CN100475012C - 中间板的制造方法 - Google Patents

中间板的制造方法 Download PDF

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CN100475012C
CN100475012C CNB2004800194092A CN200480019409A CN100475012C CN 100475012 C CN100475012 C CN 100475012C CN B2004800194092 A CNB2004800194092 A CN B2004800194092A CN 200480019409 A CN200480019409 A CN 200480019409A CN 100475012 C CN100475012 C CN 100475012C
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格拉尔德·A·J·赫姆肯斯
罗格·特伦
马塞尔·斯米茨
弗兰克·斯皮特延斯
彼得·J·M·托伦
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Abstract

制造中间板的方法。提供具有连接组件的多层板，并提供具有形成于其中以限定连接器区域周界的通道的层。该层粘合至多层板，使得连接器区域与多层板的连接组件重叠。移除该层中的至少一部分连接器区域，以暴露多层板的连接组件。还公开了刚性多层。该刚性多层包括多层板和层。多层板具有连接组件。所述层具有形成于其中以限定连接器区域周界的通道。层粘合至多层板，使得连接器区域与多层板的连接组件重叠。然后可以例如通过深度可控刮刨移除连接器区域。如本领域技术人员将要了解到的，深度的公差不是关键性的，因为在形成刚性多层之前预先形成了具有通道的层。

Description

中间板的制造方法
相关申请的交叉参考
本专利申请要求2003年7月8日提交并标记为美国Serial No.60/485,765的临时专利申请的优先权，其全部内容通过引用并入本文。
关于联邦政府赞助的研究或开发的声明
不适用。
发明内容
一般而言，本发明涉及制造中间板(mid-plane)的方法。在该方法中，提供多层板和层。所述层优选为介电层。所述多层板具有连接组件。所述层具有形成于其中以限定连接器区域周界的通道。所述层粘合至所述多层板，使得连接器区域与多层板的连接组件重叠。然后移除所述层中的至少一部分连接器区域，以暴露多层板的连接组件。
本发明还涉及刚性多层。所述刚性多层包括多层板和层。所述层优选为介电层。所述多层板具有连接组件。所述层具有形成于其中以限定连接器区域周界的通道。所述层粘合至所述多层板，使得连接器区域与多层板的连接组件重叠。然后可以例如通过深度可控刮刨(routing)来移除连接器区域，以暴露多层板的连接组件。如本领域技术人员将要了解到的，深度的公差不是关键性的，因为在形成刚性多层之前预先形成了具有通道的层。
所述层优选用不可流动的粘合剂或流动性低的粘合剂粘合至多层板。不可流动的粘合剂或流动性低的粘合剂可以是本领域公知的某些种类的半固化片。预先形成于所述层中的通道防止任何粘合剂流入连接区域。因此，所述粘合剂不会干扰或以其它方式破坏形成于多层板中的连接组件。
结合附图和所附权利要求阅读下面的详细说明时，本领域的技术人员将会明白本发明的其它优点和特征。
附图说明
图1是根据本发明构建的中间板的横截面图。
图2是根据本发明构建的两个多层电路板的横截面图。
图3是图1中所述中间板的构造过程中所用的第一和第二金属箔以及粘合材料的横截面图。
图4是由图2中所述多层板与图3中所示金属箔和粘合材料一起形成的层叠体的横截面图。
图5是图4中所示层叠体一起层压形成准备最后加工的刚性多层产品的横截面图。
图6是层叠体另一实施方案的横截面图，其与图5相似，只是其移除了导电层并增加了电连接器。
图7是中间板成品的横截面图。
具体实施方式
参照附图，具体参照图1，其中示出并用附图标记10标明了根据本发明构建的中间板。中间板10提供有第一面12和第二面14。中间板10还提供有至少两个多层板16，为清楚起见用附图标记16a和16b标明。每个多层板16限定至少一个、优选一个以上的连接器区域20。为清楚起见用附图标记20a、20b、20c和20d标明连接器区域20。连接器区域20a和20b与第一面12相邻设置。连接器区域20c和20d与第二面14相邻设置。如下文中更加详细讨论的那样，连接器区域20设计来允许与连接器22互连，使得连接器22可以安装在中间板10的两侧，即第一面12和第二面14。为清楚起见用附图标记22a、22b、22c和22d标明连接器22。连接器22通过任何合适的连接组件24连接至多层板16，例如图1中所示利用压入配合连接器26。为清楚起见图1中仅标出了三个压入配合连接器26。
中间板10还提供有第一和第二金属箔30和32。第一金属箔30通过粘合材料34连接至多层板16a。第二金属箔32通过粘合材料36连接至多层板16b。多层板16a
Figure C200480019409D0007135230QIETU
过粘合材料38连接至多层板16b。粘合材料34、36和38可以是任何能够将金属箔30和32与多层板16a和16b刚性固定在一起以形成作为刚性结构的中间板10的合适材料。例如，粘合材料34、36和38可以是未固化的预浸料。粘合材料34和36优选为流动性低的粘合剂或不可流动的粘合剂，如本领域内已知的某些种类的半固化片。
应该注意，第一和第二金属箔30和32可以在其上提供有预定导电图案，包括通路或其它类型的电互连以将第一和第二金属箔30和32连接至相应的多层板16a和16b，从而在中间板10的任一面上形成至少两个独立电路。换句话说，第一金属箔30与多层板16a电互连以形成至少一个独立电路。同样地，第二金属箔32与多层板16b互连以形成至少一个独立电路。应该注意，多层板16a和16b上的电路根据需要可以通过形成在中间板10中的通路或其它合适的导电路径互连。
图2-5描述形成中间板10的方法。现在将更加详细地说明图2-5。但是，应该理解，可以使用其它方式构建中间板10。
图2中所示为多层板16a和16b。多层板16a的连接组件24包括限定多个孔42的多个电连接器40。同样地，多层板16b的连接组件24提供有限定多个孔48的多个电连接器46。电连接器40和46的尺寸应使得孔42和48匹配地容纳压入配合连接器26。在本文所示的优选实施方案中，电连接器40和46形成上述连接组件24的一部分。孔42和48的尺寸优选等于压入配合尺寸。
多层板16a和16b的特征可在于经表面精加工(未示出)如ENIG加工完成的埋入的通路产品。
图3中所示是第一和第二金属箔30和32，以及粘合材料34和36。第一和第二金属箔30和32在构造和功能上基本相同。为简明起见，下文中仅详细描述第一金属箔30。第一金属箔30提供有导电层50和介电层52。导电层50由任何种类的合适的导电材料如铝、铜等构成。通常，导电层50由铜构成。导电层50被蚀刻或者以其它方式形成为预定图案的形状以电连接提供在多层板16a中的各种组件和/或电路。介电层52可以由任何合适种类的介电材料如FR4构成。连接器区域20通过绕连接器区域20的周界形成通道54而限定在介电层52中。为清楚起见，通道54在图3中用附图标记54a、54b、54c和54d标明。通道54a、54b、54c和54d具有至少两个用途。第一用途是防止粘合材料34和36渗出或流入连接器区域20a、20b、20c和20d。另一用途是允许在后续制造步骤中移除连接器区域20a、20b、20c和20d中的第一和第二金属箔30和32，这将在图7中更加详细地讨论。通道54a、54b、54c和54d可以任何合适的方式如用刮刨机或激光器形成。粘合材料34和36优选预先形成有切除部分，使得粘合材料34和36包围通道54a、54b、54c和54d。在一个实施方案(未示出)中，通道54a、54b、54c和54d可以形成在导电层中，而不是介电层52中。
粘合材料34和36与介电层52相邻提供，通常在介电层52周围延伸，除了提供在连接器区域20a、20b、20c和20d中的部分介电层52。
图4中所示为由多层板16a和16b、第一和第二金属箔30和32以及粘合材料34、36和38形成的层叠体60。随后对层叠体60施加一定的条件，使得粘合材料34、36和38将第一和第二金属箔30和32以及多层板16a和16b粘合在一起，基本如图5中所示。例如，当粘合材料34、36和38由半固化片构成时，对层叠体60施加热和压力以形成适合于最后加工的刚性多层62。
在另一实施方案中，可以生产刚性多层62a，如图6中所示。所述刚性多层62a与刚性多层62相似，只是其移除了导电层50并增加了电连接器40a。刚性多层62a易于进行标准精加工。例如，可以利用钻、镀、形成外层图案和表面精加工来完成刚性多层62a。
如图7中所示，刚性多层62可以众所周知的方式形成其轮廓，但是首先，连接器区域22a、22b、22c是开放的，以允许通过切削或移除与通道54a-d相邻的材料来插入连接器22a-b。如本领域技术人员将会了解到的，深度的公差不是关键性的，因为在形成刚性多层62之前，第一和第二金属箔30和32预先形成有通道54a-d。在一个实施方案中，连接器区域22a-d利用曲面的深度可控刮刨来暴露。
然后可以众所周知的方式使用中间板10。也就是说，具有压入配合连接器26的连接器22利用穿过刚性多层62中的孔42和48来插入压入配合连接器26从而穿过刚性多层而连接。中间板的用途是本领域公知的，考虑到本文中所包含的其它详细说明，相信不需要更多的语言来教导本领域的技术人员如何使用中间板10。
应该理解，前文提出了本发明的实施例。因此，在不背离如所附权利要求所限定的本发明精神和范围的情况下，可以对本文所述的各种部件、元件和组件的构造和操作进行改变，也可以对本文所述方法的步骤和步骤顺序进行改变。

Claims (17)

1.制造中间板的方法，其包括以下步骤：
提供具有连接组件的多层板；
提供包含第一面和第二面的层，所述层的所述第一面具有通道，所述通道形成于所述层中以限定连接器区域周界；
将所述层的所述第一面粘合至所述多层板，使得连接器区域与多层板的连接组件重叠；和
移除所述层中的至少一部分连接器区域，以暴露多层板的连接组件。
2.权利要求1的方法，其中所述层粘合至所述多层板，使得在所述层和所述多层板的连接组件之间形成空隙。
3.权利要求1的方法，其中所述层的所述第二面粘合至导电层，以形成金属箔。
4.权利要求3的方法，其中所述金属箔是单面覆铜箔层压板，由此导电层由铜形成，并且所述层贴附于铜导电层的唯一一个面上。
5.权利要求1的方法，其中移除至少一部分连接器区域的步骤还限定为通过沿所述通道进行深度可控刮刨来移除连接器区域。
6.权利要求1的方法，其中在将所述层粘合至所述多层板的步骤之前，所述多层板涂覆有表面覆盖层。
7.制造中间板的方法，其包括以下步骤：
提供第一和第二多层板，每个多层板均具有连接组件；
提供第一和第二层；
所述第一层包含第一面和第二面，所述第一层的所述第一面具有形成于其中以限定连接器区域周界的通道；
所述第二层包含第一面和第二面，所述第二层的所述第一面具有形成于其中以限定连接器区域周界的通道；
将所述第一层的所述第一面粘合至所述第一多层板，使得连接器区域与所述第一多层板的所述连接组件重叠；
将所述第二层的所述第一面粘合至所述第二多层板，使得所述连接器区域与所述第二多层板的所述连接组件重叠；
将多层板粘合在一起，以形成刚性多层，其中第一层置于刚性多层的一面上，第二层置于刚性多层的反面上；和
移除第一和第二层中的至少一部分连接器区域，以暴露相应的连接组件。
8.权利要求7的方法，其中每一所述层粘合至所述层各自的多层板，使得在所述层和所述多层板的连接组件之间形成空隙。
9.权利要求7的方法，其中所述层中的一个或多个粘合至导电层，以形成金属箔。
10.权利要求9的方法，其中金属箔是单面覆铜箔层压板，由此导电层由铜形成，并且所述层贴附于铜层的唯一一个面上。
11.权利要求7的方法，其中移除至少一部分连接器区域的步骤还限定为通过沿通道进行的深度可控刮刨来移除连接器区域。
12.权利要求7的方法，其中在将所述层粘合至所述多层板的步骤之前，所述多层板涂覆有表面覆盖层。
13.刚性多层，其包括：
具有连接组件的多层板；
具有通道的层，所述通道形成于所述层中以限定连接器区域周界，所述层粘合至所述多层板，使得连接器区域与多层板的连接组件重叠。
14.权利要求13的刚性多层，其中所述层具有通道形成于其中的第一面，并且其中所述层的第一面面对所述多层板。
15.权利要求13的刚性多层，其中所述层的连接器区域与多层板间隔一定距离。
16.权利要求13的刚性多层，其还包括在所述层上方延伸的导电层，使得所述层位于导电层和多层板之间。
17.权利要求13的刚性多层，其中通过在所述连接器区域的至少部分中的开口暴露所述多层板的连接组件。
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