CN100522469C

CN100522469C - Work-piece unloader for substrate processor

Info

Publication number: CN100522469C
Application number: CNB2007100894517A
Authority: CN
Inventors: 辰田胜彦; 齐田一
Original assignee: Nakamura Tome Precision Industry Co Ltd
Current assignee: Nakamura Tome Precision Industry Co Ltd
Priority date: 2006-11-06
Filing date: 2007-03-23
Publication date: 2009-08-05
Anticipated expiration: 2027-03-23
Also published as: TWI352993B; JP2008114342A; KR20080041094A; CN101176976A; KR100951494B1; TW200822109A

Abstract

The invention relates to a work pieces remover, which is characterized in that: the remover is arranged in the disc baseplates for information recording medium and other baseplate processors, to form a remover loaded in baseplate processor with short processing time and capable of moving the baseplates in and out from the processing position within short time. The remover comprises a rotary worktable, a first manipulator, and a second manipulator; wherein, the rotary worktable is provided with at least three holding bases evenly distributed on a same circumference with a rotating shaft along the vertical direction as the center, and is revolved at interval around the rotating shaft toward one direction; the first manipulator is used to convey the pre-processed baseplates from a supply reservoir to a stand-by position; the second manipulator is applied to convey the processed baseplates from a clear-out position to the supply reservoir. The stand-by position is the one of a holding base at the side of the upstream of the rotation direction when one of the holding bases is rotated to the processing position as a result of the interval rotation of the rotary worktable; the clear-out position is the one of a holding base at the side of the downstream of the rotation direction when one of the holding bases is rotated to the processing position as a result of the interval rotation of the rotary worktable.

Description

The work-handling device of substrate processing machine

Technical field

The present invention relates to be arranged at the tapping machine of on the substrate of the dish (disk) that uses as information recording carrier, offering centre bore and the work-handling device in other substrate processing machine (below abbreviate " loading and unloading device " as.), relate to the device that carries out following action, that is, take out the processing prebasal plate and it is moved into Working position from accumulator, will process substrate and take out of the accumulator from this Working position.

Background technology

The tapping machine of disc board is following working equipment: the disc board of the mode that is in level with face being moved into Working position by the profile benchmark feel relieved (location), after the cylinder that utilization is disposed up and down or trim ring (holding body) the clamping disk substrate of ring-type, the periphery of the revolving wheel of the downward cup-shaped at trim ring center on being disposed at, utilize hole saw perforate onboard, as main points, carry out perforate processing at the center of disc board.The discoideus smear metal that produces after the perforate is discharged by the hollow bulb of lower clamping ring.

Be provided with in the tapping machine of disc board: accumulator, itself and Working position adjacency store the disc board before and after the processing; And the loading and unloading device, it is the conveyance disc board between this accumulator and Working position.Usually, a plurality of boxes that contain a plurality of disc boards are carried in the accumulator, utilize the loading and unloading device to process prebasal plate successively and process the loading and unloading of substrate, thereby the disc board that stores in the accumulator is processed continuously.

In the past, as the loading and unloading device of tapping machine, use have the processing prebasal plate with and process the manipulator of the X-Y walking of 2 claws (finger) that substrate uses.Interfere for fear of claw and the trim ring and other parts that are installed in Working position, claw extends to Working position from the manipulator main body, the front end of this claw be provided be used to adsorb keep workpiece towards below a plurality of suckers.A plurality of suckers are arranged at 2 positions or 3 positions that adsorb at the position to the pars intermedia of the radial direction of disc board, and instrument and the trim ring of avoiding and be arranged at Working position interfere.

Disc board is housed in conveyance with in the box in the mode that face is in plumbness.On the other hand, the processing of disc board is to carry out in the mode that face is in level.The above-mentioned claw of loading and unloading device can be in the horizontal direction and and the downward direction of 90 degree between swing, make claw swing downwards, and carry out the taking-up and the insertion of disc board between the box, claw carries out moving into of disc board under horizontal state and between the Working position and takes out of.

With reference to Fig. 4, the action of the loading and unloading device of this existing structure is described.The Y direction of manipulator 12 by transverse arm 17 moves and the directions X of this manipulator on this arm moves, and move to the box top that contains the processing prebasal plate, makes to move into claw 3a and descend downwards, utilizes a processing of the sucker absorption prebasal plate 9a of claw front end.Then, make and move into claw 3a and rise, further turn back to after the level, manipulator 12 moves to Working position.Then, the front end of taking out of claw 3b is inserted into Working position, by taking out of the down maneuver of claw 3b, utilize the sucker absorption of its front end to process after the substrate 9b, not shown last trim ring is left from this substrate, then, make and take out of claw 3b and move up, take out from lower clamping ring and process substrate 9b.

Then, the front end that manipulator 12 will be moved into claw 3a is inserted into Working position, decline by this claw, to process prebasal plate 9a is placed on the lower clamping ring, trim ring is descended and after the clamping substrate 9a, remove the absorption of sucker, make and move into claw 3a rising, will process prebasal plate 9a and transfer processing machine to.Then, manipulator 12 will process substrate 9b conveyance to being arranged at clear position between accumulator and the Working position (removing attached to processing the working fluid on the substrate and the position of dust), remove in this clear position and to process the working fluid (being generally water) that adheres on the substrate 9b and after carrying out drying, move to accommodating the box top that processes substrate 9b processing substrate 9b.

Then, make and take out of claw 3b decline afterwards downwards, remove the absorption of the sucker of this claw front end, accommodate in the box thereby will process substrate 9b.Afterwards, make and take out of claw 3b rising, turn back to level, move to the extracting position of next processing prebasal plate.

By repeating above-mentioned action, thereby the disc board of accommodating in the box on the accumulator is processed continuously.

Patent documentation 1: 2000-No. 153425 communiques of TOHKEMY

Patent documentation 2: 2006-No. 26874 communiques of TOHKEMY

In above-mentioned existing loading and unloading device, must carry out following action: during the Working position substrate processing, the loading and unloading device will process substrate transferring to clear position, wait for cleanup action, to process substrate inserts in the box, move to the box top that contains the processing prebasal plate, take out the processing prebasal plate, move to the Working position direction.

In the chamfer machining machine of the chamfer machining of the periphery that carries out substrate, processing 1 substrate needs about 30 seconds process time, so the loading and unloading device can carry out above-mentioned action during this period.But be about 15 seconds the process time of the perforate processing of disc board, and the present patent application people can shorten to process time about 10 seconds according to the drilling processing machine in the present exploitation.If realize the shortening of this process time, then to load and unload device and can not in process time, carry out above-mentioned action, after the substrate process finishing, processing machine must wait for that the loading and unloading device finishes the conveyance action.

That is, the productivity ratio of substrate processing machine is not the ability that depends on processing machine, but by the work transporting time decision of loading and unloading device, thereby can not expect by boosting productivity the process time that shortens substrate processing machine.

Summary of the invention

Therefore, problem of the present invention is, obtain a kind of be used for carrying as the tapping machine of disc board process time of short substrate processing machine, can carry out the loading and unloading device that moving into of substrate taken out of at Working position at short notice.

The work-handling device that has solved the related substrate processing machine of the application's first aspect of above-mentioned problem is characterised in that, described work-handling device possesses: rotary table 28, it has at the rotating shaft 27 with vertical direction is at least 3 maintenance platforms 30 that equally spaced dispose on the same circumference at center, and this rotary table 28 intermittently rotates around direction of described axial rotary; The 1st manipulator 12a, its will process prebasal plate from accumulator 1 to position of readiness 4 conveyances; And the 2nd manipulator 12b, its will process substrate from clear position 6 to accumulator 1 conveyance, described position of readiness 4 is 1 the residing position of maintenance platform that rotate its direction of rotation upstream side when being positioned at Working position 5 intermittence by described rotary table that keeps in the platform, described clear position 6 is 1 the residing position of maintenance platform that rotate its direction of rotation downstream when being positioned at Working position 5 intermittence by described rotary table that keeps in the platform, in described clear position, utilization blows away the cutting fluid of substrate surface and dust from the injection air of the nozzle ejection that is disposed at this position and removes, and makes attached to the water evaporates on the substrate.

For substrate, the information recording carrier that has the large-scale glass substrate that uses in the LCD, a card-type with or electronic equipment such as IC with various substrates such as small-sized substrates, but work-handling device of the present invention is applicable to the work-handling device of the processing machine that more small-sized substrate is processed, be particularly suitable for adding the processing machine of the discoid substrate that need not the direction in the predetermined surface man-hour, especially preferably be suitable for the work-handling device of fast tapping machine of process-cycle.

The maintenance platform 30 that is arranged at rotary table 28 is generally 3 and gets final product, but processing the dry of substrate or cleaning required time than the situation of long processing time etc., also can adopt following structure: be provided with 4 and keep platform, the 1st and the 2nd 2 grades clear position is set in the downstream of Working position.In addition, clear position 6 is the positions of removing attached to processing the cutting fluid on the substrate or cutting powder etc., normally utilizes from the injection air of the nozzle ejection that is disposed at this position the cutting fluid and the dust of substrate surface blown away the structure that removes.If desired, on this clear position, be provided with and grab changing device, this grab changing device and machine table between grab and change substrate, cutting fluid or dust are not arranged not by cleaning and residual situation thereby can not appear at part that the maintenance platform by rotary table keeps.

The elasticity claw that is provided for controlling sucker or substrate periphery on the maintenance platform 30 of rotary table is (crooked and open when being inserted with substrate, utilize the claw of this crooked restoring force clamping substrate) etc. maintenance instrument (not shown), thereby substrate can not come off from keeping platform 30 when rotary table 28 rotation.Substrate preferably utilizes the

trim ring

21,22 that is arranged at Working position 5 to carry out in the maintenance of Working position.Preferred centring means 25 also is arranged at Working position 5.This is because can improve the maintenance rigidity of positioning accuracy and substrate.

The above-mentioned maintenance instrument that is arranged at the maintenance platform 30 of rotary table does not constitute and can interfere with control pawl 25a, the 25b of

trim ring

21,22 that is arranged at Working position and centring means.It is for example be positioned at

trim ring

21,22 the radial direction outside sucker or with the direction of controlling the direction quadrature of controlling

pawl

25a, 25b of centring means on control the elasticity claw etc. of dish periphery.

According to the loading and unloading device of said structure, as long as in the process time of substrate, finish each following action, that is, move into manipulator 12a and move to box 18 tops that process prebasal plate from position of readiness 4, take out the processing prebasal plate, turn back to the action of position of readiness 4; And take out of manipulator 12b from clear position 6 is inserted substrate to the box 18 that processes substrate after, turn back to the action of clear position 6, these actions finished in the actuation time that is significantly shorter than existing loading and unloading device, even so in the processing of weak point process time, can be because of the productivity ratio that limits processing machine actuation time of loading and unloading device yet, in the such substrate processing of the perforate processing of disc board, has the effect of the substrate processing that can realize that productivity ratio is high.

In addition, when the drying that processes substrate or clearance time are longer than under the situation of process time, as long as the maintenance platform of rotary table 28 is made as 4～5, clear position 6 is set to 2 places～3 places gets final product, so can not limit the productivity ratio of processing machine because of drying or clearance time.

Description of drawings

Fig. 1 is the stereogram that embodiment is shown.

Fig. 2 is the vertical view of major part of the device of Fig. 1.

Fig. 3 is the stereogram that the example of manipulator is shown.

Fig. 4 is the stereogram of example that the manipulator of existing apparatus is shown.

Symbol description

1 accumulator (stoker); 3a, 3b claw; 4 position of readiness; 5 Working positions; 6 clear position; 9 substrates; 16 longitudinal guide spares; 17 transverse arms; 12a, 12b manipulator; 24 emery wheels; 27 rotating shafts; 28 rotary tables; 30 keep platform.

The specific embodiment

Below, the accompanying drawing with reference to an example of preferred implementation of the present invention is shown further specifically describes the present invention.Fig. 1 is the stereogram of device, and Fig. 2 is the diagrammatic top view of major part, and Fig. 3 is the stereogram of manipulator.

As shown in Figure 1, 2, illustrated boring device has and overlooks the accumulator 1 that is rectangle and be disposed at its Working position 5 in the outside on one side.Working position 5 has: the last lower clamping ring of annular (mouthful gold) 21,22, and it is used for holding workpiece; The grinding wheel spindle 23 of vertical direction, it is disposed on the axle center of trim ring 21; The perforate emery wheel 24 of downward cup-shaped, it is assemblied in the lower end of this grinding wheel spindle 23; And orientation tool 25.Orientation tool 25 has a pair of pawl 25a, the 25b of controlling that opposed edge is in the shape of the letter V and faces, by a pair of pawl 25a, the 25b of controlling moved to mutual approaching direction, clamp the disc board of lift-launch on lower clamping ring 22, thereby to feeling relieved by the disc board of periphery benchmark processing.Carry out after this centering, last trim ring 21 descends, and clamping disk(-sc) substrate between the lower clamping ring 22, while by being rotated, perforate emery wheel 24 descends, thereby to all holes in the center processing of disc board.

Carry on the accumulator 1 before the processing and under the state of disc board 9 in accommodating box 18 (18a, 18b) that processes.What box 18 had a multiple row holds frame (resettlement section) 19, and this upper surface that holds frame 19 opens wide, the inboard support lugn that equally spaced is provided with the U font.The circumference of disc board 9 is supported on this support lugn that holds frame, disc board 9 with card be in vertical direction and with the rectangular direction of card on accommodated under the state arranged.

Working position 5 sides of accumulator 1 are provided with rotary table 28, and this rotary table 28 can rotate around the rotating shaft 27 of vertical direction, and utilize not shown drive unit intermittently to rotate by 120 degree to the arrow A direction of Fig. 2.Rotary table 28 among the figure is equilateral triangles that the summit has protuberance, on above-mentioned protuberance, is being on the same circumference at center with rotating shaft 27, respectively is provided with 1 at interval by 120 degree and keeps platform 30.

Rotary table 28 is by the intermittently rotation of 120 degree, so that 3 keep 1 in the platform to stop at Working position 5, when this stops, the residing position of maintenance platform in the direction of rotation downstream of rotary table 28 becomes clear position 6 from Working position 5, and the residing position of maintenance platform of direction of rotation upstream side becomes position of readiness 4.Be provided with in clear position 6 and be used to spray cleaning with the air nozzle of air etc., but owing to adopt existing known structure, so the diagram of omission and explanation.

Being provided with along the Y direction of figure with not shown portal structures above the Working position opposition side of accumulator 1 is elongated longitudinal guide spare 16, and the cardinal extremity of 2

transverse arm

17a, 17b that extend towards Working position 5 is supported for along the longitudinal that guiding piece 16 moves freely.

Transverse arm

17a, 17b are provided with manipulator 12a, the 12b that goes up walking at its bearing of trend (directions X of figure).Manipulator 12a, 12b by

directions X servomotor

32a, 32b rotation and along

transverse arm

17a, 17b running fix,

transverse arm

17a, 17b guiding piece 16 running fixes along the longitudinal by the rotation of each

Y direction servomotor

33a, 33b.

Manipulator

12a, 12b have claw 3a, a 3b respectively, and the front end of each claw has the sucker (not shown) of disc board 9 being carried out vacuum suction.

As shown in Figure 3, claw 3a can freely rotate around the axle 10 of horizontal direction, and, with the piston rod binding of oscillating cylinder 11, the advance and retreat of the piston rod by oscillating cylinder 11 can be changed into direction the horizontal direction shown in the figure and to the downward direction of lower swing 90 degree.Claw 3a is assemblied on the framework of manipulator 12 via the lift cylinder 13 of built-in lifting guiding piece.Claw 3b also adopts the structure identical with claw 3a and is assemblied on the manipulator 12b.

Based on the lifting action of the claw 3a of lift cylinder 13 with claw 3a from above be inserted into the box 18a and when taking out disc board 9, and on the maintenance platform that disc board 9 is carried position of readiness 4, carry out.In addition, the lifting action of claw 3b with disc board 9 when the maintenance platform of clear position 6 is mentioned, and with disc board 9 from above carry out when being inserted into the box 18b.

The mode that is in vertical direction with face is housed in after processing prebasal plate among the box 18a on the accumulator 1 kept by the sucker absorption towards below and the claw 3a that moves downwards, rises by making claw 3a, and is extracted out from box 18a.Then, make claw 3a be in horizontal direction,, disc board 9 is placed on the maintenance platform of position of readiness 4 by moving and the down maneuver of claw 3a of manipulator 12.The process finishing of disc board formerly, last

lower clamping ring

21,22 are from processing the moment that substrate leaves, and rotary table 28 rotates 120 degree to the arrow A direction of Fig. 2.By this rotation, process substrate and move to clear position 6, the processing prebasal plate that carries at position of readiness 4 moves to Working position 5.Empty maintenance platform moves to position of readiness 4.The disc board that moves to Working position 5 carries out perforate processing according to the step identical with above-mentioned existing apparatus.

In clear position 6, utilize the injection air will be attached to moving processing the working fluid on the substrate and cutting powder and other dust blows away of coming, and then make attached to the water evaporates on the substrate.Decline by claw 3b, by the sucker of this claw to the absorption of substrate and this a series of action of rising of this claw, mention the dry substrate that processes from the maintenance platform of clear position 6.Utilize claw 3a that the next one is processed on the maintenance platform that prebasal plate carries position of readiness 4.

In the process finishing of Working position 5, when

trim ring

21,22 separates, rotary table 28 rotations 120 degree will process substrate and be transported to clear position 6, and the processing prebasal plate that newly carries on the maintenance platform of position of readiness 4 is transported to Working position 5.Carry out in the perforate of the disc board of Working position 5 with in that the drying that processes substrate of clear position 6 is parallel, during this period, claw 3a carries new processing prebasal plate on the maintenance platform of position of readiness 4, and claw 3b will turn back to the box of accommodating perforate dish from the substrate that processes that the maintenance platform of clear position 6 is mentioned.This return action carries out in the following way: manipulator 12b moves to the box top, makes claw 3b downward, then, after claw 3b descends, removes the absorption of the sucker of this claw front end.

By carrying out above action repeatedly, the bamboo curtain splint overshooting shape to be housed in before the processing among the box 18a disc board processed successively and accommodate in the box 18b, during substrate process finishing in 1 box, then move to next box, the substrate on accumulator 1 is carried in processing continuously.In addition, it is different boxes that box 18a need not with 18b, normally the sylphon of the dish before having taken out processing or taken out the action of accommodating the dish that processes on the part of sky of box of the preceding dish of processing successively.

Claims

1. the work-handling device of a substrate processing machine is characterized in that,

Described work-handling device possesses: rotary table (28), it has at the rotating shaft (27) with vertical direction is at least 3 maintenance platforms (30) that equally spaced dispose on the same circumference at center, and described rotary table (28) intermittently rotates around direction of described axial rotary; The 1st manipulator (12a), its with undressed substrate from accumulator (1) to position of readiness (4) conveyance; And the 2nd manipulator (12b), its will process substrate from clear position (6) to accumulator (1) conveyance;

Described position of readiness (4) is 1 the residing position of maintenance platform that rotates its direction of rotation upstream side when being positioned at Working position (5) intermittence by described rotary table that keeps in the platform,

Described clear position (6) is 1 the residing position of maintenance platform that rotates its direction of rotation downstream when being positioned at Working position (5) intermittence by described rotary table that keeps in the platform, in described clear position, utilization blows away the cutting fluid of substrate surface and dust from the injection air of the nozzle ejection that is disposed at this position and removes, and makes attached to the water evaporates on the substrate.

2. work-handling device according to claim 1 is characterized in that,

Substrate processing machine is the tapping machine of disc board.