CN100585799C - Liquid processing apparatus - Google Patents

Liquid processing apparatus Download PDF

Info

Publication number
CN100585799C
CN100585799C CN200710110337A CN200710110337A CN100585799C CN 100585799 C CN100585799 C CN 100585799C CN 200710110337 A CN200710110337 A CN 200710110337A CN 200710110337 A CN200710110337 A CN 200710110337A CN 100585799 C CN100585799 C CN 100585799C
Authority
CN
China
Prior art keywords
mentioned
cup
exhaust
discharge opeing
treatment fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200710110337A
Other languages
Chinese (zh)
Other versions
CN101090063A (en
Inventor
伊藤规宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101090063A publication Critical patent/CN101090063A/en
Application granted granted Critical
Publication of CN100585799C publication Critical patent/CN100585799C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

A liquid processing apparatus includes a substrate holding member (2) configured to rotate along with a substrate (W) held thereon in a horizontal state; a rotary cup (4) configured to surround the substrate held on the substrate holding member, to rotate along with the substrate, and to receive the process liquid thrown off from the substrate; a rotation mechanism (3) configured to integrally rotate the rotary cup and the substrate holding member; and a liquid supply mechanism (5) configured to supply a process liquid onto the substrate. The apparatus further includes an annular drain cup (51) and an annular exhaust cup (52) with an exhaust port (70) connected thereto to discharge a collected gas component. A gas-flow adjusting mechanism (78, 97, 99a) is disposed between the exhaust cup and the exhaust port and configured to adjust a gas flow of the gas component to flow toward the exhaust port from essentially all around within the exhaust cup.

Description

Liquid handling device
Technical field
The present invention relates to substrates such as for example semiconductor wafer are carried out the liquid handling device of set liquid handling.
Background technology
In the manufacturing process of production process of semiconductor device and flat-panel monitor (FPD), the technology of liquid handling is carried out in more employing to supplying with treatment fluid as the semiconductor wafer of processed substrate or glass substrate.As such technology, for example can enumerate clean, the photoresist liquid in the photo-mask process and the coating processing of developer solution that to remove attached to particulate on the substrate and dirt etc. etc.
As such liquid handling device, known have substrates such as semiconductor wafer are remained on the rotation chuck, the front of wafer or positive and negative are supplied with treatment fluid carry out the front of wafer or the device that positive and negative is handled making under the state of substrate rotation.
In this device, usually treatment fluid is supplied to wafer the center, make treatment fluid form liquid film, treatment fluid is broken away from by making the substrate rotation to foreign side's diffusion.And, be provided with around the parts such as cup in the outside of wafer, guided downwards getting rid of the treatment fluid that takes off to the foreign side of substrate, will be got rid of the treatment fluid that takes off from wafer and promptly be discharged.But, under the situation that is provided with cup etc. like this, might disperse, arrive substrate and cause defectives such as watermark or particulate with the form of mist by treatment fluid.
As the technology that can prevent such problem, open in the flat 8-1064 communique (patent documentation 1) the spy, disclose with the mode of the rotation support mechanism one rotation that under the state of horizontal supporting substrate, makes substrate rotation, setting is accepted the treatment fluid of the treatment fluid that disperses to peripheral direction from substrate and is accepted parts, accepts treatment fluid and treatment fluid is led back to the technology of receipts to foreign side.In this patent documentation 1, treatment fluid accept parts from substrate-side begin to have horizontal hood portion successively, with the inclined lead part of treatment fluid below guiding laterally, with horizontal guide portion and the vertically upright wall portion that establish of treatment fluid to the guiding of horizontal foreign side.According to this structure, treatment fluid is driven in the narrow and small scope prevents that mist from adhering to once more to substrate, and accept the leakage fluid dram in the bight of parts and discharge to horizontal foreign side via being located at treatment fluid.Treatment fluid is again via accepting the groove that extends to foreign side the inside of the distance piece in the parts outsides and discharge being disposed at treatment fluid.
But, in patent documentation 1, treatment fluid is driven in the narrow range of substrate foreign side because the treatment fluid that rotates with substrate is accepted parts, so the distance piece part in the substrate outside is bigger, the footprints of device is bigger.In addition, exhaust has to carry out with discharge opeing, need be used for mechanism that exhaust, discharge opeing are separated in the downstream.For the mechanism that exhaust, discharge opeing are separated is not set exhaust is separated with discharge opeing, can consider to be provided with respectively exhaust cup and discharge opeing cup, but the footprints of device is bigger on the contrary under situation about merely being provided with respectively.
Accepting from treatment fluid under the situation of on every side composition after the treatment fluid gasification being discharged of parts, requirement is undertaken on this gas componant in the form of a ring the exhaust cup, from the exhaust cup, be arranged on 1 or the exhaust outlet of many places do not have and spread all over complete cycle exhaust equably with silting up.But, in above-mentioned communique, about such exhaust without any record.
On the other hand,, use resinous ring-type discharge opeing cup usually, fix by suitable mechanism as the discharge opeing cup that is used for accepting discharge opeing.Accept parts from the treatment fluid of rotation treatment fluid is supplied with to such ring-type discharge opeing cup, but the treatment fluid of 80 ℃ ratio higher temperatures is also arranged in treatment fluid.If such treatment fluid flow in the discharge opeing cup, the thermal expansion significantly of then resinous discharge opeing cup.Therefore, according to the difference of mounting means, might take place to absorb thermal expansion and the situation that causes the discharge opeing cup to damage.
In addition, in the liquid handling device of the mode that under the state of horizontal supporting substrate, makes the substrate rotation as described above,, then can cause the damage of substrate etc. in rotation if the offset of substrate takes place.So, the rotation integratedly for substrate being fixed on reliably on the substrate maintaining part that rotatably keeps substrate is equipped with the outer rim of restricting substrate and (for example the spy opens 2002-368066 communique (patent documentation 2: Figure 15 etc.)) to its holding member that keeps (anchor clamps).
In patent documentation 2 described liquid handling devices, holding member is installed in many places highlightedly to the reverse side of substrate maintaining part, by the periphery of its face side supporting substrates.Under the situation that makes substrate maintaining part rotation,, can in the following side space of substrate maintaining part, produce air-flow owing to existence to the outstanding holding member in the below of substrate maintaining part with such holding member.If produced such air-flow, bring influence then can for exhaust mobile of substrate maintaining part below, hinder the discharge of mist, mist can be attached on the substrate surface and cause the defective of watermark and particulate etc.And then the air-flow that produces below the substrate maintaining part can be given the treatment fluid that is undertaken in the discharge opeing cup mobilely brings influence, is difficult to treatment fluid is guided efficiently to leakage fluid dram.
Summary of the invention
The purpose of this invention is to provide a kind of complete cycle that the separating mechanism of separation off gas and discharge opeing is set especially and can spreads all over exhaust cup liquid handling device of exhaust equably that do not need.
Even another object of the present invention provides a kind of liquid handling device that does not need to be provided with especially the separating mechanism of separation off gas and discharge opeing and the damage that also difficult generation thermal expansion brings under the situation of use high-temperature process liquid.
Another object of the present invention provides and a kind ofly can be reduced in as far as possible that level keeps substrate and the liquid handling device of the mobile influence that brings of air-flow supply and exhaust that the below of the substrate maintaining part of rotating produces and discharge opeing.
The 1st technical scheme of the present invention is a kind of liquid handling device, possesses: the substrate maintaining part, flatly keep substrate, and can rotate with substrate; The rotation cup, the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate; Rotating mechanism rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly; The treatment fluid feed mechanism is supplied with treatment fluid to substrate; The discharge opeing cup of ring-type around the arranged outside of above-mentioned rotation cup, is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup; The exhaust cup of ring-type holds above-mentioned discharge opeing cup and is provided with the concentric shape of above-mentioned discharge opeing cup ground, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into; Exhaust outlet is connected on the above-mentioned exhaust cup, discharges with the above-mentioned gas composition that will be taken in the above-mentioned exhaust cup; Gas flow modulation mechanism is folded between above-mentioned exhaust cup and the above-mentioned exhaust outlet, regulates air-flow, so that in fact the air-flow of above-mentioned gas composition flows towards above-mentioned exhaust outlet from complete cycle in above-mentioned exhaust cup.
In above-mentioned the 1st technical scheme, the said flow governor motion can possess the cushion space that is provided with and is connected the ring-type on the above-mentioned exhaust outlet in above-mentioned exhaust cup with the concentric shape of above-mentioned discharge opeing cup ground.Above-mentioned exhaust outlet can be configured in above-mentioned cushion space under at least 1 place.Above-mentioned cushion space can hollow out by the bottom with above-mentioned discharge opeing cup and form.
In addition, the said flow governor motion can possess the outside aeration resistance portion of ring-type, described outside aeration resistance portion is configured between above-mentioned discharge opeing cup and the above-mentioned exhaust cup, the upside exhaust of the above-mentioned exhaust cup of the upside that is positioned at the aforesaid substrate maintaining part is taken into mouthful in fact spread all over complete cycle and is communicated with above-mentioned cushion space, above-mentioned outside aeration resistance portion sets for, and the exhaust stream that is taken into from above-mentioned upside exhaust mouthful is applied set aeration resistance.In the case, can be corresponding to above-mentioned outside aeration resistance portion, the parts of configuration ring-type between above-mentioned discharge opeing cup and above-mentioned exhaust cup, above-mentioned outside aeration resistance portion constitutes by spreading all over a plurality of air vent holes that complete cycle is formed uniformly on the parts of above-mentioned ring-type.In addition, can between the lateral wall of the lateral wall of above-mentioned discharge opeing cup and above-mentioned exhaust cup, form outside annulus, above-mentioned upside exhaust is taken into mouthful with above-mentioned outside aeration resistance portion is connected.
And then, the said flow governor motion can possess the inboard aeration resistance portion of ring-type, described inboard aeration resistance portion is configured between above-mentioned discharge opeing cup and the above-mentioned exhaust cup, the downside exhaust of the above-mentioned exhaust cup of the downside that is positioned at the aforesaid substrate maintaining part is taken into mouthful in fact spread all over complete cycle ground and is communicated with above-mentioned cushion space, above-mentioned inboard aeration resistance portion sets for, and the exhaust stream that is taken into from above-mentioned downside exhaust mouthful is applied set aeration resistance.In the case, can be corresponding to above-mentioned inboard aeration resistance portion between above-mentioned discharge opeing cup and above-mentioned exhaust cup a plurality of distance pieces of configuration, above-mentioned inboard aeration resistance portion constitutes by spread all over a plurality of openings that complete cycle is formed uniformly between above-mentioned distance piece.Can between the madial wall of the madial wall of above-mentioned discharge opeing cup and above-mentioned exhaust cup, form the inboard annulus of ring-type, above-mentioned downside exhaust is taken into mouthful with above-mentioned inboard aeration resistance portion is connected.
In above-mentioned the 1st technical scheme, circumferential portion was fixed on the above-mentioned exhaust cup via fixed part in above-mentioned discharge opeing cup can make, and outer peripheral portion is in the unconfinement state on radial direction.In the case, said fixing portion can be connected the bottom of above-mentioned discharge opeing cup with the bottom of above-mentioned exhaust cup.Above-mentioned discharge opeing cup can have the liquid containing portion that holds treatment fluid, and said fixing portion is arranged on inboard, aforesaid liquid accommodation section with ring-type.Above-mentioned discharge opeing cup can its bottom than the cavern part of said fixing portion by having ring-type on the part of outer circumferential side, above-mentioned cavern part limits top from above-mentioned discharge opeing cup to the flexible cylindrical portion of having of said fixing portion.Said fixing portion can be along circumferentially having a plurality of screw thread fixed parts and a plurality of location division.The bottom of the above-mentioned outer peripheral portion of above-mentioned discharge opeing cup can be bearing on the bottom of above-mentioned exhaust cup slidably.
In above-mentioned the 1st technical scheme, the aforesaid substrate maintaining part can have to the outstanding annex of reverse side, and above-mentioned discharge opeing cup has the liquid containing portion that holds treatment fluid, disposes the barrier rib of the air-flow that obstruct forms by above-mentioned annex between above-mentioned annex and aforesaid liquid accommodation section.In the case, above-mentioned annex can constitute, and keeps substrate by the upper end.Above-mentioned barrier rib can surround above-mentioned annex and form cylindric below the aforesaid substrate maintaining part.Above-mentioned barrier rib can be formed on the above-mentioned discharge opeing cup.Can pass through above-mentioned barrier rib, in above-mentioned discharge opeing cup, in inboard, aforesaid liquid accommodation section, mark off the liquid carrier of the treatment fluid of accepting the reverse side that escapes to the aforesaid substrate maintaining part, the aforesaid liquid carrier is connected on the aforesaid liquid accommodation section via the hole that is formed on the above-mentioned barrier rib.
In addition, above-mentioned barrier rib can form towards the below from the reverse side of aforesaid substrate maintaining part.Between the rotating shaft and above-mentioned barrier rib of above-mentioned rotating mechanism, can dispose the next door of the axial gaseous environment of above-mentioned rotation of dividing aforesaid substrate maintaining part below and the gaseous environment on every side of above-mentioned discharge opeing cup.Can also possess the pressure regulating mechanism of adjusting by the pressure in the space of the above-mentioned rotation shaft side of above-mentioned next door division.Can also possess purge gas is imported to gas introduction part in the space of the above-mentioned rotation shaft side of being divided by above-mentioned next door.On the lower position of the above-mentioned annex between above-mentioned next door and the above-mentioned barrier rib, can dispose the 2nd barrier rib that said flow is intercepted.On the lower surface of aforesaid substrate maintaining part, can be formed with a plurality of convex shaped parts of the formation that suppresses the air-flow that above-mentioned annex causes with arcuation, with above-mentioned accessory configuration between this convex shaped part.
The 2nd technical scheme of the present invention is a kind of liquid handling device, possesses: the substrate maintaining part, flatly keep substrate, and can rotate with substrate; The rotation cup, the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate; Rotating mechanism rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly; The treatment fluid feed mechanism is supplied with treatment fluid to substrate; The discharge opeing cup of ring-type around the arranged outside of above-mentioned rotation cup, is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup; The exhaust cup of ring-type holds above-mentioned discharge opeing cup and is provided with the concentric shape of above-mentioned discharge opeing cup ground, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into and exhaust; The interior circumferential portion of above-mentioned discharge opeing cup is fixed on the above-mentioned exhaust cup via fixed part, and outer peripheral portion is in the unconfinement state on radial direction.
The 3rd technical scheme of the present invention is a kind of liquid handling device, possesses: the substrate maintaining part, flatly keep substrate, and can rotate with substrate; Rotating mechanism makes the rotation of aforesaid substrate maintaining part; The treatment fluid feed mechanism is supplied with treatment fluid to substrate; The discharge opeing cup of ring-type around the aforesaid substrate maintaining part, is accepted the treatment fluid and the discharge opeing that are discharged from; The aforesaid substrate maintaining part has to the outstanding annex of reverse side, and above-mentioned discharge opeing cup has the liquid containing portion that holds treatment fluid, between above-mentioned annex and aforesaid liquid accommodation section, disposes the barrier rib of the air-flow that obstruct forms by above-mentioned annex.
Description of drawings
Fig. 1 is the cutaway view of schematic configuration of the liquid handling device of expression the present invention the 1st execution mode.
Fig. 2 is that the liquid handling device with the present invention's the 1st execution mode partly cuts the approximate vertical view of expression.
Fig. 3 is the skeleton diagram of treatment fluid feed mechanism of the liquid handling device of presentation graphs 1.
Fig. 4 is the cutaway view of exhaust discharge opeing portion that amplifies the liquid handling device of presentation graphs 1.
Fig. 5 is used for the figure of installment state of the rotation cup of liquid handling device of key diagram 1 and guide member.
Fig. 6 is the vertical view of fixed part of the discharge opeing cup of expression the 1st liquid handling device.
Fig. 7 A~Fig. 7 D is the figure of processing action that is used for illustrating the liquid handling device of the present invention's the 1st execution mode.
Fig. 8 is the schematic diagram of exhaust pathway of exhaust cup of the liquid handling device of presentation graphs 1.
Fig. 9 is the cutaway view of schematic configuration of the liquid handling device of expression the present invention the 2nd execution mode.
Figure 10 is that the liquid handling device with the present invention's the 2nd execution mode partly cuts the approximate vertical view of expression.
Figure 11 is the cutaway view of exhaust discharge opeing portion that amplifies the liquid handling device of presentation graphs 9.
Figure 12 is used for the figure of installment state of the rotation cup of liquid handling device of key diagram 9 and guide member.
Figure 13 A~Figure 13 D is the figure of processing action that is used for illustrating the liquid handling device of the present invention's the 2nd execution mode.
Figure 14 is the cutaway view of schematic configuration of liquid handling device of the variation of expression the present invention the 2nd execution mode.
Figure 15 is the stereogram of structure that is illustrated in the lower surface of the swivel plate that uses in the variation of the 2nd execution mode.
Figure 16 be illustrated in the swivel plate that uses in the variation of the 2nd execution mode want portion's cutaway view.
Figure 17 is the figure of schematic configuration of liquid handling device of another variation of expression the present invention the 2nd execution mode.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.In addition, in the following description, the identical Reference numeral of inscape mark for having roughly the same function and structure only carries out the explanation of repetition under the situation of needs.Here, the situation in the liquid handling device that the present invention is applied to the positive and negative cleaning of carrying out semiconductor wafer (following simple note is made wafer) is described.
Fig. 1 is the cutaway view of schematic configuration of the liquid handling device of expression the present invention the 1st execution mode, Fig. 2 is its vertical view, Fig. 3 is the skeleton diagram of treatment fluid feed mechanism of the liquid handling device of presentation graphs 1, and Fig. 4 is the cutaway view of exhaust discharge opeing portion that amplifies the liquid handling device of presentation graphs 1.This liquid handling device 100 is assembled with many in not shown liquid processing system.Each liquid handling device 100 has pedestal 1, rotatably keep wafer maintaining part 2 as the wafer W of processed substrate, make the rotation motor 3 of these wafer maintaining part 2 rotations, around the rotation cup 4 that remains on the wafer W setting on the wafer maintaining part 2 and rotate with wafer maintaining part 2, the front of wafer W is supplied with the front treatment fluid of treatment fluid and supplied with mouth 5, the reverse side of wafer W is supplied with the reverse side treatment fluid of treatment fluid and supplied with mouth 6, exhaust discharge opeing portion 7 with the circumference that is located at rotation cup 4.In addition, be provided with to the top that reaches wafer W on every side of covering exhaust discharge opeing portion 7 housing 8.Be provided with the air-flow introduction part 9 that the air-flow from the blower fan filtering unit (FFU) of liquid processing system is imported via the introducing port 9a that is located at sidepiece on the top of housing 8, to remaining on the sinking of the wafer W supplying clean air on the wafer maintaining part 2.
Wafer maintaining part 2 has and horizontally disposedly is discoideus swivel plate 11 and is connected the central part of its reverse side and the rotating shaft cylindraceous 12 that extends downwards vertically.At the central part of swivel plate 11, be formed with the hole 11a of the circle that is communicated to the hole 12a in the rotating shaft 12.And, possess the reverse side treatment fluid supply with that the Lift Part 13 of mouth 6 is arranged to can lifting in hole 12a and hole 11a.On swivel plate 11, be provided with the holding member 14 of the outer rim that keeps wafer W, as shown in Figure 2, they equally spaced dispose 3.This holding member 14 flatly keeps wafer W under the state that wafer W is floated slightly from swivel plate 11.This holding member 14 has the maintaining part 14a of the end face that can keep wafer W, the 14b of dismounting portion that extends to the reverse side center position of swivel plate from maintaining part 14a and the rotating shaft 14c that maintaining part 14a is rotated in vertical plane, by by not shown pressure cylinder mechanism the terminal part of the 14b of dismounting portion being boosted upward, maintaining part 14a laterally rotates and removes the maintenance of wafer W.Holding member 14 is subjected to not shown spring members to the direction application of force that maintaining part 14a keeps wafer W, is the state by holding member 14 maintenance wafer W under the situation that does not make the pressure cylinder mechanism action.
Rotating shaft 12 can be rotated to support on the pedestal 1 via the parts of bearings 15 with two bearing 15a.Embedding on the bottom of rotating shaft 12 has belt wheel 16, is wound with driving-belt 17 on belt wheel 16.Driving-belt 17 also be wound on be installed on motor 3 the axle on belt wheel 18 on.And,, make rotating shaft 12 rotations via belt wheel 18, driving-belt 17 and belt wheel 16 by making motor 3 rotations.
The front treatment fluid is supplied with mouth 5 and is being installed under the state that remains on the mouth holding member 22 on the end of mouth arm 22a, supply with treatment fluid etc. from treatment fluid feed mechanism 85 described later by the stream that is located in the mouth arm 22a, treatment fluid is spued via being located at its inner mouth hole 5a.As the treatment fluid that spues, can enumerate rinsing liquids such as soup that wafer cleans usefulness, pure water etc.In addition, on mouth holding member 22, the dry solvent mouth 21 of the dry solvent that also being equipped with spues with IPA is representative is via being located at its inner mouth hole 21a dry solvents such as IPA that spue.
Also can find out from Fig. 2, it can be that rotate at the center with axle 23 by driving mechanism 81 that mouth arm 22a is arranged to, by mouth arm 22a is rotated, the front treatment fluid is supplied with mouth 5 can be positioned at top, wafer W center and the wafer cleaning positions of periphery top and the retreating position of wafer W foreign side.In addition, mouth arm 22a can move up and down under the effect of elevating mechanisms 82 such as pressure cylinder mechanism.
As shown in Figure 3, be provided with stream 83a in mouth arm 22a, the mouth hole 5a that the front treatment fluid is supplied with mouth 5 is attached on the end of stream 83a.In addition, on the other end of stream 83a, be connected with pipe arrangement 84a.On the other hand, also be provided with stream 83b in mouth arm 22a, the mouth hole 21a of dry solvent mouth 21 is attached at the end of stream 83b.In addition, on the other end of stream 83b, be connected with pipe arrangement 84b.And,, supply with set treatment fluid from treatment fluid feed mechanism 85 to pipe arrangement 84a, 84b.Treatment fluid feed mechanism 85 have supply for example as rare fluoric acid (DHF) of acid soup as the DHF supply source 86 of the soup that is used for carrying out clean, supply with ammonia/aqueous hydrogen peroxide solution (ア Application モ ニ ア as alkaline soup
Figure C20071011033700151
Water) (SC1) as the SC1 supply source 87 of the soup that is used for carrying out clean, supply with pure water (DIW) for example as the DIW supply source 88 of rinsing liquid, for example supply with IPA as the IPA supply source 95 of dry solvent. Extend pipe arrangement 89,90,91 from DHF supply source 86, SC1 supply source 87, DIW supply source 88, these pipe arrangements 89,90,91 are connected on the pipe arrangement 84a via open and close valve 92,93,94.Thereby, by controlled opening/ closing valve 92,93,94, can selectively ammonia/aqueous hydrogen peroxide solution (SC1), rare fluoric acid (DHF), pure water (DIW) be supplied to the front treatment fluid and supply with mouth 5.In the case, be connected the upstream side of pipe arrangement 84a from DIW supply source 88 extended pipe arrangements 91.On the other hand, on IPA supply source 95, directly be connected with the pipe arrangement 84b that extends from stream 83b, in pipe arrangement 84b, be provided with open and close valve 96.Thereby, by open and close valve 96 is opened, IPA can be supplied to dry solvent mouth 21.
The reverse side treatment fluid is supplied with the center that mouth 6 is located at Lift Part 13, and portion is formed with the mouth hole 6a that alongst extends within it.And, supply with set treatment fluid from the lower end of mouth hole 6a by not shown treatment fluid feed mechanism, this treatment fluid is spued on the reverse side of wafer W via mouth hole 6a.As the treatment fluid that spues, to supply with mouth 5 same with above-mentioned front treatment fluid, can enumerate rinsing liquids such as the soup that cleans usefulness, pure water etc.The treatment fluid feed mechanism that treatment fluid is supplied with mouth 6 supplies to the reverse side treatment fluid can similarly constitute with above-mentioned treatment fluid feed mechanism 85 except the feed system of IPA.The wafer supporting platform 24 that has supporting wafer W in the upper end of Lift Part 13.On the upper surface of wafer supporting platform 24, have and be used for 3 wafer supporting pins 25 (only illustrating two) of supporting wafer W.And the lower end of supplying with mouth 6 at the reverse side treatment fluid is connected with pressure cylinder mechanism 27 via link 26, by making Lift Part 13 liftings by this pressure cylinder mechanism 27, makes the wafer W lifting, carries out the loading and the unloading of wafer W.
Rotation cup 4 has from top, the end of swivel plate 11 circular hood portion 31 that oblique upper to the inside extends and the lateral wall portion 32 of the tubular that extends to vertical lower from the outer end of hood portion 31.And, shown in the enlarged drawing of Fig. 4, be formed with circular gap 33 between side wall portion 32 and the swivel plate 11 outside, will rotate the treatment fluid (mist) that disperses and guide downwards with swivel plate 11 and rotation cup 4 owing to wafer W from this gap 33.
Between hood portion 31 and swivel plate 11, with the position of the roughly the same height of wafer W on be folded with the guide member 35 that is tabular.As shown in Figure 5, between hood portion 31 and the guide member 35, between guide member 35 and the swivel plate 11, make a plurality of openings 36 that treatment fluid passes through and a plurality of distance members 38 and 39 of 37 along circumferentially disposing to be used for forming respectively.Hood portion 31, guide member 35, swivel plate 11 and the distance member between them 38,39 are fixed by screw element 40 screw threads.
Guide member 35 is arranged to, and the positive and negative of its positive and negative and wafer W is roughly continuous.And, in that wafer maintaining part 2 and rotation cup 4 are rotated with wafer W when the front treatment fluid is supplied with the central supply treatment fluid in 5 pairs of wafer W fronts of mouth, treatment fluid spreads on the front of wafer W under action of centrifugal force, is got rid of by the periphery from wafer W and takes off.Should be got rid of the treatment fluid that takes off from the front of wafer W and be discharged to foreign side from opening 36, be guided downwards by lateral wall portion 32 by the guiding of the front of the guide member 35 that roughly is provided with continuously.In addition, when equally treatment fluid is supplied with the central supply treatment fluid of reverse side of 6 pairs of wafer W of mouth from the negative in that wafer maintaining part 2 and rotation cup 4 are rotated with wafer W, treatment fluid spreads on the reverse side of wafer W under action of centrifugal force, is got rid of by the periphery from wafer W and takes off.Should be got rid of the reverse side guiding of the guide member 35 that the treatment fluid that takes off roughly is provided with continuously by the back side with wafer W and discharged to foreign side from the reverse side of wafer W, be guided downwards by lateral wall portion 32 from opening 37.At this moment, because the treatment fluid effect of arrival interval parts 38,39 and lateral wall portion 32 is had centrifugal force, return to the inside so stoped them to become mist.
In addition and since guide member 35 like this guiding from the wafer W front and reverse side get rid of the treatment fluid that takes off, so the treatment fluid that breaks away from from the periphery of wafer W is difficult for turbulent flowization, can make the treatment fluid mistization and it is guided outside rotating cup 4.In addition, as shown in Figure 2, on guide member 35, on position, be provided with notch part 41, to avoid chip holding component 14 corresponding to chip holding component 14.
In addition, swivel plate 11, rotation cup 4, distance member 38,39, screw element 40, guide member 35 etc. are formed by resins such as PEEK, PTFE, PVC, PFA, PVDF from the viewpoint of resistance to chemical reagents etc.
Exhaust discharge opeing portion 7 is mainly used to reclaim the gas and the liquid of discharging from the space that is centered on by swivel plate 11 and rotation cup 4, shown in the enlarged drawing of Fig. 4, possess the discharge opeing cup 51 in the form of a ring of accepting the treatment fluid of discharging from rotation cup 4 and be with the concentric ring-type of discharge opeing cup 51 to hold the exhaust cup 52 of discharge opeing cup 51.They are same with rotation cup 4 grades, and the viewpoint from resistance to chemical reagents etc. is formed by resins such as PEEK, PTFE, PVC, PFA, PVDF.
As Fig. 1 and shown in Figure 4, discharge opeing cup 51 has the tubular vertical wall 53 in the outside of approaching lateral wall portion 32 and vertically being arranged on rotation cup 4 and the following side 54 of extending towards the inboard from the bottom of vertical wall 53.On the interior week of following side 54, vertically be formed with madial wall 54a.The space of the ring-type that is limited by these vertical walls 53 and following side 54 becomes the treatment fluid accommodation section 56 that holds the treatment fluid of discharging from rotation cup 4.In addition, in the upper end of vertical wall 53, in order to prevent to fly out treatment fluid and be provided with the extension 53a that reaches the upper section that rotates cup 4 from discharge opeing cup 51.On the position corresponding to the outside of holding member 14 of treatment fluid accommodation section 56, have near extending to the lower surface of swivel plate 11 from following side 54, along the next door 55 that circumferentially is provided with of discharge opeing cup 51 with ring-type.And treatment fluid accommodation section 56 is separated into the main inner cup portion 56a that accepts from the gap 33 treatment fluids of discharging by this next door 55 and accepts the secondary inner cup portion 56b of the treatment fluid that drips near the part of the maintaining part 14a of holding member 14.The bottom surface 57 of treatment fluid accommodation section 56 is divided into corresponding to the part 1 57a of main inner cup portion 56a with corresponding to the part 2 57b of secondary inner cup portion 56b by next door 55, and they all tilt in the mode that rises towards inboard (pivot side) from the outside.And, the medial extremity arrival of part 2 57b and the corresponding position, inboard (pivot side) of the maintaining part 14a of holding member 14.Next door 55 has following effects: when swivel plate 11 rotations, stop the air flow A and air mist that forms to the outstanding part in swivel plate 11 belows by holding member 14 to arrive the wafer W side.On the next door 55, be formed with and be used for treatment fluid from the hole 58 (with reference to Fig. 1) of secondary inner cup portion 56b to main inner cup portion 56a guiding.
Discharge opeing cup 51 bottom of Zhou Duan within it has and is used for discharge opeing cup 51 is fixed on the fixed part 72 of the ring-type (flange shape) on the bottom of exhaust cup 52.Fixed part 72 as shown in Figure 6, screw thread fixed part 74 with the location division 73 and 4 places at two places, in the location division 73, resinous alignment pin 73a is inserted in the carrier of exhaust cup 52, carry out the location of discharge opeing cup 51, fix by resinous screw element 75 screw threads at screw thread fixed part 74 with respect to exhaust cup 52.In the location division 73 and screw thread fixed part 74, clamped a plurality of distance pieces 76, between fixed part 72 and exhaust cup 52, spread all over complete cycle by 76 of distance pieces and be formed uniformly gapped 77.In addition, location division 73 is not limited to above-mentioned quantity with the quantity of screw thread fixed part 74, so long as a plurality of just passable.
In addition, on ratio fixed part 72 part in the outer part of following side 54, has from the following side cavern part 59 that 54 bottom surface hollows out towards the top.And, by this cavern part 59 limit from fixed part 72 extend to top thin-walled have a flexible cylindrical portion 79.The thickness of cylindrical portion 79 is about 3~6mm.In addition, by cavern part 59, as described later, be formed in the exhaust cup 52 with discharge opeing cup 51 with concentric shape setting and be connected the cushion space 78 of the ring-type on the exhaust outlet 70.
By all sides in like this fixed part 72 being arranged on, even the treatment fluid of high temperature is discharged in essence in the discharge opeing cup 51 that forms by the higher resin of coefficient of thermal expansion and causes under the situation of discharge opeing cup 51 thermal expansions, because the bigger outer peripheral portion of thermal expansion does not suffer restraints, so can reduce the possibility that thermal expansion causes discharge opeing cup 51 to damage yet.In addition, fixed part 72 is located at 56 inboards, treatment fluid accommodation section, and the thermal impact of the treatment fluid of high temperature is less.And; the flexible cylindrical portion 79 that has of thin-walled has the function that suppresses function that thermal impact transmits to fixed part 72 and absorb the distortion that thermal expansion brings by deflection under the situation of using high-temperature process liquid; thus, can prevent that at fixed part 72 places of discharge opeing cup 51 expansion that the heat because of treatment fluid causes from making screw element 75 damages such as grade.
Outermost part in the following side 54 of discharge opeing cup 51 is provided with 1 leakage fluid dram 60 from 56 discharge opeings of treatment fluid accommodation section, is connected with discharging tube 61 (with reference to Fig. 1) on leakage fluid dram 60.On discharging tube 61, be provided with discharge opeing switching part (not shown), reclaim respectively according to the kind of treatment fluid or discarded.In addition, leakage fluid dram 60 also can be provided with many places.
Exhaust cup 52 have the Outboard Sections of the vertical wall 53 that vertically is arranged on discharge opeing cup 51 lateral wall 64, with mode vertical and that swivel plate 11 is approached in its upper end be arranged on the inside part of holding member 14 madial wall 65, be located at diapire 66 on the pedestal 1 and crooked upward and cover the upper side wall 67 that ground, rotation cup 4 tops is provided with from lateral wall 64.And, exhaust cup 52 from it the introducing port in the form of a ring (upside exhaust be taken into mouthful) 68 between the hood portion 31 of sidewall 67 and rotation cup 4 will rotate cup 4 interior and on every side mainly be that gas componant is taken into and discharges.In addition,,, be provided with exhaust outlet 70, on exhaust outlet 70, be connected with blast pipe 71 as Fig. 1 and shown in Figure 4 in the bottom of exhaust cup 52.Be provided with not shown attraction mechanism in the downstream of blast pipe 71, can be with exhaust around the rotation cup 4.Exhaust outlet 70 is provided with a plurality of, can switch use according to the kind of treatment fluid.Replace this design, also can make exhaust outlet is 1 place, and many exhaust lay outs corresponding to the treatment fluid kind that can switch are set in the downstream that is linked to the exhaust lay out on the exhaust outlet.
At the upside of exhaust outlet 70, by the cavern part 59 of discharge opeing cup 51, in exhaust cup 52 with discharge opeing cup 51 concentric shapes be provided with the cushion space 78 of ring-type.In other words, exhaust outlet 70 be configured in cushion space 78 under at least 1 place, be directly connected to cushion space 78.And then, between lateral wall 64, be formed with outside annulus 99a in the form of a ring as the vertical wall 53 of the lateral wall of discharge opeing cup 51 and exhaust cup 52.In addition, the Outboard Sections of the exhaust outlet 70 between the bottom of the bottom of discharge opeing cup 51 and exhaust cup 52 is provided with the gas flow modulation parts (aeration resistance portion) 97 along the ring-type that circumferentially is formed with a plurality of air vent holes 98.Gas flow modulation parts 97 are set for, and the exhaust stream from the introducing port of discharge opeing cup 51 (upside exhaust be taken into mouthful) 68 is applied set aeration resistance.Introducing port 68 spreads all over complete cycle, via outside annulus 99a and gas flow modulation parts 97, is communicated to the cushion space 78 of ring-type.
Structure as described above plays the effect of gas flow modulation mechanism, is used for regulating the air-flow that is taken into the gas componant in the exhaust cup 52, from exhaust outlet 70 exhaust equably.That is, exhaust stream spreads all over complete cycle by the outside annulus 99a as annulus and is guided downwards equably, and the loss of exerting pressure of the gas flow modulation parts 97 with a plurality of air vent holes 98 is a resistance, is directed in the cushion space 78 with the state that disperses.Cushion space 78 provides at the upside of exhaust outlet 70 and spreaded all over the space that complete cycle has enough capacity in exhaust cup 52, even so at the position of leaving from exhaust outlet 70 (position of the opposition side of exhaust outlet 70), with respect to the pressure loss of air-flow also less (resistance to air-flow is less).Thus, in exhaust cup 52, prevented the formation of deflection air-flow, no matter how can both be from complete cycle towards exhaust outlet 70 exhaust more equably apart from the distance of exhaust outlet 70.In contrast, if to the air-flow that flows to exhaust outlet 70 without limits, then only carry out exhaust, and can be difficult to exhaust apart from exhaust outlet 70 parts far away near the exhaust outlet 70.
In addition, not only flow into outside annulus 99a, also can be flow in the treatment fluid accommodation section 56 of discharge opeing cup 51 some from introducing port (upside exhaust be taken into mouthful) 68 gas componants that are taken into.Therefore, exhaust cup 52 also is taken into gas componant and discharge from the downside of wafer maintaining part 2.Particularly, between the madial wall 65 of the madial wall 54a of discharge opeing cup 51 and exhaust cup 52, be formed with in the form of a ring inboard annulus 99b.The gap 69b of the ring-type between the upper end in the gap 69a of the ring-type between the bottom of the upper end of madial wall 65 and swivel plate 11 and the next door 55 of discharge opeing cup 51 and the bottom of swivel plate 11 becomes the downside exhaust that is used for gas componant imports among the inboard annulus 99b and is taken into mouth.And then, in interior all sides of discharge opeing cup 51, between fixed part 72 and exhaust cup 52, spread all over complete cycle by distance piece 76 and be formed uniformly gappedly 77, set for exhaust stream is applied set aeration resistance.
Such structure also plays the effect of gas flow modulation mechanism, is used for regulating the air-flow that is taken into the gas componant in the exhaust cup 52, from exhaust outlet 70 exhaust equably.Thus, exhaust stream is spreaded all over the cushion space 78 that complete cycle is directed to ring-type equably from treatment fluid accommodation section 56 by inboard annulus 99b and gap 77, can be from exhaust outlet 70 exhaust more equably.
In addition, the outer peripheral portion of gas flow modulation parts 97 and discharge opeing cup 51 is not fixed between the bottom, but constitutes slidably.That is, the interior circumferential portion of discharge opeing cup 51 is fixed on the exhaust cup 52 via fixed part, and the bottom of outer peripheral portion is bearing on the bottom of exhaust cup 52 slidably, is in the unconfinement state on radial direction.Therefore, as mentioned above, even the treatment fluid of high temperature supplied in the discharge opeing cup 51 and make the thermal expansion significantly of its outer peripheral portion, power can not suffer restraints yet.
Like this, treatment fluid is directed in the discharge opeing cup 51 via rotation cup 4, gas componant is directed to the exhaust cup 52 from introducing port 68, and carries out independently from the discharge opeing of discharge opeing cup 51 with from the exhaust of exhaust cup 52, so can guiding discharge opeing and exhaust under the state that separates.In addition, even mist spills from discharge opeing cup 51, because exhaust cup 52 is around it, thus also can promptly be discharged via exhaust outlet 70, thus prevent that reliably mist from escaping to the outside.
Then, with reference to Fig. 7 A~Fig. 7 D the action of above such liquid handling device that constitutes 100 is described.At first, shown in Fig. 7 A, under the state that Lift Part 13 is risen, the never illustrated conveying arm of wafer W is handed off on the fulcrum post 25 of wafer supporting platform 24.Then, shown in Fig. 7 B, Lift Part 13 is dropped to clamp wafer W by the position of holding member 14 maintenance wafer W by holding member 14.Then, shown in Fig. 7 C, make the front treatment fluid supply with mouth 5 and move to the wafer cleaning positions from retreating position.
Under this state, shown in Fig. 7 D, by motor 3 maintaining part 2 with rotation cup 4 and wafer W rotated on one side, supply with that mouth 5 and reverse side treatment fluid supply with that mouth 6 is supplied with set treatment fluids and the clean of carrying out wafer W from the front treatment fluid on one side.
In this wafer clean, to supply with mouth 5 and reverse side treatment fluid from the front treatment fluid and supply with the front and the reverse side of 6 pairs of wafer W of mouth and supply with treatment fluid, this cleaning fluid to the diffuse outside of wafer W, is got rid of by the periphery from wafer W and to take off under action of centrifugal force.
In this wafer clean, the cup that centers on the arranged outside of wafer W is the rotation cup 4 that rotates with wafer W, so run into rotation during cup 4 being got rid of the treatment fluid that takes off from wafer W, effect has centrifugal force on treatment fluid, disperse (mistization) when being difficult for taking place as fixing cup.And the treatment fluid that arrives rotation cup 4 is guided downwards, is discharged to from gap 33 on the main inner cup portion 56a of discharge opeing cup 51.On the other hand, owing on the installation site of the holding member 14 of swivel plate 11, be provided with the hole of inserting maintaining part 14a, so on treatment fluid can drip the secondary inner cup portion 56b of discharge opeing cup 51 from this part.Then, the treatment fluid of being accepted by discharge opeing cup 51 like this is discharged from by discharging tube 61 from leakage fluid dram 60.In addition, in exhaust cup 52, from it the introducing port in the form of a ring 68 between the hood portion 31 of sidewall 67 and rotation cup 4 be taken in the rotation cup 4 and on every side mainly be gas componant, from exhaust outlet 70 by blast pipe 71 exhausts.
Like this, because the existence of rotation cup 4, discharge opeing cup 51 so long as the very little cup of degree that can discharge opeing just can, in addition, because discharge opeing cup 51 is provided with respectively independently with exhaust cup 52, and discharge opeing and exhaust are taken into respectively and discharge respectively from leakage fluid dram 60 and exhaust outlet 70, be not used for the special mechanism of separation off gas, discharge opeing so do not need to be provided with.In addition, owing to be provided with under the state of discharge opeing cup 51 in being contained in exhaust cup 52, so be the structure that exhaust, discharge opeing are taken into respectively, can reduce the space simultaneously, the result can reduce the footprints of device.In addition, because discharge opeing cup 51 is the states that are contained in the exhaust cup 52, so even the mist of treatment fluid spills from discharge opeing cup 51, also can be deflated cup 52 and catch, the mist that can prevent treatment fluid disperses outside device and brings harmful effect.
If the gas componant that flow in the exhaust cup 52 is almost flow in the exhaust outlet 70 without restriction, the part that then only approaches exhaust outlet 70 is deflated, and becomes the state of exhaust hardly in distance exhaust outlet 70 parts far away.With respect to this, in the present embodiment, as shown in Figure 8, air communication crossed outside annulus 99a and spread all over complete cycle guiding downwards equably, under the pressure loss of the air vent hole 98 of gas flow modulation mechanism 97 is the effect of resistance, be imported in the cushion space 78 of ring-type with the state that disperses.Thus, prevented the situation that air-flow forms on the bias in exhaust cup 52, no matter how can both carry out exhaust more equably towards exhaust outlet 70 from complete cycle apart from the distance of exhaust outlet 70.
In addition, as shown in Figure 8, not only flow into outside annulus 99a, also how much flow in the treatment fluid accommodation section 56 of discharge opeing cup 51, and then flow in the exhaust outlet 70 by the inboard of discharge opeing cup 51 by the gas componant that is taken into from introducing port 68.With respect to this, be vertically formed madial wall 54a in the inboard of discharge opeing cup 51, and the madial wall 65 of exhaust cup 52 between be formed with inboard annulus 99b, and be formed with gap 77 between fixed part 72 and the exhaust cup 52 in interior all sides of discharge opeing cup 51.In the case, air-flow spreads all over complete cycle from treatment fluid accommodation section 56 by inboard annulus 99b and is guided downwards equably, under the effect of the resistance in gap 77, is directed in the cushion space 78 of ring-type under the state that disperses.Thus, prevented the problem that air-flow forms on the bias in exhaust cup 52, no matter how can both carry out exhaust more equably towards exhaust outlet 70 from complete cycle apart from the distance of exhaust outlet 70.Because arrive the air-flow of exhaust outlet 70 lacks than the air-flow that arrives exhaust outlet 70 by outside annulus 99a by this inboard annulus 99b, so the such parts of gas flow modulation parts 97 of being located at the outside needn't be set, utilize inboard annulus 99b and gap 77 just can make the air-flow homogenizing fully.
In addition, as treatment fluid, for example having, SC1 etc. is the treatment fluid of the high temperature about 80 ℃.If such treatment fluid is flow in the discharge opeing cup 51, then because discharge opeing cup 51 is resinous and in the form of a ring, so can particularly can expand significantly because the treatment fluid of high temperature produces the thermal expansion of a great deal of to outer circumferential side.Thereby, be that for example under the situation that the peripheral part of discharge opeing cup is fixing, fixed part might damage because of thermal expansion under the situation of part of thermal expansion significantly at the standing part of discharge opeing cup 51.With respect to this, in the present embodiment, the fixed part 72 of discharge opeing cup 51 is established the bottom of circumferential portion within it, and there is not fixed part in the outer peripheral portion bigger in thermal expansion.Because can slide and not suffer restraints in the bottom of this outer peripheral portion at gas flow modulation parts 97 upper edge radial directions, so discharge opeing cup 51 is less because of the possibility that thermal expansion damages.In addition, because fixed part 72 is located at than position in the inner part, treatment fluid accommodation section 56,, the thermal impact that the treatment fluid of high temperature can be brought gets rid of so trying one's best.And,, transmit to fixed part 72 even also can suppress heat under the situation of the treatment fluid of use high temperature, even exist thermal impact also can absorb the distortion that thermal expansion brings by deflection by the flexible cylindrical portion 79 of having of thin-walled.Therefore, can prevent to make because of the thermal expansion of treatment fluid the problem of damage such as screw element 75 grades reliably at the fixed part 72 of discharge opeing cup 51.
According to the 1st execution mode of the present invention referring to figs. 1 through Fig. 8 explanation, owing to be provided with the rotation cup that rotates with the rotation of substrate, so effect has centrifugal force on the rotation cup, the resilience of the mist of such treatment fluid in the time of can preventing to be provided with fixing cup.And, because discharge opeing cup around the arranged outside ring-type of rotating cup, and hold the discharge opeing cup and with the concentric shape of discharge opeing cup be provided with the exhaust cup, so mist is less from the resilience of rotation cup, correspondingly, the discharge opeing cup can be reduced, and, be contained in the exhaust cup, so correspondingly reduce the space, the result can reduce the footprints of device.And then, can carry out discharge opeing and exhaust respectively from discharge opeing cup and exhaust cup, do not need to be used for the special mechanism of separation off gas, discharge opeing.
In addition, since be provided with regulate air-flow so that the air-flow that is taken into the above-mentioned gas composition in the above-mentioned exhaust cup from complete cycle roughly towards above-mentioned exhaust outlet airflow flowing governor motion, so can spread all over the complete cycle exhaust equably of exhaust cup.
In addition, because the discharge opeing cup has the fixed part that is fixed on the above-mentioned exhaust cup on the circumferential portion within it, even so the discharge opeing cup expands, the outer peripheral portion that the influence of expansion is bigger is also unfettered, be difficult for taking place the damage that thermal expansion causes under the effect of high-temperature process liquid.
Fig. 9 is the cutaway view of schematic configuration of the liquid handling device of expression the present invention the 2nd execution mode, and Figure 10 is its vertical view, and Figure 11 is the cutaway view that amplifies expression exhaust discharge opeing portion.This liquid handling device 300 has pedestal 201, rotatably keep wafer maintaining part 202 as the wafer W of processed substrate, make the rotation motor 203 of these wafer maintaining part 202 rotations, around the rotation cup 204 that remains on the wafer W ground setting on the wafer maintaining part 202 and rotate with wafer maintaining part 202, the front of wafer W is supplied with the front treatment fluid of treatment fluid and supplied with mouth 205, the reverse side of wafer W is supplied with the reverse side treatment fluid of treatment fluid and supplied with mouth 206, with the exhaust discharge opeing portion 207 on the circumference that is located at rotation cup 204.In addition, cover exhaust discharge opeing portion 207 around and the wafer W top be provided with housing 208.Be provided with blower fan filtering unit (FFU) 209 on the top of housing 208, to remaining on the sinking of the wafer W supplying clean air on the wafer maintaining part 202.
Wafer maintaining part 202 has and horizontally disposedly is discoideus swivel plate 211 and is connected the central part of its reverse side and the rotating shaft cylindraceous 212 that extends downwards vertically.At the central part of swivel plate 211, be formed with the hole 211a of the circle that is communicated to the hole 212a in the rotating shaft 212.And the Lift Part 213 that possesses reverse side treatment fluid supply mouth 206 can be provided with in hole 212a and hole 211a up and down.On swivel plate 211, be provided with the holding member (wafer keeps the annex of usefulness) 214 of the outer rim that keeps wafer W, as shown in figure 10, they equally spaced dispose 3.This holding member 214 flatly keeps wafer W under the state that wafer W is floated slightly from swivel plate 211.The 214b of dismounting portion that this holding member 214 has the maintaining part 214a of the end face that can keep wafer W, extend to the reverse side center position of swivel plate from maintaining part 214a, make rotating shaft 214c that maintaining part 214a rotates and the fulcrum 214d that comprises this rotating shaft 214c in vertical plane, by by not shown pressure cylinder mechanism the terminal part of the 214b of dismounting portion being boosted upward, maintaining part 214a laterally rotates and removes the maintenance of wafer W.Holding member 214 to the direction application of force that maintaining part 214a keeps wafer W, is the state by holding member 214 maintenance wafer W by not shown spring members under the situation that does not make the pressure cylinder mechanism action.
Rotating shaft 212 can be rotated to support on the pedestal 201 via the parts of bearings 215 with two bearing 215a.Embedding on the bottom of rotating shaft 212 has belt wheel 216, is wound with driving-belt 217 on belt wheel 216.Driving-belt 217 also be wound on be installed on motor 203 the axle on belt wheel 218 on.And,, make rotating shaft 212 rotations via belt wheel 218, driving-belt 217 and belt wheel 216 by making motor 203 rotations.
Directly over parts of bearings 215, supply with port 219 along the purge gas that the periphery of rotating shaft 212 is provided with in the form of a ring.Supply with the purge gas stream 220 that is connected with on the port 219 in the outer wall that is located at parts of bearings 215 along vertical direction at this purge gas, in this purge gas stream 220, on the corresponding part in the position with below the pedestal 201 of parts of bearings 215, be connected with purge gas pipe arrangement 221.And never illustrated purge gas supply source is supplied with port 219 via purge gas pipe arrangement 221, purge gas stream 220 to purge gas and is for example supplied with N2 gas as purge gas.Making this purge gas supply with port 219 from purge gas flows to the upper side and the lower side of rotating shaft 212.
The purge gas that imports upward from purge gas supply port 219 is released to rotating shaft 212 space S 1 on every side of being divided by next door 265, makes this space S 1 become malleation.Thus, the top of the metal material rotating shaft of having avoided being attached to easy corrosion from the mist that disperses than next door 265 space S 2 in the outer part or treatment fluid 212, prevent the corrosion of rotating shaft 212, describedly become the chemical gas environment owing to the composition of various treatment fluids than next door 265 space S 2 in the outer part.
On the other hand, supply with purge gas that port 219 imports downwards by around metal (upper 215a, the 215b in the parts of bearings 215 and by to the outside discharge of device from purge gas.Thus, the particulate that the wearing and tearing because of bearing 215a and 215b can be produced is sent to the device outside.Thus, can suppress to arrive wafer W from the particulate of bearing 215a, 215b.
The front treatment fluid is supplied with mouth 205 and is remained on the mouth arm 222, is supplied with treatment fluid by illustrated feed tube for liquid never, via being located at its inner mouth hole 205a treatment fluid that spues.As the treatment fluid that spues, can enumerate the such dry solvent of rinsing liquids such as soup that wafer cleans usefulness, pure water, IPA etc., a kind or two or more treatment fluids can spue.Mouth arm 222 can be that the center is provided with rotationally with axle 223 as shown in figure 10, under the effect of not shown driving mechanism, can move between the retreating position of the foreign side of spue position and wafer W above the wafer W center and above the periphery.In addition, mouth arm 222 can be provided with moving up and down, at retreating position and the state for rising when spuing rotated position, and the state for descending when supplying with mouth 205 from the front treatment fluid and spue treatment fluid.
The reverse side treatment fluid is supplied with the center that mouth 206 is located at Lift Part 213, and portion is formed with the mouth hole 206a that alongst extends within it.And, supplied with set treatment fluid from the lower end of mouth hole 206a via not shown treatment fluid pipe, this treatment fluid is spued on the reverse side of wafer W via mouth hole 206a.As the treatment fluid that spues, to supply with mouth 205 same with above-mentioned front treatment fluid, can enumerate the such dry solvent of rinsing liquids such as the soup that cleans usefulness, pure water, IPA etc., and a kind or two or more treatment fluids can spue.The wafer supporting platform 224 that on the upper end of Lift Part 213, has supporting wafer W.On the upper surface of wafer supporting platform 224, have and be used for 3 wafer supporting pins 225 (only illustrating two) of supporting wafer W.And the lower end of supplying with mouth 206 at the reverse side treatment fluid is connected with pressure cylinder mechanism 227 via linking parts 226, by making Lift Part 213 liftings by this pressure cylinder mechanism 227, makes the wafer W lifting, carries out the loading and the unloading of wafer W.
Rotation cup 204 has from top, the end of swivel plate 211 circular hood portion 231 that oblique upper to the inside extends and the lateral wall portion 232 of the tubular that extends to vertical lower from the outer end of hood portion 231 as shown in figure 11.Be formed with circular gap 233 between side wall portion 232 and the swivel plate 211 outside, will rotate the treatment fluid (mist) that disperses and guide downwards with swivel plate 211 and rotation cup 204 owing to wafer W from this gap 233.
Between hood portion 231 and swivel plate 211, with the position of the roughly the same height of wafer W on be folded with the guide member 235 that is tabular.As shown in figure 12, between hood portion 231 and the guide member 235, between guide member 235 and the swivel plate 211, make a plurality of openings 236 that treatment fluid passes through and a plurality of distance members 238 and 239 of 237 along circumferentially disposing to be used for forming respectively.Hood portion 231, guide member 235, swivel plate 211 and the distance member between them 238,239 are fixed by screw element 240 screw threads.
It is roughly continuous that guide member 235 is arranged to the positive and negative of its positive and negative and wafer W.So, in that wafer maintaining part 202 and rotation cup 204 are rotated with wafer W when the front treatment fluid is supplied with the central supply treatment fluid in 205 pairs of wafer W fronts of mouth, treatment fluid spreads on the front of wafer W under action of centrifugal force, is got rid of by the periphery from wafer W and takes off.Should be got rid of the treatment fluid that takes off from the front of wafer W and be discharged to foreign side from opening 236, be guided downwards by hood portion 231 and lateral wall portion 232 by the guiding of the front of the guide member 235 that roughly is provided with continuously.In addition, equally, when treatment fluid was supplied with the central supply treatment fluid of reverse side of 206 pairs of wafer W of mouth from the negative in that wafer maintaining part 202 and rotation cup 204 are rotated with wafer W, treatment fluid spread on the reverse side of wafer W under action of centrifugal force, is got rid of by the periphery from wafer W and takes off.Should be got rid of the reverse side guiding of the guide member 235 that the treatment fluid that takes off roughly is provided with continuously by the reverse side with wafer W and discharged to foreign side from the reverse side of wafer W, be guided downwards by hood portion 231 and lateral wall portion 232 from opening 237.At this moment, because the treatment fluid effect of arrival interval parts 238,239 and lateral wall portion 232 is had centrifugal force, return to the inside so stoped them to become mist.
In addition and since guide member 235 like this guiding from the wafer W front and reverse side get rid of the treatment fluid that takes off, so the treatment fluid that breaks away from from the periphery of wafer W is difficult for turbulent flowization, can make the treatment fluid mistization and it is guided outside rotating cup 204.In addition, as shown in figure 10, on guide member 235, on position, be provided with notch part 241, to avoid holding member 214 corresponding to holding member 214.
Exhaust discharge opeing portion 207 is mainly used to reclaim the gas and the liquid of discharging from the space that is centered on by swivel plate 211 and rotation cup 204, from the enlarged drawing of Figure 11 also as can be seen, possess the discharge opeing cup 251 in the form of a ring of accepting the treatment fluid of discharging from rotation cup 204 and in the form of a ring with in the outside of discharge opeing cup 251 around the exhaust cup 252 of discharge opeing cup 251.
As Fig. 9 and shown in Figure 11, discharge opeing cup 251 has the vertical wall 253 in the outside of approaching lateral wall portion 232 and vertically being arranged on rotation cup 204 and the bottom 254 of extending towards the inboard from the lower end of vertical wall 253.The upper end of vertical wall 253 extends to the top of the lateral wall portion 232 of rotation cup 204, along hood portion 231 bendings.Thus, prevent that the mist in the discharge opeing cup 251 from flowing backwards to the wafer W side.
Towards inboard (being the pivot side of wafer W) rising crustal inclination, its medial extremity reaches the corresponding position, maintaining part 214a inboard (pivot side) with holding member 214 from its outside in the bottom 254 of discharge opeing cup 251 in the form of a ring.
In addition, on the outer fix of the holding member 214 of discharge opeing cup 251 inside, have extend to the lower surface of swivel plate 211 from bottom 254 near, along its barrier rib 255 that circumferentially is provided with ring-type (cylindric).This barrier rib 255 has in the space S 2 of obstruction below swivel plate 211 effect that the air-flow that produces is advanced towards the lateral direction of discharge opeing cup 251 (direction opposite with rotating shaft 212).And discharge opeing cup 251 is divided into the main liquid carrier 256 of conduct the 1st treatment fluid carrier of accepting from the gap 233 treatment fluids of discharging by this barrier rib 255 and accepts the secondary liquid carrier 257 of conduct the 2nd treatment fluid carrier of the treatment fluid that drips near the part of the maintaining part 214a of holding member 214.That is, barrier rib 255 also has the function that the treatment fluid carrier that will accept treatment fluid is divided into two-part next door.
The maintaining part 214a of holding member 214 constitutes, by being that center of rotation is rotated with rotating shaft 214c, can keep wafer W or remove keeping, so, on swivel plate 211, be provided with the opening 211b that is used for maintaining part 214a insertion.Travel back across via the opening 211b of this swivel plate 211 at treatment fluid under the reverse side (lower surface) and the situation of dripping downwards of swivel plate 211, can accept by secondary liquid carrier 257.In addition, on barrier rib 255, be formed with and be used for treatment fluid being directed to the hole 258 as connected entrance the main liquid carrier 256 from secondary liquid carrier 257.
On the outermost part of the bottom 254 of discharge opeing cup 251, be provided with the leakage fluid dram 260 at 1 place, on leakage fluid dram 260, be connected with discharging tube 261.On discharging tube 261, be provided with the discharge opeing switching part and attract mechanism (all not shown), reclaim respectively according to the kind of treatment fluid or discarded.In addition, leakage fluid dram 260 also can be provided with many places corresponding to the kind of for example treatment fluid.
Exhaust cup 252 have the Outboard Sections of the vertical wall 253 that vertically is arranged on discharge opeing cup 251 lateral wall 264, with mode vertical and that swivel plate 211 is approached in its upper end be arranged on the inside part of holding member 214 next door 265, be located at diapire 266 on the pedestal 201 and crooked upward and cover the upper side wall 267 that ground, rotation cup 204 tops is provided with from lateral wall 264.As mentioned above, next door 265 is to divide its inboard rotating shaft 212 space S 1 on every side and the wall of the gaseous environment of the space S 2 in its outside.And, exhaust cup 252 from it the introducing port in the form of a ring 268 between the hood portion 231 of sidewall 267 and rotation cup 204 will rotate cup 204 interior and on every side mainly be that gas componant is taken into and discharges.In addition,, as shown in Figure 9, be provided with exhaust outlet 270, on exhaust outlet 270, be connected with blast pipe 271 in the bottom of exhaust cup 252.Be provided with not shown attraction mechanism in the downstream of blast pipe 271, can be with exhaust around the rotation cup 204.Exhaust outlet 270 is provided with a plurality of, can switch use according to the kind of treatment fluid.
Like this, treatment fluid is directed in the discharge opeing cup 251 via rotation cup 204, gas componant is directed to the exhaust cup 252 from introducing port 268, and carry out independently from the discharge opeing of discharge opeing cup 251 with from the exhaust of exhaust cup 252, so discharge opeing can be guided under the state that separates with exhaust.In addition, even mist spills from discharge opeing cup 251, because exhaust cup 252 so also can promptly discharge via exhaust outlet 270, has prevented that reliably mist from escaping to the outside around it.
As mentioned above, because the bottom 254 of discharge opeing cup 251 forms towards inboard (pivot side) rising crustal inclination from its outside, thus the inner bottom surface 254b of the inner bottom surface 254a of main liquid carrier 256 and secondary liquid carrier 257 also respectively from the outside towards inboard (pivot side) rising crustal inclination.And secondary liquid carrier 257 is compared formation ground with main liquid carrier 256 more shallow.This magnitude relationship with the processing liquid measure of being accepted by main liquid carrier 256 and secondary liquid carrier 257 is corresponding.That is, the treatment fluid that travels back across reverse side (lower surface) via the opening 211b of swivel plate 211 lacks than the amount of the treatment fluid of being accepted by main liquid carrier 256, so preferably make the volume of the secondary liquid carrier 257 of volumetric ratio of main liquid carrier 256 big.
In addition, barrier rib 255 has following effects: when swivel plate 211 rotation, the air-flow (for example rotating flow) that stops the part that is projected into swivel plate 211 belows because of holding member 214 to form is accompanied by mist and arrives the wafer W side.
Promptly, holding member 214 is along with towards as the 214b of dismounting portion of the end opposite of maintaining part 214a and towards the reverse side center position of swivel plate 211 projection downwards, so under the state that makes swivel plate 211 rotations, holding member 214 plays the such effect of blade, forms air-flow in the following side space of swivel plate 211.If produce such air-flow, then can make in exhaust cup 252 movement disorder towards unidirectional exhaust of exhaust outlet 270.As a result, make the mist that is included in the exhaust spread, on the front of wafer W, produce watermark or particulate.So, in the present embodiment, by surrounding the barrier rib 255 that holding member 214 ground are equipped with tubular, hinder the air-flow that produces that rotatablely moves to flow to peripheral direction because of the holding member 214 that carries out along with the rotation of swivel plate 211, can not upset the mobile of normal exhaust.
In addition, in order to reclaim the treatment fluid that travels back across reverse side (lower surface) via the opening 211b of swivel plate 211 reliably, need cover scope by discharge opeing cup 251 from the outer circumferential side of swivel plate 211 to the lower position of the opening 211b of the swivel plate 211 at the position that escapes to the rotation support mechanism reverse side as treatment fluid.For this purpose and with the treatment fluid carrier (recess) of discharge opeing cup 251 under inboard condition of enlarged, the air-flow that produces in the space when rotating below swivel plate 211 owing to the holding member of installing in the reverse side that is projected into swivel plate 211 214, can make the movement disorder of the treatment fluid in the recess that is pooled to discharge opeing cup 251, become the reason that produces mist.
In view of such consideration, in the discharge opeing cup 251 of present embodiment, by barrier rib 255 the treatment fluid carrier of discharge opeing cup 251 is divided into main liquid carrier 256 and secondary liquid carrier 257 two parts, can suppress said flow and make the disorderly problem of treatment fluid stream that in the main liquid carrier 256 of discharge opeing cup 251, flows, prevent the generation of mist, and can keep normal discharge opeing stream.In addition, the main liquid carrier 256 of the discharge opeing cup 251 that is divided into two by barrier rib 255 and secondary liquid carrier 257 are shown in Fig. 9 and prominent 11, all be to analyse and observe to be the roughly groove of V-shape (recess of ring-type), its groove be formed with leakage fluid dram 260 bottom and as the hole 258 of connected entrance, so treatment fluid promptly can be carried to leakage fluid dram 260.And then, because barrier rib 255 has the function that intercepts said flow, make the disorderly problem of normal exhaust stream in the exhaust cup 252 so can also prevent air-flow from arriving exhaust pathway.
More than, by barrier rib 255 is set, can relax the influence that the exhausts in the air-flow supply and exhaust cup 252 that the rotation owing to holding member 214 produces bring, relax the influence of bringing for the discharge opeings in the discharge opeing cup 251 simultaneously.Thereby, can improve the efficient of the exhaust and the discharge opeing of liquid handling device 300, of reduced contamination, the liquid handling device that reliability is higher of the generation of mist and particulate is provided.
Then, with reference to Figure 13 A~Figure 13 D the action of above such liquid handling device that constitutes 300 is described.At first, as shown in FIG. 13A, under the state that Lift Part 213 is risen, the never illustrated conveying arm of wafer W is handed off on the fulcrum post 225 of wafer supporting platform 224.Then, shown in Figure 13 B, Lift Part 213 is dropped to clamp wafer W by the position of holding member 214 maintenance wafer W by holding member 214.Then, shown in Figure 13 C, make the front treatment fluid supply with mouth 205 moves to the top, center of wafer W from retreating position the position that spues.
Under this state, shown in Figure 13 D, by motor 203 swivel plate 211 with rotation cup 204 and wafer W rotated on one side, supply with set treatment fluid and carry out clean from front treatment fluid supply mouth 205 and reverse side treatment fluid supply mouth 206 on one side.
In this clean, treatment fluid is fed into the front of wafer W and the center of reverse side, and this cleaning fluid to the diffuse outside of wafer W, is got rid of by the periphery from wafer W and to take off under action of centrifugal force.In the case, the cup that is provided with owing to the outside around wafer W is the rotation cup 204 that rotates with wafer W, so run into rotation during cup 204 getting rid of the treatment fluid that takes off from wafer W, effect has centrifugal force on treatment fluid, be difficult for taking place disperse (mistization) as fixing cup.And the treatment fluid that arrives rotation cup 204 is guided downwards, is discharged to from gap 233 on the main liquid carrier 256 of discharge opeing cup 251.On the other hand, owing on the installation site of the holding member 214 of swivel plate 211, be provided with the opening 211b that maintaining part 214a is inserted, so on treatment fluid drips the secondary inner cup portion 257 of discharge opeing cup 251 from this part.
Owing to when the cleaning of wafer W, discharged while the gap 233 that rotates by from ring-type, be compelled to do circlewise so accept its discharge opeing cup 251 by the treatment fluid of discharging from rotation cup 204.
Like this, treatment fluid can be discharged from the discharge opeing cup 251 of ring-type at short notice, so under the situation of using multiple treatment fluid, understand fully easily and switch the opportunity of discharging the destination, in addition, when hand-off process liquid, can prevent that two kinds of treatment fluids are discharged under the state that mixes.
In the case, the crustal inclination owing to rise towards the inboard from the outside in the bottom 254 (the inner bottom surface 254a of promptly main liquid carrier 256 and the inner bottom surface 254b of secondary liquid carrier 257) of discharge opeing cup 251, so be discharged to the treatment fluid part outflow laterally promptly on main liquid carrier 256 and the secondary liquid carrier 257, can make the difficulty that becomes of liquid residue.In addition, when swivel plate 211 rotations, utilize the barrier rib 255 of function,, the mobile problem that becomes disorderly of treatment fluid in the discharge opeing cup 251 is taken place so that do not have air-flow with the air-flow blocking-up that mainly produces by holding member 214 with obstruct air-flow.And then, by barrier rib 255 is set, prevented that air-flow from arriving exhaust pathway and making the normal exhaust in the exhaust cup 252 become disorderly, can suppress the diffusion of mist and particulate.
Figure 14 is the cutaway view of schematic configuration of liquid handling device 301 of the variation of expression the present invention the 2nd execution mode.In the liquid handling device 300 of Fig. 9,, and the treatment fluid carrier is divided into main liquid carrier 256 and secondary liquid carrier 257 two parts by 254 upright handicapping next doors 255, bottom from discharge opeing cup 251.With respect to this, in the liquid handling device 301 of Figure 14, made the structure that barrier rib 255a cylindraceous is set towards the below from swivel plate 211.Barrier rib 255a is arranged near the outer circumferential side of opening 211a of swivel plate 211, its highly arrive discharge opeing cup 251a bottom 254c near.Thereby discharge opeing cup 251a does not have the such barrier rib 255 of the liquid handling device 300 of Fig. 9.
The barrier rib 255 of the function of barrier rib 255a and the liquid handling device of Fig. 9 300 is roughly same.That is, barrier rib 255a has the function of the air-flow obstruct that will produce in space S 2, can prevent that said flow arrival exhaust pathway and the normal exhaust that upset in the exhaust cup 252 from flowing.In addition, owing to the treatment fluid carrier of discharge opeing cup 251a is divided into main liquid carrier 256a and secondary liquid carrier 257a two parts by barrier rib 255a, so performance following effects: be suppressed at the air-flow that produces because of rotatablely moving of holding member 214 in the space S 2 and upset the treatment fluid stream that in the main liquid carrier 256a of discharge opeing cup 251, flows, prevent the generation of mist, and keep normal discharge opeing stream.In this variation, because main liquid carrier 256a and the secondary liquid carrier 257a of the discharge opeing cup 251a that is divided into two by barrier rib 255a are communicated with the gap location of the bottom 254c of discharge opeing cup 251a in the lower end of barrier rib 255a, so the treatment fluid on the secondary liquid carrier 257a that drips is flowing down rapidly on the inner bottom part of the oblique bottom 254c of periphery inclination and is being directed on the main liquid carrier 256a from inboard (the pivot side of wafer W).Then, treatment fluid is promptly carried to analysing and observe the leakage fluid dram 260 that forms bottom that is the promptly main liquid carrier 256a of the groove of V-shape (recess of ring-type) roughly.
In addition, in the liquid handling device 301 of this variation, on the lower surface of swivel plate 211, be provided with the protuberance 211c that suppresses the arcuation of mechanism as air-flow.Figure 15 is the stereogram of lower surface of expression swivel plate 211, Figure 16 be comprise protuberance 211c swivel plate 211 want portion's cutaway view.Protuberance 211c is provided with a plurality of (being 3) in the mode of the installation position P that clips holding member 214 from both sides this variation.If make swivel plate 211 rotation, then can in space S 2, produce air-flows such as rotating flow, reason is, as mentioned above, the holding member 214 of large-scale as a comparison parts is playing a role as agitator when being projected into state below the swivel plate 211 and rotatablely moving.Thereby, on the lower surface of swivel plate 211,, reduce air-flow generation itself by outstanding being formed on of protuberance 211c can be weakened the agitating function of holding member 214 on the position of moving on the circular orbit identical with holding member 214.Suppress effect in order to obtain such air-flow, it is identical or more than it that the height h of protuberance 211c is preferably fulcrum 214d with holding member 214.In addition, protuberance 211c both can be hollow, also can be solid, in addition, both can form with swivel plate 211, also can be with other part bonding on the lower surface of swivel plate 211.
More than, by barrier rib 255a being arranged on swivel plate 211 sides, also can alleviate influence that air-flow that the rotation because of holding member 214 produces brings the exhaust in the exhaust cup 252 and the influence that the discharge opeing in the discharge opeing cup 251a is brought simultaneously in space S 2.In addition, except being equipped with barrier rib 255a, the air-flow that the agitating function that is used for weakening holding member 214 also is set on the lower surface of swivel plate 211 suppresses mechanism (protuberance 211c), thereby can make the strength retrogression of air-flow.Thereby, can improve the efficient of the exhaust and the discharge opeing of liquid handling device 301, the liquid handling device that the generation of mist and particle contamination are less, reliability is higher can be provided.In addition, also this air-flow can be suppressed mechanism (protuberance 211c) is applied in the liquid handling device 300 of Fig. 9.
Figure 17 is the cutaway view of schematic configuration of liquid handling device 302 of another variation of expression the present invention the 2nd execution mode.In the liquid handling device 302 of Figure 17, except barrier rib 255, side (rotating shaft 212 sides) below is provided with the 2nd barrier rib 273 within it.The 2nd barrier rib 273 is from being located at the diapire 266 upright walls of establishing cylindraceous on the pedestal 201.The 2nd barrier rib 273 is formed on the lower position of holding member 214, forms with the height of its upper end near holding member 214.And the 2nd barrier rib 273 has and hinders the air-flow that produces space S 2 in because of rotatablely moving of holding member 214 towards discharge opeing cup 251 and the mobile function of exhaust pathway on every side thereof when swivel plate 211 rotation.In order to improve such air-flow barriering effect, baffler 273 is preferably as far as possible little in the scope that does not touch the holding member 214 that moves along circular orbit with the interval of holding member 214.
In addition, by the 2nd barrier rib 273, can prevent that the air-flow that produces is circuitous from the following direction exhaust outlet 270 of discharge opeing cup 251 in space S 2.If the air-flow that produces is directly advanced to exhaust outlet 270, then can upset the gas componant that is taken into from the introducing port 268 between the hood portion 231 of the upper side wall 267 of exhaust cup 252 and rotation cup 204 towards the mobile exhaust stream of exhaust outlet 270 in space S 2.As a result, the mist in the exhaust can spread and attached on the wafer W, become the reason that causes watermark and particle contamination.By the 2nd barrier rib 273 is set, can gets rid of the influence of air-flow as described above and carry out normal exhaust.
And then, near holding member 214, dispose not shown pressure cylinder mechanism in order to push away on the 214b of dismounting portion with holding member 214, so, can prevent from that treatment fluid or mist from dispersing and being attached to pressure cylinder mechanism from discharge opeing cup 251 to cause corrosion by the 2nd barrier rib 273 is set.
Like this, in the liquid handling device 302 of present embodiment, owing to adopted the dual Barrier structure that except barrier rib 255, also is provided with the 2nd barrier rib 273, so influence that the air-flow that can relax generation in space S 2 simultaneously brings the exhaust in the exhaust cup 252 and the influence that the discharge opeing in the discharge opeing cup 251 is brought.Thereby, improved the exhaust of liquid handling device 302 and the efficient of discharge opeing, the liquid handling device that the generation of mist and particle contamination are less, reliability is higher can be provided.In addition, the 2nd barrier rib 273 of the liquid handling device 302 of Figure 17 also can be configured in the liquid handling device 301 of Figure 14.
The 2nd execution mode of the present invention according to reference Fig. 9 to Figure 17 explanation, from keeping substrate by holding member and the pivot of the substrate maintaining part of its rotation observed than holding member to be provided with barrier rib, so can be suppressed at the mobile influence that brings of air-flow that the below of substrate maintaining part produces to exhaust and discharge opeing by the position of radial outside.Thus, in liquid handling device, can reduce the generation of mist and particulate, carry out exhaust and discharge opeing efficiently.In addition, in the 2nd execution mode,, made the structure that possesses the rotation cup 204 that synchronously rotates with swivel plate 211, also can use non-rotary cup as accepting cup around the liquid that remains on the wafer W on the swivel plate 211.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various distortion.For example, in the above-described embodiment, the liquid handling device that cleans with the positive and negative that carries out wafer is that example is illustrated, but the present invention is not limited to this, also can be to carry out only front or the only liquid handling device of the clean of reverse side, in addition, about liquid handling, being not limited to clean, also can be other liquid handling such as resist liquid coating processing and subsequent development treatment.And then, in the above-described embodiment, to using semiconductor wafer to be illustrated, but also can be applied in other substrates such as substrate of flat-panel monitor (FPD) usefulness that glass substrate with liquid crystal indicator (LCD) usefulness is representative as the situation of processed substrate.

Claims (29)

1, a kind of liquid handling device is characterized in that, possesses:
Substrate maintaining part (2) flatly keeps substrate (W), can rotate with substrate;
Rotation cup (4), the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate;
Rotating mechanism (3) rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly;
Treatment fluid feed mechanism (5) is supplied with treatment fluid to substrate;
The discharge opeing cup (51) of ring-type is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup;
The exhaust cup (52) of ring-type, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into;
Exhaust outlet (70) is connected on the above-mentioned exhaust cup, discharges with the above-mentioned gas composition that will be taken in the above-mentioned exhaust cup;
Above-mentioned rotation cup (4) has the shape that does not in fact cover the top that remains on the substrate on the aforesaid substrate maintaining part (2),
Above-mentioned discharge opeing cup (51) is configured to the outside around above-mentioned rotation cup (4),
Above-mentioned exhaust cup (52) holds above-mentioned discharge opeing cup (51) and is provided with the concentric shape of above-mentioned discharge opeing cup ground,
Upside in aforesaid substrate maintaining part (2), the upside exhaust that forms above-mentioned exhaust cup is taken into mouthful (68),
In above-mentioned exhaust cup (52) with the concentric shape of above-mentioned discharge opeing cup (51) be provided with the cushion space (78) of ring-type, and described cushion space (78) is connected on the above-mentioned exhaust outlet (70),
Above-mentioned upside exhaust is taken into mouthful (68) and is connected with the outside aeration resistance portion (97) of above-mentioned cushion space (78) via ring-type, above-mentioned outside aeration resistance portion sets for, the exhaust stream that is taken into from above-mentioned upside exhaust mouthful is applied set aeration resistance, be taken into mouthful a exhaust from above-mentioned upside exhaust and in fact spread all over the complete cycle homogenizing to above-mentioned cushion space thereby make.
2, liquid handling device as claimed in claim 1 is characterized in that,
Above-mentioned cushion space (78) is positioned at the downside of above-mentioned discharge opeing cup (51).
3, liquid handling device as claimed in claim 2 is characterized in that,
Above-mentioned exhaust outlet (70) be configured in above-mentioned cushion space (78) under at least 1 place.
4, liquid handling device as claimed in claim 2 is characterized in that,
Above-mentioned cushion space (78) hollows out by the bottom with above-mentioned discharge opeing cup (51) and forms.
5, liquid handling device as claimed in claim 1 is characterized in that,
Above-mentioned exhaust cup (52) has upper side wall (67), and described upper side wall (67) covers the top of above-mentioned rotation cup (4).
6, liquid handling device as claimed in claim 1 is characterized in that,
Corresponding to above-mentioned outside aeration resistance portion (97), dispose the parts of ring-type between above-mentioned discharge opeing cup (51) and above-mentioned exhaust cup (52), above-mentioned outside aeration resistance portion constitutes by spreading all over a plurality of air vent holes that complete cycle is formed uniformly on the parts of above-mentioned ring-type.
7, liquid handling device as claimed in claim 1 is characterized in that,
Between the lateral wall of the lateral wall of above-mentioned discharge opeing cup (51) and above-mentioned exhaust cup (52), be formed with outside annulus (99a), above-mentioned upside exhaust be taken into mouthful (68) be connected with above-mentioned outside aeration resistance portion (97).
8, a kind of liquid handling device is characterized in that,
Possess:
Substrate maintaining part (2) flatly keeps substrate (W), can rotate with substrate;
Rotation cup (4), the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate;
Rotating mechanism (3) rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly;
Treatment fluid feed mechanism (5) is supplied with treatment fluid to substrate;
The discharge opeing cup (51) of ring-type around the arranged outside of above-mentioned rotation cup, is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup;
The exhaust cup (52) of ring-type holds above-mentioned discharge opeing cup and is provided with the concentric shape of above-mentioned discharge opeing cup ground, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into;
Exhaust outlet (70) is connected on the above-mentioned exhaust cup, discharges with the above-mentioned gas composition that will be taken in the above-mentioned exhaust cup;
Gas flow modulation mechanism is folded between above-mentioned exhaust cup and the above-mentioned exhaust outlet, regulates air-flow, so that the air-flow of above-mentioned gas composition is in fact mobile towards above-mentioned exhaust outlet from complete cycle in above-mentioned exhaust cup,
The said flow governor motion possesses the inboard aeration resistance portion (77) of ring-type, described inboard aeration resistance portion (77) is configured between above-mentioned discharge opeing cup (51) and the above-mentioned exhaust cup (52), making the downside exhaust of the above-mentioned exhaust cup of the downside that is positioned at aforesaid substrate maintaining part (2) be taken into mouthful (69a, a 69b) in fact spreads all over complete cycle ground with cushion space (78) and is communicated with, above-mentioned inboard aeration resistance portion sets for, and the exhaust stream that is taken into from above-mentioned downside exhaust mouthful is applied set aeration resistance.
9, liquid handling device as claimed in claim 8 is characterized in that,
Dispose a plurality of distance pieces corresponding to above-mentioned inboard aeration resistance portion (77) between above-mentioned discharge opeing cup (51) and above-mentioned exhaust cup (52), above-mentioned inboard aeration resistance portion constitutes by spread all over a plurality of openings that complete cycle is formed uniformly between above-mentioned distance piece.
10, liquid handling device as claimed in claim 8 is characterized in that,
Between the madial wall of the madial wall of above-mentioned discharge opeing cup (51) and above-mentioned exhaust cup (52), be formed with the inboard annulus (99b) of ring-type, above-mentioned downside exhaust is taken into mouthful is connected with above-mentioned inboard aeration resistance portion (77).
11, liquid handling device as claimed in claim 1 is characterized in that,
The interior circumferential portion of above-mentioned discharge opeing cup (51) is fixed on the above-mentioned exhaust cup (52) via fixed part (72), and outer peripheral portion is in the unconfinement state on radial direction.
12, liquid handling device as claimed in claim 11 is characterized in that,
Said fixing portion (72) is connected the bottom of above-mentioned discharge opeing cup (51) with the bottom of above-mentioned exhaust cup (52).
13, liquid handling device as claimed in claim 12 is characterized in that,
Above-mentioned discharge opeing cup (51) has the liquid containing portion (56a) that holds treatment fluid, and said fixing portion (72) is arranged on inboard, aforesaid liquid accommodation section with ring-type.
14, liquid handling device as claimed in claim 13 is characterized in that,
Above-mentioned discharge opeing cup (51) its bottom than the cavern part (59) of said fixing portion (72) by having ring-type on the part of outer circumferential side, above-mentioned cavern part limits top from above-mentioned discharge opeing cup to the flexible cylindrical portion of having of said fixing portion.
15, liquid handling device as claimed in claim 13 is characterized in that,
Said fixing portion (72) is along circumferentially having a plurality of screw thread fixed parts (74) and a plurality of location division (73).
16, liquid handling device as claimed in claim 11 is characterized in that,
The bottom of the above-mentioned outer peripheral portion of above-mentioned discharge opeing cup (51) is bearing on the bottom (97) of above-mentioned exhaust cup (52) slidably.
17, a kind of liquid handling device is characterized in that,
Possess:
Substrate maintaining part (2) flatly keeps substrate (W), can rotate with substrate;
Rotation cup (4), the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate;
Rotating mechanism (3) rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly;
Treatment fluid feed mechanism (5) is supplied with treatment fluid to substrate;
The discharge opeing cup (51) of ring-type around the arranged outside of above-mentioned rotation cup, is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup;
The exhaust cup (52) of ring-type holds above-mentioned discharge opeing cup and is provided with the concentric shape of above-mentioned discharge opeing cup ground, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into;
Exhaust outlet (70) is connected on the above-mentioned exhaust cup, discharges with the above-mentioned gas composition that will be taken in the above-mentioned exhaust cup;
Gas flow modulation mechanism (78,97,99a) is folded between above-mentioned exhaust cup and the above-mentioned exhaust outlet, regulates air-flow, so that in fact the air-flow of above-mentioned gas composition flow towards above-mentioned exhaust outlet from complete cycle in above-mentioned exhaust cup,
Aforesaid substrate maintaining part (2) has to the outstanding annex (14) of reverse side, and above-mentioned discharge opeing cup (51) has the liquid containing portion (56a) that holds treatment fluid, disposes the barrier rib (55) of the air-flow that obstruct forms by above-mentioned annex between above-mentioned annex and aforesaid liquid accommodation section.
18, liquid handling device as claimed in claim 17 is characterized in that,
Above-mentioned annex (14) constitutes, and keeps substrate (W) by the upper end.
19, liquid handling device as claimed in claim 17 is characterized in that,
Above-mentioned barrier rib (55) surrounds above-mentioned annex (14) and forms cylindric in the below of aforesaid substrate maintaining part (2).
20, liquid handling device as claimed in claim 19 is characterized in that,
Above-mentioned barrier rib (55) is formed on the above-mentioned discharge opeing cup (51).
21, liquid handling device as claimed in claim 20 is characterized in that,
By above-mentioned barrier rib (55), in above-mentioned discharge opeing cup (51), in inboard, aforesaid liquid accommodation section (56a), mark off the liquid carrier (56b) of the treatment fluid of accepting the reverse side that escapes to aforesaid substrate maintaining part (2), the aforesaid liquid carrier is connected on the aforesaid liquid accommodation section via the hole (58) that is formed on the above-mentioned barrier rib.
22, liquid handling device as claimed in claim 19 is characterized in that,
Above-mentioned barrier rib (255a) forms towards the below from the reverse side of aforesaid substrate maintaining part (202).
23, liquid handling device as claimed in claim 17 is characterized in that,
Between the rotating shaft (12) and above-mentioned barrier rib (55) of above-mentioned rotating mechanism, dispose the next door (65) of the axial gaseous environment of above-mentioned rotation of dividing aforesaid substrate maintaining part (2) below and the gaseous environment on every side of above-mentioned discharge opeing cup (51).
24, liquid handling device as claimed in claim 23 is characterized in that,
Also possess the pressure regulating mechanism (219) of adjusting by the pressure in the space of above-mentioned rotating shaft (12) side of above-mentioned next door (65) division.
25, liquid handling device as claimed in claim 23 is characterized in that,
Also possess purge gas is imported to gas introduction part (219) in the space of the above-mentioned rotation shaft side of being divided by above-mentioned next door.
26, liquid handling device as claimed in claim 23 is characterized in that,
On the lower position of the above-mentioned annex (14) between above-mentioned next door (265) and the above-mentioned barrier rib (255), dispose the 2nd barrier rib (273) that said flow is intercepted.
27, liquid handling device as claimed in claim 17 is characterized in that,
On the lower surface of aforesaid substrate maintaining part (202), be formed with a plurality of convex shaped parts (211c) of the formation that suppresses the air-flow that above-mentioned annex (14) causes with arcuation, with above-mentioned accessory configuration between this convex shaped part.
28, a kind of liquid handling device is characterized in that, possesses:
Substrate maintaining part (2) flatly keeps substrate (W), can rotate with substrate;
Rotation cup (4), the substrate around remaining on the aforesaid substrate maintaining part can rotate with substrate, accepts and is got rid of the treatment fluid that takes off from substrate;
Rotating mechanism (3) rotates above-mentioned rotation cup and aforesaid substrate maintaining part integratedly;
Treatment fluid feed mechanism (5) is supplied with treatment fluid to substrate;
The discharge opeing cup (51) of ring-type is accepted the treatment fluid and the discharge opeing of discharging from above-mentioned rotation cup;
The exhaust cup (52) of ring-type, will from above-mentioned rotation cup and on every side mainly be that gas componant is taken into;
Above-mentioned rotation cup (4) has the shape that does not in fact cover the top that remains on the substrate on the aforesaid substrate maintaining part (2),
Above-mentioned discharge opeing cup (51) is configured to the outside around above-mentioned rotation cup (4),
Above-mentioned exhaust cup (52) holds above-mentioned discharge opeing cup (51) and is provided with the concentric shape of above-mentioned discharge opeing cup ground,
The interior circumferential portion of above-mentioned discharge opeing cup is fixed on the above-mentioned exhaust cup via fixed part (72), and outer peripheral portion is in the unconfinement state on radial direction.
29, a kind of liquid handling device is characterized in that, possesses:
Substrate maintaining part (2) flatly keeps substrate (W), can rotate with substrate;
Rotating mechanism (3) makes the rotation of aforesaid substrate maintaining part;
Treatment fluid feed mechanism (5) is supplied with treatment fluid to substrate;
The discharge opeing cup (51) of ring-type around the aforesaid substrate maintaining part, is accepted the treatment fluid and the discharge opeing that are discharged from;
The aforesaid substrate maintaining part has to the outstanding annex (14) of reverse side, and above-mentioned discharge opeing cup has the liquid containing portion (56a) that holds treatment fluid, between above-mentioned annex and aforesaid liquid accommodation section, dispose the barrier rib (55) of the air-flow that obstruct forms by above-mentioned annex.
CN200710110337A 2006-06-16 2007-06-13 Liquid processing apparatus Active CN100585799C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006167971 2006-06-16
JP2006167971A JP4803592B2 (en) 2006-06-16 2006-06-16 Liquid processing apparatus and liquid processing method
JP2006207044 2006-07-28
JP2006207045 2006-07-28

Publications (2)

Publication Number Publication Date
CN101090063A CN101090063A (en) 2007-12-19
CN100585799C true CN100585799C (en) 2010-01-27

Family

ID=38930907

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710110337A Active CN100585799C (en) 2006-06-16 2007-06-13 Liquid processing apparatus

Country Status (2)

Country Link
JP (1) JP4803592B2 (en)
CN (1) CN100585799C (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5180661B2 (en) * 2008-04-18 2013-04-10 株式会社ディスコ Spinner cleaning device and processing device
JP5015870B2 (en) * 2008-07-08 2012-08-29 東京エレクトロン株式会社 Substrate processing apparatus, holding member, and substrate processing method
JP5369538B2 (en) * 2008-08-12 2013-12-18 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium
JP2012064800A (en) * 2010-09-16 2012-03-29 Sumco Corp Wafer cleaning device
CN102441539B (en) * 2010-09-30 2013-09-18 承澔科技股份有限公司 Element cleaning machine easy for flow guide
JP5512508B2 (en) * 2010-12-28 2014-06-04 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
TWI418418B (en) * 2011-02-18 2013-12-11 Sparking Power Technology Co Ltd Elements washing machine
JP5472169B2 (en) 2011-03-16 2014-04-16 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium
US8899246B2 (en) * 2011-11-23 2014-12-02 Lam Research Ag Device and method for processing wafer shaped articles
CN102641869A (en) * 2012-04-17 2012-08-22 北京七星华创电子股份有限公司 Wafer cleaning device and cleaning method
JP6164826B2 (en) * 2012-12-05 2017-07-19 株式会社ディスコ Cleaning device
JP6276924B2 (en) * 2013-03-18 2018-02-07 芝浦メカトロニクス株式会社 Substrate processing equipment
KR102043811B1 (en) * 2013-05-09 2019-11-12 에이씨엠 리서치 (상하이) 인코포레이티드 Apparatus and method for plating and/or polishing wafer
JP2015023138A (en) * 2013-07-18 2015-02-02 株式会社ディスコ Spinner cleaning apparatus
KR101825092B1 (en) * 2013-10-22 2018-03-14 에이피시스템 주식회사 Apparatus for processing subsrate
CN104752302B (en) * 2013-12-30 2018-05-08 北京北方华创微电子装备有限公司 A kind of base supports structure and chamber
CN106610568A (en) * 2015-10-27 2017-05-03 沈阳芯源微电子设备有限公司 Glue coating development process module and control method for module internal environment parameters
US11094548B2 (en) 2016-06-27 2021-08-17 Ebara Corporation Apparatus for cleaning substrate and substrate cleaning method
CN106111416A (en) * 2016-08-26 2016-11-16 裕东(中山)机械工程有限公司 The device that a kind of sheet material powder spray anti-colour mixture of contactless isolation is polluted
JP6706564B2 (en) * 2016-09-23 2020-06-10 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method
JP6870944B2 (en) * 2016-09-26 2021-05-12 株式会社Screenホールディングス Board processing equipment
CN106707690B (en) 2017-01-04 2021-08-20 中国科学院光电技术研究所 Photoresist coating method and apparatus
JP6824773B2 (en) * 2017-02-20 2021-02-03 株式会社Screenホールディングス Substrate processing equipment and substrate processing method
JP6431128B2 (en) * 2017-05-15 2018-11-28 エーシーエム リサーチ (シャンハイ) インコーポレーテッド Apparatus and method for plating and / or polishing of wafers
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
CN112295721B (en) * 2020-09-19 2022-11-22 中建三局绿色产业投资有限公司 Maggot separating device for ecological crucian culture
CN112382594A (en) * 2020-11-30 2021-02-19 冠礼控制科技(上海)有限公司 Liquid drainage cylinder
CN113945072B (en) * 2021-10-18 2022-11-29 北京烁科精微电子装备有限公司 Drying system and drying method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174848A (en) * 1990-11-08 1992-06-23 Fujitsu Ltd Regist coating device
JP2001351857A (en) * 2000-04-03 2001-12-21 Tokyo Electron Ltd Substrate processing system
JP2002248408A (en) * 2001-02-26 2002-09-03 Shibaura Mechatronics Corp Spin treatment apparatus
JP3948963B2 (en) * 2002-01-21 2007-07-25 芝浦メカトロニクス株式会社 Spin processing equipment

Also Published As

Publication number Publication date
JP4803592B2 (en) 2011-10-26
JP2007330927A (en) 2007-12-27
CN101090063A (en) 2007-12-19

Similar Documents

Publication Publication Date Title
CN100585799C (en) Liquid processing apparatus
US8479753B2 (en) Liquid processing apparatus and method
US9318365B2 (en) Substrate processing apparatus
EP1848024B1 (en) Liquid processing apparatus
EP1868229B1 (en) Liquid processing apparatus
US8042560B2 (en) Substrate processing apparatus
JP5967519B2 (en) Substrate processing apparatus and substrate processing method
JP2016134514A (en) Substrate processing device
KR20020086869A (en) Bowl, Spin, Rinse and Dry Module, and Method for Loading a Semiconductor Wafer into a Spin, Rinse and Dry Module
JP4621038B2 (en) Semiconductor wafer cleaning method and semiconductor wafer cleaning apparatus
US20120090642A1 (en) Substrate processing apparatus and substrate processing method
JP2006108481A (en) Development processing apparatus
JP5036415B2 (en) Liquid processing apparatus and liquid processing method
JP4787103B2 (en) Liquid processing equipment
JP4832176B2 (en) Liquid processing apparatus and liquid processing method
JP2013207265A (en) Substrate processing apparatus
JP6739268B2 (en) Substrate processing equipment
JP4969327B2 (en) Liquid processing equipment
JP2008117971A (en) Liquid processing apparatus
JP2007287998A (en) Liquid processing device
JP5375793B2 (en) Liquid processing equipment
JP2013207266A (en) Substrate processing apparatus
CN114530395A (en) Apparatus for processing substrate
JP2011166186A (en) Liquid processing apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant