CN101057531A - 具有改进的通路设计的单层或多层印刷电路板 - Google Patents
具有改进的通路设计的单层或多层印刷电路板 Download PDFInfo
- Publication number
- CN101057531A CN101057531A CNA2005800386186A CN200580038618A CN101057531A CN 101057531 A CN101057531 A CN 101057531A CN A2005800386186 A CNA2005800386186 A CN A2005800386186A CN 200580038618 A CN200580038618 A CN 200580038618A CN 101057531 A CN101057531 A CN 101057531A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- hole
- conductive plate
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (36)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/987,480 US7485812B2 (en) | 2002-06-27 | 2004-11-11 | Single or multi-layer printed circuit board with improved via design |
US10/987,480 | 2004-11-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101057531A true CN101057531A (zh) | 2007-10-17 |
CN100571491C CN100571491C (zh) | 2009-12-16 |
Family
ID=35911131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800386186A Expired - Fee Related CN100571491C (zh) | 2004-11-11 | 2005-11-10 | 具有改进的通路设计的单层或多层印刷电路板 |
Country Status (11)
Country | Link |
---|---|
US (1) | US7485812B2 (zh) |
EP (1) | EP1817947A1 (zh) |
JP (1) | JP4739348B2 (zh) |
KR (1) | KR100996781B1 (zh) |
CN (1) | CN100571491C (zh) |
CA (1) | CA2586290C (zh) |
HK (1) | HK1109988A1 (zh) |
MX (1) | MX2007005637A (zh) |
MY (1) | MY149115A (zh) |
TW (1) | TWI318550B (zh) |
WO (1) | WO2006053206A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102869188A (zh) * | 2012-09-18 | 2013-01-09 | 武汉芯宝科技有限公司 | 一种具有全方位抗静电功能的印刷电路板及其制造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
KR100722625B1 (ko) * | 2005-12-12 | 2007-05-28 | 삼성전기주식회사 | 미소 홀랜드를 갖는 비아홀 및 그 형성 방법 |
US8008188B2 (en) * | 2007-06-11 | 2011-08-30 | Ppg Industries Ohio, Inc. | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials |
JP2009088390A (ja) * | 2007-10-02 | 2009-04-23 | Denso Corp | プリント基板、プリント基板の製造方法、及び電子装置 |
US7743494B2 (en) * | 2008-01-11 | 2010-06-29 | Ppg Industries Ohio, Inc. | Process of fabricating a circuit board |
KR101609597B1 (ko) * | 2009-02-16 | 2016-04-07 | 삼성디스플레이 주식회사 | 회로기판 및 이를 갖는 표시패널 어셈블리 |
JP5763962B2 (ja) * | 2011-04-19 | 2015-08-12 | 日本特殊陶業株式会社 | セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法 |
JP6601814B2 (ja) * | 2014-05-21 | 2019-11-06 | 住友電工プリントサーキット株式会社 | プリント配線板及びプリント配線板の製造方法 |
CN106132080A (zh) * | 2016-08-30 | 2016-11-16 | 江门全合精密电子有限公司 | 一种具有边绝缘结构的电银板及其制作方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2515875A1 (de) * | 1974-04-15 | 1975-10-23 | Texas Instruments Inc | Gedruckte schaltung und verfahren zu ihrer herstellung |
US4303715A (en) * | 1977-04-07 | 1981-12-01 | Western Electric Company, Incorporated | Printed wiring board |
JPS5527647A (en) * | 1978-08-17 | 1980-02-27 | Nippon Telegraph & Telephone | Paint for forming insulating film of conductive printed circuit board and method of forming insulating film |
US4221925A (en) * | 1978-09-18 | 1980-09-09 | Western Electric Company, Incorporated | Printed circuit board |
JPS60158764U (ja) * | 1984-03-31 | 1985-10-22 | 日本メクトロン株式会社 | フレキシブル金属ベ−ス回路基板 |
JPH0680894B2 (ja) * | 1984-07-17 | 1994-10-12 | 三菱電機株式会社 | 金属コアプリント基板の製造方法 |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
JPS63100798A (ja) * | 1986-10-17 | 1988-05-02 | 株式会社日立製作所 | 多層プリント基板の製造方法 |
EP0264105A3 (en) * | 1986-10-17 | 1988-07-27 | Hitachi, Ltd. | Method of producing multilayer printed-wiring board containing metal core |
JPH01225197A (ja) * | 1988-03-04 | 1989-09-08 | Canon Inc | プリント回路基板の製造方法 |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
JPH06244511A (ja) * | 1993-02-18 | 1994-09-02 | O K Print:Kk | プリント配線基板 |
JPH08307053A (ja) * | 1995-04-28 | 1996-11-22 | Matsushita Electric Works Ltd | 金属コアプリント配線板の製造方法 |
JPH11233904A (ja) * | 1998-02-18 | 1999-08-27 | Nec Corp | 放熱構造プリント基板 |
JP2000012723A (ja) * | 1998-06-23 | 2000-01-14 | Nitto Denko Corp | 回路基板の実装構造体およびそれに用いる多層回路基板 |
US6388208B1 (en) * | 1999-06-11 | 2002-05-14 | Teradyne, Inc. | Multi-connection via with electrically isolated segments |
JP4201436B2 (ja) * | 1999-07-14 | 2008-12-24 | 日東電工株式会社 | 多層配線基板の製造方法 |
JP2001111237A (ja) * | 1999-10-04 | 2001-04-20 | Mitsubishi Electric Corp | 多層プリント基板及び電子機器 |
JP3765970B2 (ja) * | 2000-07-12 | 2006-04-12 | ソニーケミカル株式会社 | エッチング液及びフレキシブル配線板の製造方法 |
US6951707B2 (en) | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
CN1672475B (zh) * | 2002-06-27 | 2011-11-23 | Ppg工业俄亥俄公司 | 有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法 |
-
2004
- 2004-11-11 US US10/987,480 patent/US7485812B2/en not_active Expired - Fee Related
-
2005
- 2005-11-10 CN CNB2005800386186A patent/CN100571491C/zh not_active Expired - Fee Related
- 2005-11-10 WO PCT/US2005/040907 patent/WO2006053206A1/en active Application Filing
- 2005-11-10 MY MYPI20055274A patent/MY149115A/en unknown
- 2005-11-10 JP JP2007540420A patent/JP4739348B2/ja not_active Expired - Fee Related
- 2005-11-10 CA CA2586290A patent/CA2586290C/en not_active Expired - Fee Related
- 2005-11-10 EP EP05851537A patent/EP1817947A1/en not_active Withdrawn
- 2005-11-10 MX MX2007005637A patent/MX2007005637A/es active IP Right Grant
- 2005-11-10 KR KR1020077010789A patent/KR100996781B1/ko not_active IP Right Cessation
- 2005-11-11 TW TW094139748A patent/TWI318550B/zh not_active IP Right Cessation
-
2008
- 2008-01-09 HK HK08100257.0A patent/HK1109988A1/xx not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102869188A (zh) * | 2012-09-18 | 2013-01-09 | 武汉芯宝科技有限公司 | 一种具有全方位抗静电功能的印刷电路板及其制造方法 |
CN102869188B (zh) * | 2012-09-18 | 2015-04-29 | 武汉芯宝科技有限公司 | 一种具有全方位抗静电功能的印刷电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006053206A9 (en) | 2006-08-24 |
KR20070058707A (ko) | 2007-06-08 |
MY149115A (en) | 2013-07-15 |
WO2006053206A1 (en) | 2006-05-18 |
JP2008519468A (ja) | 2008-06-05 |
CA2586290A1 (en) | 2006-05-18 |
US20050124196A1 (en) | 2005-06-09 |
TW200635467A (en) | 2006-10-01 |
TWI318550B (en) | 2009-12-11 |
CN100571491C (zh) | 2009-12-16 |
JP4739348B2 (ja) | 2011-08-03 |
HK1109988A1 (en) | 2008-06-27 |
EP1817947A1 (en) | 2007-08-15 |
US7485812B2 (en) | 2009-02-03 |
KR100996781B1 (ko) | 2010-11-25 |
CA2586290C (en) | 2012-01-10 |
MX2007005637A (es) | 2007-06-05 |
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