of fluorescent material; Reduce its luminous efficiency, make its optical attenuation very fast, thereby white light LEDs is shortened service life greatly; High-power LED particularly, this phenomenon is more outstanding.Simultaneously; White light LEDs is owing to be coated with phosphor powder layer (converting the part blue light into white light); A bright dipping part directly sees through epoxy resin and penetrates, and another part is by the fluorescent material scattering, thus near shortwave radiation and the heat high concentration of bisque; Epoxy resin " xanthochromia " around causing being filled in has greatly influenced light output efficiency.
Patent applicant of the present invention has submitted a Chinese invention patent application on June 4th, 2007, and its application number is 200710074813.5, and its can effectively dissipate heat of LED element surface can solve because heat deposition causes fluorescent material character problem of unstable.But for using coating method to generate the harmful effect that the solid state fluorescence bisque produces in the LED wafer surface, for example cause light efficiency to reduce, change color parameter, change spatial light intensity and distribute and colour temperature Ra value, problems such as the serious colour cast of marginal existence do not propose solution.
Summary of the invention
The objective of the invention is to propose the LED light-emitting component of the method that a kind of LED of improvement surface fluorescence powder distributes; Solve owing to using coating method to cause influencing light efficiency; Change color parameter, change spatial light intensity and distribute and colour temperature Ra value problems such as the serious colour cast of marginal existence.
In order to achieve the above object, the present invention is realized by following technical scheme.
The LED luminescent wafer that metal substrate loads is located in the translucent cover, and filled with fluid in translucent cover can flood liquid and covers whole LED luminescent wafer surface; In liquid, add also evenly being dispersed with fluorescent material, the fluorescent material in the surperficial liquid of LED luminescent wafer is evenly disperseed.
Described liquid is working fluid, and the working fluid that contains fluorescent material coats any exiting surface of LED luminescent wafer.
Described translucent cover is provided with the working fluid circulation import and export that contains fluorescent material, connects a liquid cooling cycle heat radiation device at the working fluid circulation import and export place that contains fluorescent material.
The present invention compares with prior art, has adopted the radiator structure that absorbs heat in LED luminescent wafer surface by utilizing working fluid circulation, and its can dissipate heat of LED wafer surface is controlled the integral heat sink performance preferably.The present invention improves the method that LED surface fluorescence powder distributes; The solid-state form fluorescent material that tradition is coated on LED luminescent wafer surface adds in the working fluid of heat radiation; Effectively avoided fluorescent material at the existing edge of the surperficial heat of LED luminescent wafer; Reduced the aging of fluorescent material, optical attenuation is reduced greatly.Utilize the working fluid fluorescent material that distributes; Make fluorescent material be evenly distributed on any light-emitting area of LED luminescent wafer; Moreover the intrinsic refractive nature of liquid can let the fluorescent material that is dispersed in LED luminescent wafer upper space fully excite; Make LED light-emitting component light colour developing of the present invention evenly, the stability of light improves greatly.Solved the use coating method and caused influencing light efficiency, changed color parameter, changed spatial light intensity and distribute and colour temperature Ra value problems such as the serious colour cast of marginal existence.
Description of drawings
Fig. 1 is a kind of LED light-emitting component of the present invention embodiment 1 structural representation
The specific embodiment
Do to describe in further detail below in conjunction with the accompanying drawing specific embodiments of the invention.
A kind of LED light-emitting component as shown in Figure 1 is located at the LED luminescent wafer 10 that metal substrate loads in the translucent cover 11.Translucent cover 11 preferential employings have the optical signature outline.On translucent cover 11, be provided with working fluid circulation import and export 12,13, pay the utmost attention to the working fluid import and export 12,13 that circulates is located at the bottom surface of translucent cover 11, make it form a sealed space.Connect a liquid cooling cycle heat radiation device 14 at working fluid circulation import and export 12,13 places,, liquid is flooded cover on LED luminescent wafer 10 surfaces through liquid cooling cycle heat radiation device 14 filled with fluid in translucent cover 11.In liquid, add and evenly being dispersed with fluorescent material, the fluorescent material in the liquid on LED luminescent wafer 10 surfaces is evenly disperseed.The working fluid that wherein contains fluorescent material coats any exiting surface of LED luminescent wafer 10.Liquid of the present invention be transparent, non-conductive, do not corrode cooling medium, preferentially select the more excellent silicone oil of heat-conductive characteristic for use.Filled arrows in the accompanying drawing is oriented to the working fluid loop direction, but also can adopt circulation in the other direction.
Liquid cooling cycle heat radiation device 14 wherein can adopt multiple suitable structures, and the textural association that this example provides comprises:
One liquid circulation coil pipe 20, coil pipe 20 adopts snakelike copper pipe, the material that also can adopt other to be suitable for; Coil pipe 20 two ends connect the working fluid circulation import and export 12.13 on the translucent cover 11.
One driving pump, 30. driving pumps 30 are connected on the liquid circulation coil pipe 20, are used to drive flowing of liquid.
One row's fin 40, fin 40 is located on the liquid circulation coil pipe 20, is used for the heat of liquid is discharged outside air rapidly.
Claims (5)
1. LED light-emitting component; The LED luminescent wafer that metal substrate loads is located in the translucent cover; Filled with fluid in translucent cover; Liquid can be flooded cover whole LED luminescent wafer surface, it is characterized in that: in liquid, add also evenly being dispersed with fluorescent material, the fluorescent material in the surperficial liquid of LED luminescent wafer is evenly disperseed.
2. LED light-emitting component according to claim 1 is characterized in that: described liquid is working fluid.
3. LED light-emitting component according to claim 1 is characterized in that: described liquid is transparent.
4. LED light-emitting component according to claim 1 is characterized in that: the described working fluid that contains fluorescent material coats any exiting surface of LED luminescent wafer.
5. LED light-emitting component according to claim 1 is characterized in that: described translucent cover is provided with the working fluid circulation import and export that contains fluorescent material, connects a liquid cooling cycle heat radiation device at the working fluid circulation import and export place that contains fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100750262A CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100750262A CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101082405A CN101082405A (en) | 2007-12-05 |
| CN101082405B true CN101082405B (en) | 2012-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100750262A Active CN101082405B (en) | 2007-06-13 | 2007-06-13 | LED light-emitting component |
Country Status (1)
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| CN (1) | CN101082405B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201251147A (en) * | 2011-06-01 | 2012-12-16 | All Real Technology Co Ltd | Liquid cooling light-emitting apparatus |
| CN102927475B (en) * | 2012-11-08 | 2014-09-24 | 浙江阳光照明电器集团股份有限公司 | Light-emitting diode (LED) light source module |
| CN103104869B (en) | 2013-01-16 | 2016-03-30 | 北京京东方光电科技有限公司 | Light-emitting component, backlight module, liquid crystal indicator and light fixture |
| CN105674073B (en) * | 2016-01-29 | 2019-04-16 | 东莞市闻誉实业有限公司 | Circulation radiating type lighting device |
| KR102553434B1 (en) * | 2016-07-22 | 2023-07-12 | 제트카베 그룹 게엠베하 | Lamp for vehicle |
| CN109426049B (en) * | 2017-08-21 | 2021-03-05 | 深圳光峰科技股份有限公司 | Liquid cooling circulation heat abstractor, liquid cooling circulation heat dissipation system and optical projection system |
| CN108533969A (en) * | 2018-04-19 | 2018-09-14 | 珠海科明智能科技有限公司 | A kind of object luminescence technology and product based on ultraviolet light and fluorescent powder |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
| CN1845348A (en) * | 2006-04-30 | 2006-10-11 | 吕大明 | High brightness white light LED luminescent device and its manufacturing process |
-
2007
- 2007-06-13 CN CN2007100750262A patent/CN101082405B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
| CN1845348A (en) * | 2006-04-30 | 2006-10-11 | 吕大明 | High brightness white light LED luminescent device and its manufacturing process |
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| Publication number | Publication date |
|---|---|
| CN101082405A (en) | 2007-12-05 |
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Owner name: DAJIN VARITRONIX ENERGY MANAGEMENT (SHENZHEN) CO., Free format text: FORMER OWNER: ZHU JIANQIN Effective date: 20100611 |
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Free format text: CORRECT: ADDRESS; FROM: 518000 18E, BUILDING 2, DUSHI YANGGUANG MINGYUAN, NO.6017, SHENNAN STREET, FUTIAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 ROOM 803, BUILDING 2, BUILDING JIANXING, CHAGUANG INDUSTRY DISTRICT, SHAHE WEST ROAD, NANSHAN DISTRICT, SHENZHEN CITY |
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Effective date of registration: 20100611 Address after: 518000 building two, Jian Xing building, Cha Guang Industrial Zone, Shahe West Road, Shenzhen, Nanshan District 803, China Applicant after: Dajinjing Electric Energy Management Co., Ltd. Address before: Sunshine City Gardens Futian District No. 6017 Shennan Road Shenzhen city Guangdong province 518000 2 18E Applicant before: Zhu Jianqin |
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Owner name: TCORIENT EASTERN LIGHTING (SHENZHEN) CO., LTD. Free format text: FORMER NAME: TC INTERCONNECT ENERGY MANAGEMENT (SHENZHEN) CO., LTD. |
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Address after: 5, building 2, 518000 Industrial Zone, tea garden, Shahe West Road, Shenzhen, Nanshan District, Guangdong Patentee after: Dajin Orient Lighting (Shenzhen) Co., Ltd. Address before: 518000 building two, Jian Xing building, Cha Guang Industrial Zone, Shahe West Road, Shenzhen, Guangdong, Nanshan District 803, China Patentee before: Dajinjing Electric Energy Management Co., Ltd. |