CN100525582C - Method of forming circuit pattern on printed circuit board - Google Patents
Method of forming circuit pattern on printed circuit board Download PDFInfo
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- CN100525582C CN100525582C CNB2006101286603A CN200610128660A CN100525582C CN 100525582 C CN100525582 C CN 100525582C CN B2006101286603 A CNB2006101286603 A CN B2006101286603A CN 200610128660 A CN200610128660 A CN 200610128660A CN 100525582 C CN100525582 C CN 100525582C
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- etchant
- circuit pattern
- ink
- insulated substrate
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
Abstract
A method of forming circuit patterns on a printed circuit board is disclosed. The method of forming circuit patterns on a printed circuit board comprising: (a) applying etchant on portions of an insulation substrate where the circuit patterns are to be formed, (b) curing the etchant by adjusting curing conditions, (c) applying metal ink on the etched circuit patterns, and (d) sintering the metal ink, allows a great reduction in production costs, since the processes of applying photoresist (PR), exposing, and developing can be eliminated to simplify the overall process, and the circuit patterns of printed circuit boards can be formed minutely and with precision with a fewer number of processes and less time.
Description
The cross reference of related application
The application requires the priority of the korean patent application submitted to Korea S Department of Intellectual Property on September 2nd, 2005 2005-0081578 number, and its full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of formation method of circuit pattern, more specifically, relate to a kind of method that on printed circuit board (PCB), forms circuit pattern.
Background technology
Usually, by on insulated substrate, carrying out the circuit pattern that technologies such as copper facing, coating photoresist, exposure, development and etching form printed circuit board (PCB).Simultaneously,, require chip component should have small size and more function, have low cost again along with nearest electronic product trends towards small size and has greater functionality.The technology that so just need form circuit pattern on printed circuit board (PCB) obtains technical improvement.
The figure of Fig. 1 (a) is to figure (f) forming process figure, and this flow chart illustrates the technology that forms circuit pattern on printed circuit board (PCB) according to prior art.Describe in the process of traditional handicraft at reference Fig. 1, the base material 1 that is used to make printed circuit board (PCB) comprise metal level 5,5 on each upper and lower surface that is positioned at insulating barrier 3 '.
In order on this base material 1, to form circuit pattern; with underseal (etchingresist) 6,6 ' be coated on metal level 5,5 ' the surface on; diaphragm 7,7 ' be formed on underseal 6,6 ' the surface on, subsequently circuit film (circuit film) is stacked on diaphragm 7,7 ' the surface on.
At stacked circuit film 8,8 ' afterwards with its exposure.That is, shown in Fig. 1 (b), when with ultraviolet irradiation on the upper and lower surface of base material the time, light do not shine be coated in non-transmissive portions 9 corresponding locational underseals 6,6 ' on, and shine on the rest parts.Thus, make underseal 6,6 ' partially hardened, and do not have irradiated part to keep its original state by irradiation.
Then, remove circuit film 8,8 ' and diaphragm 7,7 '.Fig. 1 illustrates the state of removing circuit film.In (c) of Fig. 1,, and be in hardening state by underseal 6,6 ' part that illumination is mapped to the underseal 6,6 of non-transmissive portions 9 opposite positions ' be in unhardened original state.
Then, the base material 1 of getting rid of film is immersed in the developer solution, to carry out developing procedure.When immersing base material in the developer solution, the underseal 6,6 of sclerosis ' be not removed but it is remained on the base material 1, but removed underseal 6,6 ' unhardened part, with expose metal level 5,5 '.The state that (d) of Fig. 1 shows developing procedure after finishing.
Above-mentioned technology is to utilize " minus " example (negativetype) of negativity film (negative film), and also can use the reverse of " eurymeric (positive type) ", wherein, through the part of irradiation and unhardened but be decomposed, and the part that does not shine is hardened and keep as etch-resistant coating (resist).
Then, the base material 1 of finishing developing procedure is immersed etchant.When base material 1 is immersed etchant, leave underseal 6,6 ' metal level 5,5 ' part still be kept perfectly, but will be owing to metal level 5,5 ' part removal of having removed underseal 6,6 ' expose, to expose the insulating barrier 3 of inside.It is shown in (e) of Fig. 1.
Here, do not have removed metal level 5,5 ' remainder form circuit pattern, and residual underseal 6,6 ' removal is finished circuit pattern C to expose metal level 5,5 ' time on metal level 5,5 ' surface.It is shown in (f) of Fig. 1.
After forming circuit pattern C and finishing, the technology manufacturing printed circuit board (PCB) that waits by coating such as PSR (photosensitive solder resist agent (photo solder resist)).Therebetween, when forming the printed circuit board (PCB) that constitutes by multilayer, form new insulating barrier and metal level by electroplating, and repeat above-mentioned operation.
Yet, cause following defective according to the formation method of the circuit pattern of the printed circuit board (PCB) of prior art.
At first,, must use circuit film 8,8 ' (being called as photomask) optionally in the exposure process underseal 6,6 ' carry out.Yet, owing to realize circuit films 8,8 ' be attached to base material 1 by various operations, circuit film 8,8 ' size may be according to deforming such as conditions of work such as temperature and humidities.The distortion of these sizes has caused the decline of the circuit pattern accuracy that forms on the printed circuit board (PCB).
Secondly because design protection film 7,7 ' and base material 1 must consider circuit film 8,8 according to condition of work ' and the size distortion of base material 1 simultaneously, so that design process becomes is complicated more.Although in some cases, use glass substrate as diaphragm 7,7 ' optional material, with avoid diaphragm 7,7 ' size distortion because glass substrate is difficult to handle and the cost costliness, thus be difficult to use they.
Therebetween, previous invention relates to a kind of method of utilizing ink-jet printing technology to form circuit pattern, to handle the problems referred to above of prior art in the circuit pattern that forms printed circuit board (PCB), wherein, wiring pattern according to conducting channel, partly remove insulated substrate by laser beam, and on the part of removing, form circuit by ink-jet technology.Yet, require to add laser equipment and laser technology like this.
Also have a kind of invention, it may further comprise the steps: utilize adhesive tape to form adhesion layer, form wiring pattern by the method for using droplet ejection (droplet ejection method), form circuit by drying up (blow-drying) subsequently.Yet, owing to using ink jet printing, must carry out wiring pattern and form the technology several times, with the circuit pattern of acquisition expectation thickness, and in this technical process, there is the danger of make a mistake (for example inhomogeneities and short circuit).
Summary of the invention
The object of the present invention is to provide a kind of method that on printed circuit board (PCB), forms circuit pattern, this method has been simplified the formation technology of circuit pattern, the circuit pattern of desired thickness is provided easily and at an easy rate, and has allowed to form circuit pattern with degree of precision.
An aspect of of the present present invention provides a kind of method that forms circuit pattern on printed circuit board (PCB), this method comprises: (a) etchant is coated on the insulated substrate part that will be formed with circuit pattern, (b) by regulating condition of cure etchant is solidified, (c) metal ink is coated in the etched circuit pattern, and (d) sintering metal printing ink.
Preferably, can be by ink jet printing executable operations (a) or operation (c).Preferably, insulated substrate can be a polyimide substrate, and etchant can be the etchant that is used for polyimide resin.Sintering condition may comprise temperature and time.Preferably, metal ink comprises size and is the metal particle of 1nm to 100nm.
A kind of printed circuit board (PCB) also is provided, it comprises: insulated substrate, with the surface of the corresponding insulated substrate of part that will form circuit pattern on the groove (trench) that forms and be packed in the groove and form the conductive layer of circuit pattern, wherein, form groove by etching, and form conductive layer by sintering metal printing ink.
Preferably, can utilize ink jet printing on insulated substrate, to print etchant and by the adjusting condition of cure etchant is solidified subsequently and form groove.Preferably, utilize ink jet printing to be packed into metal ink in the groove and to be dried subsequently and form conductive layer with sintering.
Preferably, insulated substrate is a polyimide substrate, and etchant is the etchant that is used for polyimide resin.Metal ink can comprise that size is the metal particle of 1nm to 100nm.Preferably, the degree of depth of groove can and be less than or equal to the thickness of insulated substrate more than or equal to 10 μ m.
Other features of the present invention will be explained by following description, and partly will become apparent by following description, perhaps can obtain by practice of the present invention.
Description of drawings
Fig. 1 illustrates the procedure chart that forms the technology of circuit pattern on printed circuit board (PCB) according to prior art.
Fig. 2 illustrates the flow chart that forms the technology of circuit pattern on printed circuit board (PCB) according to the embodiment of the invention.
Fig. 3 illustrates the procedure chart that forms the technology of circuit pattern on printed circuit board (PCB) according to the embodiment of the invention.
Embodiment
Hereinafter, embodiment of the present invention will be described in more detail with reference to the accompanying drawings.In the description of reference accompanying drawing, no matter whether figure number identical, those identical or corresponding parts adopt identical reference number, and omit unnecessary explanation.
Fig. 2 illustrates the flow chart that forms the technology of circuit pattern on printed circuit board (PCB) according to the embodiment of the invention.
The invention is characterized in a kind of method that on printed circuit board (PCB), forms circuit pattern, wherein, the technology of removal such as plating, exposure and etching etc. (typical very consuming time and expensive circuit pattern forms technology), and by spray etchant and metal ink formation circuit pattern according to ink jet printing method, with the adjusting that precise and tiny pattern is provided and realizes pattern width.
, at first etchant is coated on the part of the insulated substrate that will be formed with circuit pattern (100), that is for this reason, and on the base material of printed circuit board (PCB).With by using plating insulating substrate such as copper laminated material and comparing with the prior art that the after etching some parts forms circuit pattern, the invention is characterized in and directly on insulated substrate, form circuit pattern, wherein, before plating printing ink, etching will form the part of circuit pattern, to obtain the circuit pattern of desired thickness.
Though, usually polyimide substrate is used as insulated substrate, the present invention is not limited thereto, also can use the insulated substrate of other type in the scope that it will be apparent to those skilled in the art.
Same as the prior art, circuit pattern is based on one group of given design, and according to the coating of the circuit pattern in the scope that it will be apparent to those skilled in the art etchant.Yet, as described below, because the circuit pattern in the embodiment of the invention forms by utilizing ink jet printing plating printing ink, so preferably, also can apply etchant by ink jet printing.In this case, if utilize ink-jet printing apparatus coating etchant, then can directly etchant be printed on the insulated substrate, and need not to form the independent operation of mask, so that the maximizing efficiency of operation according to the CAD/CAM software of circuit pattern in conjunction with the design circuit patterns.
Because be used to apply the part of the etchant etching insulated substrate of circuit pattern, to be printed with the groove of metal ink to form, so just must use can carry out etched suitable etchant corresponding to etching insulated substrate material.Therefore, as mentioned above, when with polyimide substrate when the insulated substrate, expectation is used for the etchant of polyimide resin, and for the insulated substrate of other material, the expectation use can be carried out corresponding etched etchant.
Because polyimide substrate is not only insulated substrate, also be base material with high durability and corrosion resistance, so that the stable printing circuit board to be provided, so compare with the substrate of other material, it is relatively more difficult etched.Therefore, when polyimide substrate during as the insulated substrate in the embodiment of the invention, be should be noted that the selection etchant.Any known product in the scope that it will be apparent to those skilled in the art can be with the etchant that acts on polyimide resin, and the detailed description for the chemical composition of etchant and chemical constitution etc. no longer is provided.
Then, regulate condition of cure to solidify etchant (110).Along with etchant is coated on the insulated substrate, insulated substrate is etched and be cured under suitable condition.Because, in order to obtain the circuit pattern of desired thickness, must in insulated substrate, form by corresponding etched groove, regulate condition of cure according to the material of insulated substrate and the characteristic of etchant, so form and be etched into groove with suitable thickness.
Condition of cure is relevant with temperature and time usually, and expects to obtain in advance the data of temperature or time, is used for the thickness with respect to the characteristic etching specified quantitative of insulated substrate material and the corresponding etchant of choosing.In embodiments of the present invention, can provide that (that is) data, temperature or time are perhaps collected data about condition of cure by battery of tests in advance about condition of cure by the etchant manufacturer.
Then, because the curing of etchant and metal ink is coated on the insulated substrate in the etched circuit pattern (120).As mentioned above, by the etching of insulated substrate, with the form of the groove of the corresponding degree of depth of circuit pattern desired thickness, obtain etched circuit pattern.Therefore, for by metal ink being coated in the circuit pattern that obtains desired thickness in the etched circuit pattern, expect to realize coating by utilizing metal ink to fill etched groove.
If fill etched groove without metal ink, the circuit pattern that then may not can obtain desired thickness, if and etched groove excessively is filled with metal ink, then metal ink spills on the surface of insulated substrate, thereby has caused the problem in the technology of piling up of short risk in the circuit pattern and multilayer board.
Same as the prior art, based on one group of given design, carry out and to utilize metal ink to fill circuit pattern, simultaneously in the scope that it will be apparent to those skilled in the art according to circuit pattern plating printing ink.Yet, more preferably identical with the situation of etchant, by ink jet printing plating printing ink.
In this case, identical with the situation of etchant, if utilize ink-jet printing apparatus plating printing ink, can in conjunction with the CAD/CAM software that is used for the design circuit pattern metal ink directly be printed on insulated substrate according to circuit pattern, and need not form the independent operation of mask.In addition, if ink gun (inkjet head) is arranged to use etchant and metal ink, then can utilize single ink-jet printing apparatus to carry out the printing of etchant and metal ink, so that the maximizing efficiency of operation.
When by ink jet printing coating etchant and metal ink, utilize single ink-jet printing apparatus and, can carry out the circuit pattern of printed circuit board (PCB) easily in conjunction with the CAD/CAM software program.
Simultaneously, as mentioned above, when using ink jet printing, for according to filling metal ink in the circuit pattern groove that etching forms on insulated substrate, must be with respect to the depth adjustment of groove amount from the metal ink of ink gun ejection.For this reason, print speed printing speed, the size of nozzle and the expulsion pressure of printing ink etc. of control ink gun.The emitted dose of control printing ink is conspicuous to those skilled in the art, will no longer provide detailed description in this case.
For the metal ink that sprays during the ink jet printing, the printing ink of use comprises the metal particle with nanometer scale size.So just allow to carry printing ink and make printing ink pass through nozzle ejection with stable manner in the ink chamber of ink gun, preferably, the size that is included in the metal particle in the metal ink is about 1nm to 100nm.Yet, the size that is included in the metal particle in the metal ink according to the embodiment of the invention is not limited in the above-mentioned number range, and should be appreciated that the metal ink that also can use the metal particle that comprises other size in the scope that it will be apparent to those skilled in the art that.
At last, sintering (that is, be dried and fire) metal ink (130) is to finish circuit pattern.Because metal ink liquid normally, then forming on insulated substrate in the process of circuit pattern must bone dry and fire coated metal ink, for this reason, expects that sintering under suitable condition is printed on the metal ink on the printed circuit board (PCB).
Fig. 3 is the procedure chart that forms the technology of circuit pattern on printed circuit board (PCB) according to the embodiment of the invention.Insulated substrate shown in Fig. 33, etchant 10, groove 12 and metal ink 20.
Below, with reference to the technology that on printed circuit board (PCB) forms circuit pattern of Fig. 3 detailed description according to the embodiment of the invention.
Shown in Fig. 3 (a), the first step is a preparation insulated substrate 3.Compared with prior art, embodiments of the invention comprise the technology of removal such as coating photoresist, exposure and development etc., and comprise and utilize ink-jet printer direct formation circuit pattern on the surface of insulated substrate 3 (for example, polyimide substrate).Therefore, the formation technology of circuit pattern can need not to be electroplate with the substrate of metal level (for example, copper clad panel (CCL) etc.) only from insulated substrate 3.
Second step was the corresponding etchant 10 of material of coating and insulated substrate 3, shown in Fig. 3 (b).From the scope that allows etching insulated substrate 3, select etchant 10.In step 2, utilize ink-jet printer to be printed on and the corresponding part of circuit pattern by the etchant 10 that will be used for insulated substrate 3, apply etchant 10.
That is, etchant 10 optionally is coated on the surface of insulated substrate 3, that is, is coated on the base material of printed circuit board (PCB).For this reason, () printing equipment for example, the size of circuit pattern, area and shape etc., optionally the form of circuit pattern (that is, with) directly prints etchant 10 on the surface of insulated substrate 3 to utilize the various data received from CAD system.
The 3rd step was to solidify coated etchant 10, and shown in Fig. 3 (c), thereby beginning to carry out from the surface of insulated substrate 3 is etched with the degree of depth that reaches specific.On the surface of insulated substrate 3, apply etchant 10 and make its curing by this, on insulated substrate 3, form groove 12 owing to etching, wherein, when the etch depth of regulating groove 12 and when being filled with metal ink 20 therein, can obtain the circuit pattern of desired thickness.
Insulated substrate 3 is etched into desired depth needs suitable condition of cure, and usually by regulating the etching form of etch temperature and etching period acquisition expectation.
On insulated substrate 3, apply etchant 10 and it is solidified by this, remove the part that is coated with etchant 10 in the insulated substrate 3, to produce the profile of groove 12, shown in Fig. 3 (c).
Equally, although the surface of insulated substrate 3 is smooth, but the surface of the groove 12 that forms owing to etching has roughness, thus, can obtain extra surface improvements effect, be used for increasing by fill wiring that metal inks 20 form and the adhesive force between the insulated substrate 3 at groove 12.
The 4th step was a plating printing ink 20 in etched groove 12, shown in Fig. 3 (d).Here, in order to utilize ink-jet printing apparatus plating printing ink 20, the metal ink that uses comprises the metal with nanometer scale size, and after in the ink chamber that metal ink 20 is filled into ink gun, use printing equipment (for example, ink-jet printer) printing etched groove 12 parts (circuit pattern).
Utilization receives about the ink-jet printing apparatus after the data of the circuit pattern of design in advance from CAD system, prints the etchant 10 and the metal ink 20 in the 4th step of the above-mentioned first step.After type metal printing ink 20, shown in Fig. 3 (e), carry out drying and burning process, to finish the circuit pattern of printed circuit board (PCB).
Simultaneously, in order to be applied to make the printed circuit board (PCB) of multilayer, need to repeat above-mentioned technology simply and constantly pile up these layers for every layer based on the method for the formation pattern circuit of the embodiment of the invention.
Owing to guarantee that the development and the exposure technology that need not prior art by direct etching form circuit pattern and form circuit pattern thereon, pass through very simple technology according to the method permission that on printed circuit board (PCB), forms circuit pattern of the embodiment of the invention and form circuit pattern.
Promptly, optionally will be used for etched suitable etchant 10 and be printed on insulated substrate 3 (promptly, the base material of printed circuit board (PCB)) on the surface, then metal ink 20 is packed in the etched part, finishing circuit pattern, thereby can remove the technology of coating etchant, exposure and development in the technology that forms circuit pattern according to prior art and the additional technology that is used to carry out these technologies.
In addition, shown in Fig. 3 (e), the present invention relates to printed circuit board (PCB), the groove 12 that this printed circuit board (PCB) comprises insulated substrate 3, form and be packed into conductive layer in the groove 12 on the surface of insulated substrate 3.
Though can the method by in various conspicuous for those skilled in the art scopes form groove 12, preferably, by on the surface that etchant 10 is coated on insulated substrate 3 and be solidified to form groove.When forming groove 12 by etching, by the control condition of cure, groove 12 can form the degree of depth of expectation, and this condition of cure can comprise time and temperature.
Because the groove 12 that forms by etching so etching is a kind of method that the bonus effect of surface modification is provided, is used for increasing the electric conducting material that is packed into groove 12 and insulated substrate 3 because chemical reaction has the surface roughness greater than insulated substrate 3.
Although can making in the scope that it will be apparent to those skilled in the art ins all sorts of ways etchant 10 is coated on the surface with the corresponding insulated substrate 3 of the shape of circuit pattern, preferably, uses ink jet printing.When using ink jet printing, the cad data of circuit pattern about design in advance can be sent to ink-jet printing apparatus, with direct printing etchant 10, thus, on the surface of circuit pattern design and insulated substrate 3, form between the groove 12 and need not extra technology, and simplified whole technology.
After groove 12 forms desired depth, electric conducting material is packed in the groove 12, to form circuit pattern.Although can form the conductive layer that is packed in the circuit pattern by arbitrary electric conducting material in the conspicuous scope to those skilled in the art, expectation forms by sintering metal printing ink 20.
In order to ensure effective application of the metal ink 20 by ink jet printing, expectation comprises the metal particle of nanometer scale size according to the metal ink 20 of the embodiment of the invention, for example, and from 1nm to 100nm.
Simultaneously, identical with traditional printed circuit board (PCB), can use polyimide substrate as insulated substrate 3 according to the printed circuit board (PCB) of the embodiment of the invention.Yet,, need choose the etchant 10 that is used to form groove 12 carefully according to the embodiment of the invention because the characteristic of polyimide substrate comprises durability and the corrosion resistance that it is good.That is the etchant 10 that, is used for polyimide resin.
About printed circuit board (PCB) based on the embodiment of the invention, be pre-formed groove 12 in the position that will form circuit pattern, subsequently electric conducting material is packed in the groove 12, forming circuit pattern, thereby obtain circuit pattern with the corresponding thickness of groove 12 degree of depth.Therefore, the degree of depth of groove 12 forms corresponding to the desired thickness of circuit pattern, and, regulate the curing time or the curing temperature of etchant 10, thereby form the groove 12 of 10 μ m thickness or bigger thickness when the degree of depth of expectation circuit pattern is 10 μ m or when bigger.
According to comprising above-mentioned the present invention, owing to can remove coating photoresist (PR), exposure and developing process to simplify whole technology, can reduce the manufacturing cost of printed circuit board (PCB) widely, and can be by spending the circuit pattern that a spot of technology and time accurately form printed circuit board (PCB).
Equally, because utilize various etchants groove to be formed directly on the base material surface that will be formed with the circuit pattern position by ink-jet printing apparatus, and form circuit pattern by in groove, filling nano metal printing ink, so at the circuit pattern that can obtain aspect size and the external form than high precision with identical method.
In addition, owing to can obtain circuit pattern with the corresponding thickness of the degree of depth of groove by the condition of cure of regulating etchant, thus can solve by directly on insulated substrate printing nano metal printing ink form the problem that can't obtain the circuit pattern of desired thickness in the technology of circuit pattern.
Although described purport of the present invention in detail with reference to certain embodiments, these embodiment are exemplary, are not limited to the present invention.Should be appreciated that for a person skilled in the art, do not deviating under the situation that claims and its be equal to the spirit and scope of the invention that replacement limits, the present invention can have various changes and variation.
Claims (13)
1. method that on printed circuit board (PCB), forms circuit pattern, described method comprises:
(a) etchant is coated on the insulated substrate part that will form circuit pattern;
(b) solidify described etchant by regulating condition of cure;
(c) metal ink is coated in the etched described circuit pattern; And
(d) the described metal ink of sintering.
2. method according to claim 1, wherein, by ink jet printing executable operations (a) or operation (c).
3. method according to claim 1, wherein, described insulated substrate is a polyimide substrate.
4. method according to claim 3, wherein, described etchant is the etchant that is used for polyimide resin.
5. method according to claim 1, wherein, condition of cure comprises temperature and time.
6. method according to claim 1, wherein, described metal ink comprises size and is the metal particle of 1nm to 100nm.
7. printed circuit board (PCB), it comprises:
Insulated substrate;
Groove, be formed on the surface of the corresponding described insulated substrate of part that will be formed with circuit pattern on; And
Conductive layer is packed in the described groove and forms described circuit pattern,
Wherein, described groove forms by etching, and described conductive layer forms by sintering metal printing ink.
8. printed circuit board (PCB) according to claim 7, wherein, described groove forms by using ink jet printing to print etchant and solidify described etchant by the adjusting condition of cure subsequently on described insulated substrate.
9. printed circuit board (PCB) according to claim 7, wherein, described conductive layer forms by using ink jet printing to fill metal ink and carry out drying and sintering subsequently in described groove.
10. printed circuit board (PCB) according to claim 7, wherein, described insulated substrate is a polyimide substrate.
11. printed circuit board (PCB) according to claim 10, wherein, being used for etched etchant is the etchant that is used for polyimide resin.
12. printed circuit board (PCB) according to claim 7, wherein, described metal ink comprises size and is the metal particle of 1nm to 100nm.
13. printed circuit board (PCB) according to claim 7, wherein, the thickness of described insulated substrate is more than or equal to 10 μ m, and the degree of depth of described groove is more than or equal to 10 μ m and be less than or equal to the thickness of described insulated substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050081578A KR100643934B1 (en) | 2005-09-02 | 2005-09-02 | Method of forming circuit pattern of pcb |
| KR1020050081578 | 2005-09-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1925724A CN1925724A (en) | 2007-03-07 |
| CN100525582C true CN100525582C (en) | 2009-08-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101286603A Expired - Fee Related CN100525582C (en) | 2005-09-02 | 2006-09-04 | Method of forming circuit pattern on printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20070062723A1 (en) |
| JP (1) | JP2007073955A (en) |
| KR (1) | KR100643934B1 (en) |
| CN (1) | CN100525582C (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117997A (en) * | 2006-11-07 | 2008-05-22 | Seiko Epson Corp | Method of manufacturing electronic substrate |
| CN104228324B (en) * | 2008-05-09 | 2017-12-01 | 斯塔诺阿埃索澳吉有限公司 | Equipment, method, dielectric base and the chipset of conductive pattern are formed in substrate |
| KR100992187B1 (en) * | 2008-08-28 | 2010-11-04 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| CN101730389B (en) * | 2008-10-15 | 2011-12-14 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101521998B (en) * | 2009-04-01 | 2011-03-30 | 杭州新三联电子有限公司 | Brush-throwing machine for removing protruding ink at two ends of conducting hole of printed circuit board and removing method thereof |
| CN102045952B (en) * | 2009-10-15 | 2012-12-19 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board insulating protective layer |
| CN102193043A (en) * | 2010-03-08 | 2011-09-21 | 瑞统企业股份有限公司 | Testing integration method for bare board of circuit board |
| CN103369451B (en) * | 2013-07-08 | 2016-03-16 | 浙江工业职业技术学院 | Production technology of ribbon-type high-pitch diaphragm |
| US9508667B2 (en) * | 2014-12-23 | 2016-11-29 | Intel Corporation | Formation of solder and copper interconnect structures and associated techniques and configurations |
| JP6944197B2 (en) | 2015-06-04 | 2021-10-06 | カティーバ， インコーポレイテッド | Method for manufacturing etch resist pattern on metal surface |
| CN114397795A (en) * | 2015-08-13 | 2022-04-26 | 柯狄公司 | Method for producing etch-resistant patterns on metal surfaces |
| US9504148B1 (en) | 2015-12-02 | 2016-11-22 | Honeywell Federal Manufacturing & Technologies, Llc | Rapid PCB prototyping by selective adhesion |
| GB2551383A (en) * | 2016-06-17 | 2017-12-20 | Sumitomo Chemical Co | Fabrication of organic electronic devices |
| CN107949162A (en) * | 2017-11-16 | 2018-04-20 | 深圳市华星光电技术有限公司 | The production method of double-sided wiring board |
| CN108897450B (en) * | 2018-06-30 | 2021-12-03 | 广州国显科技有限公司 | Touch panel, manufacturing method thereof and display device |
| TWI690167B (en) * | 2018-10-31 | 2020-04-01 | 瑞昱半導體股份有限公司 | Decoding method for low-density parity-check code and system thereof |
| US10531568B1 (en) * | 2019-01-22 | 2020-01-07 | Honeywell Federal Manufacturing & Technologies, Llc | Circuit board interconnect decals |
| TWI751568B (en) * | 2020-05-29 | 2022-01-01 | 新應材股份有限公司 | Etchant composition, tackifier, alkaline solution, method of removing polyimide and etching process |
| CN114007346A (en) * | 2021-10-26 | 2022-02-01 | 武汉天喻信息产业股份有限公司 | Multilayer circuit board manufacturing method and multilayer circuit board |
| CN114980491A (en) * | 2022-06-16 | 2022-08-30 | 常州明耀半导体科技有限公司 | Printed circuit board and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103033A (en) * | 1998-03-04 | 2000-08-15 | Therasense, Inc. | Process for producing an electrochemical biosensor |
| TW484101B (en) * | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
| JP3867523B2 (en) * | 2000-12-26 | 2007-01-10 | 株式会社デンソー | Printed circuit board and manufacturing method thereof |
-
2005
- 2005-09-02 KR KR1020050081578A patent/KR100643934B1/en not_active IP Right Cessation
-
2006
- 2006-08-30 JP JP2006233337A patent/JP2007073955A/en active Pending
- 2006-09-01 US US11/514,079 patent/US20070062723A1/en not_active Abandoned
- 2006-09-04 CN CNB2006101286603A patent/CN100525582C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100643934B1 (en) | 2006-11-10 |
| CN1925724A (en) | 2007-03-07 |
| US20070062723A1 (en) | 2007-03-22 |
| JP2007073955A (en) | 2007-03-22 |
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