CN100523978C - Apparatus array and its manufacturing method - Google Patents
Apparatus array and its manufacturing method Download PDFInfo
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- CN100523978C CN100523978C CNB200510105048XA CN200510105048A CN100523978C CN 100523978 C CN100523978 C CN 100523978C CN B200510105048X A CNB200510105048X A CN B200510105048XA CN 200510105048 A CN200510105048 A CN 200510105048A CN 100523978 C CN100523978 C CN 100523978C
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Abstract
Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices 100 in an array 85 are provided wherein a gap 123 between the display devices 100 is reduced to less than or equal to 1/8 th of a pixel pitch. Exemplary embodiments use wire bonding 125 to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.
Description
Technical field
The present invention relates to be used for device is arranged into the Apparatus and method for of an interconnection array.More specifically, the present invention relates to a kind of interferometric devices array, it has one and minimizes outburst area to produce a big specification image between each device.
Background technology
Display device can be attached to each other by tiling, wherein relates to a plurality of display device are placed adjacent to each other to form a bigger system.Tiling is particularly useful for making up bigger display, and is applicable to the largest monitor that can the produce situation less than needed size of display.For example, a billboard or other direction boards can't be made by a monolithic glass too greatly usually.In addition, making the price of a sheet of glass may be quite high.Therefore, tiling mode can be by making a big display than small displays and be used as a low-cost substitute mode from some.
In case finish, then tiled displays can be used as a giant display basically.For example, it can produce a single complete image.Because it tiles, so described array has extra advantage: in the time need producing different distributed image generation on looking like a single display screen, it allows the separation of a plurality of images.
Generally speaking, when in an array that display device is tiled, between the viewing area of the viewing area of a device and neighboring devices, there is a void area.When void area is discovered by spectators, this void area will limit the picture quality of giant display.
Summary of the invention
One embodiment of the invention are an apparatus array, comprising:
One first device, it comprises: one comprises that a substrate, one first zone of action and are electrically connected the encapsulation in zone, the wherein said zone that is electrically connected is configured to provide electric connection with described first zone of action, and the width in wherein said electrical connection zone is less than 1 millimeter; One sealing ring around described first zone of action; One joins described sealing ring to form the base plate of described encapsulation, and wherein said electrical connection zone is arranged between the edge of described seal and described substrate; Reach one second device, it comprises one second zone of action and is adjacent to place with the described zone that is electrically connected of described first device.
Another embodiment of the present invention is for making the method for a display device array, it comprises: one first display device is provided, it comprises: one comprises that a substrate, one first zone of action and one are electrically connected the display encapsulation in zone, and the wherein said zone that is electrically connected is configured to provide electric connection with described first zone of action; One sealing ring around described first zone of action; One joins described sealing ring to form the base plate of described display encapsulation; Wherein said electrical connection zone is arranged between the edge of described sealing and described substrate; One second display device that comprises one second zone of action is provided; And described first display device and described second display device are put together, make that the described zone of action of described second display device is adjacent with the described zone that is electrically connected of described first display device, the wherein said width that is electrically connected the zone is less than or equal to 1 millimeter.
Another embodiment of the present invention is to make the method for a display device array: one first display device is provided, it comprises: one comprises that a substrate, one first zone of action and one are electrically connected the display encapsulation in zone, and the wherein said zone that is electrically connected is configured to provide electric connection with described first zone of action; One sealing ring around described first zone of action; One joins described sealing ring to form the base plate of described display encapsulation; Wherein said electrical connection zone is arranged between the edge of described seal and described substrate; One second display device that comprises one second zone of action is provided; And described first display device and described second display device are put together, make that the described zone of action of described second display device is adjacent with the described zone that is electrically connected of described first display device, the wherein said width that is electrically connected the zone is less than or equal to 1 millimeter.
One additional embodiment is an apparatus array, and it comprises: one first device, and described first device comprises: be used for transmission and pass wherein optical transmission member; Be used to modulate first movable part of the light that transmission passes described transmission member; Be used to provide the electrical connecting member with the electric connection of described first movable part, the width of wherein said electrical connecting member is less than 1 millimeter; Be used for the containment member of a sealant around described first movable part; Be used to form the covering member of an encapsulation of described transmission member, described first movable part and described containment member, wherein said electrical connecting member is arranged in the zone between the edge of described containment member and described transmission member; And one second device, described second device comprises and is used for catoptrical one second movable part, and places and the described first adjacent part of described electrical connecting member of installing.
Description of drawings
Fig. 1 is the isometric view of a part of describing an embodiment of an interferometric modulator display, and wherein the removable reflection horizon that is in an off-position and one second interferometric modulator, one of one first interferometric modulator removable reflection horizon is in an energized position.
Fig. 2 incorporates the system block diagram of an embodiment of the electronic installation that one 3 * 3 interferometric modulator displays are arranged into for explanation one.
Fig. 3 is the removable mirror position of an one exemplary embodiment of Fig. 1 interferometric modulator and the graph of a relation of the voltage that applies.
Fig. 4 explanation can be used for driving the one group of row voltage and the column voltage of an interferometric modulator display.
Exemplary frame of display data in 3 * 3 interferometric modulator displays of Fig. 5 A key diagram 2.
Fig. 5 B explanation can be used for writing the capable signal of frame shown in Fig. 5 A and an exemplary sequential chart of column signal.
Fig. 6 A is the sectional view of a device shown in Figure 1.
Fig. 6 B is a sectional view of an alternate embodiment of an interferometric modulator.
Fig. 6 C is a sectional view of another alternate embodiment of an interferometric modulator.
Fig. 7 is the sectional view that is used for a basic encapsulating structure of a MEMS device.
Fig. 8 is the exploded view of an embodiment of a display, and wherein a P.e.c. carriage is welded to a backboard.
Fig. 9 one has an one exemplary embodiment of the display device that reduces footprint area (footprint).
Figure 10 one has the exploded view of an one exemplary embodiment of the display device that reduces footprint area.
Figure 11 A and Figure 11 B are graphic for the embodiment's of the tiling of showing described display.
Figure 12 A and Figure 12 B are the system block diagram that an embodiment of a visual display unit that comprises a plurality of interferometric modulators is described.
Embodiment
One embodiment of the invention are a giant display of being made up of a plurality of indivedual display device.Described indivedual display device is placed adjacent to each other with the method that is known as tiling, so they form a big display.In this embodiment, the edge between each indivedual display device is minimized, makes can not discover described edge when spectators watch described giant display attentively.
Below describe in detail at some embodiments of the invention.But the present invention can implement by different ways.Will be in this describes referring to accompanying drawing, similar in the accompanying drawings parts use the similar elements symbol from start to finish.To be not difficult to find that the present invention can be at any motion ground (for example, video) or (for example, rest image) and show with the form of text or picture in the device of an image and implement still of being configured to according to following description.More specifically, expection can following various electronic installations in or implement the present invention explicitly with it: (but being not limited to) mobile phone for example, wireless device, personal digital assistant (PDA), handheld computer or hand-held computer, gps receiver/navigating instrument, video camera, the MP3 player, Video Camera, game console, wrist-watch, clock, counter, TV monitor, flat-panel monitor, computer monitor, automotive displays (for example, mileometer display etc.), driving cabin controller and/or display, the camera view display (for example, the rear view cameras display of vehicle), electronic photo, electronic bill-board or label, projector, building structure (for example, the layout of brick and tile), packing and aesthetic structures (for example, the image display of a jewelry).Also can be used in the non-display application such as transferred electron device with MEMS (micro electro mechanical system) (MEMS) device of the structural similarity of those devices described herein.
Fig. 1 explanation comprises an interferometric modulator display embodiment of an interfere type MEMS display element.In these devices, described pixel is in bright state or dark state.Under bright (" opening " or " opening ") state, described display element reflexes to the user with most of incident visible light.When being in dark (" pass " or " closing ") state, described display element can reflex to the user with the incident visible light hardly.According to the difference of described embodiment, can put upside down the light reflectance properties of " opening " and " pass " state.The MEMS pixel can be configured to the selected color of main reflection, thereby also allows display color except that showing black and white.
Fig. 1 is an isometric view of describing two neighbors in a series of pixels of a visual displays, and wherein each pixel comprises a MEMS interferometric modulator.In certain embodiments, an interferometric modulator display comprises delegation/column array of being made up of these interferometric modulators.Each interferometric modulator all comprises a pair of reflection horizon, and this places each other at a distance of one variable and controllable apart from part the reflection horizon, has at least one variable-sized optical resonator with formation.In one embodiment, a reflection horizon in the described reflection horizon can be moved between the two positions.In primary importance, this paper is called release conditions, described displaceable layers place with fixing partially reflection horizon at a distance of relatively large distance.In the second place, described displaceable layers places comparatively closely adjacent with partially reflecting layer.The position of depending on described removable reflection horizon, the incident light that reflects from described two layers be with mutually longways or interference mutually with disappearing, thereby produce a total reflection or non-reflective state for each pixel.
Pixel array portion shown in Fig. 1 comprises two adjacent interferometric modulator 12a and 12b.In the interferometric modulator 12a of on the left side, a removable high reflection layer 14a be illustrated as be in fixing partially reflecting layer 16a in an off-position of a preset distance.In the interferometric modulator 12b on the right, described removable high reflection layer 14b is illustrated as and is in the energized position adjacent with fixing partially reflecting layer 16b.
Fixed bed 16a, 16b be for conduction, partially transparent and for partial reflection, and can (for example) be deposited on the transparent substrates 20 by the layer with respectively do for oneself more than one or chromium and tin indium oxide and make.And subsequently these layer patterns are changed into parallel band, and can as hereinafter form column electrode in the display device with further describing.Described displaceable layers 14a, 14b can form the depositing metal layers that is deposited on pillar 18 tops or (some) depositing metal layers (and column electrode 16a, 16b quadrature) and be deposited on the series of parallel band of the intervention expendable material between the described pillar 18.When expendable material was etched, deformable metal layers was by separating with described fixed metal layer once the air gap 19 that defines.Highly conductive reflective material such as aluminium can be used for described deformable layer, and described band can form the row electrode in the display device.
If do not apply voltage, then chamber 19 remains between a layer 14a, the 16a and deformable layer is in the illustrated mechanical relaxation state just like the pixel 12a of Fig. 1.Yet when an electric potential difference being applied to a selected row and column, the column electrode at corresponding pixel place is recharged with the electric capacity of row electrode crossing place formation, and electrostatic force is moved these electrodes together to.If voltage is enough high, shown in the pixel 12b on right side among Fig. 1, displaceable layers deforms and is forced to prop up described fixed bed (dielectric material that is not illustrated in graphic can be deposited on the described fixed bed to prevent short circuit and to control spacing) so.Regardless of the polarity of the electric potential difference that is applied, this action is all identical.In this way, may command reflection is activated at a lot of aspects to the row/row of non-reflective pixel state and is similar to employed row in conventional LCD and other display techniques/row and encourages.
The example procedure and the system of an interferometric modulator array used in Fig. 2 to Fig. 5 B explanation one in display application.Fig. 2 can incorporate the system block diagram of an embodiment of the electronic installation of (some) of the present invention aspects into for explanation one.In described one exemplary embodiment, described electronic installation comprises a processor 21, and it can be any general purpose single-chip or multicore sheet microprocessor, as ARM,
Pentium
Pro, 8051,
Power
Or any special microprocessor, for example digital signal processor, microcontroller or programmable gate array.As the conventional situation in this technology, processor 21 can be configured to carry out one or more software module.Except that executive operating system, described processor can be configured to carry out one or more software application, comprising web browser, telephony application, e-mail program or any other software application.
In one embodiment, processor 21 can be configured to be communicated with an array controller 22 equally.In one embodiment, array control unit 22 comprises provides a horizontal drive circuit 24 and a column drive circuit 26 to pel array 30 with signal.Show the cross section of the illustrated array of Fig. 1 by the line 1-1 among Fig. 2.For the MEMS interferometric modulator, OK/the row excitation protocol can utilize the hysteresis property of these illustrated devices of Fig. 3.It may require the electric potential difference of (for example) one 10 volts to be deformed to foment to cause displaceable layers from release conditions.Yet, when voltage when described value reduces, displaceable layers is lower than 10 volts and still keep its state along with voltage drops to.In the one exemplary embodiment of Fig. 3, described displaceable layers can't discharge fully to drop to until voltage and be lower than 2 volts.Thereby, in the illustrated example of Fig. 3, there be the voltage range of about 3V to 7V, in described voltage range, there is a window that applies voltage, wherein said device stably is in release conditions or foment.This is called " lag windwo " or " stability window " in this article.For the display array of retarding characteristic with Fig. 3, OK/the row excitation protocol can be through design so that during the gating of being expert at, treat during gating is capable that actuated pixel is exposed to about 10 a volts voltage difference, and pixel to be discharged is exposed to one near 0 volt voltage difference.After the gating, it is poor that described pixel is exposed to about 5 a volts steady state voltage, makes it remain in capable gating and make its present any state.After writing, in described example, each pixel all experiences " stability window " interior electric potential difference of 3-7 volt.This characteristic makes the illustrated pixel design of Fig. 1 be stabilized under the condition that applies identical voltage in the foment or release conditions that is pre-existing in.Because no matter each pixel of interferometric modulator is in foment or release conditions, it all is a capacitor that is formed by described fixed reflector and removable reflection horizon basically, thereby described steady state (SS) can remain under the voltage in the lag windwo that inactivity almost consumes.If the electromotive force that is applied does not then have electric current to flow in the described pixel for what fix basically.
In the typical case uses, can be by determining that according to desired actuated pixels group in first row row electrode group produces a display frame.After this, horizontal pulse is applied to row 1 electrode, with the pixel of excitation corresponding to determined alignment.After this, determined row electrode group is become corresponding to desired actuated pixels group in second row.After this, a pulse is applied to row 2 electrodes, with according to the suitable pixel in the determined row electrode excitation capable 2.Row 1 pixel is not subjected to the influence of row 2 pulses, and remains in the state that its 1 impulse duration of being expert at is set.The row of whole series property mode in order repeats this process to produce frame.Generally speaking, repeat this process continuously by speed and refresh and/or upgrade these frames with new video data with certain required frame number/second.Be used to drive the column electrode of pel array and row electrode with the variety of protocol that forms display frame also for well-known, and can be in conjunction with using with the present invention.
Fig. 4, Fig. 5 A and Fig. 5 B explanation are used for producing the possible excitation protocol of display frame on 3 * 3 arrays shown in Figure 2.Fig. 4 explanation can be used for the one group of possible row and the voltage potential of going of the pixel of exploded view 3 hysteresis curves.In the embodiment shown in fig. 4, encouraging a pixel to comprise is set to suitable row-V
Bias voltage, and suitable row is set at+Δ V, it can correspond respectively to-5 volts and+5 volts.Discharging described pixel is by suitable row are set at+V
Bias voltageAnd suitable row is set at identical+Δ V, realize on pixel, to produce zero volt electric potential difference.The voltage of being expert at remain 0 volt those the row in, no matter described row are in+V
Bias voltageStill-V
Bias voltage, described pixel is stable in its initial residing any state.
Fig. 5 B is the sequential chart that a displaying is applied to a series of row and column signals of 3 * 3 arrays shown in Figure 2, and it causes and forms the illustrated display arrangement of Fig. 5 A, and wherein institute's actuate pixel is non-reflexive.Before writing the illustrated frame of Fig. 5 A, described pixel can be in any state, and in this example, and all row all are in 0 volt and all row and all are in+and 5 volts.With the voltage that these were applied, all pixels all are stable at its existing foment or release conditions.
In the frame shown in Fig. 5 A, pixel (1,1), (1,2), (2,2), (3,2) and (3,3) are energized.For realizing described excitation, during be expert at 1 " line time (line time) ", row 1 and row 2 are set at-5 volts and row 3 are set at+5 volts.This does not change the state of any pixel, because all pixels all remain in the stability window of 3-7 volt.After this, rise to 5 volts of pulses that are back to 0 volt that descend again then by one from 0 volt and come gating capable 1.This has encouraged pixel (1,1) and (1,2) and has discharged pixel (1,3).Other pixels in the described array are all unaffected.For according to set row 2 desiredly, row 2 are set at-5 volts, and row 1 and row 3 are set at+5 volts.After this, the same strobe pulse of the row that is applied to 2 is with actuate pixel (2,2) and discharge pixel (2,1) and (2,3).Equally, other pixels in the described array are all unaffected.Row 3 is by being set at row 2 and row 3-5 volts and row 1 are set at+5 volts and set similarly.The strobe pulse of row 3 is set row 3 pixels shown in Fig. 5 A.After writing incoming frame, the row electromotive force is 0, and described row electromotive force can remain on+5 volts or-5 volts, and after this described display is stable in the arrangement shown in Fig. 5 A.Should be appreciated that described same program can be used for tens of or hundreds of the arrays that row and column constitutes.Should be appreciated that equally the sequential, order and the electromotive force that are used to carry out the voltage of row energization and row excitation can alter a great deal in above-mentioned General Principle, and above-mentioned example only is exemplary, and any actuation voltage method all can be used for the present invention.
Details according to the structure of the interferometric modulator of above-mentioned principle operation can have a great difference.For example, three different embodiment of Fig. 6 A-Fig. 6 C explanation moving lens structure.Fig. 6 A is the sectional view of Fig. 1 embodiment, and wherein a strip of metal material 14 is deposited on the support member 18 of quadrature extension.In Fig. 6 B, described removable reflecting material 14 only is attached to the corner place of support member, on tethers 32.In Fig. 6 C, removable reflecting material 14 hangs on the deformable layer 34.Present embodiment is useful, and reason is that the structural design and the material therefor that are used for reflecting material 14 can be optimized aspect optical characteristics, and the structural design of deformable layer 34 and material therefor can be optimized aspect the desired mechanical property.The production of various types of interferometric device has been described in the many open source literatures that comprise the open application case of (for example) No. 2004/0051929 U.S..Various well-known technology can be used for producing said structure, wherein relate to a series of material depositions, encapsulation and etching step.
The moveable part of one MEMS device such as interferometric modulator array, preferably has a guard space that moves therein.Hereinafter the encapsulation technology that is used for the MEMS device will be described in more detail.Explanation is used for the synoptic diagram such as the basic encapsulating structure of the MEMS device of an interferometric modulator array in Fig. 7.As shown in Figure 7, a basic encapsulating structure 70 comprises a substrate 72 and a base plate cover or " cover " 74, and wherein an interferometric modulator array 76 is formed on the described substrate 72.Described cover 74 is also referred to as one " backboard ".
In certain embodiments, encapsulating structure 70 comprises a drying agent 80 that is configured to reduce the humidity in the chamber 79.Skilled technician will understand that drying agent is unnecessary for the encapsulation of an airtight sealing, but drying agent needs for the interior resident moisture of control encapsulation.In one embodiment, drying agent 80 places between interferometric modulator array 76 and the base plate 74.Drying agent can be used for having the encapsulation of impermeability or non-gastight seal.In the encapsulation with gastight seal, drying agent is generally used for controlling the moisture that resides in encapsulation inside.In the encapsulation with non-gastight seal, drying agent can be used for controlling from environment and moves on to moisture in the described encapsulation.Generally speaking, any moisture of catching can not disturb the material of the optical property of interferometric modulator array all to can be used as drying agent 80 simultaneously.Suitable desiccant material is including (but not limited to) zeolite, molecular sieve, surface adsorption agent, block adsorbent and chemical reactant.
Those skilled in the art will understand, and drying agent 80 can be applied by different way.In one embodiment, drying agent 80 is deposited as the part of interferometric modulator array 76.In another embodiment, drying agent 80 is coated in the encapsulation 70 as spray-on coating or dip coating.
Can the construction film above substrate 72 can be, the translucent or transparency material of MEMS device.These transparency materials are including (but not limited to) glass, plastics and transparent polymer.Interferometric modulator array 76 can comprise film modulator or separated type modulator.Those skilled in the art will understand, and base plate 74 can be formed by any suitable material, such as glass, metal, foil, polymkeric substance, plastics, pottery or semiconductor material (for example silicon).
Encapsulation process can vacuum, vacuum and up to and comprise the pressure between the pressure of environmental pressure or be higher than in the pressure of environmental pressure and finish.Encapsulation process also can be in finishing in high pressure that changing and through controlling or the environment under low pressure during the encapsulation process.Encapsulation interferometric modulator array 76 can be favourablely in the environment of a bone dry, but it is optional.Similarly, packaging environment can be and be the environment of inert gas under environmental baseline., described device can not influence the running of described device because can transporting under environmental baseline, so the encapsulation under environmental baseline allows the processing of lower cost and allows to have more potential diversity in the choice of equipment.
Generally speaking, need to make the water vapor that infiltrate to the encapsulating structure minimize, and thereby the environment of control encapsulating structure 70 inside and hermetic seal to guarantee described environment it constant.Hermetic an example of seal process is at United States Patent (USP) the 6th, 589, disclosed in No. 625, and it is incorporated herein with way of reference in full.During level when the humidity in the described encapsulation has surpassed that the surface tension that described moisture produced becomes the restoring force that is higher than the displaceable element (not shown) in the interferometric modulator array 70, described displaceable element can become and permanently adhere on the surface.If the humidity level is low excessively, then when described element began to touch through coating surperficial, moisture was charged to the polarity identical with described displaceable element.
As noted above, a drying agent can be used for controlling the moisture that resides in the encapsulating structure 70.Yet, enter into encapsulating structure 70 inside to prevent moisture from surrounding environment along with implementing gastight seal 78, can reduce or eliminate demand for drying agent.
The continuing of sized display reduced to limit the method that can be used for managing the environment in the encapsulating structure 70, and the space that reason is to be used in the encapsulating structure 70 to place drying agent 80 reduces.Elimination also allows encapsulating structure 70 thinner for the demand of drying agent, and it is desirable in certain embodiments.Usually, in the encapsulation that contains drying agent, expectation in the serviceable life value of packaging system can be depending on the serviceable life of drying agent.When drying agent during by full consumption, because sufficient moisture enters encapsulating structure and damage interferometric modulator array, thereby interferometric devices can move.
As stated previously, the configuration of embodiment is applicable to being the product at center with the display, such as mobile phone, laptop computer, digital camera and GPS unit herein.This type of device is the center with the display, and promptly each device relies on a flat-panel monitor as the main means that information is provided.Described display also can participate in input function.Therefore, described display can produce certain influence on aspect the machinery of product, electric, system and the aesthetics design, and its influence surpasses the contribution of other parts in the described product usually.Described display is formed by a material construction such as glass usually, and it is more frangible than the other materials of forming described product.As a result, machinery and product design process tend to the performance of display and are characterized as the center, but not (for example) processor or battery.The shared similar footprint area of many assemblies in the hand-held product.These assemblies comprise P.e.c. (PC) plate, light source, keyboard, battery, integrated circuit, assist or alternative flat-panel monitor and other assemblies.Because these assemblies are the plane normally, produce a similar output with the form of one or above photo etched mask or other shooting instruments usually so design the instrument of these assemblies.Thereby, there is the chance make that integrated increase in the design process and efficient improve, it can be enabled fully by function being incorporated into to backboard.
Fig. 8 describes an embodiment of the interferometric modulator display device 600 that shows with the exploded view form.Described device 600 comprises a transparent substrates 602, and it comprises one and is configured to reflect the interferometric modulator array 604 that passes the ambient light that substrate 602 enters.Described array 604 provides one to be used to modulate light and with its member towards spectators reflection.Transparent substrates 602 can comprise a glassy layer.In an alternate embodiment, transparent substrates 602 can comprise a transparent polymeric material layer, or any other suitable abundant transparent material.Thereby transparent substrates 602 provides a member that is used for supported array 604.In certain embodiments, according to the character of manufacture process and product, transparent substrates 602 can be from about 0.7 millimeter to 0.5 millimeter.
This gap distance limit one comprises the picture quality of the big display of display device 600 arrays, wherein said display device 600 together is configured to being in adjacent extension teat 613 places, and reason is that the clearance distance between the interferometric modulator 604 of adjacent display device 600 can be spectators and discovers.On the contrary, if extend teat 613 not with display device 600 arrays in another display device 600 adjacent, the picture quality of display device 600 arrays can not be subjected to extending the restriction of teat 613 so.
In this embodiment, chip for driving 612 is positioned on the same side of substrate 602 with array 604, and it is by track lead 616a and be electrically connected with array 604, and wherein chip for driving 612 is welded direct to track lead 616a.This method of placing chip is known as glass flip chip encapsulation (COG).Chip for driving 612 can be electrically connected with external circuit (not shown) by the track lead 616b of be connected with a mounting points 624 (for example, retractable cable or other polymer thin films are connected or welding lead with conductor and insulator).Also can use other chips incorporate methods, wherein including (but not limited to) mantle/paillon foil chip package (COF), the automatic combination of winding (TAB) or any other mantle type associated methods.
Still with reference to figure 8, backboard 608 at least with seal 606 and transparent substrates 602, forms the protectiveness chamber of an encirclement interferometric modulator array 604.Though not shown, drying agent can be provided in the protectiveness chamber, with the accumulation of the moisture that prevents the relative assembly life-span.Backboard 608 can be made by any suitable material, itself or be transparent or opaque or conduction or insulation.The suitable material that is used for backboard 608 including (but not limited to) glass (for example, float glass, 1737, soda-lime), plastics, pottery, polymkeric substance, laminated plate and metal and metal foil (for example, stainless steel (SS302, SS410), kovar alloy (Kovar), electroplate kovar alloy).With all require the LCD of electrod-array opposite on two substrates, 604 of arrays reside on the substrate, can make backboard 608 by than thin material and/or the material that is different from institute's materials used in the transparent substrates 602 fully make.In one embodiment, backboard 608 is applicable to and prevents that moisture from entering the protectiveness chamber and destroying array 604.Thereby an assembly such as backboard 608 provides a member that is used to protect array 604, so that it avoids the infringement of moisture and other environmental contaminants.
Described display also comprises a P.e.c. (PC) carriage 610, the side relative with transparent substrates 602 that it is positioned at backboard 608.PC carriage 610 can be the PC carriage/stack of components (component stack-up) that is used for such as the display product of personal digital assistant (PDA) or mobile phone.PC carriage 610 can be made separately with backboard 608, and is soldered to backboard then.
For reducing the footprint area of interferometric modulator display device 600, show another arrangement for chip for driving 614, wherein said chip for driving 614 is positioned in the upside of PC carriage 610, and is electrically connected with array 604 by track lead 616c, 616d, pad 625 and electric connector 618 (being depicted as welding lead).Because chip for driving 614 is not to be on the substrate 602, thereby can reduce outburst area 619.By reducing the outburst area 619 of display device 600, comprise that the picture quality of the big display of display device 600 arrays is improved, described display device 600 together is disposed near at least one teat 619.The improvement of this picture quality derives from reducing of clearance distance between the interferometric modulator 604 of adjacent display device in the array.
The outshot that dwindles 619 of transparent substrates 602 comprises the electrical connection zone of the pad 625 (for example, being used for welding lead) that is connected to track lead 616c.In an exemplary embodiment, allow outburst area 619 to be decreased to as the use of the welding lead of electric connector 618 and be less than or equal to 1.5 millimeters, wherein including (but not limited to) 1.25,1.0,0.75,0.5,0.25,0.2,0.1,0.075,0.05,0.025,0.01,0.0075,0.005,0.0025,0.001,0.0005 and 0.0001 millimeters.
By using pad 625 and electric connector 618 (being depicted as welding lead among this embodiment), lead 616c extends to PC carriage 610 from substrate 602, in lead 616c and lead 616d electric connection herein.In this embodiment, lead 616c extends to the form of lead 616d and (wherein can use the chips incorporate technology, such as COG, TAB or COF) on the PC carriage 610 and be connected to the electric assembly of PC carriage 610 and electric connection array 604 is placed with a chip for driving 614 or other.
Although by using welding lead that pad 625 and electric connector 618 are described, allow the coupling arrangement of any kind of the outburst area 619 that dwindles all to be covered by among the present invention.For example, the those skilled in the art can replace pad 625 and can replace electric connector 618 by retractable cable by the retractable cable connector, is less than or equal to 5,4,3,2,1,0.75,0.5,0.25 or 0.1 millimeters the outburst area that dwindles 619 yet still provide.
Although can provide a barrier that prevents the steam transmission that is enough to protect array 604 in the embodiment of Fig. 8 dorsulum 608, carry out by carriage 610 in the function of alternate embodiment dorsulum 608, thereby allow elimination backboard 608.In this type of embodiment, described carriage can advantageously comprise the material that minimizes or prevent the steam transmission.Those skilled in the art will understand, will be with a higher relatively ratio transmission water vapor by the PC carriage that FR4 forms.In some alternate embodiment, PC carriage 610 can be formed or comprised the gold coated films metal to strengthen its imperviousness for water by the gold coated films metal.Other suitable materials that are used for carriage 610 are including (but not limited to) pottery, aluminium nitride, beryllia and aluminium oxide.PC carriage 610 can be formed by plate or film.
Be used for six roots of sensation track lead 616a that chip for driving 612 and 614 is connected with array 604 although only show for simplicity, c should be understood that the size according to array, may need the state of more track lead with array of controls 604 for chip for driving.Similarly, though only describe to be used for three root locus lead 616b that chip for driving is connected with external circuit, e, some embodiment can require the input trajectory lead of varying number.Similarly, although in this figure, do not depict top or bottom (with respect to this figure) that the track lead extends to array 604 for simplicity, but will understand, embodiments of the invention can use referring to this figure and the following graphic configuration of discussing so that be electrically connected (for example, self-driven device circuit provides capable signal and column signal) with any part of array 604 to be provided.Equally, although track lead 616a, c is depicted as and is connected to array 604, and track lead 616a, c can be connected to by any device in the annular seal 606 formed chambers.
Can adopt the ACF material so that electric interconnection to be provided between assembly expediently, and they can be generally used for the mantle connector of TAB driver is connected to the demonstration substrate.Yet, can adopt the one exemplary embodiment that is disclosed in other methods of attachment and alternative this paper graphic, wherein including (but not limited to) Elecrical connector (zebra connector), retractable cable, projection joint, wire-bonded and micromechanics pressure conductor (for example, MEMS spring).
Fig. 9 and 10 describes the exemplary display device that reduces footprint area 750.In following argumentation be apparently; reducing of the footprint area of described device 750 partly owing to extending reducing of teat size more than one or one; all outshots 613 as seen in Figure 8, the assembly of face such as chip for driving and connector is positioned at the protection chamber outside that is formed by sealing ring thereon.These once were positioned at the assembly that extends on the teat 613 and can be positioned on the vertical direction that reduces footprint area display device 750.
Fig. 9 shows that device 750 in the assembled state and Figure 10 are with exploded view form exhibiting device 750.Referring to Fig. 9, described device 750 comprises one and is sealed to the transparent substrates 754 of carriage 770 by sealing ring 764.In this embodiment, carriage 770 serves as the backboard of device 750.
Owing to compares outburst area 775 with extension outburst area 613 depicted in figure 8 and dwindle, thereby the use of arrangements of electric connection 772 allows partly to reduce footprint area.For the outburst area 775 that reduces, the space between any adjacent display device 750 in display device 750 arrays minimizes, thereby has improved the picture quality of bigger display device 750 arrays.For example, if two display device 750 place an array to make that the outburst area 775 that reduces of display device 750 is adjacent together, then the gap between the display device 750 is described as extending outburst area 613 among Fig. 8 less than the gap when outburst area extends then.
Referring to Figure 10, an exploded view of its presentation display device 750, the wherein intraware 780 of the display device on the transparent substrates 754 and pad (pad) 761 electric connections on the carriage 770.Pad 761 on the carriage 770 can be used for being connected to any device of paying close attention to, and for example, can lead to the driver chip or the flexible cable of printed circuit board (PCB) (PCB).In this embodiment, the intraware 780 of device 750 is connected to the lead 762a that can be connected to pad 773a.Pad 773a on the substrate 754 is connected to arrangements of electric connection 772 (being depicted as welding lead herein) then, and it leads to the pad 773b on the carriage 770.These pads 773b on the carriage is connected to pad 761 via lead 762b then.In this embodiment, can be assembly with the intraware 780 of arrangements of electric connection 772 and pad 761 electric connections such as interferometric light modulator, interferometric light modulator array, or be any other assembly of paying close attention to, wherein including (but not limited to) sensing device, lighting device or other display device, such as LCD or LED.Should be understood that equally some or All Drives chip can place on the lower surface of carriage 770 and and then be in by carriage 770, transparent substrates 754 and sealing ring 764 formed annular seal space inside.
Referring to Figure 11 A, the arrangement of a plurality of display device 80 is configured to an array that forms big display device 85 by tiling.The tiling process relates to uses a plurality of display device to form big system.The tiling process is particularly useful for setting up than big display and applicable to the situation of producible largest monitor less than required display sizes.For example, billboard or other direction boards usually too big so that can't make and make the price of a sheet of glass by a monolithic glass may be quite high.Therefore, tiling can be used for filling this space and advantageously, tiling is a comparatively cheap replacement method.
Display through design so that single pixel on its usually viewed distance hardly as seen.TV, portable computer and other devices are through designing the spatial frequency to have 10 to 20cpd.The spatial frequency of about 80cpd all is sightless for best's eye.As a result, a distance of 1/8th to 1/10th that is about pel spacing can guarantee that the spatial frequency of all application is all greater than 80cpd between the movable viewing area.Pel spacing is relevant with exploration on display resolution ratio.For example, the display of 1 pixel of per inch (ppi) has 25.4 millimeters pel spacing.When correctly making up tiling, the interval between the zone of action should be distinguished by eyes.For example, if the interval between the zone of action is between about pel spacing of 1/8th to 1/10th, then the gap between the zone of action can't be distinguished for naked eyes.
Can use technology disclosed herein that various types of display technologies are together tiled in the bigger array, wherein including (but not limited to) LCD (LCD), Organic Light Emitting Diode (OLED), light emitting diode (LED), Field Emission Display (FED), electrophoretic display device (EPD) and comprise the MEMS of interferometric light modulator.In addition, tiling technology disclosed herein is applicable to that the needs of other types minimize the technology of distance between the interior zone of action of an array.For example, technology taught herein can be applicable to imaging sensor, such as X-ray, complementary metal oxide semiconductor (CMOS) (CMOS), common channel signalling (CCS), infrared ray and ultraviolet ray (UV) sensor.If (z) compares with vertical dimensions, described technology is subjected to bigger restriction on the footprint area size (x, y dimension) of device, and then the use that reduces outburst area as the described interconnection of Fig. 8-10 can be useful.
As used herein, the zone of action is defined on the common meaning the most widely at it, wherein including (but not limited to) by a seal around the zone of device.In certain embodiments, the zone of action is that wherein being electrically connected to described zone of action needs by annular seal institute area surrounded.For example, in certain embodiments, the zone of action is in the spectators of the display device zone that can be observed image, the light access to plant or from its reflection or from the device zone of its projection or other forms of information (such as, imaging induction information) enters into device or from its device zone of withdrawing from.In another embodiment, the zone of action is the interferometric light modulator array of a display device.In another embodiment, the zone of action is the sensor array of a sensing device.
Referring to Figure 11 A, it shows the top view of a tiled arrays of being made up of 16 display device 80.Each display device 80 comprises a non-zone of action 101, the backboard 120 on the zone of action 100 and the arrangements of electric connection 125 (being depicted as welding lead herein) between the zone of action 100 of a zone of action 100, some encapsulation and interconnect area 110, array.In one embodiment, the zone of action 100 of each display device 80 is a plurality of interferometric light modulator.Described arrangements of electric connection 125 is connected to the electric component on the backboard 120 with the assembly in the display device 80 (such as, zone of action 100).In one embodiment, coupling arrangement is connected to a chip for driving with described array.
In one embodiment, each display device 80 is controlled by the local driver circuit of himself.In another embodiment, a total driver (not describing) is controlled each local driver so that all display device 80 operate in phase.In case finish, the tiled displays that tiled displays 85 can be similar to a giant display substantially equally operates, and for example, it can produce a single complete image.In addition, because tiled displays 85 is the array of a plurality of display device 80, so array 85 has the additional advantage that allows to show compound or vision-mix.Therefore, in an exemplary embodiment, the array 85 of interferometric modulator display device 80 connects by a central controller device (not describing), and described central controller device will send required part in the described compound or vision-mix to produce complete compound or vision-mix on large-scale tiled arrays 85 for each display device 80.Therefore, array 85 can show different images on each single display device 80.Instead, array 85 can stride across the border display image of adjacent display device 80, to produce big image more than one or on the array 85.
The tiling of single display device is particularly useful for producing the image of big specification, such as billboard and large-scale tv machine.In one embodiment, the array 85 of interferometric modulator 80 is controlled by the main display driver of each the single display device (tiling) in the described array of a control.Therefore, a complete big specification image can be shown on the array 85 of interferometric modulator display device 80 to produce a complete image on (for example) billboard.
Perhaps, one or above display device 80 in the array 85 can show its image separately.For example, the tiled arrays 85 that Figure 11 A shows can have four independent images, and wherein each image strides across four display device 80 and shown.Therefore, can show several complete images on the tiled arrays 85, its number can reach the number of employed display device 80, is 16 among Figure 11 A.In an one exemplary embodiment, array 85 comprises a plurality of display device 80, wherein comprise from about 2 to about 20000 display device.In another one exemplary embodiment, tiled arrays 85 can comprise from about 2 to about 17,000 display device 80, wherein including (but not limited to) 2,4,8,16,32,64,128,256,512,1024,2048,4096,8192 and 16284.In another one exemplary embodiment, tiled arrays 85 can comprise from about 2 to about 1024 display device 80, wherein including (but not limited to) 4,8,16,32,64,128,256 and 512.In another one exemplary embodiment, display device comprises the interferometric modulator display device.
Referring to Figure 11 A, in one embodiment, the use of welding lead allows to reduce the non-zone of action 101 between the zone of action 100.In one embodiment, by using welding lead 125 zone of action 100 is connected to a driver or a PCB (not describing) who is connected to backboard 120, zone 110 reduces between the tiling between the adjacent display device 80, and then improves the picture quality of tiled arrays 85.
Comprise one reduce to tile between among zone 110 and the embodiment of welding lead 125, welding lead comprises at least one lead-in wire, but also can have a plurality of lead-in wires.In use, the mode that can anyly minimize between tiling non-zone of action 101 in the zone 110 is effectively adhered to welding lead.
When using specific embodiment described herein and method to minimize outburst area, vertically go up but not adhere to the electrical connector between the assembly on the backboard above the assembly of a device on the substrate and the substrate on the horizontal direction, and then reduce the space between the zone of action of described device and improve the picture quality of described device.
Referring to Figure 11 A, assembly on the device substrate and the arrangements of electric connection between the assembly on the backboard (for example welding lead 125 among Figure 11 A) can be set at and be configured to more than one or one be couple on the teat of this type of arrangements of electric connection.For example, describe in display device 80 places in grid space (A, 1) as Figure 11 A, arrangements of electric connection 125 depicted as being positioned on the single teat 123.Yet arrangements of electric connection can be positioned on the one or above teat that installs, and describes such as grid space among Figure 11 A (C, 3) place.Arrangements of electric connection 125 also can be positioned on the adjacent teat of display device 80, describes as space (D, 2), or is positioned on two parallel teats of display device 80, describes as space (D, 3).In addition, the arrangements of electric connection 125 of adjacent display device 80 may be parallel to each other, describes such as space (D, 2) and (D, 3).Many other configurations are possible.
Referring to Figure 11 B, it has described the array of four display device 142, and each display device all has one and reduces protruding segments 130, is connected to the intraware of display device 142 in pad 146 herein.Pad 146 is connected to the welding lead 144 of the pad 143 that leads on the backboard 141.Pad 143 on the backboard 141 is connected to lead 147 equally, and it allows to be connected to other electronic installations such as a chip for driving 140 or external interconnect pin/pad 145.In this embodiment, when pad 146 is present in not on the teat 130 adjacent with another display device 142, as space (B, 1) with (B, 2) display device 142 in is described, owing to do not have other display device 142 adjacent with described teat 130, thereby need not to reduce teat 130.As long as teat 130 is reduced for the teat 130 adjacent with other display device 142, such as space (A, 1) reach in the display device of (A, 2) locating 142, the space between the movable then viewing area dwindles and the picture quality of array display device improves.
Figure 12 A and Figure 12 B are the system block diagram of an embodiment of explanation one display device 2040.Described display device 2040 can be (for example) cellular phone or mobile phone.Yet the same components of display device 2040 or its slight variations also can illustrate various types of display device, as TV or portable electronic device.
The display 2030 of exemplary display device 2040 can be any in the various displays, comprising bistable display as described herein.In other embodiments, know as one of ordinary skill in the art, display 2030 comprises a flat-panel monitor, for example, and aforesaid plasma, EL, OLED, STN LCD or TFT LCD; Or a non-tablet display, as CRT or other tube arrangements.Yet for the purpose of describing present embodiment, display 2030 comprises an interferometric modulator display, as described herein.
The assembly of an embodiment of exemplary display device 2040 schematically is described among Figure 12 B.Illustrated exemplary display device 2040 comprises a shell 2041 and can comprise the additional assemblies that is sealed at least in part in the shell 2041.For example, in one embodiment, exemplary display device 2040 comprises a network interface 2027, and described network interface 2027 comprises that one is coupled to the antenna 2043 of a transceiver 2047.Described transceiver 2047 is connected to a processor 2021 that links to each other with adjusting hardware 2052.Described adjusting hardware 2052 can be configured to regulate a signal (for example, signal being carried out filtering).Regulate hardware 2052 and be connected to a loudspeaker 2045 and a microphone 2046.Processor 2021 is connected to an input media 2048 and a driving governor 2029 again.Driving governor 2029 is coupled to one frame buffer 2028 and array driver 2022, and array driver 2022 is coupled to a display array 2030 again.One power supply 2050 provides power according to the designing requirement of described particular exemplary display device 2040 to all component.
In an alternate embodiment, transceiver 2047 can be receiver and substitutes.In another alternate embodiment, network interface 2027 can be the image source that can store or produce the view data to processor 2021 to be sent and substitutes.For example, described image source can be the software module that hard disk drive or that a digital video disk (DVD) or contains view data produces view data.
In one embodiment, processor 2021 comprises microprocessor, CPU or is used to control the logical block that exemplary display device 2040 is moved.Regulating hardware 2052 comprises usually and is used for transmitting and from the amplifier and the wave filter of microphone 2046 received signals to loudspeaker 2045.Adjusting hardware 2052 can be the dispersion assembly in the exemplary display device 2040, maybe can incorporate in processor 2021 or other assemblies.
Driving governor 2029 directly receives the raw image data that is produced by processor 2021 from processor 2021 or from frame buffer 2028, and with described raw image data reformatting suitably, with high-speed transfer to array driver 2022.Particularly, driving governor 2029 is reformatted as the data stream with a grating class form with raw image data, is applicable to the chronological order that scans whole display array 2030 so that it has one.Then driving governor 2029 will be sent to array driver 2022 through formative information.Although a driving governor 2029 (for example, a lcd controller) usually as one independently integrated circuit (IC) be associated with system processor 2021, these controllers can be implemented in many ways.It can be used as in the hardware embedded processor 2021, in software embedded processor 2021, or together fully-integrated with example, in hardware and array driver 2022.
Usually, the self-driven controllers 2029 of array driver 2022 receive and are reformatted as one group of parallel waveform through formative information and with video data, and described group of parallel waveform per second repeatedly is applied to from the hundreds of of the x-y picture element matrix of display and is thousands of lead-in wires sometimes.
In one embodiment, driving governor 2029, array driver 2022 and display array 2030 are applicable to the display of any kind described herein.For example, in one embodiment, driving governor 2029 is the display controller or a bistable state display controller (for example, interferometric modulator controller) of a routine.In another embodiment, array driver 2022 is a conventional driver or a bistable state display driver (for example, interferometric modulator display).In one embodiment, a driving governor 2029 integrates with array driver 2022.This embodiment is very common in the integrated system of for example cellular phone, table and other small-area display equal altitudes.In another embodiment, display array 2030 is a typical display array or a bistable state display array (display that for example, comprises an interferometric modulator array).
Well-known various energy storing devices in the field under power supply 2050 can comprise.For example, in one embodiment, power supply 2050 is a chargeable accumulator, for example nickel-cadmium battery or lithium ion battery.In another embodiment, power supply 2050 is the solar cell that a regenerative resource, a capacitor or comprise plastic solar cell and solar cell coating.In another embodiment, the socket that is configured to from the wall of power supply 2050 receives electric energy.
As indicated above, in certain embodiments, the control programmability is present in the driving governor, and described driving governor can be arranged on several positions of electronic display system.In some cases, the control programmability is present in the array driver 2022.One of ordinary skill in the art will understand, can any amount of hardware and/or component software and implement above-mentioned optimization situation with various configurations.
Although above embodiment is showed, describe and point out to be applied to the novel feature of the present invention of various embodiment, it should be understood that one of ordinary skill in the art can make various omissions, substitute and change the form and the details of illustrated device or processing under the premise of without departing from the spirit of the present invention.Should be appreciated that, use or implement because some feature can be independent of other features, thereby the present invention can be implemented in the form that all features as herein described and benefit are not provided.
Claims (36)
1. apparatus array, it comprises:
One first device, it comprises:
One encapsulation, it comprises that one first substrate, one first zone of action and one first are electrically connected the zone, wherein said first is electrically connected the regional electric connection that is configured to be provided between described first zone of action and another assembly;
One sealing ring, it is around described first zone of action;
One base plate, it joins described sealing ring to form described encapsulation, reaches
One conductor, it is used to provide the electric connection from described base plate to the described first electrical connection zone; And
One second device, it comprises one second substrate, and one second zone of action and one second is electrically connected the zone, and described second device is positioned to be electrically connected regional adjacent part with described first of described first device,
Wherein said first is electrically connected the zone extends to the edge of the most close described second device of described first substrate from described sealing ring, and described edge is less than or equal to 1 millimeter with described second distance of installing.
2. apparatus array according to claim 1, wherein said first is electrically connected the zone is configured to provide electric connection with described first zone of action via welding lead.
3. apparatus array according to claim 1, wherein the distance between described first zone of action and described second zone of action is less than or equal to 1/8th of a pel spacing.
4. apparatus array according to claim 1, wherein said first and second devices are display device.
5. apparatus array according to claim 4, wherein said display device array comprises at least one interferometric light modulator.
6. apparatus array according to claim 5, wherein said first zone of action and described second zone of action respectively comprise at least one interferometric light modulator.
7. apparatus array according to claim 4, wherein said display device array is configured to show a single image.
8. apparatus array according to claim 4, wherein said display device array is configured to show simultaneously a plurality of images.
9. at least one under apparatus array according to claim 4, wherein said display device comprise in the array apparatus a: LCD, an Organic Light Emitting Diode, a light emitting diode, a Field Emission Display, an electric color monitor or an electrophoretic display device (EPD).
10. apparatus array according to claim 1, each in wherein said first and second devices comprises in the following imaging induction installation: an X-ray sensor, a complementary metal oxide semiconductor (CMOS) sensor, a common channel signalling sensor, an infrared ray sensor or a UV sensor.
11. apparatus array according to claim 1, wherein said first is electrically connected the zone extends to the edge of the most close described second device of described first substrate from described sealing ring, and described edge is less than or equal to 0.75 millimeter with described second distance of installing.
12. apparatus array according to claim 1, wherein said first is electrically connected the zone extends to the edge of the most close described second device of described first substrate from described sealing ring, and described edge is less than or equal to 0.5 millimeter with described second distance of installing.
13. apparatus array according to claim 1, wherein said first is electrically connected the zone extends to the edge of the most close described second device of described first substrate from described sealing ring, and described edge is less than or equal to 0.25 millimeter with described second distance of installing.
14. apparatus array according to claim 1, wherein said first is electrically connected the zone extends to the edge of the most close described second device of described first substrate from described sealing ring, and described edge is less than or equal to 0.1 millimeter with described second distance of installing.
15. apparatus array according to claim 1, wherein said backboard comprises a printed circuit board (PCB).
16. apparatus array according to claim 1, it further comprises:
One processor, itself and the described first zone of action electric connection, described processor is configured to image data processing; And
One memory storage, itself and described processor electric connection.
17. apparatus array according to claim 16, it comprises that further one is configured to the drive circuit that a near few signal sends to described first zone of action.
18. apparatus array according to claim 17, it further comprises:
One is configured at least a portion of described view data is sent to the controller of described drive circuit.
19. apparatus array according to claim 16, it comprises that further one is configured to the image source module of described image data transmission to described processor.
20. apparatus array according to claim 19, wherein said image source module comprises at least one in a receiver, transceiver and the transmitter.
21. apparatus array according to claim 16, it comprises that further one is configured to receive the input media of importing data and described input data being sent to described processor.
22. a method of making a display device array, it comprises:
One first display device is provided, and it comprises:
The encapsulation of one display, it comprises that one first substrate, one first zone of action and one first are electrically connected the zone, wherein said first is electrically connected the regional electric connection that is configured to be provided between described first zone of action and another assembly;
One sealing ring, it is around described first zone of action;
One base plate, it joins described sealing ring to form described display encapsulation; And
One conductor, it is used to provide the electric connection from described base plate to the described first electrical connection zone; And
Provide one to comprise one second substrate, one second zone of action and one second is electrically connected second display device in zone; And
Described first display device and described second display device are put together, it is regional adjacent so that described second zone of action of described second display device is electrically connected with described first of described first display device, wherein said first is electrically connected the zone extends to the edge of the most close described second device of described substrate from described sealing ring, and described edge is less than or equal to 1 millimeter with described second distance of installing.
23. method according to claim 22, the distance between wherein said first zone of action and described second zone of action is less than or equal to 1/8th of a pel spacing.
24. method according to claim 22, wherein said first is electrically connected the zone is configured to provide electric connection via welding lead.
25. method according to claim 22, wherein said display device array comprises at least one interferometric light modulator.
26. method according to claim 25, each of wherein said first zone of action and described second zone of action comprises at least one interferometric light modulator.
27. display device array that method according to claim 22 is made.
28. an apparatus array, it comprises:
One first device, it comprises:
Be used for transmission and pass first transmission member of light wherein;
Be used to modulate first movable part of the light that transmission passes described first transmission member;
Be used to be provided at first electrical connecting member of the electric connection between described first movable part and another assembly;
Be used for containment member around described first movable part;
Be used for described first transmission member, described first movable part and described containment member are formed the covering member of an encapsulation; And
One is used to provide the electrical connecting member of the electric connection from described covering member to described first electrical connecting member; And
One second device, it comprises that one is used for second transmission member that light is wherein passed in transmission, one is used for catoptrical second movable part, with one second electrical connecting member, described second device is positioned the adjacent part of described electrical connecting member with described first device, wherein said first electrical connecting member extends between the edge of the most close described second device of described containment member and described first transmission member, and the distance of described edge and described second device is less than or equal to 1 millimeter.
29. apparatus array according to claim 28, wherein said first transmission member comprises a transparent substrates.
30. apparatus array according to claim 28, wherein said first movable part comprises an interferometric modulator array.
31. apparatus array according to claim 28, wherein said first electrical connecting member comprise that one of described first device is electrically connected the zone.
32. apparatus array according to claim 28, wherein said containment member comprises a sealant.
33. apparatus array according to claim 28, wherein said covering member comprises a base plate.
34. apparatus array according to claim 28, wherein said second movable part comprises an interferometric modulator array.
35. apparatus array according to claim 28, wherein said first electrical connecting member are configured to provide the electric connection via welding lead and described first movable part.
36. apparatus array according to claim 28, the distance of one between wherein said first movable part and described second movable part is less than or equal to 1/8th of a pel spacing.
37. apparatus array according to claim 28, wherein said apparatus array comprise a display device array.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61348704P | 2004-09-27 | 2004-09-27 | |
| US60/613,487 | 2004-09-27 | ||
| US11/078,025 | 2005-03-11 |
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| CN1755488A CN1755488A (en) | 2006-04-05 |
| CN100523978C true CN100523978C (en) | 2009-08-05 |
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| JP5779992B2 (en) * | 2011-05-31 | 2015-09-16 | セイコーエプソン株式会社 | Display device with input function |
| TWI728779B (en) * | 2020-04-15 | 2021-05-21 | 宏齊科技股份有限公司 | Led display screen module |
| CN112669715B (en) * | 2020-12-24 | 2022-08-05 | 深圳市华星光电半导体显示技术有限公司 | Connecting piece, display panel, manufacturing method of display panel and display device |
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