CN101069196B - 高速rfid电路放置方法与器件 - Google Patents
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Abstract
一种高速工艺包括从具有第一间距的运载网状物(carrier web)上取下芯片或插入件,并将所述芯片或插入件转移至具有第二间距的移动网状物上的诸如RFID天线结构之类的电子组件。根据一种方法,通过在转移或传送滚筒(transfer drum)静止时拾取芯片,并在转移滚筒旋转以使得转移滚筒的切向速度与移动网状物的线速度基本相等时将芯片转移至移动网状物,转移滚筒(34)将芯片或插入件(38)转移至电子组件(42)的移动网状物(40)。
Description
技术领域
本发明一般涉及电子器件的组装。更具体地,本发明涉及射频识别(RFID)插入件、嵌入物和/或标签的组装。
背景技术
射频识别(RFID)标签和标记本说明书中共同称其为“器件”)广泛用于将物品与识别码联系起来。RFID器件通常具有天线与模拟和/或数字电子设备的组合,例如,模拟和/或数字电子设备包括通信电子设备、数据存储器和控制逻辑。此外,RFID器件包括支撑和保护天线和电子设备并将天线和电子设备安装或附着(attach)到物品上的结构。例如,RFID标签与汽车安全锁结合使用,还用于建筑物的出入控制和追踪库存品与包裹。一些RFID标签和标志的例子出现在美国专利第6,107,920、6,206,292和6,262,292号中,所有这些专利作为参考文献整体并入本申请中。
如上文所指出的,RFID器件通常被分类为标志或标签。RFID标志是黏附地或以其它方式直接附着于物品上。与之不同,RFID标签通过其它方式固定到物品上,例如使用塑料锁扣、线或其它紧固方式。此外,如下文所述,作为RFID标签和标志的替代性选择,在物品上直接安装或结合天线和电子设备中的一些或全部是可能的。正如本说明书中所使用的,术语“发射应答器”既指RFID器件又指天线与模拟和/或数字电子设备的RFID组合,其中天线和/或电子设备直接安装在物品上。
在很多应用中,RFID器件的尺寸和形状(形状因子)以及诸如柔韧性的机械性质是至关重要的。由于诸如安全、美观和生产效率的原因,形状因子有很强的向更小的方向发展的趋势。在需要薄度(thinness)和柔韧性时,避免使用增加RFID标签或标志的不适当的厚度或刚性的材料(诸如大的电子设备)和结构是很重要的。另一方面,RFID器件应具有充分的电连接、机械支撑和适当的组件(芯片、芯片连接器、天线)布置。针对这些目的的结构会增加RFID器件的复杂度、厚度和刚性。
例如在薄平的标签和标志中,另一个重要的形状因子是器件面积,并且天线的性能要求会影响该面积。例如,在偶极子天线的情况下,天线通常应具有约为射频器件的工作频率的半波长的物理长度。尽管对于RF标签的工作频率,此类天线的长度可能不够,但其仍大于很多期望的RFID器件的形状因子。
RFID标签和标志通常包括附着于天线的集成电路芯片。通常在连续的网状物上提供天线,并且通过使用商业上可获得的取放机(pick-and-place machine),RFID芯片被精确地放置在天线上。这些机器相对较慢,并且经常需要转位过程(indexing process),因此当芯片被放置到天线网状物上的天线上时,天线网状物停止一小段时间。因为天线网状物上天线的间距可以相当大,例如5到8厘米(2到3英寸),生产过程的速度会进一步减小,原因是在进行下一个放置操作前天线网状物必须移动相对较大的距离。当芯片放置位置非常接近的时候,取放设备一般具有最高的放置速度。
在很多应用中,需要尽量减小电子组件的尺寸。为了在RFID引入线(inlet)中互连天线和微小芯片,众所周知,可以采用一种被以不同的名称称呼的“插入件”、“条带”、或“承载件(carrier)”的结构以帮助器件制造。插入件包括传导导线或者与芯片的接触垫片电耦合的垫片,用于芯片与天线耦合。相较于没有插入件而直接放置的精确对准的芯片,这些垫片可用于提供更大的有效电接触面积。更大的面积降低了制造过程中对芯片放置的准确性要求,同时仍提供有效的电连接。芯片的放置与安装严重制约了高速制造。现有技术公开了多种RFID条带或者插入件结构,通常使用承载条带的接触垫片或导线的柔性衬底。结合了条带或插入件的RFID器件已经被公开了,例如,在美国专利第6,606,247号和欧洲专利出版物第1,039,543号中,这两个专利都作为参考整体并入本申请中。
尽管在将RFID芯片附着到天线上的过程中,使用条带或插入件是额外的步骤,但是在转移或传送(transfer)至天线结构的网状物的速度方面,条带或者插入件提供了优势。插入件的第二个优势是降低了放置到天线上的准确度要求。插入件和天线上的接触垫片可比RFID芯片连接所要求的接触垫片大得多,使得使用较低精确度要求的插入件放置设备成为可能。
插入件提供了这样的优势:它们可以被附着至移动网状物上的天线。但是,网状物速度和生产速度仍然很低。由于运载网状物上的条带或插入件的间距不同、以及插入件将要附着至的天线结构的间距不同,出现了一些困难。
组装插入件的一个方法以插入件导线或垫片的网状物和RFID芯片的网状物开始。通常RFID芯片与网状物分开,并且通过使用取放技术被放置到插入件导线上。芯片可以利用旋转的取放器件放置到插入件导线上,该旋转取放器件用于拾取RFID芯片并将芯片放置到网状物上的插入件导线上,以此形成插入件。替代性地,芯片的网状物可直接层叠至插入件导线的网状物。
正如本专利申请的说明书和权利要求书中所使用的,术语“RFID电路”既包括芯片,也包括结合了芯片的插入件。
通常,网状物上的RFID芯片的“间距”,也被称作相邻元件之间的中心至中心的距离,可不同于网状物上的插入件导线或其它电子组件的间距。在以下方向上,芯片的间距可以不同于将要形成的一排RFID标签或标志的间距:(a)在纵向(也被称为“沿网状物方向”)、(b)在横向(也称为“与网状物交叉方向”)、或(c)在这两个方向。例如,间距的不同可由例如元件本身的尺寸、制造考虑因素、和/或效率考虑因素引起。但是,当将RFID芯片从具有第一间距的网状物放置到具有第二间距的网状物上的插入件导线时,芯片必须被转位或换位(index)至插入件导线,或反之亦然。与之类似,当将插入件从具有第一间距的网状物放置到具有第二间距的网状物上的天线结构时,插入件和/或天线结构必须被转位。为了提高效率,转位过程应尽量无缝执行,最好不干扰包含插入件或天线结构的网状物的前进。
因此,希望提供一种方法和器件,以从具有第一间距的第一网状物将电子组件放置到具有第二间距的第二网状物上的电子组件上,其中组件的任何转位被执行时,都不妨碍电子组件的第二网状物的前进。
从上文中可以看出,RFID发射应答器制造工艺存在改进的余地。
发明内容
本发明提供了一种将芯片放置到电子组件上的方法,该方法包含:将RFID电路固定到沿圆周表面具有至少一个管嘴的转移滚筒;旋转转移滚筒;并将芯片放置到移动网状物上的电子组件上。旋转转移滚筒包括加速转移滚筒,以使得当芯片被放置到电子组件上时,至少一个管嘴的切向速度与移动网状物的线速度基本相等。当转移滚筒静止时,芯片可以固定至转移滚筒,此后当旋转转移滚筒时,转移滚筒被加速。
在一个实施例中,RFID电路包含RFID插入件,其包括安装至芯片的条带导线,并且放置步骤包括将插入件导线耦合至电子组件。电子组件可以是天线,并且放置步骤将插入件导线耦合至天线。
在另一个实施例中,RFID电路包含RFID插入件,所述方法可进一步包括:在固定步骤之前,从运载网状物或片上分开或者分离插入物的步骤。替代性地,固定步骤可包括将RFID插入件从另一转移构件转移至转移滚筒。
转移滚筒可沿其圆周表面包括一个或更多个管嘴。在多个管嘴的情况下,管嘴优选绕着转移滚筒的圆周表面均匀分开。在一个实施例中,转移滚筒包括绕着转移滚筒的圆周表面均匀分开的三个管嘴。例如,当转移滚筒静止时,管嘴可在12点钟、8点钟、和4点钟位置。在该实施例中,RFID电路可固定至位于12点钟位置的滚筒,并且被放置在位于6点钟位置的电子组件上。根据本发明的另一方面,提供了一种将RFID电路放置到电子组件上的方法,该方法包括:将RFID电路固定至转移滚筒,旋转转移滚筒,并将RFID电路放置到移动网状物上的电子组件上。旋转转移滚筒包括:加速转移滚筒,以使得当RFID电路被放置到电子组件上时,RFID电路的切向速度与移动网状物的线速度基本相等。
根据本发明的另一方面,提供了一种将RFID电路放置到电子组件上的方法,该方法包括:将RFID电路固定至主(primary)滚筒,将RFID电路从主滚筒转移至副(secondary)滚筒,并利用副滚筒将RFID电路放置到移动网状物上的电子组件上。转移步骤包括:调整主滚筒和副滚筒中的至少一个的圆周速度,以使得每个滚筒的圆周速度基本相等。放置步骤包括:调整副滚筒的圆周速度,以使得副滚筒的圆周速度与移动网状物的速度基本相等。
根据本发明的又一方面,提供了一种放置器件,其包含:至少一个主滚筒,其沿圆周表面具有至少一个主管嘴;至少一个副滚筒,其沿圆周表面具有至少一个副管嘴;至少一个马达,其可操作地耦合至滚筒中的至少一个;其中当主管嘴中的一个的轴与副管嘴中的一个的轴成一条直线时,滚筒的圆周速度基本相等,并且其中至少一个副滚筒以可变速率旋转,该可变速率是副管嘴的轴与主管嘴的轴是否成一条直线的函数。
根据本发明的另一方面,提供了一种放置器件,其包含:至少一个主滚筒,其沿圆周表面具有至少一个主管嘴;至少一个副滚筒,其沿圆周表面具有至少一个副管嘴;驱动工具,其耦合于至少一个滚筒;其中当主管嘴中的一个的轴与副管嘴中的一个的轴成一条直线时,滚筒的圆周速度基本相等,并且其中至少一个副滚筒以可变速率旋转,该可变速率是副管嘴的轴与主管嘴的轴是否成一条直线的函数。
为达到前述和相关目标,本发明包含将在后文充分描述和在权利要求中特别指出的特征。以下的描述和附图详细阐明本发明的某些示例性实施例。尽管如此,这些实施例仅说明了一些可应用本发明的原理的不同方式。参照以下本发明的详细描述并结合附图,本发明的其它目标、优势和新特性将显而易见。
附图说明
附图并不必然地依照比例绘制,其中,
图1是示出了本发明的一种方法的流程图;
图2A是根据本发明的单一滚筒、一个管嘴放置器件的侧视图;
图2B是根据本发明的单一滚筒、一个管嘴放置器件的侧视图;
图3A是示出了转移滚筒的速度分布的曲线图;
图3B是示出了转移滚筒的速度分布的曲线图;
图4是根据本发明的单一滚筒、三个管嘴放置器件的侧视图;
图5是根据本发明的单一滚筒、三个管嘴放置器件的侧视图;
图6是示出了本发明的一种方法的流程图;
图7是根据本发明的两个滚筒、三个管嘴放置器件的侧视图;
图8是根据本发明的两个滚筒、三个管嘴放置器件的斜视图;
图9是两个滚筒、三个管嘴放置器件的侧视图,其示出了在芯片从主滚筒转移至副滚筒期间的主滚筒和副滚筒;
图10是两个滚筒、三个管嘴放置器件的侧视图,其示出了将芯片放置到网状物上的天线结构上的副滚筒;
图11是两个滚筒、三个管嘴放置器件的侧视图,其示出了在芯片从主滚筒转移至副滚筒期间的主滚筒和副滚筒;
图12是本发明的实施例的分解图;以及,
图13是本发明的实施例的示意图。
具体实施方式
一种高速工艺包括:从具有第一间距的运载网状物上取下RFID电路,并将RFID电路转移至具有第二间距的移动网状物上的诸如RFID天线结构的电子组件。通常,第二间距大于第一间距。根据一种方法,通过在转移滚筒静止时拾取芯片,并在转移滚筒旋转以使得转移滚筒的切向速度与移动网状物的线速度基本相等时将芯片转移至移动网状物,转移滚筒将RFID电路转移至诸如天线的电子组件的移动网状物。根据另一种方法,主滚筒从具有第一间距的运载网状物上取下RFID电路,并且将RFID电路转移至间歇地或不定地旋转的副滚筒,此后,该副滚筒将RFID电路放置到具有第二间距的移动网状物上的电子组件上。
在图1中,所示出的流程图描述了将RFID电路放置到移动网状物上的天线上的方法5。下文将针对具有单一真空端口(port)或管嘴的转移滚筒描述图1中的方法5。尽管如此,应当理解,方法5对于多管嘴转移滚筒的任一单一管嘴是同样适用的。此外,尽管针对管嘴或孔描述该方法,但该方法不需管嘴或孔。
方法5以工序14开始,在工序14传输滚筒上的管嘴拾取单个化的(singulated)芯片。在这个实施例中,当转移滚筒上的位于12点钟位置的管嘴拾取RFID电路时,转移滚筒短暂地静止。在工序16中,转移滚筒被加速以使得当管嘴到达6点钟的位置时,管嘴的切向速度与电子组件的移动网状物的线速度基本相等。此后,在工序18中,RFID电路被从管嘴转移至电子组件的移动网状物。在RFID电路被转移至电子器件的移动网状物上后,在工序20中,转移滚筒被减速,以使得滚筒回到12点钟位置,在该位置上,管嘴位于适当位置以拾取另一个芯片,以将其转移至电子组件的移动网状物。
在转移滚筒的管嘴的一个实现方案中,管嘴是通过使用负压和正压来吸取和释放RFID电路的真空固定器。尽管如此,本发明也包括RFID电路至转移滚筒的机械固定或抓握(securement),并且正如本专利申请中所使用的,术语“管嘴”不仅包括真空固定,还包括RFID电路的机械固定。
参见图2A和2B,它们示出了一种高速放置器件30,其包括:诸如送料装置(magazine)的RFID电路供给器件32;和具有单一真空端口或管嘴36的转移滚筒34,其用于将RFID电路38从供给器件32转移至电子组件42的网状物40;以及基辊(base roller)44。正如图2A中所示,转移滚筒34位于RFID电路供给器件32与基辊44之间,管嘴36在12点钟位置。基辊44通常以适当的速度顺时针旋转,以此使电子组件42的网状物以恒定的速度从左到右前进。当转移滚筒34旋转时,其逆时针旋转。在该实施例中,通过选择性施加负压,当转移滚筒34短暂地静止而管嘴36位于12点钟位置时,管嘴36从供给器件32拾取RFID电路38。一旦RFID电路38被固定到管嘴36,转移滚筒34逆时针旋转并加速至放置速度,此时管嘴36和RFID电路38具有与移动网状物40的线速度基本相等的切向速度。在图2B中,示出了位于6点钟位置的管嘴36,RFID电路38被固定到其上,转移滚筒34旋转以使得管嘴36和/或RFID电路38的切向速度与移动网状物40的线速度基本相等。此后,通过选择性地撤掉负压和/或施加正压,RFID电路38被转移至网状物40上的电子组件42。由RFID电路38和电子组件42的组合而产生的RFID器件46继续在网状物40上移动。转移滚筒34可位于这样的位置:使得管嘴36向着网状物40上的电子组件42用力推RFID电路38。在放置RFID电路38后,转移滚筒34继续逆时针旋转,以此将管嘴36送回12点钟位置,在该位置,管嘴36再次静止并且位于适当位置以从供给器件32拾取另一个RFID电路38。
在本实施例中,转移滚筒从12点钟位置的0 RPM(圈每分钟)加速至6点钟位置的放置速度,并且回到12点钟的0 RPM。因而,转移滚筒34必须在180度(也即,在12点钟的拾取位置与6点钟的放置位置之间)旋转内,从静止加速到放置速度。应当意识到,放置滚筒34在旋转一周的过程中的加速和减速方式(本说明书中,其也被称为放置滚筒的速度分布),可以是任意适当的方式,其取决于多种因素,诸如放置器件30的总吞吐速度(total throughput rate),能将RFID电路38提供给转移滚筒34的速度,将RFID电路38固定到转移滚筒34的真空端口或管嘴36所需要的最少时间,等等。
在RFID电路是单个化的并且此后被固定至转移滚筒的实施例中,转移滚筒的速度分布通常会包括停留时间,或者转移滚筒保持静止以接收和固定单个化RFID电路的时间间隔。图3A和3B示出了转移滚筒的两个示例性速度分布。图3A示出了从静止到全速直线增加的速度分布,而图3B示出了拱形速度分布的例子。这些转移滚筒速度分布中的每个都可用于具有三个管嘴的转移滚筒,并且这些分布包括位于旋转周期中的0度、120度和240度的停留区域。其它转移滚筒配置也可具有类似的速度分布。
现参见图4和图5,下文将描述一种高速放置器件50,其具有三个管嘴的转移滚筒54。该实施例中的管嘴56a、56b、56c沿转移滚筒54的圆周以120度的间距排列。因而,在图4中,管嘴56a位于12点钟,管嘴56b位于8点钟,管嘴56c位于4点钟。RFID电路供给器件52位于转移滚筒54的12点钟位置之上。电子组件62的网状物60通过基辊64在转移滚筒54之下从左到右移动。在图4中,转移滚筒54短暂地静止,以允许管嘴56a从供给器件52拾取RFID电路58。
一旦RFID电路58被固定至管嘴56a,转移滚筒54开始对逆时针旋转进行加速。在本发明的三管嘴配置中,转移滚筒54必须从静止加速至放置速度,并且此后经过120度的弧度减速回静止。因而,如图4中所见,转移滚筒54必须在60度的弧A内达到放置速度,以此旋转56b至6点钟位置以放置先前从RFID电路供给器件52拾取的RFID电路58。固定至管嘴56b的RFID电路52的切向速度,在其到达6点钟位置时,与电子组件62的移动网状物60的线速度基本相等。因而,RFID器件66形成于网状物60上。在RFID电路58被放置后,转移滚筒54在图5中所示的60度的弧B内减速至0 RPM,因此将管嘴56c带至12点钟位置。
应当意识到,在本实施例中,转移滚筒54间歇地以120度的间隔旋转。在每个120度的旋转间隔期间,位于12点钟位置的第一管嘴(其可以是管嘴56a、56b或56c中的任意一个),当转移滚筒54静止时,从供给器件52拾取RFID电路58。此后,转移滚筒54加速通过60度的弧,直到适当的第二管嘴56a、56b或56c旋转以使得管嘴的切向速度与移动网状物60的线速度基本相等,此时RFID电路58被转移至网状物60上的电子组件62。在RFID电路58被放置之后,转移滚筒54在60度的弧上减速,直到适当的第三管嘴56a、56b或56c旋转到从供给器件52拾取RFID电路58的位置。应当意识到,管嘴的其它配置和/或多个RFID电路供给器件52是可以接受的。此外,尽管上面的描述以位于12点钟位置的管嘴56a开始,管嘴56a、56b或56c中的任意一个可以12点钟位置开始,而余下的两个管嘴适当地采用余下的两个相对位置。因此,上面的描述仅仅描述了可与本发明结合使用的多种可能的管嘴配置中的一种。
作为上述包括三个管嘴的转移滚筒的替代性选择,管嘴的其它配置和数量是可以接受的。具有围绕转移滚筒均匀分开的奇数个管嘴的配置与速度分布的优选类型相兼容,在该速度分布中转移滚筒在静止时在12点钟位置接收RFID器件,在6点钟位置加速到放置速度并在12点钟位置(可能经过一系列图3A、3B中的子周期)恢复到0 RPM。尽管如此,具有偶数个管嘴的配置也是可以接受的,诸如具有位于9点钟(RFID电路在此位置固定至转移滚筒)和3点钟的驻留区域的双管嘴配置。将管嘴数量增加到超过一定数量是不合需求的,原因是这会减小转移滚筒加速和减速发生所经过的角度间距。
在图6中,示出了描述方法105的流程图,该方法通过使用根据本发明的双滚筒放置器件,将RFID电路高速放置到网状物上的天线上。方法105以工序114开始,其中RFID电路由主滚筒拾取。主滚筒可装备真空源,该真空源用于为临时将RFID电路固定到主滚筒提供吸力。此后,在工序116中,RFID电路被从主滚筒转移至副滚筒。RFID从主滚筒转移至副滚筒可于主滚筒和副滚筒短暂地静止时发生,也可于主滚筒和副滚筒以基本相同的圆周速度旋转时发生。在工序118中,副滚筒被加速或减速以使得副滚筒的圆周速度与诸如天线结构的电子组件的网状物的速度基本相等。此后,在工序120中,RFID电路被放置到天线网状物上的天线结构上。此后,在工序122中,副滚筒被适当地加速或减速,以使得副滚筒的圆周速度与主滚筒的圆周速度基本相等,以此为另一个RFID电路从主滚筒转移至副滚筒做准备。在RFID电路被放置到天线结构上之后,RFID电路随后可以任意适当的方式与天线结构耦合。下文将关于图7-13进一步描述方法105。
在图7和图8中,示出了一种高速放置器件200。在这两个附图中,天线结构222的网状物220在器件200之下从左到右前进。运送RFID电路252的网状物250通过狭槽260进入高速放置器件200。RFID电路252在剥离端(peel tip)262处被从网状物250取下,并且网状物250在狭槽264处退出器件200。随着RFID电路252在剥离端处与网状物250分开,RFID电路252由主滚筒270拾取。通过主滚筒表面272中的多个主管嘴273施加真空,主滚筒270可固定RFID电路252。在主滚筒表面272上,也排列了多个凹口274和/或隆起部275,用于接收RFID电路252。
在图7和图8中示出的实施例中,主滚筒270以顺时针方式旋转,而副滚筒280逆时针旋转。当主滚筒270旋转时,被主滚筒270拾取的RFID电路252接近转移位置276。在该说明性实施例中,转移位置276对应于主滚筒270的6点钟位置和副滚筒280的12点钟位置。其它转移位置是可以接受的,诸如对应于主滚筒270的4点钟位置和副滚筒280的10点钟位置的转移位置。与之类似,可围绕副滚筒的圆周安置多于一个的主滚筒,以此使得RFID电路252能够在多于一个位置转移至副滚筒280。例如,副滚筒280可具有两个主滚筒,它们分别位于副滚筒280的2点钟位置和10点钟位置。
在转移位置276,RFID电路252被从主滚筒270转移至副滚筒280。在将RFID电路252从主滚筒270转移至副滚筒280之前,副滚筒被加速或减速,以使得在转移时,副滚筒的表面282的圆周速度与主滚筒270的表面272的圆周速度基本相等。
为了使得将RFID电路252从主滚筒270转移至副滚筒280更加便利,主滚筒270中的真空源被解除,以此去掉表面272上对RFID电路252的固定力。此外,滚筒280中的真空源被激活,以将RFID电路252固定至其表面282。为了辅助RFID电路252从主滚筒270的释放,主滚筒270可施加正压,以此向表面272上的RFID电路252提供分离力。在将RFID电路252从表面272转移到表面282的过程中,主滚筒270和副滚筒280可静止,或者替代性地,主滚筒270和副滚筒280可在RFID电路252转移期间旋转。
随着天线结构222的网状物220从左到右前进,天线结构222移动进入用于接受RFID电路252的放置位置290。随着天线结构222进入放置位置290,副滚筒280适当地加速或减速,以使得副滚筒280的表面282的圆周速度与网状物220的速度基本相等。滚筒280的旋转和速度被设定,以使得保持在表面282上的RFID电路252在放置位置290与网状物220上的天线结构222相接触。此时,副滚筒280中的真空源被去除,并且RFID电路252被放置到移动网状物220上的天线结构222上。副滚筒280可施加正压,以此向表面272上的RFID电路252提供分离力。
网状物220可包括粘合剂或其它工具,以将RFID电路252固定至天线结构222,以此使得将RFID电路252从副滚筒表面282转移至网状物220上的天线结构222更加便利。例如,在天线结构222到达放置位置290之前,粘合剂可施加于网状物220、天线结构222或二者。通常,在将RFID电路252放置到天线结构222期间,副滚筒280不需与网状物220或天线结构222进行接触。尽管如此,在某些情况下,诸如当使用压敏粘合剂以将RFID电路252耦合至天线结构222时,副滚筒280可与网状物220和/或天线结构222进行接触,以此提供压力以激活压敏粘合剂。为了这个目的,背辊(backing roller)或其它构件,诸如图2A、2B中的44处所示,图4和图5中64处所示,图7-10中295处所示,可形成辊隙压力(pressure nip)以使得将RFID电路转移至网状物更加便利。
现参见图9-11,将详细描述放置器件200的操作,尤其是主和副滚筒270和280的操作。在图9中,示出了主滚筒270和副滚筒280。主滚筒270包括多个主管嘴273,用于接收RFID电路252的凹口274和/或隆起部275。主滚筒270还包括用于将吸力指引至主滚筒表面272的真空源,以将RFID电路252临时固定于其上。在该实施例中,主滚筒270顺时针旋转。示出的RFID电路252通过由真空源提供的吸力固定至主滚筒270。当主滚筒270顺时针旋转时,固定至主滚筒表面272的RFID电路252旋转进入转移位置276,在该位置RFID电路252被转移至副滚筒280。主滚筒270可连续旋转、间歇旋转、或可变速地旋转,这取决于具体应用。
在说明性实施例中,副滚筒280包括三个副管嘴284a、284b、284c,它们围绕副滚筒280的表面282以120度的间距部署。应当意识到:在实践中,可以使用任意适当数量的副管嘴;尽管如此,为简化解释,此处示出了三个副管嘴。副滚筒280也包括真空源,其用于将吸力指引至副管嘴以将RFID电路252临时固定至副管嘴。
在图9中,主管嘴273和副管嘴284a处于转移位置276。在转移位置276,主管嘴273和副管嘴284a的轴成一条直线。示出的副管嘴284b有芯片252固定于其上。副管嘴284c没有芯片固定于其上。在图9和图10中,示出的天线结构222的网状物220处于副滚筒280之下,并且从左到右前进。
在图10中,副滚筒280从图9中所示的位置逆时针旋转了约60度。示出的副管嘴284a现在有RFID电路252固定于其上,如图9中所示的那样,RFID电路252被从主滚筒270转移。副管嘴284b现位于放置位置290。副管嘴284c,如图9中所示的那样,刚刚将RFID电路252放置到天线结构222上,副管嘴284c正接近放置位置276,在该位置,另一个RFID电路252将被转移至其上。在图10中,网状物220从左到右前进,以使得天线结构222处于放置位置290。此时,副滚筒280和/或副管嘴284b的圆周速度与网状物220的速度基本相等,副滚筒已被加速或减速以使得副管嘴284b的圆周速度与网状物220的速度基本相等。因而,尽管网状物220可以高速前进,但实质上,副管嘴284b和网状物220之间并不存在相对运动。当副管嘴284b处于放置位置290时,向副管嘴284b提供吸力的真空源被撤除,因此消除将RFID电路252固定至副管嘴284b的力,并且RFID电路252被放置到天线结构222上。
在将RFID电路放置到天线结构222上后,副滚筒280继续逆时针旋转以使得副管嘴284c前进到转移位置276,如图11中所示。随着副管嘴284c接近转移位置276,副滚筒280被加速或减速,以使得在转移位置276处,副滚筒280的副管嘴284c的圆周速度与主滚筒270的表面272和/或主喷嘴273的圆周速度基本相等。正如上文所提到的,主滚筒270和副滚筒280在转移工序期间,可以短暂地静止。
应当注意到:通过主滚筒270和/或副滚筒252的可变速旋转、或加速和/或减速,可实现将RFID电路252转位至天线结构222。因而,本实施例的双滚筒放置器件允许将RFID电路转位至具有比单一滚筒放置器件更大的间距的电子组件,原因是主滚筒和副滚筒都能执行一部分转位功能。主滚筒可间歇地旋转以执行转位功能,其间歇旋转的方式与副滚筒间歇旋转的方式相同,以将RFID电路转位至电子组件的网状物上。
现参见图12,其示出了根据本发明的另一个实施例的高速放置器件300的分解图。器件300包括剥离点(peel point)362,两个主滚筒370,和一个副滚筒380。在该实施例中,两个主滚筒370将RFID电路转移至副滚筒380的副喷嘴384a、384b和384c(图12中未示出382c)。在这种配置中,副滚筒380可将RFID电路放置到具有多于一道天线结构的网状物。器件300还包括主滚筒370每侧上的侧板390。轴承402支撑副滚筒380,并且上外壳412和下外壳414封住该器件。
在图13中,示意图示出了一种高速放置器件400,其包括:主滚筒470,耦合至主滚筒470的马达478,耦合至主滚筒470的真空源479。副滚筒480包括马达488和耦合至副滚筒480的真空源489。应当意识到,单一马达和单一真空源既可耦合至主滚筒470,也可耦合至副滚筒480。可使用任意适当的马达以向滚筒提供旋转力。例如,电动马达或液压马达可被耦合至滚筒以提供旋转力。此外,可使用适当的传动齿轮和变速箱组件以将马达或其它驱动工具耦合至滚筒。
应当意识到,可使用任意适当数量的主滚筒以将芯片或条带转移至一个或更多个副滚筒。主滚筒可沿共用轴布置,以将RFID电路转移至一个或更多个如图12中所示的副滚筒,以此允许同时将多于一个RFID电路放置到一个或更多个网状物上的多于一道中的多个天线结构。还应意识到,多于一个主滚筒可将RFID电路转移至副滚筒,其中主滚筒沿副滚筒的圆周布置在不同的圆周位置。
也应当意识到,在任一上面的实施例中,主滚筒与副滚筒的相对速度可通过适当的齿轮和/或电动马达控制。例如,步进马达驱动器可用于控制滚筒的相对速度。通过允许对高速放置器件的简单调整,以适应具有许多种组件间距的RFID电路网状物和天线网状物,使用具有计算机或其它数字控制的步进马达驱动器是极具优势的。
在RFID电路至天线结构的典型应用中,当副管嘴在转移位置与放置位置之间旋转时,副滚筒将被加速,以使得在放置位置,特定副管嘴的圆周速度比在拾取位置时的圆周速度大。因为在放置位置,副管嘴的圆周速度可被调整,并且天线结构的网状物的前进速度可被调整,所以本发明允许将RFID电路放置到具有多种间距的网状物上的天线结构上。
还应意识到,为了帮助将RFID电路放置到天线结构上,可采用视觉系统以读取坐标点和/或天线位置,并向控制主滚筒和副滚筒的控制系统、RFID电路运载网状物、和/或天线结构的网状物提供反馈。此外,可使用不同于剥离端的方法以将RFID电路从运载网状物单个化(singulate)。例如,运载网状物可被冲切(die cut),以此在由主滚筒拾取RFID电路之前,对RFID电路进行单个化处理。替代性地,运载网状物可在刀具构件和主滚筒之间通过,其中,通过将主滚筒作为铁砧使用来切割网状物,刀具构件对RFID电路进行单个化处理。
上面描述的放置器件允许第一运载网状物上的第一间距(通常相对较小)的RFID电路被转移至第二网状物上的天线或其它电子组件,第二网状物具有第二间距(通常相对较大),而第二网状物的速度没有变化。RFID电路运载网状物可根据需要具有恒定的、间歇的或可变的速度,以向主滚筒提供适当数量的RFID电路。与之类似,主滚筒可根据需要具有恒定的、间歇的、可变的旋转速度,以从运载网状物接收足够的RFID电路,并向副滚筒提供足够的RFID电路。
应当意识到,在上述任一实施例中,在放置期间,固定至滚筒的RFID电路的切向或圆周速度可与移动网状物的线速度基本相等。贯穿上述描述,当RFID电路被放置到移动网状物上的电子组件上时,提到了滚筒表面的切向或圆周速度,其与网状物的线速度基本相等。尽管如此,在某些配置中,尤其在采用了从滚筒的圆周表面向外伸出的管嘴的配置中,应当意识到是管嘴和/或固定于其上的RFID电路的切向速度与电子组件的移动网状物的线速度基本相等。因此,应当理解,滚筒表面被设计为RFID电路所固定至的表面。
在阅读前面的描述后,本领域内的技术人员可以想出某些修改和改进。应当理解,本发明并不限于任一特定类型的无线通信器件、或插入件。术语“电子组件”可包含电子电路或电子器件,并且在优选实施例中,其包含天线。天线可包括单一天线部分,或多个分开的天线部分。此外,本发明可使用多种天线设计,诸如环天线、缝隙天线、或贴片天线。在本申请中,“耦合”既可包括机械耦合,又可包括电耦合。机械耦合包括将插入件物理固定至电子组件。电耦合包括在插入件与电子组件之间形成电连接。电连接包括将插入件直接连接或电抗耦合至电子组件。电抗耦合定义为电容性耦合或电感性耦合,或者二者的组合。电容性耦合可包含将插入件放到与电子组件接近的位置,电介质垫片位于其间,以允许插入件与电子组件之间的电容性耦合。电介质垫片可包括:诸如压敏粘合剂的非导电粘合剂,例如可从Avery Dennison公司获得的Fasson粘合剂S4800和S333;和诸如钛化合物的高介电常数材料,例如二氧化钛或钛酸钡。电介质垫片具有有效介电常数,其是电介质垫片厚度的非常数方程。例如,电介质垫片可包括诸如铝和/或镍颗粒的导电颗粒,以使厚度变化对电容性耦合的影响最小。电介质垫片可具有约0.025毫米(0.001英寸)或更小的厚度。
尽管本发明的方法是针对RFID芯片、条带、插入件和天线结构描述的,但是对于直接将芯片放置到天线或将芯片放置到插入件导线之上,本发明的方法是极具优势的。例如,在上面的实施例中的任一个中,插入件导线可替换天线结构,并且芯片可被放置到插入件导线上而非天线结构上。
本领域内的普通技术人员将认识到:这些元件能以不同的方式实现本发明。本发明意在涵盖所要求的权利和任意等效物。本说明书中所使用的特定实施例是用于帮助理解本发明的,并不应被用于以窄于权利要求和其等效物的方式来限制本发明的范围。
虽然参照某一或某些实施例对本发明进行了展示和描述,但是很明显,通过对本说明书和附图的阅读和理解,本领域内的技术人员可以做出其它等效的变更或修改。特别是参照上述元件(组件、组装部件、器件、合成体等)所执行的不同功能,除非另外指出,即使其结构上不等效于执行本说明中的本发明的说明性、示例性实施例中的功能的所公开的结构,用于描述这些元件的术语(包括提到的“工具”)是用于与执行所描述的元件的指定功能的任何元件对应的(即,功能上等效)。此外,尽管只参照几个说明性实施例中的一个或几个描述了本发明的特定特征,但此特征可与其它实施例的一个或多个其它特征相组合,其对于其它任意给定或特定的应用,也是需要的和极具优势的。
Claims (12)
1.一种将RFID电路放置到电子组件上的方法,所述方法包含:
将RFID电路(38,58,252)固定至转移滚筒(34,54,280,480);
旋转所述转移滚筒;和
将所述RFID电路从所述转移滚筒放置到移动网状物(40,60,220)上的电子组件(42,62,222)上;
其中旋转所述转移滚筒包括:将所述转移滚筒从所述固定期间的较低的圆周速度加速到所述放置期间的较高的圆周速度,以使得当所述RFID电路被放置到所述电子组件上时,所述RFID电路的切向速度与所述移动网状物的线速度基本相等;
并且其中所述转移滚筒包括可操作地耦合至所述转移滚筒的圆周表面上的至少一个管嘴(36,56a,56b,56c,284a,284b,284c)的真空源,用于将所述RFID电路临时固定至所述转移滚筒。
2.根据权利要求1所述的方法,其中所述RFID电路包含RFID插入件,所述RFID插入件包括安装至RFID芯片的插入件导线。
3.根据权利要求1到2中的任一项所述的方法,其中所述转移滚筒在所述固定期间基本静止。
4.根据权利要求1所述的方法,其中所述固定包括将所述RFID电路从供给器件(32,52)转移至所述转移滚筒。
5.根据权利要求1所述的方法,其中加速所述转移滚筒包括将所述转移滚筒作为一个单位均匀地加速。
6.一种将RFID电路放置到电子组件上的方法,所述方法包含:
通过对真空源的选择性应用,将RFID电路(252)固定至主滚筒(270,470),所述真空源可操作地耦合至所述主滚筒的圆周表面上的至少一个管嘴(36,56a,56b,56c,284a,284b,284c);
将所述RFID电路从所述主滚筒转移至副滚筒(280,480);和
将所述RFID电路从所述副滚筒放置到移动网状物(220)上的电子组件(222)上;
其中所述转移包括调整所述主和副滚筒中的至少一个的圆周速度,以使得每个所述滚筒的所述圆周速度基本相等;
其中所述放置包括调整所述副滚筒的所述圆周速度,以使得所述副滚筒的所述圆周速度与所述移动网状物的速度基本相等;
其中所述转移和所述放置中的至少一个包括:增加所述主和副滚筒中的至少一个的所述圆周速度,以使得所述RFID电路的速度从所述固定期间的相对较低的圆周速度增加至所述放置期间的相对较高的圆周速度;
其中所述主和副滚筒包括真空源,所述真空源可操作地耦合至所述主滚筒的圆周表面上的至少一个主管嘴(36,56a,56b,56c,284a,284b,284c)和所述副滚筒的圆周表面上的至少一个副管嘴(284a,284b,284c),用于将所述RFID电路临时固定至所述主和副滚筒。
7.根据权利要求6所述的方法,其中所述转移包括使所述主滚筒的所述主管嘴中的一个的轴与所述副滚筒的所述副喷嘴中的一个的轴成一条直线。
8.根据权利要求6-7中的任一项所述的方法,其中所述RFID电路包括RFID插入件,其包括安装至所述RFID电路的插入件导线。
9.根据权利要求7所述的方法,其中所述主滚筒在所述固定期间基本静止。
10.根据权利要求6所述的方法,其中所述主滚筒包括多个围绕所述圆周表面的用于接收所述RFID电路的凹口(274)。
11.根据权利要求6所述的方法,其中所述主滚筒和所述副滚筒在同一平面上以相反的方向旋转。
12.根据权利要求6所述的方法,其中增加所述滚筒中的所述至少一个的所述圆周速度包括将所述滚筒中的所述至少一个作为一个单位来增加其圆周速度。
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US10/947,010 US7500307B2 (en) | 2004-09-22 | 2004-09-22 | High-speed RFID circuit placement method |
US10/947,010 | 2004-09-22 | ||
PCT/US2005/033668 WO2006036666A1 (en) | 2004-09-22 | 2005-09-21 | High-speed rfid circuit placement method and device |
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ES2402931T3 (es) | 2013-05-10 |
US20080061981A1 (en) | 2008-03-13 |
TW200611201A (en) | 2006-04-01 |
US7500307B2 (en) | 2009-03-10 |
US20060063323A1 (en) | 2006-03-23 |
KR20070067092A (ko) | 2007-06-27 |
US7669318B2 (en) | 2010-03-02 |
EP1800253B1 (en) | 2013-02-20 |
KR101182602B1 (ko) | 2012-09-14 |
US8020283B2 (en) | 2011-09-20 |
WO2006036666A1 (en) | 2006-04-06 |
US20100172737A1 (en) | 2010-07-08 |
EP1800253A1 (en) | 2007-06-27 |
CA2581425A1 (en) | 2006-04-06 |
CN101069196A (zh) | 2007-11-07 |
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