CN100530761C - Protecting cap attachment processing line - Google Patents
Protecting cap attachment processing line Download PDFInfo
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- CN100530761C CN100530761C CNB2006101609099A CN200610160909A CN100530761C CN 100530761 C CN100530761 C CN 100530761C CN B2006101609099 A CNB2006101609099 A CN B2006101609099A CN 200610160909 A CN200610160909 A CN 200610160909A CN 100530761 C CN100530761 C CN 100530761C
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- chamber
- glass
- organic material
- attached
- material deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Abstract
The invention discloses a protecting cap attachment processing line including: a first buffer chamber which holds a bottom glass (BG) or a metal cab (MC), a desiccant attached on the BG or MC, and deposits a sealant on the BG or MC; a second transporting chamber connected with the first buffer chamber; a glass attachment chamber connected with the second transporting chamber and attaching the BG to an organic material deposition glass (G); a synthesizing chamber connected with the second transporting chamber, attaching the MC to the BG and ossifying the G and the BG attached with each other; a supply and extraction chamber connected with the second transporting chamber; a third transporting chamber connected with the supply and extraction chamber and having a transporting robot; a second buffer chamber connected with the third transporting chamber and in which the G can be loaded; an unloading chamber connected with the third transporting chamber; a fourth transporting chamber connected with the unloading chamber; and a return line connected with the fourth transporting chamber and used for returning a metal container disk having a metal cap thereon. The metal cap or the glass cab can be attached to the G on a processing line, thereby the cost and space for mounting the processing line can be reduced.
Description
Related application
The application relates to the theme that is included among the korean patent application No.10-2005-0117701 that submitted on December 5th, 2005, and its full content specially is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of protective cover (protective cap) attachment processing line, specifically, relate to a kind of being used for metal cap and cloche to be attached to organic material deposition production line on glass at a production line.
Background technology
Organic Light Emitting Diode (OLED) is as display unit, and uses following principle: be injected into electronics and hole combination again in the film of organic material (low-molecular-weight or HMW) by negative electrode and anode, to form electron hole pair (exciton).Produce the light of specific wavelength by the energy of electron hole pair, thereby show required image.OLED is also referred to as organic electroluminescenoe device (OELD).
OLED is used for exciting organic material and luminous self-emitting display by electricity.OLED attracts much attention as display of future generation owing to low voltage drive, film, wide visual angle, quick response etc.According to its structure, OLED is divided into passive matrix (PM) OLED and active matrix (AM) OLED.
OLED comprises: tin indium oxide (ITO) glass, and it has the transparent anode layer on the glass plate of certain area; Organic field luminescence (EL) layer, it is formed on the transparent anode layer of ito glass; And cathode layer, be formed on the organic EL layer.
OLED can be by the whole bag of tricks manufacturing.As shown in Figure 1, on glass plate 1, form transparent anode layer, organic EL layer and cathode layer by semiconductor making method with certain area.Each unit cell (unit cell) 2 that comprises transparent anode layer, organic EL layer and cathode layer is arranged on the glass plate.Glass plate 1 is cut corresponding to unit cell 2, thereby makes the unit cell device that constitutes OLED.Below, the glass plate 1 that is arranged with unit cell 2 on it will be called as organic material deposition glass G.
Be used to protect the protective cover of the definite shape of unit cell 2 to be attached to glass plate 1, so that cover unit cell 2.Protective cover comprises the drier that is used to remove moisture that is positioned at wherein.According to its material, protective cover can be divided into metal cap, cloche or the like.
As shown in Figure 2, metal cap MC comprises the container (can) 3 of rectangle and is attached to the drier on the formed inner recesses 4 in the container 3.MC is attached on the organic material deposition glass G, so that cover unit cell 2.
In order to make MC, prepare the canister 3 of definite shape, and drier 4 is attached in the canister 3.The MC of manufacturing is attached on the organic material deposition glass G, so that cover unit cell 2 by sealant.Here, use canister dish (the metal can tray) T that is arranged with a plurality of MC on it.
Can easily make MC by molding, and can produce in batches at low cost.But, because MC has the deformation rate that is different from organic material deposition glass G, so may be after long-time the use owing to its distortion causes damage of product.
As shown in Figure 3, cloche GC comprises the cover glass (cap glass) 6 and the drier 4 that is attached on the inner recesses 7 of covering glass 6 of rectangle.GC is attached on the organic material deposition glass G, so that cover unit cell 2.By in the end glass BG that has with the corresponding size of organic material deposition glass G, forming a plurality of recesses 7, then drier 4 is attached in the recess 7, again with the BG cutting, and form GC.The BG that is attached with drier 4 on it is attached on the organic material deposition glass G, and then is cut with organic material deposition glass G.
GC is by making with organic material deposition glass G identical materials, thereby prevented the damage of product that causes owing to its distortion after long-time the use.Since the bonding density of drier 4 be according to the processing stage of the recess 7 of BG and definite, so the processing separately of the recess 7 of BG, therefore, GC has than MC and has more expensive production cost.
The development of OLED concentrates on two surface light emittings, rather than front surface luminous on.Therefore, as the protective cover that is attached on the organic material deposition glass G, GC is more than the MC use.
Be used for the process that protective cover is attached on the organic material deposition glass G is carried out with production line of batch.
Fig. 4 shows and is used for metal cap is attached to organic material deposition production line on glass.
As shown in Figure 4, a plurality of canisters 3 are arranged on the canister dish T, and canister dish T is at cleaning line L1 place experience cleaning course.By cleaning liquid canister 3, so that remove the foreign matter that is attached on it by cleaning line L1.Then, by plasma cleaning canister 3, so that the bonding force of enhancing and drier 4.
By the transfer robot 10 of the first conveying chamber C1, will be positioned at the canister dish T that drier adheres to C2 place, chamber and be delivered to the distributor chamber C3 that is connected with the first conveying chamber C1.Then, by being arranged on the distributor 20 at distributor chamber C3 place, sealant is deposited to the canister of canister dish T respectively.Distributor chamber C3 is provided with a plurality of.
Then, by the transfer robot 10 of the first conveying chamber C1, the canister dish T that will deposit sealant in distributor chamber C3 is delivered to the surge chamber C4 that is connected with the first conveying chamber C1.
The second conveying chamber C5 is connected with surge chamber C4, and transfer robot 30 is arranged on the second conveying chamber C5 place.The canister dish T that the transfer robot 30 of the second conveying chamber C5 will be positioned at surge chamber C4 place be delivered to be connected with the second conveying chamber C5 adhere to chamber C6.
To on semiconductor production line, experience the organic material deposition glass G of semiconductor processes, be loaded in the C7 of settling chamber that is connected with the second conveying chamber C5.Magazine (cassette) 40 is arranged on C7 place, settling chamber, and organic material is deposited glass G deposits on the magazine 40.
The transfer robot 30 of the second conveying chamber C5 will be loaded into organic material deposition glass G in the C7 of settling chamber and be delivered to and adhere to chamber C6.By being arranged on the attachment device 50 that adheres to C6 place, chamber, the canister 3 of canister dish T is attached to respectively on the organic material deposition glass G.Adhering to chamber C6 is provided with a plurality of.
With the organic material deposition glass G that is attached with canister 3 on it with and on no longer have the canister dish T of canister 3, be delivered to the C8 of relief chamber that is connected with the second conveying chamber C5 respectively.
The C8 of relief chamber is connected with the 3rd conveying chamber C9, and the 3rd conveying chamber C9 is connected with the taking-up chamber C10 that is used to take out organic material deposition glass G.The line of return L2 that is used for canister dish T is back to the 3rd conveying chamber C9 is connected with the 3rd conveying chamber C9.Transfer robot 60 is arranged on the 3rd conveying chamber C9 place.
The organic material deposition glass G that the transfer robot 60 of the 3rd conveying chamber C9 will be delivered to the C8 of relief chamber is delivered to taking-up chamber C10.In addition, the transfer robot 60 of the 3rd conveying chamber C9 canister dish T that will be delivered to the C8 of relief chamber is delivered to line of return L2.
The canister dish T that is delivered to line of return L2 is cleaned, and new canister 3 is arranged on the canister dish T that has cleaned.Then, be furnished with the canister dish T experience process as hereinbefore of canister 3 on it.
Be delivered to the organic material deposition glass G that takes out chamber C10 and on the reprocessing line, experienced reprocessing.The reprocessing line comprises: be used for organic material is deposited the process that glass G cuts into unit cell; The process that is used for the inspection unit structure cell; And be used for teat (tab) is attached to process on the per unit structure cell.
Unaccounted drawing reference numeral C11 represents to be used for canister is supplied to the supply room of canister dish T, and C12 represents to be used for the clean room by cleaning line clean metal tray of containers, and C13 represents the settling chamber.
Fig. 5 shows and is used for cloche is attached to organic material deposition production line on glass.
As shown in Figure 5, wherein be formed with end glass BG process cleaning course on cleaning line L3 of recess 7, and remove the foreign matter that is attached on the BG by cleaning line L3.Further clean so BG of cleaning by plasma, so that the bonding force of enhancing and drier 4.
By the transfer robot 70 of the first conveying chamber C21, the BG that experiences cleaning line L3 is delivered to the drier that is connected with the first conveying chamber C21 adheres to chamber C22.By being arranged on the attachment device 81 that drier adheres to C22 place, chamber, drier 4 is attached to the recess 7 of BG respectively.Drier adheres to chamber C22 and is provided with a plurality of.
By the transfer robot 70 of the first conveying chamber C21, will be positioned at the BG that drier adheres to C22 place, chamber and be delivered to the distributor chamber C23 that is connected with the first conveying chamber C21.Then, by being arranged on the distributor 80 at distributor chamber C23 place, sealant is deposited on the BG that is delivered to distributor chamber C23.Distributor chamber C23 is provided with a plurality of.
Then, by the transfer robot 70 of the first conveying chamber C21, the BG that will deposit sealant at distributor chamber C23 place is delivered to the surge chamber C24 that is connected with the first conveying chamber C21.
The second conveying chamber C25 is connected with surge chamber C24, and transfer robot 90 is arranged on the second conveying chamber C25 place.The BG that the transfer robot 90 of the second conveying chamber C25 will be positioned at surge chamber C24 place be delivered to be connected with the second conveying chamber C25 adhere to chamber C26.
To in semiconductor production line, experience the organic material deposition glass G of semiconductor processes, be loaded in the C27 of settling chamber that is connected with the second conveying chamber C25.Magazine 100 is arranged on C27 place, settling chamber, and organic material is deposited glass G deposits on the magazine 100.
The transfer robot 90 of the second conveying chamber C25 will be loaded into organic material deposition glass G in the C27 of settling chamber and be delivered to and adhere to chamber C26, and by being arranged on the attachment device 110 that adheres to C26 place, chamber, BG being attached to organic material depositing on the glass G.Adhering to chamber C26 is provided with a plurality of.Explanation is used for BG being attached to process on the organic material deposition glass G adhering to C26 place, chamber.At first, organic material deposited glass G and BG aligned with each other, and carry out pre-hardening.Then, on prevulcanized organic material deposition glass G and BG, can harden like this deposits to sealant on the BG, thereby BG is attached on the organic material deposition glass G with ultraviolet irradiation.
Then, by the transfer robot 90 of the second conveying chamber C25, the organic material deposition glass G that is attached with BG on it is transported to the C28 of relief chamber that is connected with the second conveying chamber C25.
The C28 of relief chamber is connected with the 3rd conveying chamber C29, and the 3rd conveying chamber C29 is connected with the taking-up chamber C30 that is used to take out organic material deposition glass G.Transfer robot 120 is arranged on the 3rd conveying chamber C29 place.
The organic material deposition glass G that the transfer robot 120 of the 3rd conveying chamber C29 will be delivered to the C28 of relief chamber is delivered to taking-up chamber C30.Be delivered to the organic material deposition glass G that takes out chamber C30 and in the reprocessing line, experienced reprocessing.The reprocessing line comprises: be used for organic material is deposited the process that glass G cuts into unit cell; The process that is used for the inspection unit structure cell; And be used for teat is attached to process on the per unit structure cell.
Unaccounted drawing reference numeral C31 represents to be used for BG is delivered to the conveying chamber of cleaning line, and C32 represents the settling chamber.
As previously mentioned, when protective cover is metal cap MC, in the MC attachment processing line, MC is attached on the organic material deposition glass G.On the contrary, when protective cover is cloche GC, in the BG attachment processing line, BG is attached on the organic material deposition glass G.
That is to say,, use two different production lines according to waiting that the protective cover that is attached on the organic material deposition glass G is MC or GC.Therefore, when installation is used for protective cover is attached to corresponding production line on the organic material deposition glass G, caused expensively, and needed broad installing space.
Summary of the invention
Therefore, the object of the present invention is to provide and a kind ofly can metal cap and cloche both be attached to organic material deposition protective cover attachment processing line on glass by a production line.
In order to realize this or other purpose and advantage, and according to purpose of the present invention, such as here enforcement and broadly described, a kind of protective cover attachment processing line is provided, comprise: first surge chamber, be used to keep be attached to end glass or the metal cap that organic material deposits protective cover on glass as waiting, drier is attached on end glass or the metal cap, and then sealant deposits on end glass or the metal cap; Second transfer chamber, it is connected with first surge chamber, and has transferring robot; The glass attachment chamber, it is connected with second transfer chamber, is used for that organic material is deposited glass and end glass is attached to each other; Synthetic chamber, it is connected with second transfer chamber, and it is on glass to be used for that metal cap is attached to the organic material deposition, and the organic material that sclerosis is attached to each other deposits glass and end glass; Supply and taking-up chamber, it is connected with second transfer chamber; The 3rd transfer chamber, it is connected with the taking-up chamber with supply, and has transferring robot therein; Second surge chamber, it is connected with the 3rd transfer chamber, and organic material deposition glass can be loaded in this second surge chamber; Relief chamber, it is connected with the 3rd transfer chamber; The 4th transfer chamber, it is connected with relief chamber; And the line of return, it is connected with the 4th transfer chamber, is used to return the canister dish that is furnished with metal cap on it.
By following detailed description of the present invention in conjunction with the accompanying drawings, it is more apparent that above and other objects of the present invention, feature, aspect and advantage will become.
Description of drawings
Constitute the accompanying drawing of the part of this specification, be used for further understanding the present invention, these accompanying drawings illustrate embodiments of the invention, and are used for explaining principle of the present invention with specification.In the accompanying drawing:
Fig. 1 shows the plan view according to the organic material deposition glass G of prior art;
Fig. 2 shows according to the organic material deposition glass G of prior art and the perspective view of metal cap MC;
Fig. 3 shows according to the organic material deposition glass G of prior art and the perspective view of end glass BG;
Fig. 4 shows the plan view that is used for metal cap MC is attached to the production line on the organic material deposition glass G according to prior art;
Fig. 5 shows the plan view that is used for end glass BG is attached to the production line on the organic material deposition glass G according to prior art;
Fig. 6 shows the plan view according to protective cover attachment processing line of the present invention; And
Fig. 7 shows formation according to the supply of composition protective cover attachment processing line of the present invention with take out the front view of the magazine of chamber.
Embodiment
Now the preferred embodiments of the present invention are described in detail, the example is shown in the drawings.
Below, explain in more detail with reference to the accompanying drawings according to protective cover attachment processing line of the present invention.
Fig. 6 shows the plan view according to protective cover attachment processing line of the present invention.As shown, the protective cover attachment processing line is provided with the cleaning line L4 that is used to clean end glass BG or metal cap MC.BG is the mother substrate that is used to make cloche GC, and MC is arranged on the canister dish T.
Line L4 carries out following process by cleaning: the process that is used for being attached to by the cleaning liquid such as deionized water the foreign matter on the canister 3 of BG or MC; And be used for plasma cleaning BG or canister 3, so that the process of the bonding force of enhancing and drier 4, or the like.
The first transfer chamber C41 is connected with cleaning line L4, and adheres to chamber C42 and be connected with the first transfer chamber C41.And distributor chamber C43 is connected with the first transfer chamber C41.Attachment device 210 is arranged on and adheres to C42 place, chamber, and distributor 220 is arranged on distributor chamber C43 place.
Transferring robot R1 is arranged on the first transfer chamber C41 place, and adheres to chamber C42 and distributor chamber C43 is provided with a plurality of.Drier 4 is attached to BG or canister 3 by the attachment device that adheres to C42 place, chamber, and the distributor 220 of sealant by distributor chamber C43 place deposits on BG or the canister 3.
The first surge chamber C44 is connected with the first transfer chamber C41, and the second transfer chamber C45 is connected with the first surge chamber C44.The second transfer chamber C45 is provided with transferring robot R2.
Glass attachment chamber C46 is connected with the second transfer chamber C45, and synthetic chamber C47 is connected with the second transfer chamber C45.Glass attachment chamber C46 and synthetic chamber C47 lay respectively at the opposite side of the second transfer chamber C45.Preferably, be provided with a glass attachment chamber C46, and be provided with a plurality of synthetic chamber C47.First attachment device 230 is arranged on C46 place, glass attachment chamber, and second adheres to chamber 240 and be arranged on each C47 place, synthetic chamber.
Glass attachment chamber C46 is used for by first attachment device 230 BG being attached on the organic material deposition glass G.Synthetic chamber C47 is used for adhering to chamber 240 by second canister 3 is attached on the organic material deposition glass G, and BG and organic material that sclerosis is attached to each other deposit glass G.Specifically, organic material deposition glass G and BG a plurality of contact points place betwixt be by pre-hardening, and the BG that is attached to each other and G are finally hardened at C47 place, synthetic chamber.
Supply is connected with the second transfer chamber C45 with taking-up chamber C48, and the 3rd transfer chamber C49 is connected with taking-up chamber C48 with supply.And the 3rd transfer chamber C49 is provided with transferring robot R3.
As shown in Figure 7, supply and taking-up chamber C48 are provided with magazine 250.Magazine 250 comprises: first area 251, and the organic material deposition glass G that has experienced deposition process is loaded in this first area; And second area 252, the organic material deposition glass G that is attached with canister 3 or BG is loaded in this second area.
The second surge chamber C50 is connected with the side of the 3rd transfer chamber C49, and the C51 of relief chamber is connected with the opposite side of the 3rd transfer chamber C49.The 4th transfer chamber C52 is connected with the C51 of relief chamber.
The 4th transfer chamber C52 is provided with transferring robot R4, and the organic material deposition glass G that deposits organic material by semiconductor fabrication on it is loaded onto in the second surge chamber C50.
Take out chamber C53 and be connected, and the line of return L5 that is used to return canister dish T is connected with the opposite side of the 4th transfer chamber C52 with the side of the 4th transfer chamber C52.Taking out chamber C53 is provided with a plurality of.
The canister dish T that has transferred to line of return L5 is cleaned, and new canister 3 is arranged on the canister dish T that has cleaned.
Transfer to the organic material deposition glass G that takes out chamber C53 and in the reprocessing line, experienced reprocessing.The reprocessing line comprises: be used for organic material is deposited the process that glass G cuts into unit cell; The process that is used for the inspection unit structure cell; And be used for teat is attached to process on the per unit structure cell.
Unaccounted drawing reference numeral C54 represents to have the 5th transfer chamber of transferring robot R5, and C55 represents to be used for canister is supplied to the supply room of canister dish T, and C56 represents the BG supply room, and C57 represents the settling chamber.
With the operation of explaining according to protective cover attachment processing line of the present invention.
At first, explanation is used for metal cap MC is attached to operation on the organic material deposition glass G.
A plurality of canisters 3 are arranged on the canister dish T, and canister dish T experiences cleaning course on cleaning line L4.Liquid by the cleaning line L4 that flows through cleans canister 3, so that remove the foreign matter that is attached on it.Then, canister 3 is cleaned, so that the bonding force of enhancing and drier 4 by plasma.
By the transferring robot R1 of the first transfer chamber C41 that is connected with cleaning line L4, adhere to chamber C42 with on cleaning line L4, transferring to through the canister dish T that cleans.Drier 4 is attached to the canister 3 of the canister dish T that adheres to C42 place, chamber respectively.
By the transferring robot R1 of the first transfer chamber C41, will be positioned at the canister dish T that adheres to C42 place, chamber and transfer to distributor chamber C43.Then, by being arranged on the distributor 220 at distributor chamber C43 place, sealant is deposited to respectively on the canister 3 of canister dish T.
Then, by the transferring robot R1 of the first transfer chamber C41, the canister dish T that is furnished with the canister 3 of the sealant that has deposited on it is transferred to the first surge chamber C44.The canister dish T that the transferring robot R2 of the second transfer chamber C45 will be loaded in the first surge chamber C44 transfers to synthetic chamber C47.
The organic material deposition glass G that has experienced semiconductor production process is loaded in the second surge chamber C50,, transmits it to supply and take out chamber C48 then by the transferring robot R3 of the 3rd transfer chamber C49.Here, organic material is deposited in the first area 251 that glass G is loaded into the magazine 250 that is arranged on the supply and takes out C48 place, chamber.
The transferring robot R2 of the second transfer chamber C45 will be loaded into supply and take out the interior organic material deposition glass G of chamber C48 and transfer to synthetic chamber C47.
The MC that is arranged on the canister dish T is attached to respectively on the organic material deposition glass G at synthetic C47 place, chamber.By the ultraviolet ray of sending, the sealant that is deposited on each MC is hardened, thereby MC is attached on the organic material deposition glass G by the ultra-violet lamp (not shown).
By the transferring robot R2 of the second transfer chamber C45, the organic material deposition glass G that will adhere to MC at synthetic C47 place, chamber on it transfers to supply and takes out chamber C48.Then, by the transferring robot R3 of the 3rd transfer chamber C49, organic material is deposited glass G transfer to the C51 of relief chamber.By the transferring robot R2 of the second transfer chamber C45, the canister dish T that no longer carries MC is transferred to supply and takes out chamber C48.Then, by the transferring robot R3 of the 3rd transfer chamber C49, T transfers to the C51 of relief chamber with the canister dish.Here, the organic material deposition glass G that is attached with MC on it is loaded in the second area 252 of the magazine 250 that is arranged on supply and takes out C48 place, chamber.
By the transferring robot R4 of the 4th transfer chamber C52, the organic material deposition glass G that transfers to the C51 of relief chamber is transferred to taking-up chamber C53.And, by the transferring robot R4 of the 4th transfer chamber C52, the canister dish T that transfers to the C51 of relief chamber is transferred to line of return L5.
The canister dish T that transfers to line of return L5 is cleaned, and new canister 3 is arranged on the canister dish T that has cleaned.Then, be furnished with the canister dish T experience process identical of canister 3 on it with aforementioned process.
Be attached with MC's on it and transferred to the organic material deposition glass G that takes out chamber C53 and in the reprocessing line, experience reprocessing.The reprocessing line comprises: be used for organic material is deposited the process that glass G cuts into unit cell; The process that is used for the inspection unit structure cell; And be used for teat is attached to process on the per unit structure cell.
Explanation is used for cloche GC is attached to operation on the organic material deposition glass G.
At first, wherein be formed with BG experience cleaning on cleaning line L4 of recess 7, and remove the foreign matter that is attached on the BG by the liquid of the cleaning line L4 that flows through.Then, the BG that has cleaned is cleaned, so that the bonding force of enhancing and drier 4 by plasma.
By the transferring robot R1 of the first transfer chamber C41 that is connected with cleaning line L4, transfer to and adhere to chamber C42 having experienced the BG that cleans line L4.Drier 4 is attached to the recess 7 among the BG that adheres to C42 place, chamber respectively.
By the transferring robot R1 of the first transfer chamber C41, transfer to distributor chamber C43 with being loaded into the BG that adheres in the C42 of chamber.Then, by being arranged on the distributor 220 at distributor chamber C43 place, to transferring to the BG deposition sealant of distributor chamber C43.
Then,, the BG that deposits sealant is transferred to the first surge chamber C44, and pass through the transferring robot R2 of the second transfer chamber C45, the BG that is loaded in the first surge chamber C44 is transferred to glass attachment chamber C46 by the transferring robot R1 of the first transfer chamber C41.
The organic material deposition glass G that has experienced semiconductor fabrication is loaded in the second surge chamber C50,, transmits it to supply and take out chamber C48 then by the transferring robot R3 of the 3rd transfer chamber C49.Here, organic material is deposited in the first area 251 that glass G is loaded into the magazine 250 that is arranged on the supply and takes out C48 place, chamber.
The transferring robot R2 of the second transfer chamber C45 will be loaded into supply and take out the interior organic material deposition glass G of chamber C48 and transfer to glass attachment chamber C46.
At C46 place, glass attachment chamber, BG is attached on the organic material deposition glass G.A plurality of contact points place betwixt carries out pre-hardening to organic material deposition glass G and BG.
By the transferring robot R2 of the second transfer chamber C45, prevulcanized organic material deposition glass G and BG are transferred to synthetic chamber C47.Then, ultraviolet irradiation to the sealant that is deposited on the BG, so that the sclerosis sealant, thereby is attached to BG on the organic material deposition glass G.
Then, by the transferring robot R2 of the second transfer chamber C45, the organic material deposition glass G that finishes attaching process at synthetic C47 place, chamber is transferred to supply and takes out chamber C48.Here, the organic material deposition glass G that is attached with BG on it is loaded in the second area 252 of the magazine 250 that is arranged on supply and takes out C48 place, chamber.
By the transferring robot R3 of the 3rd transfer chamber C49, the organic material deposition glass G that is loaded into supply and take out in the C48 of chamber is transferred to the C51 of relief chamber, then,, transmit it to and take out chamber C53 by the transferring robot R4 of the 4th transfer chamber C52.
Be attached with BG on it and transferred to the organic material deposition glass G that takes out chamber C53 and in the reprocessing line, experience reprocessing.The reprocessing line comprises: be used for will be attached with on it the organic material deposition glass G of BG cut into the process of unit cell; The process that is used for the inspection unit structure cell; And be used for teat is attached to process on the per unit structure cell.The BG that has cut has constituted cloche GC.
As previously mentioned, on protective cover attachment processing line according to the present invention, not only MC but also GC can be attached in a production line on the organic material deposition glass G.That is to say, in the time of on MC being attached to organic material deposition glass G, be attached on the organic material deposition glass G at this MC on the protective cover attachment processing line of the present invention.Equally, in the time of on GC being attached to organic material deposition glass G, be attached on the organic material deposition glass G at this GC on the protective cover attachment processing line of the present invention.
In addition, in the time of on GC being attached to organic material deposition glass G, a plurality of contact points place betwixt carries out pre-hardening to organic material deposition glass G and BG.Then,, sealant is hardened, be in the same place and prevulcanized organic material deposition glass G finally is attached to each other with BG by using ultraviolet ray at C47 place, synthetic chamber.Therefore, can accurately keep the alignment between organic material deposition glass G and the BG, thereby on the Organic Light Emitting Diode (OLED) that protective cover can be attached to have two light-emitting areas.
As mentioned above, on protective cover attachment processing line according to the present invention, MC or GC can be attached on the production line on the organic material deposition glass G.Therefore, needn't install independently of one another and be used for MC is attached to production line on the organic material deposition glass G, and be used for GC is attached to production line on the organic material deposition glass G, thereby reduce production line installation cost and production line installing space.Therefore, improve the degree of freedom that is used for mounting production line, and reduced manufacturing cost, and then improved product competitiveness.
Because under the prerequisite that does not deviate from spirit of the present invention or essential characteristic, the present invention can implement with different forms, so also should be appreciated that, unless specifically stated otherwise, the foregoing description is not limited to above-described any details, but should think it widely in the spirit and scope that claims limit, therefore drop on the claim scope or be equal to that institute in the described scope changes and correction is included in the claims.
Claims (5)
1. protective cover attachment processing line comprises:
First surge chamber is used to keep be attached to end glass or the metal cap that organic material deposits protective cover on glass as waiting, drier is attached on glass of the described end or the metal cap, and then sealant deposits on glass of the described end or the metal cap;
Second transfer chamber, it is connected with described first surge chamber, and has transferring robot;
The glass attachment chamber, it is connected with described second transfer chamber, is used for glass attachment of the described end on glass to described organic material deposition;
Synthetic chamber, it is connected with described second transfer chamber, and it is on glass to be used for that described metal cap is attached to described organic material deposition, and the described organic material that sclerosis is attached to each other deposits glass and glass of the described end;
Supply and taking-up chamber, it is connected with described second transfer chamber;
The 3rd transfer chamber, it is connected with the taking-up chamber with described supply, and has transferring robot therein;
Second surge chamber, it is connected with described the 3rd transfer chamber, and described organic material deposition glass can deposit in described second surge chamber;
Relief chamber, it is connected with described the 3rd transfer chamber;
The 4th transfer chamber, it is connected with described relief chamber; And
The line of return, it is connected with described the 4th transfer chamber, is used to return the canister dish that is furnished with metal cap on it.
2. protective cover attachment processing line according to claim 1 wherein, is provided with a plurality of synthetic chambers, and described synthetic chamber is connected with described second transfer chamber.
3. protective cover attachment processing line according to claim 1, wherein, described glass attachment chamber and described synthetic chamber lay respectively at the opposite side of described second transfer chamber.
4. protective cover attachment processing line according to claim 1, wherein, described supply and taking-up chamber are provided with magazine, and described magazine comprises: the first area, described organic material deposition glass is loaded in it; And second area, the described organic material deposition glass that is attached with described protective cover on it is loaded in it.
5. protective cover attachment processing line according to claim 1, wherein, in described glass attachment chamber, described organic material deposition glass and glass of the described end a plurality of contact points place betwixt are by pre-hardening.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050117701 | 2005-12-05 | ||
| KR1020050117701A KR101189774B1 (en) | 2005-12-05 | 2005-12-05 | Protecting cap attachment processing line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979919A CN1979919A (en) | 2007-06-13 |
| CN100530761C true CN100530761C (en) | 2009-08-19 |
Family
ID=38131000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101609099A Expired - Fee Related CN100530761C (en) | 2005-12-05 | 2006-12-01 | Protecting cap attachment processing line |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101189774B1 (en) |
| CN (1) | CN100530761C (en) |
| TW (1) | TWI343761B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202016102752U1 (en) * | 2016-05-24 | 2017-08-25 | Kuka Systems Gmbh | manufacturing station |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4954434B2 (en) | 2002-05-17 | 2012-06-13 | 株式会社半導体エネルギー研究所 | Manufacturing equipment |
| KR100649982B1 (en) | 2005-08-26 | 2006-12-08 | 주식회사 탑 엔지니어링 | Protecting cap attachment processing line and protecting cap attachment method using the same |
-
2005
- 2005-12-05 KR KR1020050117701A patent/KR101189774B1/en not_active IP Right Cessation
-
2006
- 2006-11-10 TW TW095141746A patent/TWI343761B/en not_active IP Right Cessation
- 2006-12-01 CN CNB2006101609099A patent/CN100530761C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1979919A (en) | 2007-06-13 |
| TW200735694A (en) | 2007-09-16 |
| TWI343761B (en) | 2011-06-11 |
| KR101189774B1 (en) | 2012-10-10 |
| KR20070058886A (en) | 2007-06-11 |
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Granted publication date: 20090819 Termination date: 20161201 |