CN100471367C - Circuit board with recognition information and its making method - Google Patents
Circuit board with recognition information and its making method Download PDFInfo
- Publication number
- CN100471367C CN100471367C CNB2004100866104A CN200410086610A CN100471367C CN 100471367 C CN100471367 C CN 100471367C CN B2004100866104 A CNB2004100866104 A CN B2004100866104A CN 200410086610 A CN200410086610 A CN 200410086610A CN 100471367 C CN100471367 C CN 100471367C
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- Prior art keywords
- identifying information
- circuit board
- layer
- circuit
- insulating barrier
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- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 45
- 239000010410 layer Substances 0.000 claims description 80
- 239000002184 metal Substances 0.000 claims description 43
- 230000004888 barrier function Effects 0.000 claims description 40
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
This invention relates to a CB with identifying information and its manufacturing method, in which, the CB includes a kernel plate, an insulation layer, a circuit layer with an increased layer and metallic identifying information, in which, the insulation layer has a space region without circuit location forming multiple open-ends on the space, a pattern circuit layer is formed on the surface of said insulation layer and metallic identifying information is formed in the open-end of the space region for successors to track and discriminate circuit products by said information.
Description
Technical field
The invention relates to a kind of circuit board and method for making thereof, particularly about a kind of circuit board that confession identification and tracked information are set and preparation method thereof on circuit board with identifying information.
Background technology
Flourish along with electronic industry, it is compact that electronic product is tending towards on form, then marches toward high-performance, high function, high-speed R﹠D direction on function gradually.Be high integration (Integration) and microminiaturized (Miniaturization) demand that satisfies semiconductor device, the circuit board (Circuit board) that provides a plurality of masters, passive device and circuit to accept also develops into multi-layer sheet (Multi-layerboard) by doubling plate gradually, under limited space, enlarge available circuit area on the circuit board by interlayer interconnection technique (Interlayer connection), cooperate integrated circuit (Integrated circuit) demand of high electron density.
The flow process that the common circuit plate is made is after circuit board is finished the circuit making, via the electrical functionality and the mechanical strength test of a succession of circuit board, special series or relevant manufacturing information is set on this circuit board at last again, carries out product after being provided with and follows the trail of.
But above-mentioned serial number or relevant manufacturing information are after circuit board is finished manufacturing, just form icon indicia on circuit board welding resisting layer surface with printing or laser mode, can't promptly form in inside in circuit board process, it not only expends man-hour, also augments manufacturing cost.And the icon indicia that this circuit board surface forms also can't effectively be followed the trail of this product manufacturing information because of the sealing perfusion after finishing semiconductor packages.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of circuit board and method for making thereof with identifying information, and use side all can be followed the trail of and be recognized to the end from the processing procedure of circuit board product.
Another object of the present invention is to provide a kind of circuit board and method for making thereof, can provide reliable product to follow the trail of also and can save manufacturing cost with identifying information.
For reaching above-mentioned purpose, the invention provides a kind of circuit board method for making key step and comprise: provide the surface to be formed with the core board of patterned line layer with identifying information; On the surface of this core board, form insulating barrier; Offer a plurality of first openings and second opening in this insulating barrier, wherein this first opening is arranged on the part line layer of this core board, and this second opening is arranged on the spaciousness district of logicalnot circuit layout; And utilize Layer increasing method on this insulating barrier, to form the build-up circuit layer, and in this first opening, form conductive blind hole, and in this second opening, form the metal identifying information.
The present invention also provides a kind of circuit board method for making with identifying information to comprise: provide a circuit board, the spaciousness district that the inner at least one insulating barrier of this circuit board has the logicalnot circuit layout; Spaciousness district at this insulating barrier is formed with a plurality of openings; And be formed with patterned line layer, and in the opening in this spaciousness district, be formed with the metal identifying information on the surface of this insulating barrier.
By above-mentioned processing procedure, the invention provides a kind of circuit board and comprise with identifying information: core board, this core board surface is formed with patterned line layer; At least one insulating barrier is formed on the surface of this core board; At least one build-up circuit layer forms the surface of this insulating barrier; And the metal identifying information, the spaciousness district that big this insulating barrier is not laid with build-up circuit is set; Wherein, this spaciousness district has a plurality of openings for forming the metal identifying information.
The invention provides the circuit board that another kind has identifying information comprises: core board, the surface of insulating layer of this core board are formed with patterned line layer and the spaciousness district that is not laid with circuit, and this spaciousness district has a plurality of openings; And the metal identifying information, be formed on a plurality of openings in this spaciousness district.
Circuit board and method for making thereof with identifying information of the present invention, mainly be in the circuit board making process, offer a plurality of openings in the spacious district of this circuit board simultaneously, the form of this opening can be literal or pattern sign indicating number etc., when forming the circuit of this circuit board, simultaneously in this opening, be formed with metal level, follow the trail of and identification circuit board product situation of use side to the end from manufacture process by this literal or pattern sign indicating number for follow-up, so as to reliable product tracing system is provided.
In addition, literal in this circuit board or pattern sign indicating number can form in arbitrary layer of multilayer circuit intralamellar part, to avoid taking the outer-layer circuit wiring space.After the circuit board finished product is finished, though can't discern with visual or microscope, but still can be by means of tool identification such as X-ray; Certainly, if outer-layer circuit wiring space permission down, literal in this circuit board or pattern sign indicating number also can be formed on and this outer-layer circuit with layer, can utilize visual, microscope or barcode machine (Bar code reader) directly to recognize.Therefore utilize the present invention can provide reliable product to follow the trail of, compared with prior art can save manufacturing cost.
Description of drawings
Figure 1A to Fig. 1 F is the circuit board generalized section with identifying information of the present invention;
Fig. 2 is circuit board embodiment 2 schematic diagrames with identifying information of the present invention.
Embodiment
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention.
See also Figure 1A to Fig. 1 F, it is the generalized section with circuit board method for making of identifying information of the present invention.Wherein, this accompanying drawing is the schematic diagram of simplification, and circuit board of the present invention is described in a schematic way.This accompanying drawing only shows the element relevant with the present invention, and the aspect of shown element when being not actual enforcement, and component number, shape and the dimension scale during its actual enforcement is a kind of optionally design, and its component placement form may be more complicated.
Shown in Figure 1A, core board 11 at first is provided, this core board 11 mainly comprises insulating barrier 110 and the patterned line layer 111 that is formed on this insulating barrier 110.This core board 11 also can be to finish the circuit board that pre-treatment inside has the multilayer line layer in addition, and its processing procedure is a prior art, so do not give unnecessary details at this.
Shown in Figure 1B, on the surface of this core board 11, form insulating barrier 12.The material of insulating barrier 12 can be the resin type material of non-fiber, ABF (Ajinomoto Build-upFilm) for example, or fiber impregnation resin material, for example bismaleimides/triazine (BT, Bismaleimide triazine) adds glass fibre or blending epoxy and glass fibre (FR4) etc.
Shown in Fig. 1 C, for example in this insulating barrier 12, utilize technology such as laser beam drilling to offer a plurality of first openings 13 and second opening 14, wherein these a plurality of first openings 13 are arranged on the part line layer 111 of this core board 11, as blind hole to expose outside the part line layer 111 that covers under this insulating barrier 12, these a plurality of second openings 14 are arranged on the spaciousness district 12a of logicalnot circuit layout, the best of it is in this circuit board periphery, also can be located at non-outer peripheral areas, is as the criterion not have influence on configuration.
Shown in Fig. 1 D, utilization increases layer mode and form build-up circuit layer 15 on this insulating barrier 12, and formation conductive blind hole 130 in first opening 13 in this insulating barrier 12, this build-up circuit layer 15 of confession is electrically conducted the line layer 111 to this core board 11, and in a plurality of second openings 14 of this insulating barrier 12, forming metal identifying information 140, the metal identifying information 140 in this second perforate 14 can for example be the serial number of numeral 141, literal 142, bar code 143 or all types of relevant circuit boards such as pattern 144 or the information of relevant manufacturing.In addition, the making of this build-up circuit layer 15 all is a prior art, so repeat no more.
Under the situation of circuit board outer-layer circuit wiring space permission, when if this build-up circuit layer 15 is the outer-layer circuit layer, 140 of metal identifying informations in this circuit board and this outer-layer circuit are formed at layer, can utilize visual, microscope or barcode machine (Bar code reader) like this, perhaps be equipped with microprocessor, computer or Programmable Logic Controller, read this and be formed on metal identifying information 140 in this circuit board, can cooperate process conditions originally to continue to follow the trail of this product specification like this in the same stage of processing procedure.
Other sees also shown in Fig. 1 E and Fig. 1 F; certainly; circuit board of the present invention also can be the circuit board with multilayer line layer; it increases a layer processing procedure by continuing to carry out circuit; on core board 11, form multilayer build-up circuit layer 15 (shown in Fig. 1 E); also can form patterning insulating protective layer 16 on the circuit board that circuit increases layer processing procedure finally finishing, for example refuse layer (shown in Fig. 1 F), cover line construction under it so as to protection.Like this; this metal identifying information 140 of previous formation is covered by the circuit of follow-up formation or patterning insulating protective layer; but this metal identifying information 140 still can be discerned by instruments such as X-ray, and can cooperate being provided with of little reason device, computer or program-controlled device to continue the tracing product situation.Just, this metal identifying information 140 can be formed in arbitrary layer of multilayer circuit intralamellar part, to avoid taking the outer-layer circuit wiring space.After the circuit board finished product is finished, though can't be discerned with visual or microscope, but still can be discerned by instruments such as X-ray.
By above-mentioned processing procedure, the invention provides a kind of circuit board with identifying information, this circuit board mainly comprises: core board 11, these core board 11 surfaces are formed with patterned line layer; At least one insulating barrier 12 is formed on the surface of this core board 11; At least one build-up circuit layer 15 is formed on the surface of this insulating barrier 12; And metal identifying information 140, be arranged on the spaciousness district 12a that this insulating barrier is not laid with build-up circuit.Wherein, there are a plurality of openings in this spaciousness district for forming metal identifying information 140, it can be arranged on arbitrary layer of insulating barrier that will form line layer in the circuit board, but no matter this metal identifying information 140 is formed in the circuit board still is and the same layer of the surface lines of this circuit board that all available suitable detecting instrument or mode read this metal identifying information 140.
Embodiment 2
As shown in Figure 2, this metal identifying information 240 also can be formed directly in core board 21 except being formed on as mentioned above the layer reinforced structure of circuit board, so as to finishing the two layer line road layer circuit boards with identifying information in the embodiment of the invention 2.This circuit board is a kind of circuit board with identifying information, and it comprises: core board 21, the surface of insulating layer of this core board are formed with patterned line layer 211 and the spaciousness district 21a that is not laid with circuit; This spaciousness district 21a has a plurality of opening 21b; And metal identifying information 240, be arranged among a plurality of opening 21b in this spaciousness district.
But the circuit board of present embodiment 2 comprises at least one insulating barrier, is formed on the surface of this core board, and at least one build-up circuit, is formed on this insulating barrier, and the circuit board with two layers of line layer does not exceed.
Therefore, circuit board and method for making thereof with identifying information of the present invention, mainly be in the circuit manufacturing process of circuit board, simultaneously offer a plurality of openings in the spaciousness district of this circuit board logicalnot circuit layout, the form of this opening can be literal or pattern sign indicating number etc., in forming this circuit board making process, can in this opening, form metal level simultaneously, follow the trail of or identification circuit board product situation of use side to the end from manufacture process by this literal or pattern sign indicating number for follow-up, so as to reliable product tracing system is provided.Simultaneously, literal in this circuit board or pattern sign indicating number can be formed on the insulating barrier that will form line layer in the arbitrary layer of multilayer circuit intralamellar part, avoid taking the outer-layer circuit wiring space.After the circuit board finished product is finished, though can't discern this information with visual or microscope, but still can be by tool identification such as X-ray; In addition, if outer-layer circuit wiring space permission, literal in this circuit board or pattern sign indicating number also can with this outer-layer circuit with layer, even can utilize visual, microscope barcode machine (Bar code reader) directly to recognize this information.
Claims (21)
1. circuit board method for making with identifying information is characterized in that this method for making comprises:
Provide the surface to be formed with the core board of patterned line layer;
On the surface of this core board, form insulating barrier;
Offer a plurality of first openings and second opening in this insulating barrier, wherein this first opening is arranged on the part line layer of this core board, and this second opening is arranged on the spaciousness district of logicalnot circuit layout, and this second opening does not run through this insulating barrier;
Utilize Layer increasing method on this insulating barrier, to form the build-up circuit layer, and in this first opening, form conductive blind hole, and in this second opening, electroplate formation metal identifying information, and this metal identifying information does not electrically connect this build-up circuit layer; And
Form the patterning insulating protective layer on the circuit board that circuit increases layer processing procedure finally finishing.
2. the circuit board method for making with identifying information as claimed in claim 1 is characterized in that, this first opening and second opening utilize the laser beam drilling technology to form.
3. the circuit board method for making with identifying information as claimed in claim 1 is characterized in that, the metal identifying information in this second opening is selected from a kind of by in numeral, the combination that literal, bar code and pattern constituted.
4. the circuit board method for making with identifying information as claimed in claim 1 is characterized in that, this method for making also is included in and forms before the patterning insulating protective layer, continues to carry out circuit and increases a layer processing procedure, to form multilayer build-up circuit layer on circuit board.
5. the circuit board method for making with identifying information as claimed in claim 1 is characterized in that this metal identifying information is discerned by X-ray.
6. the circuit board method for making with identifying information as claimed in claim 1 is characterized in that, this metal identifying information and circuit board outer-layer circuit are with layer.
7. the circuit board method for making with identifying information as claimed in claim 6 is characterized in that, this metal identifying information reads by visual, microscope and wherein a kind of mode of barcode machine.
8. circuit board method for making with identifying information is characterized in that this method for making comprises:
Provide a circuit board, the spaciousness district that the inner at least one insulating barrier of this circuit board has the logicalnot circuit layout;
Spaciousness district at this insulating barrier is formed with a plurality of openings, and this opening does not run through this insulating barrier;
Surface at this insulating barrier is formed with patterned line layer, and plating is formed with the metal identifying information in the opening in this spaciousness district, and this metal identifying information does not electrically connect this patterned line layer; And
Form the patterning insulating protective layer at this circuit board surface.
9. the circuit board method for making with identifying information as claimed in claim 8 is characterized in that, the metal identifying information in this spaciousness district opening is selected from a kind of in the combination that is made of numeral, literal, bar code and pattern.
10. the circuit board method for making with identifying information as claimed in claim 8 is characterized in that this metal identifying information is discerned by X-ray.
11. the circuit board method for making with identifying information as claimed in claim 8 is characterized in that, this metal identifying information and circuit board outer-layer circuit are with layer.
12. the circuit board method for making with identifying information as claimed in claim 11 is characterized in that, this metal identifying information reads by visual, microscope and wherein a kind of mode of barcode machine.
13. the circuit board with identifying information is characterized in that, this circuit board comprises:
Core board, this core board surface is formed with patterned line layer;
At least one insulating barrier is formed on the surface of this core board;
At least one build-up circuit layer forms the surface of this insulating barrier;
The metal identifying information is arranged on the spaciousness district that this insulating barrier is not laid with build-up circuit; Wherein, this spaciousness district has a plurality of openings that do not run through this insulating barrier and forms the metal identifying information for electroplating, and this metal identifying information does not electrically connect this build-up circuit layer; And
The patterning insulating protective layer is formed on and finally finishes on the circuit board that circuit increases layer processing procedure.
14. the circuit board with identifying information as claimed in claim 13 is characterized in that, the metal identifying information in this spaciousness district opening is selected from a kind of in the combination that is made of numeral, literal, bar code and pattern.
15. the circuit board with identifying information as claimed in claim 13 is characterized in that, this metal identifying information can be discerned by X-ray.
16. the circuit board with identifying information as claimed in claim 13 is characterized in that, this metal identifying information and circuit board outer-layer circuit are with layer.
17. the circuit board with identifying information as claimed in claim 13 is characterized in that, this metal identifying information reads by visual, microscope and wherein a kind of mode of barcode machine.
18. the circuit board with identifying information is characterized in that, this circuit board comprises:
Core board, the surface of insulating layer of this core board are formed with patterned line layer and the spaciousness district that is not laid with circuit, and this spaciousness district has a plurality of openings that do not run through this insulating barrier;
The metal identifying information electroplate a plurality of openings that are formed on this spaciousness district, and this metal identifying information does not electrically connect this patterned line layer; And
The patterning insulating protective layer is arranged at this circuit board surface.
19. the circuit board with identifying information as claimed in claim 18 is characterized in that, the metal identifying information in this spaciousness district opening is selected from a kind of by in numeral, the combination that literal, bar code and pattern constituted.
20. the circuit board with identifying information as claimed in claim 18; it is characterized in that; the below of the patterning insulating protective layer of this circuit board surface also comprises at least one insulating barrier that is formed on this core board surface, and at least one build-up circuit layer that is formed on this insulating barrier.
21. the circuit board with identifying information as claimed in claim 18 is characterized in that, this metal identifying information is discerned by X-ray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100866104A CN100471367C (en) | 2004-10-29 | 2004-10-29 | Circuit board with recognition information and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100866104A CN100471367C (en) | 2004-10-29 | 2004-10-29 | Circuit board with recognition information and its making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1767729A CN1767729A (en) | 2006-05-03 |
| CN100471367C true CN100471367C (en) | 2009-03-18 |
Family
ID=36743241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100866104A Expired - Fee Related CN100471367C (en) | 2004-10-29 | 2004-10-29 | Circuit board with recognition information and its making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100471367C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101790289B (en) * | 2009-06-10 | 2011-05-18 | 华为技术有限公司 | PCB with interconnected blind holes and processing method thereof |
| CN102740585A (en) * | 2011-04-02 | 2012-10-17 | 华硕科技（苏州）有限公司 | Circuit board and manufacturing method thereof |
| DE102016117795A1 (en) * | 2016-09-21 | 2018-03-22 | Endress+Hauser Conducta Gmbh+Co. Kg | Field device of process automation technology |
| CN109406922B (en) * | 2017-08-15 | 2020-09-22 | 昆山维信诺科技有限公司 | Electronic product and testing method and device thereof |
| CN107613634A (en) * | 2017-09-26 | 2018-01-19 | 广东欧珀移动通信有限公司 | A kind of printed circuit board (PCB), terminal and printed circuit board typesetting method |
| CN110831339A (en) * | 2019-11-14 | 2020-02-21 | 江苏上达电子有限公司 | Graphic design method for avoiding ink bubbles |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
-
2004
- 2004-10-29 CN CNB2004100866104A patent/CN100471367C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1767729A (en) | 2006-05-03 |
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Granted publication date: 20090318 |