CN100433304C - Basilar plate strip for transparent package - Google Patents
Basilar plate strip for transparent package Download PDFInfo
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- CN100433304C CN100433304C CNB2004100745773A CN200410074577A CN100433304C CN 100433304 C CN100433304 C CN 100433304C CN B2004100745773 A CNB2004100745773 A CN B2004100745773A CN 200410074577 A CN200410074577 A CN 200410074577A CN 100433304 C CN100433304 C CN 100433304C
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- substrate strip
- injecting glue
- glue opening
- flow path
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Abstract
The present invention discloses a basilar plate strip for transparent package; the basilar plate strip is provided with an upper surface, a lower surface and a glue filling opening which penetrate through the upper and the lower surfaces. The upper surface of the basilar plate strip comprises a plurality of glue sealing regions and a plurality of flow passage regions; the glue filling opening is arranged between the glue sealing regions and is connected with the flow passage regions. The glue filling opening is provided with a side wall forming a glue removing layer which is used for avoiding removing rest glue left in transparent glue in the glue filling opening. The present invention can reduce the phenomenon that the transparent glue overflows near the flow passage regions, is favorable to remove the transparent glue in the glue filling opening, and can not leave rest glue and damaged basilar plate strips after sealing glue.
Description
Technical field
The present invention is particularly to a kind of substrate strip that is applicable to transparent enclosure relevant for a kind of substrate strip.
Background technology
Utilize the photoelectric cell or the sensing element of transparent enclosure to grow with each passing day at present; for example LGA (plain cushion trellis array) encapsulation; its employed substrate strip as shown in Figure 1; one substrate strip 10 comprises a plurality of adhesive areas 11 and a plurality of flow path areas 12; each flow path area 12 and corresponding adhesive area 11 connect and extend to the side of this substrate strip 10; please consult Fig. 2 again; 3; when with a plurality of chip 30 of this substrate strip 10 and a transparent adhesive tape material 20 encapsulation; be that two substrate strip 10 that are installed with those chips 30 are positioned in the mould 40; this mould 40 includes a cope match-plate pattern 41; one lower bolster 42 and a plurality of piston 43 (plunger); this lower bolster 42 has a plurality of piston mouths 44; those piston mouths 44 are in order to ccontaining those pistons 43; please consult Fig. 3 again; behind this cope match-plate pattern 41 and these lower bolster 42 matched moulds; be formed with a plurality of runners 45 that are connected with those flow path areas 12 of those substrate strip 10; when those pistons 43 upwards squeeze when pushing away this transparent adhesive tape material 20; make this transparent adhesive tape material 20 be formed at those adhesive areas 11 of those substrate strip 10 via those flow path areas 12 of those runners 45 and this substrate strip 10; lower than the denseness of general known packing colloid to seal those chips 30. owing to this transparent adhesive tape material 20; and in above-mentioned encapsulation process is easily to leave the gap in many substrate strip 10 involutory modes in mould 40; therefore; in the injecting glue process; these transparent adhesive tape material 20 regular meetings produce the serious glue that overflows near those flow path areas 12 of equivalent length; cause after the demoulding; this transparent adhesive tape material 20 will firmly be attached to those flow path areas 12 of those substrate strip 10 and be the extension of equivalent length; when removing at those piston mouths 44; during the transparent adhesive tape material 20 of those runners 45 and those flow path areas 12; then must impose big strength and could remove cull; especially when peeling off this transparent adhesive tape material 20 of removing those flow path areas 12; near the transparent adhesive tape material 20 of glue those flow path areas 12 that overflow will be pullled those substrate strip 10; make and the welding resisting layer and the line layer structural damage of those substrate strip 10 cause the difficulty of coming unstuck.
Summary of the invention
Technical problem solved by the invention provides a kind of substrate strip that is applicable to transparent enclosure, can reduce near the excessive glue phenomenon of transparent adhesive tape material flow path area, helps removing the transparent adhesive tape material in the injecting glue opening, can not stay cull and wounded substrate bar after sealing.
Another technical problem solved by the invention provides a kind of substrate strip that is applicable to transparent enclosure, it can reduce the contact area and the scrap rubber amount of transparent adhesive tape material and flow path area, make this transparent adhesive tape material can near flow path area, not produce to overflow glue, also can make the transparent adhesive tape material scrap rubber easily and substrate strip peel off.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of substrate strip that is applicable to transparent enclosure, it has a upper surface, a lower surface and one runs through the injecting glue opening of this upper surface and this lower surface, the upper surface of this substrate strip includes a plurality of adhesive areas and a plurality of flow path area, those flow path areas are located between corresponding adhesive area and this injecting glue opening, this injecting glue opening is located between those adhesive areas, this injecting glue opening has a sidewall, on this sidewall, be formed with the layer that comes unstuck, assist in removing the transparent adhesive tape material that residues in this injecting glue opening, and avoid when the transparent adhesive tape material of removing in this injecting glue opening, staying cull.
Further, the injecting glue opening of this substrate strip has a plurality of gap slots towards those flow path areas.
According to such scheme, the present invention is provided with an injecting glue opening between a plurality of adhesive areas of a substrate strip, and the sidewall of this injecting glue opening is formed with the layer that comes unstuck, to reduce near the excessive glue phenomenon of transparent adhesive tape material flow path area, help removing the transparent adhesive tape material in this injecting glue opening, after sealing, can not stay cull and wounded substrate bar.
Further, the present invention forms a plurality of gap slots at the injecting glue opening sidewalls of a substrate strip, those gap slots are recessed to form in the flow path area of correspondence, to shorten the length of flow path area, reduce the contact area and the scrap rubber amount of a transparent adhesive tape material and this flow path area, make this transparent adhesive tape material can near those flow path areas, not produce to overflow glue, also can make this transparent adhesive tape material scrap rubber easily and this substrate strip peel off.
Description of drawings
Fig. 1 is the front schematic view of known substrate strip.
Fig. 2 places the front schematic view of a lower bolster for known substrate strip.
Fig. 3 places the schematic cross-section of a mould for known substrate strip.
Fig. 4 is according to the present invention, a kind of front schematic view that is applicable to the substrate strip of transparent enclosure.
Fig. 5 is according to the present invention, and this substrate strip is along the schematic cross-section of 5-5 line among Fig. 4.
Fig. 6 is according to the present invention, and this substrate strip places the schematic cross-section of a mould.
The component symbol explanation:
10 substrate strip, 11 adhesive areas
12 flow path areas, 20 transparent adhesive tape materials
30 chips, 40 moulds
41 cope match-plate patterns, 42 lower bolsters
43 pistons, 44 piston mouths
45 runners, 100 substrate strip
110 upper surfaces, 111 first adhesive areas
112 second adhesive areas, 113 first flow districts
114 second flow path areas, 115 encapsulation units
120 lower surfaces, 130 injecting glue openings
131 sidewalls, 132 gap slots
133 sidewalls 140 layer that comes unstuck
150 come unstuck the layer 200 a transparent adhesive tape material
300 chips, 400 moulds
410 cope match-plate patterns, 420 lower bolsters
421 piston mouths, 430 pistons
Embodiment
Consult appended graphicly, the present invention will enumerate following embodiment explanation.
According to a specific embodiment of the present invention, see also Fig. 4,5, a kind of substrate strip 100 that is applicable to transparent enclosure, these substrate strip 100 materials can be glass epoxide base resin (flame-retardantepoxy-glass fabric composite resin, FR-4, FR-5) or two maleic acid vinegar imines (Bismaleimide Triazine, BT), it has a upper surface 110, a lower surface 120 and one runs through the injecting glue opening 130 of this upper surface 110 and this lower surface 120, this upper surface 110 includes at least one first adhesive area 111, at least one second adhesive area 112 and at least one first flow district 113, at least one second flow path area 114, this injecting glue opening 130 is located between those first adhesive areas 111 and second adhesive area 112, promptly this first adhesive area 111 and this second adhesive area 112 balanced configuration in pairs are in the two opposite sides of this injecting glue opening 130, those first adhesive areas 111 and second adhesive area 112 all comprise a plurality of encapsulation units 115, wherein this first flow district 113 is located between corresponding first adhesive area 111 and this injecting glue opening 130, and be connected with this injecting glue opening 130 with corresponding first adhesive area 111, this second flow path area 114 is located between corresponding second adhesive area 112 and this injecting glue opening 130, and be connected with this injecting glue opening 130 with corresponding second adhesive area 112, this first flow district 113 can be toward the fan-shaped flow path area of this injecting glue opening 130 convergences with this second flow path area 114, in the present embodiment, the size of this injecting glue opening 130 is to be good between 8 to 20mm, preferably, this injecting glue opening 130 is located at the middle position of this substrate strip 100, this injecting glue opening 130 has a sidewall 131, and this sidewall 131 be formed with one come unstuck the layer 140, this layer 140 that comes unstuck can be metal levels such as gold or nickel billon, this layer 140 that comes unstuck extends to this upper surface 110, and these layer 140 width that extends to this upper surface 110 by this sidewall 131 of this injecting glue opening 130 that come unstuck are at least more than 100 μ m, preferably, this layer 140 that comes unstuck at this upper surface 110 centers on these injecting glue opening 130 peripheries, in the present embodiment, this injecting glue opening 130 has a plurality of gap slots 132, those gap slots 132 are towards this first flow district 113 of correspondence and this second flow path area 114 and being recessed to form in this first flow district 113 and this second flow path area 114, to shorten the injecting glue flow-path-length of this first flow district 113 and this second flow path area 114, each gap slot 132 has a sidewall 133, this layer 140 that comes unstuck also is formed at the sidewall 133 of those gap slots 132 for good, and at those flow path areas 113,114 be formed with one come unstuck the layer 150, preferably, this come unstuck the layer 150 can with this come unstuck the layer 140 a same metal material that is formed as one.
Please consult Fig. 6 again, in the time will utilizing a plurality of chip 300 of above-mentioned substrate strip 100 and a transparent adhesive tape material 200 encapsulation, the substrate strip 100 that is installed with those chips 300 is positioned in the mould 400, this mould 400 includes a cope match-plate pattern 410, one lower bolster 420 and at least one piston 430 (plunger), this lower bolster 420 has at least one piston mouth 421, with ccontaining this piston 430, the injecting glue opening 130 of this substrate strip 100 is corresponding to the piston mouth 421 of this lower bolster 420, after this cope match-plate pattern 410 and these lower bolster 420 matched moulds, this piston 430 is upwards pushed, this transparent adhesive tape material 200 is filled in after this injecting glue opening 130 of this substrate strip 100, extruding immediately flows into those first flow districts 113, second flow path area 114, and via those first flow districts 113, second flow path area 114 is filled to those first adhesive areas 111 and second adhesive area 112, to coat those chips 300, therefore between this cope match-plate pattern 410 and this lower bolster 420, not needing as is well known, mould forms the injecting glue runner, make this transparent adhesive tape material 200 significantly shorten by the distance of this piston mouth 421 to the more known piston mouth of the distance of those first adhesive areas 111 and second adhesive area 112 to adhesive area, this transparent adhesive tape material 200 will be difficult for having the situation of excessive glue to take place on this short first flow district 113 and this second flow path area 114, after the demoulding, then remove in those first flow districts 113, the transparent adhesive tape material 200 of second flow path area 114 and this injecting glue opening 130, promptly remove the residual scrap rubber part outside those first adhesive areas 111 and second adhesive area 112, because the sidewall 131 of this injecting glue opening 130 is formed with this layer 140 that comes unstuck, and this layer 140 that comes unstuck extends to this upper surface 110, except can making that residuing in transparent adhesive tape material 200 in this injecting glue opening 130 is easy to be removed, also can make and when the transparent adhesive tape material of removing in this injecting glue opening 130 200, can not stay cull, in addition, because in the present embodiment, the sidewall 131 of this injecting glue opening 130 has this gap slot 132, those gap slots 132 are recessed to form in this first flow district 113 and this second flow path area 114 of correspondence, to reduce this transparent adhesive tape material 200 and contact area and the scrap rubber amount of this first flow district 113, also can make the scrap rubber of this transparent adhesive tape material 200 peel off easily with this second flow path area 114.
Protection scope of the present invention is as the criterion when looking the content that claims define, and anyly knows this skill person, and any variation and the modification done without departing from the spirit and scope of the present invention all belong to protection scope of the present invention.
Claims (20)
1, a kind of substrate strip that is applicable to transparent enclosure, it is characterized in that: this substrate strip has a upper surface, a lower surface and an injecting glue opening, the upper surface of this substrate strip comprises a plurality of adhesive areas and a plurality of flow path area, each flow path area connects corresponding adhesive area and this injecting glue opening, this injecting glue opening runs through this upper surface and this lower surface and is located between those adhesive areas, this injecting glue opening has a sidewall, and is formed with the layer that comes unstuck on this sidewall of this injecting glue opening.
2, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: the injecting glue opening of this substrate strip has a plurality of gap slots towards those flow path areas.
3, the substrate strip that is applicable to transparent enclosure as claimed in claim 2, it is characterized in that: those gap slots have a plurality of sidewalls, and this layer that comes unstuck is formed at those sidewalls of those gap slots.
4, the substrate strip that is applicable to transparent enclosure as claimed in claim 2 is characterized in that: those gap slots are formed in the corresponding flow path area.
5, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: the diameter dimension of this injecting glue opening between 8 to 20mm.
6, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: this layer sidewall by this injecting glue opening that come unstuck extends to this upper surface.
7, the substrate strip that is applicable to transparent enclosure as claimed in claim 6 is characterized in that: this layer that comes unstuck is at least 100 μ m by the sidewall of this injecting glue opening to the width of this upper surface.
8, the substrate strip that is applicable to transparent enclosure as claimed in claim 6 is characterized in that: this layer periphery around this injecting glue opening that come unstuck.
9, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: this injecting glue opening is located at the middle position between those adhesive areas.
10, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: the balanced configuration in pairs of those adhesive areas is in two offsides of this injecting glue opening.
11, the substrate strip that is applicable to transparent enclosure as claimed in claim 1, it is characterized in that: each adhesive area comprises a plurality of encapsulation units.
12, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: this layer that comes unstuck is selected from wherein a kind of material of gold and nickel billon.
13, the substrate strip that is applicable to transparent enclosure as claimed in claim 1 is characterized in that: other includes another layer that comes unstuck, and it is formed at those flow path areas.
14, the substrate strip that is applicable to transparent enclosure as claimed in claim 13 is characterized in that: the layer that comes unstuck of those flow path areas layer is formed as one with coming unstuck of this injecting glue opening.
15, the substrate strip that is applicable to transparent enclosure as claimed in claim 13 is characterized in that: the layer that comes unstuck of those flow path areas is connected with the layer that comes unstuck of this injecting glue opening.
16, a kind of substrate strip, the lower surface that it has a upper surface and a correspondence is characterized in that, this substrate strip comprises in addition:
One first adhesive area, it is positioned at a side of this upper surface;
One second adhesive area, it is positioned at this upper surface at the opposite side corresponding to this first adhesive area;
One injecting glue opening, it is located between this first adhesive area and this second adhesive area and runs through this upper surface and this lower surface, and this injecting glue opening has a sidewall;
One layer that comes unstuck, it is formed at the sidewall of this injecting glue opening.
17, substrate strip as claimed in claim 16 is characterized in that, other comprises a first flow district and one second flow path area, and wherein this first flow district is formed at this upper surface of this substrate strip, and connects this first adhesive area and this injecting glue opening; This second flow path area is formed at this upper surface of this substrate strip, and connects this second adhesive area and this injecting glue opening.
18, substrate strip as claimed in claim 17 is characterized in that, this first flow district and this one second flow path area are fan-shaped, and towards this injecting glue opening convergence.
19, substrate strip as claimed in claim 17, it is characterized in that, this injecting glue opening has a plurality of gap slots towards this first flow district and this second flow path area, with connect respectively this first flow district to this injecting glue opening be connected this second flow path area to this injecting glue opening.
20, substrate strip as claimed in claim 16 is characterized in that, this first adhesive area and this second adhesive area balanced configuration in pairs are in two offsides of this injecting glue opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100745773A CN100433304C (en) | 2004-09-07 | 2004-09-07 | Basilar plate strip for transparent package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100745773A CN100433304C (en) | 2004-09-07 | 2004-09-07 | Basilar plate strip for transparent package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1747143A CN1747143A (en) | 2006-03-15 |
| CN100433304C true CN100433304C (en) | 2008-11-12 |
Family
ID=36166583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100745773A Active CN100433304C (en) | 2004-09-07 | 2004-09-07 | Basilar plate strip for transparent package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100433304C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103021902A (en) * | 2011-09-21 | 2013-04-03 | 国碁电子(中山)有限公司 | Mould casting device and method for semiconductor package |
| TWI617057B (en) * | 2016-12-30 | 2018-03-01 | 隆達電子股份有限公司 | Package board |
| TWI671921B (en) * | 2018-09-14 | 2019-09-11 | 頎邦科技股份有限公司 | Chip package and chip |
| CN113276359B (en) * | 2020-02-19 | 2022-11-08 | 长鑫存储技术有限公司 | Injection mold and injection molding method |
| CN112382618B (en) * | 2020-11-09 | 2023-10-27 | 成都海光集成电路设计有限公司 | Packaging structure and packaging method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886398A (en) * | 1997-09-26 | 1999-03-23 | Lsi Logic Corporation | Molded laminate package with integral mold gate |
| US6224360B1 (en) * | 1996-07-23 | 2001-05-01 | Apic Yamada Corporation | Resin sealing device for chip-size packages |
| US6338813B1 (en) * | 1999-10-15 | 2002-01-15 | Advanced Semiconductor Engineering, Inc. | Molding method for BGA semiconductor chip package |
| CN1357910A (en) * | 2000-12-11 | 2002-07-10 | 矽品精密工业股份有限公司 | Substrate-type semiconductor device packing method without glue overflow |
| CN2566454Y (en) * | 2002-08-21 | 2003-08-13 | 南茂科技股份有限公司 | Circuit board preventing moulding-die glue-overflow |
| US6652799B2 (en) * | 2000-08-16 | 2003-11-25 | Micron Technology, Inc. | Method for molding semiconductor components |
-
2004
- 2004-09-07 CN CNB2004100745773A patent/CN100433304C/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6224360B1 (en) * | 1996-07-23 | 2001-05-01 | Apic Yamada Corporation | Resin sealing device for chip-size packages |
| US5886398A (en) * | 1997-09-26 | 1999-03-23 | Lsi Logic Corporation | Molded laminate package with integral mold gate |
| US6338813B1 (en) * | 1999-10-15 | 2002-01-15 | Advanced Semiconductor Engineering, Inc. | Molding method for BGA semiconductor chip package |
| US6652799B2 (en) * | 2000-08-16 | 2003-11-25 | Micron Technology, Inc. | Method for molding semiconductor components |
| CN1357910A (en) * | 2000-12-11 | 2002-07-10 | 矽品精密工业股份有限公司 | Substrate-type semiconductor device packing method without glue overflow |
| CN2566454Y (en) * | 2002-08-21 | 2003-08-13 | 南茂科技股份有限公司 | Circuit board preventing moulding-die glue-overflow |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1747143A (en) | 2006-03-15 |
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