CN100499086C - High wet sensitive electronic device element and its manufacturing method - Google Patents
High wet sensitive electronic device element and its manufacturing method Download PDFInfo
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- CN100499086C CN100499086C CNB021425078A CN02142507A CN100499086C CN 100499086 C CN100499086 C CN 100499086C CN B021425078 A CNB021425078 A CN B021425078A CN 02142507 A CN02142507 A CN 02142507A CN 100499086 C CN100499086 C CN 100499086C
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- sensitive electronic
- electronic device
- humidity
- height humidity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
The component includes package shell and sealing material. The shell packages all high humidity sensitive electronic devices on base plate. The sealing material placed between the said base plate and the package shell encloses each electronic device or grouped multiple electronic devices so as to form complete airtight seat. The method is also disclosed.
Description
Technical field
The present invention relates to control, relate in particular to height humidity-sensitive electronic device element and manufacture method thereof, to prevent that too early device from damaging or the too early reduction of device performance with a plurality of height humidity-sensitive electronic devices to the encasing electronic components interior humidity.
Background technology
In the mill, electronic device is normally by being processed into the big substrate that comprises a plurality of electronic devices.These substrates normally choose from glass, plastics, metal, pottery, silicon, other semi-conducting materials or above-mentioned material.Substrate can be rigidity or flexible, can be used as independent unit or continuously roll handle.Making the main cause of a plurality of electronic devices in big independent substrate or continuous roll substrate, is in order to reduce production costs by reducing operation, increase production capacity and increase output.At microelectronic industry, the silicon wafer process technology increases to 12 inches wafers from 2 inches wafers, has greatly reduced cost.In LCD (LCD) industry, the substrate of glass process technology increases to substrate more than the 600mm x 700mm from 300mmx 400mm substrate, and the result is reduced cost greatly.At the height humidity-sensitive electronic device, for example in the manufacturing of organic luminescent device (OLED), polymer light-emitting device, charge-coupled device (CCD) transducer and microelectromechanicsensors sensors (MEMS), by in big independent substrate or continuous roll substrate, making a plurality of height humidity-sensitive electronic devices, equally also can enlarge the saving that obtains economically because of production scale.Figure 1A has shown the not height humidity-sensitive electronic device element 14 of encapsulation, and element 14 has a plurality of height humidity-sensitive electronic devices 12 in independent substrate 10.Figure 1B is the schematic cross sectional views that height humidity-sensitive electronic device element 14 obtains along the section line 1B-1B among Figure 1A.But in big independent substrate or continuous roll substrate, make a plurality of height humidity-sensitive electronic devices and produced a problem that low humidity-sensitive electronic device is not run into, promptly the height humidity-sensitive electronic device can not make moist in manufacture process, and is also not all right even the short time makes moist.
Typical electronic requirement on devices humidity level is in about 2500ppm to the scope that is lower than 5000ppm, in the work of device regulation and/or prevent within memory time that device performance from taking place to reduce too early.Be by with device package or with device sealing and in capping drier being set, the environment in the packaging being controlled in this humidity level's scope generally speaking.Drier (for example molecular screen material, silica gel material and be commonly called the material of drierite material) is used to humidity is remained within the above-mentioned scope.Making and encapsulating in such electronic device process, be exposed in short time above not causing device performance to produce measurable reduction under 2500ppm humidity level's the environment.Therefore can encapsulate it at such electronic device and original substrate after separating.
In making the LCD process, electronic circuit and liquid crystal material are not the height humidity-sensitive materials.Therefore, in the operation that electronic circuit and liquid crystal material are encapsulated, do not need the external environment humidity in the manufacture process is protected.Fig. 2 A has shown the compound LCD element 28 that typically is partitioned into before the single LCD device, and Fig. 2 B is the schematic cross sectional views that compound LCD element 28 is got along the section line 2B-2B among Fig. 2 A.In the manufacture process of LCD, the base plate 22 of LCD and the header board 24 of LCD comprise a plurality of LCD devices.LCD base plate 22 and LCD header board 24 usefulness encapsulants 20 link together, and encapsulant 20 surrounds each LCD device, except the slit in the encapsulant 20.After producing compound LCD element 28, the LCD device is cut apart and filling liquid crystal material.Fill after the LCD device, the slit in the encapsulant 20 is by the gap sealing material seal, maintaining liquid crystal material, and prevents that LCD base plate electronic device 26 and liquid crystal material from making moist.Because the LCD device is not highly wet quick, thus in the air ambient compound LCD element is carried out division processing around, and can not make the LCD device performance that measurable reduction takes place.
Particularly for the height humidity-sensitive electronic device, for example organic luminescent device (OLED) or panel, polymer light-emitting device, charge-coupled device (CCD) transducer and microelectromechanicsensors sensors (MEMS), requirement is controlled at the below horizontal of about 1000ppm with humidity, and some device even requirement are controlled at humidity under about 100ppm.Use the drier of silica gel material and drierite material can't obtain so low level.If dry under higher relatively temperature, molecular screen material then can obtain to be lower than the humidity level of 1000ppm in package casing.But under the situation that is equal to or less than the 1000ppm humidity level, molecular screen material has relatively low humidity capacity, and the I of molecular screen material obtains the function that the humidity level is a temperature in the package casing: for example the moisture that at room temperature absorbs can be discharged into when temperature becomes higher (for example to 100 ℃) again in shell or the encapsulation.The drier that uses in this packaging comprises metal oxide powder, alkaline earth oxide, sulfate, metal halide or perchlorate, promptly has the relatively low average minimum humidity of hope and the material of higher humidity capability value.But, to compare with above-mentioned molecular sieve, silica gel or drierite material, it is slower usually that this materials chemistry absorbs the speed of moisture.The device performance that the relatively slow reaction of this and steam causes producing measurable degree after drier being sealed in the device capping reduces, this be because the steam that in moisture that device inside absorbs, air locking, exists and pass device and capping between the sealing moisture of going into from external penetration cause.In addition, even in manufacturing and encapsulation process, the height humidity-sensitive electronic device can not be exposed to the humidity level usually and surpass in the environment of 1000ppm, all needs the humidity level is controlled before device encapsulates fully.Owing to these reasons, in manufacturing and encapsulation process, all need the humidity level is controlled to prevent that performance from reducing.
In order to reduce at device inside amount of moisture that absorb or that in air locking, exist, the height humidity-sensitive electronic device, for example organic luminescent device (OLED) or plate, polymer light-emitting device, charge-coupled device (CCD) transducer and microelectromechanicsensors sensors (MEMS) normally seal under low-humidity environment (for example the humidity level is lower than the drying box of 1000ppm).For the humidity level who guarantees that air locking inside is lower, carrying out any other procedure of processing (for example interconnecting and the module assembling) before, all needing these height humidity-sensitive electronic devices is to seal fully in low-humidity environment fully.In order to obtain this low humidity sealing, the height humidity-sensitive electronic device, for example charge-coupled device (CCD) transducer and microelectromechanicsensors sensors (MEMS) seal separately as discrete component and independent cover element cutting apart the back from composite component substrate or wafer usually.Other devices, for example organic luminescent device (OLED) is to seal as a plurality of devices on discrete component.But in existing manufacture method, the single cover element of metal or glass is used to each device of sealing before cutting apart.Fig. 3 A has shown the typical compound OLED element 34 that includes a plurality of OLED devices 32 in independent substrate 10, encapsulates with single package casing 30 and encapsulant 20.Fig. 3 B is the schematic cross sectional views that OLED element 34 is got along the section line 3B-3B among Fig. 3 A.These the two kinds existing methods that the height wet sensitive device is sealed all require according to high standard independent cover element to be assembled on independent device element or the multiple device element in low-humidity environment.
In order to reduce the operation of using single cover element in low-humidity environment, compound height wet sensitive device element to be encapsulated, people have dreamed up the improved procedure of LCD encapsulating method, in this mode, before connecting, the encapsulant between substrate and the package casing does not have the slit.Fig. 4 A has shown height humidity-sensitive electronic device element 14, and element 14 comprises: substrate 10, contain a plurality of height humidity-sensitive electronic devices 12; Single package casing 30 encapsulates all height humidity-sensitive electronic devices 12; With encapsulant 20.Fig. 4 A schematically shows the problem that this technology exists, wherein after substrate 10 and package casing 30 touch encapsulant, when substrate 10 and package casing 30 were moved to the precalculated position, the hyperbar that produces in each sealing area can cause damage to encapsulant 20.Because have narrow sealed width or uniform slit in the sealing, therefore this damage often takes place, protection to the height humidity-sensitive electronic device is weakened or be eliminated.Fig. 4 B is the schematic cross sectional views that height humidity-sensitive electronic device element 14 is got along the section line 4B-4B among Fig. 4 A.Therefore, need a kind of height humidity-sensitive electronic device element and a kind of method of making height humidity-sensitive electronic device element, thus make and encapsulation process in can guarantee to be used for to prevent that the sealing that humidity-sensitive electronic device highly makes moist from can not make moist.
Many publications have all illustrated and have been used for method and/or the material in encasing electronic components the humidity level controlled.For example, people such as Kawami have disclosed a kind of organic electroluminescent device that is encapsulated in the gas-tight container in European patent application EP 0 776 147 A1, and container contains dry matter, and dry matter comprises the solid chemical compound that is used for chemical absorbing moisture.Dry matter and electroluminescent cell separate, and apply by vacuum vapor deposition, spraying or rotation, strengthen according to predetermined shape.People such as Kawami have lectured the use of following drier: alkali metal oxide, alkaline earth oxide, sulfate, metal halide or perchlorate.But people such as Kawami do not lecture the method for the compound electroluminescent device element that compound electroluminescent device element with a plurality of gas-tight containers and manufacturing have a plurality of gas-tight containers.People such as Kawami do not have to discuss or lecture problem and the solution that a plurality of electroluminescent device elements are handled and sealed yet, and for example prevent in encapsulation process that hyperbar in the sealing area from causing the method for damage to sealing.
At US-A-5,304,419 have disclosed a kind of interior moisture and particulate absorbent of shell that is used to be packaged with electronic device.The part of inner surface of outer cover is applied with the pressure sensitive adhesive that contains solid drier.
At US-A-5,401,536 have disclosed a kind ofly for electronic device provides the method for free from dampness shell, and shell contains coating or the adhesive with drier characteristic.Coating or adhesive comprise the protonated alumina silicate powder that is dispersed in the polymer.
At US-A-5,591,379 have disclosed a kind of air-breathing composition of moisture that is used to seal electronic device.Composition is applied to the inner surface of device package as coating or adhesive, and composition comprises the water vapor permeable adhesive, is dispersed with drier in the adhesive, and drier is preferably molecular screen material.
Less than the method for in these patents, explaining the multiple device element and the free from dampness shell being provided for the multiple device element.
At US-A-4,081,397 has illustrated a kind of stable constituent of Electrical and Electronic characteristic maintenance that is used to make the Electrical and Electronic device.This constituent comprises the alkaline earth oxide in the elastomeric material matrix.Booe does not explain the multiple device element and is used to make the Electrical and Electronic characteristic of compound Electrical and Electronic device element to keep stable method.
At US-A-4,357,557 have illustrated a kind of thin film electroluminescence display panel, and display panel seals by a pair of substrate of glass, is used for display panel is protected.Method comprises: introduce protective liquid between substrate of glass; Spacer is set, to determine the spacing between the pair of substrates; In a substrate, make injection orifice, under vacuum, from the cavity that limits by substrate, draw air, and protective liquid is introduced cavity; Be suitable between substrate and spacer, providing the adhesive that is connected; In protective liquid, introduce the moisture absorption composition; Be used for adhesive with the injection orifice sealing.People such as Inohara do not explain compound electroluminescent device element with a plurality of gas-tight containers and the method that is used to make the compound electroluminescent device element with a plurality of gas-tight containers.People such as Inohara do not have to discuss or explain problem and the solution that a plurality of electroluminescent device elements are handled and sealed yet, and for example prevent in encapsulation process because the hyperbar in the sealing area causes the method for damage to sealing.Though use injection orifice that excessive ambient gas is discharged by injection orifice in a substrate, thereby prevent from sealing is caused damage, people such as Inohara propose injection orifice because of this purpose.On the contrary, the purpose of injection orifice is to allow to introduce protective liquid in the cavity that is limited by substrate.
At US-A-5, the method that similarly is used for the protective film electroluminescent device with methods that the people proposed such as Inohara has been described in 239,228, its additional features is to be provided with groove in sealing plate, is used to obtain excess binder.Can also comprise moisture absorber in the groove.People such as Taniguchi do not explain yet has the compound electroluminescent device element of a plurality of gas-tight containers and the method that is used to make the compound electroluminescent device element with a plurality of gas-tight containers.People such as Taniguchi do not have to discuss yet or explanation is handled and sealed a plurality of electroluminescent device elements problem and solution for example prevent in encapsulation process that hyperbar in the sealing area from causing the method for damage to sealing.
At US-A-5, the method that organic luminescent device is sealed has been described in 771,562, the step that comprises is: substrate is provided with the machine luminescent device; On organic luminescent device, apply one deck inorganic insulating material again; Inorganic coating of sealed engagement on insulating material.People such as Harvey III do not explain the method that has the compound OLED device element of a plurality of gas-tight containers and be used to make the compound OLED device element with a plurality of gas-tight containers.Though in packaging process, inorganic insulation layer can provide interim moisture-proof function, people such as Harvey III do not explain how this coating is used to make the compound OLED device element with a plurality of gas-tight containers.
At US-A-6, illustrated that method comprises the selection drier to being sealed in the withering method of height humidity-sensitive electronic device surrounding environment in the shell in 226,890, drier is made up of at 0.1 to 200 micron solid particle the particle size scope.Drier is selected to provide average minimum humidity level, and the device that this minimum humidity level is lower than in the can aitiogenic humidity level.Select a kind of adhesive that can keep or strengthen the rate of water absorption of drier, mix with selected drier.Adhesive can or be dissolved in the liquid for liquid state.Make a kind of plastic mixture, mixture comprises desiccant particle and adhesive at least, and the weight quota of desiccant particle in mixture is preferably in 10% to 90% the scope.The mixture of some is cast on the part of inner surface of outer cover, forms desiccant layer in the above, shell has sealing flange.Mixture solidifies and forms the solid drier layer, and with shell along sealing flange with electronic component encapsulation.But people such as Boroson do not explain being sealed in the withering method of compound height humidity-sensitive electronic device component ambient environment in a plurality of shells.
Summary of the invention
The purpose of this invention is to provide a kind of have the height humidity-sensitive electronic device element of a plurality of height humidity-sensitive electronic devices and the manufacture method of described element, wherein since can be moistureproof and the relative prior art of manufacturing described element simplify more, thereby can avoid element inner height humidity-sensitive electronic device to be damaged.
In one aspect, the objective of the invention is to reach by height humidity-sensitive electronic device element with a plurality of height humidity-sensitive electronic devices, element comprises:
A) contain the substrate of two or more humidity-sensitive electronic devices;
B) package casing, it is encapsulated in all height humidity-sensitive electronic devices in the described substrate; With
C) encapsulant, it forms sealing fully around each humidity-sensitive electronic device or around the humidity-sensitive electronic device group between described substrate and described package casing between described substrate and described package casing.
In yet another aspect, the objective of the invention is to reach by a kind of method of in single substrate, making height humidity-sensitive electronic device element (for example OLED) with a plurality of height humidity-sensitive electronic devices, wherein device can be prevented from making moist before being divided into independent device, and the step that method comprises is:
A) around each height humidity-sensitive electronic device or around each group height humidity-sensitive electronic device encapsulant is being set fully in the substrate or on the appropriate location at package casing, thereby around encapsulant after the sealing will be positioned at each height humidity-sensitive electronic device fully or around each group height humidity-sensitive electronic device;
B) substrate and package casing (one of them comprises encapsulant) is aligned with each other close, but exist at interval, this position provides initial ambient pressure;
C) provide relative motion between substrate and package casing, touch substrate and package casing up to encapsulant, substrate and package casing are at a distance of certain scope;
D) after step c) or in the step c) process, increase ambient pressure, make it be higher than substrate, package casing and encapsulant initial ambient pressure on every side, with reduce by in the space that limits between substrate, package casing and the encapsulant with respect to the pressure reduction of the ambient pressure that increases, thereby can prevent that encapsulant is damaged;
E) encapsulant is connected with substrate with package casing, forms compound height humidity-sensitive electronic device element.
According to height humidity-sensitive electronic device element and the manufacture method thereof with a plurality of height humidity-sensitive electronic devices of the present invention, preventing compared with prior art have following advantage aspect too early device damage or the device performance decline too early: by all height humidity-sensitive electronic devices are sealed in the single substrate, before element is split into less single or multiple device element, as unitary element, has single package casing, shell is encapsulated in all height humidity-sensitive electronic devices in the single substrate, thereby has reduced the processing to device and package casing; Strengthened the moisture protection before being exposed to external environment; Strengthened the harmony of making required automation procedure with big output; Strengthened harmony with the inner operation of low-humidity environment; Reduced because the encapsulation flaw that the pressure reduction between height humidity-sensitive electronic device inside and the outside causes.
Description of drawings
Figure 1A has shown the not height humidity-sensitive electronic device element of encapsulation, and described element has a plurality of height humidity-sensitive electronic devices in independent substrate;
Figure 1B is the schematic cross sectional views that height humidity-sensitive electronic device element is got along the section line 1B-1B among Figure 1A among Figure 1A;
Fig. 2 A has shown the typical compound LCD element that is partitioned into before the single LCD device;
Fig. 2 B is the schematic cross sectional views that a plurality of LCD elements are got along the section line 2B-2B among Figure 1A among Fig. 2 A;
Fig. 3 A has shown the typical compound OLED element of encapsulation separately;
Fig. 3 B is the schematic cross sectional views that the compound OLED element among Fig. 3 A is got along the section line 3B-3B among Fig. 3 A;
Fig. 4 A has shown the height humidity-sensitive electronic device element that comprises single package casing and encapsulant, and this structure can be owing to excess pressure causes damage;
Fig. 4 B is the schematic cross sectional views that height humidity-sensitive electronic device element is got along the section line 4B-4B among Fig. 4 A among Fig. 4 A;
Fig. 5 A has shown a kind of height humidity-sensitive electronic device element, and element comprises the substrate with a plurality of height humidity-sensitive electronic devices, single package casing and encapsulant;
Fig. 5 B is the schematic cross sectional views that height humidity-sensitive electronic device element is got along the section line 5B-5B among Fig. 5 A among Fig. 5 A;
Fig. 6 A has shown a kind of height humidity-sensitive electronic device element, and element comprises the substrate with a plurality of height humidity-sensitive electronic devices, single package casing, encapsulant, absorbent material and interim damp-proof layer;
Fig. 6 B is the schematic cross sectional views that height humidity-sensitive electronic device element is got along the section line 6B-6B among Fig. 6 A among Fig. 6 A;
Fig. 7 A has shown a kind of initial ambient pressure P that is in
1Height humidity-sensitive electronic device element, element comprises substrate with a plurality of height humidity-sensitive electronic devices and the encapsulant that does not have the slit, described substrate is with to contain the package casing of absorbent material aligned with each other close, but exists at interval;
Fig. 7 B be among Fig. 7 A height humidity-sensitive electronic device element along the section line 7B among Fig. 7 A, C-7B, the schematic cross sectional views that C obtains;
Fig. 7 C moves the back and ambient pressure is P at the point that substrate and package casing contact substrate and package casing relative to encapsulant
2The time Fig. 7 A in height humidity-sensitive electronic device element along the section line 7B among Fig. 7 A, C-7B, the schematic cross sectional views that C obtains;
After Fig. 7 D had shown that a kind of relative motion between substrate and package casing reaches preset space length, final ambient pressure was P
3Height humidity-sensitive electronic device element, element comprises substrate, encapsulant, package casing and the absorbent material with a plurality of height humidity-sensitive electronic devices; With
Fig. 7 E is the schematic cross sectional views that height humidity-sensitive electronic device element obtains along the section line 7E-7E among Fig. 7 D among Fig. 7 D.
Embodiment
Comprise one or more height humidity-sensitive electronic devices after term " height humidity-sensitive electronic device element " is meant in manufacture process or manufacturing finishes, perhaps in the manufacture process of height humidity-sensitive electronic device and after manufacturing finishes, comprise the element of one or more height humidity-sensitive electronic devices.Term " height humidity-sensitive electronic device " be meant when extraneous humidity level during greater than 1000ppm the easy generation of device performance can measure any electronic device of reduction.Noun " substrate " is meant the combination of organic and inorganic or organic and inoganic solids, makes one or more height humidity-sensitive electronic devices on it.Noun " package casing " is meant the combination of organic and inorganic or organic and inoganic solids, thereby is used for by stoping or limiting the moisture infiltration and avoid one or more height humidity-sensitive electronic devices to make moist.
Term " encapsulant " is meant the combination of organic and inorganic or organic and inorganic material, is used for package casing is bonded in substrate, thereby and by stoping or limiting the moisture infiltration and avoid one or more height humidity-sensitive electronic devices to make moist.Term " slit " is meant the interruption that centers on one or more electronic devices in the encapsulant.Term " absorbent material " is meant the inorganic material that can absorb moisture or react with moisture with physics or chemical mode, otherwise moisture will damage highly humidity-sensitive electronic device.Term " interim damp-proof layer " is meant the combination of organic and inorganic or organic and inorganic material, be used for preventing when the short time is exposed to extraneous humidity level greater than 1000ppm or limit moisture the height humidity-sensitive electronic device is caused damage that wherein the short time is meant and is no more than 10 days.
Please referring to Fig. 5 A, Fig. 5 A has shown an embodiment according to height humidity-sensitive electronic device element 14 of the present invention.Height humidity-sensitive electronic device element 14 comprises: contain the substrate 10 of a plurality of height humidity-sensitive electronic devices 12; Single package casing 30 is encapsulated in all height humidity-sensitive electronic devices 12 in the substrate 10; Encapsulant 20 around each height humidity-sensitive electronic device 12 does not have the slit in the encapsulant 20.Fig. 5 B is the schematic cross sectional views that height humidity-sensitive electronic device element 14 obtains along the section line 5B-5B among Fig. 5 A among Fig. 5 A.In Fig. 5 A and Fig. 5 B, height humidity-sensitive electronic device element 14 comprises four height humidity-sensitive electronic devices 12, but height humidity-sensitive electronic device element of the present invention can comprise any amount of height humidity-sensitive electronic device greater than.By using single package casing that all height humidity-sensitive electronic devices are encapsulated in the substrate, the advantage that can obtain is, compared with prior art, needn't use independent package casing that each height humidity-sensitive electronic device is encapsulated in respectively in the substrate, reduce processing.Substrate 10 that shows among Fig. 5 A and Fig. 5 B and package casing 30 can be the combinations of organic solid, inoganic solids or organic and inoganic solids.Substrate 10 and package casing 30 can be rigidity or flexibility, and can be used as discrete monolithic (for example sheet material or wafer) or continuously roll handle.Typical substrate and package casing material comprise glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.Substrate and package casing can be same type of material mixture, composite material or many material layers.The encapsulant 20 that shows among Fig. 5 A and Fig. 5 B is around each independent height humidity-sensitive electronic device, if but final products need have a plurality of height humidity-sensitive electronic devices in an element, then encapsulant can also around two or more be one group height humidity-sensitive electronic device.In addition, do not comprise the slit around the encapsulant of the height humidity-sensitive electronic device of each height humidity-sensitive electronic device or a group, thereby can prevent that before being divided into less single or multiple device element height humidity-sensitive electronic device element from making moist.Encapsulant can be organic and inorganic or organic and inorganic combined material.Encapsulant can be by melting and cool off or being bonded to substrate and package casing by reaction curing.Comprise by melting and cooling off bonding typical material: glass; Hot melt adhersive, for example polyolefin, polyester, polyamide or its combination; Inorganic scolder, for example indium, tin, lead, silver, gold or its combination.Typical reaction curing comprises by heating; Radiation, for example ultra-violet radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.Solidify bonding material by reaction and comprise acrylate, epoxy resin, polyurethane, silicones or its combination.Usually other inorganic material of using in encapsulant comprise glass, pottery, metal, semiconductor, metal oxide, conductor oxidate or its combination.
Please referring to Fig. 6 A, Fig. 6 A has shown another embodiment according to height humidity-sensitive electronic device element 14 of the present invention.Height humidity-sensitive electronic device element 14 comprises: contain the substrate 10 of a plurality of height humidity-sensitive electronic devices 12; Single package casing 30, it is encapsulated in all height humidity-sensitive electronic devices 12 in the substrate 10; Encapsulant 20, it limits a space around each height humidity-sensitive electronic device 12, does not have the slit in the encapsulant 20; Water accepting layer 60, it and is in the space that is limited by encapsulant 20 between substrate 10 and package casing 30; Interim damp-proof layer 62, it is applied on each height humidity-sensitive electronic device 12.Fig. 6 B is the schematic cross sectional views that height humidity-sensitive electronic device element 14 obtains along the section line 6B-6B among Fig. 6 A among Fig. 6 A.The details of height humidity-sensitive electronic device 12, substrate 10, package casing 30 and encapsulant 20 is identical with the embodiment that Fig. 5 A and Fig. 5 B show.Absorbent material is used for absorbing moisture with physics or chemical mode, perhaps react with moisture, otherwise moisture can damage the height humidity-sensitive electronic device.Typical absorbent material comprises that alkali metal oxide, alkaline earth oxide, sulfate, metal halide, perchlorate, molecular sieve and work function are lower than the metal that oxidation also can take place 4.5eV, perhaps its combination when moisture occurring.Absorbent material can be encapsulated in permeable container of moisture or the adhesive.Absorbent material can be homogenous material, same type of material mixture, composite material or many material layers.Interim damp-proof layer is used for preventing when the short time is exposed to extraneous humidity level greater than 1000ppm or limiting moisture the height humidity-sensitive electronic device is caused damage.Interim damp-proof layer is organic material, inorganic material and combination thereof.Typical organic material comprises epoxy resin, polyurethane, polyureas, acrylate, silicones, polyamide, polyimides, carbolic acid, polyvinyl, phenoxy group compound, polysulfones, polyolefin, polyester or its combination.Typical inorganic material comprises glass, pottery, metal, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.Interim damp-proof layer can be homogenous material, same type of material mixture, composite material or many material layers.
Please referring to Fig. 7 A to Fig. 7 E, Fig. 7 A to Fig. 7 E has shown an embodiment who makes the method for height humidity-sensitive electronic device element (for example OLED device) according to of the present invention in single substrate, and wherein device can be by protection against the tide before being split into independent device.Fig. 7 A has shown a kind of initial ambient pressure P that is in
1Height humidity-sensitive electronic device element 14, element 14 comprises: contain the substrate 10 of a plurality of height humidity-sensitive electronic devices 12; Encapsulant 20 around each height humidity-sensitive electronic device 12, do not have the slit in the encapsulant 20, itself and package casing 30 are aligned with each other close, but exist at interval, package casing 30 is encapsulated in height humidity-sensitive electronic device 12 in the substrate 10, and contain absorbent material 60, thereby will be positioned within each humidity-sensitive electronic device at bonding back absorbent material.Fig. 7 B be among Fig. 7 A height humidity-sensitive electronic device element along the section line 7B among Fig. 7 A, C-7B, the schematic cross sectional views that C obtains.Ambient pressure P
1Can be higher than, be less than or equal to atmospheric pressure.The details of height humidity-sensitive electronic device 12, substrate 10, single package casing 30, encapsulant 20 and absorbent material 60 is identical with the embodiment that Fig. 5 A and Fig. 5 B show.In another embodiment, can use, be applied on the height humidity-sensitive electronic device 12, shown in Fig. 6 A and the detailed introduction of Fig. 6 B with interim damp-proof layer replacement absorbent material 60 or with absorbent material 60.But in another embodiment, height humidity-sensitive electronic device element 14 comprises height humidity-sensitive electronic device 12, substrate 10, package casing 30 and encapsulant 20.Fig. 7 C carries out relative motion 90 at substrate 10 and package casing 30 to reach encapsulant and substrate 10 and package casing 30 all position contacting and pressure are P
2After, height humidity-sensitive electronic device element is along the section line 7B among Fig. 7 A, C-7B, the schematic cross sectional views that C got among Fig. 7 A.Ambient pressure P
2Can be equal to or greater than initial ambient pressure P
1Fig. 7 D has shown a kind of final ambient pressure P that is in
3Height humidity-sensitive electronic device element 14, among this figure, after the spacing that makes substrate 10 and package casing 30 of relatively moving between substrate 10 and the package casing 30 reaches preset range, and after being bonded to encapsulant 20 on substrate 10 and the package casing 30, a plurality of height humidity-sensitive electronic devices 12 have been formed.Ambient pressure P
3Can be equal to or greater than ambient pressure P
2Ambient pressure P
3With respect to the initial ambient pressure P around substrate 10, package casing 30 and the encapsulant 20
1Increase, with the ambient pressure P of the relative increase of pressure in the space that reduces to be limited by substrate 10, package casing 30 and encapsulant 20
3Between pressure reduction, thereby can prevent encapsulant 20 distortion.Can encapsulant 20 be bonded on substrate 10 and the package casing 30 by fusing and cooling, reaction curing or its combination.Reaction curing comprises by heating; Radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.Fig. 7 E is the schematic cross sectional views that height humidity-sensitive electronic device element is got along the section line 7E-7E among Fig. 7 D among Fig. 7 D.After finishing the described method of Fig. 7 A to Fig. 7 E, the height humidity-sensitive electronic device is split into individual devices or the set of devices with the initial substrate of a part usually.
Example
I. the structure of test structure
Can make a plurality of identical test structures by following step:
(1) by in acetone and isopropyl alcohol, carrying out ultrasonication and in distilled water, washing, the substrate of glass that comprises a plurality of height humidity-sensitive electronic devices is carried out purified treatment;
(2) by with at the identical purification style of purified treatment described in the above-mentioned steps (1), before making drying layer, glass packaging is carried out purified treatment, glass packaging comprises a plurality of cavitys of making by the selective etch substrate of glass;
(3) in the cavity of package casing, make water accepting layer and curing;
(4) each cavity that centers on the package casing is provided with encapsulant fully;
(5) under initial ambient pressure, substrate and to contain the package casing of encapsulant aligned with each other close, but have the interval;
(6) make between substrate and the package casing and relatively move, all contact with package casing with substrate, 20 to 30 microns at interval of substrate and package casings until encapsulant;
(7) step (6) afterwards, the ambient pressure around substrate, package casing and the encapsulant is increased or keeps constant;
(8) encapsulant is bonded to substrate and package casing, forms test structure.
II. result
For the judgement of the package quality of all positions in the test structure, be quality based on bonding back encapsulant.If owing between the inside of encapsulant and outside, have pressure reduction, thereby cause encapsulant obviously to damage, then airtight quality be rated as poor.If there is no obvious impairment, then package quality is rated as excellent.If there is slight damage, then package quality is rated as medium.
| Closure size LxWxT (mm) | Initial pressure (Vac.gauge, Torr) | Final pressure (Vac.gauge., Torr) | Package quality |
| 100?x?1.5?x?0.02 | 760 | 760 | Difference |
| 100?x?1.5?x?0.02 | 525 | 760 | Difference |
| 100?x?1.5?x?0.02 | 625 | 760 | Difference |
| 100?x?1.5?x?0.02 | 580 | 760 | Excellent |
| 170?x?1.5?x?0.02 | 760 | 760 | Difference |
| 170?x?1.5?x?0.02 | 525 | 760 | Difference |
| 170?x?1.5?x?0.02 | 735 | 760 | Difference |
| 170?x?1.5?x?0.02 | 625 | 760 | Excellent |
The result shows, optimal initial and final pressure has determined package quality, and is basic by the size of the encapsulated space of representing as closure size.For any special seal size, will there be the initial and final pressure of many groups, can produce high-quality encapsulation, and in every group of pressure, all can have opereating specification can produce high-quality encapsulation.Condition shown in the table has only shown one group of pressure that can bring the high-quality encapsulation for each closure size.
Be other features of the present invention below.
Height humidity-sensitive electronic device element, wherein organic material, inorganic material or its combination that encapsulant melts and cools off for process or reaction is solidified.
Height humidity-sensitive electronic device element, wherein reaction curing comprises by heating; Radiation, for example ultra-violet radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.
Height humidity-sensitive electronic device element, wherein organic material is selected from epoxy resin, polyurethane, acrylate, silicones, polyamide, polyolefin, polyester or its combination.
Height humidity-sensitive electronic device element, wherein inorganic material is selected from glass, pottery, metal, semiconductor, metal oxide, conductor oxidate, brazing metal or its combination.
Height humidity-sensitive electronic device element, wherein absorbent material comprises that alkali metal oxide, alkaline earth oxide, sulfate, metal halide, perchlorate, molecular sieve and work function are lower than the metal that oxidation also can take place 4.5eV, perhaps its combination when moisture occurring.
Have the height humidity-sensitive electronic device element of height humidity-sensitive electronic device, element comprises:
A) contain the substrate of two or more humidity-sensitive electronic devices, device uses interim damp-proof layer to apply;
B) package casing is encapsulated in all height humidity-sensitive electronic devices in the described substrate; With
C) encapsulant between described substrate and described package casing, forms sealing fully around each humidity-sensitive electronic device or around each group humidity-sensitive electronic device between described substrate and described package casing.
Height humidity-sensitive electronic device element, wherein substrate comprises rigidity or flexible: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Height humidity-sensitive electronic device element, package casing wherein comprises rigidity or flexibility: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Height humidity-sensitive electronic device element, wherein organic material, inorganic material or its combination that encapsulant melts and cools off for process or reaction is solidified.
Height humidity-sensitive electronic device element, wherein reaction curing comprises by heating; Radiation, for example ultra-violet radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.
Height humidity-sensitive electronic device element, wherein organic material is selected from epoxy resin, polyurethane, acrylate, silicones, polyamide, polyolefin, polyester or its combination.
Height humidity-sensitive electronic device element, wherein inorganic material is selected from glass, pottery, metal, semiconductor, metal oxide, conductor oxidate, brazing metal or its combination.
Height humidity-sensitive electronic device element, wherein interim damp-proof layer is organic material, inorganic material or its combination.
Height humidity-sensitive electronic device element, wherein organic material is selected from epoxy resin, polyurethane, polyureas, acrylate, silicones, polyamide, polyimides, carbolic acid, polyvinyl, phenoxy group compound, polysulfones, polyolefin, polyester or its combination.
Height humidity-sensitive electronic device element, wherein inorganic material is selected from glass, pottery, metal, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
A kind of method of in single substrate, making height humidity-sensitive electronic device element (for example OLED) with a plurality of height humidity-sensitive electronic devices, wherein device can prevent to make moist before being divided into independent device from substrate, and the step that method comprises is:
A) around each height humidity-sensitive electronic device or around each group height humidity-sensitive electronic device encapsulant is being set fully in the substrate or on the appropriate location at package casing, thereby around encapsulant after the sealing will be positioned at each height humidity-sensitive electronic device fully or around each group height humidity-sensitive electronic device;
B) substrate and package casing (one of them comprises encapsulant) is aligned with each other close, but exist at interval, this position provides initial ambient pressure;
C) provide relative motion between substrate and package casing, touch substrate and package casing up to encapsulant, substrate and package casing are at a distance of certain scope;
D) after step c) or in the step c) process, increase ambient pressure, be higher than substrate, package casing and encapsulant initial ambient pressure on every side, with reduce by in the space that limits between substrate, package casing and the encapsulant with respect to the pressure reduction of the ambient pressure that increases, thereby can prevent that encapsulant is damaged;
E) encapsulant is connected with substrate with package casing, forms compound height humidity-sensitive electronic device element.
Adhesion step in this method is solidified by fusing and cooling, reaction or its combination realizes.
Reaction curing in this method comprises by heating; Radiation, for example ultra-violet radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.
Initial ambient pressure in this method is higher than, is less than or equal to air pressure.
Substrate in this method comprises rigidity or flexibility: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Package casing in this method comprises rigidity or flexibility: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Encapsulating material in this method is organic material, inorganic material or its combination.
Organic material in this method is selected from epoxy resin, polyurethane, acrylate, silicones, polyamide, polyolefin, polyester or its combination.
Inorganic material in this method is selected from glass, pottery, metal, semiconductor, metal oxide, conductor oxidate, brazing metal or its combination.
This method also comprises the height humidity-sensitive electronic device is divided into the individual devices with the initial substrate of a part or the step of one group of device.
A kind of method of in single substrate, making height humidity-sensitive electronic device element with a plurality of height humidity-sensitive electronic devices (for example OLED device), wherein device can prevent to make moist before being divided into independent device from substrate, and the step that method comprises is:
A) in the substrate that comprises two or more height humidity-sensitive electronic devices, apply interim damp-proof layer; Perhaps apply absorbent material on substrate or the appropriate location at package casing, like this after bonding, it is inner or be positioned at each group height humidity-sensitive electronic device that absorbent material will be positioned at each height humidity-sensitive electronic device; Perhaps both apply described interim damp-proof layer, also applied described absorbent material;
B) around each height humidity-sensitive electronic device or around each group height humidity-sensitive electronic device encapsulant is being set fully in the substrate or on the appropriate location at package casing, thereby after sealing, will having encapsulant fully around each height humidity-sensitive electronic device or around each group height humidity-sensitive electronic device;
C) substrate and package casing (one of them comprises encapsulant) is aligned with each other close, but exist at interval, this position provides initial ambient pressure.
D) provide relative motion between substrate and package casing, touch substrate and package casing up to encapsulant, substrate and package casing are at a distance of certain scope;
E) after step d) or in step d), increase ambient pressure, greater than the initial external world around substrate, package casing and the encapsulant, with the pressure reduction between the ambient pressure of the relative increase of pressure in the space that reduces to be limited, thereby can prevent the encapsulant distortion by substrate, package casing and encapsulant;
F) encapsulant is engaged with substrate and package casing, form height humidity-sensitive electronic device element.
Adhesion step in this method is solidified by fusing and cooling, reaction or its combination realizes.
Reaction curing in this method comprises by heating; Radiation, for example ultra-violet radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.
Initial ambient pressure in this method is higher than, is less than or equal to air pressure.
Substrate in this method comprises rigidity or flexibility: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Package casing in this method comprises rigidity or flexibility: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Encapsulant in this method is organic material, inorganic material or its combination.
Organic material in this method is selected from epoxy resin, polyurethane, acrylate, silicones, polyamide, polyolefin, polyester or its combination.
Inorganic material in this method is selected from glass, pottery, metal, semiconductor, metal oxide, conductor oxidate, brazing metal or its combination.
This method also comprises the height humidity-sensitive electronic device is divided into the individual devices with the initial substrate of a part or the step of one group of device.
Absorbent material in this method comprises that alkali metal oxide, alkaline earth oxide, sulfate, metal halide, perchlorate, molecular sieve and work function are lower than the metal that oxidation also can take place 4.5eV, perhaps its combination when moisture occurring.
Interim damp-proof layer in this method is organic material, inorganic material or its combination.
Organic material in this method is selected from epoxy resin, polyurethane, polyureas, acrylate, silicones, polyamide, polyimides, carbolic acid, polyvinyl, phenoxy group compound, polysulfones, polyolefin, polyester or its combination.
Inorganic material in this method is selected from glass, pottery, metal, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
Claims (7)
1. height humidity-sensitive electronic device element with a plurality of height humidity-sensitive electronic devices, this element comprises:
A) substrate forms described a plurality of height humidity-sensitive electronic devices in this substrate;
B) single package casing, it is encapsulated in all described height humidity-sensitive electronic devices in the described substrate and protects described height humidity-sensitive electronic device not make moist;
C) encapsulant, its around each highly wet quick appliance device from described base extension to described package casing, between described substrate and described package casing, to form sealing fully, form an independent seal cavity thereby center on each height humidity-sensitive electronic device respectively around each height humidity-sensitive electronic device;
D) absorbent material, it is placed in each described seal cavity and the height humidity-sensitive electronic device corresponding with each separated.
2. height humidity-sensitive electronic device element according to claim 1, it is characterized in that described substrate comprises rigidity or flexible: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
3. height humidity-sensitive electronic device element according to claim 1, it is characterized in that described package casing comprises rigidity or flexible: glass, plastics, metal, pottery, semiconductor, metal oxide, metal nitride, metal sulfide, conductor oxidate, semiconducting nitride thing, semiconductor sulfuration thing, carbon or its combination.
4. height humidity-sensitive electronic device element according to claim 1 is characterized in that, described encapsulant is for process fusing and cooling or react organic material, inorganic material or its combination of solidifying.
5. height humidity-sensitive electronic device element according to claim 4 is characterized in that, described reaction curing comprises by heating; Radiation; Two or more elements are mixed; Be exposed to extraneous moisture; Remove extraneous oxygen; Or the reaction of its combination results.
6. height humidity-sensitive electronic device element according to claim 4 is characterized in that described organic material is selected from epoxy resin, polyurethane, acrylate, silicones, polyamide, polyolefin, polyester or its combination.
7. height humidity-sensitive electronic device element according to claim 4 is characterized in that described inorganic material is selected from glass, pottery, metal, semiconductor, metal oxide, conductor oxidate, brazing metal or its combination.
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| CNB021425078A CN100499086C (en) | 2002-09-23 | 2002-09-23 | High wet sensitive electronic device element and its manufacturing method |
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| CNB021425078A CN100499086C (en) | 2002-09-23 | 2002-09-23 | High wet sensitive electronic device element and its manufacturing method |
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| CN100499086C true CN100499086C (en) | 2009-06-10 |
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| KR100637201B1 (en) * | 2004-12-20 | 2006-10-23 | 삼성에스디아이 주식회사 | Organic electroluminescence display and manufacturing method thereof |
| JP5693515B2 (en) * | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | Electronic device with internal water-resistant coating |
| CN103855308B (en) * | 2012-11-30 | 2016-04-27 | 海洋王照明科技股份有限公司 | A kind of organic electroluminescence device and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357557A (en) * | 1979-03-16 | 1982-11-02 | Sharp Kabushiki Kaisha | Glass sealed thin-film electroluminescent display panel free of moisture and the fabrication method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4357557A (en) * | 1979-03-16 | 1982-11-02 | Sharp Kabushiki Kaisha | Glass sealed thin-film electroluminescent display panel free of moisture and the fabrication method thereof |
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