CN100539060C - The method and system of conductive bonding material is provided - Google Patents
The method and system of conductive bonding material is provided Download PDFInfo
- Publication number
- CN100539060C CN100539060C CNB2007100964399A CN200710096439A CN100539060C CN 100539060 C CN100539060 C CN 100539060C CN B2007100964399 A CNB2007100964399 A CN B2007100964399A CN 200710096439 A CN200710096439 A CN 200710096439A CN 100539060 C CN100539060 C CN 100539060C
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- Prior art keywords
- bonding material
- conductive bonding
- cavity
- supporting substrate
- tucker
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
Abstract
Disclosing a kind ofly provides the system of conductive bonding material, method and apparatus to a plurality of cavitys in circuit supporting substrate.This method comprises that tucker is set to be contacted with circuit supporting substrate substantially.Circuit supporting substrate comprises at least one cavity.In that tucker is basic when contacting with circuit supporting substrate, linear movement is provided or rotatablely moves at least one circuit supporting substrate and tucker.Conductive bonding material is arranged to circuit supporting substrate from tucker.In the contiguous tucker of at least one cavity, provide conductive bonding material at least one cavity.
Description
Technical field
The present invention relates generally to the layout field on the electrical pads, more particularly, relate to and on circuit supporting substrate, directly arrange conductive bonding material as the conductive bonding material of scolder.
Background technology
In the semiconductor device in modern times, the demand that constantly increases device density and minimizing device size requires the encapsulation and the interconnection technique of such device more urgently.Usually, in the encapsulation of IC chip, use the flip chip connection method.In the flip chip connection method, replace the lead frame of IC die attach in the encapsulation formed array of solder balls on chip surface.Generally by the mask evaporation, the solder paste material screen selects (screening), by the plating of photoresist, or the injection molding of scolder, carry out the formation of solder ball.
The U.S. Patent No. 5,244,143 that International Business Machine Corporation (IBM) holds jointly discloses injection molding scolder (IMS) technology, and therefore introduces its whole contents as a reference.The advantage that IMS is better than other solder bump technology is, the stereomutation between fusion welding and final solder bump is very little.The IMS technology utilizes scolder tucker (solder head) to fill the mould that is made of Pyrex, molybdenum, silicon, polyimides etc., and it is enough wide to cover most of single chip module.Through after the hole of filling of mould, provide optional narrow contact brush, at the scolder slit to remove unnecessary scolder.
Then, by applying fusion welding to substrate, realize being used for the IMS method of solder bonds with shifting process.When running into smaller substrate, promptly when chip level or single chip module, finish transfer step easily, because the mould that scolder is filled in the zone is relative with substrate less, and therefore aim at and connect into easily multiple structure easily.For example, often use and cut apart optics (split-optic) Alignment Process chip is connected to substrate.Identical technology also is used for the IMS mould of chip level is connected to the substrate (chip) of wanting projection.
Solder ball discussed above form technology and as a common problem of other technology of not discussing of fusion welding screening be to need use mould or punch die.Current mould is defined as rectangle and has the cavity that is provided with the figure relevant with the figure of substrate design.In other words, only can be used for specific substrate design when front mold.Each new design of design or change all require to set up new mask or mould.To plating and existing technology such as evaporation and IMS, this is a truth.In most cases, also preferred a plurality of copies of making mask or mould are used for output or redundancy.The cost of these new masks and mould changes obviously, and expensive.This has also prolonged the time of delivery, and it has limited the submission of final parts.The result of redesign has more increased cost, also can increase several weeks on the delivery schedule.
Comprise
, the problem that several mold materials of polyimides on glass have is not have the existing base layer structure that is used to build mould.There is not the mould manufacturing in different with the metal mask that uses in glass mask that uses in the solder plating or the scolder evaporation (the two all worldwide obtain easily) in large-scale production.Though there is base layer structure really in some mould manufacturings, as molybdenum, there is other shortcoming in it.
Using mould another problem that deposit solder has on substrate is that current mould is a rectangle.Therefore, mould and the mutual linear movement of scolder tucker so that cavity is vertically shifted to the slit of scolder tucker, thereby are worked as them through out-of-date cavity filling.
Therefore, exist overcoming the needs of the problem that above-mentioned current techniques has.
Summary of the invention
Briefly, according to the present invention, disclosed is the system and method that is used for providing to a plurality of cavitys of circuit supporting substrate conductive bonding material.This method comprises that tucker is set to be contacted substantially with circuit supporting substrate.Circuit supporting substrate comprises at least one cavity.When tucker contacts substantially with circuit supporting substrate, provide linear and rotatablely move at least one of circuit supporting substrate and tucker.Conductive bonding material is arranged to circuit supporting substrate from tucker.When at least one cavity vicinity tucker, provide conductive bonding material at least one cavity.
In another embodiment of the present invention, the system that a plurality of cavitys in circuit supporting substrate provide conductive bonding material is disclosed.This system comprises at least one circuit supporting substrate and at least one conductive bonding material setting device.At least one circuit supporting substrate comprises at least one cavity.At least one circuit supporting substrate at least one cavity at least one circuit supporting substrate provides conductive bonding material.At least one conductive bonding material setting device comprises tucker, is used for when tucker contacts substantially with at least one circuit supporting substrate, and the guiding conductive bonding material enters at least one cavity.At least one conductive bonding material setting device also comprises the electric conducting material holder that is mechanical coupling to tucker, is used for providing conductive bonding material from the conductive bonding material holder to tucker.This system also comprises a device, is used for when tucker contacts substantially with at least one circuit supporting substrate a kind of at least one of tucker and at least one circuit supporting substrate provides linear and rotatablely move.
In another embodiment of the present invention, a kind of integrated circuit is disclosed.This integrated circuit comprises circuit supporting substrate and at least one electronic circuit that is arranged on the circuit supporting substrate.This integrated circuit also comprises at least one cavity on the outer surface that is arranged on circuit supporting substrate, at least one cavity is used for receiving conductive bonding material during welding operation, the conductive bonding material at least one cavity and at least one electronic circuit form and electrically contact.
In another embodiment of the present invention, another kind of integrated circuit is disclosed.This integrated circuit comprises circuit supporting substrate and at least one electronic circuit.Electronic circuit is arranged on the circuit supporting substrate.Integrated circuit comprises that also at least one that be arranged on the circuit supporting substrate is contact pad designed.At least one contact pad designed outer surface from circuit supporting substrate extends.In the corresponding cavity at least one contact pad designed at least a portion insertion second circuit support substrates with the conductive bonding material filling.
The advantage of previous embodiment of the present invention is directly to provide conductive bonding material as scolder to circuit supporting substrate.Avoided the cost of mould and from the time delay of mould to the substrate-transfer material.Can use current tucker to implement the present invention.
Description of drawings
Similar label is represented the feature or function similar elements in the accompanying drawing, run through each accompanying drawing, and accompanying drawing combines and forms the part of specification with following detailed, be used for further illustrating different embodiment and explain with good grounds different principle and advantage of the present invention.
Fig. 1 is according to embodiments of the invention, and the sectional view of the tucker of conductive bonding material directly is provided to circuit supporting substrate;
Fig. 2-the 3rd is according to embodiments of the invention, with the sectional view of the circuit supporting substrate of another circuit supporting substrate coupling that has conductive bonding material in a plurality of cavitys;
Fig. 4 is according to embodiments of the invention, has the sectional view of the cavity in the circuit supporting substrate that electrically contacts in the substrate layer that the cavity place stops;
Fig. 5-the 6th, the sectional view of circuit supporting substrate according to an embodiment of the invention has and extends from the surface of circuit supporting substrate and be inserted into reception liner the cavity of another circuit supporting substrate with conductive bonding material; And
Fig. 7 is an operational flowchart according to an embodiment of the invention, shows the typical process that conductive bonding material directly is provided to circuit supporting substrate.
Embodiment
As requested, disclosed herein is specific embodiment of the present invention; Yet, should be understood that disclosed embodiment only is representative of the present invention, it can be implemented with various forms.Therefore, concrete 26S Proteasome Structure and Function details disclosed herein can not be thought restriction, but only as the basis of claim and as the representative basis of instructing those skilled in the art, uses the present invention to change in any suitable concrete structure of reality.In addition, term used herein and word are not intended to restriction; Describe and provide intelligibility of the present invention.
Be defined as one or more as term used herein " " or " one ".Be defined as two or as term used herein is a plurality of more than two.As term used herein another, be defined as two or more at least.Comprise and/or have as term used herein, be defined as and comprise (that is open language).Coupling is defined as connection as term used herein, but needn't directly connect and needn't mechanical connection.
According to an embodiment, the present invention is by directly providing the conductive bonding material as scolder to overcome the problem that prior art has to circuit supporting substrate.Avoided the cost of mould and from the time delay of mould to the substrate-transfer material.Can use existing tucker to implement the present invention.Another advantage is the welded connection that can be manufactured between circuit supporting substrate two-layer.
Be used for directly providing the typical filling technique of scolder to circuit supporting substrate
Fig. 1 shows the sectional view that is used for directly providing to circuit supporting substrate 154 tucker 108 of scolder.Though in whole disclosing, use scolder, can use as conductive epoxy resin scolder slurry, the electric conducting material of the adhesive of conductor (for example metallic) dipping etc. as the material that offers circuit supporting substrate 154.The filling technique that it shall yet further be noted that previous embodiment is to circuit deposited conductor grafting material without limits.Filling technique can also be used for other application, as machine applications, and optical application etc.For example, filling technique of the present invention can be used to form mechanical splice point.
Be different from conventional method,, do not use mould when directly when circuit supporting substrate 154 provides scolder.This is advanced, because avoided the cost of mould and be used to set up mould and shift the time delay of scolders from mould to substrate 154.Circuit supporting substrate 154 comprises with at least one of at least one cavity 104 coupling and electrically contacts (not shown).Tucker 108 comprises holder 146, is used to keep the conductive bonding material as scolder.Comprise that also port one 48 is used for providing back pressure so that raceway groove 132 is discharged and entered to scolder from holder 146 to holder 146.Raceway groove 132 is opened on and allows scolder to flow to transmission opening 112 on the circuit supporting substrate.Can also use rotation filling technique and/or linear filling technique directly to provide scolder to circuit supporting substrate 154.
In one embodiment, the leading edge transmission hot gas by tucker 108 makes scolder remain on molten/liquid.Leading edge is first edge of tucker 154, and when filling them with scolder, cavity 104 passes through down from it.When with scolder cavity filling 104, tucker 108 is set to contact with circuit supporting substrate 154 substantially.When by the transmission opening 112 when cavity 104 provides scolder, scolder solidifies in cavity 104.For example, in one embodiment, by the back edge transmission cold air of tucker 108, this edge is to fill the edge of their back cavitys 104 from its following process with scolder.When cavity 104 under the back edge through out-of-date, solder solidification.
The scolder in cavity 104 and the surface of circuit supporting substrate are on same plane.By tucker 108 (at least in the specific region of tucker 108) transmission hot gas and cold air, allow to control more the temperature of tucker 108 and scolder.For example, can change the temperature of scolder from the hot/cold gas of mould 102.Do not have transport gas, holder need be heated to higher temperature, so that scolder can premature setting.In another embodiment, thermocouple detector (not shown) is arranged at least one leading edge of tucker 108 and/or back edge so that precise dose monitoring and feedback to be provided.
In one embodiment, the surface deposition sacrifice layer (not shown) of process circuit supporting substrate 154.In the position that needs scolder, for example receive liner, etching cavity 104 in the sacrifice layer (not shown).In case provide scolder to cavity 104, just remove the sacrifice layer (not shown) as etched one or more technology by those of ordinary skill in the art is known.This technology is made solder bump on the reception liner (not shown) of circuit supporting substrate 154.
Two circuit supporting substrate are coupled
Fig. 2 and 3 shows the sectional view of two circuit supporting substrate 254,256.Fig. 3 shows two closely adjacent circuit supporting substrate 354,356 mutually.As shown in Figure 2, first circuit supporting substrate 254 comprises the cavity 204 (same shown in Figure 3 is cavity 304) of filling with scolder.In one embodiment, the size of cavity 204 is not all identical.For example, cavity can be 1 micron and another cavity can be 100 microns.Comprise also and one or morely electrically contact 260 that (same shown in Figure 3 electrically contact 360 for one or more) is used for being manufactured on circuit supporting substrate 254 or in cavity 204 on the different circuit supporting substrate (not shown) and the electrical connection between other specific region.Though Fig. 2 and Fig. 3 show that each cavity 204,304 all comprises and electrically contact 260,360, but with the viewpoint of this elaboration, those of ordinary skill in the art should be understood that optional embodiment can comprise and any cavity 204, the 304 any numbers that connect electrically contact 260,360.Second circuit support substrates 256 comprises reception liner 258 (same shown in Figure 3 for receiving liner 358).In one embodiment, the reception liner 258 of second circuit support substrates 254 flushes substantially with circuit supporting substrate 256.When first circuit supporting substrate 254 was heated to the reflux temperature of scolder, because the lip-deep surface tension of first circuit supporting substrate 254, scolder will slight uplift.When first and second circuit supporting substrate 254,256 are close to mutually when closely adjacent, this allows to receive liner 258 and contacts with scolder, as shown in Figure 3.Solder solidification then, thus the electrical connection that engages between first and second substrates 254,256, made.
Making interlayer in circuit supporting substrate connects
Fig. 4 shows the sectional view of circuit supporting substrate 454.More particularly, Fig. 4 show circuit supporting substrate 454 two-layer 464,466 on electrically contact 460,470.Illustrate in this example electrically contact 460,470 do not extend to as layer LN468 other the layer.Yet from the viewpoint of this elaboration, those of ordinary skill in the art should be understood that within the scope of the invention, and these electrically contact 460,470 other layers that can extend to circuit supporting substrate 454.As following more detailed discussion, circuit supporting substrate 454 comprises one or more cavitys 404.Equally, circuit supporting substrate 454 comprises and one or morely electrically contacts 460,470.In one embodiment, electrically contact 460,470 be positioned at circuit supporting substrate 454 not at the same level 464,466 in.For example, Fig. 4 shows first electrically contacting 460 and intersect with cavity 404 in the ground floor 464 of circuit supporting substrate 454.Second electrically contacts 470 second layers 466 that are arranged in circuit supporting substrate 454 intersects with cavity 404.In one embodiment, electrically contact 460,470 sidewall 462,472 places that end at cavity 404.This has produced cavity 404 and the electrical connection that electrically contacts between 460,470.In another embodiment, one or more electrically contact end at and embed in the cavity 404.
Another embodiment of two circuit supporting substrate is used to be coupled
Fig. 5-6 shows the cross section of two circuit supporting substrate 554,556.First circuit supporting substrate 554 comprises the cavity 504 that the scolder that provides by the tucker (not shown) is provided directly.Second circuit support substrates 556 comprises from second circuit support substrates 556 outward extending reception liners 558.Mutual when closely adjacent when circuit supporting substrate 554,556, outstanding reception liner 558 enters in the scolder of cavity 504.When circuit supporting substrate 554,556 was coupled mutually, as shown in Figure 6, the outstanding reception liner 558 of first circuit supporting substrate 554 entered in the cavity 504 of first circuit supporting substrate 554.This guarantees to receive the suitable contact of appearance between liner 558 and the scolder.For example, scolder cavity filling 504 that can be enough is to contact the conventional liner that receives.
Directly fill the exemplary process of circuit supporting substrate with scolder
Fig. 7 is an operational flowchart, shows directly to circuit supporting substrate exemplary process as the conductive bonding material of scolder is provided.The operational flowchart of Fig. 7 starts from step 702 and directly enters step 704.The tucker of step 704 is set to contact with circuit supporting substrate substantially.In step 706, provide linear or rotatablely move to circuit supporting substrate and/or tucker one.In step 708, scolder is arranged to circuit supporting substrate from tucker.For example, provide back pressure, force flow through raceway groove and discharge tucker of scolder by the transmission opening to holder.
In step 710, when at least one cavity below tucker through out-of-date, at least one cavity on circuit supporting substrate provides scolder.In one embodiment, comprise suitable filling sword sheet (blade) (not shown) on the tucker, it shows scrapes the slurry effect and guides fusion welding to enter cavity.In another embodiment, the basal surface of tucker is enough smooth and enough smooth scrapes the slurry effect to show through mould.In step 712, scolder solidifies in the cavity of circuit supporting substrate.For example, from the gas passage transmission cold air of external storage (not shown) to tucker.When the cavity with scolder below the edge of tucker of transmission cold air through out-of-date, this impels the solder solidification at least one cavity.Then, control flow ends at step 114.
Limiting examples
Previous examples of the present invention is advanced, provides conductive bonding material as scolder because they provide directly to circuit supporting substrate.Avoided the cost of mould and from the time delay of mould to the substrate-transfer material.Can use existing tucker to implement the present invention.Another advantage is the welded connection that can make between the two-layer or multilayer of circuit supporting substrate.
Though disclose specific embodiments of the invention, those of ordinary skill in the art can understand, is not breaking away under the spirit and scope of the present invention and can make amendment to specific embodiment.Therefore, it is specific embodiment that scope of the present invention does not have strict regulations, and is intended to accessory claim and covers any in the scope of the present invention and application that all are such, revises and embodiment.
Claims (18)
1. a plurality of cavitys in circuit supporting substrate provide the method for conductive bonding material, may further comprise the steps:
Tucker is set contacts with circuit supporting substrate, wherein said circuit supporting substrate comprises at least one cavity;
When described tucker contacts with described circuit supporting substrate, a kind of at least one of described circuit supporting substrate and described tucker provides linear movement and rotatablely move;
Conductive bonding material is arranged to described circuit supporting substrate from described tucker;
First edge along described tucker transmits first gas, described first gas has the temperature of the fusing point that is higher than described conductive bonding material, thereby when described conductive bonding material and described at least the first gas are contiguous mutually, keep described conductive bonding material in molten condition; And
When the described tucker of described at least one cavity vicinity, provide described conductive bonding material to described at least one cavity.
2. according to the method for claim 1, also comprise:
The described conductive bonding material of heating in described at least one cavity be to reflux temperature, thus on described at least one cavity the described conductive bonding material of lifting.
3. according to the method for claim 1, also comprise:
Make second circuit support substrates and described circuit supporting substrate contiguous, wherein the reception of at least one on described second circuit support substrates liner contacts with the described conductive bonding material of described at least one cavity.
4. according to the method for claim 3, wherein said at least one reception liner extends from the surface of described second circuit support substrates, and at least a portion in described at least one cavity of at least a portion insertion of described at least one reception liner.
5. according to the process of claim 1 wherein that described at least one cavity is formed by following steps:
Outer surface to the circuit supporting substrate that receives conductive bonding material provides temporary layer; And
At least one cavity of etching is used to receive described conductive bonding material in described temporary layer, wherein after providing described conductive bonding material, remove described temporary layer, thereby on described circuit supporting substrate, stay the conductive bonding material projection to described at least one cavity.
6. according to the method for claim 1, also comprise:
Fill described at least one cavity, so that at least one in one or more layers of described circuit supporting substrate electrically contact with described at least one cavity in conductive bonding material electrically contact, wherein said at least one electrically contact the sidewall that ends at described at least one cavity.
7. according to the process of claim 1 wherein that described at least one cavity is different with another cavity size design on the described circuit supporting substrate.
8. according to the process of claim 1 wherein that described conductive bonding material comprises scolder.
9. according to the method for claim 1, also comprise:
Second edge along described tucker transmits second gas, described second gas has the temperature of the fusing point that is lower than described conductive bonding material, thereby described at least one cavity under the described second area of described tucker with described at least the second gas through out-of-date, the described conductive bonding material in described at least one cavity solidifies.
10. a plurality of cavitys in circuit supporting substrate provide the system of conductive bonding material, comprising:
At least one conductive bonding material setting device is used for providing conductive bonding material at least one cavity of at least one circuit supporting substrate, and described conductive bonding material setting device comprises:
Tucker, be used for when described tucker contacts with described at least one circuit supporting substrate, guide described conductive bonding material to enter in described at least one cavity, wherein said tucker comprises at least the first gas passage, be used for transmitting first gas along the first area of described tucker, described first gas has the temperature of the fusing point that is higher than described conductive bonding material, thereby when described conductive bonding material and described at least the first gas are contiguous mutually, keep described conductive bonding material in molten condition;
The conductive bonding material holder is mechanical coupling to described tucker, and being used for provides conductive bonding material from described conductive bonding material holder to described tucker; And
The motion generator is used for when described plugger contacts with described at least one circuit supporting substrate, a kind of at least one of described tucker and described at least one circuit supporting substrate provides linear and rotatablely move.
11. the system according to claim 10 also comprises:
Heater is used for heating the described conductive bonding material of described at least one cavity to reflux temperature.
12. the system according to claim 10 also comprises:
Coupling device, be used at least one second circuit support substrates is coupled to described at least one circuit supporting substrate, wherein at least one on described another circuit supporting substrate at least receives liner and contacts with described conductive bonding material in described at least one cavity.
13. system according to claim 12, wherein said at least one reception liner extends from the surface of the described support substrates of second circuit at least, and in the described conductive bonding material in described at least one cavity of at least a portion insertion of described at least one reception liner.
14. the system according to claim 10 also comprises:
Filling device, be used to fill described at least one cavity, electrically contact so that at least one in one or more layers of described circuit supporting substrate electrically contacts with described conductive bonding material in described at least one cavity, wherein said at least one electrically contact the sidewall that ends at described at least one cavity.
15. according to the system of claim 10, wherein said at least one cavity is different with another cavity size design on described circuit supporting substrate.
16. according to the system of claim 10, wherein said conductive bonding material comprises scolder.
17. according to the system of claim 10, wherein said tucker also comprises:
At least the second gas passage, be used for transmitting second gas along the second area of described tucker, described conductive bonding material gas has the temperature of the fusing point that is lower than described conductive bonding material, thereby when described at least one cavity under the described second area of described tucker with described at least the second gas through out-of-date, the described conductive bonding material in described at least one cavity solidifies.
18. the system according to claim 17 also comprises:
The 3rd gas passage is used to transmit described first gas, wherein said the 3rd gas passage and the described first gas passage mechanical couplings and be positioned at around the 3rd zone of tucker of the described first area that is different from described tucker; And
The 4th gas passage is used to transmit described second gas, wherein said the 4th gas passage and the described second gas passage mechanical couplings and be positioned at around the 4th zone of tucker of the described second area that is different from described tucker.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/409,244 | 2006-04-21 | ||
| US11/409,244 US7410090B2 (en) | 2006-04-21 | 2006-04-21 | Conductive bonding material fill techniques |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101060091A CN101060091A (en) | 2007-10-24 |
| CN100539060C true CN100539060C (en) | 2009-09-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100964399A Expired - Fee Related CN100539060C (en) | 2006-04-21 | 2007-04-17 | The method and system of conductive bonding material is provided |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7410090B2 (en) |
| JP (1) | JP5039917B2 (en) |
| CN (1) | CN100539060C (en) |
| TW (1) | TW200802655A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7410092B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Fill head for injection molding of solder |
| US7416104B2 (en) * | 2006-04-21 | 2008-08-26 | International Business Machines Corporation | Rotational fill techniques for injection molding of solder |
| US7410090B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Conductive bonding material fill techniques |
| US9314864B2 (en) | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
| US7931187B2 (en) * | 2008-11-12 | 2011-04-26 | International Business Machines Corporation | Injection molded solder method for forming solder bumps on substrates |
| US20110079632A1 (en) * | 2009-10-01 | 2011-04-07 | International Business Machines Corporation | Multistack solder wafer filling |
| US8492262B2 (en) * | 2010-02-16 | 2013-07-23 | International Business Machines Corporation | Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates |
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-
2006
- 2006-04-21 US US11/409,244 patent/US7410090B2/en active Active
-
2007
- 2007-04-12 JP JP2007104611A patent/JP5039917B2/en not_active Expired - Fee Related
- 2007-04-17 CN CNB2007100964399A patent/CN100539060C/en not_active Expired - Fee Related
- 2007-04-20 TW TW096114121A patent/TW200802655A/en unknown
-
2008
- 2008-07-15 US US12/173,346 patent/US7669748B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7669748B2 (en) | 2010-03-02 |
| US7410090B2 (en) | 2008-08-12 |
| TW200802655A (en) | 2008-01-01 |
| CN101060091A (en) | 2007-10-24 |
| JP2007294954A (en) | 2007-11-08 |
| US20080272177A1 (en) | 2008-11-06 |
| JP5039917B2 (en) | 2012-10-03 |
| US20070246511A1 (en) | 2007-10-25 |
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