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Publication numberCN100586258 C
Publication typeGrant
Application numberCN 200680010153
PCT numberPCT/JP2006/322902
Publication date27 Jan 2010
Filing date10 Nov 2006
Priority date10 Nov 2005
Also published asCN101151949A, EP1946626A1, EP1946626B1, US7632710, US20090233117, WO2007055410A1
Publication number200680010153.8, CN 100586258 C, CN 100586258C, CN 200680010153, CN-C-100586258, CN100586258 C, CN100586258C, CN200680010153, CN200680010153.8, PCT/2006/322902, PCT/JP/2006/322902, PCT/JP/6/322902, PCT/JP2006/322902, PCT/JP2006322902, PCT/JP6/322902, PCT/JP6322902
Inventors前田宪, 境忠彦, 大园满
Applicant松下电器产业株式会社
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Method for soldering electronic component and soldering structure of electronic component
CN 100586258 C
Abstract
In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder (8) is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder (8) has a flake or dendrite shape including a core segment (8a) of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment (8b) of the metal with good-wettability for the molten solder and to be solid-solved in the core segment (8a) molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles (18) . Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.
Claims(9)  translated from Chinese
1.一种用于焊接电子元件在基板上使得形成于与该基板的电极对准的该电子元件上的焊料凸点被加热且由此熔化的该焊料凸点被焊接在该电极上的方法,包括步骤: 将所述电子元件的该焊料凸点与该基板的电极对准,焊剂夹置于该焊料凸点和该电极之间,该焊剂包含金属粉末,该金属粉末具有包括金属的核心部分和金属的表面部分的片状或枝状形状,该金属的核心部分在比构成所述焊料凸点的焊料的液相温度高的温度熔化,该金属的表面部分对于熔化的焊料具有良好的润湿性且将固相溶解在熔化的核心部分内; 加热所述电子元件和所述基板以熔化所述焊料凸点,使得熔化的焊料被润湿且沿该金属粉末的表面延展而达到该电极; 进一步继续加热,使得残留的不接触所述熔化焊料的该金属粉末熔化成基本上球形;以及随后冷却所述基板和所述电子元件,使得该熔化的金属粉末和所述焊料固化。 1. A method for soldering an electronic component on a substrate such that the solder bump formed on the electrode of the electronic component and the substrate is aligned on the heated and thus melted solder bump is soldered on the electrode method comprising the steps of: aligning the solder bump electrodes of the electronic component and the substrate, the solder interposed between the solder bump and the electrode, the flux containing metallic powder, the metal powder comprises a metal having a core flake or dendrite shape of the surface portion of the metal part and the core part of the metal constituting the solder bump than the liquidus temperature of the solder of high melting temperature, the surface portion of the metal to molten solder has good and the wettability of the solid phase is dissolved in the melt of the core portion; heating the electronic component and the substrate to melt the solder bump so that the molten solder is wetted and stretched along the surface of the metal powder to achieve the electrode; heating was continued further so that the residual molten solder does not contact the substantially spherical metal powder melts; and subsequently cooling the electronic component and the substrate, such that the melted metal powder and the solder solidified.
2. 如权利要求1所述的用于焊接电子元件的方法,其中构成所述表面部分的金属为金、银或铂;且构成所述核心部分的金属为锡或锡系列合金。 2. A method for soldering an electronic component according to claim 1, wherein the metal constituting the surface portion of the gold, silver or platinum; and the metal constituting the core portion of the tin or tin alloy series.
3. 如权利要求l所述的用于焊接电子元件的方法,还包括步骤:使用清洗水来清洗固化成球形的该金属粉末以及所述焊剂的残余物,从而将它们从该基板移除。 A method for soldering an electronic component l according to claim, further comprising the step of: using the washing water to clean the solidified into spherical metal powder and the flux residue, thereby removing them from the substrate.
4. 一种用于焊接电子元件在基板上使得形成于与该基板的电极对准的该电子元件上的焊料凸点被加热且由此熔化的该焊料凸点被焊接在该电极上的方法,包括步骤:将所述电子元件的该焊料凸点与该J4l的电极对准,热固性树脂夹置于该焊料凸点和该电极之间,该热固性树脂包含金属粉末,该金属粉末具有包括金属的核心部分和金属的表面部分的片状或技状形状,该金属的核心部分在比构成所述焊料凸点的焊料的液相温度高的温度熔化,该金属的表面部分对于熔化的焊料具有良好的润湿性且将固相溶解在熔化的核心部分内;加热所述电子元件和所述基板以熔化所述焊料凸点,使得熔化的焊料被润湿且沿该金属粉末的表面延展而达到该电极;进一步继续加热, <吏得残留的不接触所述熔化焊料的该金属粉末熔化成基本上球形;通过该加热促进所述热固性树脂的石更化反应;以及随后冷却所述基板和所述电子元件,使得该熔化的金属粉末和所述焊料固化。 4. A method for soldering an electronic component on a substrate such that the solder bump formed on the electrode of the substrate is aligned with the electronic components are heated to melt the solder and thus be soldered on the bump electrode method comprising the steps of: aligning the solder bump electrodes of the electronic element and the J4l, the thermosetting resin interposed between the solder bump and the electrode, the thermosetting resin containing metallic powder, the metal powder comprises a metal having a The core of the technology and metal flake-like shape of the surface or part of, the core part of the metal than the solder constituting the solder bumps high melting temperature of the liquid phase, the surface portion of the metal to the molten solder has good wettability and dissolution of the solid phase in the melting of the core portion; heating the electronic component and the substrate to melt the solder bump so that the molten solder powder are wetted and extend along the surface of the metal and reach the electrode; and further heating was continued, <officials have residual molten solder does not contact the metal powder melted substantially spherical; promote the thermosetting resin stone more reaction by the heating; and subsequently cooling the substrate and The electronic components, such that the melted metal powder and the solder solidified.
5. 如权利要求4所述的用于焊接电子元件的方法,其中构成所述表面部分的金属为金、银或铂;且构成所述核心部分的金属为锡或锡系列合金。 5. A method for soldering an electronic component according to claim 4, wherein the metal constituting the surface portion of the gold, silver or platinum; and the metal constituting the core portion of the tin or tin alloy series.
6. —种通过如权利要求1所述的焊接方法而焊接在基板上的电子元件的焊接结构,包括具有用于连接所述电子元件和所述电极的焊料部分,以及残留在所述焊料部分的表面上及该基板的表面上的焊剂残余物,其中由于未接触该熔化焊料的该金属粉末被熔化成球形而产生的金属粒子被包含在所述焊剂残余物内。 6. - species by welding method as claimed in claim 1, wherein the welded structure and welding of electronic components on a substrate, comprising having a solder portion for connecting said electronic element and said electrode, and a solder portion remaining in the flux residues on the surface and on the surface of the substrate, and wherein the metal particles are not in contact due to the molten solder which is melted spherical metal powder produced is contained within the flux residue.
7. 如权利要求6所述的电子元件的焊接结构,其中所述金属粒子分别具有位于表面上的氧化膜。 7. A welded structure 6 of the electronic device as claimed in claim wherein said metal particles each having an oxide film located on the surface.
8. —种通过如权利要求4所述的焊接方法而焊接在基板上的电子元件的焊接结构,包括具有用于连接所述凸点和该基板的所述电极的焊料部分, 以及用于强化该焊津+部分和该电极之间的连接部分的树脂部分,其中由于未接触该熔化焊料的所述金属粉末被熔化成基本上球形而产生的金属粉末被包含在所述树脂部分内。 8. - species by welding and the welding method according to the electronic component soldering structure on a substrate as claimed in claim, comprising the electrode having a solder portion for connecting the bump and the substrate, and means for strengthening The welding Tsu + resin portion and said connecting portion between the electrodes, wherein since the molten solder does not contact the metal powder is melted to produce substantially spherical metal powder to be contained in the resin portion.
9. 如权利要求8所述的电子元件的焊接结构,其中所述金属粒子分别具有位于表面上的氧化膜。 9. The welded structure 8 of the electronic device as claimed in claim wherein said metal particles each having an oxide film located on the surface.
Description  translated from Chinese

用于焊4妄电子元件的方法和电子元件的焊接结构 Welded construction method for welding 4 jump of electronic components and electronic components

技术领域 Technical Field

本发明涉及用于焊接电子元件在基板上的方法以及电子元件的焊接结构。 The present invention relates to a welded structure for soldering electronic components on a substrate method, and electronic components.

背景技术 Background

传统上广泛地采用焊接,作为将电子元件安装在基板上的方法。 Widely used welding Traditionally, as a method of electronic components mounted on the substrate. 焊接的方式包括各种技术,例如,通过焊接形成金属凸点作为形成于该电子元件上的连接电极的方法,以及在基板的电极表面上形成焊料层的"焊料预涂覆 Welding methods include various techniques, e.g., a metal bump is formed by welding a connecting electrode formed on the method for electronic components, as well as "solder precoated solder layer formed on the electrode surface of the substrate

(solder-precoating),,方法。 (Solder-precoating) ,, methods. 近年来,^^环境保护的角度考虑,在上述焊4妄中,含有最少数量的有害的铅的"无铅焊料"已经被采用。 In recent years, environmental protection viewpoint ^^, 4 jump the above welding, contain harmful lead minimum number of "lead-free solder" has been adopted.

无铅焊料在成分上与常规采用的铅系列焊料大不相同。 Lead-free solder differ in composition and use of conventional lead series solder. 因此,对于焊接工艺中采用的焊剂(flux),不可以照搬使用传统上通常使用的焊剂。 Therefore, the soldering process using flux (flux), can not be copied using the Flux traditionally commonly used. 具体而言,常规焊剂具有不充分的活化(activating)操作,使得焊料表面上氧化膜的移除不充分。 Specifically, the conventional flux has insufficient activation (activating) operation, so that the removal of the oxide film on the solder surface is not sufficient. 因此,难以保证良好的焊料润湿性。 Therefore, it is difficult to ensure good solder wettability. 对于具有不良焊料润湿性的这种焊料,具有如下成分的焊剂已经被提出,其中该成分中混合了具有出色焊料润湿性的金属例如银的金属粉末(例如,见JP-A-2000-31210)。 For solder flux having poor solder wettability such, having the following composition have been proposed, wherein the mixed composition having excellent solder-wettable metal, for example silver metal powder (e.g., see JP-A-2000- 31210). 通过使用这种焊剂,在回流工艺中熔化的焊料可以沿焊剂内金属粉末的表面被润湿延展,使得熔化的焊料可以被牵引至为连接目标的电极。 By using such a flux, the molten solder reflow process may be extended along the wetted surface of the solder metal powder, so that the molten solder can be pulled to the electrode connection target.

然而,在上述专利文献中披露的焊剂中,视具体情况而定,根据金属粉末的含量会导致下述不便。 However, in the flux in the above patent document disclosure, as the case may be, depending on the content of the metal powder can cause the following inconveniences. 近年来的主流是一种在焊接之后不实施用于消除焊剂成分的清洗的无清洗技术。 In recent years, the mainstream is a non-implementation of the no-clean flux cleaning technology for eliminating the component after welding. 因此,在回流之后,焊剂成分残留下来作为残余物沉积在焊接部分周围。 Therefore, after reflow, the flux component is deposited as a residue left behind around the welded portion. 因此,焊剂中包含的金属粉末也残留在焊接部分周围。 Thus, the metal powder contained in the flux residue around the welded portion also.

此时,如果大量金属粉末残留,则可能发生由于迁移引起的不良绝缘。 At this time, if a large number of metal powder residues may occur due to the migration caused by poor insulation. 这种情况下,如果金属粉末的含量减少以防止该不良绝缘,则在回流工艺中通过金属粉末的该熔化焊料的牵引效果降低。 In this case, if the content of the metal powder is reduced to prevent the poor insulation, in the reflow process to reduce the effect of the metal powder by pulling the molten solder. 结杲,焊料连接性恶化。 Results Gao, solder connections deteriorated. 具体而言,在通过将封装元件与封装在树脂基板内的半导体元件堆叠来制造半导 Specifically, by the encapsulating element encapsulated in a resin substrate to produce a semiconductor element of the semiconductor stack

4体装置的焊接中,在电极和待焊接的凸点之间由于树脂基板的翘曲而可能产生-间隙,結泉,非常频繁地发生由于焊料润湿性引起的不良连揍《..如士沐述,-使用.包含金属粉末的焊剂的常规焊接方法存在的问题为,难以组合维持焊料连接性和保证绝缘。 4 body welding apparatus, to be welded between the electrode and the bump due to the warping of the resin substrate that may arise - a gap junction springs, very frequently due to adverse even beat solder wettability caused by the ".. as Mu Shi said, - the use of conventional welding methods exist containing solder metal powder is difficult to maintain a combination of solder connections and ensure that the insulation.

发明内容 DISCLOSURE

鉴于上述情形,本发明的目的是提供一种可以组合焊料连接性的维护和绝缘的保证的焊接电子元件的方法,以及该电子元件的焊接结构。 In view of the above circumstances, an object of the invention is to provide a combination of an electronic component soldering method of the solder connection of the maintenance and assurance of insulation, and the electronic component soldering structure.

本发明的一个方面提供了一种用于将电子元件焊接在基板上使得形成于与该基板电极对准的该电子元件上的焊料凸点被加热且由此熔化的该焊 One aspect of the invention provides a method for soldering an electronic component on a substrate such that the solder bump formed on the electronic component aligned with an electrode on the substrate is heated to melt the solder and thereby

料凸点被焊接在该电极上的方法,该方法包括步骤:将该电子元件的该焊料凸点与该基板的电极对准,焊剂夹置于该焊料凸点和该电极之间,该焊剂包含金属粉末,该金属粉末具有包括金属的核心部分(core segment)和金属的表面部分(surface segment)的片状或枝状形状,该金属的核心部分在比构成该焊料凸点的焊料的液相温度高的温度熔化,该金属的表面部分对于该熔化的焊料具有良好的润湿性且将固相溶解在该熔化的核心部分内;加热该电子元件和该基板以熔化该焊料凸点,使得该熔化的焊料被润湿且沿该金属粉末的表面延展而达到该电极;进一步继续加热,使得残留的不接触该熔化焊料的该金属粉末熔化成基本上球形;以及,随后冷却该基板和该电子元件, 使得该熔化的金属粉末和该焊料固化。 Bump material is welded to the electrode, the method comprising the steps of: the solder bump of the electronic component and the electrode of the substrate aligned solder interposed between the solder bump and the electrode, the flux contains metal powder, the metal powder has a core portion including metal (core segment) and the surface portion (surface segment) or dendritic shape sheet metal, the core portion of the metal than the solder bump constituting the liquid solder higher temperature melting phase, the surface portion of the metal to the molten solder with good wettability and dissolution of the solid phase in the core portion of the melted; heating the electronic component and the substrate to melt the solder bump, so that the molten solder is wetted and extend along the surface of the metal powder to achieve the electrode; and further heating was continued so that the residual molten solder does not contact the metal powder melted substantially spherical; and, followed by cooling the substrate and The electronic components, so that the molten metal powder and the solder cure.

本发明的另一方面提供了一种用于将电子元件焊接在基板上使得形成于与该基板电极对准的该电子元件上的焊料凸点^t加热且由此熔化的该焊料凸点被焊接在该电极上的方法,该方法包括步骤:将该电子元件的该焊料凸点与该基板的电极对准,热固性树脂夹置于该焊料凸点和该电极之间,该热固性树脂包含金属粉末,该金属粉末具有包括金属的核心部分和金属的表面部分的片状或枝状形状,该金属的核心部分在比构成该焊料凸点的焊料的液相温度高的温度熔化,该金属的表面部分对于该熔化的焊料具有良好的润湿性且将固相溶解在该熔化的核心部分内;加热该电子元件和该基板以熔化该焊料凸点,使得该熔化的焊料被润湿且沿该金属粉末的表面g而达到该电极;进一步继续加热,使得残留的不接触该熔化焊料的该金属粉末熔化成基本上球形;通过该加热促进该热固性树脂的硬化反应;以及,随后冷却该基板和该电子元件,使得该熔化的金属粉末和该焊料固化。 Another aspect of the invention provides a method for soldering an electronic component on a substrate so as to form the electronic component on the substrate with the solder bump electrodes aligned ^ t heating and thereby melting the solder bump is welding on the electrode, the method comprising the steps of: the electrode of the solder bump of the electronic component and the substrate are aligned, the thermosetting resin interposed between the solder bump and the electrode, the thermosetting resin contains a metal powder, the metal powder having a flake or dendrite shape of the surface portion comprises a metallic core portion and metal core of the metal at a temperature higher than the liquidus temperature of the solder constituting the solder bump melts, the metal For the portion of the surface of the molten solder with good wettability and dissolution of the solid phase in the core portion of the melted; heating the electronic component and the substrate to melt the solder bump so that the molten solder is wetted and along The metal powder of the electrode surfaces to achieve g; heating was continued further so that the residual molten solder does not contact the metal powder melts substantially spherical; promoting the curing reaction of the thermosetting resin by the heating; well, followed by cooling the substrate and the electronic component, so that the molten metal powder and the solder cure.

本发明的另《壽..薛提供;^-辟通过该焊接方法而焊接在基板上的电子元件的焊接结构,包括具有用于连接该电子元件和该电极的焊料部分,以及残留在该焊料部分的表面上及该基板的表面上的焊剂残余物,其中由于未接触该熔化焊料的该金属粉末被熔化成球形而产生的金属粒子被包含在该焊剂残余物内。 Another of the invention "tho .. Xue provided; ^ - the provision by the welding method and welding welded structure of the electronic components on a substrate, including a for connecting the electronic components and the solder portion of the electrodes, and remaining in the solder flux residues on the surface portion of the upper surface of the substrate and the metal particles which are not due to the contact with the molten solder is melted spherical metal powder produced is contained within the flux residue.

本发明的另一方面提供了一种通过该焊接方法而焊接在基板上的电子元件的焊接结构,包括具有用于连接该凸点和该基板的电极的焊料部分,以及用于强化该焊料部分和该电极之间的连接部分的树脂部分,其中由于未接触该熔化杆料的该金属粉末被熔化成基本上球形而产生的金属粉末被包舍在该树脂部分内。 Another aspect of the invention there is provided a method of welding by the welding of the welded structure on the substrate of electronic components, including an electrode having a solder portion for connecting the bump and the substrate, and means for reinforcing the solder portion and a resin portion of the connecting portion between the electrodes, wherein the non-contacting due to the melting of the metal rod material powder is melted substantially spherical metal powder to be produced within the resin package rounded portion.

根据本发明,出于在回流时牵引熔化焊料的目的而混合的该金属粉末具有包括金属的核心部分和金属的表面部分的片状或枝状形状,该金属的核心部分在比构成该焊料凸点的焊料的液相温度高的温度熔化,该金属的表面部分对于该熔化的焊料具有良好的润湿性且将固相溶解在该熔化的核心部分内。 According to the present invention, at reflux, for the purpose of pulling the molten solder is mixed with the metal powder or flake shape of the surface portion of the dendritic core comprises a metallic portion and a metal portion of the metal core constituting the solder bump than high liquidus temperature of the solder melting point temperature, the surface portion of the metal to the molten solder with good wettability and dissolution of the solid phase in the core portion of the melted. 因此,残留的金属粉末在回流时被熔化成其基本上球形的状态,该状态难以产生迁移。 Therefore, the residual metal powder is melted during reflow substantially spherical state, the state is difficult to produce migration. 因此,焊料连接性和绝缘保证均可以被组合。 Accordingly, the solder connection and insulation to ensure both may be combined.

附图说明 Brief Description

图1A至1C为用于解^^艮才居本发明第一实施例的电子元件安装工艺的视图。 1A to 1C are used to solve ^^ Burgundy was living example of an electronic component installation process view of a first embodiment of the present invention.

图2A至2C为用于解^^艮据本发明第一实施例的电子元件安装工艺的视图。 2A to 2C are used to solve ^^ Burgundy according to the first embodiment of the present invention, an electronic element according to the view of the installation process.

图3A和3B为用于解释根据本发明第一实施例的用于焊接电子元件的方法中采用的焊剂的形状和成分的视图。 3A and 3B are views for explaining a method for soldering an electronic component of a first embodiment of the present invention employed in the shape and composition of the flux according to.

图4A至4C为用于解释根据第一实施例的用于焊接电子元件的方法中焊料连接工艺的视图。 4A to 4C for explaining a method for soldering an electronic component according to a first embodiment of a solder connection process view.

图5A至5C为根据本发明第一实施例的用于焊接电子元件的方法中采用的焊剂中包含的金属粉末的剖面图。 5A to 5C is a sectional view of a method for soldering electronic components of a first embodiment of the present invention employed the flux contains metal powder in accordance with.

图6为根据本发明第一实施例的电子元件的焊接结构的剖面图。 Figure 6 is a sectional view of a welded structure of an electronic device according to the first embodiment.

图7A至7C为用于解释根据本发明第一实施例的电子元件的安装中为焊料连接供应浆料(paste)的方法的视图。 7A to 7C for explaining mounting electronic components according to a first embodiment of the invention in connection serves as a solder paste (paste) method of view.

图8为根据本发明第二实施例的电子元件的焊接结构的剖面图。 Figure 8 is a sectional view of a second embodiment of the electronic component of the present invention is based on welded structures.

具体实施方式实施例1 DETAILED DESCRIPTION Example 1

图1A至1C和图2A至2C为用于解释才艮据本发明第一实施例的用于焊接电子元件的方法的工艺的视图。 1A to 1C and 2A to 2C for explaining only Burgundy according to the first embodiment of the present invention, the process for soldering electronic components view of the example of the method. 图3A和3B为用于解释根据本发明第一实施例的用于焊接电子元件的方法中采用的焊剂的形状和成分的视图。 3A and 3B are views for explaining a method for soldering an electronic component of a first embodiment of the present invention employed in the shape and composition of the flux according to. 图4A至4C为用于解释根据第一实施例的用于焊接电子元件的方法中焊料连接工艺的视图。 4A to 4C for explaining a method for soldering an electronic component according to a first embodiment of a solder connection process view. 图5A至5C为才艮据本发明第一实施例的用于焊接电子元件的方法中采用的焊剂中包含的金属粉末的剖面图。 5A to 5C are only Burgundy according to the first embodiment of the present invention, a cross-sectional view of a metal powder, a method for soldering electronic components used in an embodiment of the flux contained. 图6为根据本发明第一实施例的电子元件的焊接结构的剖面图。 Figure 6 is a sectional view of a welded structure of an electronic device according to the first embodiment. 图7A至7C为用于解释根据本发明第 7A to 7C for explaining the first according to the present invention

首先,将参考图1A至1C和2A至2C来解释用于焊接电子元件的方法。 First, referring to FIG. 1A to 1C and 2A to 2C to explain a method for soldering electronic components. 在用于焊接电子元件的该方法中,形成于与基板电极对准的电子元件上的焊料凸点被加热,且由此熔化的该焊料凸点被焊料连接到该电极。 In the method for soldering an electronic component, a solder bump formed on the electronic component aligned with an electrode on the substrate is heated, and thereby the molten solder to the solder bump is connected to the electrode. 通过这种焊接方法,电子元件安装在该基板上。 By this welding method, an electronic component mounted on the substrate.

在图1A中,电极2形成于基板1的上表面上。 In Fig. 1A, the electrode 2 is formed on the upper surface of the substrate 1. 电子元件4具有下述结构,其中元件电极4b形成于树脂基板4a的下表面上且元件安装部分5形成于上表面上,焊料凸点6 (下文中筒称为凸点6)形成于元件电极4b上。 Electronic component 4 has a structure, in which the element and the electrodes 4b formed on the element mounting portion 5 is formed on the upper surface 4a of the lower surface of the resin substrate, the solder bumps 6 (hereinafter referred to as bumps in the cylinder 6) formed on the element electrode and 4b. 通过将精细颗粒状焊料球焊料连接到元件电极4b来形成凸点6。 By finely particulate solder balls to solder connecting element electrodes 4b formed bumps 6. 附带地,"焊料"是指具有低熔点的金属(例如锡)或者由多种金属组成的合金(例如, 银锡合金)。 Incidentally, "solder" refers to a metal having a low melting point (e.g., tin) or an alloy by a variety of metals (e.g., silver-tin alloy). 现在,在这些金属和合金中包含最少数量的铅的无铅焊料被用做焊料材料。 Now, in these metals and alloys containing a minimum amount of lead in lead-free solder is used as solder material.

元件安装部分5是通过树脂密封安装于树脂基板4a上表面上的半导体元件(未示出)而形成的。 The seal element mounting portion 5 is formed by mounting a semiconductor element on a resin substrate 4a on the surface (not shown) through the resin. 在该树脂密封步骤中,在高温下处于熔化状态的树脂注入到模腔内并热硬化以形成树脂模。 In the resin sealing step, the resin in a molten state at a high temperature is injected into the mold cavity and a thermosetting resin to form a mold. 从该模腔移除如此形成的树脂模并在空气中冷却。 Removed from the mold cavity thus formed resin mold and cooled in air. 在该冷却步骤,由于树脂基板4a和树脂模之间的热膨胀系数的差异,树脂基板4a上侧上的元件安装部分5收缩程度大于树脂基板4a。 In this cooling step, since the difference in coefficient of thermal expansion of the resin substrate and the resin mold 4a between the resin substrate member 4a on the upper side of the mounting portion 5 is larger than the degree of shrinkage of the resin substrate 4a. 因此,整个电子元件4按照树脂基板4a端部朝元件安装部分5翘曲的方式变形。 Thus, the entire electronic component 4 in accordance with the end portion 4a of the resin substrate mounting portion 5 deforms toward the warp elements. 因此,在形成于电子元件4下侧上的多个凸点6中,位于外部边多彖的各个凸点6*的下端由于翘曲变形而处于比位于内部的各个凸点的下端更高的位置,偏移了dl。 Thus, the lower side 4 is formed on the electronic component in the plurality of bumps 6 is located in the lower end of the external side of the respective multiple hog bumps 6 * warpage due to higher than the lower end of which is located in the interior of each of the bumps position, shifted dl. 因此,凸点6的下端的高度并不相互齐平,从而在电子元件4加载在基板1上的状态下,间隙可能形成于凸点6*和相应电极2之间。 Therefore, the height of the lower end of the bumps 6 are not flush with each other, so that in the electronic component 4 on the substrate 1 loaded state, a gap may be formed between the bumps and the corresponding electrodes 6 * 2.

下述的焊剂3通过复制而应用于各个凸点6上。 The following solder 3 by copying and applied to various bumps 6. 具体而言,通过相对于具有焊剂3沉积膜的复制台7上下移动电子元件4,见图1B,焊剂3复制/ 应用在各个凸点6的下端上。 Specifically, with respect to the deposited film 3 having a flux copying station 7 moves up and down the electronic component 4, shown in Figure 1B, solder 3 copy / applied on the lower end of each of the bumps 6. 在下述的用于将电子元件4焊接在基板1上的焊料连接中,采用焊剂3以隔开凸点6和电极2,从而改善焊料连接性。 4 is used in the soldering of electronic components on a substrate a solder connection described below, the use of solder bumps 3 to 6 and the electrode 2 are separated, thereby improving the solder connectivity.

现在解释焊剂3的成分。 Solder composition 3 is now explained. 焊剂3是通过将活化剂和金属粉末8作为添加剂混合到具有高粘稠度的液态基试剂中而形成的,其中在该液态基试剂中, 诸如松香的树脂成分固态溶解在溶剂中。 3 is formed by the flux activator and metal powder 8 as additives mixed into a liquid having a high viscosity base reagent formed, wherein the liquid base reagent, such as a solid rosin resin component dissolved in a solvent. 添加该活化剂的目的是移除形成于各个凸点6表面上的焊料的氧化膜。 The object of the activator is added to remove an oxide film 6 is formed on the surface of each of the solder bumps. 为此,采用能够移除该氧化膜的有机酸。 To this end, an organic acid can be removed using the oxide film. 附带地,现在,该活化剂采用在焊料连接之后无需清洗的具有^[氐活性的活化剂。 Incidentally, now, the use of activator in the solder connection without cleaning after having ^ [Di active activators.

从图3A看出,金属粉末8采用通过压碎精细颗粒状金属而形成的片状粉末。 Seen from FIG. 3A, the use of metal powder 8 flakes by crushing and the fine particulate metal is formed. 图3B示出了沿图3A中金属粉末8的线AA取的剖面图。 3B illustrates a cross-sectional view along line 3A metal powder of AA 8 taken. 从图3B 看出,金属粉末8是由核心部分8a和覆盖核心部分8a表面的表面部分8b 组成。 Seen from Fig. 3B, the metal powder 8 is covered by the core portions 8a and 8b surface portion of the core portion 8a composition of the surface. 在表面部分8b和核心部分8a之间的边界,形成了其中构成表面部分8b的金属扩散于核心部分8a内的扩散层8c。 Boundary surface portions 8b and between the core portions 8a, 8c are formed in which the metal diffusion layer constituting the surface portion 8b is diffused in the core portion 8a. 在这种配置中,核心部分8a 中使用的金属物质选自由锡(Sn)和锡系列合金组成的组。 In this configuration, the metal material used in the core portion 8a is selected from tin (Sn) and tin alloys thereof. 表面部分8b通过诸如电镀的技术^隻盖核心部分8a的表面而形成。 Surface portion 8b through techniques such as electroplating ^ only cover the surface to form a core portion 8a.

锡系列合金可以是锡-银(Sn-Ag)系列、锡-银-铜(Sn-Ag-Cu)系列、锡-铅(Sn-Pb)系列、锡—铅-银(Sn-Pb-Ag )系列、锡-铜(Sn-Cu) 系列、锡-铋(Sn-Bi)系列、锡-银-铋(Sn-Ag-Bi)系列、锡-银-铋-铟(Sn-Ag-Bi-In )系列、锡-锑(Sn-Sb )系列、锡-铟(Sn-In)系列、锡-锌(Sn-Zn )系列、锡-锌-铋(Sn-Zn-Bi)系列、或者锡-锌-铝(Sn-Zn-Al) 系列。 Sn series alloy may be a tin - silver (Sn-Ag) series, tin - silver - copper (Sn-Ag-Cu) series, tin - lead (Sn-Pb) series, tin - lead - silver (Sn-Pb-Ag ) series, tin - copper (Sn-Cu) series, tin - bismuth (Sn-Bi) series, tin - silver - bismuth (Sn-Ag-Bi) series, tin - silver - bismuth - indium (Sn-Ag-Bi -In) series, tin - antimony (Sn-Sb) series, tin - indium (Sn-In) series, tin - zinc (Sn-Zn) series, tin - zinc - bismuth (Sn-Zn-Bi) series, or Tin - zinc - aluminum (Sn-Zn-Al) series.

对于表面部分8b的金属物质,则选择下述材料,其在比凸点6所采用的焊料的液相温度高的温度熔化,在空气中不会在金属粉末8的表面上形成氧化膜,且进一步提供对于构成凸点6的焊料的良好润湿性,使得熔化凸点6的流动状态下的焊料可能被润湿并沿表面延展(该材料为例如,诸如纯度 For the surface of the metal material portion 8b, the following material is selected, in which the solder liquidus temperature higher than the temperature used to melt the bumps 6, an oxide film is not formed in the air on the surface of the metal powder 8, and further constituting the solder bumps 6 good wettability, so that the molten solder bumps 6 under flow conditions may be wetted and extending along the surface (of the material, for example, as pure

8为90%以上的金(Au)、银(Ag)或铂(Pt)的贵金属)。 8 90% or more of gold (Au), silver (Ag) or platinum (Pt) of the noble metal). 通过将这种金属粉末8按1至20体积%范围内的百分比混合到基础试剂中,由此将其添加到焊剂3。 By such a metal powder 8 percentage within the range of 1 to 20% by volume of the mixed reagent to the base, thereby adding to the flux 3.

现在,对于核心部分8a和表面部分8b中采用的金属物质的组合,则选择能够实现下述扩散特性的组合,即,在回流工艺中通过加热,从表面部分8b到内部核心部分8a的扩散(见图5B)可能发生,且当该回流完成时,从表面部分8b到核心部分8a的扩散完成,使得表面部分8b内的更多部分的金属被吸收到核心部分8a。 Now, the combination of metal core material portions 8a and 8b used in the surface portion is selected to achieve the following combination of diffusion characteristics, i.e., by heating in the reflow process, the diffusion from the surface to the interior portion 8b of the core portion 8a ( see FIG. 5B) may occur, and when the reflux is completed, from the surface to the core portion 8b diffusion portion 8a is completed, so that more of the metal surface of the inner portion 8b is absorbed into the core portion 8a. 在这种成分中,表面部分8b是由对于焊料具有出色润湿性的金属制成,且核心部分8a是由允许该表面部分8b由于回流通过加热而熔化并被内部吸收的金属制成。 In this composition, the surface portion 8b is made of a metal having good wettability for solder, and the core portion 8a 8b is melted by heating at reflux since the portion of the surface and allowed to absorb the metal inside. 将被混合到焊剂3内的金属粉末采用这种成分,则在通过无清洗体系的焊料连接中可以获得下述出色效果。 The metal powder is mixed into the flux within 3 With this component, you can get excellent results in the following connection via a solder-free cleaning system in.

在上述实施例中,金属粉末8是片状的,使得单位重量的表面积尽可能大。 In the above embodiment, the metal powder 8 is a sheet, so that the largest possible surface area per unit weight. 然而,金属粉末8可以是枝状的,使得细条形金属三维地分枝。 However, the metal powder 8 may be branched so that branch thin strip of metal in three dimensions. 这种分枝的金属粉末还可以最大可能地增大单位重量的表面积。 This branch of the metal powder may also be possible to increase the maximum surface area per unit weight.

如果片状金属粉末和枝状金属粉末相互混合,则单位重量的表面积可以增大。 If the sheet metal powder and a metal powder mixed with each dendrite, the surface area per unit weight can be increased. 此外,两种类型的粉末的结构特征以该金属粉末被混合到焊剂3内的状态被组合,使得小重量%的金属粉末可以最大可能地均匀地且高密度地散布在焊剂3内。 Furthermore, structural features of the two types of powder to the metal powder mixed into flux state 3 are combined within such a small percent of the maximum weight of the metal powder may be may be uniformly dispersed in a high density and the flux 3.

即,在本实施例的烀接方法中采用的焊剂3包含由金属的核心部分8a 和金属的表面部分8b组成的片状或枝状金属粉末8,该金属的核心部分8a 在比构成焊料凸点6的焊料的液相温度高的温度熔化,该金属的表面部分8b 对于该熔化的焊料具有良好的润湿性且将固相溶解在该熔化的核心部分8a 内。 That is, in the method of the present embodiment 烀 then employed in Example 3 the flux metal powder containing sheet or branched portion 8b from the surface of the metal core portions 8a and 8 composed of metal, the core part of the metal constituting the solder bump than 8a Point 6 of the liquidus temperature of the solder of high melting temperature, the surface portion 8b of the metal for the molten solder with good wettability and dissolution of the solid phase in the core of the melted portion 8a.

接着,从图1C看出,在已经复制/应用了焊剂之后的电子元件4被安装在基板1上。 Then, seen from Figure 1C, has been copied / applied after solder electronic components 4 are mounted on the substrate 1. 通过加热来熔化凸点6,使得熔化的凸点6连续地焊料连接到电极的上表面,由此实施将电子元件4安装在基板1上。 6 bumps melted by heating, so that the melted solder bumps 6 is continuously connected to the upper surface of the electrode, thereby performing the electronic component 4 is mounted on the substrate 1. 因此,藉由通过固化该熔化焊料而形成的焊料部分,各个元件电极4b电连接到相应电极2且电子元件4固定到基板1。 Thus, by curing by solder portion formed by the molten solder, the various elements connected to the corresponding electrode 4b and the electrode 2 electronic component 4 is fixed to the substrate 1.

在该安装工艺中,将凸点6与电极2对准,置于基板l上方的电子元件4朝向基板1降低。 In the mounting process, the bumps 6 is aligned with the electrode 2, the electronic component disposed above the substrate 4 l lowered toward the substrate 1. 应用了焊剂3的凸点6着陆在电极2上,且使用预定压负载来压制。 The application of solder bumps 3 of 6 landing on the electrode 2, and using a predetermined pressure load to suppress. 因此,对于多个凸点6,即使下端位于平均高度的凸点6的高 Therefore, a plurality of bumps 6, even if the average height of the bumps located at the lower end of the high 6

9面,因为较高的凸点6沿高度方向被该压力略微压碎(crush)。 9 side, because the higher bump height direction 6 is the pressure a little crush (crush). 另一方面,即使当其他凸点6略微压碎使得整个电子元件4相应地降低,位于外部边缘的凸点6*的下端不接触电极2的表面。 On the other hand, even when the other bumps 6 slightly crushed so that the entire electronic component 4 is correspondingly reduced, located at the lower end of the outer edge of the bumps 6 * 2 does not contact the surface of the electrode. 因此,凸点6*处于凸点下表面和电极2之间存在间隙的状态下。 Thus, in the presence of bumps 6 * 2 under bump gap between surface and electrode state.

接下来,将解释熔化凸点6从而焊料连接到电极2的步骤。 Next, it will be explained thus melting the solder bumps 6 is connected to the electrode 2 steps. 如图1C所示载有电子元件的基板1递送到回流炉并加热。 1C, the substrate containing electronic components 1 delivered to the reflow oven and heated. 在如图2A所示的时刻,在下述状态下实施加热,即,在下端位于平均高度的中心附近的凸点6内,其下端保持与电极2接触,且在位于外部边缘的凸点6*内,焊剂3夹置于其下端和电极2之间。 At the time shown in Figure 2A, the embodiment in a state under heating, i.e., at the lower end 6 located near the center of the average height of the bumps, the lower end thereof kept in contact with the electrode 2, and is located at the outer edge of the bump 6 * inside, the flux 3 sandwiched between two electrodes placed in its lower end.

通过该加热,凸点6、 6*均焊料连接到电极2。 By this heating, the bumps 6, 6 * 2 are solder connected to the electrode. 焊料在此时的行为视该凸点下端是否接触电极2而不同。 At this time, as the behavior of the solder bumps the lower end of the contact electrode 2 is different. 具体而言,从图2B看出,在下端接触电极2的凸点6内,当通过加热而熔化时,熔化状态下的焊料6a迅速沿具有良好焊料润湿性的材料的电极2表面顺利地延展,使得元件电极4b通过电极2和焊料6a耦合。 Specifically, seen from Figure 2B, the lower end of the contact electrode bumps 6 2 when melted by heating, the molten state of the solder 6a rapidly along with good solder wettability of the electrode material 2 surface smooth extension, so that the coupling element electrodes 4b and 6a through the electrodes 2 and the solder. 此时,凸点6表面上的氧化膜通过包含在焊剂3内的活化剂而被移除。 At this time, the oxide film on the surface of the bumps 6 by solder 3 contained in the activator is removed.

另一方面,在焊剂3存在于凸点6*本身与电极2之间的间隙内的凸点6*中,元件电极4b和电极2通过图4A至4C所示工艺通过焊料6a相互耦合。 On the other hand, in the solder bumps 3 exists between itself and the electrode 6 * 2 * gap bumps 6, the element electrode 4b and the electrode 2 by the process of FIG. 4A to 4C shown coupled to each other via a solder 6a. 图4A示出了在回流工艺中开始加热时的状态。 Figure 4A shows a state in the reflow process began heating.

现在,夹置于凸点6*下端和电极2表面2a之间的焊剂3内的金属粉末8仍混合在焊剂3内,即,处于如图5A所示的该片状核心部分8a浮皮表面部分8b覆盖的状态。 Now, interposed bumps 6 * 2 surface 2a of the metal powder flux between the lower end of the inner electrode 3 and 8 are still mixed in the solder 3, namely, in the sheet portion of the core shown in Fig. 8a floating skin surface portion 5A 8b covering state. 由于许多金属粉末8以随机的姿势存在于焊剂3内,很可能形成耦合凸点6*下端和电极2表面2a的金属粉末8的桥接(见图4A 中箭头a所示的部分)。 Since many metal powder 8 in a random position in the presence of a flux 3, it is likely to form a bridge coupling bump electrode 6 and the lower end of the metal powder * 2 8 surface 2a (see Fig portion in the arrow a in Fig. 4A).

现在,"桥接,,是指金属粉末8呈现连续串联相互毗邻的状态。"毗邻的状态"是指这样的状态,即,多个金属粉末8存在特定间隔,使得当润湿覆盖特定金属粉末8表面的流动状态的焊料通过其表面张力形成特定厚度时, 焊料厚度的表面接触邻近的其他金属粉末8。 Now, "bridging ,, refers metal powder 8 presents a continuous series of mutually adjacent state." Next state "means a state, i.e., the presence of a plurality of metal powder 8 specific intervals, such as wetting covering particular metal powder 8 solder formed on the surface of the flowable state by the surface tension of a specific thickness, the thickness of the contact surface of the solder adjacent the other metal powder 8.

具体而言,由于大量金属粉末S连续地处于这种邻近状态,在该串联的金属粉末的一侧上接触该金属粉末8的焊料被润湿并延展从而包覆包含具有良好焊料润湿性的金属的该金属粉末8表面,因此连续地接触毗邻的金属粉末8。 Specifically, since a lot of metal powder S continuously in this neighboring state, on one side of the metal powder series solder contacts the metal powder 8 is wetted and stretched thereby coating comprises a good solder wettability The metal surface 8 of the metal powder, thus continuously contacting adjacent metal powder 8. 通过这种传播的该焊料流连续地形成,直到该串联金属粉末8的另一侧。 This spread is continuously formed by the solder flow until the series the other side of the metal powder 8. 因此,从图4B看,该串联的金属粉末8作为耦合凸点6*下端和电极2 表面2a的桥接,使得焊料流动。 Therefore, from Fig. 4B, the metal powder 8 in the series as the coupling and the lower electrode bumps 6 * 2 surface 2a of the bridge, so that the solder flows.

这种情况下,由于构成金属粉末8的表面部分8b是由熔点高于通常采用的焊料的液相温度的贵金属例如金或银制成,即使力口热到高于焊料液相温度的温度,表面部分8b肯定仍处于固态。 In this case, since the metal powder constituting the surface portion 8b 8 it is usually higher than a melting point of the solder liquidus temperature of a noble metal such as gold or silver formed, even if force is heated to above the mouth of the liquidus temperature of the solder temperature, surface portion 8b is certainly still in the solid state. 具体而言,使用在焊剂中包含焊料粒子的乳脂状焊料的焊料连接方法中,乳脂状焊料中的焊料粒子由于在回流中加热而同时熔化,4吏得桥接间隙内的熔化焊料的功能无法获得。 Specifically solder connection method using solder containing creamy solder particles in the flux, the creamy solder by heating the solder particles while in reflux melted officials have bridged the gap 4 within the molten solder function can not be obtained . 另一方面,在本实施例的焊剂3中,金属粉末确实可以实施上述桥接功能。 On the other hand, the flux in the present embodiment 3, the above-described embodiment of the metal powder can indeed bridging functions.

焊剂3中采用的金属粉末8使用例如金或银的昂贵的贵金属作为覆盖廉价的核心部分8a表面的表面部分8b„为此,与常规包含金属粉末的焊剂中实际情况那样使用昂贵的贵金属作为粉末主体的方法相比,可以实现很大的成本减小。附带地,尽管已经提出了由合金制成的焊料(例如,Sn-Ag系列焊料),该合金包含可选用于核心部分8a的金属物质和银,但是从由金属粉末8获得的操作优点的角度而言,这种焊料应与本实施例的金属粉末8有着明确的区别。 3 flux used in a solder metal powder 8 using, for example gold or silver expensive noble metal as a core covering portion 8a inexpensive surface portion 8b "for this surface, comprising a metal powder with conventional actual situation as the use of expensive noble metal as a powder The method as compared to the body, can greatly reduce the cost. Incidentally, although has been proposed by the solder alloy (e.g., Sn-Ag system solder), metal material comprising the alloy used for the core portion 8a optional and silver, but from a metal powder 8 operating advantages gained perspective, this solder metal powder should present a clear example of the difference between 8 implementation.

现在,通过使用藉由处理上述金属获得的片状的金属粉末8,通过纵向方向沿间隙桥接方向取向的姿势的金属粉末8可以容易地形成桥接。 Now, by using the metal sheet by processing the obtained metal powder 8, the metal powder through a gap along the longitudinal direction of the bridging direction oriented posture bridge 8 can be easily formed. 因此, 可以由低百分比含量来有效地形成桥接。 Therefore, a low percentage content to effectively form a bridge. 一旦焊料6a通过该桥接到达电极表面2a,流动状态的焊料6a沿具有良好焊料润湿性的电极表面2a润湿延展。 Once the bridge by the solder 6a reaches the electrode surface 2a, 6a along the fluid state of the solder has good solder wettability of the electrode surface 2a wetting extension. 由于焊料6a的润湿延展,电极表面2a附近的焊剂3被推开,使得同样在其本身与电极2之间初始具有间隙的凸点6*内,元件电极4b通过焊料6a与电才及2完全耦合。 Since the extension wetting solder 6a, 2a near the surface of the solder electrode 3 is opened, so that the same bumps between itself and the electrode 2 with a gap of 6 * initial inner element electrodes 4b and 6a by a solder electrical and only 2 fully coupled.

同样在这种情况下,连接性通过焊剂3内包含的活化剂而改善。 Also in this case, connectivity through 3 solder activator contained therein is improved. 然而, 由于上述桥接形成效应,即使在凸点表面上的氧化膜仅部分移除的位置,焊剂3内包含的活化剂无需具有强的活化作用。 However, since the formation of the bridging effect, even if the position of the oxide film on the bump surface is only partially removed, the activator included in flux within 3 without having a strong activation. 换言之,添加金属粉末8使得可以采用具有弱的活化作用的低活性焊剂。 In other words, adding metal powder 8 allows the use of low activity flux with weak activation of. 因此,即^f吏在焊料连接之后该焊剂3仍保留,由该活化成分引起的电极2腐蚀程度是^[氐的。 Therefore, the officials of the flux 3 ^ f remains after solder connection, two electrode made of the degree of corrosion is caused by the activation of components ^ [Di's. 因此,协同下述由于金属粉末8特性引起的改善绝缘的效应,同样地在焊料连接之后不实施用于移除焊剂的清洗的无清洗技术中,可以保证充分的可靠性。 Thus, the effect of improving the insulation of the metal powder 8 synergistic following characteristics caused in the same manner after the solder connection does not implement for removing flux cleaning without cleaning techniques, can ensure sufficient reliability.

在上述回流工艺中,在如图5A所示的金属粉末8块中,通过继续加热, 如图5B所示,表面部分8b通过扩散逐渐吸收到核心部分8a内。 In the reflow process, as shown in FIG. 5A metal powder 8 by continued heating, shown in Figure 5B, the surface portion 8b is gradually absorbed by diffusion into the core portion 8a. 才艮据核心 It was Gen Core

ii部分8a的金属物质和加热温度,存在两种情况,即,表面部分8b通过液相扩散到核心部分8a内,以及表面部分8b通过固相扩散到核心部分8a内。 ii metal material and the heating temperature of the portion 8a, there are two cases, i.e., the surface portion 8b by liquid phase diffusion into the core portion 8a, 8b and the surface portion by solid phase diffusion into the core portion 8a. 在两种情况下,表面部分8b均逐渐吸收到核心部分8a内。 In both cases, surface portions 8b are gradually absorbed into the core portion 8a.

由于金属粉末8加热到高于构成核心部分8a的金属的熔点,通过固相溶解吸收表面部分8b的核心部分8a被熔化,且如此熔化的核心部分8a通过表面张力而浓缩。 Since the metal powder 8 is heated to the melting point higher than the metal constituting the core portion 8a, by dissolving the solid phase portion 8b of the absorbent core surface portion 8a is melted, and the melted core portion 8a so concentrated by surface tension. 该核心部分8a随后冷却和固化,这导致具有基本上球形的金属粒子18,如图5C所示。 The core portion 8a is then cooled and solidified, which results in a substantially spherical metal particles having a 18, shown in Figure 5C. 即,将表面部分8b通过固相溶解吸收到核心部分8a内,在回流工艺时通过加热可以将包含例如银的高熔点贵金属作为表面部分8b的金属粉末8形状改变为金属粒子18。 That is, the surface of the solid phase portion 8b by dissolving into the absorbent core portion 8a, by heating during the reflow process can be included as a noble metal such as silver, high melting point metal powder 8 surface portion 8b of the shape change of the metal particles 18. 通过暴露表面部分8b被完全吸收的核心部分8a的表面以及上述形状改变,由于加热和氧化该核心部分8a所致的氧化膜形成于金属粒子18表面上。 Through the exposed surface and said surface portion 8b is completely absorbed by the change in shape of the core portion 8a, and oxidation due to heating of the core due to the oxide film portion 8a is formed on the surface of the metal particles 18. 氧化膜8d提供了如下所述的在焊料连接之后改善绝缘的效应。 8d is provided in the oxide film after the insulating effect of improving the solder connection as described below.

图4C示出了在回流工艺时预定加热周期已经完成之后,通过冷却电子元件4和基板1使焊料6a和金属粒子18固化的状态。 4C shows a reflow process at a predetermined heating cycle has been completed, the electronic cooling element 4 and the substrate 1 and the solder metal particles 18 6a cured state. 通过固化焊料6a,形成了通过焊接来连接元件电极4b和电极2的焊料部分16。 By curing the solder 6a, the formation of the solder connecting portion 16 by welding element electrode 4b and the electrode 2. 在焊料部分16 的电极表面2a附近,在焊接工艺时吸收在焊料内的金属粉末8处于合金状态或固溶状态。 In the vicinity of the electrode surface of the solder portion 16 2a, in the welding process absorbed in the solder alloy metal powder 8 is a state or solution state. 在电极表面2a上及电极2周围,溶剂成分从焊剂3蒸发后的残余物(树脂成分和活化剂)3a与通过熔化和固化未被吸收到焊料部分16内的金属粉末8而产生的基本上球形金属粒子18 —起保留下来。 On the surface of the electrode 2a and the electrode 2 around the components from the solvent evaporated and the residue was 3 after the flux (resin component and activator) 3a and by melting and solidifying the metal powder is not absorbed into the solder portion 16 is substantially generated 8 spherical metal particles 18 - from preserved.

图2C示出了将电子元件4焊接在基板1上已经完成的状态,因为对所有元件电极4b和电极2形成了分別耦合元件电极4b和电极2的焊料部分16。 Figure 2C shows a soldered electronic component 4 on the substrate 1 has been completed state, because all elements electrode 4b and the electrode 2 are formed coupling element electrode and the solder portions 16 4b electrode 2. 由此制造如图6所示的电子元件的焊接结构。 Whereby the welded structure of the electronic component 6 shown in FIG manufacture. 从图6看出,元件电极4b和电极2通过焊料部分16连接,且在电极2周围,部分覆盖焊料部分16的下部并延伸到基板1表面的焊剂残余物3a保持处于沉积状态。 It is seen from Figure 6, element electrodes 4b and the electrode 2 are connected by a solder section 16, and 2 around the electrode, partially covering the lower part of the solder portion 16 and extending to a surface of the substrate flux residue remains in the deposition state 3a. 在焊剂残余物3a中,由于在回流工艺时未接触熔化焊料6a且未被吸收到焊料部分16内而仍保留的金属粒子18被分散。 In the flux residue 3a, since when not in contact with the molten solder reflow process 6a and has not been absorbed into the solder portion 16 while remaining metal particles 18 are dispersed.

筒而言之,电子元件的焊接结构呈这样的配置,其具有分别将电子元件4的元件电极4b连接到电极2的焊料部分16以及残留在焊料部分16及基板1表面上的焊剂残余物3a,其中不接触熔化焊料6a的金属粉末8被熔化以形成基本上球形,且分别在表面上具有氧化膜8d的金属粒子18包含在焊剂残余物3a内。 Cylinder speaking, the electronic component soldering structure was such a configuration, the electronic component having a component electrode, respectively, 4b of the solder portion 16 is connected to the electrode 2, and a portion of the solder remaining on the surface of the substrate 16 and the flux residue 3a , which does not contact the molten solder 6a of the metal powder 8 is melted to form a substantially spherical shape, and on the surface of metal particles having an oxide film 8d respectively 18 contained in the flux residue within 3a. 这种焊接结构可以提供保证电极之间的绝缘的下述出色效应。 This welding structure may ensure that the insulation provided by the following excellent effects between the electrodes. 在焊料连接步骤之后不实施用于移除焊剂的清洗的无清洗方法中,焊剂 In step after the solder connection does not implement without cleaning method for cleaning to remove flux, the flux

残余物3a原样地保留在电极2周围。 The residue was retained as 2 3a around the electrode. 当例如金或银的金属作为将被混合到焊剂内的金属粉末时,根据该残余物的数量,可能发生迁移,这电腐蚀电极之间的区域,由此使其间的绝缘恶化。 When a metal such as gold or silver as the metal powder to be mixed into the flux within the time, according to the number of this residue, may migrate happen, area this galvanic corrosion between the electrodes, thereby making between insulation deterioration. 因此,传统上,从保证绝缘的角度考虑,需要将待混合的金属粉末限制在低的含量百分比。 Therefore, conventionally, to ensure insulation from the viewpoint of the need to limit the metal powder to be mixed in a low percentage content. 结果出现如下情形, 即,无法充分实现改善在回流工艺中引导熔化焊料的焊料润湿性的效应。 The results appear the following situations that can not be fully realized improvement guide the molten solder during the reflow process the solder wettability effects.

另一方面,使用具有上述成分的金属粉末8,即使在该焊料连接步骤已经完成之后大量金属粉末8保留电极2周围,该金属粉末8在回流时通过加热被熔化而变为基本上球形的金属粒子18。 On the other hand, use of metal powder having the above-described components 8, even after the solder bonding step has been completed to retain a large number of metal powder 8 around the electrode 2, when the metal powder 8 is melted by heating at reflux becomes substantially spherical metal particles 18. 因此,产生粒子相互接触而耦合的状态的可能性非常低。 Thus the possibility of generating particles contact with each other and the coupling state of very low. 此外,结合金属粒子18表面覆盖有电学稳定的氧化膜8d的事实,可以有效地防止迁移的发生,由此保证良好的绝缘。 In addition, the surface-bound metal particles 18 covered with the electrical stability of the fact that the oxide film 8d, migration can be effectively prevented from occurring, thereby ensuring good insulation. '因此, 通过使用具有上述成分的金属粉末8使得足以保证焊剂中的焊料润湿性的数量的金属粉末被混合,则焊料连接性可得到改善且焊料连接之后的绝缘也可以得到保证,由此改善安装的可靠性。 'Therefore, by using a metal powder having the above-described components 8 such that is sufficient to ensure the wettability of solder flux amount of metal powder are mixed, the connection between the solder and improving solder joint can be obtained after the insulation may be ensured, whereby improve the reliability of the installation.

换言之,通过使用具有上述成分的金属粉末S,可以实现具有出色的焊料连接性和绝缘的无清洗类型的焊剂3。 In other words, by using a metal powder S having the above-described components, can be achieved without having excellent cleaning type flux and solder connections insulation 3. 具体而言,对于安装目标为具有由硬度高且难以压碎的无铅垾料形成的凸点的电子元件的情形,以及在由于电子元件的翘曲和凸点尺寸变化引起在凸点和基板的电路电极之间存在间隙的情形,可以有效地防止凸点通常未焊接在电路电极上的不良安装的发生。 Specifically, for the case of mounting the target electronic component having bumps crushed by the high hardness and difficult to form lead-free 垾 material, as well as due to the warpage and bumps caused by dimensional changes in the electronic component and the substrate bumps a gap exists between the case of circuit electrodes, can effectively prevent the occurrence of the bump is usually not soldered to the circuit electrode poor installation. 此外,对于采用在焊接之后不实施用于移除焊剂的清洗的无清洗方法中,同样可以保证令人满意的绝缘。 In addition, for use in welding not performed after the cleaning method for removing the flux without washing, the same can guarantee satisfactory insulation.

此外,在上述实施例中,采用了在回流之后不实施用于移除焊剂的清洗的无清洗方法。 Further, in the above embodiment, the cleaning method using no without reflux after the embodiment for removing flux cleaning. 然而,当需要更高的可靠性时,通过清洗水来清洗固化呈球形的金属粒子18以及该焊剂残余物3a,从而将其从基板1移除。 However, when the need for higher reliability, the washing water for cleaning by curing spherical metal particles 18 and the flux residue 3a, so as to remove it from the substrate 1. 在该清洗步骤中,由于残留的金属粉末以可以容易移除的金属粒子18的形式存在于焊剂残余物3a中,因此通过简单的清洗方法可以保证良好的清洗质量。 In the cleaning step, since the metal particles in the form of residual metal powder 18 can be easily removed to be present in the flux residue 3a, and therefore by a simple cleaning method can ensure good cleaning quality.

用于焊接电子元件的上述方法是采用如下配置,其中焊料凸点6与电极2对准,具有上述成分的焊剂3夹置于焊料凸点6和电极2之间,电子元件4和基板1被加热以熔化焊料凸点6,熔化焊料被润湿并沿金属粉末8表面延展到达电极2,加热进一步继续使得不接触熔化焊料的残余的金属粉末8 熔化成基本上球形形状,且随后基板1和电子元件4:f皮冷却以固化该熔化的 The above-described method for soldering an electronic component is configured as follows, in which the solder bumps 6 is aligned with the electrode 2, the above-described composition having flux 2 3 interposed between the solder bump 6 and the electrode, the electronic element 4 and the substrate 1 is heating to melt the solder bumps 6, the molten solder is wetted and the surface of the metal powder 8 extending along the electrode 2 reaches the heating is further continued so that the molten solder does not contact the residual melted metal powder 8 substantially spherical shape, and then the substrate 1, and Electronic component 4: f the skin is cooled to solidify the melted

13金属粉末8和焊料。 13 metal powder 8 and solder.

在上述实施例中,在应用焊剂3的步骤中,焊剂3复制在凸点6上。 In the above example, in the application of solder step 3, the solder bumps 6 on 3 replicate. 然而,可以采用其他方法。 However, other methods may be employed. 例如,从图7A看出,焊剂3通过配给器(dispenser) 9喷射而供应到电极2。 For example, it is seen from Figure 7A, the flux through the dispenser 3 (dispenser) 9 jet supplied to the electrodes 2. 此外,从图7B看出,使用复制引脚IO,焊剂3可以通过复制而供应到电极2。 Furthermore, it is seen from Figure 7B, using copy pin IO, solder 3 may be supplied to the electrodes 2 by copying.

此外,从图7C看出,通过丝网印刷,焊剂3可以印刷在电极2上。 Furthermore, seen from Figure 7C, by screen printing, the flux 3 may be printed on the electrode 2. 具体而言,具有与电极2相对应的掩模孔lla的掩模板11安装在基板1上, 且通过挤压器12填充在图案孔lla内的焊剂3被印刷在电极2的表面上。 Specifically, with the 2 corresponding mask hole electrode lla reticle 11 is mounted on the substrate 1, and by 12 extruder solder filling hole in the pattern lla 3 is printed on the surface of the electrode 2.

实施例2 Example 2

图8为本发明第二实施例的电子元件的.焊接结构的剖面图。 . 8 is a sectional view of an electronic device according to the second embodiment of FIG welded structure. 在第二实施例中,对于用于增强凸点6和电极2之间的焊料连接性的焊料连接辅助,在与第一实施例相同的电子元件4焊接到基板1时采用具有活化功能的热固性树脂来替代焊剂3。 In the second embodiment, the electrode for enhancing the solder bump 6 and solder connection of the connection between the two auxiliary, with the first embodiment of the electronic component soldered to the substrate 4 having the activation functions thermosetting 1:00 resin flux instead of 3.

从图8看出,与第一实施例相同,元件电极4b和电极2分别通过焊料部分16连接。 It is seen from FIG. 8, the same as the first embodiment, the element electrode 4b and the electrode 2 are connected through the solder portion 16. 在电极2周围形成树脂部分13,该树脂部分13分别具有部分覆盖焊料部分16下部且延展到基板1表面的形状。 In the resin portion 2 is formed around the electrode 13, the resin portion 13 having a lower portion, respectively covering the solder portion 16 and extending to the shape of a surface of the substrate. 当用于焊料连接辅助的热固性树脂在回流工艺中通过加热被热硬化时形成该树脂部分13,且该树脂部分13具有强化焊料部分16和电极2之间的连接部分的功能。 The resin portion 13 is formed when the thermosetting resin is used for the solder joint during the reflow process auxiliary is thermally cured by heating, and the reinforcing resin portion 13 having the solder portions 16 and the electrode connecting portion 2 between the functions. 在树脂部分13中,由于在回流工艺中未接触熔化的焊料6a且未被吸收到焊料部分16 内而残留的金属粒子18被M。 In resin portion 13, since the process is not in contact with the molten reflux solder 6a and has not been absorbed into the solder portion 16 and the remaining metal particles 18 is M.

电子元件的焊接结构是采用这种配置,其具有分别用于连接电子元件4 的元件电极4b和电极2的焊料部分16以及分别用于强化焊料部分16和电极2之间的连接部分的树脂部分13,其中未接触熔化焊料的金属粉末8熔化成为基本上球形,且由此形成的在表面上分别具有氧化膜"d的金属粒子18 包含在该树脂部分13内。通过这种焊接结构,类似于第一实施例,可以保证电极之间的绝缘且可以有效地强化焊料部分16和电极2之间的连接部分, 由此进一步改善安装可靠性。 Electronic components are welded structure With this arrangement, a solder having 16 4b and the electrode portion and a resin portion 2 of the connecting portion 2 between the respective portions 16 for reinforcing the solder and the electrode elements are electrically connected to the electronic component 4 13, which does not contact the molten solder to melt metal powder 8 becomes substantially spherical, and thus formed on the surface of an oxide film having respective "d metal particles 18 contained in the resin portion 13. With this welded structure, similar in the first embodiment, and it can ensure insulation between the electrodes can be effectively strengthen the connection portion between the solder portion 2 and the electrode 16, thereby further improving the mounting reliability.

通过使用具有活化功能的热固性树脂替代第一实施例的电子元件焊接方法中的焊剂3(见图IA至1C和2A至2C),可以实现这种焊接结构。 The method of soldering an electronic component using a thermosetting resin by substitution with the activation function of the first embodiment of the solder 3 (see FIG. IA to 1C and 2A to 2C), this welded structure can be achieved. 即, 在第二实施例的电子元件焊接方法中,采用这种配置,其中电子元件4的凸点6与基板1的电极2对准,包含与第一实施例相同的金属粉末8的热固性树脂夹置于凸点6和电极2之间,电子元件4和基板1随后被加热以熔化凸点6,且由此熔化的焊料被润湿并沿金属粉末8表面延展到达电极2。 That is, in the electronic component soldering method of the second embodiment, with this configuration, where the bumps of the electronic element 4 and the electrode 6 second alignment substrate 1, the first embodiment comprises the same metal powder in a thermosetting resin 8 interposed between the bump 6 and the electrode 2, the electronic component 4 and the substrate 1 is then heated to melt the bump 6, and thereby the molten solder is wetted and the surface of the metal powder 8 extending along the electrode 2 reaches.

该加热进一步继续使得不接触熔化焊料的残余的金属粉末8熔化成基本上球形形状,由此促进该热固性树脂的硬化反应。 The heating is further continued so that the molten solder does not contact the residual melted metal powder 8 substantially spherical shape, thereby promoting the curing reaction of the thermosetting resin. 随后,基板l和电子元件4被冷却以固化该熔化的金属粉末8和焊料6a。 Subsequently, the substrate 4 l and electronic components are cooled to solidify the molten metal powder 8 and solder 6a. 在该焊接方法中,与第一实施例相同,可以组合实现焊料连接性的改善和绝缘的保i正。 In this welding method, the same as in the first embodiment, may be combined to achieve improved solder connection of the protection and insulation i n.

产业适用性 Industrial Applicability

本发明的电子元件焊接方法和电子元件焊接结构提供了组合焊料连接性的改善和绝缘的保证的效应。 Electronic components and electronic components welding welding structure of the present invention provides a combination of improved solder joint and insulating effect guaranteed. 本发明的电子元件焊接方法和电子元件焊接结构可用于趋于在凸点和电极之间产生间隙的焊接,例如用于堆叠封装元件来制造半导体装置的焊接。 Electronic components and electronic components welding welding structure of the present invention may be used between the bumps tend to weld and the electrode gap, for example in the manufacture of welded elements stacked packages semiconductor devices.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US2004/0177997 Title not available
US567254219 Mar 199630 Sep 1997Hewlett Packard CompanyMethod of making solder balls by contained paste deposition
WO2005/072906A1 Title not available
Classifications
International ClassificationH05K3/34, B23K35/02
Cooperative ClassificationH01L2224/05573, Y10T428/12049, H05K2201/0248, H05K2201/0245, H05K2203/0435, H05K2201/0218, H05K2201/0215, H05K3/3436, H05K3/3484, H05K3/3489, H05K2201/10977, H01L2224/16225
European ClassificationH05K3/34G, H05K3/34F6B
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