CN101002319A - 用于提供堆叠管芯器件的方法和装置 - Google Patents

用于提供堆叠管芯器件的方法和装置 Download PDF

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CN101002319A
CN101002319A CNA2005800269708A CN200580026970A CN101002319A CN 101002319 A CN101002319 A CN 101002319A CN A2005800269708 A CNA2005800269708 A CN A2005800269708A CN 200580026970 A CN200580026970 A CN 200580026970A CN 101002319 A CN101002319 A CN 101002319A
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D·苏
D·马利克
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Intel Corp
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Abstract

提供堆叠管芯器件的方法和装置，堆叠管芯器件包括堆叠的子封装。对于本发明的一个实施例，每个子封装具有形成在基片的管芯侧上的互连件，用于与另一个子封装相互连接。管芯和相关的导线被密封剂保护，使得每个互连件的上部分被暴露。对于本发明的一个实施例，密封剂是可模板印刷的密封剂，且互连件的上部分通过使用形成有图案的模板在施加密封剂期间被暴露。

Description

用于提供堆叠管芯器件的方法和装置
技术领域
本发明的实施例一般地涉及集成电路器件的领域，且更特定地涉及用于堆叠管芯以制造堆叠管芯器件的方法和装置。
背景技术
如果芯片可以在硅电路板的表面上封装得更紧密，则可以降低模块的尺寸和成本且改进系统的性能。最大化封装密度的一个可能的方法涉及将芯片一个放置在另一个顶上以形成三维的堆叠，它被称为堆叠芯片器件或堆叠管芯器件。在过去的数年中，在可能的情况下已经存在一些在堆叠芯片中的兴趣。这样的芯片堆叠方案包括将多个尺寸减小的芯片堆叠以便于丝焊，或包括使用定间隔器或使用切角技术或使用“T形切口”管芯作为上管芯来堆叠多个相同尺寸的芯片。当趋势从目前典型的器件中2至4个堆叠管芯到近期内的6至8个和更多的堆叠管芯向堆叠更多管芯发展时出现了问题。
例如，对于降低尺寸的管芯方案，最终达到的是上管芯的尺寸是无效的点。对于切角或T形切口的管芯方案，在堆叠中的下管芯和上管芯之间的尺寸差异上存在极限(即过分的悬垂更难处理且导致堆叠管芯器件更不稳定)。
此外，这些方案的每个呈现出增加的产率损失的问题。当堆叠管芯的个数增加时，产率损失增加。堆叠管芯器件直至其完成没有完全地被检测。可以在管芯、预堆叠级在单独管芯上完成温度检测和其他公差的检测，但这样的检测不代表堆叠管芯器件的总的功能性。特别地在其中堆叠管芯的一个实现了逻辑处理器器件时，在整个器件的所有电气连接完成前的快速检测是不可靠的。
为解决堆叠极限和产率损失的问题，已引入了堆叠管芯的子封装的概念。在这样的方案中，生产且检测多个子封装，每个子封装包括堆叠管芯器件。在检测成功时，两个或多个子封装被堆叠且电气地连接，以形成堆叠管芯器件。
图1图示了包括根据现有技术的堆叠的子封装的堆叠管芯器件。在图1中示出的堆叠管芯器件100包括三个子封装105a、105b和105c，它们可以是堆叠管芯封装，例如封装105b和105c。封装105a包括基片110a，带有形成在基片110a的下表面111上的导电球120(例如球栅阵列(BGA))。导电球120用于将基片110a电气地连接到母板(未示出)上。管芯130a布置在基片110a的上表面112上。
封装105b包括具有堆叠在管芯130b顶上的管芯130c的堆叠管芯器件。封装105c包括具有如示出的一个堆叠在另一个顶上的管芯130d至130f的堆叠管芯器件。所有管芯130a、130b和130c以及130d至130f以丝焊140电气地连接到各基片110a至110c或相互连接。用于每个子封装的丝焊140典型地覆盖有模制化合物145，用于在堆叠子封装前的保护。子封装以互连件150电气地相互连接，互连件150可以是子封装之间的铜接头。
堆叠管芯器件100解决了堆叠极限和产率损失的一些缺点，但它也还具有缺点。例如，形成了子封装之间的连接接头的铜插入件要求了附加的空间。换言之，子封装之间的互连件150必须略微从丝焊140移除，使得它们不被模制化合物145覆盖。这增加了堆叠管芯器件的尺寸。铜插入件的形成也要求了附加的过程(例如钻孔)，这增加了成本且实际上限制了每个封装的构造为标准的形状和尺寸。图1A是用于以上参考图1描述的堆叠管芯器件100的子封装的顶视图。如在图1A中示出，用于连接子封装的铜插入件150具有载体155。载体在其中可以放置丝焊140的基片110a上的区域外。对于给定的尺寸，管芯130a、基片110a且因此子封装105a需要足够大以容纳载体155。
附图说明
本发明可以通过参考如下的用于图示本发明的实施例的描述和附图被最好地理解。各图为：
图1图示了包括根据现有技术的堆叠的子封装的堆叠管芯器件；
图1A是用于根据现有技术的堆叠管芯器件的子封装的顶视图；
图2图示了用于根据本发明的一个实施例的子封装的基片的顶视图和侧视图；
图3A至图3D图示了用于生产根据本发明的一个实施例的子封装的过程；
图4图示了根据本发明的一个实施例的用于密封子封装的管芯同时使子封装互连件的上部分暴露的过程；和
图5图示了包括根据本发明的一个实施例的堆叠子封装的堆叠管芯器件。
具体实施方式
在如下的描述中阐述了多个特定的细节。然而，理解的是本发明的实施例可以不以这些特定的细节实践。在其他的例子中，已知的电路、结构和技术未详细示出，以不使对本发明的理解模糊。
在整个说明书中参考“一个实施例”或“实施例”意味着结合实施例描述的特定的特点、结构或特征包括在本发明的至少一个实施例中。因此，措辞“在一个实施例中”或“在实施例中”在整个说明书中不同的位置的出现不必需地都涉及相同的实施例。此外，特定的特点、结构或特征可以以任何合适的方式在一个或多个实施例中组合。
此外，本发明的方面决不在于单一的所披露的实施例的所有特征。因此，具体实施方式后的权利要求书因此清楚地合并到具体实施方式，使得每项权利要求作为本发明的独立的实施例自立。
图2图示了用于根据本发明的一个实施例的子封装的基片的顶视图和侧视图。基片210具有互连件240和子封装互连件250，其例如可以是导电的金属球，可用于以堆叠子封装构造将一个子封装电气地连接到其上的另一个子封装。子封装互连件250可以类似于典型地使用在管芯的底侧的用于表面安装封装的BGA。根据本发明的一个实施例，子封装互连件形成在基片的顶侧(管芯侧)。子封装互连件250是不连续的且因此丝焊可以在子封装互连件250附近和之间实现。对于一个实施例，在形成提供了子封装之间的相互连接的子封装互连件250之前，丝焊可以一直形成到将放置子封装互连件处。子封装互连件通过互连件240电气地连接到管芯230。基片的底侧可以具有常规的BGA或金属焊盘，用于电气地连接到下面的子封装。
图3A至图3D图示了用于生产根据本发明的一个实施例的子封装的过程。如在图3A中示出，基片310是具有用于管芯接附和丝焊或倒装芯片接附的特征的常规基片。基片310的底表面311具有导电金属球320，如以上参考图1所描述。基片310具有形成在顶表面312上的子封装互连件350。子封装互连件350接附到形成在基片310的外围附近的金属盘(未示出)。子封装互连件350可以是导电金属球，它可以由焊料形成，焊料可以是铅/锡合金。在替代实施例中，子封装互连件350可以由铜或其他合适的导电金属制成。对于这样的实施例，子封装互连件350可以使用类似于常规的BGA球接附方法的过程接附。
对于本发明的一个实施例，在于基片310的顶表面312上形成子封装互连件350后，将集成电路芯片(管芯)接附到基片310。根据本发明的一个实施例，管芯可以实现多种类型的存储器件或逻辑处理器器件。可以是一个管芯或具有堆叠构造的多个管芯的管芯使用常规管芯接附方法和材料接附到基片310且相互接附。如在图3B中示出，管芯330a接附到基片310的顶表面312且管芯330b堆叠到管芯330a顶上且接附到管芯330a。管芯的每个可以使用常规方法(例如丝焊或倒装芯片接附)电气地连接到基片且相互连接。子封装互连件350在顶表面312上延伸比管芯堆叠更大的距离。
如在图3C中示出，然后密封已接附的管芯或管芯堆叠以保护管芯且如果具有相关的导线(例如丝焊)则也保护相关的导线，同时使子封装互连件350的上部分351暴露。密封剂延伸到上表面312上方高于管芯堆叠，但不与子封装互连件350等高。对于本发明的一个实施例，密封剂345是例如环氧树脂或聚合物树脂的热固性材料，它可以包括不同的量(例如从重量百分比0％至80％)的硅石或其他无机微粒，以修改CTE、模量或粘性。对于本发明的一个实施例，这样的热固性材料可以包括助熔剂以在后续的回流过程中提供助熔能力。对于本发明的一个实施例，如在图3C中示出，管芯堆叠的密封通过下文中将更详细描述的模板印刷过程实现。
如在图3D中示出，密封剂345可以包围整个子封装互连件350。子封装互连件350可以保持被密封，其中子封装是堆叠的子封装器件的最顶层的子封装。在子封装互连件将用于将子封装电气地连接到在堆叠的子封装构造中其上方的另一个子封装的情况，子封装互连件350的上部分可以通过已知的方法暴露，例如通过研磨或激光钻孔。
将堆叠到另一个子封装顶上的子封装可以不包括例如BGA的导电的金属球，但可以包括对应于它们堆叠在其上的子封装的子封装互连件的焊盘321。
密封
对于本发明的一个实施例，使用模板印刷过程实现子封装的管芯的密封。密封剂的高度覆盖通过优化模板印刷过程和材料选择来控制，用于改进可加工性、密封性能和热力学性质。图4图示了根据本发明的一个实施例的用于密封子封装的管芯同时使子封装互连件的上部分暴露的过程。在图4中示出的过程400开始于操作405，其中提供了模板且将其放置在基片上。模板可以是薄的镍板，它被形成图案以覆盖子封装互连件的每个的一些上部分。
在操作410处提供可模板印刷的密封剂。典型的密封剂是不可模板印刷的，但可以通过减小它们粘性，例如通过添加溶剂到密封剂来使其可模板印刷。
在操作415处，施加可模板印刷的密封剂以密封管芯。密封剂的量控制为使得管芯(例如管芯堆叠)和相关的导线完全地被密封，同时子封装互连件的每个的上部分保持被暴露。子封装互连件的下部分也被密封。在实践中，密封剂的一些可能保留在子封装互连件的上部分上，但低粘性的密封剂有助于降低这样的密封剂的量。
在操作420处，基片受到升高的温度以移除溶剂(即蒸发在操作410中添加的溶剂的一些或全部)。对于本发明的一个实施例，基片受到大约100摄氏度的温度大约2小时。用于这样的蒸发过程的温度和时间可以取决于待蒸发的溶剂的量而修改。辅助模板印刷过程的溶剂在回流前被尽可能多地移除，以降低如果不移除溶剂而可能在固化/回流期间形成的空隙。溶剂的移除增加了施加的密封剂的粘性。对于本发明的一个实施例，在烘焙后，密封剂在随后的回流过程期间固化(交联)，回流过程将在下文中更完全地描述。对于本发明的一个实施例，这样的固化与焊料回流同时地实现。对于本发明的一个实施例，密封剂的固化动力学被特别地设计以降低与接头形成的干涉。
回流
两个或多个子封装相互连接以形成根据本发明的一个实施例的堆叠的子封装器件。子封装堆叠在另一个的顶上，使得在最顶上的子封装的底侧上的焊盘或导电金属球对应于在堆叠中下一个下方的子封装的暴露的子封装互连件。然后进行回流过程或其他常规的表面安装过程以造成子封装之间的相互连接。在回流期间，密封剂的粘性因升高的温度而降低。在上子封装的焊盘和下子封装的子封装互连件之间存在润湿力，促使任何残留在子封装互连件的表面上的密封剂材料排出而允许在子封装之间的相互连接的正确形成。
图5图示了包括根据本发明的一个实施例的堆叠的子封装的堆叠管芯器件。在图5中示出的堆叠管芯器件500包括三个子封装505a、505b和505c，它们可以是根据本发明的实施例制造的堆叠管芯子封装。子封装505a包括带有导电球520的基片510a。子封装505a具有管芯530a和530b，以密封剂545a将它们密封。子封装互连件550a的上部分551a被暴露且与形成在子封装505b的底表面上的焊盘521b形成相互连接。子封装505b具有接附到基片510b的管芯530c和530d，以密封剂545b将它们密封。子封装互连件550b的上部分551b被暴露且与形成在子封装505c的底表面上的焊盘521c形成相互连接。子封装505c具有接附到基片510c的管芯530e和530f，以密封剂545c将它们密封。整个子封装互连件550c也被密封。如堆叠管芯器件500的堆叠的子封装的每个是典型的一样，堆叠管芯器件500也是典型的。堆叠管芯器件可以具有任何合理的个数的堆叠子封装且每个子封装可以具有一个管芯或任何个数的堆叠管芯。
一般事项
本发明的实施例提供了用于生产具有堆叠子封装构造的堆叠管芯器件的方法和装置。本发明的多种实施例已描述为包括特定的特征或过程。对于本发明的替代实施例，特征或过程可以修改。例如，虽然子封装互连件一般地描述为导电的金属球，但它可以是根据本发明的替代实施例的任何合适的材料或形状。
本发明的实施例已描述为具有多种操作的过程。这样的操作是典型的且可以以其最基本的形式描述，但可以根据多种实施例在过程中添加或删除操作或修改操作而不偏离本发明的基本范围。例如，在以上参考图4描述的过程400中，覆盖子封装互连件的操作可以省略。对于这样的过程，子封装互连件的上部分可以通过越过施加了密封剂的表面拖曳刮板来暴露，以暴露子封装互连件。对于这样的实施例，保留在子封装互连件的表面上的有限的密封剂材料在回流期间将流下表面，其原因是密封剂的增加的粘性和在子封装互连件和连接的子封装的相应的焊盘之间的湿润。因此，任何残留的密封剂不干涉正确的相互连接的形成。
根据本发明的一个实施例，可以在回流前施加不流动的底填料材料，用于更好的连接形成和热能分散。在本发明的替代实施例中，底填料材料可以在子封装已连接后施加。
虽然本发明已经根据数个实施例描述，本领域技术人员将认识到本发明不限制于已描述的实施例，而是可以以在附带的权利要求书的精神和范围内的修改和变化来实践。描述因此被考虑为说明性的而非限制性的。

Claims (29)

1.一种装置，其包括：
具有顶表面和底表面的基片；
一组一个或多个接附到基片的顶表面的管芯，该一个或多个管芯在顶表面上延伸第一距离；
一个或多个形成在基片的顶表面上的互连件，该一个或多个互连件在顶表面上延伸第二距离；和
布置在基片的顶表面上且在顶表面上延伸第三距离的密封剂，第三距离大于第一距离且小于第二距离，使得一个或多个管芯被密封且一个或多个互连件的部分被暴露。
2.根据权利要求1所述的装置，其中一个或多个管芯在堆叠管芯构造中相互接附且最上方的管芯的最上部分在顶表面上延伸第一距离。
3.根据权利要求1所述的装置，其中一个或多个管芯具有相关的导线，相关的导线在顶表面上延伸第四距离，第四距离小于第一距离，使得相关的导线被密封。
4.根据权利要求1所述的装置，其中密封剂是热固性材料。
5.根据权利要求1所述的装置，进一步包括：
具有顶表面和底表面的第二基片，第二基片具有第二组一个或多个接附到第二基片的顶表面的管芯，且一个或多个导电区形成在第二基片的底表面上，每个导电区电气地联接到一个或多个形成在基片的顶表面上的互连件的相应的互连件。
6.根据权利要求4所述的装置，其中热固性材料是环氧树脂。
7.根据权利要求3所述的装置，其中一个或多个管芯的相关的导线包括丝焊。
8.根据权利要求1所述的装置，其中管芯的一个或多个具有实现在其上的逻辑处理器器件。
9.一种系统，其包括：
第一子封装；和
第二子封装，第二子封装堆叠在第一子封装顶上且与第一子封装电连接，第一子封装和第二子封装的每个包括基片，基片具有一个或多个接附到其顶表面的管芯和一个或多个形成在其顶表面上的互连件，且密封剂布置在基片的顶表面上使得一个或多个管芯被密封且一个或多个互连件的每个的上部分被暴露。
10.根据权利要求9所述的系统，其中第二子封装的基片具有一个或多个形成在底表面上的导电区，每个导电区电气地联接到形成在第一子封装的基片的顶表面上的一个或多个互连件的相应的互连件。
11.根据权利要求10所述的系统，进一步包括：
一个或多个相继地堆叠在第二子封装的顶上的附加的子封装，每个附加的子封装包括基片，基片具有一个或多个接附到其顶表面的管芯的和一个或多个形成在其顶表面上的互连件；和布置在基片的顶表面上的密封剂使得一个或多个管芯被密封且一个或多个互连件的每个的上部分被暴露；和一个或多个形成在底表面上的导电区，每个导电区电气地联接到形成在直接地前面的子封装的基片的顶表面上的一个或多个互连件的相应的互连件。
12.根据权利要求9所述的系统，其中一个或多个管芯在堆叠管芯构造中相互接附。
13.根据权利要求9所述的系统，其中一个或多个管芯具有相关的导线，相关的导线完全地被密封剂密封。
14.根据权利要求13所述的系统，其中管芯的一个或多个的相关的导线包括丝焊。
15.根据权利要求9所述的系统，其中密封剂是热固性材料。
16.根据权利要求15所述的系统，其中热固性材料是环氧树脂。
17.根据权利要求9所述的系统，其中一个或多个管芯实现了逻辑处理器器件。
18.一种方法，其包括：
在基片的顶表面上形成一个或多个互连件，该一个或多个互连件在基片的顶表面上延伸第一距离；
将一组一个或多个管芯接附到基片的顶表面，该一个或多个管芯在顶表面上延伸第二距离；
将密封剂施加在基片的顶表面上使得密封剂在顶表面上延伸第三距离，第三距离大于第一距离且小于第二距离。
19.根据权利要求18所述的方法，进一步包括：
在施加密封剂前将模板放置在基片上，模板具有对应于形成在顶基片上的一个或多个互连件的图案，使得模板降低了形成在一个或多个互连件的任意的互连件上的密封剂的量，该一个或多个互连件在基片的顶表面上延伸大于第二距离的距离。
20.根据权利要求19所述的方法，其中密封剂是热固性材料。
21.根据权利要求20所述的方法，其中热固性材料是环氧树脂。
22.根据权利要求21所述的方法，进一步包括：
在将热环氧树脂施加到基片的顶表面前降低其粘性。
23.根据权利要求22所述的方法，其中降低热环氧树脂的粘性包括向它添加溶剂。
24.根据权利要求18所述的方法，进一步包括：
堆叠第二基片，第二基片具有顶表面和基片顶上的底表面，第二基片具有第二组一个或多个接附到第二基片的顶表面的管芯，和形成在第二基片的底表面上的一个或多个导电区，每个导电区对应于形成在基片的顶表面上的一个或多个互连件的互连件。
25.根据权利要求24所述的方法，进一步包括：
进行回流过程使得在形成在基片的顶表面上的每个互连件和形成在第二基片的底表面上的每个相应的导电区之间形成电气连接。
26.根据权利要求18所述的方法，进一步包括：
在密封剂上施加刮板来降低形成在一个或多个互连件的任意互连件上的密封剂的量，该一个或多个互连件在基片的顶表面上延伸大于第二距离的距离。
27.根据权利要求18所述的方法，其中一个或多个管芯具有相关的导线，相关的导线完全地被密封剂密封。
28.根据权利要求27所述的方法，其中一个或多个管芯的相关的导线包括丝焊。
29.根据权利要求18所述的方法，其中一个或多个管芯实现了逻辑处理器器件。
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