CN100465716C - Substrate assembling device and method - Google Patents
Substrate assembling device and method Download PDFInfo
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- CN100465716C CN100465716C CNB2006101285776A CN200610128577A CN100465716C CN 100465716 C CN100465716 C CN 100465716C CN B2006101285776 A CNB2006101285776 A CN B2006101285776A CN 200610128577 A CN200610128577 A CN 200610128577A CN 100465716 C CN100465716 C CN 100465716C
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- 239000000758 substrate Substances 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims description 9
- 230000006837 decompression Effects 0.000 claims description 15
- 239000004973 liquid crystal related substance Substances 0.000 claims description 14
- 239000007767 bonding agent Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 description 18
- 238000012423 maintenance Methods 0.000 description 17
- 238000007789 sealing Methods 0.000 description 17
- 238000010521 absorption reaction Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
In order to easily perform maintaining and inspecting in a pressure reduction chamber for adhering large-scale substrates to achieve highly precise adhering, an assembling device for adhering two substrates under a reduced pressure state divides the chamber into upper and lower structures. The upper chamber has an upper working stage capable of detachably fixing one of the substrates, and the lower chamber has a lower working stage capable of detachably fixing the other substrate, so that the substrates are opposite to each other. The upper working stage has a driving means to make the upper working stage and upper chamber independently move up and down respectively outside the upper chamber. The lower working stage is integrated with the lower chamber. The lower working stage has a driving means to make the lower working stage move at least in the horizontal direction corresponding to the upper chamber outside the lower chamber.
Description
The application's denomination of invention that to be Hitachi Sangyo Co., Ltd propose on June 26th, 2003 is dividing an application of 03149313.0 application for " substrate assembling apparatus and substrate assembling method ", application number.
Technical field
The present invention relates to base plate bonding device, particularly relevant be applicable to that the substrate that makes gummed in relief chamber keeps respectively to each other and relatively, dwindle the substrate assembling apparatus of assembling of the LCD panel etc. of gummed at interval.
Background technology
As liquid crystal display panel manufacturing apparatus in the past, record to some extent in Japanese kokai publication hei 10-26763 communique.In this communique, the liquid crystal that on side's side of 2 glass substrates that are provided with transparency electrode or film transistor matrix (ト ラ Application ジ ス ア レ イ), is covered, then, behind the decentralized configuration partition, by having the pin of mechanism up and down, with the opposing party's substrate-placing in the above, the register pin that is provided with by the left and right directions at device is after this substrate orientation, make and be vacuum in the chamber, behind the overlapping substrate, after positioning once more,, glues together cavity pressure by being returned to atmospheric pressure side.
In addition, in TOHKEMY 2001-305563 communique, following structure is disclosed: in the vacuum chamber of Construction integration, have with any one party detachable of two substrates remain on the first top or following table top and with the opposing party's detachable of two substrates remain on the second following or top table top.And, top and the following configuration relatively that keeps the table top of substrate separately, one square tube of two table tops is crossed elastic body and is combined movably airtightly with vacuum chamber, and this side's table top has the drive unit that moves in the horizontal direction at least with respect to vacuum chamber at the atmospheric side of the vacuum chamber of being divided by aforementioned elastic body.
In addition, in TOHKEMY 2001-5401 communique, disclose the chamber has been divided into 2 up and down,, had transporting and the substrate assembling apparatus of liquid crystal dripping device of substrate in the downside chamber.
Open in the flat 10-26763 communique above-mentioned spy, the pressurization of substrate only is to utilize between substrate and the draught head in the substrate outside carries out, and in this case, the encapsulant between substrate must be the state that is filled into really between upper and lower base plate.Therefore, when employed encapsulant must be very big amount, the possibility that expands the display part side to is arranged.In addition, the maintenance of substrate in a vacuum, because the substrate-placing of its downside is on smooth objective table, the substrate of upside passes through the member supporting of pin shape in the suitable position of its periphery, so at large substrate is under the situation of the large substrate more than 1m * 1m, deflection takes place, and is difficult to determine the tram of two substrates up and down.
Have again, the direct conveyance of upper and lower base plate in vacuum chamber, because be vented to vacuum from atmospheric pressure in the chamber, is needed the time of exhaust after conveyance, can not improve productive problem so exist.
In addition, open in the formation of flat 2001-305563 communique the spy, because table top up and down is configured in the vacuum chamber of Construction integration, so when the situation that the substrate breakage is arranged in the chamber, perhaps pollute under the situation of mesa surfaces, have the problem that is difficult to clean at the table top of inside, chamber at attachment material owing to substrate.In addition, promote the elevating mechanism of substrate in order to take out the substrate behind the gummed or in order to prevent displacement with the mechanism of temporary fixed substrate or for the mark identification mechanism or the lighting mechanism of the location of carrying out substrate, be fixed on the vacuum chamber that one constitutes or the structure side of vacuum chamber outside.But, because vacuum chamber and downside table top relatively move when the location, so exist the elevating mechanism that is arranged on the downside table top, temporary fixed, identification or the groove of location or the size in hole to become big problem.If the size of the hole that is provided with on table top or groove is too big, then after to substrate orientation, when pressurization, the variation that produces local pressure occurs the situation of the influence that bonding agent can not evenly apply.
And, 2 to cut apart in the device in chamber having in the past, following table and downside chamber do not have integrated, between table top and chamber sealing are arranged, with respect to the downside chamber, the motion that the downside table top can rotate freely etc.Therefore, because the location of substrate is to make in the XY direction that whole move in the chamber, the motion of θ direction is a moving substrate mounting table top, so sealing be configured between the upper and lower cavity and downside table top and downside chamber between 2 positions, from the viewpoint of airtight maintenance, existence situation about having problems.
Summary of the invention
Therefore, maximize, also can carry out high precision and gummed, that productivity is high at a high speed base plate bonding device even the purpose of this invention is to provide a kind of substrate.
The present invention in order to achieve the above object, be in the base plate bonding device that in the chamber of decompression state, two substrates is glued together, it constitutes, the chamber is made alienable structure up and down, in the upside chamber, make a side the substrate detachable first table top fixed, with the substrate detachable that in the downside chamber, makes the opposing party second table top fixed, with relative the purchasing of substrate separately, aforementioned first table top has the driving mechanism that makes it to move up and down at the atmospheric side of epicoele in the chamber, aforementioned second table top combines with the cavity of resorption one, at the atmospheric side of aforementioned cavity of resorption, have with respect to the epicoele drive unit of minute movement at least in the horizontal direction.
Description of drawings
Fig. 1 is the figure of formation of the substrate assembling apparatus of expression an embodiment of the invention.
Fig. 2 is the figure that expression is used for epicoele is connected with the pressurization foundation plate bindiny mechanism that moves.
Fig. 3 is the figure of an example of the cross sectional shape of the sealing ring between expression epicoele and the cavity of resorption.
Embodiment
Below, an embodiment of the invention are described with reference to the accompanying drawings.
In Fig. 1, substrate assembling apparatus is made of cavity of resorption T1 portion and epicoele T2 portion.In epicoele T2 portion, upside table top 2 is mounted at above-below direction movably by connecting supporting leg 3 and a plurality of adjustment leg 4 of epicoele T2.Supporting leg 3 is adjusted leg 4 by welding bellows 6 in addition by O shape ring 5, and epicoele T2 inside is interdicted for not to be communicated with atmosphere.The supporting leg 3 of upside table top 2 and adjustment leg 4 are fixed on the pressurization foundation plate 7.
And the central portion of this pressurization foundation plate 7 is fixed on the intermediate base plate 8.Constituting of intermediate base plate 8 by making on top frame 9 the driving mechanism action that is made of CD-ROM drive motor 10 and reductor 11 and ball screw 12 of installing, as guide piece, can move up and down ball spline guiding mechanism 13.In addition, on stand 1, the support column by being provided with respectively with the ball spline guiding mechanism comes support, top frame 9.One end be fixed on pressurization on the foundation plate 7 respectively to adjust another of leg 4 distolateral, link with the ball screw 15 that is driven by the CD-ROM drive motor 14 that is installed on the intermediate base plate 8.The adjusting mechanism up and down that driving is made of this CD-ROM drive motor 14 and ball screw 15 acts on pressurization foundation plate 7, on one side upside table top 2 can keep flatness, Yi Bian move up and down by exerting all one's strength.
In Fig. 2, represented to be used to drive an example of the mechanism of epicoele T2.On epicoele T2, be provided with the bindiny mechanism of the upside table top 2 that the link 52 by bar 51 that drives by cylinder 50 and T word shape constitutes.On pressurization foundation plate 7, be provided with the through hole that link 52 can be up and down.Under the state that pressurization foundation plate 7 descends, if at the link 52 of T font with between above the pressurization foundation plate 7, by insertion rod 51, promote pressurization foundation plate 7, epicoele T2 also can together make progress side shifting and constitute.In addition, epicoele T2 also with ball spline guide piece 13 as guide piece with can move up and down, all around (horizontal direction) install near the form of rigidity.These ball spline 13 1 ends are fixed on the device stand 1.That is,,, upside table top 2 and epicoele T2 are together moved up and down and constitute by bindiny mechanism for mobile epicoele T2.
In addition, in the chamber, be arranged on the side outer wall side of epicoele T2 in order to carry out the family of power and influence 16 that moving into of substrate take out of.And, on the sidewall locations of the relative epicoele of the family of power and influence 16, be provided with by ionization ultrasonic air is blown and be attached to substrate surface, can carry out the ion generator of removing static 17 to substrate.Have again, also be provided with ion generator 17a near the family of power and influence 16 outside the chamber, in view of the above, under the state that the family of power and influence opens,, can improve the electric effect of disappearing of substrate by blowing attached ionized air.In addition, though the ion generator 17 in the chamber is arranged on the epicoele T2, certain needing only is attached to the ion wind on the real estate, and be also passable as the formation that is installed on the cavity of resorption T1.From then on the family of power and influence 16 moves into substrate, carries out taking out of of liquid crystal board behind gummed.
On the outer wall, the secondary guide piece 18 of a plurality of sleeve structures is provided with central shaft 19 highlightedly in the chamber on epicoele T2.This central shaft 19 closes with the hole system that is provided with on the teat on the periphery that is arranged at upside table top 2, can carry out the adjustment of the horizontal direction of upside table top 2.That is, as the horizontal adjusting mechanism of upside table top 2, secondary guide piece 18 and central shaft 19 actions.So, also can finely tune the position of its horizontal direction by upside table top 2, becoming in the location that makes substrate is easy to also can make the plus-pressure equalization that is applied on the substrate simultaneously.
In epicoele T2, the window frame lower end of inboard convex form in the chamber is provided with a plurality of observation ports that base plate mark is observed usefulness.The camera lens 21 of gamma camera is inserted in the window frame of this observation usefulness, confirm the mark that on substrate, is provided with by gamma camera.The camera lens 21 of gamma camera is arranged on the moving stage of (X, the Y direction) shifting axle that has horizontal direction and vertical direction (Z direction) shifting axle, and this moving stage is fixed on the epicoele T2.Have again, on upside table top 2, the hole of base plate mark identification usefulness be arranged on the corresponding position of above-mentioned observation port on.
In the present embodiment, though be that gamma camera is configured in formation outside the chamber, by this gamma camera being directly installed on the formation on the upside table top 2, do not need observation port, except that the sealing that can improve in the chamber, can also dispose gamma camera near substrate, raising is improved based on the precision of the mark identification of gamma camera, thereby improve the bearing accuracy between substrate.
And, be to measure plus-pressure to substrate, between the intermediate base of supporting leg 3 and ball screw, be provided with load cell 22.In addition, when adjusting the flatness of upper table surface,, load cell 23 is set respectively so each on pressurization foundation plate 7 adjusted on the leg because need to monitor that driving the motor 14 of respectively adjusting leg 4 can not transship.
Downside table top 24 is fixed in the T1 of downside chamber.This downside table top 24, fixing if it engages with cavity of resorption comprehensively, then when decompression, under the situation of cavity of resorption T1 distortion, exist this distortion former state to be delivered to the possibility that the downside table top produces the flatness deviation.Therefore, for not being subjected to the influence of cavity of resorption T1 distortion, only the periphery with the downside table top is fixed on the downside chamber.In addition, on the full week of cavity of resorption T1, dispose sealing ring 25 described later.Epicoele T2 contacts with sealing ring 25, and the family of power and influence 16 is under closing state, and its inner sealing constitutes the decompression chamber.
Cavity of resorption T1 is arranged on the table top 28 of θ basis, and this θ basis table top 28 constitutes by motor 26 and do not have illustrated ball screw and swivel bearing 27 to rotate driving.In being connected of θ basis table top 28 and cavity of resorption T1, make box shape assembly between wherein, can guarantee the space of defined.This space is to be the downside at cavity of resorption T1, UV irradiation means 40 or substrate is installed is kept pawl elevating mechanism 41, substrate elevating mechanism 43 and be provided with.θ basis table top 28 is installed on the Y table top 32 by swivel bearing 27.In addition, Y table top 32 is arranged to can move on the linear track that is arranged on the X table top 33 by motor 29.Have, X table top 33 is arranged to can move by CD-ROM drive motor 30 on the linear track that is arranged at stand 1 side again.Like this, fixedly the actuator configuration in the downside chamber of downside table top is in the outside in downside chamber, by mobile downside chamber, and can be to the substrate orientation on the downside table top.Therefore, in can holding chamber in the sealing because with driving mechanism as exterior arrangement, so by the driving mechanism action, substrate can not be subjected to the influence of the dust that produced, thereby carries out the good gummed of precision.
In addition, epicoele T2 contacts with the sealing ring 25 of cavity of resorption T1 and when constituting the decompression chamber, for the crushing amount that makes sealing ring 25 keeps certain, on the peripheral part of θ basis table top 28, ball bearing 34 that a plurality of epicoeles use and the striking plate 35 that has adjusting mechanism is set.By these ball bearing 34 and striking plate 35, adjust the down position of upper cavity part T2.In addition, in the present embodiment, epicoele T2 carries out with combining by the deadweight of epicoele T2 of cavity of resorption T1.Like this, even only depend on the deadweight of epicoele T2, also can be gradually to inner pressure relief, from atmospheric side to chamber internal action external force, because epicoele T2 can make the chamber combination by huge adhesion in the sufficient pushing force of effect.In addition, on ball bearing 34, possess to be useful on and make epicoele T2 at the little height elevating mechanism of fine motion up and down.
And, for making the basic table top 28 of θ indeformable,, on parts fixing on the device basic (stand) 1, be provided with the ball bearing 37 and the striking plate 38 that has adjusting mechanism of a plurality of θ basis pressing plate 28 usefulness for supporting the peripheral part of θ basis table top 28.In view of the above, acceptance is from the heavy burden of θ basis pressing plate 28.Like this because be the ball bearing used with ball bearing 34 and θ basis table top by the chamber 37 these 2 layers, accept upper and lower cavity around heavy burden and constitute, so can be suppressed to the distortion in chamber very little.
On cavity of resorption T1, be provided for carrying out a plurality of transmission illuminations 39 of mark identification, in the position perforate corresponding with downside table top 24.And, in cavity of resorption T1, for the substrate that makes gummed unshift, and with the UV bonding agent smash to pieces make it the sclerosis, a plurality of pressurization UV irradiation means 40 are set.In addition, be separately positioned on and carry out the moving into when taking out of of substrate, be the maintenance pawl elevating mechanism 41 of the Width deflection that prevents substrate, or be the rotation and lifting pin of the deflection of the substrate of the deflection that prevents mechanical arm and fore-and-aft direction, or be used for substrate elevating mechanism 43 substrate elevating behind the gummed.
On downside table top 24, the hole is set in downside table top 24 for pressurization UV irradiation means 40 can be moved up and down.In addition, pressurization UV irradiation means 40 can doublely be done the use of rotation and lifting pin.In addition, can move up and down for making substrate elevating mechanism 43, and groove (notch) is set respectively in the base plate supports side.When moving into and take out of substrate, make 43 actions of this substrate elevating mechanism, make mechanical arm can insert side below the substrate.These holes or groove because on cavity of resorption T1 fixing downside table top 24, get final product so minimum surplus only is set.
Have again, pressurization UV irradiation means 40 and keep pawl elevating mechanism 41, and substrate elevating mechanism 43 have the reciprocating mechanism that connects cavity of resorption T1 respectively, between cavity of resorption T1 and these reciprocating mechanism portions, O type ring is set, in view of the above as the structure that keeps sealing.
Under decompression state,, can be the mechanism of electric maintenance by electrostatic chuck based on the upside substrate holding mechanism of upside table top 2, or in the mechanism that keeps by adhesives and physics any one.Under the situation of electric maintenance by electrostatic chuck, cut off impressed voltage, after certain electricity time that disappears, rise by making upside table top 2, can interrupt maintenance based on upside table top 2.In addition, under situation about keeping by the adhering part that is configured in the sheet on the table top, set in advance and a plurality ofly mechanically push the upside substrate pin of downside substrate to, will sell under the state that downward thruster presses, by upside table top 2 is risen, just can interrupt the maintenance of upside substrate.
Under the opposing party's decompression state based on the downside substrate holding mechanism of downside table top 24 too, can be the method for electric maintenance, or by adhering part and in the physics maintenance method any one by electrostatic chuck.For example, the combination of the adsorption method under the decompression state of upside table top 2 and downside table top 24, can be all as electrostatic chuck or adhesives with upside table top 2, downside table top 24, or with any one party of upside table top 2 or downside table top 24 as electrostatic chuck, the opposing party is as adhesives.Like this,, can guarantee par, keep parallel between table top as benchmark by under decompression state, substrate being remained on the table top, thus assembling substrates easily.Therefore, can glue together upper and lower base plate equably.In addition, in the present embodiment, can be with the formation that attracts based on negative pressure to adsorb with based on static and this both sides' dual-purpose of Electrostatic Absorption and constituting.
Decompression in the relief chamber is by at the illustrated vent port that do not have that is provided with in the chamber arbitrarily up and down, is connected with the vacuum pump of vacuum valve and dry pump or turbomolecular pump to carry out.In addition, the airborne release in the chamber is also not have illustratedly at the valve that is provided with on the chamber arbitrarily up and down by these, the inactive gas of nitrogen etc. or atmosphere is imported carry out.Airborne release is few from the moisture that the chamber is adhered to, shorten the meaning that is used for the time of reducing pressure in the chamber, and hope is the inert gas of the few nitrogen of hydrone amount etc.
Below, by constituting substrate assembling apparatus of the present invention, describe with regard to the action of gluing together liquid crystal board.At first, with bonding agent be the frame shape surround liquid crystal board periphery be applied as black matrix" shape or near the upside substrate it, at the face that has applied bonding agent is to be configured under the state that overturns of downside, on a side's who is equipped at the downside that is positioned at robot the mechanical arm, or scribble the downside substrate of liquid crystal from the teeth outwards in advance, with below liquid crystal drop as the state of upside configuration, and be positioned on the opposing party's the arm of robot of upside.Under the state that 2 plate bases is equipped on the underarm, robot moves to the place ahead of substrate assembling apparatus like this.In the instruction of the control device of substrate assembling apparatus, the family of power and influence 16 who opens epicoele T2, the upside substrate that robot will overturn on the downside mechanical arm is inserted in the chamber.
If upper substrate inserts, then according to the instruction of control device, upside table top 2 descends, by attraction absorption based on negative pressure, with the upside substrate absorption of upset remain on upside table top 2 below.Deflection when the front end of mechanical arm extends is bigger, attracts to use the rotation and lifting pin in the chamber under the absorption situation of difficult, pushes away the front end of supported mechanical arm from downside.The mechanical arm of downside temporarily retreats in the chamber, wait for that this retreats, the control device of substrate assembling apparatus is to the liquid crystal board of finishing gummed on downside table top 24, substrate elevating mechanism 43 or maintenance pawl elevating mechanism 41 are sent steering order, substrate is promoted upward.Robot is inserted into the downside mechanical arm liquid crystal board downside in the chamber once more, after above portable being raised to, it is retreated, and liquid crystal board is fetched into the outside in the chamber.Thereafter, by the instruction of control device, substrate elevating mechanism 43 and maintenance pawl elevating mechanism 41 descend.
Then, robot is inserted into the downside substrate that scribbles liquid crystal in advance on the mechanical arm of upside in the chamber.If infrabasal plate inserts in the chamber, then keep pawl elevating mechanism 41 to rise, promote the downside substrate, wait for retreating of mechanical arm, with the downside substrate be arranged on downside table top 24 above, by vacuum suction absorption downside substrate.
Then, shifting axle CZ vertically falls with camera lens 21, measures the base plate mark position of upside substrate, usage level direction shifting axle CX, CY, and the mark center position of mobile upside substrate and the center of camera lens 21 arrive consistent location.Then, fall upside table top 2,, measure the deviation of the mark position of upside substrate and downside substrate by camera lens 21.Then, do not promote ball bearing 34, make epicoele T2 and together rise, rise to sealing ring 25 and contact slightly or discontiguous position with epicoele T2 at the striking plate that has adjusting mechanism 35 of epicoele side setting by there being illustrated little height elevating mechanism., drive θ shaft drive motor 26 and Y-axis CD-ROM drive motor 29 and X-axis CD-ROM drive motor 30, lower cavity part T1 is moved horizontally to XY θ direction, carry out the coarse positioning of the calibration marker of infrabasal plate and upper substrate thereafter.
Behind the coarse positioning, fall ball bearing 34.So last following table is provided with under the situation of electrostatic chuck, and electrostatic chuck is applied voltage, the Electrostatic Absorption substrate is to table top.Under this state, close the family of power and influence 16, use vacuum pump, the air in the discharge side.In exhaust, discharge for easily making the gas between upper and lower base plate, upside table top 2 is promoted.After in the chamber, reaching certain decompression state, fall upside table top 2 once more, measure the position deviation between upper and lower base plate, by CD-ROM drive motor 26, motor 29, motor 30, cavity of resorption T1 is moved horizontally to XY θ direction, carry out the microposition of the calibration marker of infrabasal plate and upper substrate.Like this, under the state that epicoele T2 and cavity of resorption T1 agree with, under the situation of XY θ direction minute movement, move, the sealing ring 25 that disposes on cavity of resorption T1 is taken measures for not making epicoele T2 at cavity of resorption.
In addition, in the maintenance method of aforesaid substrate, in atmosphere, under the state that makes based on the absorption affinity effect of negative pressure, be to make the Electrostatic Absorption masterpiece be used for substrate, in this case, be necessary the small voltage that makes the voltage that is applied between substrate and electrostatic chuck, not produce electric discharge phenomena applying on the electrostatic chuck, thereby improve voltage according to decompression state.Therefore, also can become the decompression state of regulation in the vacuum chamber, electrostatic chuck be applied the voltage of regulation.
Fig. 3 is an example of representing the cross sectional shape of employed in the present embodiment sealing ring 25.That is, employed in the present embodiment sealing ring 25 is to use with the elastic force of above-below direction and compares, its all around direction be the sealing ring 25 of submissile power shape ((a) of Fig. 3 or shape (b)).And, because epicoele T2 as previously mentioned, above-below direction can move, all around direction (horizontal direction) is installed on the ball spline guide piece 13 hardly actively, even so make cavity of resorption T1 minute movement in the horizontal direction, can not drive epicoele and move, thereby table position is up and down overlapped.In addition, the shape of this sealing ring is not limited to the shape of Fig. 3, as long as we can say and can bring into play aforesaid characteristic, arbitrary shape all can.
After finishing microposition,,, carry out the compression set of substrate Yi Bian upside table top 2 is descended Yi Bian measure the value of load cell 22.After plus-pressure arrives the setting of crushing bonding agent, finish pressurization, by pressurization UV irradiation means 40, on one side on the temporary fixed position of substrate in advance the UV bonding agent of the temporary fixed usefulness of coating pressurize, shine on one side UV light, for not making the substrate position deviation, and carry out temporary fixed.
After the temporary fixed end, promote pressurization UV irradiation means 40.At upside table top 2 is under the situation about utilizing based on the absorption under the decompression state of electrostatic chuck, cuts off voltage, utilizes ion generator 17 to remove static.After the electricity time that disappears has been passed through in wait, promote upside table top 2.For seeking to shorten the electricity time that disappears, also can on the power supply supply line, make its ground connection by switch.At upside table top 2 is to utilize under the bonding situation, by a plurality of pins, mechanically pushes the upside substrate to the downside substrate, pin is being pressed under the state of downside, interrupts maintenance to the upside substrate by only promoting upside table top 2.
Thereafter, by being arranged on the valve on the chamber, in the inert gas or atmosphere introduction chamber with nitrogen etc., to atmosphere opening.Then, the open family of power and influence 16 carries out moving into and taking out of of substrate.
In the chamber of relevant substrate assembling apparatus, under the situation of the maintenance of cleaning etc., the cylinder driving stem 51 of upper cavity part T2 will be installed in, under the state that pressurization foundation plate 7 is fallen, insert pressurization foundation plate 7 and be installed between the link 52 of epicoele T2, under this state, use CD-ROM drive motor 10, with upside table top 2 one Z-direction lifting in the same way.Like this, epicoele T2 and upside table top 2 combine by bindiny mechanism, because be used for the CD-ROM drive motor 10 to 2 pressurizations of upside table top, can promote epicoele T2, promote the driving mechanism that epicoele T2 uses so there is no need to be provided with separately, can seek the simplification of device.In addition, under the opened state of chamber, can go up the maintenance of following table in view of the above.
As described above, in the present invention, because its formation is when substrate is assembled, under the incorporate state of upper and lower cavity, carry out a series of operation, when the base plate bonding at ormal weight finishes, carries out safeguarding of device, just carry out the separation of upper and lower cavity, so when can seeking to shorten gluing time, also can seek to shorten maintenance time.
Base plate bonding device of the present invention according to the above description, because be that to make following table and epicoele be one, it is involutory etc. to carry out the position by the driving mechanism that is arranged on the chamber outside, so can reduce the hole that on the chamber, is provided with as far as possible, can be under the state of stable maintenance decompression state, carry out high-precision gummed, and because be as the formation that epicoele can be moved up and down, so the maintaining in the vacuum chamber also becomes easy.
Claims (2)
1. a substrate assembling method keeps also relatively the substrate that should glue together, separately from each other up and down when positioning, shorten at interval,, in the chamber of decompression state, two substrates is glued together by the bonding agent that on the substrate of at least any one party, is provided with, it is characterized in that
The mode that is positioned at downside with the face that is coated with bonding agent on a side's of the robot that has arm up and down arm keeps the upside substrate, on the opposing party's arm, be that the mode of upside keeps the downside substrate with the face of the liquid crystal that drips to the surface, at first a side arm is inserted in the chamber, the side stage hand-deliver that makes progress of upside substrate is connect, then, to be positioned on the arm that the liquid crystal panel of finishing gummed on the downside table top remains on an above-mentioned side, outside the chamber, take out, then, the downward side stage hand-deliver of downside substrate that remains on the opposing party's the robots arm is connect.
2. substrate assembling method as claimed in claim 1, it is characterized in that, submit when connecting the side group plate at the side stage face that makes progress of the arm from an above-mentioned side, when the deflection of an above-mentioned side's arm is big, use the rotation and lifting pin that is arranged on to push away a side's of support robot the front end of arm from downside in the chamber in.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP191579/2002 | 2002-07-01 | ||
| JP2002191579A JP3906753B2 (en) | 2002-07-01 | 2002-07-01 | Board assembly equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN031493130A Division CN1470922B (en) | 2002-07-01 | 2003-06-26 | Baseboard assembling device and baseboard assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1916719A CN1916719A (en) | 2007-02-21 |
| CN100465716C true CN100465716C (en) | 2009-03-04 |
Family
ID=30437054
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101285776A Expired - Fee Related CN100465716C (en) | 2002-07-01 | 2003-06-26 | Substrate assembling device and method |
| CN031493130A Expired - Fee Related CN1470922B (en) | 2002-07-01 | 2003-06-26 | Baseboard assembling device and baseboard assembling method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN031493130A Expired - Fee Related CN1470922B (en) | 2002-07-01 | 2003-06-26 | Baseboard assembling device and baseboard assembling method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3906753B2 (en) |
| KR (1) | KR100479691B1 (en) |
| CN (2) | CN100465716C (en) |
| SG (1) | SG103930A1 (en) |
| TW (1) | TWI231558B (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI285758B (en) * | 2004-10-08 | 2007-08-21 | Au Optronics Corp | A method for combining set of substrates and apparatus of the same |
| KR100609897B1 (en) | 2004-11-01 | 2006-08-09 | 삼성전자주식회사 | LCD Manufacturing Apparatus |
| JP4078487B2 (en) * | 2005-05-25 | 2008-04-23 | 株式会社日立プラントテクノロジー | Substrate assembly apparatus and method |
| KR100721681B1 (en) | 2005-09-26 | 2007-05-25 | 주식회사 이라이콤 | Device for assembling assistant window assembly for backlight unit of liquid crystal display |
| JP4936730B2 (en) | 2006-01-16 | 2012-05-23 | 東京エレクトロン株式会社 | Vacuum container and vacuum processing apparatus |
| KR100906123B1 (en) * | 2006-05-12 | 2009-07-07 | 에이피시스템 주식회사 | Apparatus for pressing upper chuck for use in FPD bonding apparatus |
| JP4961957B2 (en) * | 2006-11-10 | 2012-06-27 | 株式会社日立プラントテクノロジー | Substrate assembly apparatus transport method |
| JP4163242B1 (en) * | 2007-07-31 | 2008-10-08 | 株式会社アルバック | Substrate bonding apparatus and substrate bonding method |
| KR100913220B1 (en) * | 2007-11-23 | 2009-08-24 | 주식회사 에이디피엔지니어링 | Apparatus for attaching substrates |
| KR100921997B1 (en) * | 2007-11-23 | 2009-10-14 | 주식회사 에이디피엔지니어링 | Apparatus for attaching substrates |
| KR100890380B1 (en) * | 2007-12-07 | 2009-03-25 | 주식회사 에이디피엔지니어링 | Apparatus for assembling substrates |
| KR100915698B1 (en) * | 2007-12-20 | 2009-09-04 | 주식회사 에이디피엔지니어링 | Apparatus for attaching substrates of flat plate display element |
| KR101307434B1 (en) * | 2011-10-31 | 2013-09-12 | 에프씨산업 주식회사 | Apparatus For Aligning Touch Screen Panel |
| KR101380978B1 (en) * | 2011-12-09 | 2014-04-02 | 주식회사 탑 엔지니어링 | Bonding apparatus |
| KR101408644B1 (en) * | 2013-02-25 | 2014-06-18 | 주식회사 톱텍 | Compensation device for stage flatness ratio of connation coalescence board |
| KR101631028B1 (en) * | 2015-05-20 | 2016-06-16 | (주)다스 | Bonding apparatus for display |
| JP6737575B2 (en) * | 2015-09-30 | 2020-08-12 | Ａｉメカテック株式会社 | Board assembly system, board assembly apparatus used in the system, and board assembly method using the system |
| CN109188739A (en) * | 2018-09-29 | 2019-01-11 | 深圳市纳瑞科技有限公司 | A kind of liquid crystal module panel intelligence production line |
| JP7433181B2 (en) * | 2020-09-23 | 2024-02-19 | 株式会社Ｓｃｒｅｅｎホールディングス | drawing device |
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|---|---|---|---|---|
| US6036568A (en) * | 1997-06-04 | 2000-03-14 | Kabushiki Kaisha Toshiba | Method and apparatus for assembling liquid crystal display |
| US6062798A (en) * | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| JP2001005405A (en) * | 1999-06-18 | 2001-01-12 | Hitachi Techno Eng Co Ltd | Method for assembling substrate and apparatus therefor |
| US6382895B1 (en) * | 1998-12-28 | 2002-05-07 | Anelva Corporation | Substrate processing apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3828670B2 (en) * | 1998-11-16 | 2006-10-04 | 松下電器産業株式会社 | Manufacturing method of liquid crystal display element |
-
2002
- 2002-07-01 JP JP2002191579A patent/JP3906753B2/en not_active Expired - Fee Related
-
2003
- 2003-05-27 TW TW092114301A patent/TWI231558B/en active
- 2003-06-26 CN CNB2006101285776A patent/CN100465716C/en not_active Expired - Fee Related
- 2003-06-26 CN CN031493130A patent/CN1470922B/en not_active Expired - Fee Related
- 2003-06-30 SG SG200303872A patent/SG103930A1/en unknown
- 2003-06-30 KR KR10-2003-0043451A patent/KR100479691B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6062798A (en) * | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| US6036568A (en) * | 1997-06-04 | 2000-03-14 | Kabushiki Kaisha Toshiba | Method and apparatus for assembling liquid crystal display |
| US6382895B1 (en) * | 1998-12-28 | 2002-05-07 | Anelva Corporation | Substrate processing apparatus |
| JP2001005405A (en) * | 1999-06-18 | 2001-01-12 | Hitachi Techno Eng Co Ltd | Method for assembling substrate and apparatus therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100479691B1 (en) | 2005-03-31 |
| JP3906753B2 (en) | 2007-04-18 |
| SG103930A1 (en) | 2004-05-26 |
| CN1470922B (en) | 2010-04-21 |
| CN1916719A (en) | 2007-02-21 |
| KR20040004082A (en) | 2004-01-13 |
| JP2004037594A (en) | 2004-02-05 |
| CN1470922A (en) | 2004-01-28 |
| TWI231558B (en) | 2005-04-21 |
| TW200403792A (en) | 2004-03-01 |
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