Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberCN101048273 A
Publication typeApplication
Application numberCN 200580036752
PCT numberPCT/JP2005/019831
Publication date3 Oct 2007
Filing date21 Oct 2005
Priority date26 Oct 2004
Also published asCN101048273B, EP1805003A1, US7740797, US20080286139, WO2006046671A1
Publication number200580036752.2, CN 101048273 A, CN 101048273A, CN 200580036752, CN-A-101048273, CN101048273 A, CN101048273A, CN200580036752, CN200580036752.2, PCT/2005/19831, PCT/JP/2005/019831, PCT/JP/2005/19831, PCT/JP/5/019831, PCT/JP/5/19831, PCT/JP2005/019831, PCT/JP2005/19831, PCT/JP2005019831, PCT/JP200519831, PCT/JP5/019831, PCT/JP5/19831, PCT/JP5019831, PCT/JP519831
Inventors阿部谕, 新开弘一
Applicant松下电工株式会社
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Photo-shaping method, photo-shaping system, and photo-shaping program
CN 101048273 A
Abstract
In photo-shaping a target object executed by a photo-shaping machine (10) along with a computing device (1), a first path (P1) is generated as a light beam irradiation path on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the first parameter data. A second path (P2) is generated as a removal processing path on the basis of the three-dimensional CAD model data, the second parameter data, and removing timing data showing a timing of executing the removal process. Driving programs (P3) are generated for executing the photo-shaping process including the light beam irradiation and the removal process, on the basis of the first path data, second path data and removing timing data, thereby performing the photo-shaping and removal process according to the driving programs.
Claims(11)  translated from Chinese
1.一种光成形方法,包括由光成形机(10)与计算设备(1)执行的计算过程一起对目标对象进行光成形的过程,所述光成形过程包括步骤:将光束照射到粉末材料层的指定位置,以使粉末材料的所需部分烧结,形成烧结层;用新的粉末材料层覆盖烧结层;将光束照射到新的粉末材料层的指定位置,使新的粉末材料粉末的所需部分烧结,与下面的烧结层整体地形成新烧结层;重复该过程形成层叠的烧结层;所述光成形过程还包括在重复形成烧结层的过程期间去除处于层叠的烧结层的形成体的外面的步骤,其特征在于,由计算设备(1)执行的计算过程包括步骤:将各种参数的第一参数数据存储于在光成形过程中用于光照射处理的第一参数数据库(2)中;将各种参数的第二参数数据存储在用于去除加工的第一参数数据库中(2);根据以要形成的目标对象的三维CAD模型数据的指定间距切开的每个断面的轮廓数据,和所述第一参数数据库(2)中存储的第一参数数据,产生第一路径(P1),作为用于光照射处理的光束照射路径;根据三维CAD模型数据,所述第二参数数据库(3)中存储的第二参数数据,和指示执行去除加工的定时的去除定时数据,产生第二路径(P2),作为用于去除加工的去除加工路径;根据第一路径数据,第二路径数据和去除定时数据,产生驱动用于执行光成形过程的光成形机(10)的驱动程序,所述光成形过程执行包括光束照射和去除加工,从而根据驱动程序进行光成形和去除加工。 An optical shaping method, including by the optical forming machine (10) with the computing device (1) calculation process executed on the target object along the optical shaping process, the process comprising the step of forming the light: the light beam is irradiated to the powder material Specifies the position of the layer, so that the partial sintering of powder material required to form a sintered layer; covering the sintered layer with a new powder material layer; irradiating a light beam to a new powder material layer to the specified position of the new powder material powder by require partial sintering, the new sintered layer with the underlying sintered layer formed integrally; the process is repeated to form a laminated sinter layers; the light during the forming process further comprises repeating the sintered layer forming process is removed in the stacked layers of a sintered body is formed Step outside, characterized in that, by the computing device (1) comprises the step of executing the calculation process: the first parameter data of various parameters stored in the optical forming process for the first parameter database light irradiation treatment (2) ; and the second parameter data of various parameters stored in the first parameter database for the removal process in (2); the pitch contour to the specified target object's three-dimensional CAD model data to be formed for each cut section of the data, and the first parameter database (2) the data stored in the first parameter, generating a first path (P1), as a light beam irradiation path for the light irradiation treatment; three-dimensional CAD model data, the second parameter database (3) the data stored in the second parameter, and instructing to execute the timing of the removal process for removing timing data, generating a second path (P2), the removal process for removing a processing path; data according to the first path, the second path data and removing timing data, to generate driving the optical forming process for performing optical shaping machine (10) of the driver, the forming process performed including light beam irradiation and the removal process, thereby performing optical shaping and removal process according to the driver.
2.一种光成形系统,包括与计算设备(1)一起对目标对象进行光成形的光成形机(10),所述光成形机具有光照射装置(8),用于将光束照射到粉末材料层的指定位置,以使粉末材料的所需部分烧结,形成烧结层;用新的粉末材料层覆盖烧结层,将光束照射到新的粉末材料层的指定位置,使新的粉末材料粉末的所需部分烧结,与下面的烧结层整体地形成新的烧结层;重复该过程形成层叠的烧结层;所述光成形机还具有去除加工装置(8),用于去除在重复形成烧结层的过程期间去除层叠的烧结层的形成体的外面,其特征在于,所述计算设备(1)包括:第一参数数据库(2),用于存储在由所述光照射装置(7)执行的光成形过程中使用的各种参数;第二参数数据库(3),用于存储在由所述去除加工装置(8)执行的去除加工中使用的各种参数;第一路径产生装置(13),用于根据以要形成的目标对象的三维CAD模型数据的指定间距切开的每个断面的轮廓数据,和所述第一参数数据库(2)中存储的参数数据,产生第一路径(P1),作为用于所述光照射装置的光束照射路径;第二路径产生装置(14),用于根据三维CAD模型数据,所述第二参数数据库(3)中存储的参数数据,和指示执行去除加工的定时的去除定时数据,产生第二路径(P2),作为用于所述去除加工装置的去除加工路径;驱动程序产生装置(15),根据所述第一路径数据,第二路径数据和去除定时数据产生用于驱动所述光成形机(10)和所述去除加工装置(8)的驱动程序(P3),从而使所述光成形机(10)和所述去除加工装置(8)根据驱动程序进行光成形和去除加工。 2. An optical shaping system comprising a computing device (1) for the target object along an optical light shaping forming machine (10), said optical molding machine having a light irradiation means (8) for irradiating a light beam to a powder Specify the location of the material layer, so that the partial sintering of powder material required to form a sintered layer; covering the sintered layer with a new powder material layer, irradiating a light beam to a new powder material layer to the specified position of the new powder material powder desired partially sintered, forming a new sintered layer with the underlying sintered layer integrally; the process is repeated to form a laminated sintered layer; said molding machine further comprising removing the optical processing means (8) for removing the sintered layer is formed in a repeating removing the outer body is formed of a sintered layer during the laminating process, characterized in that said computing device (1) comprises: a first parameter database (2), for light emitted by said light irradiation means (7) stored in the execution the various parameters used during forming; the second parameter database (3) for storing various parameters used in the removal process by the removal processing means (8) is executed; first path generating means (13), pitch contour data according to the specified three-dimensional CAD model of the target object to be formed of data of each section of the cut, and the first parameter database (2) stored in the parameter data, generating a first path (P1) removing the second execution path generating means (14) for the three-dimensional CAD model data, parameter data of said second parameter database (3) stored, and instructions; as a path of the optical beam irradiating means for irradiating the removing timing data processing timing, generating a second path (P2), as a machining path for the removal processing means of removal; driver generating means (15), data based on the first path, second path data and removing timing data for driving the light-shaping machine (10) and the removal processing means (8) of the driver (P3), so that said light shaping machine (10) and the removal processing means (8) light shaping and removal process according to the driver.
3.根据权利要求2所述的光成形系统,其中第二路径产生装置(14)根据三维CAD模型数据和所述第二参数数据库(3)中存储的参数数据来确定由去除加工装置(8)执行的去除加工中使用的去除工具。 The optical shaping system according to claim 2, wherein the second path generating means (14) based on the three-dimensional CAD model data and parameter data of said second parameter database (3) is determined by the stored removal processing means (8 ) removal tool removal processing executed used.
4.根据权利要求2或3所述的光成形系统,其中所述第二路径产生装置(14)根据三维CAD模型数据和所述第二参数数据库(3)中存储的参数数据产生去除定时数据,在产生所述去除定时数据时所参考的参数数据包含与切削深度的向下重叠量(ovr)有关的数据。 The optical shaping system according to claim 2 or claim 3, wherein said second path generating means (14) generates removing timing data according to the three-dimensional CAD model data and parameter data of said second parameter database (3) stored in Meanwhile, when generating the removing timing data contains data of the reference parameter data associated with the depth of cut down the amount of overlap (ovr).
5.根据权利要求2至4中的任何一项所述的光成形系统,其中所述第二路径产生装置(14)在去除定时沿高度方向分割针对整个对象模型产生的第二路径(P2)。 According to claims 2 to 4 according to any one of the optical shaping system, wherein said second path generating means (14) in the height direction dividing removing timing generated for the entire object model of the second path (P2) .
6.根据权利要求5所述的光成形系统,其中所述第二路径产生装置(14)产生连贯地连接相邻的第二路径的空中线路路径,忽略所产生的第二路径的对象范围之上的形状。 The scope of the object according to an optical shaping system of claim 5, wherein said second path generating means (14) generates coherent connecting adjacent second air line route path, ignoring the path of the generated second shapes.
7.根据权利要求2至4中的任何一项所述的光成形系统,其中所述第二路径产生装置(14)根据预定的去除定时数据,沿高度方向分割三维CAD模型,根据分割的模型形状和存储在用于去除加工的所述第二参数数据库(3)中的参数数据来产生第二路径。 According to claims 2 to 4 according to any one of the optical shaping system, wherein said second path generating means (14) according to a predetermined timing removal data, the height direction dividing three-dimensional CAD model, based on segmentation model shape and stored in the processing for removing a second parameter database (3) of the parameter data to generate a second path.
8.根据权利要求7所述的光成形系统,其中所述第二路径产生装置构造在光成形中产生的剩余硬化部分的模型,依据所获得的剩余硬化模型确定去除范围,根据去除范围产生第二路径。 8. The optical shaping system according to claim 7, wherein the hardened portions of the remaining model generated in the device configuration wherein the second optical path forming generation, residual hardening model is determined based on the obtained removal range, generates a first range according to remove two paths.
9.根据权利要求7所述的光成形系统,其中所述第二路径产生装置(14)在由去除定时指定的范围的最低轮廓,和从所述最低轮廓向外侧偏移指定量的偏移轮廓之间的区域中确定去除范围,根据所述去除范围产生第二路径。 9. The optical shaping system according to claim 7, wherein the minimum at the timing specified by the outline removal range, and shifts to the specified amount of offset from the lowest contour of the outer device (14) wherein said second path generating region outline removal range between the determined, generating a second path based on the removing range.
10.根据权利要求7至9中的任何一项所述的光成形系统,其中所述第二路径产生装置(14)在分割模型间的每个不连贯区域中产生第二路径,产生链接所述第二路径的空中线路路径。 According to claims 7 to 9, the optical forming system of any one of claims, wherein said second path generating means (14) generates a second path in each region not consecutive among divided models, and generates links said air line path of the second path.
11.根据权利要求2至10中的任何一项所述的光成形系统,其中所述第二路径产生装置(14)在用作切削装置的去除加工装置(8)执行的去除加工中,依据第二参数数据库(3)中包含的工具形状来确定与去除对象部分接触的接触开始位置,根据所述接触开始位置产生第二路径。 According to claim 2-10 in an optical shaping system of any one of claims, wherein said second path generating means (14) in removing machining device is used as a cutting means (8) removing processing executed, based on a second parameter database (3) contained in the tool to determine the shape of the contact start position in contact with the removed portion of the object, generates a second path based on the contact start position.
Description  translated from Chinese
光成形方法,光成形系统,和光成形程序 An optical molding method, an optical forming system, and a light shaping procedures

技术领域 FIELD

本发明涉及由粉末材料制造三维对象的光成形技术,特别是,涉及通过用光束照射到粉末材料层的指定位置,使粉末层烧结,去除在重复形成烧结层期间目前形成的三维对象的外面,来获得目标三维对象的光成形方法,和实施光成形方法的光成形系统和光成形程序。 The present invention relates to a three-dimensional object from a powder material of the light forming technology, in particular, to a light beam irradiated by the powder material layer to the specified position, so that the powder layer is sintered, is removed out of the sintered layer is formed during the repetition of the current three-dimensional object is formed, an optical system forming an optical forming method to obtain the target three-dimensional object, and the implementation of an optical molding method and optical shaping procedures.

背景技术 BACKGROUND

日本专利申请公开No.2002-115004(专利文献1)中公开了一种传统的光成形方法。 Japanese Patent Application Publication No.2002-115004 (Patent Document 1) discloses a conventional optical molding method. 在该方法中,光束照射到粉末材料层的指定位置,使粉末材料层的对应部分烧结(包括曾经熔化的情况),以形成烧结层。 In this method, the beam irradiation to the specified position of a powder material layer, so that a corresponding portion of a sintered powder material layer (including the case of once melt), to form a sintered layer. 然后,用新的粉末材料层覆盖烧结层,用光束照射其指定位置,以使新的粉末材料层的对应部分烧结,从而形成与下面的烧结层结合成一体的新烧结层。 Then, with a new powder material layer covers a sintered layer, which is irradiated with a light beam designated location, so that the corresponding portion of the new powder material layer is sintered to form a sintered layer in conjunction with the following new sintered layer integrally. 在重复该烧结层形成过程的同时,在形成烧结层的重复步骤期间,对通过层叠的烧结层获得的形成体的外面进行去除加工。 In repeating the sintered layer forming process, while, during the repeated steps to form a sintered layer, is formed on the outside of the body obtained by laminating the sintered layer removal process.

在这种传统的光成形方法中,如专利文献1所揭示的,根据从要生成的三维对象的三维CAD模型数据获得的STL模型数据,为了由光束照射装置和去除加工装置执行光束照射处理和去除加工而计算两个装置的加工路径,以便根据获得的加工路径数据来驱动光束照射装置和去除加工装置。 In such a conventional optical shaping method, as disclosed in Patent Document 1, according to the STL model data obtained from three-dimensional CAD model to generate three-dimensional object data, in order to perform beam irradiated by the beam irradiation processing device and a removal processing means and The calculation processing means for removing the two processing paths, so that the machining path according to the obtained data to drive the beam irradiation means and the removal processing means.

在该过程中,即使是在传统的CAD中,通过在高度(垂直)方向顺序地指定加工范围能够获得在层叠烧结层以形成对象过程中要插入的去除加工中使用的加工路径(即,第二路径)。 In this process, even in the conventional CAD by sequentially processing range specified in the height (vertical) direction can be obtained in the laminated sintered layers to form the object during the machining route to be inserted for use in the removal process (i.e., the first two paths). 然而,当沿高度方向的分割数量增加时,要花费大量劳力和时间,并且操作人员很容易出现错误。 However, when the number of dividing the height direction, it takes a lot of labor and time, and is prone to operator error.

例如,当以0.05mm的层叠间距每层叠10层时执行去除加工的情况下,如果成形体的高度是100mm,分割数量则是200,如果使用5种去除工具,总的分割数量变为1000。 For example, the case of performing removal processing When stacking pitch of 0.05mm each laminated layer 10, if a height of the molded body is 100mm, the number of partitions is 200, if the use of five kinds of the removal tool, the total number is divided into 1000. 如果在设置和进入高度范围中以这样的次数来计算第二路径,这将导致操作者的劳动过多,并且很容易出现错误。 If the setting and entering the height range in such a number of times to calculate the second path, which will lead to too much labor of the operator, and prone to error. 另外,必须通过按加工顺序安排第二路径的数量来产生程序,将该程序传送到去除加工装置,在用手工进行时,该项工作也要占用大量时间和劳力。 In addition, the number must be generated by the second path arranged by the processing sequence program, the program to remove the processing device carried by hand at the time, the work should take a lot of time and labor.

发明内容 SUMMARY

为了解决现有技术中的上述问题,已经做出了本发明,本发明的目的是提供一种光成形方法,光成形系统,和光成形程序,能够有效地执行光成形,包括在重复层叠烧结层的步骤期间的去除加工。 In order to solve the above problems in the prior art, the present invention has been made, an object of the invention is to provide an optical molding method, an optical shaping system, and optical forming process can be efficiently performed photoforming, comprising repeating laminated sintered layer removed during processing steps.

为了实现上述目的,本发明提供一种光成形方法,包括由光成形机与计算设备执行的计算过程一起对目标对象进行光成形的过程,所述光成形过程包括步骤:将光束照射到粉末材料层的指定位置,以使粉末材料的所需部分烧结,形成烧结层;用新的粉末材料层覆盖烧结层;将光束照射到新的粉末材料层的指定位置,使新的粉末材料粉末的所需部分烧结,与下面的烧结层整体地形成新烧结层,重复该过程形成层叠的烧结层,和包括在重复形成烧结层的过程期间去除处于层叠的烧结层的形成体的外面的步骤。 To achieve the above object, the present invention provides an optical molding method, including the calculation process performed by the light-molding machine, together with the computing device to the target object light forming process, the light forming process comprising steps of: irradiating a light beam to the powder material Specifies the position of the layer, so that the partial sintering of powder material required to form a sintered layer; covering the sintered layer with a new powder material layer; irradiating a light beam to a new powder material layer to the specified position of the new powder material powder by require partial sintering, with the underlying sintered layer formed integrally new sintered layer, repeating the process of forming the laminated sintered layer, and including during the process is repeated to form a sintered layer is removed at the outside of the laminated body formed sintered layer step.

该方法的特征在于,由计算设备执行的计算过程包括步骤:将各种参数的第一参数数据存储于在光成形过程中用于光照射处理的第一参数数据库中;将各种参数的第二参数数据存储在用于去除加工的第一参数数据库中;根据以要形成的目标对象的三维CAD模型数据的指定间距切开的每个断面的轮廓数据,和所述第一参数数据库中存储的第一参数数据,产生第一路径,作为用于光照射处理的光束照射路径;根据三维CAD模型数据,所述第二参数数据库中存储的第二参数数据,和指示执行去除加工的定时的去除定时数据,产生第二路径,作为用于去除加工的去除加工路径;根据第一路径数据,第二路径数据和去除定时数据产生驱动光成形机的驱动程序,所述驱动程序执行包括光束照射和去除加工的光成形过程,从而根据驱动程序进行光成形和去除加工。 The method is characterized in that the calculation process executed by a computing device comprising the steps of: a first parameter data of various parameters stored in the first parameter database for the light irradiation process in the optical forming process; various parameters of the first Second parameter data stored in the first parameter database for the removal process in; contour data in accordance with each section of the designated interval to the three-dimensional CAD model of the target object to be formed cut data, and the first parameter stored in the database The first parameter data, generating a first path as a light beam irradiation path for the light irradiation treatment; timing according to the three-dimensional CAD model data, the second parameter the second parameter data stored in the database, and instruct the execution of the removal process removing timing data, generating a second path as a removal processing path for the removal process; the data based on a first path, second path data and removing timing data for driving the light forming machine driver, including the driver performs beam irradiation and removing the optical forming process processing, thereby performing optical shaping and removal process according to the driver.

本发明还提供一种光成形系统,包括与计算设备一起对目标对象进行光成形的光成形机,所述光成形机具有光照射装置,用于将光束照射到粉末材料层的指定位置,以使粉末材料的所需部分烧结,形成烧结层;用新的粉末材料层覆盖烧结层,将光束照射到新的粉末材料层的指定位置,使新的粉末材料粉末的所需部分烧结,与下面的烧结层整体地形成新的烧结层,重复该过程形成层叠的烧结层,和具有去除加工装置,用于去除在重复形成烧结层的过程期间去除层叠的烧结层的形成体的外面。 The present invention also provides an optical forming system, comprising a computing device on the target object along an optical light forming molding machine, the molding machine having a light irradiation means for irradiating a light beam to the powder material layer to specify the location, in order to so that part of the required sintering of the powder material, to form a sintered layer; covering the sintered layer with a new powder material layer, irradiating a light beam to a new powder material layer at a specified position, so that part of the new powder material necessary for sintering the powder, and the following The sintered layer formed integrally new sintered layer, repeating the process of forming the laminated sintered layer, and having a removal processing means for removing the outside during the process is repeated to form a sintered layer formed laminated body is removed sintered layer.

该系统的特征在于,所述计算设备包括:第一参数数据库,用于存储在由所述光照射装置执行的光成形过程中使用的各种参数;第二参数数据库,用于存储在由所述去除加工装置执行的去除加工中使用的各种参数;第一路径产生装置,用于根据以要形成的目标对象的三维CAD模型数据的指定间距切开的每个断面的轮廓数据,和所述第一参数数据库中存储的参数数据,产生第一路径,作为用于所述光照射装置的光束照射路径;第二路径产生装置,用于根据三维CAD模型数据,所述第二参数数据库中存储的参数数据,和指示执行去除加工的定时的去除定时数据,产生第二路径,作为用于所述去除加工装置的去除加工路径;驱动程序产生装置,根据所述第一路径数据,第二路径数据和去除定时数据产生用于驱动所述光成形机和所述去除加工装置的驱动程序,从而使所述光成形机和所述去除加工装置根据驱动程序进行光成形和去除加工。 The system is characterized in that, said computing apparatus comprising: a first parameter database for storing various parameters used in the optical forming apparatus of the process performed by the light irradiation; a second parameter database for storing by the removing said removal processing of various parameters used in the processing executed by the apparatus; a first path generating means for the data based on the specified pitch contour to 3D CAD model of the target object to be formed of data of each section of the cut, and the said first parameter stored in the parameter data in the database, generating a first path as a light beam irradiation path for the light irradiation means; a second path generating means for the three-dimensional CAD model data, the second parameter database Parameter data storage, and instructed to perform removal processing for removing the timing of the timing data, generating a second path as a removal processing path for the removal processing means; driver generating means, based on said first data path, second path data and removing timing data for driving the light-shaping machine and the removal processing means of the driver, so that said light shaping machine and the removal processing means shaping and removal process according to the optical driver.

第二路径产生装置根据三维CAD模型数据和所述第二参数数据库中存储的参数数据来确定由去除加工装置执行的去除加工中使用的去除工具。 Second path generating means to determine the removal of the tool by removing the processing apparatus performs removal processing according to the parameters used in the three-dimensional CAD model data and second parameter data stored in the database. 由此,能够利用适合于模型成形的适当工具进行去除加工。 Therefore, by using a suitable tool adapted to the model forming removal processing.

优选的是,所述第二路径产生装置根据三维CAD模型数据和所述第二参数数据库中存储的参数数据产生去除定时数据,和在产生所述去除定时数据中参考的参数数据包含与切削深度的向下重叠量有关的数据。 Preferably, the second path generating means generates removing timing data according to the parameter data and the three-dimensional CAD model data stored in the second parameter database, and removing timing data in generating the reference parameter data comprises cutting depth The data relating to downward overlapping amount. 由此,能够根据工具的形状自动地设置适合的去除定时,并且与去除总是在相同去除定时的情况相比,能够减少去除次数,有效地利用工具的切削齿的长度,能够减少换工具的次数,减少重叠量,节省浪费过程,和缩短加工时间。 Thereby, it is possible to automatically set according to the shape of the tool for removal of the timing, and removal is always compared with the same timing of the removal, it is possible to reduce the number of removal, effective use of the length of the cutting teeth of the tool, the tool change can be reduced times, reducing the amount of overlap, save waste process and shorten the processing time.

所述第二路径产生装置在去除定时沿高度方向分割针对整个对象模型产生的第二路径。 Generating means in said second path split second timing path for removing the entire object model generated in the height direction. 只需要一次耗时的模型形状识别过程,能够缩短计算加工时间。 Processed only once model shape recognition process, the calculation processing time can be shortened.

这种情况下,优选的是,所述第二路径产生装置产生连贯地连接相邻的第二路径的空中线路路径,忽略产生的第二路径的对象范围之上的形状。 In this case, it is preferable that the second path generating means generates consecutively connecting adjacent second air line route path, the shape of the object range of the second path is ignored generated above. 由此,能够忽略浪费的干扰检验,并进一步缩短计算过程。 Thereby, it is possible to ignore wasted interference testing, and to further shorten the calculation process.

所述第二路径产生装置根据预定的去除定时数据,沿高度方向分割三维CAD模型,和根据分割的模型形状,和存储在用于去除加工的所述第二参数数据库中的参数数据来产生第二路径。 The second path generating means according to predetermined removing timing data, the height direction dividing three-dimensional CAD model, and the model parameters based on the shape data segmentation, and stored in the processing for removing the second parameter database to generate the first two paths. 由此,能够将优化的去除工具用于每个分割的模型,能够获得无浪费的第二路径。 Thereby, it is possible to optimize the removal tool is used for each divided model, the second path can be obtained without waste.

所述第二路径产生装置构造在光成形中产生的剩余硬化部分的模型,和由所获得的剩余硬化模型确定去除范围,和根据去除范围产生第二路径。 The second path generating means Model remaining hardened portion generated in the structure forming the light, and the remaining hardening model is determined by removing the obtained range, and generates a second path based removal range. 由此,能够获得更有效的第二路径。 Thereby, it is possible to obtain more efficient second paths.

所述第二路径产生装置在由去除定时指定的范围的最低轮廓,和从所述最低轮廓向外侧偏移指定量的偏移轮廓之间的区域中确定去除范围,和根据所述去除范围产生第二路径。 The second path to produce the lowest contour device timing specified by the removal of the range, and to determine the removal of the scope, and according to the area from the outer contour of the lowest offset a specified amount of the offset between the removal of the contour range produce second path. 这种情况下,能够获得更有效的第二路径。 In this case, it is possible to obtain more efficient second paths.

如果所述第二路径产生装置在分割模型间的每个不连贯区域中产生第二路径,和产生链接所述第二路径的空中线路路径,很容易识别所谓的岛的一部份,能够获得无浪费的第二路径。 If the second path generating means generates a second path, and the air line route generating link of the second path in each region not consecutive among divided models, it is easy to identify a part of a so-called island, can be obtained The second path without waste.

优选的是,所述第二路径产生装置在用作切削装置的去除加工装置执行的去除加工中,依据第二参数数据库中包含的工具形状来确定与去除对象部分接触的接触开始位置,和根据所述接触开始位置产生第二路径。 Preferably, the second path generating means used in the removal processing means for removing the cutting performed in the processing apparatus, according to the tool shape contained in the second parameter database to determine the portion of the object in contact with the removal contact start position, and according to The contact start position to generate a second path.

本发明还提供一种光成形程序,生成由计算机执行的驱动程序,用于对由光成形机与计算过程一起执行的目标对象执行光成形过程,所述光成形过程包括步骤:将光束照射到粉末材料层的指定位置,以使粉末材料的所需部分烧结,形成烧结层;用新的粉末材料层覆盖烧结层;将光束照射到新的粉末材料层的指定位置,使新的粉末材料粉末的所需部分烧结,与下面的烧结层整体地形成新烧结层,重复该过程形成层叠的烧结层,和包括在重复形成烧结层的过程期间去除层叠的烧结层的形成体的外面的步骤。 The present invention also provides a light-shaping process executed by a computer to generate the driver for the implementation of the target object by light performed together with the calculation of the light forming machine forming process, the light-shaping process comprises the steps of: irradiating a light beam to Specify the location of the powder material layer, so that the partial sintering of powder material required to form a sintered layer; covering the sintered layer with a new powder material layer; irradiating a light beam to a new powder material layer specified position, so that the new powder material powder The partially sintered desired, with the underlying sintered layer formed integrally new sintered layer, repeating the process of forming the laminated sintered layer, and comprises a body formed outside the laminated sintered layer forming step is repeated during the course of the sintered layer is removed.

该程序的特征在于,由计算机执行的计算过程包括步骤:将各种参数的第一参数数据存储在用于光照射处理的第一参数数据库中;将各种参数的第二参数数据存储在用于去除加工的第一参数数据库中;根据以要形成的目标对象的三维CAD模型数据的指定间距切开的每个断面的轮廓数据,和所述第一参数数据库中存储的第一参数数据,产生第一路径,作为用于光照射处理的光束照射路径;根据三维CAD模型数据,所述第二参数数据库中存储的第二参数数据,和指示执行去除加工的定时的去除定时数据,产生第二路径,作为用于去除加工的去除加工路径;根据第一路径数据,第二路径数据和去除定时数据产生驱动光成形机的驱动程序,使所述光成形机执行包括光束照射和去除加工的光成形过程,从而根据所述驱动程序进行光成形和去除加工。 Characterized in that the program calculation process performed by the computer comprising the steps of: storing first parameter data of various parameters in the first parameter database for the light irradiation treatment; the second parameter data of various parameters stored in the use removing machining in a first parameter database; based on the contour data of each section of the designated interval to the three-dimensional CAD model of the target object to be formed cut data, and the first parameter of the first parameter data stored in the database, generating a first path as a light beam irradiation path for the light irradiation treatment; removing timing data according to the timing of the three-dimensional CAD model data, the second parameter the second parameter data stored in the database, and instructing to execute the removal process, resulting in the first second path, as the removal processing path for the removal process; the data based on a first path, second path data and removing timing data for driving the light forming machine driver, so that the light beam irradiation comprises a molding machine and perform removal processing light forming process, thereby performing optical shaping and removal process according to the driver.

根据本发明,能够从包含用于光成形的各种参数的第一参数数据库中存储的参数数据、包含用于去除加工的各种参数的第二参数数据库中存储的参数数据、去除定时数据、和模型数据获得第一路径和第二路径,能够获得依次执行这些第一路径和第二路径的驱动程序。 According to the present invention, can be used for various parameters from the group consisting of light forming a first parameter the parameter data stored in the database, data in the second parameter database containing parameters for removing machining of various parameters stored in the removing timing data, and the model data to obtain the first and second paths can be obtained sequentially perform these first and second paths of the driver. 由此,能够明显节省操作者执行光成形过程的劳动和时间,和通过在重复层叠烧结层的步骤期间执行去除加工来有效地执行光成形过程。 This enables significant savings in labor and time the operator performs light forming process, and the process by performing the removal procedure was repeated during the sintered layer laminated to the effective implementation of the light forming process.

附图说明 Brief Description

图1A、1B是根据本发明的光成形系统实施例的方框图。 Figures 1A, 1B is a block diagram of the present invention, an optical shaping system according to an embodiment.

图2A、2B是第一参数数据库中包含的参数数据的解释示意图。 Figures 2A, 2B are diagrams for explaining the first parameter database containing parameter data.

图3A、3B是第二参数数据库中包含的参数数据的解释示意图。 Figures 3A, 3B are diagrams for explaining the second parameter database containing parameter data.

图4A、4B是接受模型数据的解释示意图。 Figures 4A, 4B is a diagram for explaining accepted model data.

图5是第一路径的解释示意图。 5 is a diagram for explaining the first path.

图6A、6B是第二参数数据库中包含的参数数据的另一个实例的解释示意图。 Figure 6A, 6B are diagrams for explaining another example of the second parameter database containing parameter data.

图7是表示干扰检验的流程图。 FIG 7 is a flowchart showing the interference test.

图8是表示剩余硬化部分和工具的侧视图。 Figure 8 is a side view showing the remaining hardened portion and tools.

图9是第二路径的分割的解释示意图。 Figure 9 is a diagram for explaining the second route is divided.

图10A、10B是表示空中线路路径的解释示意图,图10A是侧视图,图10B是平面图。 Figures 10A, 10B is a diagram for explaining the path of the air line, FIG. 10A is a side view, FIG. 10B is a plan view.

图11是表示伴随有分割过程的第二路径产生过程的流程图。 11 is a process accompanied by dividing a second flowchart of a process of generating a path.

图12是模型分割的解释示意图。 FIG 12 is a diagram for explaining segmentation model.

图13是表示伴随有分割过程的第二路径产生过程的另一个实例的流程图。 FIG 13 is a flowchart showing the process accompanied by dividing a second path generating process of another example.

图14A是模型的一个实例的透视图,图14B是具有重叠的分割模型的解释示意图。 Figure 14A is a perspective view showing an example of model, 14B is a diagram for explaining an overlap of division model.

图15A是模型的一个实例的侧视图,图15B是同一模型的制造中间状态的侧视图,图15C是剩余硬化部分的模型的侧视图。 Figure 15A is a side view of an example of model, 15B is a side view of manufacturing intermediate state of the same model, and 15C is a side view of the remaining portion of the hardened model.

图16是表示剩余硬化部分的模型的制成过程的解释示意图。 16 is a diagram for explaining the process made the remaining portion of the model of hardening.

图17是表示产生第二路径范围的确定过程的另一个实例的解释示意图。 17 is a diagram for explaining the generation process of determining the range of the second path another example.

图18是表示干扰检验的参考范围的解释示意图。 18 is a diagram for explaining the interference test reference range.

图19A是使用圆头槽铣刀为工具时的问题的侧视图,图19B是表示解决该问题的手段的放大侧视图。 19A is a side view of the use of ball groove cutter tool problems, FIG. 19B is an enlarged side view of the means for solving this problem.

图20A是光成形机的一个实例的切开透视图,图20B是其局部透视图。 20A is a cut-away perspective view of an optical forming machine example, FIG. 20B is a partial perspective view thereof.

具体实施方式 DETAILED DESCRIPTION

本申请基于2004年10月26日在日本提交的日本专利申请No.2004-311506(新授权为日本专利3687677),在此清楚地引入该申请的整体内容作为参考。 This application is an application No.2004-311506 (Japanese Patent 3,687,677 for a new authorization), this is clearly the introduction of the overall content of the application is based on Japanese patent filed in Japan October 26, 2004 as a reference.

下面参考附图描述本发明的优选实施例。 Be described below with reference to the accompanying drawings of the preferred embodiment of the present invention. 图20A和20示出了根据本发明的光成形系统的一个实例,所述光成形系统主要包括光成形机10,计算设备1及CAD(计算机辅助设计)部分,和其它外围设备。 20A and FIG. 20 shows one example of forming an optical system according to the present invention, the optical system includes a light shaping forming machine 10, a computing device 1 and CAD (computer aided design) portion, and other peripherals. 光成形机10本身与专利文献1中揭示的光成形机类似。 Optical forming machine 10 itself and Patent Document 1 discloses an optical shaping machine similar. 更具体地讲,光成形机10包括粉末层形成装置6,光束照射装置7。 More specifically, the optical molding machine 10 includes powder layer forming means 6, light beam irradiating means 7. 去除加工装置8,和将粉末层形成装置6,去除加工装置8和其它装置安装在其中的容器。 Removal processing means 8, and the powder layer forming means 6, removal processing means 8 and other apparatus installed therein the container. 粉末层形成装置6将来自粉末罐63的金属粉末提供给平台(stage)60。 6 the metal powder from the powder tank 63 is supplied to a platform (stage) 60 powder layer forming means. 通过在围绕外圆周的空间内移动圆柱体来上、下驱动平台。 By moving to the cylinder in the space around the outer circumference, the driving platform. 由挤压叶片(squeezing blade)61均匀地层化供给的金属粉末,以便在平台60上形成具有指定厚度的粉末层F。 By pressing the blade (squeezing blade) formation of metal powder 61 is supplied uniformly to form a powder layer having a predetermined thickness on the platform 60 F.

光束照射装置7把从激光振荡器70发射的激光束通过扫描光系统照射到粉末层F。 Beam irradiating means 7 from the laser beam emitted from the laser oscillator 70 to the powder layer is irradiated by scanning the optical system F. 扫描光系统由束形校正部分75,电镜(galvano-mirror)71等构成。 Scanning optical system consists of the beam-shaped correction section 75, electron microscopy (galvano-mirror) 71 and the like. 光束照射装置7被设置在容器28的外部,来自光束照射装置7的光束通过容器28中设置的透光窗口29照射到粉末层F上。 Beam irradiating means 7 is disposed outside the container 28, the beam from the beam irradiating means 7 is disposed in the vessel 28 through the transparent window 29 is irradiated onto the powder layer F. 去除加工装置8具有铣刀头81,铣刀头81设置在位于粉末层形成装置6的基部之上的XY驱动机构80上。 Removal processing means 8 has a milling head 81, a milling head 81 provided on the XY drive mechanism is located above the powder layer forming means 6 of the base portion 80.

从粉末罐63溢出的金属粉末被提供到平台60的基面上,同时由叶片61均匀地整平,以形成粉末层F的第一层。 Overflow from the powder tank 63 is supplied to the base of the metal powder surface of the platform 60, while the blade 61 is uniformly leveled to form a first layer of powder layer F. 诸如激光束LB之类的光束照射到要硬化的粉末层F的所需部分,以使金属粉末烧结,形成与基部结成一体的第一烧结层。 Irradiating a laser beam LB such as a beam or the like to be hardened to a desired portion of the powder layer F, so that the metal powder is sintered integrally formed with the base portion to form a first sintered layer. 然后,使平台略微下降,再次从粉末罐63提供新的金属粉末,并由叶片61整平,以便在第一粉末层F和第一烧结层二者上形成第二粉末层F。 Then, the platform declined slightly, again to provide a new metal powder from a powder tank 63, by the leveling blade 61, so that the second powder layer is formed on the first powder layer F and the first sintered layer both F. 诸如激光束LB之类的光束照射到要硬化的第二粉末层F的所需部分,以使粉末烧结,形成与下面的第一烧结层结成一体的第二烧结层。 Irradiating a laser beam LB such as a beam or the like to be hardened to the desired portion of the second powder layer F in order to sinter the powder, formed with the underlying first sintered layer to form a second sintered layer integrally.

通过在降低平台60时重复上述形成新粉末层F的过程,并将光束照射到指定位置形成烧结层。 By lowering the platform 60 during the above-described process is repeated to form a new powder layer F, and the light beam to a specified position to form a sintered layer. 以层叠的方式堆叠起多个烧结层。 In a laminated manner from a plurality of sintered layers are stacked. 当层叠的烧结层厚度达到根据例如去除加工装置8的铣刀头81的工具长度预先指定的预定值时,对去除加工装置8进行一次驱动,以切除直到目前为止堆叠的形成体的表面(即,铣去侧面),从而使其外面受到去除加工,以便完成其整个表面。 When the thickness of the laminated sintered layers reaches a predetermined value according to the processing means, for example removal cutter head 8 of the tool 81 a pre-specified length of time, to conduct a removal processing means 8 is driven to cut the surface formed so far stacked body (i.e. , milling to the side), so that the outside by removing machining, in order to complete its entire surface.

优选的是,可以使用颗粒大小为10至100mm的、大致为球形的铁粉末作为粉末,用二氧化碳激光束作为光束,但本发明不限于仅使用他们。 Preferably, the particle size may be used from 10 to 100mm, and a substantially spherical iron powder as a powder, a CO2 laser beam as a light beam, but the present invention is not limited to use them only. 另外,去除加工装置8不限于使用铣刀头81,而是可以使用其它切削装置。 In addition, the removal of the processing unit 8 is not limited to the use of the cutter head 81, but you can use other cutting devices.

下面参考图1A和1B描述执行计算过程的计算设备1的构成。 Referring now to Figures 1A and 1B describe the implementation of the calculation process for a computing device 1. 如图1A所示,计算设备1包括包含用于进行光成形的各种参数的第一参数数据库2,和包含用于执行去除和切削加工的各种参数的第二数据库3。 1A, the computing device 1 comprises a containing various parameters for performing optical shaping the first parameter database 2, and includes a variety of parameters are available for cutting and removing a second database 3. 计算设备1还包括模型数据接受单元11,切开处理单元12,用于为光成形过程产生第一路径P1的第一路径产生单元13,用于为去除或切削加工产生第二路径P2的第二路径产生单元14,还包括驱动程序产生单元15。 The computing device 1 further includes a model data receiving means 11, cut processing unit 12 for generating a first process for forming an optical path of the first path P1 generation unit 13, is used to generate the first removal or cutting of the second path P2 second path generating unit 14 further includes a driver generating unit 15. 应该指出,在该构造中,第一和第二参数数据库(2,3)可以被形成为单个数据库。 It should be noted, in this configuration, the first and second parameter databases (2, 3) may be formed as a single database.

如图1B所示,包括CPU、RAM和ROM的计算设备1通过I/O接口101与存储单元102、通信单元103(103')、鼠标105、键盘106、显示单元104、和控制器107相连。 1B, includes a CPU, RAM and ROM of the computing device 1 through I / O interface 101 and the storage unit 102, the communication unit 103 (103 '), mouse 105, keyboard 106, display unit 104 is connected, and a controller 107 .

下面参考图1A和1B描述根据本发明的光成形系统的加工操作。 Referring now to Figures 1A and 1B describe machining operations forming optical system of the present invention.

当通过操作键盘和/或鼠标提供规定指令时,CPU根据该指令读出ROM中存储的、或记录在存储单元102中的程序,并将要执行的程序加载到RAM。 When the provisions of the instruction provided by operating a keyboard and / or mouse, CPU reads according to the instruction stored in ROM, or record a program in the storage unit 102, and loads the program to be executed to RAM. 作为替换,也可以由从通信单元103(103')接收的信息来指令程序的执行。 Alternatively, it may be formed from the communication unit 103 receives (103 ') information to the instruction execution of the program. 然后,CPU按照需要发出加工结果,和在由诸如LCD或CRT构成的显示单元104上显示该加工结果,或将加工结果发送到打印机(未示出),或通过通信单元发送到外部设备,或存储在存储单元102中。 Then, CPU given in accordance with the need for processing results, and displays the processing results on the display unit 104 constituted by such as a LCD or CRT, or to send the processing result to a printer (not shown), or transmitted to an external device via the communication unit, or stored in the storage unit 102.

并不总是需要按照加工的时间序列描述计算设备(计算机)1执行各种过程的程序的步骤,可以并行或单独处理这些步骤。 Step 1 is not always necessary to perform various process programs (computer) calculation processing is described in time series, in parallel or individually deal with these steps. 计算设备1不限于单个单元,而是可以使用多个计算设备分开处理该程序。 The computing device 1 is not limited to a single unit, but may use a plurality of computing devices separate from the processing program. 此外,计算设备可以位于远端位置,而可以将程序传送到该远端计算设备来执行。 In addition, the computing device may be located at a remote location, and the program may be transferred to the remote computing device to perform.

存储单元102不限于特别指定的类型,只要能够存储由CPU执行的程序和数据即可,可以使用计算机能够读取的任何类型的记录介质和存储器件作为存储单元102,例如,诸如内部硬盘和可移动盘之类的磁盘,磁光盘,光盘,非易失性存储器,EPROM,EEPROM,诸如闪存器件之类的半导体存储器件,和任何其它记录介质。 Storage unit 102 is not limited to specified type, as long as capable of storing programs and data can be executed by the CPU, can use any type of computer-readable recording medium and the storage device as a storage unit 102, e.g., such as internal hard disks and a removable disk like disks, magneto-optical disk, optical disk, nonvolatile memory, EPROM, EEPROM, flash memory device such as a semiconductor memory device and the like, and any other recording medium.

当与能够从记录介质读出要执行的光成形程序的计算设备1一起使用时,记录有本发明的光成形程序的计算机可读记录介质能够显示出本发明的特定效果。 When a computing device capable of reading out from the recording medium to execute the program 1 photoforming used together, recorded optical forming program of the present invention a computer-readable recording medium can exhibit a specific effect of the present invention.

如图1A所示,当计算设备1处理和执行本发明的光成形程序时,模型数据接受单元11从要生产的目标对象的三维CAD获取三维模型数据。 1A, when computing device 1 and executing the processing program of the present invention, an optical shaping model data accepting unit 11 acquires three-dimensional model to be produced from three-dimensional CAD data of the target object. 切开处理单元12以指定的间距切分模型数据,以获得每个断面的轮廓数据。 Incision processing unit 12 to specify the pitch segmentation model data to obtain contour data of each section. 第一路径产生单元13根据每个断面的轮廓数据和第一参数数据库2中存储的参数数据形成光束照射线路的第一路径P1。 The first path generating unit 13 forms a first path P1 beam irradiation parameter data according to the contour line data for each section and the first parameter stored in the database 2. 第二路径产生单元14根据三维CAD模型数据,第二参数数据库3中存储的参数数据,和表示去除加工定时的去除定时数据产生形成去除加工线路的第二路径P2。 The second path generating unit 14 according to the three-dimensional CAD model data, parameter data stored in the second parameter database 3, and shows the timing of the removal process for removing timing data removal processing line forming a second path P2. 驱动程序产生单元15根据上面获得的第一路径P1,第二路径P2的数据,和去除定时数据,产生用于驱动光成形机10和设置在光成形机中的去除加工装置8的驱动程序P3。 Driver generation unit 15 according to the first path P1 obtained above, the second data path P2, and removing timing data, generating unit 10 for driving the optical forming process is removed and disposed in an optical forming machine device driver 8 P3 . 这意味着可以用在计算设备1中执行操作的计算机程序(即,应用软件)来实施模型接受单元11和各种加工单元12至15。 This means that the apparatus 1 can be used in the calculation performed in the operation of a computer program (i.e., application software) to implement the model acceptance unit 11 and the various processing units 12-15.

第一参数数据库2存储光成形机本身的各种数据,如图2A的表中所示,和与成形过程有关的各种参数,如图2B的表中所示。 The first parameter database 2 stores optical molding machine itself various data, as shown in the table in FIG. 2A, and various parameters associated with the forming process, as shown in the table shown in Figure 2B. 图2B所示的后面的数据表包括诸如光束照射点直径,光束照射功率,照射速度,照射图案(固态描绘图案片段),和照射间隔之类的各种数据,关于要烧结的每种粉末材料。 Behind the data table shown in Figure 2B includes such beam irradiation spot diameter, light beam irradiation power, irradiation speed, irradiation pattern (solid pattern depicted fragment), and various data and the like of the irradiation interval, regarding each powder material to be sintered . 图2B示出了后面数据表的一个实例,其中在每个烧结粉末材料和后面提到的每个切开间距中描述了数据。 2B illustrates an example of the back data table, wherein the distance between each cut back in each sinter powder material and is described in the mentioned data.

第二参数数据库3存储与去除加工装置8有关的各种数据(参数),用于进行光成形机中提供的铣和切削加工。 8 various data relating to the second parameter database 3 stores removing processing apparatus (parameters) for performing milling and cutting optical molding machine provided. 如图3A所示,数据库3包括存储工具直径和可在每种工作材料中使用的工具的首下(underhead)长度数据和工具材料的数据的标准工具数据部分,夹具直径,诸如球型和平面型之类的类型数据,或其它规范。 3A, 3 standard database tools section includes data storage tool diameter and tools that can be used in each of the first next working materials (underhead) the length of the data and the tools and materials data is shown, the fixture diameter, such as spherical and planar Types of data type and the like, or other specifications. 如图3B所示,切削条件数据部分存储可在每个结束模式中使用的搜集工具,和其驱动条件。 3B, the cutting conditions gathering tool may be used to store the data portion in each end of the mode, and the driving conditions.

接下来,下面描述由计算设备1进行的计算操作。 Next, the following describes a calculation operation performed by the computing device. 首先,模型数据接受单元11从三维CAD获取要生产的目标对象的三维模型数据,作为至少描述表面的面部和背部的三维固态模型或表面模型(例如,STL模型)。 First, the model data acceptance unit 11 from the 3D model to be produced to obtain a three-dimensional CAD data of the target object, as described in at least a three-dimensional solid model or surface model of the face and the back surface (for example, STL model).

模型数据的表达形式可以被规定为诸如NURBS之类的曲率表达式,和由三角等表示的多边形近似表达式。 Expression in the form of model data can be defined as the curvature of expression such as NURBS and the like, and represented by the triangle and other polygonal approximation expression. 在所希望的模型需要曲率表达式时,优选曲率表达式,而当加工时间更重要时,优选多边形近似表达式。 When the desired model requires curvature expression, preferably the curvature of expression, and when the processing time is more important, the preferred polygonal approximation expression.

在由激光扫描进行的烧结过程中,不需要严格的精度,可以使用图4A所示的大致多边形近似精度的模型数据。 In sintering process by laser scanning, the strict accuracy is not required, substantially polygonal model data can be used as shown in FIG. 4A approximation accuracy. 在通过铣或切削进行的去除加工中,由于要求高精度的模型,可以应用如图4B中所示的精确的多边形近似模型(例如,STL表达式)数据或曲率显示模型数据。 In the processing carried out by removing milling or cutting, since a model of high accuracy is required, may be applied as shown in Fig. 4B precise polygonal approximate model (for example, STL expression) data or curvature display model data. 就是说,模型数据的类型在为成形加工产生第一路径P1时的情况与在为去除加工产生第二路径P2时的情况之间可以不同。 That is, when the type of model data is generated for forming a first path P1 between the case and for the removal of processing when generating the second path P2 may be different circumstances. 然而,在此应该指出,在两种模型数据中,定义其位置的坐标系统应该匹配。 However, here it should be noted that in both of the model data, the coordinate system defined its location should match.

接下来,切开处理单元12以规定间距切分模型数据,以便获得每个断面的轮廓数据。 Next, cut processing unit 12 at a predetermined pitch segmentation model data, so as to obtain contour data of each section. 该切开处理可以通过,例如,日本专利申请公开No.2001-277369中公开的已知技术来实现,在此为了简单起见而不再具体描述。 The incision may be, for example, Japanese Patent Application Laid-Open No.2001-277369 disclosed known techniques, for simplicity this is no longer described in detail. 在该切开处理中,如图5所示,在公开中描述的偏移过程中的偏移量OFST不限于激光束光点直径的值,而是可以预设为指定量。 In the cut process, shown in Figure 5, the offset process described in the disclosure of the offset OFST Any of the laser beam spot diameter value to, but may be preset to a specified amount. 该指定量优选的是参考例如在第一参数数据库2中初步描述的值,或者也可以是在加工期间由操作者输入的值。 The indicated amount is preferable that the reference value for example in a first parameter database 2 preliminary description, or may be a value by the operator during machining entered. 偏移加工方向不限于轮廓线的内侧,而是该偏移也可以从轮廓线移到外侧,以便可以在去除加工中为去除提供较大的容差。 Offset machine direction is not limited to the inside of the contour, but this offset can be moved to the outside from the contour line, so that it can be removed to provide greater tolerance in the removal processing.

可以由操作者输入,或者根据粉末材料,模型形状,或所需的精度自动确定切开间距。 May be input by an operator, or automatically according to the powder material cut pitch, model shape, or required precision.

当在切开过程中获得每个断面的形状时,第一路径产生单元13参考第一参数数据库3中存储的参数数据,和根据每个断面的轮廓数据在每个断面形状中产生用于形成光束照射路线的第一路径P1。 Upon obtaining the shape of each cross section in the cutting process, the first path generating unit 13 refers to the parameter data stored in the first parameter database 3, and generates a cross-sectional shape is formed in each based on the contour data of each section of The first path P1 beam irradiation route. 在该第一路径产生步骤中,如图5所示,顺序地描述由光束LB对模型的切开断面M1的轮廓扫描时的位置坐标,和顺序地描述切开断面内的固态描绘路径坐标。 In this first path generating step, shown in Figure 5, the light beam LB is sequentially described by the position coordinates of the contour of the model M1 scanning cross section cut on when, and cut sequentially describe solid cross section within the drawing path coordinates. 因此,以可用作NC控制的光成形机的NC数据的格式来产生第一路径P1。 Therefore, in order to form the optical molding machine NC NC control data can be used to generate the first path P1. 优选的是,应该在第一路径P1的数据中描述光束LB的光点直径,照射速度v,照射间隔p,照射功率和其它照射条件。 Preferably, the light beam LB should describe the spot diameter, irradiation speed v in the data of the first path P1, p, irradiation power and other irradiation conditions of the irradiation interval. 因此,在开始加工时,不需要分开设置这些条件,能够减少操作错误。 Thus, at the beginning of the processing, these conditions need not be provided separately, it is possible to reduce operator error.

在用于成形的第一路径产生步骤之后,或与其并行,第二路径产生单元4根据分开给定的模型数据和去除定时数据,以可用作NC控制的去除加工装置的格式产生第二路径P2。 After the first path generating step for shaping, or parallel with, the second path generating unit 4 according to the given separate model data and removing timing data, NC control can be used to format the removal processing means generating a second path P2. 关于要使用的工具,操作者可以从第二参数数据库3中存储的工具中选择,或者第二路径产生单元14可以通过参考如下面提到的模型形状,自动确定要使用的工具。 Tools to be used on, the operator may select from the second parameter stored in the tool database 3, or unit 14 may be by reference to the model shape as mentioned below, to automatically determine the tool to be used to generate a second path.

当确定了要使用的工具时,确定加工方法和要加工的区域。 When determining the tool to be used when determining the processing method and the area to be machined. 加工方法可以包括诸如轮廓线加工,表面复制加工,角落跳过(corner skip)加工,和其他加工之类的传统切削加工,虽然不限于此。 The method may include processing, such as contour line processing, surface copy processing, corner skip (corner skip) processing, and other conventional machining process or the like, though not limited thereto.

当确定了工具,加工方法,和加工区域时,为去除加工产生第二路径P2。 When it is determined the tool, processing method, and processing region, generating a second processing path for the removal of P2. 该加工可以利用偏移方法,预留偏移方法,和用于切削加工的传统CAM中采用的Z_map方法,或其他方法来实现,但本发明不限于此。 The process can use the offset method, reservation migration, and Z_map traditional CAM machining method employed, or other methods used to achieve, but the present invention is not limited thereto.

然而,应该根据对此进行参考的去除定时数据的值,在高度方向分割第二路径P2。 However, should the value of this reference is based on removing timing data, the second path P2 is divided in the height direction. 例如,在规定去除定时数据以致每当按5mm的厚度堆叠烧结层时执行去除加工的情况下,应该在高度方向按每隔5mm分割路径。 For example, at a predetermined removing timing data that whenever the case of performing machining by removal of 5mm thickness when stacked sintered layer, should be in the height direction by every 5mm divided route. 可以由操作者规定去除定时数据,或者根据第二参数数据库3中的预设值来规定去除定时数据。 Timing data can be removed to remove the timing data specified by the operator, or according to the provisions of the second parameter database 3 presets. 另外,可以构成第二路径产生单元14根据模型数据和第二参数数据库3中存储的第二参数数据来产生去除定时数据。 Further, a second path unit 14 can be constructed according to the second model data and parameter data stored in the second parameter database 3 to generate the timing data generated is removed. 另外,如下面提到的,可以根据要使用的根据自动选择去除定时数据。 Further, as mentioned below, can be automatically selected according to the removing timing data according to use. 这种情况下,稍后描述分割方法。 In this case, the division method is described later.

当由第一路径产生单元13产生第一路径P1和由第二路径产生单元14产生第二路径P2时,驱动程序产生单元15产生用于监督第一路径P1,第二路径P2,和去除定时数据的驱动程序P3。 When generated by the first path generating unit 13 generates a first path P1 and a second path unit 14 by generating a second path P2, the driver generation unit 15 generates a first path for supervision P1, a second path P2, and removing timing driver data P3.

程序P3用于与作为子程序的第一和第二路径P1和P2一起来驱动光成形机10和去除定时装置8。 P3 is used as a subroutine program with the first and second paths P1 and P2 together to drive the light-molding machine 10 and removal timing means 8. 就是说,用第一路径P1作为光成形机的NC数据,用第二路径P2作为去除加工装置的NC数据。 That is, as with the first optical path P1 molding machine NC data, by removing the second path P2 as the NC data processing apparatus. 驱动程序P3,第一路径P1和第二路径P2被传送到控制器107。 Driver P3, the first path P1 and second path P2 are transferred to the controller 107. 控制器107控制光成形机和其去除加工装置的操作。 The controller 107 controls the optical operation of the molding machine and its removal processing means. 当操作者发出执行控制器中存储的驱动程序P3的指令时,程序P3依次获取所需的第一路径P1和第二路径P2,以便驱动光成形机和其去除加工装置。 When the driver execution controller P3 stored instructions issued by the operator, in order to obtain the first program P3 desired path and the second path P1 P2, so as to drive the light forming machine and its removal processing unit. 结果是,光成形机和其去除加工装置通过根据第一路径P1照射光束,从而形成要层叠的烧结层,然后每当去除定时数据指定的定时,根据用于执行去除加工的第二路径P2来操作去除加工装置。 As a result, the optical shaping machine and its removal processing means by irradiating a light beam according to the first path P1, so as to form a sintered layer to be laminated, and then removing the timing whenever the specified timing data, according to a second processing path for executing removal of P2. Operating removal processing unit. 于是,通过重复上述过程来制造光成形产品的目标对象。 Thus, by repeating the above procedure for manufacturing the optical molding product of the target object.

为了自动选择在去除加工中使用的根据,例如,根据波动、曲率选择合适根据的数据,把要切掉的对象表面的水平状态和垂直状态记录在如图6A的表中所示的第二参数数据库3中,或者在能够使用多个工具的情况下记录工具的优先数据,如图6B的表中所示。 The second parameter is automatically selected according to the order used in the removal process, for example, based on the fluctuation, according to the curvature select the appropriate data, the horizontal surface of the object to be cut away and the vertical position as shown in FIG. 6A recorded in the table database 3, or can be recorded in the case of using a plurality of tools priority data tool, as shown in the table in Fig. 6B.

于是,如图7所示,当第二路径产生单元14产生第二路径P2时,从模型数据获取表面形状信息和邻近干扰表面区的信息(步骤S3),根据取决于表面形状的数据来选择工具(步骤S4,S5),检验与邻近表面的干扰(步骤S6),和检测是否干扰,选择低优先的工具(通常是直径较小的工具)。 Thus, as shown in FIG. 7, when the second path generating unit 14 generates a second path P2, the surface shape information to obtain information and interference of the neighboring surface region (step S3) from the model data, depending on the surface shape data according to selected Tool (step S4, S5), and the adjacent surface of the test interference (step S6), and detects whether interference, low priority selection tool (usually a tool of smaller diameter).

去除工具的自动选择是一种常规技术,而不是新技术,但是,为了在本实施例中的堆叠烧结层的层叠过程中执行去除加工,本实施例中的选择算法与常规算法的区别在于以下几点。 Automatically selectively removing tool is a conventional technique, instead of the new technology, however, in the present embodiment to process embodiment of the laminated sintered layer stack removal processing is performed, the difference between the embodiment and the conventional algorithm selection algorithm of the present embodiment in that the following points. 就是说,在本发明中执行去除加工时,在比目前要受到去除加工的堆叠烧结层的高度高的位置没有层叠的烧结层。 That is, the removal processing is executed, the current to be removed in processing than the stacked sintered layer of high-altitude locations No laminated sinter layers in the present invention. 因此,能够跳过检验工具、工具夹具和主轴与要受到去除的形成体之间的干扰。 Therefore, it is possible to skip testing tool, tool holder and spindle and to be subject to interference between the removal of the formation of the body. 而在常规方法中,当对完成的产品进行去除加工时,该检验步骤是必须的。 In the conventional method, when the removal of the finished product processing, the verification step is necessary. 因此,本发明能够明显缩短工具选择加工时间。 Accordingly, the present invention can significantly shorten the tool selection processing time.

此外,如上所述,当第二路径产生单元14根据模型数据和第二参数数据库3中的第二参数数据产生去除定时数据时,可以根据工具9的首下长度L和端部直径R来确定去除定时数据(切削深度)T。 In addition, as described above, when the second path generating unit 14 generates the model data and second parameter database 3 when removing the second parameter data timing data, may be determined according to the tool at the first end portion diameter and the length L of R 9 remove the timing data (cutting depth) T. 然而,实际上应该优先考虑以下几点。 However, in fact, the following points should be considered a priority. 就是说,在执行光成形过程中,如图8所示,在目前层叠和烧结部分5的一侧形成烧结部分50的下垂余量,除了工具9的首下长度L和端部直径R,和从工具9的首下长度L减去重叠量“ovr”和端部直径R的值之外,第二参数数据库3中必须包括去除过量烧结部分50的下垂部分所需的重叠量“ovr”。 That is, in the implementation of the optical forming process, shown in Figure 8, on one side of the current lamination and sintering to form a sintered portion 5 of the drooping portion 50 of the balance, in addition to the length of the tool 9 at the first end portion diameter L and R, and From the outside of the tool at the first overlap length L minus 9 "ovr" and the end diameter R value, the second parameter database 3 must include the removal of an excess amount of overlap required sintering drooping portions 50 of the "ovr". 作为替换,将比该值小的值设置为去除定时数据T。 Alternatively, the value is smaller than the set value for removing timing data T. 当在层叠和烧结步骤期间实施的一次去除步骤中使用多个工具9时,通过与工具9的最短首下长度L相符来确定去除定时数据T。 When a removal step during lamination and sintering steps to implement the use of multiple tools 9:00, with the tool length L under shortest first nine matches to determine the removal of the timing data T. 当使用多个工具9时,通过施加每个工具9的切削定时数据,在达到该定时时能够由工具9执行去除加工。 When using a plurality of tools 9, by applying the cutting timing data of each tool 9, when reaching the timing can be performed by removing machining tool 9.

下面描述在产生第二路径P2的过程中,根据去除定时数据T执行的分割过程。 The following describes the process of generating the second path P2, and removing timing data according to the segmentation process T performed. 在该分割中,在一种情况下,首先针对整个模型数据计算第二路径P2,然后根据去除定时数据T分割针对整个模型数据的第二路径P2。 In the segmentation, in one case, first calculate the second path P2 for the entire model data, then T split second path P2 for the entire model data based on the removal of the timing data. 作为替换,在另一种情况下,首先根据去除定时数据T沿高度方向分割模型数据,然后可以根据各个分割的模型数据产生单独的第二路径P2。 Alternatively, in another case, the first T-division model data in the height direction based on timing data is removed, then the individual may be generated based on the second path P2 respective divided model data.

在前一种情况下,如图9所示,首先产生整个模型的第二路径P2,从整个第二路径P2顺序提取与按去除定时数据T分割的每个去除高度范围对应的部分,以便获得分割的第二路径P2。 In the former case, shown in Figure 9, first generates the second path P2 of the entire model, extraction and removal of the height range corresponding to each portion divided by removing timing data T from the entire second path P2 sequentially, so as to obtain Segmentation of the second path P2. 这种情况下,能够确认整个模型的第二路径P2,并且能够确认遗漏的加工步骤和路径。 In this case, the entire model can be confirmed in the second path P2, and can confirm the processing steps and the omission of the path. 在计算第二路径P2时,虽然需要模型形状识别过程,并且该过程要消耗时间,然而只需要一次模型识别过程,并且能够缩短总的消耗时间。 In the calculation of the second path P2, although the need to model the shape recognition process, and the process to be time consuming, however, requires only one process model identification, and the total elapsed time can be shortened.

如上所述,在去除加工中,优选的是重叠到下侧,在从整个模型的第二路径P2提取与去除高度范围对应的提取部分时,在重叠和设置按去除定时数据T分割的每个去除高度范围后提取第二路径P2。 As described above, in the removal process, it is preferred that the overlap to the lower side, at the time of extraction and removal of extraction section P2 height range corresponding to the second path from the entire model, in the overlap and removing timing data T provided by dividing each extracting a second path P2 after removal of height range.

在计算第二路径P2时,如果如图10所示在特定去除高度范围内的不同位置有要去除的部分(岛),针对这些部分(岛)产生多个去除第二路径P2a,P2b,P2c,并且同时或在该产生之后产生用于链接这些多个第二路径P2a,P2b的空中第二路径P2',以便创建一个第二路径P2。 In the calculation of the second path P2, have to be removed portion (island) if 10 different positions as shown in the specific removal height range as shown, to produce a plurality of removal second paths P2a for these portions (islands), P2b, P2c and simultaneously with or after the generating generates the plurality of second link paths P2a, P2b of the second air path P2 ', to create a second path P2.

与上面提到的为去除加工自动选择工具的情况相同,由于在去除时要连接的第二路径P2a,P2b,P2c的对象部分上没有形成任何对象,因此很容易计算空中线路路径P2'。 The above-mentioned process for the removal of the same automatic selection tool case, because the removal of the second path when you want to connect P2a, P2b, did not form part of any object on the object P2c, so it is easy to calculate the air route path P2 '. 因此,在该部分上没有干扰对象,实际上不需要考虑干扰来计算空中线路路径P2'。 Accordingly, in that portion does not interfere with the object, in fact, no need to consider interference to calculate the air line path P2 '. 据此,尽管是从整体模型计算第二路径P2,通过在第二路径P2a,P2b,P2c略微偏移来产生空中线路路径P2',以使工具可以在例如比要连接的第二路径P2a,P2b,P2c的对象部分的上侧略微高0.1mm到1mm之上处经过。 Accordingly, although the second path is calculated from the overall model P2, through the second path P2a, P2b, P2c is slightly offset to produce air line paths P2 ', so that the tool can be for example, than in the second path to be connected P2a, P2b, the upper portion of the object P2c slightly elevated above 0.1mm to 1mm at the pass. 在该加工中,能够在目前计算第二路径P2的部分上忽略由图10A中的虚线指示的模型形状。 In this process, it is possible in the current calculation of the second path portion P2 from FIG. 10A to ignore the model shape indicated by the broken line. 由于几乎不需要考虑干扰,可以只由方便的路径,例如由最短距离链接的空中线路路径P2'来链接要连接的第二路径P2a,P2b,P2c。 Since almost no need to consider the second path interference, can only be made easy path, such as the shortest distance from the air line route links P2 'to link to connect P2a, P2b, P2c. 图11是表示产生包括空中线路路径P2'的上述第二路径P2的操作。 11 is a circuit path including air generating P2 'of the second path P2 of operation.

当如图12所示根据去除定时数据T分割模型数据以便为分割的模型数据单独产生第二路径P2时,不需要获得分割的模型数据的最上表面的第二路径P2,并从第二路径P2的计算范围中排除对其计算。 As shown in Figure 12 is removed according to the timing data T division model for dividing the model data to produce a second separate data path P2, the division of the model data is not required to obtain the uppermost surface of the second path P2, and from the second path P2 The calculation range to exclude its calculation. 图13示出了这种情况中的流程图。 Figure 13 shows a flowchart of this case. 根据需要,能够如上所述产生空中线路路径P2'。 According to need, as described above capable of producing the air line paths P2 '.

由于针对多个模型数据单独地计算第二路径P2,优选的是,启动多个第二路径产生装置,以便将分割的多个模型数据并行地传送到要加工的第二路径P2产生装置,由此缩短消耗的时间。 Since the calculation of the second path alone P2, preferably for a plurality of model data is to start a plurality of second path generating means for dividing the plurality of model data in parallel to the second path generating means P2 to be processed, by This shortens the time consumed.

此外,另一个优点是能够根据分割的模型形状使用适当的工具获得经济的第二路径P2。 Further, another advantage is the ability to use appropriate tools to obtain the second path P2 in accordance with the model shape economic segmentation. 例如,在图12中,形状(Ma)的模型只在一侧的垂直平面上具有去除表面,并选择大直径的平头铣刀为工具,对于图12中具有曲率和斜面的形状(Mb),(Mc),(Md)和(Me)的模型,可以选择圆头槽铣刀为工具,以平滑地完成该表面。 For example, in Fig. 12, the shape (Ma) of the model only in the vertical plane with the removal of the side surface, and select a large diameter flat head cutter as a tool for the FIG. 12 and the inclined plane having a curvature shape (Mb), (Mc), (Md) and (Me) model, you can choose round slot cutters as a tool to smoothly complete the surface. 另外,在图12的形状(Mc)和(Me)的模型中,由于没有台阶部分,可以使用大直径圆头槽铣刀为工具,以便迅速加工。 In addition, the shape of Fig. 12 (Mc) and (Me) model, because there is no stepped portion can be used for large diameter ball end milling tools for rapid processing. 在图12的形状(Mb)和(Md)的模型中,由于有台阶部分,选择小直径的圆头槽铣刀为工具来有效地加工台阶部分。 In the shape of Fig. 12 (Mb) and (Md) of the model, since the stepped portion, to select a small-diameter ball end mill as a tool for groove processing step portion effectively.

如图12所示,当把形状(Me)的模型分割成多个岛时,为了便于识别,很容易伴随某个岛的切削深度的改变而产生第二路径P2a,伴随另一个岛的切削深度的改变而产生第二路径P2b,和用于链接这些第二路径P2a,P2b的一个空中线路路径P2'。 12, when the split shape (Me) model into a plurality of islands, in order to facilitate the identification, it is easy to vary the depth of cut along a second path generating island P2a, accompanied by another island of the cutting depth while generating a second path P2b, and for linking these second paths P2a, P2b of an air path line P2 'change. 这种情况下,与通过用空中线路路径链接某个岛的高度部分的第二路径和另一个岛的高度部分的第二路径,改变切削深度,和进一步重复相同的步骤来产生多个空中线路路径的情况相比,能够以更短的时间,并且容易地产生路径。 In this case, with the air line route link by a height of the island portion of the height of the second path and the second path portion of another island, changing the depth of cut, and further repeating the same steps to produce a plurality of air lines compared to the case of the path, can be a shorter time, and easily generate a path.

如上所述,在产生第二路径P2的过程中,由于优选的是重叠对下侧的去除加工,在分割模型时,如图14所示,根据由去除定时数据T指示的量,从按第二参数数据库3中存储的重叠量“ovr”的一部分延伸到下侧的分割的模型来计算各个第二路径P2。 As described above, in the process of generating the second path P2, since it is preferable that the overlapping lower side removal processing, when dividing the model, shown in Figure 14, according to the amount by removing timing data T indicated from the press section Second part of the extension parameters are stored in the database overlap 3 "ovr" to split the model to calculate the lower side of each of the second path P2.

此外,在根据分割模型产生去除经过P2时,很容易在产生重叠到下侧的第二路径P2的情况下解决下列问题。 In addition, after the removal of the produce when P2, it is easy to solve the following problems in the overlap to the lower side of the case in accordance with the second path P2 segmentation model. 就是说,如图15A所示,在模型的形状具有中度斜面部分的情况下,对图15B中所示的部分进行去除,和将烧结层层叠在其上。 That is, as shown in Figure 15A, in the case where the shape model having a moderately inclined surface portion, on the part shown in Fig. 15B is removed, and the sintered layer is laminated thereon. 此后,在下一次去除时,在上面计算第二路径P2的过程中,由于中度斜面部分的整个区域处在重叠量“ovr”的范围中,在该整个区域中设置第二路径P2。 Thereafter, when removing next time, in the above calculation process of the second path P2, since the entire region of the slant portion at a moderate amount of overlap "ovr" range, providing a second path P2 in the entire region. 然而,如图15C所示,下垂的剩余硬化部分50确实只与一部分中度斜面部分重叠,其它部分是被前面的去除加工切去的部分,剩余硬化部分50不存在。 However, 15C, the remaining hardened drooping portion 50 really only moderate overlap with a portion of the ramp portion, the other part is cut away in front of the removal processing part, the remaining hardened portion 50 does not exist. 因此,该部分不需要另一次去除加工,如果仅按重叠量“ovr”从延伸到下侧的分割模型产生第二路径P2,在消耗浪费时间的同时产生第二路径P2。 Thus, this portion does not require another removing process, if only by the amount of overlap "ovr" from extending to the lower side of the division model generating a second path P2, in a waste of time consumed while generating the second path P2.

然而,通过生成添加有最初预测的剩余硬化部分50的模型的剩余硬化部分附加模型,并产生想要去除该剩余硬化部分附加模型的第二路径P2能够解决该问题。 However, by generating the first prediction residual is added the remaining hardened portion 50 hardened portion additional model of the model, and produce the desired removal of the remaining portion of the second path P2 additional hardening model can solve the problem.

如图16所示,获得此次剩余硬化部分50的模型。 As shown in Figure 16, to obtain the remaining portion 50 of the hardened model. 具体地讲,通过在按去除定时数据T截开的模型中向要去除的表面添加偏移量α,将偏移部分的下侧向下延伸重叠量“ovr”的部分或分开给定的剩余硬化部分50的下垂量作为参数数据,和从它们包围的区域排除与初始模型(该模型是与下层侧的模型组合的去除定时数据T分割的模型)重叠的部分。 Specifically, by removing timing data T in accordance with the model sectioned adding the offset α to the surface to be removed, the lower side of the offset portion extending portions overlap amount "ovr" or separate a given residual hardening sag amount data section 50 as a parameter, and from the area surrounding the exclusion of their initial model (this model is the model with the lower side of removing timing data T combined segmentation model) overlap.

如图17所示,通过从由去定时数据T分割的模型最低部分的轮廓向外侧添加偏移量γ伽马,将添加该添加偏移量γ的轮廓的内侧和只有未与最初模型重叠的范围设置为工具的可移动范围Ω,只在与从去除定时数据T和重叠量“ovr”确定的去除范围Z和工具可移动范围Ω二者相符的区域中产生第二路径P2。 Shown in Figure 17, by going through the timing data from the contour segmentation model T lowest portion adding an offset to the outside γ gamma, adding the added offset γ inner contour and not only overlap with the initial model range is set to the tool movable range Ω, produced only in the second path P2 and the removal tool from the scope and Z removing timing data T and overlap amount "ovr" OK both movable range Ω matching area. 于是,能够消除产生不需要的第二路径P2的问题。 Thus, it is possible to eliminate unnecessary second path P2 to generate a problem.

最初根据要使用的粉末材料和其烧结条件来确定这些偏移量α,γ和向下延伸量(例如,重叠量“ovr”),这些量存储在第二参数数据库3中。 Initially the powder material to be used in accordance with the sintering conditions and to determine the offset α, γ and downwardly extending amount (e.g., the amount of overlap "ovr"), 3 of these quantities are stored in the second parameter database.

另外,当基于按照去除定时数据T分割的每个模型确定第二路径P2时,当计算第二路径P2时,在把下层侧的模型形状作为对工具的干扰检验区的情况下,优选的是,参考与由去除定时数据T和重叠量“ovr”确定的第二路径P2的计算范围远的下层侧的模型形状。 Further, when the removal of the model based on the timing data for each division of T when determining the second path P2, when calculating the second path P2, in the case where the shape of the lower side of the model as a test tool interference area, preferably , the calculation range is far removed from the reference path and the second timing data T and overlap amount "ovr" P2 in determining the shape of the lower side of the model.

如图18所示,当由作为圆头槽铣刀的工具9的边缘切削和去除对象范围Z的局部开口9a时,由于工具9的前端可能与下层侧造成干扰,把从去除对象范围Z起的下部9b传送到第二路径产生单元14作为参考区域。 As shown, when the ball end mill as a tool for cutting and removal of Z target range edge 9 a partial opening 9a, due to the front end of the tool 9 may interfere with the lower side 18, the object is removed from the range from Z The lower portion 9b to the second path generating unit 14 as reference region. 要参考的模型的范围可以是比去除对象范围Z低的全部模型形状,但是,考虑到速度,可以是与工具9的半径R对应的范围。 Range to the reference model may be all model shape lower than the removing object range Z, but, considering the speed, may be a tool radius R 9 of the corresponding range.

当针对整个模型确定第二路径P2,然后根据去除定时数据T分割路径P2时存在类似问题。 When determining the second path P2 for the entire model, then there is a similar problem when the P2 removing timing data T is divided according to the path. 然而,由于用于切削的模型和要产生的第二路径P2是整个模型,不需要将其作为参考范围分开添加,可以直接检验干扰。 However, since the model for the cutting and second path P2 to be generated is the entire model, it is not necessary to add separately as reference range, the interference can be tested directly.

当以两种方式中的任何一种分割时,如果要使用的工具9是圆头槽铣刀,优选的是考虑以下几点来计算第二路径P2。 When any one of two ways segmentation, if the tool to be used is a ball end milling cutter 9, it is preferable to consider the following points to calculate the second path P2. 就是说,当根据去除定时数据T产生第二路径P2时,如果工具9是圆头槽铣刀,由于工具9的前端是半球状的,切削开始位置来到图19A中所示的点,并且在轮廓线处理中的最初路径中,可以根本不与剩余硬化部分5接触,可能导致加工失败。 That is, when generating the removing timing data T based on the second path P2, if the tool 9 is ball end milling cutter, since the front end of the tool 9 is hemispherical, a cutting start position come to the point shown in FIG. 19A, and In the initial contour processing path, can no contact with the remaining hardened portion 5, may cause processing to fail.

因此,根据第二参数数据库3中存储的工具9的端半径R和剩余硬化部分5的宽度w的预测数据来确定工具9的接触高度,并且通过从该高度开始切削,能够消除由失败造成的加工时间损失。 Thus, to determine the height of the tool 9 according to the contact width w of the second prediction data 3 stored in the parameter database tool end radius R 9 and the remaining hardened portion 5, and by starting cutting from this height, it is possible to eliminate the failure caused by Processing time loss.

通过从模型中要去除的部分的上表面下降距离ΔH来计算带有剩余硬化部分5的工具9的接触高度作为位置值,其中由如下的公式获得ΔH: By contacting the upper surface portion to be removed from the model to calculate the fall distance ΔH hardened with the remaining portion 5 of the tool 9 as the height position value, which obtained by the following equation ΔH:

(R-ΔH)2+(RW)2=R2(R-ΔH)2=W(2R-W)ΔH=R-(W(2R-W))1/2当然,当工具9是平头铣刀时,通过假设R=0来确定切削开始位置工业实用性由此,本发明能够从包含用于光成形的各种参数的第一参数数据库中存储的参数数据,包含用于去除加工的各种参数的第二数据库中存储的参数数据,去除定时数据,和模型数据来获得第一路径和第二路径,能够获得用于顺序执行这些第一路径和第二路径的驱动程序。 (R-ΔH) 2+ (RW) 2 = R2 (R-ΔH) 2 = W (2R-W) ΔH = R- (W (2R-W)) 1/2, of course, when the tool is flat cutter 9 When, by assuming R = 0 to determine the cutting start position Industrial Applicability Accordingly, the present invention is capable of containing the parameter data from the various parameters of the first parameter database for the light shaping stored, includes a variety of processing for removing Parameter data stored in the second parameter database, and removing timing data, and model data to obtain first and second paths can be obtained for sequentially executing these first path and second path drivers. 因此,能够明显节省操作者执行光成形加工的体力和时间,通过在层叠烧结层的重复步骤期间执行去除加工能够有效地执行光成形加工。 Accordingly, significant savings in time the operator performs physical and optical shaping by repeating step during the execution of the laminated sintered layer removing processing can be efficiently performed light forming.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
CN105880588A *3 Aug 201524 Aug 2016株式会社松浦机械制作所Three-dimensional shaping method
Classifications
International ClassificationB22F3/10, B22F3/105, B29C67/00, B22F3/16
Cooperative ClassificationB29C64/153, B22F3/1055, Y02P10/295, B22F2003/1057, B22F2999/00, B29C2037/903, G05B2219/49018
European ClassificationB22F3/105S, B29C67/00R4B
Legal Events
DateCodeEventDescription
3 Oct 2007C06Publication
28 Nov 2007C10Entry into substantive examination
18 Jan 2012C14Grant of patent or utility model