CN100449747C - 高密度电路模块 - Google Patents
高密度电路模块 Download PDFInfo
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- CN100449747C CN100449747C CNB028261879A CN02826187A CN100449747C CN 100449747 C CN100449747 C CN 100449747C CN B028261879 A CNB028261879 A CN B028261879A CN 02826187 A CN02826187 A CN 02826187A CN 100449747 C CN100449747 C CN 100449747C
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L2924/3011—Impedance
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
Description
Claims (76)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/005,581 US6576992B1 (en) | 2001-10-26 | 2001-10-26 | Chip scale stacking system and method |
US10/005,581 | 2001-10-26 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810009614A Division CN100594608C (zh) | 2001-10-26 | 2002-10-25 | 高密度电路模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1608400A CN1608400A (zh) | 2005-04-20 |
CN100449747C true CN100449747C (zh) | 2009-01-07 |
Family
ID=21716598
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810009614A Expired - Lifetime CN100594608C (zh) | 2001-10-26 | 2002-10-25 | 高密度电路模块 |
CNB028261879A Expired - Lifetime CN100449747C (zh) | 2001-10-26 | 2002-10-25 | 高密度电路模块 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810009614A Expired - Lifetime CN100594608C (zh) | 2001-10-26 | 2002-10-25 | 高密度电路模块 |
Country Status (5)
Country | Link |
---|---|
US (4) | US6576992B1 (zh) |
CN (2) | CN100594608C (zh) |
GB (1) | GB2395367B (zh) |
HK (1) | HK1077460A1 (zh) |
WO (1) | WO2003037053A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111093316A (zh) * | 2018-10-24 | 2020-05-01 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6627984B2 (en) * | 2001-07-24 | 2003-09-30 | Dense-Pac Microsystems, Inc. | Chip stack with differing chip package types |
DE10138278C1 (de) * | 2001-08-10 | 2003-04-03 | Infineon Technologies Ag | Elektronisches Bauteil mit aufeinander gestapelten elektronischen Bauelementen und Verfahren zur Herstellung derselben |
US6759745B2 (en) * | 2001-09-13 | 2004-07-06 | Texas Instruments Incorporated | Semiconductor device and manufacturing method thereof |
US7371609B2 (en) * | 2001-10-26 | 2008-05-13 | Staktek Group L.P. | Stacked module systems and methods |
US7026708B2 (en) * | 2001-10-26 | 2006-04-11 | Staktek Group L.P. | Low profile chip scale stacking system and method |
US20060255446A1 (en) | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US6914324B2 (en) * | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
US7081373B2 (en) * | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
SG121707A1 (en) * | 2002-03-04 | 2006-05-26 | Micron Technology Inc | Method and apparatus for flip-chip packaging providing testing capability |
SG107595A1 (en) | 2002-06-18 | 2004-12-29 | Micron Technology Inc | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods |
SG111069A1 (en) * | 2002-06-18 | 2005-05-30 | Micron Technology Inc | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
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Also Published As
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US20060131716A1 (en) | 2006-06-22 |
GB2395367B (en) | 2005-05-25 |
CN1608400A (zh) | 2005-04-20 |
WO2003037053A1 (en) | 2003-05-01 |
US6576992B1 (en) | 2003-06-10 |
GB2395367A (en) | 2004-05-19 |
CN101271886A (zh) | 2008-09-24 |
CN100594608C (zh) | 2010-03-17 |
US20060091521A1 (en) | 2006-05-04 |
GB0406140D0 (en) | 2004-04-21 |
US20030137048A1 (en) | 2003-07-24 |
HK1077460A1 (en) | 2006-02-10 |
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