CN100517077C - Exposal machine carrying platform cleaning method and system - Google Patents
Exposal machine carrying platform cleaning method and system Download PDFInfo
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- CN100517077C CN100517077C CNB2006101188352A CN200610118835A CN100517077C CN 100517077 C CN100517077 C CN 100517077C CN B2006101188352 A CNB2006101188352 A CN B2006101188352A CN 200610118835 A CN200610118835 A CN 200610118835A CN 100517077 C CN100517077 C CN 100517077C
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- carrying platform
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Abstract
An exposure machine chip carrier surface cleaning method comprises the steps of obtaining particle defect position information of the surface of a chip carrier, moving the chip carrier according to the position information, positioning the particle defect below a gas nozzle and an exhaust port, spouting gas to the surface of the chip carrier through the gas nozzle and discharging the gas through the exhaust port. An exposure machine chip carrier surface cleaning system comprises a positioning device, a gas spouting pipe with the gas nozzle, an exhaust pipe with the exhaust port and a control device for controlling the gas spouting pipe to spout gas and controlling the exhaust pipe to discharge gas. The exposure machine chip carrier surface cleaning system and method of the present invention can save cleaning time, reduces the wear of a substrate under the exposure machine chip carrier, and improves the utilization ratio of exposure machines.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, the clean method and the system of the exposal machine carrying platform in particularly a kind of photoetching process.
Background technology
The exposure sources of two slide holders (twin stage) has been developed success and has been applied to the production line that semiconductor is made, and wafer hockets by two slide holders and exposes and calibration operation, has improved the ability of exposure machine processing wafer greatly.The patent No. be US6262796B1 U.S. Patent Publication a kind of pair of slide holder exposure machine and be applied to two slide holder structures of this exposure machine.Fig. 1 is two slide holder structural representations of described U.S. Patent Publication.As shown in Figure 1, described pair of slide holder structure has two " H " shape guide rails 10 staggered relatively, 11 are positioned in the substrate 1, described guide rail 10 has two parallel placement guide rods 12,13 and one with the vertical slide bar 16 of described guide rod 12,13, described guide rail 11 has the guide rod 14 of two parallel placements, 15 and one with the vertical slide bar 17 of described guide rod 14,15.Described slide bar 16 can slide along described guide rod 12,13, and described slide bar 17 can slide along described guide rod 14,15, has slidably slide block 18 and 19 on described slide bar 16 and 17 respectively.Described slide block 18 is connected by the attachment 22 of its attachment 20 and first slide holder 26, and described cunning fast 19 is connected by the attachment 25 of its attachment 21 and described second slide holder 27.Described first slide holder 26 and second slide holder 27 have first loading surface 28 and second loading surface 29 respectively, and described first slide holder 26 and second slide holder 27 yet have attachment 23 and 24 respectively.Described two slide holders 26 and 27 can make the attachment 23 of described first slide holder 26 be connected on the attachment 21 of cunning fast 19 by guide rail movement and exchange, and the attachment 24 of described second slide holder 27 are connected on the attachment 20 of cunning fast 18.
Fig. 2 is the structural representation with exposure machine of described pair of slide holder.As shown in Figure 2, second slide holder 27 be positioned at imaging len 30 under, on described second slide holder 27, be placed with second wafer 32, above described imaging len 30, be placed with mask plate 33, the irradiation of the light by described mask plate 33 tops, the figure on the described mask plate 33 can be projeced on second wafer 32 by imaging len 30.Described first slide holder 26 is positioned at described measurement calibrating installation 34 belows, can measure and calibrate first wafer 31, when described first wafer 31 is finished measurement and calibration, after second wafer 32 is finished exposure, described first slide holder 26 and second slide holder, 27 switches, make described first slide holder 26 move to below the imaging len 30, described first wafer 31 is exposed, second slide holder 27 moves to and measures calibrating installation 34 lower positions, unload second wafer 32, and load other wafer and measure and calibrate, expose preparing.
When on first loading surface 28 or second loading surface 29 particle defects (particale defect) being arranged, can cause wafer surface projection on described first loading surface 28 or second loading surface 29, influence the focusing of described wafer surface when 30 times exposures of imaging len, cause the figure on the described mask plate 33 can not well transfer to wafer surface.The method of existing removing loading surface particle defects at first will make whole exposure machine stop, and opens the shell of exposure machine then, and the substrate below the described slide holder is thrown away together with slide holder in the lump, cleans whole slide holder surface by adsorbent equipment.Described clean method needs to shut down when the cleaning slide holder, to having the exposure machine of two slide holders, has particle defects even have only on the slide holder especially, also has to make entire machine to be stopped, and loses time, and has reduced output.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of clean method and system of exposal machine carrying platform, to solve the problem that existing exposal machine carrying platform clean method is lost time.
For achieving the above object, the clean method on a kind of exposal machine carrying platform provided by the invention surface comprises: obtain the positional information of slide holder surface particle defective, according to described positional information, move described slide holder, make described particle defects be positioned at gas spout and exhausr port below; Spray gas by described gas spout to described slide holder surface, and described gas is discharged by described exhausr port.
By in exposure process, the measurement of the surface flatness of slide holder semiconductor-on-insulator wafer being obtained the positional information of described slide holder surface particle defective.
Described ejection gas is inert gas.Described inert gas is a nitrogen.
The air pressure of described nitrogen is 50 to 100Pa.
The air pressure of described exhausr port is 30 to 80pa.
Described gas spout is to be the angle of 30 to 75 degree to described slide holder surface ejection gas with described slide holder surface.
Accordingly, the present invention also provides a kind of exposal machine carrying platform cleaning surfaces system, comprising: locating device is used to obtain the positional information of slide holder surface particle defective, and move slide holder according to described positional information, make described particle defects be positioned at the gas spout below; Be used to control the control device of the jet and gas outlet exhaust of air jet pipe; Air jet pipe with gas spout; Gas outlet with exhausr port; Wherein, the oblique described slide holder surface of pointing to down of the gas spout of described air jet pipe.
Described cleaning systems comprise that also one has the lid of upper bottom surface and sidewall, and wherein said air jet pipe and gas outlet pass described lid, and described gas spout and exhausr port are positioned among the described lid.
The structure of described lid is a kind of in barrel-shaped, truncated cone-shaped or the reverse frustoconic.
The angle on described air jet pipe and described slide holder surface is 30 to 75 degree.
The gas spout of described air jet pipe is 0.5 to 1cm to the distance on described slide holder surface.
Described gas outlet is positioned at the position of described air jet pipe about described slide holder surface normal symmetry, and described exhausr port equates with the distance of described gas spout to described slide holder surface.
The diameter of described gas spout is 1/4 to 1/10 inch.
The diameter of described exhausr port is 1/3 to 1 inch.
The present invention also provides a kind of exposure machine, comprising: the mask plate brace table; The focal imaging lens; Can be along the slide holder of guide rail slip; Air jet pipe with gas spout has the gas outlet of exhausr port; The control device that be used to control that described air jet pipe is jet, gas outlet exhaust, slide holder is moved; Wherein, described focal imaging lens are positioned at described guide rail primary importance top, described mask plate brace table is positioned at described focal imaging lens top, and described air jet pipe and gas outlet are positioned at described guide rail second place top, and the described second place of the oblique sensing down of the gas spout of described air jet pipe.
Compared with prior art, the present invention has the following advantages:
The present invention has at first utilized the characteristic of the focusing of exposure machine condenser lens to the semiconductor wafer surface flatness sensitivity on the slide holder to the cleaning course of slide holder surface particle defective, obtain the positional information of slide holder surface particle defective, and move described slide holder according to described positional information, make described particle defects be positioned at the below of air jet pipe gas spout, described particle defects is removed to described slide holder surface ejection gas by described gas spout, this method needn't make exposure machine stop, the shell that more needn't open exposure machine cleans described slide holder surface, obtaining described positional information can carry out synchronously with exposure process, save the time, improved the utilization factor of exposure machine.
Have now the cleaning requirement of slide holder is opened the exposure machine shell, make slide holder be exposed to fully in the external environment condition, easier of external environmental.Method of the present invention needn't be opened the exposure machine shell, has avoided slide holder by external environmental, makes higher to the cleaning efficiency of slide holder;
Have now when slide holder is cleaned and the substrate below the slide holder need be thrown away together with described slide holder in the lump, can cause wearing and tearing to described substrate, in the course of time, the flatness of substrate will be affected, and the wearing and tearing to substrate can be avoided or reduce to method of the present invention.
When exposing by exposure machine, the inventive method obtains the positional information of slide holder surface particle defective, the position of accurate localization particle defects comparatively, and by the nitrogen of gas spout ejection the particle defects on slide holder surface is removed.
Description of drawings
Fig. 1 is the vertical view of existing a kind of pair of slide holder structure;
Fig. 2 is the exposure machine structural representation with described pair of slide holder of Fig. 1;
Fig. 3 is the process flow diagram of the clean method embodiment on exposal machine carrying platform of the present invention surface;
Fig. 4 is the vertical view of two slide holders of the clean method on application exposal machine carrying platform of the present invention surface;
Fig. 5 is the diagrammatic cross-section of first embodiment of exposal machine carrying platform cleaning surfaces of the present invention system;
Fig. 6 is the structural representation of the lid among second embodiment of exposal machine carrying platform cleaning surfaces of the present invention system;
Fig. 7 is the structural representation of the lid among the 3rd embodiment of exposal machine carrying platform cleaning surfaces of the present invention system;
Fig. 8 is the structural representation of the embodiment of exposure machine of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
The invention discloses the clean method on a kind of exposal machine carrying platform surface, this method is by the surface undulation information of wafer on the slide holder that obtains in the exposure process, judge the positional information of particle defects on the described slide holder surface, and move described slide holder according to described positional information, make described particle defects be positioned at the below of gas spout and exhausr port, spray gas by described gas spout to described slide holder surface, air-flow by ejection gas is removed the particle defects on the described slide holder, and by exhausr port the described gas that has particle defects is discharged.The clean method on exposal machine carrying platform of the present invention surface is by the position of exposure information location particle defects, and move described slide holder to the below of described gas spout by control device, by jet and exhausr port described particle defects is removed, exposure machine needn't stop, also needn't open exposure machine, improve the utilization factor of exposure machine, and reduced the wearing and tearing of exposure machine.
Be described below in conjunction with the clean method of process flow diagram exposal machine carrying platform of the present invention surface.Fig. 3 is the process flow diagram of the embodiment of the clean method on exposal machine carrying platform of the present invention surface.
As shown in Figure 3, at first obtain the positional information (S100) of slide holder surface particle defective.Described slide holder is used for bearing wafer, wafer will exposed areas carry out the measurement of surface flatness on when exposure, exposure machine was at first to slide holder, and by described wafer surface is calibrated in the adjustment of described slide holder, make that the photoresist total surface on the wafer is to be positioned on the focal plane of condenser lens, then by scan-type or step printing with the figure transfer on the mask plate to described photoresist.If there is particle defects on the slide holder surface, after semiconductor wafer is adsorbed on described slide holder surface, particle defects can cause described semiconductor wafer surface projection, and this projection can't be eliminated by the adjustment to described slide holder, when being detected, described semiconductor wafer surface flatness will detect this projection, and write down the positional information of this projection, all detect this projection in identical position during if expose, think that then the relevant position has particle defects on the following slide holder of this semiconductor wafer upper process for two semiconductor wafers.The position coordinates of the projection that is write down is the position coordinates of described slide holder surface particle defective.Also write down the positional information of particle defects on the slide holder when the semiconductor wafer on the slide holder is exposed simultaneously, this process is actually the result who has utilized exposure process that the semiconductor wafer surface flatness is measured.
When detection slide holder surface has particle defects, the positional information of described particle defects need be sent to control device, wait to finish the exposure of described slide holder semiconductor-on-insulator wafer and when semiconductor wafer also is not sent to this slide holder down, move described slide holder by control device, make the particle defects on the described slide holder be positioned at the below (S120) of gas spout and exhausr port.
To described slide holder surface ejection gas, described ejection gas is removed the particle defects on described slide holder surface by described gas spout, by exhausr port the described gas that has particle defects is discharged (S130).Described gas spout is to be the angle of 30 to 75 degree to described slide holder surface ejection gas with described slide holder surface.Described ejection gas is inert gas, and the gas of ejection described in the present embodiment is nitrogen, and the air pressure of described nitrogen is 50 to 100Pa.The air pressure of described exhausr port is 30 to 80pa.The air-flow of the gas by the ejection of described gas spout blows afloat the particle defects on described slide holder surface, by exhausr port described particle defects is discharged simultaneously.After finishing cleaning, can continue to load semiconductor wafer thereon, and move described slide holder and to condenser lens, expose described slide holder surface.The present invention has at first utilized the characteristic of the focusing of exposure machine condenser lens to the semiconductor wafer surface flatness sensitivity on the slide holder to the cleaning course of slide holder surface particle defective, obtain the positional information of described slide holder surface particle defective, and move described slide holder according to described positional information, make described particle defects be positioned at the below of gas spout, described particle defects is removed to described slide holder surface ejection gas by described gas spout, this method needn't make exposure machine stop, the shell that more needn't open exposure machine cleans described slide holder surface, obtaining described positional information can carry out synchronously with exposure process, save the time, improved the utilization factor of exposure machine; Have now the cleaning requirement of slide holder is opened the exposure machine shell, make slide holder be exposed to fully in the external environment condition, easier of external environmental, method of the present invention has avoided slide holder by external environmental, makes higher to the cleaning efficiency of slide holder; And existing method need throw away the substrate below the slide holder to come together with described slide holder when slide holder is cleaned in the lump, can cause wearing and tearing to described substrate, in the course of time, the flatness of substrate will be affected, and the wearing and tearing to substrate can be avoided or reduce to method of the present invention.In addition, the inventive method is the position of accurate localization particle defects comparatively, and by the nitrogen of gas spout ejection the particle defects on slide holder surface is removed.
Among the embodiment of the inventive method, described exposure machine can have two slide holders.As shown in Figure 4, first semiconductor wafer on first slide holder 26 measures calibration in primary importance 51.Second semiconductor wafer on second slide holder 27 exposes in the second place 52.Monitor in the exposure process after described second slide holder 27 surfaces have particle defects, write down the positional information of described particle defects, after treating that described second semiconductor wafer is finished exposure, exchange that position of described first slide holder and second slide holder, make described second slide holder 27 to primary importance 51, unload described second semiconductor wafer; First slide holder 26 is to the second place 52, expose to having finished first semiconductor wafer that measures calibration on described first slide holder 26, simultaneously, move second slide holder, 27 to the 3rd positions 53 of having finished unloading second semiconductor wafer, above described the 3rd position, have gas spout and exhausr port, and make the position of particle defects on described second slide holder 27 be positioned at the below of described gas spout and exhausr port, spray gas by gas spout to described second slide holder surface then, described particle defects is removed, and the gas that will have particle defects by exhausr port is discharged.After finishing cleaning to described second slide holder 27 surfaces, move described second slide holder 27 once more to primary importance, load the 3rd semiconductor wafer, after treating that first semiconductor wafer on described first slide holder 26 is finished exposure, exchange the position of described first slide holder 26 and second slide holder 27, the 3rd semiconductor wafer on described second slide holder 27 is exposed, unload first semiconductor wafer of having finished exposure on described first slide holder 26, if monitor on described first slide holder 26 particle defects is not arranged, continue to load the 4th semiconductor wafer, if monitor on described first slide holder 26 particle defects is arranged, move described first slide holder 26 to the 3rd positions 53 and remove, and the like, exposure and removing slide holder surface particle defective can be carried out simultaneously, be independent of each other, improved the efficient of exposure machine.
The present invention also provides an exposal machine carrying platform cleaning surfaces system, exposal machine carrying platform cleaning surfaces of the present invention system comprises the air jet pipe with gas spout, gas outlet with exhausr port, locating device and control device, wherein said locating device can obtain the positional information of slide holder surface particle defective, and move slide holder according to described positional information, and making the below of described particle defects to described gas spout, described control device is controlled the jet and gas outlet exhaust of described air jet pipe.Fig. 5 is the diagrammatic cross-section of first embodiment of exposal machine carrying platform cleaning surfaces of the present invention system.As shown in Figure 5, described exposal machine carrying platform cleaning surfaces system comprises air jet pipe 204, gas outlet 206, locating device 201 and control device 202.Described air jet pipe 204 has gas spout 205, and described gas outlet 206 has gas outlet 207.Gas spout 205 oblique described slide holder 210 surfaces of pointing to down of described air jet pipe 204.
Described control device 202 is used to control described air jet pipe 204 jet and described gas outlet 206 exhausts, described locating device 201 is used to obtain the positional information on described slide holder 210 surfaces, move the below of described slide holder 210, and make described particle defects be positioned at the below of described gas spout 205 and exhausr port 207 to described air jet pipe 204 and gas outlet 206.Can communicate between described locating device 201 and the described control device 202, make described slide holder 210 finish and carry out jet and exhaust after move the location.Described air jet pipe 204 is spent with the angle 30 to 75 on described slide holder 210 surfaces, and angle described in the present embodiment is 45 degree.The diameter of described gas spout 205 is 1/4 to 1/10 inch, and the diameter of gas spout described in the present embodiment is 1/8 inch; The diameter of described exhausr port 207 is 1/3 to 1 inch, and the diameter of exhausr port described in the present embodiment 207 is 1/2 inch.The gas spout 205 of described air jet pipe 204 is 0.5 to 1cm to the distance on described slide holder 210 surfaces, and distance is 0.8cm described in the present embodiment.Described gas outlet 206 is positioned at the position of described air jet pipe 204 about described slide holder 210 surface normals 203 symmetries, and described exhausr port 207 equates to described slide holder 210 surface distances that with described gas spout 203 gas outlet described in the present embodiment 206 also is 45 degree with the angle on described slide holder 210 surfaces.
Described cleaning systems comprise that also one has upper bottom surface and sidewall lid 208, and wherein said air jet pipe 204 and gas outlet 206 pass described lid 208, and described gas spout 205 and exhausr port 207 are positioned among the described lid 208.Described lid 208 is a kind of in barrel-shaped, truncated cone-shaped or the reverse frustoconic structure, and lid described in the present embodiment 208 is for barrel-shaped.
Lid 212 is a reverse frustoconic among second embodiment of exposure machine cleaning systems of the present invention, as shown in Figure 6, air jet pipe 204 and gas outlet are symmetrically distributed and described lid 212 axis both sides, and pass described lid 212, and other structure of present embodiment repeats no more here with first embodiment.
The present invention also provides a kind of exposure machine, and described exposure machine includes the mask plate brace table, and the focal imaging lens can have the air jet pipe of gas spout along the slide holder of guide rail slip, have the gas outlet of exhausr port, control device; Described control device is used to control the exhaust of the jet and gas outlet of described air jet pipe.Among the embodiment of exposure machine of the present invention, described focal imaging lens are positioned at described guide rail primary importance top, described mask plate brace table is positioned at described focal imaging lens top, described air jet pipe and gas outlet are positioned at described guide rail second place top, and the described second place of the oblique sensing down of the gas spout of described air jet pipe.
The structural representation of the embodiment of exposure machine of the present invention as shown in Figure 8, described exposure machine comprises mask plate brace table 33, focal imaging lens 30 can be along first slide holder 26 and second slide holder 27, air jet pipe 204 and the gas outlet 206 of guide rail 1 slip.Described focal imaging lens 30 are positioned at guide rail 1 primary importance 61 tops, and described air jet pipe 204 and gas outlet 206 are positioned at the top of the described second place 60, the described second place 60 of the oblique sensing down of the gas spout of described air jet pipe 204.Slide holder is in primary importance 61, be the semiconductor wafer on the described slide holder to be exposed below the described focal imaging lens 30, by can know in exposure process whether described slide holder surface has the positional information of particle defects and particle defects, and slide holder cleans the slide holder surface when the second place 60.For example in the present embodiment, second slide holder 27 is when described primary importance 61, and exposure machine exposes to the semiconductor wafer 32 on described second slide holder 27; The semiconductor wafer of finishing exposure on first slide holder 26 is unloaded, the positional information of the particle defects by first slide holder, 26 surfaces when the semiconductor wafer on first slide holder 26 is exposed, known, move described first slide holder to the second place 60, gas spout by spray control device control air jet pipe 204 sprays gases to described first slide holder 26 surfaces, and the particle defects on described first slide holder 26 surfaces is removed.Exposure machine of the present invention also comprises down barrel-shaped lid 206, describedly fall barrel-shaped lid 208 and be positioned at the described second place 60 tops, described air jet pipe 204 and gas outlet 208 pass described lid 208, and the gas spout of described air jet pipe 204, the exhausr port of gas outlet 208 are positioned at described falling among the barrel-shaped lid 208.Describedly fall barrel-shaped lid 208 and be used to prevent that the gas of described air jet pipe 204 ejections from being blown described particle defects to other place,, cause other to pollute, guarantee that the particle defects that blows afloat can discharge by gas outlet such as exposure machine condenser lens bottom.
Though the present invention with preferred embodiment openly as above; but it is not to be used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible change and modification, so protection scope of the present invention should be as the criterion with the scope that claim of the present invention was defined.
Claims (16)
1, the clean method on a kind of exposal machine carrying platform surface comprises:
Obtain the positional information of slide holder surface particle defective,, move described slide holder, make described particle defects be positioned at gas spout and exhausr port below according to described positional information;
Spray gas by described gas spout to described slide holder surface, and described gas is discharged by described exhausr port.
2, the clean method on exposal machine carrying platform as claimed in claim 1 surface is characterized in that: by the measurement of the surface flatness of slide holder semiconductor-on-insulator wafer being obtained the positional information of described slide holder surface particle defective in exposure process.
3, the clean method on exposal machine carrying platform as claimed in claim 1 surface, it is characterized in that: described ejection gas is inert gas.
4, the clean method on exposal machine carrying platform as claimed in claim 1 surface, it is characterized in that: described ejection gas is nitrogen.
5, the clean method on exposal machine carrying platform as claimed in claim 4 surface is characterized in that: the air pressure of described nitrogen is 50 to 100Pa.
6, the clean method on exposal machine carrying platform as claimed in claim 1 surface is characterized in that: the air pressure of described exhausr port is 30 to 80pa.
7, the clean method on exposal machine carrying platform as claimed in claim 1 surface is characterized in that: described gas spout is to be the angles of 30 to 75 degree to described slide holder surface ejection gas with described slide holder surface.
8, a kind of exposal machine carrying platform cleaning surfaces system comprises:
Locating device is used to obtain the positional information of slide holder surface particle defective, and moves slide holder according to described positional information, makes described particle defects be positioned at the gas spout below;
Be used to control the control device of the jet and gas outlet exhaust of air jet pipe;
Air jet pipe with gas spout;
Gas outlet with exhausr port;
Wherein, the oblique described slide holder surface of pointing to down of the gas spout of described air jet pipe.
9, exposal machine carrying platform cleaning surfaces as claimed in claim 8 system, it is characterized in that: described cleaning systems comprise that also one has the lid of upper bottom surface and sidewall, wherein said air jet pipe and gas outlet pass described lid, and described gas spout and exhausr port are positioned among the described lid.
10, exposal machine carrying platform cleaning surfaces as claimed in claim 9 system is characterized in that: a kind of in barrel-shaped, truncated cone-shaped or the reverse frustoconic of the structure of described lid.
11, exposal machine carrying platform cleaning surfaces as claimed in claim 8 system is characterized in that: the angle on described air jet pipe and described slide holder surface is 30 to 75 degree.
12, exposal machine carrying platform cleaning surfaces as claimed in claim 11 system is characterized in that: the gas spout of described air jet pipe is 0.5 to 1cm to the distance on described slide holder surface.
13, exposal machine carrying platform cleaning surfaces as claimed in claim 12 system, it is characterized in that: described gas outlet is positioned at the position of described air jet pipe about described slide holder surface normal symmetry, and described exhausr port equates with the distance of described gas spout to described slide holder surface.
14, exposal machine carrying platform cleaning surfaces system as claimed in claim 8 or 9, it is characterized in that: the diameter of described gas spout is 1/4 to 1/10 inch.
15, exposal machine carrying platform cleaning surfaces system as claimed in claim 8 or 9, it is characterized in that: the diameter of described exhausr port is 1/3 to 1 inch.
16, a kind of exposure machine comprises:
The mask plate brace table;
The focal imaging lens;
Can be along the slide holder of guide rail slip;
Air jet pipe with gas spout has the gas outlet of exhausr port;
The control device that be used to control that described air jet pipe is jet, gas outlet exhaust, slide holder is moved;
Wherein, described focal imaging lens are positioned at described guide rail primary importance top, described mask plate brace table is positioned at described focal imaging lens top, and described air jet pipe and gas outlet are positioned at described guide rail second place top, and the described second place of the oblique sensing down of the gas spout of described air jet pipe.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101188352A CN100517077C (en) | 2006-11-28 | 2006-11-28 | Exposal machine carrying platform cleaning method and system |
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| CNB2006101188352A CN100517077C (en) | 2006-11-28 | 2006-11-28 | Exposal machine carrying platform cleaning method and system |
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| CN101192010A CN101192010A (en) | 2008-06-04 |
| CN100517077C true CN100517077C (en) | 2009-07-22 |
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| CN102129954B (en) * | 2010-01-18 | 2012-12-12 | 和舰科技(苏州)有限公司 | Wafer back cleaning device for decreasing defocusing probability during exposure |
| CN102623301A (en) * | 2011-01-27 | 2012-08-01 | 无锡华润上华半导体有限公司 | Silicon chip bench particle removing apparatus and particle removing method thereof |
| CN105436994A (en) * | 2016-01-05 | 2016-03-30 | 中信戴卡股份有限公司 | Split type end surface block automatic detecting device |
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