CN100449725C - Wafer array apparatus and method for arraying wafer - Google Patents
Wafer array apparatus and method for arraying wafer Download PDFInfo
- Publication number
- CN100449725C CN100449725C CNB2006101402341A CN200610140234A CN100449725C CN 100449725 C CN100449725 C CN 100449725C CN B2006101402341 A CNB2006101402341 A CN B2006101402341A CN 200610140234 A CN200610140234 A CN 200610140234A CN 100449725 C CN100449725 C CN 100449725C
- Authority
- CN
- China
- Prior art keywords
- wafer
- unit
- receiving element
- wafer set
- push unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Abstract
The invention relates to a wafer array apparatus which makes opposite surfaces of a pair of adjacent wafers have a same property during a process of cleaning a plurality of wafers at one time by arraying wafers. The wafer array apparatus provided according to the invention includes a wafer receiving unit for receiving a first wafer group and a second wafer group composed of at least a wafer respectively in a horizontal state and arranging the wafer groups in a vertical state, and a delivering unit for orderly receiving the first wafer group and second wafer group of the vertical state and arranging the groups, and the wafer array apparatus further has a sturcture in which the wafers of the first wafer group and the second wafer group are alternately arrayed in opposite directions by the rotation of either the wafer receiving unit or the delivering unit.
Description
Technical field
The present invention relates to a kind of wafer collating unit, relate in particular to by arranging wafer and in the process of once cleaning numerous wafers, make adjacent a pair of wafer facing surfaces have the wafer collating unit of same nature.
Background technology
Usually, in the semiconductor fabrication process in the employed wafer cleaning method, utilize wet-cleaned method that cleaning fluid and deionized water remove wafer surfaces of contaminant matter because output (throughput) is higher and can remove all contaminations matter simultaneously, and can carry out in batches that (batch) cleans, therefore become in semiconductor fabrication process, to use maximum cleaning methods at present.
Usually, the employed cleaning device of wet-cleaned method is mainly formed by moving into portion, clean portion, the portion of taking out of.The described portion of moving into comprises and is used for receiving the mounting table of wafer, being the loader mechanism of unit loaded with wafers with the wafer carrier and receiving the arrangement units of being arranged by 50 wafers that are equivalent to 2 wafer carriers that described loader mechanism loaded from the wafer carrier (carrier) of taking in predetermined quantity (for example 25) wafer.50 wafers being arranged by described arrangement units are moved to clean portion by wafer clamp (waferchuck) and immerse in a plurality of rinse baths and/or rinsing (rinse) groove and carry out clean.Through repeatedly cleaning and the wafer of rinse cycle is moved to the portion of taking out of, after being taken in by wafer carrier, the described portion that takes out of is shifted into the cleaning device outside in clean portion.
Be incorporated between the wafer in each wafer carrier across preset space length, its surface is all towards same direction.That is, the surface of each wafer is all relative with the back side of adjacent chip in a plurality of wafers, and wafer is moved to cleaning device with this ordered state.
In addition, a surface of wafer must be a minute surface of having removed particle (particle) etc. in order to form device, even and the reverse side on a described surface to be the back side of wafer compare the particle that exists to a certain degree with minute surface also harmless.
Therefore, if the state when being taken in by wafer carrier with wafer cleans, then owing to clean under the minute surface of the adjacent chip ordered state relative with the back side, so the particle that can generation in the wafer cleaning process comes off from chip back surface is attached to the situation on the adjacent chip minute surface.As mentioned above, be attached to the wafer minute surface again and when polluting the wafer minute surface from the removed particle of chip back surface, the corresponding rising of ratio of defects, thus cause output to descend.
In order to prevent that this problem from occurring, when a plurality of wafers of being taken in two wafer carriers are arranged in and clean together, make the minute surface of adjacent chip relative with the back side by arrangement with the minute surface or the back side, this process is called mirror face turning.So, make the similar face of adjacent chip relative, thereby the particle of avoiding coming off from chip back surface in the cleaning process is attached on the minute surface of adjacent chip by mirror face turning.Thus, prevented to adhere to the wafer contamination that causes again because of removed particle.
Fig. 1 to Fig. 3 is the artwork of the expression wafer collating unit mirror face turning process that prior art provided.The mirror face turning process is described with reference to the accompanying drawings.
Shown in Fig. 1 (a), receiving element 10 receives the first wafer set W1 that is made up of a plurality of (25) wafer by the automation supply that does not illustrate among the figure.At this moment, the described first wafer set W1 is supplied with level, is placed to receiving element 10, and the rotation by receiving element 10 and in vertical state shown in Fig. 1 (b).After this, the lifting unit 20 that is positioned at described receiving element below rises and makes described first wafer set rise to predetermined altitude, shown in Fig. 1 (c).The first wafer set W1 after rising moves to the top of transfer (buffer) unit 40 by mobile unit 30, and when the described first wafer set W1 moved, described lifting unit 20 descended and returns original position, shown in Fig. 1 (d).
Then, shown in Fig. 2 (e), described transfer unit 40 is promoted to predetermined altitude with the first wafer set W1, and it is separated from receiving element 10, thus transfer unit 40 under propradation is center Rotate 180 degree with the vertical axis the overturn minute surface of the first wafer set W1.At this moment, described receiving element 10 returns original position in order to receive second wafer set.
The described receiving element 10 that returns original position is got back to initial conditions by rotation and is promptly stood vertically state, to receive second wafer set by the supply of automation level, and propelling movement (pusher) unit 50 that is used to receive the first wafer set W1 that is overturn below described transfer unit 40 rises, shown in Fig. 2 (f).
Shown in Fig. 2 (g), when receiving the first wafer set W1 when described push unit 50 risings, 40 beginnings of described transfer unit descend to original position, and meanwhile described receiving element 10 receives the second wafer set W2 that is made up of 25 wafers.
After this, shown in Fig. 2 (h), be placed to the second wafer set W2 of described receiving element 10 and receiving element 10 and together revolve and turn 90 degrees in vertical state, and described transfer unit 40 drops to original position.
The second wafer set W2 that is rotated into plumbness is shown in Fig. 3 (i), rely on mobile unit 30 to move to the top of described transfer unit 40 with receiving element 10, described receiving element 10 returns original position shown in Fig. 3 (j) after the second wafer set W2 is placed to transfer unit 40.
Under aforesaid state, shown in Fig. 3 (k), the push unit 50 of laying the first wafer set W1 descends towards transfer unit 40 directions of laying the second wafer set W2, and receiving element 10 is rotated and gets back to initial conditions and promptly stand vertically state, to receive another first wafer set from automation.
At this moment, the first wafer set W1 that descends with described push unit 50 is placed to transfer unit 40, and the wafer that makes the first wafer set W1 is between the wafer of the second wafer set W2, and the final first wafer set W1 is arranged in minute surface and minute surface or the back side state relative with the back side with the second wafer set W2.50 wafer W of arranging by said process are transported to cleaning device by wafer carrier 60 and clean, shown in Fig. 3 (l).
As mentioned above, existing its structure of wafer collating unit that is used to carry out mirror face turning is very complicated, and owing to carry out mirror face turning through a plurality of steps, so output is lower.Especially, owing to will repeatedly grasp and lay wafer, therefore increased and installed occupied mobile (Foot Print) zone.
Summary of the invention
The present invention proposes in order to solve aforesaid problem, and it is a kind of simple in structure and can simplify mirror face turning technology to greatest extent and productivity gain and reduce the wafer collating unit of mobile route (Foot Print) to greatest extent that its purpose is to provide.
Another object of the present invention is to provide a kind of and can in the wafer alignment processes, prevent the wafer collating unit that wafer is impaired.
To achieve these goals, according to wafer collating unit provided by the present invention, comprise to receive respectively and be arranged in the wafer receiving element of plumbness by first wafer set that at least one wafer was constituted and second wafer set and with it and receive first wafer set of described plumbness successively and second wafer set and the push unit arranged, and the rotation that has by some unit in described wafer receiving element or the push unit makes the wafer of first wafer set and the wafer of second wafer set replace structure arranged in the opposite direction with level.
And described wafer receiving element and push unit relatively move along wafer orientation in vertical state, and described push unit to be arranged to the vertical axis be rotatable 180 degree in center.Different therewith, described wafer receiving element and push unit are relatively moved in the wafer orientation of the plumbness lower edge of wafer, and described wafer receiving element is arranged to along a certain direction and opposite spin 90 degree thereof.
Especially, can also comprise transducer of when the wafer that is loaded onto described push unit enters the damaged zone of possibility, being monitored and the control part that moves according to the described push unit of the signal limitations of described transducer.
According to wafer cleaner provided by the present invention, comprise: be used to the unloading portion of loading substrate loading portion and being used for unloading substrate; Process chamber, this process chamber comprises the rinse bath that is used to carry out clean; And the substrate handover portion that is used to transfer substrate; And described loading part comprises above-mentioned wafer collating unit.
According to wafer aligning method provided by the present invention, comprise step: will be rotated into plumbness with first wafer set by at least one wafer was constituted of level supply by the wafer receiving element; First wafer set of plumbness is handed off to push unit; To be rotated into plumbness with second wafer set by at least one wafer was constituted of level supply by described wafer receiving element; Second wafer set that reaches plumbness is handed off to described push unit; And, when described second wafer set of handing-over, the wafer of first wafer set and the wafer of second wafer set are alternately arranged in the opposite direction.
At this moment, join and preferably also comprise step before described second wafer set: with first wafer set that is joined is center Rotate 180 degree with the vertical axis; Described first wafer set and second wafer set are relatively moved along the wafer orientation of described first wafer set.
Different therewith, the step that described second wafer set is rotated into plumbness can comprise the step that is rotated along the direction opposite with described first wafer set, and wafer aligning method provided by the present invention can also comprise the step that described first wafer set and second wafer set are relatively moved along the wafer orientation of described first wafer set.
Description of drawings
Fig. 1 to Fig. 3 is the artwork of the expression wafer collating unit mirror face turning process that prior art provided;
Fig. 4 is the side view of whole expression wafer collating unit first embodiment provided by the present invention;
Fig. 5 and Fig. 6 are the profile and the side view of the wafer receiving element of the wafer collating unit shown in Fig. 4;
Fig. 7 is the side view of the push unit of the wafer collating unit shown in Fig. 4;
Fig. 8 is the synoptic diagram with wafer cleaner of the wafer collating unit shown in Fig. 4;
Fig. 9 a to Fig. 9 d is the artwork of the wafer collating unit mirror face turning process shown in the presentation graphs 4;
Figure 10 is the side view of whole expression wafer collating unit second embodiment provided by the present invention;
Figure 11 is the front elevation of the wafer receiving element of the wafer collating unit shown in Figure 10;
Figure 12 is the front elevation of wafer receiving element when rotary body is in level shown in Figure 11;
Figure 13 is the side view of the push unit of the wafer collating unit shown in Figure 10;
Figure 14 a to Figure 14 d is the artwork of the wafer collating unit mirror face turning process shown in expression Figure 10;
Figure 15 is the side view of whole expression wafer collating unit the 3rd embodiment provided by the present invention;
Figure 16 and Figure 17 are the artwork that is used to illustrate the push unit control procedure of the wafer collating unit shown in Figure 15.
Embodiment
Below, present invention will be described in detail with reference to the accompanying embodiment.
Fig. 4 is the side view of whole expression wafer collating unit first embodiment provided by the present invention.
As shown in Figure 4, comprise according to wafer collating unit provided by the present invention that to make wafer be that the center revolves the wafer receiving element that turn 90 degrees 200 and make wafer with the trunnion axis be the push unit 300 of center Rotate 180 degree with the vertical axis.At this moment, wafer is fed to described wafer receiving element by automation 100.
First wafer set and second wafer set that described automation 100 will be made up of a plurality of wafers respectively are fed to described wafer receiving element 200 respectively.At this moment, the wafer of first wafer set and second wafer set is supplied to described wafer receiving element 200 with level.
Below, be that 25 situation is that example describes with the number of wafers of each wafer set.
Described automation 100 comprises: the wafer saddle 110 that wafer is placed with level, the long guide rail 120 that extends by fore-and-aft direction and the slide block 130 that combines with described wafer saddle 110 and move along described guide rail 120.
At this moment, at 50 slots 112 of front surface formation of described wafer saddle 110, laid with the end of introducing wafer.Form between the adjacent a pair of slot 112 and lay projection 114, describedly lay projection 114 its sectional area is more little the closer to the end.That is, adjacently a pair ofly lay slot 112 between the projection 114 its width is big more more forward.This is to prevent in the wafer in the described slot 112 when wafer is introduced into slot 112 because of laying protruding 114 edges and the wafer end damage wafers that contacts in order to be introduced in guiding.
Described guide rail 120 is driven by motor (not shown) with the slide block 130 that advances on described guide rail 120 and retreat, and is used for described wafer saddle 110 is moved to the place ahead or rear.Described guide rail 120 and slide block 130 are normally used equipment, omit its explanation at this.
The following describes the ordered state of the wafer of laying on the described wafer saddle 110.As mentioned above, form 50 slots 112 on the wafer saddle 110,110 last times of wafer saddle lay 25 wafers and transfer in the present embodiment.Thereupon, in the slot 112 of described wafer saddle 110, lay a wafer, so that can both place other wafer between each wafer every a slot.This is in order to carry out the wafer mirror face turning, will to be elaborated in the back to this.
Fig. 5 and Fig. 6 are the profile and the side view of the wafer receiving element of the wafer collating unit shown in Fig. 4.
And described wafer receiving element 200 can also comprise the brake 250 (stopper) that the rotation that limits described rotary body 220 can only revolve described wafer saddle 230 to turn 90 degrees and the transducer 260 of monitoring rotary body 220 positions.
Further specify described wafer receiving element 200 below.
Described wafer receiving element 200 be located at described automation 100 the place aheads and with automation 100 preset space lengths at interval, be positioned at simultaneously wafer collating unit main body 400 the top and with wafer collating unit main body 400 preset space lengths at interval.
As mentioned above, described wafer receiving element 200 comprises framework 210, and described framework 210 comprises fixing horizontal parts 212, a pair of fixed vertical parts of upwards erectting in described fixing horizontal parts 212 two side ends 214 and the fixed connecting part 216 that connects described a pair of fixed vertical parts 214.And, be positioned at described framework 210 tops and rotatably be incorporated into the rotary body 220 of framework 210 similar, comprise rotation horizontal part 222, in the vertically extending a pair of rotation vertical member 224 of described rotation horizontal part 222 two side ends and connect the parts 226 that are rotatably connected of described a pair of rotation vertical member 224 downwards with framework 210.
The rotation vertical member 224 of the fixed vertical parts 214 of the framework 210 of Xing Chenging and rotary body 220 overlaps each other as mentioned above, form through hole 218 respectively on a pair of fixed vertical parts 214, form the projection 228 that is inserted into described through hole 218 on a pair of rotation vertical member 224 respectively, described protruding 228 are inserted in the described through hole 218, thereby in conjunction with described framework 210 and rotary body 220.At this moment, between described through hole 218 and projection 228, bearing 270 is set, rotary body 220 can be rotated with respect to framework 210.
And the fixed vertical parts 214a that is positioned at a side in the described fixed vertical parts 214 is provided with motor 240.Described motor 240 rotating shafts 242 combine with the rotation vertical member 224a projection 228a that inserts by the through hole 218a on the described fixed vertical parts 214a, thereby make described rotary body 220 rotations when motor 240 is driven.And, be respectively equipped with brake 250 at fixing horizontal parts 212 the place ahead upper surfaces and fixed connecting part 216 tops, can only revolve with the described rotary body 220 of accurate restriction and to turn 90 degrees, and be provided with transducer 260 to monitor the position of rotation of described rotary body 220 at the opposite side upper surface of described fixing horizontal parts 212.
In addition, on described rotary body 220, promptly rotate horizontal part 222 above be provided with a pair of wafer saddle 230 that separates to both sides by preset space length.Described wafer saddle 230 is used for receiving wafer from automation 100 also to be laid, and forms slot 232 in its one side relative to each other.Described slot 232 is of similar shape and quantity with slot 112 on the wafer saddle 110 that is formed on described automation 100, omits its explanation at this.Described slot 232 is respectively formed on a pair of wafer saddle 230, the spacing distance that described a pair of wafer saddle 230 is had should guarantee wafer not along the supplier to disengaging.
At this, described framework 210 is attached to described wafer collating unit main body (among Fig. 4 400) by bolt (among Fig. 4 280), and this is in order to regulate the height of framework 210, can to make framework 210 rise or descend during bolt 280 rotations.The reason that framework is arranged to move up and down is to make the wafer saddle 110 of described automation 100 and the wafer saddle 230 of described wafer receiving element 200 to be positioned at equal height, by making both have identical height, can carry out the handing-over action of wafer smoothly.
Fig. 7 is the side view of push unit in the wafer collating unit provided by the present invention.
As shown in Figure 7, push unit 300 comprises: can lay laying parts 310, make and lay rotary unit 320 that parts 310 are center Rotate 180 degree with the vertical axis, make the lifting unit 330 of laying parts 310 liftings (rise or descend) and move the mobile unit 340 of laying parts 310 along horizontal fore-and-aft direction by the wafer of wafer receiving element 200 supply.
As mentioned above, the described parts 310 of laying are used to lay from first wafer set and second wafer set of 200 supplies of wafer receiving element and are arranged, and are provided with 50 slots 312 in the above, can lay 50 wafers altogether.
Described parts 310 bottoms of laying are provided with rotary unit 320, and described rotary unit 320 is the inscapes that play a significant role in the wafer mirror face turning, are used to make that to lay parts 310 be center Rotate 180 degree with the vertical axis.At this moment, described rotary unit 320 is realized by common motor 322 and a pair of brake that do not illustrate in the drawings.Described motor 322 is located at describedly to be laid parts 310 bottoms and carries out clockwise/be rotated counterclockwise, and the brake that along continuous straight runs is oppositely arranged limits its rotation.This rotary unit 320 is not limited to motor 322 and brake, also can realize by other element.
Described lifting unit 330 is used for the described parts 310 of laying of lifting, comprises vertically the long guide rail 332 that extends, the slide block 334 that moves along described guide rail 332 and the motor (not shown) that described slide block is moved.And described mobile unit 340 comprises the long guide rail 342 that extends along fore-and-aft direction, the slide block 344 that moves along described guide rail 342 and the motor (not shown) that described slide block 344 is moved.At this moment, the guide rail 332 of described lifting unit 330 is positioned at above the slide block 344 of described mobile unit 340.That is, the described parts 310 of laying are realized moving on fore-and-aft direction and the above-below direction by described lifting unit 330 and mobile unit 340.
At this, the motor of the slide block 334,344 that is used for mobile described lifting unit 330 and mobile unit 340 that does not illustrate in the drawings is arranged on slide block 334,344 inside, moves described slide block 334,344 when motor-driven.In order to realize this function, its length direction forms tooth bar in described guide rail 332,342 upper edges, and on the rotating shaft of described motor, be provided with can with the pinion of described tooth bar engagement.At this moment, in order to control described parts 310 the moving on fore-and-aft direction and above-below direction of laying, preferably adopt stepping motor (Stepping Motor).
Fig. 8 is the synoptic diagram with wafer cleaner of wafer collating unit provided by the present invention.
With reference to accompanying drawing, wafer cleaner comprises loading part 1000 and unloading portion 2000 and process chamber 3000 and hothouse 4000.Described loading part 1000 and unloading portion 2000 are located at the end of wafer cleaner both sides, and at their intermediate arrangement process chambers 3000 and hothouse 4000, described process chamber 3000 is made of a plurality of rinse baths 3100.
Further specify the process of using wafer cleaner to clean below with said structure.
The inner wafer of wafer case 5000 (Wafer Cassette) that is incorporated in the wafer that is used for keeping cleaning front and back is moved into loading part 1000 with wafer case 5000, and move to process chamber 3000 by wafer carrier, clean through a plurality of rinse baths 3100 that are provided with in the process chamber 3000, after hothouse 4000 carries out drying, move to unloading portion 2000 by wafer carrier and be incorporated in again in the wafer case 5000.
At this moment, be provided with successively automation (among Fig. 4 100) and the wafer collating unit provided by the present invention of supplying first wafer set and second wafer set with level in the described loading part 1000.Thus, realize moving to process chamber 3000 after the mirror face turning on described wafer collating unit by the wafer that described loading part 1000 is moved into, the process of being carried out mirror face turning by described wafer collating unit will be elaborated in the back.Not only can be suitable for the wafer collating unit that aforementioned first embodiment is provided in the described loading part 1000, can also be suitable for the wafer collating unit that other embodiment of back is provided.
Fig. 9 a to Fig. 9 d illustrates the mirror face turning process below in view of the above for the artwork of the described wafer collating unit mirror face turning process provided by the present invention of expression.
Utilize the mirror face turning process of wafer collating unit provided by the present invention as follows.At first, shown in Fig. 9 a, laying the first wafer set W1 that is made of 25 wafers on the wafer saddle 110 of automation 100, the described first wafer set W1 forwards is that wafer receiving element 200 directions move by guide rail 120 and slide block 130.At this moment, on described wafer saddle 110, lay the first wafer set W1 that constitutes by 25 wafers as previously mentioned, the wafer of the described first wafer set W1 is placed in the slot and preset space length at interval each other, to put into the wafer of second wafer set that will be explained hereinafter between the wafer of the first wafer set W1.
In addition, the wafer saddle 230 of described wafer receiving element 200 stands vertically, and to receive the first wafer set W1 of level from described automation 100, the parts 310 of laying of push unit 300 keep at a certain distance away with wafer receiving element 200.
Under aforesaid state, when the wafer saddle 110 of described automation 100 forwards moves horizontally, in the moment of mobile end, as described in the first wafer set W1 is placed in shown in Fig. 9 b on the wafer saddle 230 of wafer receiving element 200, make the first wafer set W1 be handed off to wafer receiving element 200, and the wafer saddle 110 of described automation 100 rearward move to receive the second wafer set W2.
As mentioned above, when laying the first wafer set W1 on the wafer saddle 230 of wafer receiving element 200, drive described motor (among Fig. 5 240), making the first wafer set W1 is that the center is revolved and turn 90 degrees with the trunnion axis, thereby makes the described first wafer set W1 be in plumbness.
At this moment, described lay parts 310 by mobile unit 340 to wafer receiving element 200 1 side shiftings, and finish to move can receiving the position of revolving the first wafer set W1 that turn 90 degrees.Thereupon, when the first wafer set W1 revolves when turning 90 degrees, lifting unit 330 promotes to be laid parts 310, the first wafer set W1 and is placed to laying on the parts 310 of rising.
Through said process, when the first wafer set W1 is placed to described when laying on the parts 310, shown in Fig. 9 c, the wafer saddle 230 of described wafer receiving element 200 revolves once more to turn 90 degrees and returns original position, the meanwhile described parts 310 laid descend by lifting unit 330, and laying parts 310 under this state is center Rotate 180 degree by rotary unit 320 with the vertical axis.
Meanwhile, described wafer receiving element 200 receives the second wafer set W2 that is made of 25 wafers from automation 100 shown in Fig. 9 d, and drive motors 240 to make the second wafer set W2 be that the center is revolved and turn 90 degrees with the trunnion axis.After this, thereby the described parts 310 of laying rise by lifting unit 330 and receive the second wafer set W2 and arranged, lay this moment parts 310 before rising by mobile unit 340 forwards or the rear move preset distance so that the wafer of the second wafer set W2 can be placed between the wafer of the first wafer set W1 that had before laid.At this, described displacement is predefined spacing size, 1/2 of the spacing distance of the described spacing size general employing first wafer set W1 and the second wafer set W2, i.e. 0.5mm half spacing (Half-Pitch).
In addition, though have only push unit 300 to move among the described embodiment, also can be arranged to wafer receiving element 200 or two 200,300 whiles of unit and move along the wafer orientation along the wafer orientation.For instance, can be under the state of fixing push unit 300, advance and retreat and the alignment pitch size along the wafer orientation by wafer receiving element 200.And, also can move and the alignment pitch size round about simultaneously by wafer receiving element 200 and push unit 300.
In the aforementioned embodiment, for first wafer set and second wafer set are carried out mirror face turning, the push unit 300 that receives first wafer set from wafer receiving element 200 is before receiving second wafer set from wafer receiving element 200, with the vertical axis is center Rotate 180 degree, but can be center Rotate 180 degree with the vertical axis by wafer receiving element 200 also.That is, after automation 100 receives second wafer set, be earlier that the center is revolved and turn 90 degrees with the trunnion axis, described then wafer receiving element 200 is a center Rotate 180 degree with the vertical axis, then second wafer set is handed off to push unit 300.At this moment, push unit 300 must move to the position that can receive second wafer set.
So, wafer receiving element 200 is after receiving second wafer set, earlier be that the center is revolved and turn 90 degrees with the trunnion axis, the structure that with the vertical axis is center Rotate 180 degree again can replace with wafer receiving element 200 after receiving second wafer set, revolves the structure that turn 90 degrees in the opposite direction according to revolving the side that turn 90 degrees with first wafer set.This structure is compared with aforesaid first embodiment, has the advantage that reduces number of motors, simplified structure, and this will be illustrated among second embodiment below.
Figure 10 is the side view of whole expression wafer collating unit second embodiment provided by the present invention, Figure 11 is the front elevation of the wafer receiving element of the wafer collating unit shown in Figure 10, Figure 12 is the front elevation of wafer receiving element when rotary body is in level shown in Figure 11, and Figure 13 is the side view of the push unit of the wafer collating unit shown in Figure 10.
As shown in figure 10, to comprise with the trunnion axis be the wafer receiving element 600 of center rotation wafer and the push unit 700 that the wafer that is rotated by described wafer receiving element 600 is arranged to wafer collating unit provided by the present invention.At this moment, the wafer that is rotated by described wafer receiving element 600 is supplied to wafer receiving element 600 by automation 100 handovers that are arranged on wafer receiving element 600 1 sides.Described automation 100 is identical with automation among aforesaid first embodiment, omits its explanation at this.
As Figure 11 and shown in Figure 12, wafer receiving element 600 is used to rotate first wafer set and second wafer set that receives from the automation shown in Figure 10 100, this wafer receiving element 600 be arranged in wafer collating unit (Figure 10 800) above, be located at described automation 100 the place aheads and automation 100 position of preset space lengths at interval simultaneously.
Described wafer receiving element 600 comprises: lay the rotary body 610 of first wafer set that receives from described automation 100 and second wafer set, be located at the pair of frames 620 of described rotary body 610 both sides respectively.
Described rotary body 610 is four jiaos of loop-shaped, portion is provided with the space that can lay first wafer set and second wafer set within it, form outstanding laterally rotating shaft 612 respectively in its two sides, be provided with the device for limiting (Locker) 630 that when rotary body 610 rotations, is used to prevent to be placed in the wafer disengaging rotary body 610 on the rotary body 610 in the front and back of described rotary body 610.And, forming slot 614 on the both sides internal face of described rotary body 610, the slot 112 that forms on the wafer saddle 110 of described slot 614 and described automation 100 is of similar shape and quantity, omits its explanation at this.
Described framework 620 comprises horizontal part 622 that contacts with described wafer collating unit 800 and the vertical member 624 of giving prominence to vertically upward on described horizontal part 622.And, comprise the patchhole 626 that is formed on described vertical member 624 upper ends and is used to insert described rotating shaft 612.
Observe the combined structure of described rotary body 610 and framework 620, the patchhole 626 that rotary body 610 is inserted into described framework 620 by its rotating shaft 612 is attached to framework 620 and can is that the center is rotated with rotating shaft 612, and the rotation of described rotary body 610 realizes by cylinder (cylinder) or motor.
Described device for limiting 630 is separately positioned on the front and back of rotary body 610, can slide and is attached to rotary body 610 to relative to each other the direction outside.That is to say that the described device for limiting 630 that is arranged on described rotary body 610 front and back can be to mutual away from reaching approaching direction slip and being attached to rotary body 610.So, the reason that described device for limiting 630 is set is that the wafer that prevents to be placed on the rotary body 610 arbitrarily breaks away from rotary body 610 when described rotary body 610 rotations.But when to described rotary body 610 handing-over wafers or from rotary body 610 handing-over wafers, described device for limiting 630 slides so that wafer can move to the direction that is separated from each other, and slides to approaching mutually direction when rotary body 610 rotations.
In addition, push unit 700 comprises and can lay laying parts 710, make and describedly lay the lifting unit 720 of parts 710 liftings (rise or descend) and move the mobile unit 730 of laying parts 710 along horizontal fore-and-aft direction by the wafer of wafer receiving element 600 supply as shown in figure 13.
That is, the described push unit 700 of present embodiment is not that the center is rotated but being fixed with the vertical axis except laying parts, is that the push unit 300 of first embodiment of center Rotate 180 degree is identical with the vertical axis with laying parts.Thereupon, described push unit 700 does not comprise and is used to rotate the rotary unit 320 of laying parts 710, lays parts 710 and is directly connected to lifting unit 720.In addition, all the other formations of described push unit 700 are identical with the push unit 300 of first embodiment.
That is, the described parts 710 of laying are provided with slot 712 in the above, can lay 50 wafers altogether.Described lifting unit 720 is used for the described parts 710 of laying of lifting, and the slide block 724 that comprise guide rail 722, moves along described guide rail 722 reaches the motor (not shown) that moves described slide block.And described mobile unit 730 comprises guide rail 732, the slide block 734 that moves along described guide rail 732 and the motor (not shown) that described slide block 734 is moved.At this moment, the guide rail 722 of described lifting unit 720 is positioned at above the slide block 734 of described mobile unit 730.That is, the described parts 710 of laying are realized moving on fore-and-aft direction and the above-below direction by described lifting unit 720 and mobile unit 730.
Below, with reference to the mirror face turning process of Figure 14 a to Figure 14 d explanation wafer collating unit that present embodiment provided.
Utilize the mirror face turning process of the wafer collating unit that present embodiment provides as follows.At first, shown in Figure 14 a, laying the first wafer set W1 that is made of 25 wafers on the wafer saddle 110 of automation 100, the described first wafer set W1 forwards is that wafer receiving element 600 directions move by guide rail 120 and slide block 130.At this moment, on described wafer saddle 110, lay the first wafer set W1 that constitutes by 25 wafers as previously mentioned, the wafer of the described first wafer set W1 is placed in the slot (among Figure 10 112) and preset space length at interval each other, to put into the wafer of second wafer set (Figure 14 c W2) that will be explained hereinafter between the wafer of the first wafer set W1.
In addition, the rotary body 610 of described wafer receiving element 600 stands vertically, and to receive the first wafer set W1 of level from described automation 100, the parts 710 of laying of push unit 700 keep at a certain distance away with wafer receiving element 600.
Under aforesaid state, when the wafer saddle 110 of described automation 100 forwards moves horizontally, in the moment of mobile end, rotary body 610 inside of wafer receiving element 600 as described in the first wafer set W1 is placed to shown in Figure 14 b, make the first wafer set W1 be handed off to wafer receiving element 600, and the wafer saddle 110 of described automation 100 rearward move to receive the second wafer set W2.
As mentioned above, when laying the first wafer set W1, rotate described rotary body 610, the first wafer set W1 is vertically revolved turn 90 degrees, thereby make the described first wafer set W1 be in plumbness in rotary body 610 inside of wafer receiving element 600.
At this moment, described push unit 700 lay parts 710 by mobile unit 730 to wafer receiving element 600 1 side shiftings, and finish to move can receiving the position of revolving the first wafer set W1 that turn 90 degrees.Thereupon, when the first wafer set W1 revolves when turning 90 degrees, lifting unit 720 promotes to be laid parts 710, the first wafer set W1 and is placed to laying on the parts 710 of rising.
Through said process, when the first wafer set W1 is placed to described when laying on the parts 710, shown in Figure 14 c, the rotary body 610 of described wafer receiving element 600 revolves once more to turn 90 degrees and returns original position, and the meanwhile described parts 710 of laying descend by lifting unit 720.
The rotary body 610 of described wafer receiving element 600 that returns original position receives the second wafer set W2 that is made of 25 wafers from automation 100 shown in Figure 14 d, and the second wafer set W2 that will receive revolves and turn 90 degrees.
After this, thereby the described parts 710 of laying rise by lifting unit 720 and receive the second wafer set W2 and arranged, lay parts 710 before rising by mobile unit 730 forwards or the rear move preset distance so that the wafer of the second wafer set W2 can be placed between the wafer of the first wafer set W1 that had before laid.
At this moment, be placed to the described first wafer set W1 that lays parts 710 and the second wafer set W2 and lay after rotating in the opposite direction by the rotation of the rotary body 610 of described wafer receiving element 600, thus with minute surface mutually the state of upset lay.And described displacement is predefined spacing size, 1/2 of the spacing distance of the described spacing size general employing first wafer set W1 and the second wafer set W2, i.e. 0.5mm half spacing (Half-Pitch).
And, the rotary body 610 that returns the described wafer receiving element 600 of original position make the second wafer set W2 that receives from automation 100 revolve the action that turn 90 degrees and lay parts 710 by mobile unit 730 forwards or the rear move preset distance so that the action that the wafer of the second wafer set W2 is placed between the wafer of the first wafer set W1 can be carried out simultaneously.
In addition, though have only push unit 700 along continuous straight runs to move among the described embodiment, also can be arranged to wafer receiving element 600 or two unit 600,700 simultaneously along continuous straight runs move.For instance, can be under the fixing state of push unit 700, advance and retreat and the alignment pitch size by wafer receiving element 600 along continuous straight runs.And, also can move and the alignment pitch size round about simultaneously by wafer receiving element 600 and push unit 700.
In addition, if in the mirror face turning process because have a power failure or very reason such as button actions cause system reset (reset) and carry out manual operation, all devices of the wafer collating unit that then aforesaid first and second embodiment provided all can be initialised and return original position.For example, system resets in the process that push unit 300,700 rises in order to receive the second wafer set W2 under the state of the first wafer set W1 if laid at an upper portion thereof, and then described push unit 300,700 can continue return original position after its direct of travel rises.At this moment, because being placed to the first wafer set W1 on described push unit 300,700 tops is positioned on the same vertical line with second wafer set that is placed to described wafer saddle 230 (or device for limiting 630), can run foul of each other when therefore rising, and in this process, wafer disengaging or damaged problem can take place.And, rising to peak at described push unit 300,700 receives under the state of the some wafer set among the first wafer set W1 and the second wafer set W2 when carrying out manual operation because of system is out of service, if rotate because of operator's operate miss makes push unit 300,700, the first wafer set W1 and the second wafer set W2 then can take place and be positioned at its peripheral wafer collating unit main body and other parts collide and impaired problem.
The 3rd embodiment that will illustrate below proposes in order to address this is that, and it can be regarded as the variation of first and second embodiment.Below, will be that example illustrates the 3rd embodiment with the situation that first embodiment is out of shape, but the main composition of the 3rd embodiment be suitable for too to second embodiment.In addition, omit and first embodiment explanation of repeating part mutually for ease of explanation.
Figure 15 is the side view of whole expression wafer collating unit the 3rd embodiment provided by the present invention, and Figure 16 and Figure 17 are the artwork that is used to illustrate the push unit control procedure of the wafer collating unit shown in Figure 15.
As shown in figure 15, the 3rd embodiment of wafer collating unit provided by the present invention comprise with by automation 100 with the wafer of level supply be arranged in the wafer receiving element 200 of plumbness, the push unit 300 that the wafer of the plumbness that receives from described wafer receiving element 200 is rotated, the control part (not shown) that whether the described push unit 300 of monitoring lays the transducer 900 of wafer, restriction push unit 300 moves when described transducer 900 monitors wafer.
Described automation 100, wafer receiving element 200 and push unit 300 are identical with aforesaid first embodiment.
Described transducer is used for whether having wafer in certain area monitoring of wafer collating unit main body 400.Promptly, described transducer 900 is for comprising the optical sensor of illuminating part 910 and light accepting part 920, be used to monitor be placed in the wafer that moves on the described push unit 300 whether enter may damaged zone (that is the zone that interferes between wafer and the wafer collating unit during push unit action).At this moment, described illuminating part 910 and light accepting part 920 are arranged on wafer collating unit lower body part, and be separately positioned on the front and back of laying parts 310 of rising in order to receive wafer and with lay parts 310 preset space lengths at interval.
At this, transducer has adopted optical sensor described in the present embodiment, but is not to be defined in this, can adopt the various transducers that are used for the monitoring wafer position.
When the sensor 900 monitored wafer, its signal was sent to control part (not shown), received that the control part of signal limits moving of described push unit 300.To be elaborated in conjunction with Figure 16 and Figure 17 by described transducer 900 and control part mobile situation about limiting to push unit 300.
Wafer collating unit provided by the present invention as previously mentioned, when in the mirror face turning process because have a power failure or very reason such as button actions cause system reset (reset) and when carrying out manual operation, by program control all devices all be initialised and return original position.
As an example, as shown in figure 16, if push unit 300 lay the first wafer set W1 at an upper portion thereof and the process that under this state, rises in order to receive the second wafer set W2 in system move again, then whether control part at first lays wafer on the position by described transducer 900 monitoring wafer and the described push unit 300.
At this moment, if described transducer 900 monitors wafer, its signal will be sent to described control part, receive that the control part of signal will limit push unit 300 risings.Meanwhile, the described push unit 300 that is limited to rise drops to minimum point earlier and is moved horizontally to afterwards original position in order to return original position.
Thus, do not worry bumping being positioned under the state on the same vertical line yet, thereby can prevent that wafer breaks away from or impaired with second wafer set even be placed in the first wafer set W1 that promptly lays on the parts 310 on described push unit 300 tops.
As another example, as shown in figure 17, if rising to peak at described push unit 300 receives under the state of the some wafer set among the first wafer set W1 and the second wafer set W2 and rotates because of operator's operate miss makes push unit 300, then whether control part is at first by laying wafer on the described push unit 300 of described transducer 900 monitorings, when monitoring wafer, its signal is sent to control part, receives that the control part of signal will limit push unit 300 rotations.
Thus, can prevent the first wafer set W1 that is placed in described push unit 300 tops and the some wafer set among the second wafer set W2 and wafer collating unit main body 400 and other parts collides and impaired problem.
In addition, when the described push unit 300 of restriction moves, except the method for utilizing transducer (optical sensor) 900 monitoring wafer positions, can also be provided for monitoring the transducer of whether laying wafer and limit push unit 300 and move at push unit 300.
For example, when in the mirror face turning process because have a power failure or very reason such as button actions cause system reset (reset) and when carrying out manual operation, control part will be monitored and whether lay wafer by the transducer (for example, load cell (Load Cell)) that is arranged on the push unit 300.At this moment, if arrive wafer, then its signal can be sent to the action of control part restriction push unit 300 by described sensor monitors.
More than, accompanying drawings the structure and the mirror face turning process thereof of the wafer collating unit that the preferred embodiments of the present invention provided, but this only illustrates, and the general technology worker of this area should be able to understand in the scope that does not break away from the technology of the present invention thought can carry out various changes and change.
In sum, wafer collating unit provided by the present invention with mainly by receiving element, lifting unit, The existing wafer collating unit that mobile unit, transfer unit and push unit form is compared, and has structure Simply, make advantage easy, easy to use.
And, utilize the mirror face turning technology of described wafer collating unit than in the past significantly shortening, thus tool The advantage that can improve output and reduce to greatest extent mobile route (Foot Print) is arranged.
Especially, be provided with when the wafer that is loaded into push unit enters and monitored may damaged area the time Sensor, thus can prevent manual operation or (reset) situation that resets when taking place because of push unit in institute State the rotation of possibility damaged area or rising and make the impaired problem of wafer. That is, push away by restriction as mentioned above Send the rotation of unit and move to prevent that wafer is impaired, thereby can improve device reliability.
Claims (22)
1, a kind of wafer collating unit is characterized in that, comprises:
The wafer receiving element is arranged in plumbness to be used for receiving respectively by first wafer set that at least one wafer was constituted and second wafer set and with it with level; With
Push unit is with first wafer set and second wafer set that are used for receiving successively described plumbness and arranged; And,
Rotation by some unit in described wafer receiving element or the push unit is alternately arranged the wafer of first wafer set and the wafer of second wafer set in the opposite direction.
2, wafer collating unit according to claim 1 is characterized in that the wafer orientation in vertical state of described wafer receiving element and push unit edge relatively moves, and it is rotatable 180 degree in center that described push unit is arranged to the vertical axis.
3, wafer collating unit according to claim 2, it is characterized in that described wafer receiving element comprise framework, rotatably be incorporated into described framework rotary body, be arranged on and be used to receive the wafer saddle of wafer set and the drive division that is used to rotate described rotary body on the described rotary body.
4, wafer collating unit according to claim 3 is characterized in that described wafer receiving element also comprises: limit described rotary body rotation so that described wafer saddle can only revolve the brake that turn 90 degrees; And the transducer that is used to monitor rotational body position.
5, wafer collating unit according to claim 2, it is characterized in that described push unit comprise be used to lay wafer lay parts, be the rotation described rotary unit of laying parts in center with the vertical axis, be used for that lifting is described lays the lifting unit of parts and move the described mobile unit of laying parts along wafer orientation in vertical state.
6, wafer collating unit according to claim 1, it is characterized in that described wafer receiving element and push unit relatively move in the wafer orientation of the plumbness lower edge of wafer, described wafer receiving element is arranged to along a certain direction and opposite spin 90 degree thereof.
7, wafer collating unit according to claim 6 is characterized in that described wafer receiving element comprises the pair of frames of along continuous straight runs interval preset space length and rotatably is incorporated into the rotary body that is used to receive wafer set between the described pair of frames.
8, wafer collating unit according to claim 7 is characterized in that described rotary body is formed for laying the groove of wafer set in inside, and has the device for limiting that is used to when the rotation of described rotary body to prevent that the wafer set of being laid breaks away from.
9, wafer collating unit according to claim 6 is characterized in that described push unit comprises and is used to lay laying parts, being used for that lifting is described lays the lifting unit of parts and move the described mobile unit of laying parts along wafer orientation in vertical state of wafer.
10,, it is characterized in that described mobile unit comprises the long guide rail that forms along in vertical state wafer orientation, the slide block that moves along described guide rail and the drive division that is used for moving described slide block according to claim 5 or 9 described wafer collating units.
11,, it is characterized in that also comprising transducer of when the wafer that is loaded into described push unit enters the damaged zone of possibility, being monitored and the control part that moves according to the described push unit of the signal limitations of described transducer according to any described wafer collating unit in the claim 2,5,6,9.
12, wafer collating unit according to claim 11 is characterized in that the rotation of described control part for the described push unit of restriction.
13, wafer collating unit according to claim 11 is characterized in that described transducer comprises the optical sensor with illuminating part and light accepting part.
14, a kind of wafer cleaner is characterized in that, comprises:
Be used to the unloading portion of loading substrate loading portion and being used for unloading substrate;
Process chamber, this process chamber comprises the rinse bath that is used to carry out clean; And
Be used to transfer the substrate handover portion of substrate; And,
Described loading part comprises claim 1 any described wafer collating unit to the claim 5.
15, a kind of wafer aligning method is characterized in that, comprises step:
To be rotated into plumbness by the wafer receiving element with first wafer set by at least one wafer was constituted of level supply;
First wafer set of plumbness is handed off to push unit;
To be rotated into plumbness by described wafer receiving element with second wafer set by at least one wafer was constituted of level supply; And
Second wafer set of plumbness is handed off to described push unit; And,
When described second wafer set of handing-over, the wafer of first wafer set and the wafer of second wafer set are alternately arranged in the opposite direction.
16, wafer aligning method according to claim 15, described second wafer set that it is characterized in that joining also comprises step before: with first wafer set that is joined is center Rotate 180 degree with the vertical axis; Described first wafer set and second wafer set are relatively moved along the wafer orientation of described first wafer set.
17, wafer aligning method according to claim 15, it is characterized in that the step that described second wafer set is rotated into plumbness is comprised the step that is rotated along the direction opposite with described first wafer set, and this wafer aligning method also comprises the step that described first wafer set and second wafer set are relatively moved along the wafer orientation of described first wafer set.
18, according to any described wafer aligning method in the claim 15 to 17, it is characterized in that described second wafer set is rotated into plumbness comprises the step that makes first wafer set decline that is joined before, and before second wafer set of the described plumbness of handing-over, comprise the step that makes first wafer set rising that is descended.
19,, it is characterized in that the described step that relatively moves comprises the step that moves described first wafer set according to claim 16 or 17 described wafer aligning methods.
20,, it is characterized in that the step that also comprises the step of when the wafer that is loaded into described push unit enters the damaged zone of possibility, being monitored and when monitoring wafer or push unit, limit described push unit action according to any described wafer aligning method in the claim 15 to 17.
21, the step that wafer aligning method according to claim 20, the step that it is characterized in that limiting described push unit action comprise when manual operation or the restriction push unit rises when resetting.
22, wafer aligning method according to claim 20 is characterized in that the step that limits described push unit action comprises the step that the restriction push unit rotates when assigning rotate instruction.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050100087A KR20070044126A (en) | 2005-10-24 | 2005-10-24 | Wafer array apparatus and method for arraying wafer |
| KR1020050100087 | 2005-10-24 | ||
| KR1020050133802 | 2005-12-29 | ||
| KR1020050133801 | 2005-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1956161A CN1956161A (en) | 2007-05-02 |
| CN100449725C true CN100449725C (en) | 2009-01-07 |
Family
ID=38063393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101402341A Active CN100449725C (en) | 2005-10-24 | 2006-10-20 | Wafer array apparatus and method for arraying wafer |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20070044126A (en) |
| CN (1) | CN100449725C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507798A (en) * | 2017-08-15 | 2017-12-22 | 无锡先导智能装备股份有限公司 | For forming the handler and handling method of silicon chip batch |
| TWI723577B (en) * | 2019-10-14 | 2021-04-01 | 環球晶圓股份有限公司 | A method for arranging a plurality of wafers, method for performing cleaning steps on a plurality of wafers, and method for manufacturing die |
| CN112736002B (en) * | 2020-12-31 | 2022-06-07 | 至微半导体(上海)有限公司 | Wafer high-speed loading method for wafer cleaning equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4804007A (en) * | 1987-04-29 | 1989-02-14 | Verteq, Inc. | Cleaning apparatus |
| JPH09162156A (en) * | 1995-12-07 | 1997-06-20 | Tokyo Electron Ltd | Treating method and treating system |
| JPH1126420A (en) * | 1997-07-04 | 1999-01-29 | Tokyo Electron Ltd | Method and apparatus of cleaning and drying treatment |
| US5868865A (en) * | 1995-06-27 | 1999-02-09 | Tokyo Electron Limited | Apparatus and method for washing treatment |
| JP2002136935A (en) * | 2001-08-29 | 2002-05-14 | Tokyo Electron Ltd | Device and method for cleaning treatment |
| US20020155709A1 (en) * | 2000-10-20 | 2002-10-24 | Tokyo Electron Limited | Method and apparatus of processing surface of substrate |
| CN1450608A (en) * | 2002-03-01 | 2003-10-22 | 东京毅力科创株式会社 | Liquid processing apparatus and method thereof |
| US20050076531A1 (en) * | 2000-12-22 | 2005-04-14 | Lam Research Corporation | Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same |
-
2005
- 2005-10-24 KR KR1020050100087A patent/KR20070044126A/en not_active Application Discontinuation
-
2006
- 2006-10-20 CN CNB2006101402341A patent/CN100449725C/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4804007A (en) * | 1987-04-29 | 1989-02-14 | Verteq, Inc. | Cleaning apparatus |
| US5868865A (en) * | 1995-06-27 | 1999-02-09 | Tokyo Electron Limited | Apparatus and method for washing treatment |
| JPH09162156A (en) * | 1995-12-07 | 1997-06-20 | Tokyo Electron Ltd | Treating method and treating system |
| JPH1126420A (en) * | 1997-07-04 | 1999-01-29 | Tokyo Electron Ltd | Method and apparatus of cleaning and drying treatment |
| US20020155709A1 (en) * | 2000-10-20 | 2002-10-24 | Tokyo Electron Limited | Method and apparatus of processing surface of substrate |
| US20050076531A1 (en) * | 2000-12-22 | 2005-04-14 | Lam Research Corporation | Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same |
| JP2002136935A (en) * | 2001-08-29 | 2002-05-14 | Tokyo Electron Ltd | Device and method for cleaning treatment |
| CN1450608A (en) * | 2002-03-01 | 2003-10-22 | 东京毅力科创株式会社 | Liquid processing apparatus and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070044126A (en) | 2007-04-27 |
| CN1956161A (en) | 2007-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9624046B2 (en) | Substrate processing apparatus and substrate conveying apparatus for use in the same | |
| US7878213B2 (en) | Substrate processing apparatus | |
| KR100514624B1 (en) | Substrate sorting device and method | |
| US8919358B2 (en) | Substrate processing apparatus | |
| US8308529B2 (en) | High throughput chemical mechanical polishing system | |
| US8757180B2 (en) | Substrate processing apparatus | |
| CN101261935B (en) | Substrate treatment apparatus | |
| US8342761B2 (en) | Coating/developing apparatus and coating/developing method | |
| KR100982366B1 (en) | Substrate processing apparatus | |
| KR20110020272A (en) | Next generation screen printing system | |
| US20120148378A1 (en) | Substrate transfer apparatus, substrate process system, and substrate transfer method | |
| US20080156361A1 (en) | Substrate processing apparatus | |
| CN100449725C (en) | Wafer array apparatus and method for arraying wafer | |
| KR20150047442A (en) | Wafer treatment system and wafer multi-step cleaning apparatus used therein | |
| US8441618B2 (en) | Substrate transfer method and apparatus | |
| US8506186B2 (en) | Coating and developing apparatus, coating and developing method and non-transitory tangible medium | |
| JP5224612B2 (en) | Substrate delivery device and substrate delivery method | |
| US7597109B2 (en) | Spin scrubber apparatus | |
| TWI426044B (en) | Substrate processing apparatus and substrate conveying apparatus for use in the same | |
| KR200163637Y1 (en) | Transfer stage for semiconductor wafer | |
| CN114888983A (en) | Automatic chamfering and cleaning integrated equipment for silicon wafers | |
| JP2598364B2 (en) | Substrate cleaning system | |
| JP2007227823A (en) | Wafer holding and rotating apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do, South Korea Patentee after: KC Limited by Share Ltd. Address before: Gyeonggi Do, South Korea Patentee before: K.C. Tech Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180824 Address after: Gyeonggi Do, South Korea Patentee after: K.C.TECH Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: KC Limited by Share Ltd. |