CN100490198C - Paster diode producing method - Google Patents
Paster diode producing method Download PDFInfo
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- CN100490198C CN100490198C CNB2006101614186A CN200610161418A CN100490198C CN 100490198 C CN100490198 C CN 100490198C CN B2006101614186 A CNB2006101614186 A CN B2006101614186A CN 200610161418 A CN200610161418 A CN 200610161418A CN 100490198 C CN100490198 C CN 100490198C
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Abstract
A method for preparing paster diode includes setting thick and thin copper plates with the same length to be parallel-interval way, welding diode chip on thin copper plate and connection copper plate between diode chip and top plane of thick copper plate, enveloping three said copper plates and diode chip in epoxy body, making bottom surfaces and two end surfaces of thick and thin copper plates be at the same plane with bottom surface and two end surfaces of epoxy body.
Description
Technical field
The present invention relates to a kind of manufacture method of stamp-mounting-paper diode.
Background technology
In electronic industry circle, diode has become the infrastructure component of various electronic products, respectively there is a lead-in wire at the two ends of conventional diode product, need be during use with the circuit board upper drill hole, the hole that lead-in wire is penetrated on the circuit board to be beaten, product is fixed on the circuit board, yet, the electronic product of whole world use at present, as phone, television set, facsimile machine, computer and peripheral product thereof are all with frivolous, short and small for researching and developing target, its circuit board technology uses bilayer or multilayer circuit plate technique more, but bilayer or multilayer circuit board can not burrow on circuit board, so double-deck above circuit board all uses the paster electronic component.As Chip-R, because of production cost is low, most of shaft type traditional resistor that replaces.
Stamp-mounting-paper diode (SMA, SMB, SMC) has two kinds of production structures at present, can't replace the shaft type conventional diode by now because of production cost is higher than the shaft type conventional diode;
1, tablet formula: break into shape as Fig. 1 and Fig. 2 with copper sheet, again Fig. 1 is worked as lower floor, put into solder plate or solder(ing) paste at each copper sheet end of Fig. 1, put into diode chip for backlight unit on the tin cream again, put into solder plate or solder(ing) paste on the chip again, again Fig. 2 is stacked on the solder(ing) paste, the process high temperature furnace welds out and just becomes Fig. 3, again with die material molding for epoxy resin such as Fig. 4, after the moulding, blanking becomes Fig. 5, becomes Fig. 6 through cutting pin, clubfoot, plating again.
This production technology is adopted by general stamp-mounting-paper diode supplier, its shortcoming:
(1) mould wasting space, necessary spacing between tablet and tablet, shaping efficiency is poor;
(2) the tablet both sides must remove could moulding Fig. 6, waste both sides copper sheet, the copper sheet utilization rate is less than 20%, all the other wastes;
(3) to penetrate toward both sides again through middle Jiao Dao during moulding, waste Jiao Dao and inject the both sides diode and lead the way, the epoxy resin utilization rate is less than 30%, and all the other wastes because of epoxy resin can not reclaim, cause environmental pollution.
2, shaft type: this mode of production is that two symmetry lead-in wires are as Fig. 7, utilization is controlled instrument and Fig. 7 lead riser is put into tool (once about 2000) up again solder plate is put into the lead-in wire head end, on solder plate, put into diode chip for backlight unit again, on diode chip for backlight unit, put into solder plate again, again lead-in wire is put into the instrument of controlling upside down as Fig. 7, become as Fig. 8 through high-temperature soldering again, the reshaping mould, moulding such as Fig. 9, as Figure 10, on mould, the both sides lead-in wire is flattened as Figure 11 after the counterdie, again the excision of both sides copper lead-in wire, and clubfoot, electroplate the back as Figure 12.
This mode of production is simple than the tablet formula, though cost is lower, its shortcoming is as follows:
(1) will be both sides lead-in wire excision, waste copper lead-in wire, in fact copper lead-in wire utilization rate is 20%, all the other work as waste material;
(2) the mould design is as Fig. 9, and because of both sides copper lead-in wire wasting space, efficient is low;
(3), moulding is afterwards for operating the back technological process easily, copper lead-in wire both sides must add two Jiao Dao and fixedly excise after the both sides copper lead-in wire again when molding for epoxy resin, and waste both sides Jiao Dao, actual rings epoxy resins utilization rate is also less than 20%, useless epoxy resin is difficult for handling, and causes environmental pollution.
Summary of the invention
The present invention seeks to: a kind of manufacture method of stamp-mounting-paper diode is provided, not only can saves copper material and epoxy resin raw material, reduce die cost, and not need clubfoot, thereby enhance productivity, reduce product cost.
Technical scheme of the present invention is: a kind of stamp-mounting-paper diode, comprise thick copper sheet and scale copper that equal in length and parallel interval are provided with, the middle part on plane is welded with diode chip for backlight unit on the scale copper, be welded with between the last plane of diode chip for backlight unit and thick copper sheet and be connected copper sheet, gross thickness after the welding of scale copper and diode chip for backlight unit equates with the thickness of thick copper sheet, it is vertical with scale copper with thick copper sheet respectively to connect copper sheet, and the length that connects copper sheet is the width+thick copper sheet of the width+scale copper of thick copper sheet and the spacing between the scale copper, the thick copper sheet of welding fabrication, scale copper, diode chip for backlight unit be connected copper sheet together by envelope in body of epoxy resin, the bottom surface of only thick copper sheet and scale copper and the bottom surface of body of epoxy resin are at grade, the both ends of the surface of thick copper sheet and scale copper respectively with the both ends of the surface of body of epoxy resin at grade.
A kind of manufacture method of stamp-mounting-paper diode comprises the following steps:
The first step: cut a thick copper sheet of strip, a strip scale copper, some billet shapes connection copper sheets;
Second step: some billet shapes are connected the copper sheet parallel interval be placed in the mould, place solder plate or solder(ing) paste respectively in the same side of some billet shapes connection copper sheets earlier, place diode chip for backlight unit at solder plate or solder(ing) paste again, on diode chip for backlight unit, place solder plate or solder(ing) paste then again, on solder plate or solder(ing) paste, place the strip scale copper again, the other end placement solder plate or the solder(ing) paste that connect copper sheet at last some billet shapes, place the thick copper sheet of strip again on solder plate or solder(ing) paste, the thick copper sheet of strip and strip scale copper are respectively with to be connected copper sheet vertical;
The 3rd step: with the thick copper sheet of strip, strip scale copper, diode chip for backlight unit be connected the copper sheet welding fabrication;
The 4th step: the strip diode group of welding fabrication is put into mould enveloping ring epoxy resins, and the bottom surface that only makes the bottom surface of thick copper sheet of strip and strip scale copper and body of epoxy resin after the enveloping ring epoxy resins at grade;
The 5th step: have the strip diode group of strip body of epoxy resin to cut into single diode envelope, the both ends of the surface that make thick copper sheet and scale copper respectively with the both ends of the surface of body of epoxy resin at grade;
The 6th step: the single diode behind excision forming the copper electroplating surfaces with tin arranged;
The 7th step: test, packing, finished product.
Advantage of the present invention is:
1. the present invention welds with three copper sheets that design, and does not have the copper sheet of tablet formula, does not also have the copper lead-in wire of shaft type, and the utilization rate of copper is not almost very wasted, and copper accounts for cost of material about 40%.
2. moulding of the present invention does not need tablet formula and shaft type moulding Jiao Dao, and the epoxy resin utilization rate almost is shaft type and tablet formula three times, has reduced environmental pollution, and epoxy resin accounts for cost of material about 30%.
3. mould design of the present invention does not need headspace because of there being tablet and shaft type lead-in wire, can improve shaft type and tablet production efficiency more than 5 times.
4. the present invention does not need clubfoot, has reduced the bad order rate.
5. more than comprehensive, raw material of the present invention is saved, and improves man efficiency, estimates than shaft type cost and reduces about 40%.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 are for having the structural representation of tablet formula method now;
Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11, Figure 12 are for having the structural representation of shaft type method now;
Figure 13 is a perspective view of the present invention;
Figure 14 is a front view of the present invention;
Figure 15 looks cutaway view for master of the present invention;
Figure 16 is a upward view of the present invention;
Figure 17 is the vertical view of the thick copper sheet of strip of the present invention;
Figure 18 is the vertical view of strip scale copper of the present invention;
Figure 19 connects the vertical view of copper sheet for the present invention;
Figure 20 places the vertical view of copper sheet die for the present invention;
Figure 21 welds the vertical view of back diode group for the present invention;
Figure 22 is the end view of Figure 21;
Figure 23 injects the mould vertical view of epoxy resin for the present invention;
Figure 24 is the figure that bows of diode group after the enveloping ring epoxy resins of the present invention;
Figure 25 is the end view of Figure 24.
Wherein: 1 thick copper sheet; 2 scale coppers; 3 diode chip for backlight unit; 4 connect copper sheet; 5 body of epoxy resin.
Embodiment
Embodiment: as Figure 13, Figure 14, Figure 15, shown in Figure 16, a kind of stamp-mounting-paper diode, comprise thick copper sheet 1 and scale copper 2 that equal in length and parallel interval are provided with, the middle part on plane is welded with diode chip for backlight unit 3 on the scale copper 2, gross thickness after 3 welding of scale copper 2 and diode chip for backlight unit equates with the thickness of thick copper sheet 1, be welded with between the last plane of diode chip for backlight unit 3 and thick copper sheet 1 and be connected copper sheet 4, it is vertical with scale copper 2 with thick copper sheet 1 respectively to connect copper sheet 4, and the length that connects copper sheet 4 is the width+thick copper sheet 1 of the width+scale copper 2 of thick copper sheet 1 and the spacing between the scale copper 2, the thick copper sheet 1 of welding fabrication, scale copper 2, diode chip for backlight unit 3 be connected copper sheet 4 together by envelope in body of epoxy resin 5, the bottom surface of only thick copper sheet 1 and scale copper 2 and the bottom surface of body of epoxy resin 5 are at grade, the both ends of the surface of thick copper sheet 1 and scale copper 2 respectively with the both ends of the surface of body of epoxy resin 5 at grade.
The manufacture method of aforesaid stamp-mounting-paper diode comprises the following steps:
The first step: cut the thick copper sheet of strip 1, a strip scale copper 2, some billet shapes and connect copper sheets 4; As Figure 17, Figure 18, shown in Figure 19.
Second step: some billet shapes are connected copper sheet 4 parallel interval be placed in the mould, place solder plate or solder(ing) paste respectively in the same side of some billet shapes connection copper sheets 4 earlier, place diode chip for backlight unit 3 at solder plate or solder(ing) paste again, on diode chip for backlight unit 3, place solder plate or solder(ing) paste then again, on solder plate or solder(ing) paste, place strip scale copper 2 again, the other end placement solder plate or the solder(ing) paste that connect copper sheet 4 at last some billet shapes, place the thick copper sheet 1 of strip again on solder plate or solder(ing) paste, the thick copper sheet 1 of strip and strip scale copper 2 are respectively with to be connected copper sheet 4 vertical; As Figure 20, Figure 21, shown in Figure 22.
The 3rd step: with the thick copper sheet 1 of strip, strip scale copper 2, diode chip for backlight unit 3 be connected copper sheet 4 welding fabrications; As Figure 21, shown in Figure 22.
The 4th step: the strip diode group of welding fabrication is put into mould enveloping ring epoxy resins, and the bottom surface that only makes the bottom surface of thick copper sheet 1 of strip and strip scale copper 2 and body of epoxy resin 5 after the enveloping ring epoxy resins at grade; As Figure 23, Figure 24, shown in Figure 25.
The 5th step: have the strip diode group of strip body of epoxy resin 5 to cut into single diode envelope, the both ends of the surface that make thick copper sheet 1 and scale copper 2 respectively with the both ends of the surface of body of epoxy resin 5 at grade; As Figure 24, shown in Figure 25.
The 6th step: the single diode behind excision forming the copper electroplating surfaces with tin arranged;
The 7th step: test, packing, finished product.
In the above-mentioned manufacture method, connecting the thick copper sheet 1 of interval, strip of copper sheet 4 and the width of strip scale copper 2 can decide according to the size of this stamp-mounting-paper diode (SMA, SMB, SMC).
The present invention welds with three copper sheets that design, and does not have the copper sheet of tablet formula, does not also have the copper lead-in wire of shaft type, and the utilization rate of copper is not almost very wasted, and copper accounts for cost of material about 40%; Moulding of the present invention does not need tablet formula and shaft type moulding Jiao Dao, and the epoxy resin utilization rate almost is shaft type and tablet formula three times, has reduced environmental pollution, and epoxy resin accounts for cost of material about 30%; Mould design of the present invention does not need headspace because of there being tablet and shaft type lead-in wire, can improve shaft type and tablet production efficiency more than 5 times; The present invention does not need clubfoot, has reduced the bad order rate.
More than comprehensive, raw material of the present invention is saved, and improves man efficiency, estimates than shaft type cost and reduces about 40%.
Claims (3)
1. the manufacture method of a stamp-mounting-paper diode comprises the following steps:
The first step: cut a thick copper sheet of strip (1), a strip scale copper (2), some billet shapes connection copper sheets (4);
Second step: some billet shapes are connected copper sheet (4) parallel interval be placed in the mould, place diode chip for backlight unit (3) respectively in the same side of some billet shapes connection copper sheets (4) earlier, go up at diode chip for backlight unit (3) again and place strip scale copper (2), the other end that connects copper sheet (4) billet shape is placed the thick copper sheet of strip (1) at last, and the thick copper sheet of strip (1) and strip scale copper (2) are connected copper sheet (4) respectively with billet shape vertical;
The 3rd step: the thick copper sheet of strip (1), strip scale copper (2), diode chip for backlight unit (3) are connected copper sheet (4) welding fabrication with billet shape;
The 4th step: the strip diode group of welding fabrication is put into mould enveloping ring epoxy resins, and the bottom surface that only makes the bottom surface of thick copper sheet of strip (1) and strip scale copper (2) and strip body of epoxy resin (5) after the enveloping ring epoxy resins at grade;
The 5th step: have the strip diode group of strip body of epoxy resin (5) to cut into single diode envelope, the both ends of the surface that make thick copper sheet of strip (1) and strip scale copper (2) respectively with the both ends of the surface of strip body of epoxy resin (5) at grade;
The 6th step: the single diode behind excision forming the copper electroplating surfaces with tin arranged;
The 7th step: test, packing, finished product.
2. the manufacture method of stamp-mounting-paper diode according to claim 1, it is characterized in that: in second step, the same side placement solder plate or the solder(ing) paste that connect copper sheet (4) earlier some billet shapes, place diode chip for backlight unit (3) at solder plate or solder(ing) paste again, place solder plate or solder(ing) paste again at diode chip for backlight unit (3) then, on solder plate on the diode chip for backlight unit (3) or solder(ing) paste, place strip scale copper (2) again.
3. the manufacture method of stamp-mounting-paper diode according to claim 1, it is characterized in that: in second step, connect the other end placement solder plate or the solder(ing) paste of copper sheet (4) earlier some billet shapes, on solder plate or solder(ing) paste, place the thick copper sheet of strip (1) again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101614186A CN100490198C (en) | 2006-12-06 | 2006-12-06 | Paster diode producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101614186A CN100490198C (en) | 2006-12-06 | 2006-12-06 | Paster diode producing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1976077A CN1976077A (en) | 2007-06-06 |
| CN100490198C true CN100490198C (en) | 2009-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101614186A Expired - Fee Related CN100490198C (en) | 2006-12-06 | 2006-12-06 | Paster diode producing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100490198C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3174088B1 (en) * | 2015-11-26 | 2020-12-30 | Siyang Grande Electronics Co., Ltd. | Method of manufacturing a plastic packaged smd diode |
| CN105489488B (en) * | 2015-11-26 | 2019-04-23 | 泗阳群鑫电子有限公司 | A kind of chip diode is using Jiao Dao as the manufacturing method of ontology |
| CN105514058A (en) * | 2016-02-03 | 2016-04-20 | 泰州优宾晶圆科技有限公司 | Open patch diode |
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2006
- 2006-12-06 CN CNB2006101614186A patent/CN100490198C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1976077A (en) | 2007-06-06 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070606 Assignee: Suzhou Qunxin Electronics Co., Ltd. Assignor: Lin Haihu Contract record no.: 2010990000140 Denomination of invention: Novel method for manufacturing chip diode Granted publication date: 20090520 License type: Exclusive License Record date: 20100324 |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090520 Termination date: 20171206 |