CN100519194C - Substrate and method of forming substrate for fluid ejection device - Google Patents
Substrate and method of forming substrate for fluid ejection device Download PDFInfo
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- CN100519194C CN100519194C CNB2005800293139A CN200580029313A CN100519194C CN 100519194 C CN100519194 C CN 100519194C CN B2005800293139 A CNB2005800293139 A CN B2005800293139A CN 200580029313 A CN200580029313 A CN 200580029313A CN 100519194 C CN100519194 C CN 100519194C
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Abstract
A method of forming an opening (150) through a substrate (160) having a first side (162) and a second side (164) opposite the first side includes abrasive machining a first portion (154) of the opening into the substrate from the second side toward the first side, and abrasive machining a second portion (156) of the opening into the substrate from the first side toward the second side. Abrasive machining one of the first or second portion includes communicating the first or second portion with the other of the first or second portion to form the opening through the substrate.
Description
Technical field
The present invention relates to a kind of method and a kind of substrate that is used for fluid ejection apparatus that is formed for the substrate of fluid ejection apparatus.
Background technology
In some fluid ejection apparatus of for example printhead, the drop injection component is formed on the front side of substrate, and fluid is directed to the ejection chamber of drop injection component via opening in the substrate or stria.Usually, substrate is a silicon sheet, and stria is formed on the thin slice by chemical etching.The existing method that the stria of substrate is passed in formation comprises front side etch from the rear side of substrate to substrate in substrate, and wherein the rear side of substrate is defined as the substrate opposite with forming the drop injection component one side.Unfortunately, from rear side until front side etch can cause the misalignment of stria of front side and/or the wide variety of front side stria in the substrate.
Summary of the invention
According to one aspect of the present invention, a kind of method that is formed for the substrate of fluid ejection apparatus is provided, this substrate has first side and second side opposite with first side, and this method comprises:
With first corrosion rate, subsequently with second corrosion rate, lose from second side towards first side grinding and to be worked in the substrate less than first corrosion rate, comprise the first that forms the fluid passage in the substrate; And
Lose from first side towards second side grinding and to be worked in the substrate, comprise the second portion that forms the fluid passage in the substrate;
Wherein forming one of first or second portion comprises in the second portion of the first of one of the first of fluid passage and second portion of fluid passage and fluid passage and fluid passage another is communicated with.
According to another aspect of the present invention, a kind of substrate that is used for fluid ejection apparatus is provided, this substrate comprises:
First side;
Second side opposite with first side; And
With the fluid passage that first side and second side are communicated with, the fluid passage comprises first and second portion that is communicated with second side and the neck between first and second portion that is communicated with first side, and wherein neck limits the minimum dimension of fluid passage.
Description of drawings
Fig. 1 is the block diagram of an embodiment of expression ink-jet print system;
Fig. 2 is the schematic section of embodiment of the part of expression fluid ejection apparatus;
Fig. 3 is formed in the schematic section of an embodiment of the part of the fluid ejection apparatus on the embodiment of substrate;
Fig. 4 A-4H is the embodiment that expression forms the opening that passes substrate.
The specific embodiment
In the following detailed description of preferred embodiment, with reference to the accompanying drawing that forms its part and represent by exemplary specific embodiment.In this regard, for example direction terms such as " top ", " bottom ", " front portion ", " rear portion ", " leading ", " hangover " are used for the orientation with reference to the accompanying drawing of describing.Because parts described herein can be positioned on the multiple different orientation, the direction term is used for describing and connotation without limits.Will appreciate that and to adopt other embodiment and can carry out structure or the logic variation, and do not depart from the scope of this disclosure.Therefore describe connotation without limits below in detail, and scope of the present invention limits by claims.
Fig. 1 represents an embodiment of ink-jet print system 10.Ink-jet print system 10 constitutes an embodiment of fluid injection systems, and this fluid injection system comprises the fluid ejection assembly of inkjet printhead assembly 12 for example and the fluid provisioning component of ink supply module 14 for example.In described embodiment, ink-jet print system 10 also comprises installation component 16, medium transport assembly 18 and electronic controller 20.
As an embodiment of fluid ejection assembly, inkjet printhead assembly 12 comprises one or more printheads or the fluid ejection apparatus that sprays ink droplet or fluid via aperture or nozzle 13.In one embodiment, drop is towards the medium guiding of for example print media 19, so that print on the print media 19.Print media 19 is the suitable sheet material of any kind, for example paper, card stock, lantern slide, polyester film, fiber and analog.Usually, nozzle 13 is configured in one or more row or column, make in one embodiment, when inkjet printhead assembly 12 and print media 19 relative motions, cause character, symbol and/or other figure or image to print on the print media 19 with suitable sequence-injection printing ink from nozzle 13.
In one embodiment, electronic controller 20 provides and comprises the control of inkjet printhead assembly 12 of spraying the timing control of ink droplets from nozzle 13.Therefore, electronic controller 20 is limited to the pattern of the injection ink droplet that forms character, symbol and/or other figure or image on the print media 19.The pattern of timing control and injection ink droplet is determined by print out task instruction and/or order parameter.In one embodiment, the logic of formation electronic controller 20 parts and driving loop are positioned on the inkjet printhead assembly 12.In another embodiment, the logic of formation electronic controller 20 parts and driving loop are positioned at outside the inkjet printhead assembly 12.
Fig. 2 represents an embodiment of the part of fluid ejection apparatus 30.Fluid ejection apparatus 30 comprises the array of drop injection component 31.Drop injection component 31 is formed on the substrate 40 with fluid (or printing ink) the supply stria 41 that forms on it.Therefore, fluid feed slot 41 provides the supply of liquid (printing ink) to drop injection component 31.Substrate 40 is for example formed by silicon, glass or pottery.
In one embodiment, each drop injection component 31 comprises membrane structure 32 and the orifice layer 36 with resistor 34.Membrane structure 32 has formation fluid (printing ink) supply orifice 33 wherein that is communicated with the fluid feed slot 41 of substrate 40.Orifice layer 36 also has the formation nozzle chamber 39 wherein that is communicated with the fluid feed hole 33 of nozzle opening 38 and membrane structure 32.Resistor 34 is positioned in the nozzle chamber 39, and comprises the lead 35 that resistor 34 is electrically connected to driving signal and ground connection.
Membrane structure 32 for example forms by the one or more passivation or the insulating barrier of silica, carborundum, silicon nitride, tantalum, polysilicon glass or other material.In one embodiment, membrane structure 32 also comprises the conducting shell that limits resistor 34 and lead 35.Conducting shell for example forms by aluminium, gold, tantalum, tantalum-aluminium or other metal and metal alloy.
In one embodiment, in operating process, fluid flows to nozzle chamber 39 via fluid feed hole 33 from fluid feed slot 41.It is relevant that nozzle opening 38 and resistor 34 can be operated, when resistor 34 energisings, make fluid drop via nozzle opening 38 from nozzle chamber 39 plane of resistor 34 (for example perpendicular to) and towards medium injection.
The exemplary embodiment of fluid ejection apparatus 30 comprises the fluid ejection apparatus of aforesaid thermal print head, piezoelectric printhead, gentle varicose power printhead or any other type well known in the art.In one embodiment, fluid ejection apparatus 30 is fully-integrated thermal inkjet printhead.
Fig. 3 represents another embodiment of a part of the fluid ejection apparatus 130 of inkjet printhead assembly 12.Fluid ejection apparatus 120 comprises the array of drop injection component 131.Drop injection component 131 is formed on the substrate 140 with formation fluid (printing ink) supply stria 131 wherein.Therefore.Fluid feed slot 141 provides the supply of fluid (printing ink) to drop injection component 131.Substrate 140 is for example formed by silicon, glass or pottery.
In one embodiment, each drop injection component 131 comprises membrane structure 132 and the orifice layer 136 with resistor 134.Membrane structure 132 has formation fluid (printing ink) supply orifice 133 wherein that is communicated with the fluid feed slot 141 of substrate 140.Orifice layer 136 also has the formation nozzle chamber 139 wherein that is communicated with nozzle opening 138 and fluid feed hole 133 separately.In one embodiment, orifice layer 136 comprises barrier layer 1361 that limits nozzle chamber 139 and the nozzle plate 1362 that limits nozzle opening 138.
In one embodiment, in operating process, fluid is from flowing to nozzle chamber 139 via fluid feed hole 133 from fluid feed slot 141.It is relevant that nozzle opening 138 and resistor 134 separately can be operated, when resistor 134 energisings, make fluid drop via nozzle opening 138 from nozzle chamber 139 and towards medium injection.
Shown in the embodiment of Fig. 3, substrate 140 has first side 143 and second side 144.Second side 144 is opposite with first side 143, and in one embodiment, is roughly parallel to first side, 143 orientations.Therefore, fluid feed hole 133 is communicated with first side 143 of substrate 140, and fluid feed slot 141 is communicated with second side 144 of substrate 140.Fluid feed hole 133 and fluid feed slot 141 are interconnected, so that form fluid passage or the opening 145 that passes substrate 140.Therefore, fluid feed slot 141 forms the part of opening 145, and fluid feed hole 133 forms the part of opening 145.In one embodiment, opening 145 is as described below is processed to form in substrate 140 by abrasion.
Fig. 4 A-4H represents to pass an embodiment of the opening 150 of substrate 160.In one embodiment, substrate 160 is silicon substrates, and opening 150 is as described below is processed to form in substrate 160 by abrasion.Substrate 160 has first side 162 and second side 164.Second side 164 is opposite with first side 162, and in one embodiment, is roughly parallel to first side, 162 orientations.Opening 150 is communicated with first side 162 and second side 164 of substrate 160, so that passage or the raceway groove that passes substrate 160 is provided.Though have only an opening 150 to be expressed as being formed in the substrate 160, should be understood that any amount of opening 150 can be formed in the substrate 160.
In one embodiment, first side 162 forms the front side of substrate 160, and the rear side of second side, 164 formation substrates 160, makes fluid flow through opening 150 and substrate 160 from the rear side to the front side.Therefore, opening 150 provides via the fluid passage of substrate 160 with fluid (printing ink) and 131 connections of drop injection component.
In one embodiment, shown in Fig. 4 A and 4B, before opening 150 passes substrate 160 formation, the membrane structure 132 that comprises resistor 134 is formed on the substrate 160, shown in the embodiment of Fig. 4 A, before membrane structure 132 formed, oxide skin(coating) 170 and 172 was respectively formed on first side 162 and second side 164 of substrate 160.In one embodiment, oxide skin(coating) 170 and 172 forms by grow oxide on first side 162 and second side 164.Oxide can comprise for example silica (SiO2) or field oxide (FOX).
Then, shown in Fig. 4 B, membrane structure 132 is formed on first side 162 of substrate 160.More especially, membrane structure 132 is made on the oxide skin(coating) 170 that is formed on first side 162 of substrate 160.As mentioned above, membrane structure 132 comprises one or more passivation or the insulating barrier that forms by silica, carborundum, silicon nitride, tantalum, polysilicon glass or other material.In addition, membrane structure 132 also comprises the conducting shell that limits resistor 134 and respective conductive path and lead.Conducting shell for example forms by aluminium, gold, tantalum, tantalum-aluminium or other metal and metal alloy.
Equally, shown in the embodiment of Fig. 4 B, oxide skin(coating) 170 forms patterns, is communicated with so that limit or determine wherein opening 150 (Fig. 4 H) to be formed in first side 162 of substrate 160 and with it.Oxide skin(coating) 170 can for example form pattern by photoetching and etching, so that limit the expose portion of first side 162 of substrate 160.
In one embodiment, shown in Fig. 4 C, before the part of opening 150 or opening 150 was formed in the substrate 160, centering stria 152 was formed in first side 162; In one embodiment, in the time of in opening 150 forms substrates 160, centering stria 152 is controlled at and where opening 150 is communicated with first side 162 of substrate 160.In one embodiment, centering stria 152 is formed in the substrate 160 by being chemically etched into from first side 162 in the substrate 160, and chemical etching for example comprises dry type, plasma or reactive ion etching.
In one embodiment, shown in Fig. 4 C, in order to form centering stria 152 in substrate 160, mask layer 180 is formed on first side 162 of substrate 160.More especially, mask layer 180 is formed on membrane structure 132 and the resistor 134.Therefore, mask layer 180 is used for controlling selectively or stopping the etching of first side 162.
In one embodiment, mask layer 180 deposits and forms pattern by photoetching and etching and forms, so that limit the expose portion of first side 162, more especially comprises the expose portion that is formed on the oxide skin(coating) 170 on first side 162.Therefore, mask layer 180 forms pattern, where centering stria 152 is formed in the substrate 160 from first side 162 so that determine and be limited to.
In one embodiment, centering stria 152 is formed in the substrate 160 by chemical etching.Therefore, mask layer 180 is formed by the material that is used for centering stria 152 is etched in the etchant in the substrate 160 as opposing.The example that is applicable to the material of mask layer 180 comprises silica, silicon nitride, photoetching resist.After centering stria 152 forms, remove or lift-off mask layer 180.
In one embodiment, shown in Fig. 4 D, comprise that more especially the part of sacrifice layer 136 on the barrier layer 1361 of orifice layer 136 is formed on first side 162 of substrate 160.Barrier layer 1361 is formed on the membrane structure 132, and forms pattern so that limit nozzle chamber 139 (Fig. 3).Barrier layer 1361 is formed by the photoimaging epoxy resin of for example SU8.
Then, shown in the embodiment of Fig. 4 E, before opening 150 was formed on substrate 160, mask layer 182 and 184 was formed on the substrate 160.More especially, mask layer 182 is formed on first side 162 of substrate 160, and mask layer 184 is formed on second side 164 of lining 160.In one embodiment, mask layer 182 is formed on barrier layer 1361 and comprises on the membrane structure 132 of resistor 134, and mask layer 184 is formed on the oxide skin(coating) 172. Mask layer 182 and 184 is used for controlling selectively respectively and stopping the abrasion processing of first side 162 and second side 164 of substrate 160, forms a plurality of parts of opening 150 simultaneously as mentioned above.
In one embodiment, mask layer 182 and 184 forms by depositing or spray and forming pattern by photoetching and etching, so that limit the exposed region of substrate 160.More especially, mask layer 182 and 184 forms pattern, is formed in the substrate 160 from first side 162 and second side 164 wherein so that determine the part (Fig. 4 H) of opening 150.In one embodiment, as described below, opening 150 is processed to form in substrate 160 by abrasion.Therefore, mask layer 182 and 184 is formed by opposing abrasion material processed.In one embodiment, for example mask layer 182 and 184 material comprise the photoetching resist.
Shown in the embodiment of Fig. 4 F, after mask layer 182 and 184 formed and forms pattern, the first 154 of opening 150 was formed in the substrate 160.In one embodiment, first 154 forms by the abrasion process.More especially, first 154 forms by the exposed region of processing the substrate 160 that is limited by mask layer 184 towards 162 abrasions of first side from second side 164.
In one embodiment, the abrasion process is included in substrate 160 places and guides for example flow of the compressed gas and the abrasive particulate material of air.Therefore, abrasive particulate material stream impacts on substrate 160, and denudes or corrode the exposed region of the substrate 160 that limits by mask layer 184 (and/or mask layer 182 as described below).Abrasive particulate material can comprise other suitable abrasive material of for example sand, aluminium oxide, carborundum, quartz and diamond dust and particle form or have suitable abrasion performance so that the granular materials of abrasion substrate 160.
In one embodiment, shown in Fig. 4 F, the first 154 of opening 150 comprises first area 1541 and second area 1542.First area 1541 is communicated with second side 164 of substrate 160, and in one embodiment, limits the full-size of the first 154 of opening 150 at second side, 164 places of substrate 160.In addition, second area 1542 is communicated with first area 1541, and in one embodiment, limits the minimum dimension of the first 154 of opening 150.
In one embodiment, the first area 1541 of first 154 forms with the different corrosion rates of second area 1542 by the abrasion process.For example, first area 1541 is by forming with first corrosion rate abrasion processing, and second area 1542 forms to denude processing less than second corrosion rate of first corrosion rate subsequently.In one embodiment, carry out the cycle very first time with the abrasion processing of first corrosion rate, and denude processing with second corrosion rate and carried out for second time cycle.In one exemplary embodiment, the cycle very first time and second time cycle are about equally.Therefore, the less corrosion rate of second area 1542 is for second area 1542 abrasion less material.
Shown in the embodiment of Fig. 4 G, the second portion 156 of opening 150 is formed in the substrate 160.In one embodiment, second portion 156 forms by the abrasion process as mentioned above.More especially, the second portion 156 of opening 150 forms by the exposed region of processing the substrate 160 that is limited by mask layer 182 towards 164 abrasions of second side from first side 162.
In one embodiment, shown in Fig. 4 G, the abrasion of the substrate 160 from first side 162 towards second side 164 processing is carried out at centering stria 152 and after removing any part that is retained in the substrate 160 between the centering stria 152 in advance.Therefore, in one embodiment, the second portion 156 of opening 150 comprises first area 1561 that is limited by centering stria 152 and the second area 1562 that is limited by the abrasion process.First area 1561 is communicated with first side 162 of substrate 160, and in one embodiment, limits the full-size of the second portion 156 of opening 150 at first side, 162 places of substrate 160.In addition, second area 1562 is communicated with first area 1561, and limits the minimum dimension of the second portion 156 of opening 150 in one embodiment.
In one embodiment, shown in Fig. 4 F and 4G, before the second portion 156 of opening 150 was formed in the substrate 160, the first 154 of opening 150 was formed in the substrate 160.But in other embodiments, the first 154 of opening 150 forms after forming second portion 156, and perhaps first 154 and second portion 156 are roughly forming (second portion 156 formation when the first 154 of opening 150 forms that is opening 150) simultaneously.
Shown in the embodiment of Fig. 4 H, after the opening 150 of first 154 that comprises opening 150 particularly and second portion 156 forms, peel off or remove mask layer 182 and 184.Subsequently, nozzle plate 1362 is arranged on first side 162 of substrate 160.More especially, in one embodiment, nozzle plate 1362 be formed on barrier layer 1361 on the membrane structure 132 and separate and form and fix on it.Nozzle plate 1362 limits nozzle opening 138, and in one embodiment, by comprising that for example one or more layers material of metal material forms, metal material for example is nickel, copper, iron/nickel alloy, palladium, gold or rhodium.
Shown in the embodiment of Fig. 4 H, the first 154 of opening 150 and second portion 156 are communicated with, and form the neck 158 of opening 150.In one embodiment, neck 158 limits the minimum dimension of first 154 and the minimum dimension of second portion 156.Therefore, the full-size of neck 158 is less than the full-size of first 154, and less than the full-size of second portion 156.In one embodiment, neck 158 with respect to the position of first side 162 of substrate 160 and second side 164 by substrate 160 from first side 162 towards second side 164 abrasion processing and the relative duration of the abrasion processing of substrate 160 from second side 164 towards first side 162 control.
In one embodiment, shown in Fig. 4 H, pass the profile of the opening 150 of substrate 160 and converge to neck 158 towards first side 162, and disperse from neck 158 to second sides 162 from second side 164.More especially, the first 154 of opening 150 converges to neck 158 towards first side 162 from second side 164, and the second portion 156 of opening 150 disperses from neck 158 to first sides 162.In one embodiment, the first area 1541 of first 154 is converged towards second side 162 from second side 164 with first gradient, and the second area 1542 of first 154 is 1541 to converge towards first side 162 from the first area greater than second gradient of first gradient of first area 1541.In addition, in one embodiment, the second area 1562 of second portion 156 disperses towards first side 162 from neck 158 with first gradient, and the first area 1561 of second portion 156 disperses from second area 1562 to first sides 162 with second gradient less than first gradient of second area 1562.
In one embodiment, shown in Fig. 4 H, the first 154 and the second portion 156 of the opening 150 that is processed to form by abrasion comprise recessed sidewall.More especially, the first area 1541 and the second area 1542 of first 154 comprise recessed sidewall, and the second area 1562 of second portion 156 comprises recessed sidewall.In one embodiment, the first area 1561 of second portion 156 comprises the linear sidepiece (Fig. 4 C) that is limited by centering stria 152.
Though above description refers to the substrate 160 that comprises the opening 150 that forms in the inkjet printhead assembly, understand that the substrate 160 with formation opening 150 wherein can be incorporated in the system of other fluid injection system that comprises non-print application or other application with fluid passage of passing substrate, for example medical treatment device or other micro electronic mechanical system (MEMS device).Therefore, method described herein, structure and system are not limited to printhead, and applicable to any substrate with stria.In addition; though above description refers to the opening 150 of fluid or printing ink guiding by substrate 160, should be understood that any flowable materials that comprises the liquid of water, printing ink, blood or resist for example or comprise talcum powder for example or opening 150 by substrate 160 can be supplied or guide to the fluent solid of medicine powder or air.
Though describe and illustrated specific embodiment here, those skilled in the art will appreciate that multiple type selecting and/or be equal to the specific embodiment that application can replace institute to describe and illustrate, and do not depart from scope of the present invention.The present invention is intended to cover any remodeling or the modification of specific embodiment described herein.What therefore, planned is that the present invention only limits by claim and equivalents thereof.
Claims (12)
1. method that is formed for the substrate (160) of fluid ejection apparatus, this substrate has first side (162) and second side (164) opposite with first side, and this method comprises:
With first corrosion rate, be worked in the substrate to lose from second side towards first side grinding subsequently less than second corrosion rate of first corrosion rate, comprise the first (154) that forms the fluid passage (150) in the substrate; And
Lose from first side towards second side grinding and to be worked in the substrate, comprise the second portion (156) that forms the fluid passage in the substrate;
Wherein forming one of first or second portion comprises in the second portion of the first of one of the first of fluid passage and second portion of fluid passage and fluid passage and fluid passage another is communicated with.
2. the method for claim 1 is characterized in that, forms one of first or second portion and comprises formation fluid passage neck (158).
3. method as claimed in claim 2 is characterized in that, the neck of fluid passage limits the minimum dimension of first and the minimum dimension of second portion.
4. the method for claim 1 is characterized in that, the full-size of first is greater than the full-size of second portion.
5. the method for claim 1 is characterized in that, also comprises:
Before being worked in the substrate from the erosion of first side grinding, be chemically etched in the substrate towards second side from first side, comprise that part forms the second portion of fluid passage.
6. substrate (160) that is used for fluid ejection apparatus, this substrate comprises:
First side (162);
Second side (164) opposite with first side; And
The fluid passage (150) that is communicated with first side and second side, the fluid passage comprises the first (154) that is communicated with first side and the second portion (156) that is communicated with second side and the neck between first and second portion (158), and wherein neck limits the minimum dimension of fluid passage.
7. substrate as claimed in claim 6 is characterized in that the full-size of the first of fluid passage is greater than the full-size of the second portion of fluid passage.
8. substrate as claimed in claim 7 is characterized in that, the first of fluid passage comprises the second area (1542) that first area (1541) that the full-size by first partly limits and the minimum dimension by neck partly limit.
9. substrate as claimed in claim 8 is characterized in that, the first area comprises the first recessed sidewall, and second area comprises the second recessed sidewall.
10. substrate as claimed in claim 8 is characterized in that the first area is converged towards first side from second side with first gradient, and second area converges from the first area towards first side with second gradient greater than first gradient.
11. substrate as claimed in claim 6 is characterized in that, the second portion of fluid passage comprises at least one zone (1562) that the minimum dimension by neck partly limits.
12. substrate as claimed in claim 11 is characterized in that, described at least one zone disperses towards first side from neck.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60608604P | 2004-08-31 | 2004-08-31 | |
| US60/606,086 | 2004-08-31 | ||
| US11/007,103 | 2004-12-07 |
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| CN101010200A CN101010200A (en) | 2007-08-01 |
| CN100519194C true CN100519194C (en) | 2009-07-29 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417032A (en) * | 2001-10-31 | 2003-05-14 | 惠普公司 | Micromachined silicon interlocking structure for attaching tablet to pen body |
| CN1496838A (en) * | 2002-10-24 | 2004-05-19 | 惠普开发有限公司 | Fluid jet device and method |
-
2005
- 2005-07-29 CN CNB2005800293139A patent/CN100519194C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417032A (en) * | 2001-10-31 | 2003-05-14 | 惠普公司 | Micromachined silicon interlocking structure for attaching tablet to pen body |
| CN1496838A (en) * | 2002-10-24 | 2004-05-19 | 惠普开发有限公司 | Fluid jet device and method |
Non-Patent Citations (3)
| Title |
|---|
| 2003140497A1 2003.07.31 |
| 2003164355A 2003.09.04 |
| 2003210299A1 2003.11.13 |
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| CN101010200A (en) | 2007-08-01 |
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