CN100411130C - Substrate processing apparatus and substrate transfer method therefor - Google Patents

Abstract

The present invention relates to enhance working ratio in each processing chamber and thereby enhance throughput of an entire processing apparatus by matching the timing of transferring wafers from cassette containers with the processing time at each processing chamber. The substrate processing apparatus 100 comprises a processing unit 110 having a plurality of processing chambers 140A, 140B (P1, P2) for applying given processing to wafers, a transfer unit 120 connected to the processing unit 110, a transfer unit side transfer mechanism 170 for transferring the wafers contained in cassette containers 134A, 134B to the processing unit, and a processing unit side transfer mechanism 180 for transferring the wafers transferred from the transfer unit to the processing chambers. A control unit 190 is provided that obtains wafer transferring timing for each processing chamber for transferring the wafers from the cassette containers to each processing chamber, based on processing times T(P1), T(P2)of the wafers W(P1), W(P2)in each processing chamber P1, P2, and transfers the wafers from the cassette containers according to the transfer timing.

Description

The substrate carrying method of substrate board treatment and substrate board treatment

Technical field

The processed substrate that the present invention relates to for example be used for semiconductor wafer, glass substrate (for example crystal liquid substrate) etc. is implemented the substrate board treatment of predetermined process and the substrate carrying method of substrate board treatment.

Background technology

This kind substrate board treatment generally has: processing unit, and it has a plurality of process chambers that to processed substrate, for example semiconductor wafer (following also simply be called sometimes " wafer ") carried out predetermined processing; Supply unit, it is by load locking room processing unit connection (for example with reference to patent documentation 1) therewith.

The substrate board treatment of integrated equipment type in this way for example, for example Fig. 6 of patent documentation 1 is described, form polygonal common transfer chamber around above-mentioned a plurality of process chambers and load locking room are connected into airtight conditions, constitute above-mentioned processing unit.It is indoor to be arranged on common transfer with the conveying mechanism of the processing unit side of formations such as conveying arm, with this conveying mechanism of handling cell side, carries out sending into and taking out of wafer between a plurality of process chambers and load locking room.On supply unit, also be provided with conveying mechanism,, between the box container (substrate accepting container) of placing wafer and above-mentioned load locking room, carry out sending into and taking out of wafer with the conveying mechanism of this supply unit side with the supply unit side of formations such as conveying arm.

In such substrate board treatment, to carry out under the situation of predetermined processing the wafer that is placed in the box container, at first in supply unit, there is not the wafer of processing from the box container taking-up with the conveying mechanism of supply unit side.The wafer that not have to handle that takes out from box container by to positioner (for example locator, the predetermined alignment platform) conveying that is arranged on the supply unit, positioned before sending into to load locking room.The wafer that does not have to handle that is positioned is carried to load locking room after the positioner taking-up.

The wafer of carrying to load locking room that does not have to handle takes out from load locking room with the conveying mechanism of handling cell side, carries to process chamber, carries out predetermined process.The wafer of the processing after the finishing dealing with of process chamber takes out from process chamber with the conveying mechanism of handling cell side, turns back to load locking room.The wafer of the processing of returning to load locking room turns back to box container with the conveying mechanism of supply unit side.

In order to improve the treatment effeciency of in such substrate board treatment, managing the processing of chamber throughout, wish to make the as close as possible process chamber standby of wafer that does not have processing, even so carrying out during the processing of process chamber, to from box container, take out the wafer that does not have to handle successively, make these wafers in standbies such as common transfer chamber, load locking room, positioners.After process chamber is finished the processing of a wafer, the wafer of handling directly is placed on box container then,, the wafer that the next one does not have to handle is directly carried to process chamber the wafer batch transportation that not having in above-mentioned each standby handled.

The chamber of managing in order to improve the running rate of chambers, determines that what wafer that the chamber of managing is throughout handled carry that to take out from box container constantly also be important at all under the situation of carrying out processing of wafers throughout in addition.This point is now when the wafer that does not have from the box container taking-up next one to handle, remaining time of the processing carried out of the chamber of managing more throughout is detecting the back taking-up from box container at the wafer that does not have to handle that handle in the shortest process chamber its remaining time.So for example the remaining time of Chu Liing short more process chamber, can more early carry out processing of wafers next time, thus by by its remaining time short order from box container, take out wafer, can improve the running rate of chambers.

Patent documentation 1 spy opens the 2002-237507 communique

Owing to be that different processing is carried out in the chamber of managing throughout mostly, for example carry out the different disposal of etch processes and film forming processing etc., even or identical processing, carry out the different processing of its treatment conditions, so managing the processing time (for example take out after finish to its processing of wafers the back from wafer is sent into, can send into the time of next wafer) of the wafer in the chamber throughout is different mutually mostly.

In above-mentioned existing technology, at the wafer that the next one is not had handle when box container takes out, only specially keep a close watch on the processing remaining time of chambers, from box container take out the time of delivery of the next mode of not handling wafer in the order short remaining time, do not consider the difference in above-mentioned chambers processing time with its.

Therefore for example long process chamber of processing time is compared with the process chamber of processing time weak point, the remaining time of processing of wafers is also short, the wafer of the process chamber that the processing time is long takes out from box container earlier, such wafer will be in long-time standby such as shared process chamber, load locking room, positioner, appearance can not be the situation of the wafer of short process chamber of processing time from the box container taking-up, the running rate of process chamber is reduced, have the problem of the treatment effeciency reduction of substrate board treatment integral body.

Be described more specifically, for example the processing of the process chamber P2 of the processing of the process chamber P1 of processing time length and processing time weak point is all under the parallel situation of implementing to handle, short as the remaining time that long process chamber P1 of processing time handles, manage the wafer W of handling among the P1 of chamber herein _P1Become the object that takes out from box container next time.

In this case, for example since the wafer of other that will next time handle at process chamber P1 in the standby of common transfer chamber, so after the finishing dealing with of process chamber P1, even take out wafer W from box container _P1, this wafer W _P1Can not directly handle.Even this is because want batch transportation at the wafer of standbies such as common transfer chamber, load locking room, positioner, formerly send into before other the finishing dealing with of wafer of process chamber P1, from the wafer W of box container taking-up _P1Become state in standbies such as common transfer chamber, load locking room, positioners.

After the processing of short process chamber P2 of processing time was finished at once, even become not operating condition, can not take out from box container will be in the wafer W of short process chamber P2 processing of processing time like this _P2Therefore produced the unnecessary stand-by period among the process chamber P2 of processing time weak point, so the running rate of process chamber P2 reduces, the treatment effeciency of substrate board treatment integral body reduces.

Summary of the invention

So the present invention is the invention of carrying out in view of such problem, its objective is the substrate carrying method that a kind of substrate board treatment and substrate board treatment are provided, the chamber of managing walks abreast when processed substrate is handled throughout, make from the substrate accepting container and carry the time of processed substrate and the processing time matching coordinative of chambers, the running rate of chambers is improved, the treatment effeciency of substrate board treatment integral body is improved.

In order to solve above-mentioned problem, as adopt certain viewpoint of the present invention, a kind of substrate board treatment can be provided, have: processing unit, it is useful on a plurality of process chambers of implementing predetermined processing on processed substrate; Supply unit, it is connected this and handles on the unit; The conveying mechanism of supply unit side, it is arranged on the above-mentioned supply unit, and the above-mentioned processed substrate that is housed in the substrate accepting container is carried to above-mentioned processing unit; The conveying mechanism of processing unit side, it is arranged on the above-mentioned processing unit, the above-mentioned processed substrate of carrying from above-mentioned supply unit is carried to above-mentioned process chamber, at such substrate board treatment, it is characterized in that, has control device, it is according to the processing time of the above-mentioned processed substrate in the above-mentioned chambers, according to each above-mentioned chambers being obtained, take out above-mentioned processed substrate from the aforesaid substrate accepting container according to this time of delivery from the time of delivery of aforesaid substrate accepting container to the above-mentioned processed substrate of above-mentioned chambers conveying.

In order to solve above-mentioned problem, as adopt other viewpoint of the present invention, a kind of substrate carrying method of substrate board treatment can be provided, this substrate board treatment has: processing unit, and it is useful on a plurality of process chambers of implementing predetermined processing on processed substrate; Supply unit, it is connected this and handles on the unit; The conveying mechanism of supply unit side, it is arranged on the above-mentioned supply unit, and the above-mentioned processed substrate that is housed in the substrate accepting container is carried to above-mentioned processing unit; The conveying mechanism of processing unit side, it is arranged on the above-mentioned processing unit, the above-mentioned processed substrate of carrying from above-mentioned supply unit is carried to above-mentioned process chamber, the substrate carrying method of such substrate board treatment, it is characterized in that, according to the processing time of the above-mentioned processed substrate in the above-mentioned chambers, according to each above-mentioned chambers being obtained from the time of delivery of aforesaid substrate accepting container to the above-mentioned processed substrate of above-mentioned chambers conveying, when above-mentioned processed substrate is handled, according to above-mentioned time of delivery, take out above-mentioned processed substrate from the aforesaid substrate accepting container.

As adopt said apparatus or method, according to the processing time of processed substrate in the chambers, according to the time of delivery of obtaining in advance in each above-mentioned chambers, take out processed substrate from the substrate accepting container, so the chamber of managing walks abreast when processed substrate is handled throughout, can make from the substrate accepting container and carry the time of processed substrate to cooperate, can improve the running rate of chambers like this, can improve the treatment effeciency of substrate board treatment integral body with the processing time of chambers.For example in the process chamber of processing time length, the processed substrate of processing can take out from the substrate accepting container with long interval, and in the process chamber of processing time weak point, the processed substrate of processing can take out from the substrate accepting container with short interval.Can eliminate like this resemble existing the processed substrate of long process chamber of processing time in long-time standby such as common transfer chamber, load locking room, positioner, the situation that the processed substrate of the process chamber that the processing time is short can not take out from the substrate accepting container, so can improve the running rate of chambers, can improve the treatment effeciency of substrate board treatment integral body.

In addition in said apparatus or ten thousand methods, during the conveying of above-mentioned processed substrate with for example being when the aforesaid substrate accepting container takes out above-mentioned processed substrate, the ratio of the taking-up number of the above-mentioned processed substrate of each chambers and take out the interval.Wherein the taking-up number of so-called processed substrate is than the ratio of taking-up number that is the processed substrate of each chambers of taking out from the substrate accepting container, and the taking-up of so-called processed substrate is that the processed substrate of the chambers of taking out from the substrate accepting container takes out at interval at interval in addition.

In this case, hope be according to based on processing time of the above-mentioned processed substrate of above-mentioned chambers and definite benchmark take out at interval each interval in throughout the polylith number of the above-mentioned processed substrate of the chamber of managing processing obtain the ratio of the taking-up number of above-mentioned processed substrate, the taking-up of above-mentioned processed substrate wishes that at interval handle is in above-mentioned chambers, take out the ratio of the taking-up number of above-mentioned processed substrate at interval with said reference, take out one interval as each processing time of the above-mentioned processed substrate of above-mentioned chambers.

By obtain the time of carrying processed substrate from the substrate accepting container with such method, for example in certain process chamber is carrying out time of processing of processed substrate, the processing of the processed substrate of the polylith number that can handle at other process chamber, so that the processing latency of chambers reduces, the running rate of chambers is improved.In addition by taking out at interval with identical benchmark at each process chamber, from one or more processed substrate of the every taking-up of substrate accepting container, from time that the substrate accepting container takes out since each processed substrate of chambers always stagger, for example the processed substrate of each chambers always staggers the time of staggering of time started of producing when carrying junior one piece, and can not be simultaneously so take out the time of processed substrate.Manage the stand-by period that the chamber can not produce wafers to be removed such as being used for so throughout.

In this external said apparatus or the method, for example according to processing time of the above-mentioned processed substrate of above-mentioned chambers, the processing time of supposing the process chamber that processing time in the above-mentioned chambers is the longest is that said reference is taken out under the situation at interval, with in this benchmark takes out interval at interval, the polylith number of manageable above-mentioned processed substrate is obtained the ratio of the taking-up number of above-mentioned processed substrate for the basis in other process chambers.By determining that according to the processing time of the longest process chamber of processing time benchmark takes out method at interval, determine that benchmark takes out the interval and becomes easily, like this so can easily calculate the ratio of the taking-up number of processed substrate.

In this external said apparatus or the method, wish to take out each interval stand-by period at interval, determine the said reference taking-up at interval, these times for the treatment of are shortened according to the benchmark in the above-mentioned chambers.Owing to can make the stand-by period optimization of chambers, can further improve the treatment effeciency of base board delivery device integral body like this.

In order to solve above-mentioned problem, as adopt other viewpoint of the present invention, a kind of substrate carrying method of substrate board treatment can be provided, be by respectively a plurality of above-mentioned processed substrate that is housed in the substrate accepting container, carry to the process chamber that will handle in the time of delivery order of obtaining in advance, at the parallel substrate carrying method of implementing the substrate board treatment of above-mentioned processed processing substrate of a plurality of process chambers, it is characterized in that above-mentioned time of delivery has: obtain according to processing time of the above-mentioned processed substrate in the above-mentioned chambers and definite benchmark takes out the operation of ratio of taking-up number of the above-mentioned processed substrate of each the above-mentioned chambers at interval interval; According to the ratio of the taking-up number of above-mentioned processed substrate, obtain the taking-up operation at interval of the above-mentioned processed substrate of each above-mentioned chambers.

In above-mentioned method, obtaining the operation that above-mentioned processed substrate takes out the ratio of number also can have: the processing time of handling an above-mentioned processed substrate in the hypothesis process chamber the longest with the processing time in above-mentioned chambers takes out under the situation at interval as said reference, obtains in this benchmark takes out at interval interval the operation that the polylith of in other process chambers manageable above-mentioned processed substrate is counted n; Is that benchmark takes out under the situation at interval in hypothesis with the processing time of handling a processed substrate in the longest process chamber of above-mentioned processing time, obtains the operation of the stand-by period of above-mentioned other process chambers in said reference is taken out at interval interval; Is that benchmark takes out under the situation at interval in hypothesis with the processing time of handling the above-mentioned processed substrate of n+1 piece in above-mentioned other process chambers, obtains the operation of the stand-by period of the longest process chamber of in said reference is taken out at interval interval above-mentioned processing time; Determine the operation of ratio of the taking-up number of above-mentioned processed substrate, it compares these stand-by period, be less than in the stand-by period of the longest process chamber of above-mentioned processing time under the situation of stand-by period of above-mentioned other process chambers, said reference taken out be specified to the processing time of handling a processed substrate in the longest process chamber of above-mentioned processing time at interval, simultaneously above-mentioned processed substrate being taken out likening to of number is 1: n, under the situation of stand-by period more than the stand-by period of above-mentioned other process chambers of the longest process chamber of above-mentioned processing time, said reference is taken out the processing time that is specified to the above-mentioned processed substrate of processing n+1 piece in above-mentioned other process chambers at interval, and simultaneously above-mentioned processed substrate being taken out likening to of number is 1: n+1.

In this case, the taking-up operation at interval of obtaining above-mentioned processed substrate also can have the operation of assert the interval of taking out, ratio at the taking-up number of above-mentioned processed substrate is 1: under the situation of n, the taking-up number of the above-mentioned processed substrate in the longest process chamber of above-mentioned processing time is regarded as the interval of taking out one of every taking-up at interval with said reference at interval, and the taking-up number of the above-mentioned processed substrate in above-mentioned other process chambers is regarded as at interval with said reference and taken out every at interval taking-up n piece, takes out one interval in its each processing time; Ratio at the taking-up number of above-mentioned processed substrate is 1: under the situation of n+1, the taking-up number of the above-mentioned processed substrate in the longest process chamber of above-mentioned processing time regard as at interval said reference take out at interval in the interval of one of every taking-up, the taking-up number of the above-mentioned processed substrate in above-mentioned other process chambers is regarded as at interval with said reference and is taken out every at interval taking-up n+1 piece, takes out one interval in its each processing time.

By processing time, determine that benchmark takes out at interval like this, determine that benchmark takes out the interval and becomes easily, so can easily calculate the ratio of the taking-up number of processed substrate according to the longest process chamber of processing time.Any the shortest mode of stand-by period with the longest process chamber of processing time and other process chambers determines benchmark to take out at interval in addition, take out at interval according to benchmark, obtain the time (for example the taking-up of the ratio of the taking-up number of processed substrate and processed substrate at interval) of taking out processed substrate from the substrate accepting container, so, can further improve the treatment effeciency of base board delivery device integral body owing to can make the stand-by period optimization of chambers.

In this external said method, the operation of ratio of obtaining the taking-up number of above-mentioned processed substrate also can have: the processing time of handling the above-mentioned processed substrate of m piece in the hypothesis process chamber the longest with the processing time in above-mentioned chambers takes out under the situation at interval as benchmark, obtains in this benchmark takes out at interval interval the operation that the polylith of manageable above-mentioned processed substrate in other process chambers is counted n; Take out under the situation at interval as benchmark with the processing time of the processed substrate of in the longest process chamber of above-mentioned processing time, handling the m piece in hypothesis, obtain the operation of the stand-by period of above-mentioned other process chambers in said reference is taken out at interval interval; Take out under the situation at interval as benchmark with the processing time of the above-mentioned processed substrate of in above-mentioned other process chambers, handling the n+1 piece in hypothesis, obtain the operation of the stand-by period of the longest process chamber of in said reference is taken out at interval interval above-mentioned processing time; Determine the operation of m, n, change above-mentioned m, the polylith of obtaining above-mentioned processed substrate is counted the stand-by period of the longest process chamber of the stand-by period of n, above-mentioned other process chambers, above-mentioned processing time, makes the stand-by period of the longest process chamber of stand-by period of above-mentioned other process chambers and above-mentioned processing time the shortest; Having determined m, the stand-by period of the process chamber that the stand-by period of above-mentioned other process chambers during n and above-mentioned processing time are the longest compares, be shorter than in the stand-by period of the longest process chamber of above-mentioned processing time under the situation of stand-by period of above-mentioned other process chambers, said reference taken out be defined as processing time of in the longest process chamber of above-mentioned processing time, handling the processed substrate of m piece at interval, and the ratio of the taking-up number of above-mentioned processed substrate is decided to be m: n, be longer than in the stand-by period of the longest process chamber of above-mentioned processing time under the situation of stand-by period of above-mentioned other process chambers, said reference is taken out the processing time that is defined as handling the processed substrate of n+1 piece at interval in above-mentioned other process chambers, and the ratio of the taking-up number of above-mentioned processed substrate is decided to be m: n+1.

In this case, the taking-up operation at interval of obtaining above-mentioned processed substrate is, also can have following operation: the ratio at the taking-up number of above-mentioned processed substrate is under the situation of m: n, the taking-up number of the above-mentioned processed substrate in the longest process chamber of above-mentioned processing time is regarded as at interval with said reference and is taken out every taking-up m piece at interval, take out one interval in its each processing time, the taking-up number of the above-mentioned processed substrate in above-mentioned other process chambers is regarded as at interval with said reference and is taken out every taking-up n piece at interval, in its each processing time, take out one interval; Ratio at the taking-up number of above-mentioned processed substrate is under the situation of m: n+1, the taking-up number of the above-mentioned processed substrate in the longest process chamber of above-mentioned processing time is regarded as said reference at interval and is taken out the m piece in taking out at interval, in its each processing time, take out one interval, the taking-up number of the above-mentioned processed substrate in above-mentioned other process chambers is regarded as at interval in said reference is taken out at interval and is taken out the n+1 piece, respectively takes out one interval in its each processing time.

By the m time doubly, determine that benchmark takes out at interval like this according to processing time of the longest process chamber of processing time, benchmark take out at interval determine to become easily, so can easily calculate the ratio of the taking-up number of processed substrate.Determine that in any the mode of stand-by period minimum in the longest process chamber of processing time and other process chambers benchmark takes out at interval in addition, take out at interval according to benchmark, obtain the time (for example the taking-up of the ratio of the taking-up number of processed substrate and processed substrate at interval) of carrying processed substrate from the substrate accepting container, so, can further improve the treatment effeciency of base board delivery device integral body owing to can make the stand-by period optimization of chambers.

As described above, as adopt the present invention that the substrate carrying method of a kind of substrate board treatment and substrate board treatment can be provided, manage the chamber throughout when parallel the processing, can make from the substrate accepting container carries the time of processed substrate and the processing time of chambers to coincide, the running rate of chambers can be improved like this, the treatment effeciency of substrate board treatment integral body can be improved.

Description of drawings

Fig. 1 is the example of structure of the substrate board treatment of expression embodiment of the present invention.

Fig. 2 is illustrated in the flow chart of asking the processing of wafer transport time in the identical execution mode.

Fig. 3 is the flow chart of the object lesson of the processing of the ratio of obtaining wafer taking-up number in the presentation graphs 2.

Fig. 4 is the flow chart that wafer takes out the object lesson of processing at interval of obtaining in the presentation graphs 2.

Fig. 5 is the figure of the processing of wafers program in two process chambers of expression.

Fig. 6 is other example of structure of the substrate board treatment of expression embodiment of the present invention.

Fig. 7 is the figure of the processing of wafers program in three process chambers of expression.

Fig. 8 is the figure of the processing of wafers program in four process chambers of expression.

Fig. 9 is the flow chart of other object lessons of the processing of the ratio of obtaining wafer taking-up number in the presentation graphs 2.

Figure 10 is the flow chart that wafer takes out other object lessons of processing at interval of obtaining in the presentation graphs 2.

Figure 11 is the figure of the processing of wafers program in four process chambers of expression.

Label declaration: 100,200 substrate board treatments; 110 processing units; 120 supply units; 130 conveying chambers; 132 (the box platforms of 132A～132C); 134 (the box containers of 134A～134C); 136 (the gate valves of 136A～136C); 137 locators; 138 rotatable stages; 139 optical pickocffs; 140 (the process chambers of 140A～140C); 140D process chamber or inspection chamber; 142 (the objective tables of 142A～142D); 144 (the gate valves of 144A～144D); Common transfer chambers 150; 160 (160M, 160N) load locking room; 170 supply unit side conveying mechanisms; 172 base stations; 174 guide rails; 176 linear motor driven mechanisms; 180 processing unit side conveying mechanisms; 190 control parts.

Embodiment

With reference to the accompanying drawings suitable execution mode of the present invention is elaborated.In this specification and figure, actual inscape with identical function structure adopts identical symbol, has omitted the explanation that repeats.

(the formation example of substrate board treatment)

At first the substrate board treatment of embodiments of the present invention is described with reference to figure.Fig. 1 is the figure of the brief configuration of the substrate board treatment of expression embodiments of the present invention.This substrate board treatment 100 has: a plurality of processing units 110, and it carries out the various processing of film forming processing, etch processes etc. to processed substrate, for example semiconductor wafer (following also simply be called " wafer ") W; Supply unit 120, it is hitherward managed unit 110 to wafer W and sends into and take out.Supply unit 120 has conveying chamber 130 shared when transfer wafers W.

The conveying chamber 130 of supply unit 120 is for example by making N ₂The section of the non-active gas of gas etc. and clean air circulation is roughly polygonal casing and constitutes.Section is roughly on the side on polygonal long limit in constituting conveying chamber 130, is arranged side by side a plurality of box platforms 132 (being 132A and 132B at this).These box platform 132A and 132B constitute box container 134A, the 134B that can place as an example of substrate accepting container respectively.

Each box container 134A, 134B for example can equally spaced be placed on maximum 25 wafer W on the multilayer, become inside N ₂Atmosphere is enclosed the hermetically-sealed construction that is full of.Conveying chamber 130 constitutes in the mode of sending into and taking out wafer W to inside by gate valve 136A, 136B.

Wherein in box container 134A, 134B, be respectively charged into the wafer of handling among process chamber 140A, the 140B of narration in the back.But as know which wafer with which process chamber is handled and to manage wafer that chamber 140A, 140B handle throughout and separately pack into respectively among box container 134A, the 134B.In one or two that for example can be in box container 134A or 134B, the wafer of handling in process chamber 140A, 140B is mixed.For example adducible example is among this external Fig. 1: two box container 134A, 134B are respectively placed one respectively on box platform 132A and 132B, but the quantity of box platform and box container is not limited thereto, and for example can be more than three.

Positioner has revolution objective table 138 and the surrounding edge of wafer W carried out optical check in inside optical pickocff 139, locator (prealignment objective table) 137 as positioner is set at the end of conveying chamber 130, just is set at the formation section and is roughly on the side of polygonal minor face.This locator 137 is the devices that detect back aligned position such as the plane of orientation of wafer W and breach.

Processing unit 110 has and is used for wafer is carried out the process chamber 140 (140A, 140B) that film forming is for example handled the predetermined process of (for example plasma CVD processing) and etch processes (for example plasma etch process) etc.Managing the processing that chamber 140A, 140B carry out throughout can be processing of the same race, also can be different processing.In the information (technological procedure-manufacture method) of the treatment process of the expression etch processes of storages such as the memory of control part etc. etc., each wafer is managed chamber 140A, 140B throughout and is carried out predetermined process according in advance.Handle at which process chamber for each wafer, for example can judge by above-mentioned technological procedure-manufacture method.Processing unit 110 has common transfer chamber 150, sends into or take out wafer at process chamber 140A, 140B.Polygon (for example hexagon) is made in common transfer chamber 150, and above-mentioned chambers 140A, 140B are configured in around it by gate valve 144A, 144B respectively.

Above-mentioned chambers 140A, 140B for example carry out processing of the same race or processing not of the same race mutually to wafer W.Manage the objective table 142A, the 142B that are provided for placing wafer W in chamber 140A, the 140B respectively throughout.Process chamber 140 is not defined as two in addition, can increase number yet.

150 first, second load locking room 160M, the 160N that dispose on every side as an example of the vacuum preparation room that is connected with above-mentioned supply unit 120 in the common transfer chamber.Specifically, the front end of first, second load locking room 160M, 160N is connected around the common transfer chamber 150 by gate valve (gate valve of vacuum one side) 154M, 154N respectively, and the cardinal extremity of first, second load locking room 160M, 160N is connected the section that constitutes on the conveying chamber 130 by gate valve (gate valve of atmosphere one side) 162M, 162N respectively and is roughly on another side on polygonal long limit.

First, second load locking room 160M, its structure of 160N can vacuumize, and have and can preserve wafer W temporarily, lead to the function of next stage after adjusting pressure.Also have cooling body and heating arrangements in addition on load locking room 160M, the 160N structure.

Between common transfer chamber 150 and chambers 140A, the 140B and between common transfer chamber 150 and above-mentioned each load locking room 160M, 160N, constitute in the mode that can under airtight conditions, open and close respectively, be made to integrated equipment, can become as required and shared 150 interior connections of conveying chamber.Between this each load locking room 160M, 160N and above-mentioned conveying chamber 130 of external above-mentioned first and second, also constitute in the mode that can under airtight conditions, open and close respectively.

The processing unit side conveying mechanism 180 that multiarticulate arm that can bending-lifting-rotation on being provided with for example by structure in common transfer chamber 150 constitutes.This handles cell side conveying mechanism 180 can carry out access at each load locking room 160M, 160N and chambers 140A, 140B kind.For example send into wafer to above-mentioned each load locking room 160M, 160N, this wafer is sent into process chamber 140A or the 140B that handles this wafer with handling cell side conveying mechanism 180.

Processing unit side conveying mechanism 180 can once be got two wafers by there being two both arms mechanisms of picking up portion to constitute.So for example, can exchange wafer of handling and the wafer that does not have to handle when chambers 140A, 140B send into or take out wafer.The quantity of the portion of picking up of processing unit side conveying mechanism 180 is not limited to above-mentioned situation in addition, for example also can be to have only a single armed mechanism of picking up portion.

In above-mentioned conveying chamber 130, be provided with along the supply unit side conveying mechanism 170 of its length direction (direction of arrow shown in Figure 1) transfer wafers W.Guide rail 174 is arranged on the centre in the conveying chamber 130 along its length, and fixedly the base station 172 of supply unit side conveying mechanism 170 is supported on the guide rail 174, can slide mobile.On this base station 172 and guide rail 174, be respectively arranged with the rotor and the stator of linear motor.Be provided with the linear motor driven mechanism 176 that is used to drive this linear motor in the end of guide rail 174.Control part 190 is connected in the linear motor driven mechanism 176.According to from the control signal of control part 190, drive linear motor drive mechanism 176 like this, supply unit side conveying mechanism 170 moves to the direction of arrow along guide rail 174 with base station 172.

Also the same about supply unit side conveying mechanism 170 with processing unit side conveying mechanism 180, by there being two both arms mechanisms of picking up portion to constitute, can once get two wafers.So for example, can exchange wafer when box container 134, locator 137, load locking room 160M, 160N etc. send into or take out wafer.The quantity of the portion of picking up of processing unit side conveying mechanism 180 is not limited to above-mentioned situation in addition, for example also can be to have only a single armed mechanism of picking up portion.

In aforesaid substrate processing unit 100, be provided with the control part 190 of this substrate board treatment molar behavior of control, handle following control: except the control of above-mentioned each conveying mechanism 170,180, each gate valve 136,144,154,162, locator 137 etc., also comprise the processing of obtaining from the time of delivery of the wafer of the box container of narrating later 134, and the control etc. of taking out wafers according to the wafer transport time from box container 134.Control part 190 has memory of microcomputer, store various kinds of data of the main body that for example constitutes this control part 190 etc. etc.

(action of substrate board treatment)

Action to the substrate board treatment of said structure describes below.Utilize supply unit side conveying mechanism 170 to be transported to locator 137, move on on the rotatable stage 138 of locator 137, position at this from the wafer W of box container 134A or 134B taking-up.Wafer behind the location takes out from locator 137, delivers to load locking room 160M or 160N.The wafer that handled this moment takes out the wafer of handling and send into the wafer that does not have processing as in load locking room 160M or 160N.

The wafer of delivering among load locking room 160M or the 160N takes out from load locking room 160M or 160N with handling cell side conveying mechanism 180, delivers to the process chamber 140A or the 140B that handle this wafer, carries out predetermined process then.The wafer of finishing the processing of processing at process chamber 140A or 140B takes out from process chamber 140A or 140B with handling cell side conveying mechanism 180, turns back to load locking room 160M or 160N.The wafer that turns back to the processing of load locking room 160M or 160N turns back to box container 134A or 134B with supply unit side conveying mechanism 170.

Yet, wish to make the wafer that not have to handle to try one's best near the process chamber standby for the treatment effeciency of the processing that improves process chamber 140A or 140B.Even during process chamber 140A or 140B handle, order is taken out the wafer that not have processing from box container 134A or 134B, make these wafers in common transfer chamber 150, load locking room 160M or standbies such as 160N, locator 137.As finish the processing of a wafer at process chamber 140A or 140B, the wafer of handling directly turns back to box container 134A or 134B, the wafer batch transportation in above-mentioned each standby, the wafer that the next one in 150 standbies of common transfer chamber does not have to handle is directly delivered to process chamber 140A or 140B.

In such substrate board treatment 100, managing chamber 140A, 140B throughout carries out under the situation of processing of wafer simultaneously, in order to improve the running rate of chambers 140A, 140B, determine that be important at what time of delivery managing throughout that wafer that chamber 140A, 140B handle takes out from box container 134A or 134B.So the substrate carrying method to the present embodiment that comprises the processing of obtaining such time of delivery describes below.

(substrate carrying method of substrate board treatment)

The substrate carrying method of present embodiment in the processing time based on chambers, according to the wafer transport time of obtaining in advance, utilizes the conveying mechanism 170 of supply unit side from each box container 134 taking-up wafer aspect feature to be arranged.Because like this in the wafer transport time corresponding to processing time of chambers, take out wafer from each box container 134, so in mutually different a plurality of process chambers of processing time, even handle continuously at the same time under the situation of wafer, do not produce the unnecessary stand-by period of causing, so can improve the treatment effeciency of substrate board treatment integral body because of chambers processing time difference yet.The processing time of this external this said so-called chambers is meant handles the needed time of wafer (time that for example comprises technical process), for example be meant and manage in the chamber throughout, begin after the processing of finishing this wafer, to take out the time till next piece wafer can be sent into from the moment of sending into a wafer.

The above-mentioned wafer transport time for example takes out next at interval definite by the ratio and the wafer of wafer taking-up number.The ratio that wherein so-called wafer takes out number is the ratio that the wafer of each process chamber that will take out from box container 134 takes out number, and it is that the wafer of each process chamber of taking out from box container 134 takes out at interval at interval that so-called in addition wafer takes out.The longest process chamber of processing time of for example establishing each piece wafer is P1, establish other process chambers simultaneously and be Pk (k=2,3 ...), the processing time that is located at each piece wafer among the process chamber P1 is T _P1, the processing time that is located at each piece wafer in other process chambers simultaneously is T _Pk, the wafer that is located at process chamber P1 processing is W _P1, the wafer of handling at other process chambers Pk is W simultaneously _Pk, the ratio that wafer takes out number is for respectively handling time T corresponding to chambers P1, Pk _P1, T _Pk, from the wafer W of box container 134 taking-ups _P1And W _PkThe ratio of taking-up number.The wafer taking-up is the ratio that takes out number with above-mentioned wafer at interval in addition, from the wafer W of box container 134 taking-ups _P1, W _PkTaking-up separately at interval.

The number of the process chamber that has of substrate board treatment is under the situation more than three in addition, and each other process chambers Pk uses the relation with the longest process chamber P1 of processing of wafers time respectively, obtains the wafer transport time.Specifically, for example be the substrate board treatment that three process chamber P1, P2, P3 are arranged, obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And W _P2Time of delivery.Wafer W in addition _P3Time of delivery obtain with the relation of process chamber P1 and process chamber P3.Obtaining the wafer transport time with the relation of the longest process chamber P1 of processing of wafers time and other process chambers Pk like this is, with long process time T _P1Be the method on basis, obtain the wafer optimal transport time of the chamber of managing processing throughout easily.

Below the above-mentioned wafer transport time method of obtaining is described.Respectively handle time T corresponding to chambers P1, Pk _P1, T _Pk, obtain the wafer transport time below can resembling.At this is that example describes with the substrate board treatment that two process chambers are arranged shown in Figure 1 100 for example.In process chamber 140A, the 140B of substrate board treatment 100, establishing the longest process chamber of processing time is P1, and other process chambers are P2.

For example establish the processing time T of chambers P1, P2 _P1, T _P2Ratio (T _P1: T _P2) be 2: 1, wafer W in process chamber P1 _P1Processing time T _P1In, in process chamber P2, can carry out two wafer W _P2Processing.Therefore the ratio of establishing wafer taking-up number is 1: 2.In this case, manage the processing of carrying out next piece wafer after the finishing dealing with of chamber P1, P2 throughout, establish wafer W _P1, W _P2Wafer take out at interval that each is each processing time T _P1, T _P2

Manage the wafer W of handling respectively among chamber P1, the P2 so throughout _P1, W _P2At each processing time T _P1, T _P2Taking-up at interval respectively take out one.This moment is because processing time T _P1Be processing time T _P2Twice, so wafer W of in process chamber P1, handling of every taking-up _P1, take out two wafer W of in process chamber P2, handling _P2

Owing to respectively handle time T corresponding to chambers P1, Pk so in the present embodiment _P1, T _Pk, obtain time of transfer wafers from box container 134, so according to such wafer transport time, the wafer W of in long process chamber P1 of processing time, handling _P1, can be with corresponding to processing time T _P1The interval of length taken out the wafer W of in short process chamber Pk of processing time, handling simultaneously from box container 134 _Pk, can be with corresponding to processing time T _PkThe interval of weak point taken out from box container 134.Like this owing to can eliminate the wafer W of handling among the process chamber P1 that resembles now such processing time length _P1In common transfer chamber 150, long-time standby such as load locking room 160M, 160N, locator 137, and the wafer W of short process chamber Pk of processing time _PkCan not so can improve the running rate of managing chamber P1, Pk throughout, can improve the treatment effeciency of substrate board treatment integral body from the situation of box container 134 taking-ups.

Supply unit side conveying mechanism 170 is owing to having only one, for example in the substrate board treatment that two process chambers are arranged 100 shown in Figure 1, for example at the such initial wafer W from handling among process chamber P1 of Fig. 5 _P1The time started t that takes out ₁₁To the initial wafer W that handles at other process chambers P2 _P2The time started t that takes out ₁₂, only produce supply unit side conveying mechanism 170 action cycle depart from time T _S2The action cycle of so-called supply unit side conveying mechanism 170 is for example represented following a series of actions.At first from box container 134 wafer is taken out, be sent to locator 137 with supply unit side conveying mechanism 170.Carry out access at locator 137 then, the wafer exchange behind this wafer and the location.Again the wafer behind the location is sent to load locking room 160N or 160M, then the wafer after load locking room 160N or 160M are the location with handle after wafer exchange.At last the wafer after handling is turned back to box container 134.The time that so a series of action needs in object lesson shown in Figure 5 for example is decided to be 20sec, and just the time started departs from time T _S2Be decided to be 20sec.

And owing to the wafer W of handling at process chamber P1 _P1Taking-up interval that every taking-up is one and the wafer W of handling at process chamber P2 _P2The taking-up that every taking-up is two equates at interval, always only departs from the time T that the above-mentioned time started departs from so these take out each intervals at interval _SKSo wafer W _P1Time and wafer W from box container 134 taking-ups _P2The time of taking out from box container 134 can not become simultaneously.Therefore the wafer take-off time as using takes out wafer W from box container 134 _P1, wafer W _Pk, manage can not produce among chamber P1, the P2 throughout because of waiting for that wafer takes out the stand-by period of causing.

Processing time T at such process chamber P1 _P1Just be the processing time T of process chamber Pk _PkThe situation of integral multiple (for example be n doubly) under, the wafer W of handling at process chamber P1 _P1Taking-up interval that every taking-up is one and the wafer W of handling at process chamber Pk _PkThe taking-up that the piece number of every above-mentioned integral multiple (for example being the n piece) takes out equates at interval, always only departs from the time T that the above-mentioned time started departs from interval so these take out _SkTherefore manage throughout and can not produce among chamber P1, the Pk because of waiting for that wafer takes out the stand-by period of causing.In addition as in this case wafer transport time, for managing the wafer W that chamber P1, Pk handle throughout _P1, W _Pk, wafer is taken out all departs from the processing time T that manages throughout among chamber P1, the Pk at interval respectively _P1, T _PkJust enough.Naturally and understandably determine thus for wafer W _P1, W _PkWafer take out the ratio of number.

Actual when carrying out processing of wafers, the processing time T of most applications process chamber P1 _P1Not just to be the processing time T of process chamber Pk _PkIntegral multiple.In this case, for example taking out wafer W _P1, W _PkEven in produce departing from the time of aforesaid time started because wafer W _P1, W _PkTaking-up separately at interval different, can produce wafer W _P1Time and wafer W from box container 134 taking-ups _PkThe time of taking out from box container 134 becomes situation simultaneously.In this case, because wafer W _P1, W _P2In wafers to be removed such as some appearance, the result manages throughout in some processing among chamber P1, the P2 and the stand-by period occurs, reduces because of this part makes the treatment effeciency of base board delivery device integral body.

So in the present invention will be with the identical base interval T of one or every polylith _XTake out wafer W from box container 134 _P1, W _PkMode is obtained time of delivery, makes taking out wafer W from box container 134 _P1, W _P2The time, do not produce the situation of waiting for that wafer takes out.

Specifically, at first respectively handle time T according to chambers P1, Pk _P1, T _Pk, determine to take out wafer W from box container 134 _P1, W _PkThe benchmark of Shi Zuowei benchmark takes out interval T _XObtain respectively then at this benchmark and take out interval T _XIn can handle wafer W _P1, W _PkPolylith count m, n.

In this case, for example, establish wafer W as the wafer transport time _P1, W _PkThe wafer ratio that takes out number be m: n, wafer takes out the processing time T that is spaced apart separately _P1, T _PkLike this for the wafer W of in process chamber P1, handling _P1At T fiducial time _XTake out the m piece, wherein at each processing time T _P1In take out one from box container 134, simultaneously at the wafer W of in process chamber Pk, handling _PkAt T fiducial time same as described above _XTake out the n piece, at each processing time T _PkIn take out one from box container 134.In this case, as wafer W _P1, W _PkTake out interval T at benchmark _XEach interval in take out m piece, n piece respectively time be respectively to handle time T _P1, T _Pk, can take out continuously, also can take out continuously.

Manage chamber P1, Pk parallel processing wafer W so throughout _P1, W _PkThe time, can make from the wafer transport time of box container 134 and the processing time T that manages chamber P1, Pk throughout _P1, T _PkConsistent.And the wafer transport time as employing is above-mentioned, for example carry out wafer W at process chamber P1 _P1Time of processing in count wafer W owing to can carry out accessible polylith at other process chamber Pk _PkProcessing, the wait processing time of chambers P1, Pk is reduced, can improve the running rate of chambers.Can improve the treatment effeciency of substrate board treatment integral body like this.

Pass through in addition taking out interval T with identical benchmark from box container 134 _XTime (cycle) wafer W _P1, W _PkEvery taking-up one or more, take out wafer W from box container 134 _P1, W _PkEach time always only depart from the time T that departs from of above-mentioned time started _SkSo, take out wafer W from box container 134 _P1, W _PkTime can be simultaneously.Manage so throughout can not produce among chamber P1, the P2 and wait for that wafer takes out the stand-by period of causing.

Under this external above-mentioned situation, take out interval T from benchmark _XDeduct the wafer W of m, n piece _P1, W _PkRemaining time in processing time become respectively at each benchmark and take out interval T _XThe stand-by period of middle chambers Pk, P1.Therefore determine preferably that benchmark takes out interval T _X, make these treat that the time is the least possible.For example as making processing time T process chamber P1 _P1Take advantage of m T doubly _P1M is that benchmark takes out interval T _X, the stand-by period that can eliminate process chamber P1 is in addition as with processing time T _Pk* n or processing time T _PkTake advantage of (n+1) T doubly _Pk(n+1) take out interval T for benchmark _X, the stand-by period that can eliminate process chamber Pk.

Like this according to the processing time T of process chamber P1, P2 _P1, T _P2Combination, determine that benchmark takes out interval T _X, make any the stand-by period among process chamber P1, the P2 the shortest, take out interval T according to benchmark _X, obtain the time of delivery (for example wafer takes out the ratio and the wafer taking-up interval of number) that takes out wafer from box container 134.Like this owing to making the stand-by period optimization of chambers P1, P2, so can further improve the treatment effeciency of base board delivery device integral body.Obtain the no matter processing time T of process chamber P1 of wafer transport time method in addition like this _P1Whether just be the processing time T of process chamber Pk _PkIntegral multiple can be suitable for.

, under the situation more than three, each other process chambers Pk used respectively with the relation of the longest process chamber P1 of processing of wafers time obtain time of delivery in process chamber number that substrate board treatment has.But in this case, take out interval T for unified benchmark _X, for example obtain at the wafer transport of other process chambers P2 and determine during the time that benchmark takes out interval T at first _X, obtain for other process chambers P3, P4 ..., Pk _EndThe situation of wafer transport time under, use the said reference of having determined to take out interval T _XAlso can obtain the stand-by period to each other process chambers Pk,, obtain benchmark and take out interval T according to making these treat the mode that the time is minimum to use with the relation of P1 _X

(obtaining the object lesson of the processing of wafer transport time)

Below with reference to figure, to being that the object lesson that the processing of wafer transport time is obtained on the basis describes with the above-mentioned wafer transport time method of obtaining.Fig. 2 is the flow chart of the processing of obtaining the wafer transport time of expression present embodiment.The processing of obtaining the wafer transport time for example is made of regulated procedure, is undertaken by control part 190 according to this program.For example said procedure is stored on the storage medium of the memory of control part 190 or the hard disk unit of the outside main device that connects etc. in advance, and control part 190 is implemented after above-mentioned storage medium reads these programs.

As the processing of obtaining the wafer transport time, as shown in Figure 2, at first in S110 step, the processing of wafers time of managing throughout in the chamber is compared, the longest process chamber of processing time of establishing each piece wafer is P1, other process chambers be Pk (k=2,3 ..., k _End).K wherein _EndIt is the processing number of chambers that substrate board treatment 100 has.Substrate board treatment for example shown in Figure 1 100 is owing to have two process chamber 140A, 140B, as the processing time of each piece wafer the longest be process chamber 104A, establishing process chamber 104A is P1, process chamber 140B is P2.

In S120 went on foot, the processing time that is located at each the piece wafer among the process chamber P1 was T subsequently _P1, the processing time of each the piece wafer in other process chambers Pk is T _PkProcess chamber P1 and other process chambers Pk (k=2,3 ..., k _End) order wish that with long process chamber of processing time be preface.For example in the substrate board treatment that three process chambers are arranged, the order long by the processing time of each piece wafer is made as process chamber P1, process chamber P2, process chamber P3.

In step, obtain the processing of wafer transport time at S130 step, S140 then.Just, in the step, obtain the processing that wafer takes out the ratio of number, in the step, obtain wafer and take out processing at interval at S140 at S130.Wherein the object lesson of the processing of the ratio of obtaining wafer taking-up number in S130 goes on foot is shown in Fig. 3, is shown in Fig. 4 at the object lesson of obtaining wafer taking-up processing at interval of S140 in the step.The processing of Fig. 3, Fig. 4 is located at benchmark and takes out interval T _XManageable wafer W _P1Polylith to count m be under 1 the situation, just with the processing time T of the longest process chamber P1 of the processing time of each piece wafer _P1Be benchmark, determine that benchmark takes out interval T _XSituation under processing.The wafer transport time that Fig. 5 represents to obtain with Fig. 2～Fig. 4 is managed the wafer W that chamber P1, P2 handle throughout under the situation of box container 134 taking-up wafers _P1, W _P2The processing program.Fig. 5 transverse axis is used the time, the wafer W of handling in two process chamber P1, P2 _P1, W _P2The processing program represent with bar graph respectively.

(obtaining the object lesson of processing that wafer takes out the ratio of piece number)

At first obtain the object lesson of processing that wafer takes out the ratio of piece number and describe above-mentioned at this with reference to Fig. 3.As shown in Figure 3, in the step, suppose processing time T at S210 with the longest process chamber P1 of the processing time of each piece wafer _P1For benchmark takes out interval T _XSituation under, obtain at this benchmark and take out interval T _XInterval in (at this is processing time T _P1In), the manageable wafer W of other process chambers Pk _PkPolylith count n.At the processing time of process chamber P1 T _P1In, by only the wafer W of manageable number of other process chambers Pk _PkTake out from box container, the stand-by period of process chamber Pk is reduced as far as possible.

Specifically, for example following formula (1-1) and (1-2) all set up is obtained wafer W _PkPiece count n.Following formula (1-1 and (1-2) in, T _P1It is each piece wafer W among the process chamber P1 _P1Processing time, T _PkIt is each piece wafer W among other process chambers Pk _PkProcessing time, n is the integer that satisfies n 〉=1, k is the integer that satisfies k 〉=2 as described above.This external following formula (1-1 and (1-2) in, point " " expression multiplication sign (following identical).

T _P1≥T _Pk·n …(1-1)

T _P1＜T _Pk·(n+1) …(1-2)

S220 below～S280 is in the step, at the processing time of process chamber P1 T _P1Processing time T with process chamber Pk _Pk(n+1) in, determine with a stand-by period short side (benchmark taking-up interval T _XA side who shortens) takes out interval T for benchmark _X, obtain and manage the wafer W of handling among chamber P1, the Pk throughout _P1, W _PkWafer take out the ratio of number.Short side of stand-by period by employing process chamber P1, Pk takes out interval T as benchmark like this _X, in whole process chamber P1, Pk, processing latency is shortened.Can realize the whole stand-by period optimization of substrate board treatment like this.

Specifically, in the step, suppose processing time T at S220 with process chamber P1 _P1For benchmark takes out interval T _XSituation under, obtain the stand-by period T of other process chambers Pk with following formula (1-3) _Wk, in the step, suppose processing time T with process chamber Pk at S230 _Pk(n+1) take out interval T for benchmark _XSituation under, obtain the stand-by period T of process chamber P1 with following formula (1-4) _W1

T _Wk＝T _P1-T _Pk·n …(1-3)

T _W1＝T _Pk·(n+1)-T _P1 …(1-4)

Then in S240 goes on foot, above-mentioned each stand-by period T _W1, T _WkCompare, judge which stand-by period weak point.Specifically, for example judge stand-by period T _WkWhether be not more than stand-by period T _W1(T _Wk≤ T _W1).In step, is T in judgement at S240 _Wk≤ T _W1Situation under, just judging stand-by period T _WkShort (or the stand-by period T of a side _W1, T _WkAll equate) situation under, in S250 step, resemble shown in the following formula (1-5) each wafer W _P1, W _PkBenchmark take out interval T _XBe defined as the processing time T of process chamber P1 _P1, in the step, establish each wafer W at S260 _P1, W _PkWafer take out the ratio (W of number _P1: W _Pk) be 1: n.

T _X＝T _P1＝T _Pk·n+T _Wk …(1-5)

As the T that obtains adopting _X(=T _P1=T _PkN+T _Wk), in each this interval, take out a wafer W of in process chamber P1, handling _P1, the stand-by period of process chamber P1 is 0, takes out the wafer W that the n piece is handled in process chamber Pk simultaneously _Pk, the stand-by period of process chamber Pk is T _Wk

In contrast, in the step, not T at S240 judging _Wk≤ T _W1Situation under, just judging stand-by period T _W1The short situation of a side under,, resemble shown in the following formula (1-6) in the step at S270 each wafer W _P1, W _PkBenchmark take out interval T _XBe defined as the processing time T of process chamber Pk _Pk(n+1), in the step, establish each wafer W at S280 _P1, W _PkWafer take out the ratio (W of number _P1: W _Pk) be 1: n+1.

T _X＝T _P1+T _W1＝T _Pk·(n+1) …(1-6)

As the T that obtains adopting _X(=T _P1+ T _W1=T _Pk(n+1)), in each this interval, take out a wafer W of in process chamber P1, handling _P1, the stand-by period of process chamber P1 is T _W1, take out the wafer W that the n+1 piece is handled simultaneously in process chamber Pk _Pk, the stand-by period of process chamber Pk is 0.The benchmark that obtains in the processing shown in Figure 3 takes out interval T _XThe ratio etc. that takes out number with wafer is stored in the memory of control part 190 etc.

(obtaining the object lesson that wafer takes out processing at interval)

Below with reference to Fig. 4 the object lesson of obtaining wafer taking-up processing is at interval described.By the processing that wafer takes out the ratio of number of obtaining shown in Figure 3, take out interval T at this according to the benchmark of determining thus _XAnd the wafer that obtains takes out the ratio of number, obtains in reality each wafer W when box container 134 takes out wafers _P1, W _PkWafer take out at interval.

Specifically, at first at S310 shown in Figure 4 in the step, from the memory of control part 190 etc., take out the ratio (W of the wafer taking-up number of obtaining with processing shown in Figure 3 _P1: W _Pk), judge that wafer takes out the ratio (W of number _P1: W _Pk) be 1: n or 1: n+1.

In step, judge that wafer takes out the ratio (W of number at S310 _P1: W _Pk) be 1: under the situation of n, in S320 goes on foot, to the wafer W of in process chamber P1, handling _P1Wafer take out to be spaced apart and take out interval T at benchmark _XIn the interval of one of every taking-up.Wafer W like this _P1A side for example take out interval T with benchmark _XFrom one of box container 134 every taking-up, just at each processing time T _P1Take out one from box container 134.In this case, because benchmark takes out interval T _XProcessing time T for process chamber P1 _P1, shown in the processing program of the upside of Fig. 5 (a), be 0 for example in the process chamber P1 stand-by period, can handle wafer W continuously _P1

In step, make the wafer W of handling in process chamber Pk at S330 then _PkWafer take out and to be spaced apart according to taking out interval T at benchmark _XIn every taking-up n piece and at each processing time T _PkEach takes out one interval.Wafer W like this _PkOne side for example takes out interval T at each benchmark _XEach interval in, take out the n pieces continuously from box container 134 at every turn, only wait for stand-by period T simultaneously _WkTake out.After just taking out the n piece continuously, through stand-by period T from box container 134 _Wk, then from the box container 134 continuous n pieces that take out next batch.In this case, because benchmark takes out interval T _XProcessing time T for process chamber Pk _PkN+T _Wk, for example shown in the processing program of the downside of Fig. 5 (a), take out interval T at each benchmark at process chamber Pk _XEach interval in, with stand-by period T _WkEach handles n piece wafer W continuously _PkFig. 5 (a) is the concrete example under the situation of k=2, n=3 in addition.

In contrast, in the step, judging that wafer takes out the ratio (W of number at S310 _P1: W _Pk) be 1: under the situation of n+1, in S340 goes on foot, to the wafer W of in process chamber P1, handling _P1Wafer take out to be spaced apart and take out interval T at benchmark _XIn the interval of one of every taking-up.Wafer W like this _P1A side for example take out interval T at each benchmark _XEach interval in from one of box container 134 every taking-up, stand-by period T only simultaneously _W1Become the stand-by period.After just taking out one, at process stand-by period T from box container 134 _W1After, take out next piece from box container 134.In this case, because benchmark takes out interval T _XProcessing time T for process chamber P1 _P1+ T _W1So, shown in the processing program of the upside of Fig. 5 (b), take out interval T at each benchmark at process chamber P1 _XEach interval in, at stand-by period T _W1Handle each piece wafer W _P1

In step, make the wafer W of in process chamber Pk, handling at S350 then _PkWafer take out to be spaced apart and take out interval T at benchmark _XIn every taking-up n+1 piece, at each processing time T _PkTake out one interval.Wafer W like this _PkOne side for example takes out interval T at each benchmark _XEach interval in, take out the n+1 pieces continuously from box container 134 at every turn.In this case, because benchmark takes out interval T _XProcessing time T for process chamber Pk _Pk(n+1), for example shown in the processing program of the downside of Fig. 5 (b), take out interval T at each benchmark at process chamber Pk _XEach interval in, the stand-by period is 0, can handle n+1 piece wafer W continuously at every turn _PKFig. 5 (b) is the concrete example under the situation of k=2, n=2 in addition.

The wafer of obtaining with Fig. 3, processing shown in Figure 4 takes out the ratio of number and wafer and takes out at interval with control part 190 and store in this memory etc. like this.Then under actual situation of carrying out processing of wafers, ratio and wafer that the wafer that obtains to obtain with Fig. 3, Fig. 4 by control part 190 from memory etc. takes out number take out the interval, the ratio and the wafer that take out number according to this wafer take out at interval, and control supply unit side conveying mechanism 170 is respectively wafer W _P1, W _PkTake out from box container 134.

The wafer W of in long process chamber P1 of processing time, handling so for example _P1With corresponding to its processing time T _P1The interval of length, take out from box container 134, at short process chamber W of processing time _PkThe middle wafer W of handling _PkWith corresponding to its processing time T _PkThe interval of weak point, take out wafer, thus can not produce resemble existing the wafer W of long process chamber P1 of processing time _P1In common transfer chamber 150, long-time standby such as load locking room 160M, 160N, locator 137, the process chamber T that the processing time is short _PkWafer W _PkSituation about can not from box container 134, take out.Therefore can improve the running rate of chambers P1, Pk, can bring up to the treatment effeciency of substrate board treatment integral body and be higher than existing state.

In addition for wafer W _P1, W _Pk, owing to take out interval T at identical benchmark respectively _XTime (cycle) take out from box container 134, in wafer W _P1, W _PkIn benchmark take out interval T _XEach is interval for only departing from the initially treated wafer W of taking-up _P1, W _PkThe time time started of producing depart from time T _SkTherefore take out wafer W _P1, W _PkTime can be simultaneously.Fig. 3, processing shown in Figure 4 are not only applicable to the processing time T of process chamber P1 in addition _P1Not just to be the processing time T of process chamber Pk _PkThe situation of integral multiple, shown in the processing progress of Fig. 5 (c), the processing time T of process chamber P1 _P1At the processing time T that just is process chamber Pk _PkThe situation of integral multiple also can be suitable for.

(being applicable to the situation of the substrate board treatment of two process chambers)

To in the substrate board treatment that two process chambers are arranged shown in Figure 1, enumerate concrete numerical value below with reference to Fig. 5, Fig. 2～processing of obtaining time of delivery shown in Figure 4 is described.The processing of wafers time of each piece in Fig. 5 among (a) expression chambers 140A, the 140B is the situation of 200sec, 60sec, (b) situation of expression 200sec, 70sec, (c) situation of expression 200sec, 50sec.Because these situations all are that the longest process chamber of processing time is process chamber 140A, so as adopting S110, the S120 step of Fig. 2, process chamber 140A is process chamber P1, its processing time is T _P1, other process chambers 140B is process chamber P2, its processing time is T _P2

In the S130 of Fig. 2 step (processing for example shown in Figure 3) and S140 step (processing for example shown in Figure 4), obtaining under the situation of time of delivery then, because the processing time of usefulness chambers, be divided into Fig. 5 (a) and (b) below, (c) describes.

At first the object lesson to Fig. 5 (a) describes.This object lesson is that benchmark takes out interval T _XProcessing time T for process chamber P1 _P1Side situation about shortening for stand-by period of process chamber.Situation shown in Fig. 5 (a) is the processing time T of process chamber P1 _P1Be 200sec, the processing time T of process chamber P2 _P2Be 60sec, so by the S210 step shown in Figure 3, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=3 as k=2.

Then by S220 step and S230 step, as k=2, as respectively numerical value being used for formula (1-3), (1-4), the stand-by period T of process chamber P2 _W2=200-60 * 3=20sec, the stand-by period T of process chamber P1 _W1=60 * 4-200=40sec.Because the stand-by period T of process chamber P2 _W2One side of (=20sec) is than the stand-by period T of process chamber P1 _W1(=40sec) is few, so by in S240, S250, S260 step, make wafer W _P1, W _P2Benchmark take out interval T _XProcessing time T for process chamber P1 _P1(=200sec), the wafer W of in process chamber P1, handling _P1With the wafer W of in process chamber P2, handling _P2Wafer take out the ratio (W of number _P1: W _P2) be 1: 3.

Then by S310 shown in Figure 4, S320, the S330 wafer W of step in process chamber P1, handling _P1Wafer take out to be spaced apart and take out interval T at benchmark _XThe interval of one of every taking-up in the (=200sec) is to the wafer W of handling in process chamber P2 _P2Wafer take out to be spaced apart and take out interval T at benchmark _XThree of every taking-ups in the (=200sec), at each processing time T _P2The interval that the every taking-up of (=60sec) is one.

As the wafer transport time adopting is from box container 134 each wafer W of taking-up _P1, W _P2, the processing program of chambers P1, P2 is shown in Fig. 5 (a).In this case, the stand-by period is 0 in process chamber P1, can handle wafer W continuously _P1On the other hand, in process chamber P2, take out interval T at each benchmark _XIn the (=200sec), with stand-by period T _W2(=20sec) can be handled three wafer W continuously _P2

Object lesson to Fig. 5 (b) describes below.This object lesson is to take out interval T with benchmark _XProcessing time T for process chamber P2 _P2The situation that the stand-by period of side's process chamber (n+1) shortens.Situation shown in Fig. 5 (b) is the processing time T of process chamber P1 _P1Be 200sec, the processing time T of process chamber P2 _P2Be 70sec, so by the S210 step shown in Figure 3, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=2 as k=2.

Subsequently as adopting S220 step and S230 step, as k=2, as respectively numerical value being used for formula (1-3), (1-4), the stand-by period T of process chamber P2 _W2=200-70 * 2=60sec, the stand-by period T of process chamber P1 _W1=70 * 3-200=10sec.Because the stand-by period T of process chamber P1 _W1One side of (=10sec) is than the stand-by period T of process chamber P2 _W2(=60sec) is few, so by in S240, S270, S280 step, make wafer W _P1, W _P2Benchmark take out interval T _XFor processing time 70sec * 3 of process chamber P2 (=210sec), wafer W _P1, W _P2Wafer take out the ratio (W of number _P1: W _P2) be 1: 3.

Below by S310 shown in Figure 4, S340, S350 step, to the wafer W of in process chamber P1, handling _P1Wafer take out to be spaced apart and take out interval T at benchmark _XThe interval of one of every taking-up in the (=200sec) is to the wafer W of handling in process chamber P2 _P2Wafer take out to be spaced apart and take out interval T at benchmark _XThree of every taking-ups in the (=200sec), at each processing time T _P2The interval that the every taking-up of (=70sec) is one.

As the wafer transport time adopting is from box container 134 each wafer W of taking-up _P1, W _P2, the processing program of chambers P1, P2 is shown in Fig. 5 (b).In this case, in process chamber P1, take out interval T at each benchmark _X(=200sec) is interior with stand-by period T _W1(=10sec) can be handled wafer W continuously _P1On the other hand, in process chamber P2, take out interval T at each benchmark _XIn the (=200sec), with the stand-by period be 0, each handles three wafer W continuously _P2

Object lesson to Fig. 5 (c) describes below.This object lesson is the processing time T of process chamber P1 _P1Processing time T with process chamber P2 _P2The situation that n equates.In this case, by the processing time T of process chamber P2 _P2N (or the processing time T of process chamber P1 _P1) take out interval T as benchmark _X, the stand-by period of chambers all is 0.Situation shown in Fig. 5 (c) is the processing time T of process chamber P1 _P1Be 200sec, the processing time T of process chamber P2 _P2Be 50sec, so by the S210 step shown in Figure 3, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=4 as k=2.

Adopt S220 step and S230 step subsequently, as k=2, as respectively numerical value being used for formula (1-3), (1-4), the stand-by period T of process chamber P2 _W2=200-50 * 4=0sec, the stand-by period T of process chamber P1 _W1=50 * 5-200=50sec.Because the stand-by period T of process chamber P1 _W1One side of (=0sec) is than the stand-by period T of process chamber P2 _W2(=50sec) is few, so by in S240, S270, S280 step, make wafer W _P1, W _P2Benchmark take out interval T _XProcessing time T for process chamber P2 _P2* n (=200sec), wafer W _P1, W _P2Wafer take out the ratio (W of number _P1: W _P2) be 1: 4.

Below by S310 shown in Figure 4, S340, S350 step, to the wafer W of in process chamber P1, handling _P1Wafer take out to be spaced apart and take out interval T at benchmark _XThe interval of one of every taking-up in the (=200sec) is to the wafer W of handling in process chamber P2 _P2Wafer take out to be spaced apart and take out interval T at benchmark _XTake out four in the (=200sec), at each processing time T _P2(=50sec) taken out one interval.

As the wafer transport time adopting is from box container 134 each wafer W of taking-up _P1, W _P2, the processing program of chambers P1, P2 is shown in Fig. 5 (c).In this case, in process chamber P1, take out interval T at each benchmark _XThe inherent stand-by period of (=200sec) is 0, can handle wafer W continuously _P1On the other hand, in process chamber P2, take out interval T at each benchmark _XBe 0 with the stand-by period in the (=200sec), each handles four wafer W _P2

(being applicable to the situation of the substrate board treatment of the process chamber more than three)

Below to the substrate board treatment of the process chamber more than three is arranged, the situation of carrying out the processing of obtaining time of delivery of Fig. 2～shown in Figure 4 describes.Fig. 6 represents to have the figure of brief configuration of the substrate board treatment of three or four process chambers.On substrate board treatment 200 structures shown in Figure 6 with substrate board treatment 100 shown in Figure 1 much at one, also chamber 140C, 140D are connected the structure of the both sides of common transfer chamber 150 by gate valve 144C, 144D.Wherein for example chamber 140C is being constituted as the process chamber that carries out processing of wafers, simultaneously chamber 140D as under the situation of carrying out the inspection chamber of the various inspections of the mensuration of the result of the wafer handled etc. is constituted, become the substrate board treatment 200 that three process chambers are arranged, under the situation that chamber 140C, 140D are constituted as the process chamber that carries out processing of wafers, become the substrate board treatment 200 that four process chambers are arranged.In this external substrate board treatment shown in Figure 6 200, also the section in constituting conveying chamber 130 is on the side on polygonal long limit, and box platform 132C is set, can constitute another box container 134C is placed on above.For example also can be enclosed in the wafer that the chamber 140C that constitutes as process chamber and chamber 140D handle among the box container 134C.

At first with reference to Fig. 7, exemplify concrete numerical value, the substrate board treatment 200 that Fig. 6 is represented is as the substrate board treatment that constitutes three process chambers, and the situation of the processing of the time of delivery of obtaining Fig. 2～shown in Figure 4 is described.Fig. 7 represents the processing of wafers program of the chambers handled with the time of delivery that Fig. 2～Fig. 4 obtains.Fig. 7 transverse axis is the time, is that the processing program of the wafer handled in three process chamber P1, P2, P3 is represented with bar graph respectively.Fig. 7 is that the processing of wafers time of each piece among chambers 140A, 140B, the 140C is the situation of 200sec, 70sec, 50sec.

The longest process chamber is process chamber 140A processing time in this case, so as S110, the S120 step of adopting Fig. 2, process chamber 140A is process chamber P1, its processing time is T _P1, process chamber 140B is process chamber P2, its processing time is T _P2, process chamber 140C is process chamber P3, its processing time is T _P3Therefore in this case, obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery, wafer W _P3Time of delivery obtain with the relation of process chamber P1 and process chamber P3.But obtaining wafer W _P3The situation of time of delivery under, for unified benchmark takes out interval T _X, use and obtaining wafer W _P1And wafer W _P2Time of delivery the time benchmark determined take out interval T _XDescribe such wafer transport time method of obtaining below in detail.

At first obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery.Because this situation is identical with the object lesson of Fig. 5 (b), wafer W _P1, W _P2Benchmark take out interval T _XFor processing time 70sec * 3 of process chamber P2 (=210sec), wafer W _P1, W _P2Wafer take out the ratio (W of number _P1: W _P2) be 1: 3.For wafer W _P1Wafer take out to be spaced apart and take out interval T at benchmark _XThe interval of one of every taking-up in the (=210sec) is for wafer W _P2Wafer take out to be spaced apart and take out interval T at benchmark _XTake out three in the (=210sec), at each processing time T _P2(=70sec) taken out one interval.

Obtain the wafer W of in process chamber P3, handling with the relation of process chamber P1 and process chamber P3 then _P3Time of delivery.In this case, take out interval T owing to determined benchmark _X=210sec obtains wafer W with it _P3Time of delivery.Specifically, for example benchmark is taken out fixed interval at T _X=210sec carries out S210 shown in Figure 3, S220, the processing in S260 step, carries out S310 shown in Figure 4, the S330 step.

Just, by the S210 step, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=4 as k=3.By the S220 step, as respectively numerical value being used for formula (1-3) as k=3, the stand-by period of process chamber P3 is T then _W3=210-50 * 4=10sec is by S260 step, the wafer W of handling in process chamber P1 _P1, the wafer W in process chamber P3, handled _P3Wafer take out the ratio (W of number _P1: W _P3) be 1: 4.S310 step, the S330 that represents by Fig. 4 goes on foot then, to the wafer W of handling in process chamber P3 _P3Wafer take out to be spaced apart and take out interval T at benchmark _XTake out four in the (=210sec), at each processing time T _P3(=50sec) taken out one interval.

The wafer transport time as using is taken out each wafer W from box container 134 _P1, W _P2, W _P3, the processing program of chambers P1, P2, P3 as shown in Figure 7.In this case, take out interval T at benchmark _XAmong the inherent process chamber P1 of (=210sec) with stand-by period T _W1(=10sec) can be handled wafer W continuously _P1, in process chamber P2, be 0 with the stand-by period, can handle three wafer W continuously _P2, in process chamber P3 with stand-by period T _W3(=10sec) can be handled four wafer W continuously _P3

With reference to Fig. 8, exemplify concrete numerical value then, the substrate board treatment 200 that Fig. 6 is represented is as the substrate board treatment that constitutes four process chambers, and the situation of the processing of the time of delivery of obtaining Fig. 2～shown in Figure 4 is described.Fig. 8 represents the processing of wafers program of the chambers handled with the time of delivery that Fig. 2～Fig. 4 obtains.Fig. 8 transverse axis is the time, is that the processing program of the wafer handled in four process chamber P1, P2, P3, P4 is represented with bar graph respectively.Fig. 8 is that the processing of wafers time of each piece among chambers 140A, 140B, 140C, the 140D is the situation of 200sec, 70sec, 60sec, 50sec.

The longest process chamber is process chamber 140A processing time in this case, so as S110, the S120 step of adopting Fig. 2, process chamber 140A is process chamber P1, its processing time is T _P1, process chamber 140B is process chamber P2, its processing time is T _P2, process chamber 140C is process chamber P3, its processing time is T _P3, process chamber 140D is process chamber P4, its processing time is T _P4Therefore in this case, obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery, wafer W _P3Time of delivery obtain wafer W with the relation of process chamber P1 and process chamber P3 _P4Time of delivery obtain with the relation of process chamber P1 and process chamber P4.But obtaining wafer W _P3, W _P4The situation of time of delivery under, for unified benchmark takes out interval T _X, use and obtaining wafer W _P1And wafer W _P2Time of delivery the time benchmark determined take out interval T _XDescribe such wafer transport time method of obtaining below in detail.

At first obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery.Because this situation is identical with the object lesson of Fig. 5 (b), wafer W _P1, W _P2Benchmark take out interval T _XFor processing time 70sec * 3 of process chamber P2 (=210sec), wafer W _P1, W _P2Wafer take out the ratio (W of number _P1: W _P2) be 1: 3.For wafer W _P1Wafer take out to be spaced apart and take out interval T at benchmark _XThe interval of one of every taking-up in the (=210sec) is for wafer W _P2Wafer take out to be spaced apart and take out interval T at benchmark _XTake out three in the (=210sec), at each processing time T _P2(=70sec) taken out one interval.

Obtain the wafer W of in process chamber P3, handling with the relation of process chamber P1 and process chamber P3 then _P3Time of delivery.In this case, take out interval T owing to determined benchmark _X=210sec obtains wafer W with it _P3Time of delivery.Specifically, for example benchmark is taken out fixed interval at T _X=210sec carries out S210 shown in Figure 3, S220, the processing in S260 step, carries out S310 shown in Figure 4, the S330 step.

Just, by the S210 step, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=3 as k=3.By the S220 step, as respectively numerical value being used for formula (1-3) as k=3, the stand-by period of process chamber P3 is T then _W3=210-60 * 3=30sec is by S260 step, the wafer W of handling in process chamber P1 _P1, the wafer W in process chamber P3, handled _P3Wafer take out the ratio (W of number _P1: W _P3) be 1: 3.S310 step, the S330 that represents by Fig. 4 goes on foot then, to the wafer W of handling in process chamber P3 _P3Wafer take out to be spaced apart and take out interval T at benchmark _XEvery taking-up is three in the (=210sec), at each processing time T _P3(=50sec) respectively taken out one interval.

Obtain the wafer W of in process chamber P4, handling with the relation of process chamber P1 and process chamber P4 then _P4Time of delivery.In this case, take out interval T owing to determined benchmark _X=210sec obtains wafer W with it _P4Time of delivery.Specifically, for example benchmark is taken out fixed interval at T _X=210sec carries out S210 shown in Figure 3, S220, the processing in S260 step, carries out S310 shown in Figure 4, the S330 step.

Just, by the S210 step, as being applicable to formula (1-1), (1-2), that satisfy these formula is n=4 as k=4.By the S220 step, as respectively numerical value being used for formula (1-3) as k=4, the stand-by period of process chamber P4 is T then _W4=210-50 * 4=10sec is by S260 step, the wafer W of handling in process chamber P1 _P1, the wafer W in process chamber P3, handled _P4Wafer take out the ratio (W of number _P1: W _P4) be 1: 4.S310 step, the S330 that represents by Fig. 4 goes on foot then, to the wafer W of handling in process chamber P4 _P4Wafer take out to be spaced apart and take out interval T at benchmark _XFour of every taking-ups in the (=210sec), at each processing time T _P4(=50sec) respectively taken out one interval.

The wafer transport time as using is taken out each wafer W from box container 134 _P1, W _P2, W _P3, W _P4, the processing program of chambers P1, P2, P3, P4 as shown in Figure 8.In this case, take out interval T at benchmark _XAmong the inherent process chamber P1 of (=210sec) with stand-by period T _W1(=10sec) can be handled wafer W continuously _P1, in process chamber P2, be 0 with the stand-by period, can handle three wafer W continuously _P2, in process chamber P3 with stand-by period T _W3(=30sec) can be handled three wafer W continuously _P3, in process chamber P4 with stand-by period T _W4(=10sec) can be handled four wafer W continuously _P4

(obtaining other object lessons of the processing of wafer transport time)

Below with reference to figure, other object lessons of the processing of obtaining the wafer transport time that principle according to the present invention is carried out describe.Because the main flow of other examples has omitted the detailed description to it with shown in Figure 2 identical.Fig. 9 represents other examples of the processing of the ratio of obtaining wafer taking-up number that S130 shown in Figure 2 goes on foot, and Figure 10 represents other examples that wafer takes out processing at interval of obtaining in S140 step shown in Figure 2.The processing of Fig. 9, Figure 10 is the processing time T with the longest process chamber P1 of the processing time of each piece wafer _P1M is a benchmark, obtains wafer and takes out the ratio of number and the situation that wafer takes out the interval, just, takes out interval T at benchmark _XIn manageable wafer W _P1The piece number be the situation of m.M also can be 1 in addition.Wafer transport time under the situation of m=1 and coming to the same thing of obtaining with Fig. 3, processing shown in Figure 4.

(obtaining other object lessons of processing that wafer takes out the ratio of number)

At first obtain other object lessons of processing that wafer takes out the ratio of number and describe above-mentioned at this with reference to Fig. 9.As shown in Figure 9,, suppose in the step at S410 at processing time T with the longest process chamber P1 of the processing time of each piece wafer _P1M takes out interval T as benchmark _XSituation under, obtain at its benchmark and take out interval T _XInterval in (at this is processing time T _P1M) the manageable wafer W of other process chambers Pk _PkPolylith count n.Because at the processing time of process chamber P1 T _P1In the m, by only from box container, taking out the wafer W of manageable number of other process chambers Pk _Pk, can make the stand-by period of process chamber Pk short as far as possible.

Specifically, for example obtain wafer W _PkPiece count n, make following formula (2-1) and 2-2) all set up.This external following formula (2-1) and 2-2) in, T _P1Be each piece wafer W among the process chamber P1 _P1Processing time, T _PkBe each piece wafer W among other process chambers Pk _PkProcessing time, n is the integer that satisfies n 〉=1, m is the integer that satisfies m 〉=1, as above-mentioned, k is the integer that satisfies k 〉=2.

T _P1·m≥T _Pk·n …(2-1)

T _P1·m＜T _Pk·(n+1) …(2-2)

S420 below～in 490 steps, determine m, n makes the stand-by period of chambers the shortest, simultaneously at the processing time of process chamber P1 T _P1Processing time T with process chamber Pk _Pk(n+1) in, determine with short (benchmark taking-up interval T of stand-by period _XWeak point) be that benchmark takes out interval T _X, obtain and manage the wafer W of handling among chamber P1, the Pk throughout _P1, W _PkWafer take out the ratio of number.Can all among process chamber P1, the Pk be shortened the time of handling wait like this.Therefore can realize the optimization of stand-by period in the whole base plate processing unit.

Specifically, in the step, suppose processing time T at S420 with process chamber P1 _P1M is that benchmark takes out interval T _XSituation under, obtain the stand-by period T of other process chambers Pk with following formula (2-3) _Wk, in the step, suppose processing time T with process chamber Pk at S430 _Pk(n+1) take out interval T for benchmark _XSituation under, obtain the stand-by period T of process chamber P1 with following formula (2-4) _W1

T _Wk＝T _P1·m-T _Pk·n …(2-3)

T _W1＝T _Pk·(n+1)-T _P1·m …(2-4)

In S440 step, change the value (for example making the value of m increase progressively 1) of m more subsequently, simultaneously at S410,420, in 430 steps, the situation of each m is obtained polylith count n and stand-by period T _Wk, T _W1, determine m, n, make stand-by period T _Wk, T _W1In some minimums.

, determined under the situation of m, n in the step at above-mentioned S440, relatively each stand-by period T in the step at S450 then _W1, T _Wk, judge which stand-by period is short.Specifically, for example judge stand-by period T _WkWhether at stand-by period T _W1Below (T _Wk≤ T _W1).In step, judgement is T at S450 _Wk≤ T _W1Situation under, just judging stand-by period T _WkShort (or stand-by period T _W1, T _WkAll identical) situation under, in S460 step, as following formula (2-5), each wafer W _P1, W _PkBenchmark take out interval T _XBe defined as the processing time T of process chamber P1 _P1M is in S470 goes on foot, each wafer W _P1, W _PkWafer take out the ratio (W of number _P1: W _Pk) be decided to be m: n.

T _X＝T _P1·m＝T _Pk·n+T _Wk …(2-5)

As the benchmark that obtains adopting takes out interval T _X(=T _P1M=T _PkN+T _Wk), in each should the interval, take out the wafer W that the m piece is handled in process chamber P1 _P1, the stand-by period of process chamber P1 is 0, takes out the wafer W that the n piece is handled in process chamber Pk simultaneously _Pk, the stand-by period of process chamber Pk is T _Wk

In contrast, in the step, not T at S450 judging _Wk≤ T _W1Situation under, just judging stand-by period T _W1Under the short situation, in S480 goes on foot, as following formula (2-6), each wafer W _P1, W _PkBenchmark take out interval T _XBe defined as the processing time T of process chamber Pk _Pk(n+1), in S490 goes on foot, each wafer W _P1, W _PkWafer take out the ratio (W of number _P1: W _Pk) be decided to be m: n+1.

T _X＝T _P1·m+T _W1＝T _Pk·(n+1) …(2-5)

As the benchmark that obtains adopting takes out interval T _X(=T _P1M+T _W1=T _Pk(n+1)), in each should the interval, take out the wafer W that the m piece is handled in process chamber P1 _P1, the stand-by period of process chamber P1 is T _W1, take out the wafer W that the n+1 piece is handled simultaneously in process chamber Pk _Pk, the stand-by period of process chamber Pk is 0.The benchmark that obtains in processing shown in Figure 3 is taken out interval T _XThe ratio etc. that takes out number with wafer stores in the memory of control part 190 etc.

(obtaining other object lessons that wafer takes out processing at interval)

Below with reference to Figure 10 other object lessons of obtaining wafer taking-up processing are at interval described.Determine that in this processing benchmark takes out interval T with the ratio of obtaining wafer taking-up number shown in Figure 9 _X, according to taking out interval T with benchmark _XThe wafer that obtains takes out the ratio of number, obtains in the reality each wafer W when box container 134 takes out wafers _P1, W _PkWafer take out at interval.

Specifically, at first as shown in figure 10, in the step, the wafer of obtaining with processing shown in Figure 9 is taken out the ratio (W of number at S510 _P1: W _Pk) from the memory of control part 190 etc., take out, judge that wafer takes out the ratio (W of number _P1: W _Pk) be m: n or m: n+1.

In step, judge that wafer takes out the ratio (W of number at S510 _P1: W _Pk) be m: under the situation of n, in S520 goes on foot, wafer W in process chamber P1, handling _P1Wafer take out to be made as at benchmark at interval and take out interval T _XThe middle m piece that takes out is at each processing time T _P1Middle interval of taking out.Wafer W like this _P1One side for example takes out interval T at each benchmark _XEach interval take out the m pieces continuously from box container 134.In this case, because benchmark takes out interval T _XProcessing time T for process chamber P1 _P1M is so take out interval T at each benchmark in process chamber P1 _XEach interval, with the stand-by period 0, handle every m piece W continuously _P1

In step, make the wafer W of handling at process chamber Pk at S530 then _PkWafer take out to be spaced apart and take out interval T at benchmark _XIn every taking-up n piece, at each processing time T _PkIn respectively take out one interval.Wafer W like this _PkOne side for example takes out interval T at each benchmark _XEach interval take out each n piece continuously from box container 134, simultaneously only at stand-by period T _WkWait for for taking out.Just, behind box container taking-up n piece, only wait for stand-by period T continuously _Wk, then continuously from box container taking-up n piece next time.In this case, because benchmark takes out interval T _XProcessing time T for process chamber Pk _PkN+T _WkSo, in process chamber Pk, take out interval T at each benchmark _XEach interval with stand-by period T _Wk, wafer W _PkBe that each n piece is handled continuously.

In contrast, in the step, judge that wafer takes out the ratio (W of number at S530 _P1: W _Pk) be m: under the situation of n+1, in S540 goes on foot, wafer W in process chamber P1, handling _P1Wafer take out to be made as at benchmark at interval and take out interval T _XIn every taking-up m piece, at each processing time T _P1In respectively take out one interval.Wafer W like this _P1One side is for example to take out interval T at each benchmark _XEach interval, from box container 134 every taking-up m pieces, stand-by period T only simultaneously _W1Take out.Just, at each processing time T _P1After taking out the m piece from box container 134 continuously, only at stand-by period T _W1After, from the box container 134 continuous m pieces that take out next time.In this case, because benchmark takes out interval T _XBe the processing time T among the process chamber P1 _P1M+T _W1So, in process chamber P1, take out interval T at each benchmark _XEach interval in stand-by period T _W1Handle each m piece W _P1

In step, make the wafer W of handling at process chamber Pk at S550 then _PkWafer take out to be spaced apart and take out interval T at benchmark _XIn every taking-up n+1 piece, at processing time T _PkIn respectively take out one interval.Wafer W like this _PkOne side for example takes out interval T at each benchmark _XEach interval take out each n+1 piece continuously from box container 134.In this case, because benchmark takes out interval T _XProcessing time T for process chamber Pk _Pk(n+1), so in process chamber Pk, take out interval T at each benchmark _XEach interval be 0 with the stand-by period, handle each n+1 piece W continuously _Pk

The wafer of obtaining with Fig. 9, processing shown in Figure 10 takes out the ratio of number and wafer and takes out at interval with control part 190 and store in its memory etc. like this.Then under actual situation of carrying out processing of wafers, ratio and wafer that the wafer that obtains to obtain with Fig. 9, Figure 10 by control part 190 from memory etc. takes out number take out the interval, the ratio and the wafer that take out number according to this wafer take out at interval, and control supply unit side conveying mechanism 170 is respectively wafer W _P1, W _PkTake out from box container 134.

The wafer W of in long process chamber P1 of processing time, handling so for example _P1With corresponding to its processing time T _P1The interval of length, take out from box container 134, at short process chamber W of processing time _PkThe middle wafer W of handling _PkWith corresponding to its processing time T _PkThe interval of weak point, take out from box container 134, thus can not produce resemble existing the wafer W of long process chamber P1 of processing time _P1In common transfer chamber 150, long-time standby such as load locking room 160M, 160N, locator 137, the process chamber T that the processing time is short _PkWafer W _PkSituation about can not from box container 134, take out.Therefore can improve the running rate of chambers P1, Pk, can bring up to the treatment effeciency of substrate board treatment integral body and be higher than existing state.

In addition for wafer W _P1, W _Pk, owing to take out interval T at identical benchmark respectively _XTime (cycle) take out from box container 134, in wafer W _P1, W _PkIn benchmark take out interval T _XEach is interval for only departing from the initially treated wafer W of taking-up _P1, W _PkThe time time started of producing depart from time T _SkTherefore take out wafer W _P1, W _PkTime can be simultaneously.Fig. 9, processing shown in Figure 10 are not only applicable to the processing time T of process chamber P1 in addition _P1Just not the processing time T of process chamber Pk _PkThe situation of integral multiple, at the processing time T that just is process chamber Pk _PkThe situation of integral multiple also can be suitable for.

Below substrate board treatment shown in Figure 6 200 as situation as the substrate board treatment that constitutes four process chambers in, to the situation of the processing of obtaining Fig. 2, Fig. 9, time of delivery shown in Figure 10, enumerate concrete numerical value and be elaborated.Figure 11 represents the processing of wafers program of the chambers handled with the time of delivery that Fig. 2, Fig. 9, Figure 10 obtain.Figure 11 uses the time for transverse axis, is that the processing program of the wafer handled in four process chamber P1, P2, P3, P4 is represented with bar graph respectively.Figure 11 is that the processing of wafers time of each piece among chambers 140A, 140B, 140C, the 140D is the situation of 100sec, 70sec, 60sec, 50sec.

The longest process chamber is process chamber 140A processing time in this case, so as S110, the S120 step of adopting Fig. 2, process chamber 140A is process chamber P1, its processing time is T _P1, process chamber 140B is process chamber P2, its processing time is T _P2, process chamber 140C is process chamber P3, its processing time is T _P3, process chamber 140D is process chamber P4, its processing time is T _P4Therefore in this case, obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery, wafer W _P3Time of delivery obtain wafer W with the relation of process chamber P1 and process chamber P3 _P4Time of delivery obtain with the relation of process chamber P1 and process chamber P4.But obtaining wafer W _P3, W _P4The situation of time of delivery under, for unified benchmark takes out interval T _X, use and obtaining wafer W _P1And wafer W _P2Time of delivery the time benchmark determined take out interval T _XDescribe such wafer transport time method of obtaining below in detail.

At first obtain wafer W with the relation of process chamber P1 and process chamber P2 _P1And wafer W _P2Time of delivery.Just, obtain stand-by period T by S410 shown in Figure 9～S440 step _Wk, T _W1Minimum m, n.Be m=2, n=3.Then by S450～S470 step, wafer W _P1, W _P2Benchmark take out interval T _XFor processing time 70sec * 3 of process chamber P2 (=210sec), wafer W _P1, W _P2Wafer take out the ratio (W of number _P1: W _P2) be 2: 3.For wafer W _P1Wafer take out to be spaced apart and take out interval T at benchmark _XTwo of the every taking-ups of (=210sec), processing time TP1 (=100sec) take out one interval, for wafer W _P2Wafer take out to be spaced apart and take out interval T at benchmark _XThree of every taking-ups in the (=200sec), at each processing time T _P2(=70sec) respectively taken out one interval.

Obtain the wafer W of in process chamber P3, handling with the relation of process chamber P1 and process chamber P3 then _P3Time of delivery.In this case, take out interval T owing to determined benchmark _X=210sec obtains wafer W with it _P3Time of delivery.Specifically, the situation with shown in Figure 8 is identical.Therefore the wafer W of handling at process chamber P1 _P1, the wafer W handled at process chamber P3 _P3Wafer take out the ratio (W of number _P1: W _P3) be 1: 3, for wafer W _P3Wafer take out to be spaced apart and take out interval T at benchmark _XThree of the every taking-ups of (=210sec), at each processing time T _P3(=30sec) respectively taken out one interval.

Obtain the wafer W of in process chamber P4, handling with the relation of process chamber P1 and process chamber P4 then _P4Time of delivery.In this case, take out interval T owing to determined benchmark _X=210sec obtains wafer W with it _P4Time of delivery.Specifically, the situation with shown in Figure 8 is identical.Therefore the wafer W of handling at process chamber P1 _P1, the wafer W handled at process chamber P4 _P4Wafer take out the ratio (W of number _P1: W _P4) be 1: 4, for wafer W _P4Wafer take out to be spaced apart and take out interval T at benchmark _XFour of the every taking-ups of (=210sec) are at each processing time T _P4(=50sec) respectively taken out one interval.

The wafer transport time as using is taken out each wafer W from box container 134 _P1, W _P2, W _P3, W _P4, the processing program of chambers P1, P2, P3, P4 as shown in figure 11.In this case, take out interval T at each benchmark _XAmong the inherent process chamber P1 of (=210sec) with stand-by period T _W1(=10sec) handled each two wafer W continuously _P1, in process chamber P2, be 0 with the stand-by period, handle each three wafer W continuously _P2, in process chamber P3 with stand-by period T _W3(=30sec) handled each three wafer W continuously _P3, in process chamber P4 with stand-by period T _W4(=10sec) handled each four wafer W continuously _P4

As described above in detail, as adopting present embodiment, because according to the wafer W of managing throughout among chamber P1, the Pk _P1, W _PkProcessing time T _P1, T _Pk,, take out wafer W from box container 134 according to the wafer transport time of in each process chamber P1, Pk, obtaining in advance _P1, W _PkSo, manage throughout when carrying out processing of wafers side by side among chamber P1, the Pk, can make from the wafer take-off time realization of box container 134 and the processing time T chambers P1, the Pk _P1, T _PkBecome to add most identical.The wafer W of in long process chamber P1 of processing time, handling for example _P1, can be with corresponding to its processing time T _P1The interval of length taken out the wafer W of in short process chamber WPk of processing time, handling simultaneously from box container 134 _Pk, can be with corresponding to its processing time T _PkThe interval of weak point taken out from wafer.

Therefore can eliminate the wafer W of handling among the process chamber P1 that resembles now such processing time length _P1In common transfer chamber 150, long-time standby such as load locking room 160M, 160N, locator 137, and short process chamber T of processing time _PkWafer W _PkCan not so can improve the running rate of managing chamber P1, Pk throughout, can improve the treatment effeciency of substrate board treatment integral body from the situation of box container 134 taking-ups.

The processing of obtaining the wafer transport time of above-mentioned in addition such present embodiment was carried out before the processing of wafers of reality.For example adding in the heat run when the power connection of substrate board treatment, carry out.Also can under the situation of the maintenance of after this substrate board treatment being carried out part replacement and cleaning etc., after safeguarding, this carry out in addition.

In addition in the present embodiment, in order to obtain the wafer transport time, before carrying out actual processing of wafers, obtain wafer transport during the time, obtain according to the predicted value in processing time of chambers corresponding to the processing time of chambers.To consider that because of attached to the processing environments such as fine-particle powder in the process chamber, the processing of wafers time of reality is departed from above-mentioned predicted value.Also to consider in addition according to the difference of handling, change the situation that the part of treatment conditions as the basis (for example the flow-rate ratio of chamber pressure, temperature, processing gas, be applied to the parameter of voltage on the electrode etc. etc.) is handled, and the situation of replenishing new treatment conditions (parameter etc.).Under these circumstances, worry that also the processing time departs from above-mentioned predicted value.

Manage so throughout under processing time of chamber situation different, revise the wafer take-off time more again with predicted value.Can obtain the wafer take-off time corresponding to the actual treatment time of chambers like this, can prevent to manage throughout the chamber and depart from the uncertain stand-by period of causing with the actual processing time.

Be illustrated being fit to embodiments of the present invention with reference to accompanying drawing above, but be not to be defined in example of the present invention.Very clear those of ordinary skill in the art in this way in the scope of being narrated, can expect the example of various variations or the example of correction in the scope that patent requires, also be interpreted as certainly for these to belong to technical scope of the present invention.

For example in the above-described embodiment, enumerate the example of the substrate board treatment of the so-called integrated equipment type that around the common transfer chamber, connects a plurality of process chambers, understand processing unit, but except load locking room being connected on the process chamber at processing unit, a plurality of processing units are connected in parallel on beyond the substrate board treatment of the so-called tandem type on the supply unit, the present invention also goes for having the substrate board treatment that a plurality of process chambers carry out various pattern of parallel processing.

Industrial applicibility

The present invention go for to processed substrate implement predetermined processing substrate board treatment and The base board delivery device of substrate board treatment.

Claims (11)

1. substrate board treatment is characterized in that having:

Processing unit has a plurality of process chambers that are used for implementing predetermined processing on processed substrate;

Supply unit is connected this and handles on the unit;

The conveying mechanism of supply unit side is arranged on the described supply unit, and the described processed substrate that is housed in the substrate accepting container is carried to described processing unit; With

The conveying mechanism of processing unit side is arranged on the described processing unit, the described processed substrate of carrying from described supply unit carried to described process chamber,

Has control device, according to the processing time of the described processed substrate in the described chambers, each described chambers is obtained the chambers when described substrate accepting container takes out described processed substrate described processed substrate the taking-up number ratio and take out at interval, take out the ratio of number and take out at interval from described substrate accepting container and take out described processed substrate and carried according to this to described chambers.

2. substrate board treatment as claimed in claim 1 is characterized in that,

Take out in each interval at interval at the benchmark of determining by the processing time of the described processed substrate of described chambers, obtain the ratio of the taking-up number of described processed substrate according to managing the polylith number of manageable described processed substrate in the chamber throughout, the taking-up of described processed substrate be at interval as described chambers described benchmark take out at interval described in the piece number of ratio of taking-up number of processed substrate, in each processing time of the described processed substrate of described chambers, respectively take out the interval that plot takes out.

3. substrate board treatment as claimed in claim 2 is characterized in that,

According to the processing time of the described processed substrate of described chambers, suppose that the processing time of the process chamber that in described chambers processing time is the longest takes out under the situation at interval as described benchmark, according in this benchmark takes out interval section, the polylith number of manageable described processed substrate in other process chambers is obtained the ratio of the taking-up number of described processed substrate.

4. as claim 2 or 3 described substrate board treatments, it is characterized in that,

Take out each interval stand-by period at interval according to the benchmark in described chambers, determine that described benchmark takes out at interval, shortens its stand-by period.

5. the substrate carrying method of a substrate board treatment is characterized in that,

This substrate board treatment has:

Processing unit has a plurality of process chambers that are used for implementing predetermined processing on processed substrate;

Supply unit is connected this and handles on the unit;

The conveying mechanism of supply unit side is arranged on the described supply unit, and the described processed substrate that is housed in the substrate accepting container is carried to described processing unit; With

The conveying mechanism of processing unit side is arranged on the described processing unit, the described processed substrate of carrying from described supply unit carried to described process chamber,

According to the processing time of the described processed substrate in the described chambers, each described chambers is obtained the chambers when described substrate accepting container takes out described processed substrate described processed substrate the taking-up number ratio and take out at interval,

When described processed substrate is handled, according to the ratio of described taking-up number with take out at interval, take out described processed substrate and carried to described chambers from described substrate accepting container.

6. the substrate carrying method of substrate board treatment as claimed in claim 5 is characterized in that,

Take out in each interval at interval at the benchmark of determining by the processing time of the described processed substrate of described chambers, obtain the ratio of the taking-up number of described processed substrate according to the polylith number of managing manageable described processed substrate in the chamber throughout,

The taking-up of described processed substrate be at interval as described chambers described benchmark take out at interval described in the piece number of ratio of taking-up number of processed substrate, in each processing time of the described processed substrate of described chambers, respectively take out the interval that plot takes out.

7. the substrate carrying method of substrate board treatment as claimed in claim 6 is characterized in that,

According to the processing time of the described processed substrate of described chambers, suppose that the processing time of the process chamber that in described chambers processing time is the longest takes out under the situation at interval as described benchmark, according in this benchmark takes out interval section, the polylith number of manageable described processed substrate in other process chambers is obtained the ratio of the taking-up number of described processed substrate.

8. as the substrate carrying method of claim 6 or 7 described substrate board treatments, it is characterized in that,

According to the stand-by period in the taking-up of the benchmark in described chambers each interval at interval, determine that described benchmark takes out at interval, shortens its stand-by period.

9. the substrate carrying method of a substrate board treatment is characterized in that,

By being contained in the described processed substrate of polylith in the substrate accepting container, carry to the process chamber that will handle according to the ratio and the following taking-up intervening sequences of the following taking-up number of obtaining in advance respectively, described processed substrate is handled in that a plurality of process chambers are parallel

This method has:

Obtain according to processing time of the described processed substrate of described chambers and definite benchmark take out the described chambers at interval interval described processed substrate the taking-up number ratio operation and

According to the ratio of the taking-up number of described processed substrate, obtain the taking-up operation at interval of the described processed substrate of described chambers.

10. the substrate carrying method of substrate board treatment as claimed in claim 9 is characterized in that,

The operation of obtaining the ratio of described processed substrate taking-up number has:

In hypothesis in described chambers in the longest process chamber of processing time, a processing time of handling a described processed substrate is being taken out under the situation at interval as described benchmark, obtaining in this benchmark takes out at interval interval the operation that the polylith of in other process chambers manageable described processed substrate is counted n;

Is that benchmark takes out under the situation at interval in hypothesis with the processing time of handling a processed substrate in the longest process chamber of described processing time, obtains the operation of the stand-by period of described other process chambers in described benchmark takes out at interval interval;

In described other process chambers, is being that benchmark takes out under the situation at interval in hypothesis with the processing time of handling the described processed substrate of n+1 piece, obtains the operation of the stand-by period of the longest process chamber of in described benchmark takes out at interval interval described processing time; With

These stand-by period are compared, under the situation of stand-by period smaller or equal to the stand-by period of described other process chambers of the longest process chamber of described processing time, described benchmark taken out be specified to the processing time of handling a processed substrate in the longest process chamber of described processing time at interval, and described processed substrate is taken out likening to of number is 1: n, under the situation of stand-by period greater than the stand-by period of described other process chambers of the longest process chamber of described processing time, described benchmark is taken out the processing time that is specified to the described processed substrate of processing n+1 piece in described other process chambers at interval, and described processed substrate is taken out likening to of number is 1: the operation of n+1

The taking-up operation at interval of obtaining described processed substrate has following operation:

Ratio at the taking-up number of described processed substrate is 1: under the situation of n, the taking-up number of the described processed substrate in the longest process chamber of described processing time is regarded as the interval of one of in described benchmark takes out at interval every taking-up at interval, and the taking-up number of the described processed substrate in described other process chambers is regarded as at interval at described benchmark and taken out at interval every taking-up n piece, should take out one interval in the processing time at each;

Ratio at the taking-up number of described processed substrate is 1: under the situation of n+1, the taking-up number of the described processed substrate in the longest process chamber of described processing time is regarded as the interval of taking out one of every taking-up at interval at described benchmark at interval, and the taking-up number of the described processed substrate in described other process chambers is regarded as at interval at described benchmark and taken out at interval every taking-up n+1 piece, should take out one interval in the processing time at each.

11. the substrate carrying method of substrate board treatment as claimed in claim 9 is characterized in that,

The operation of ratio of obtaining the taking-up number of described processed substrate has:

In hypothesis in described chambers in the longest process chamber of processing time, a processing time of handling the described processed substrate of m piece is being taken out under the situation at interval as described benchmark, obtaining in this benchmark takes out at interval interval the operation that the polylith of in other process chambers manageable described processed substrate is counted n;

In the longest process chamber of described processing time, is being that benchmark takes out under the situation at interval in hypothesis with the processing time of handling the processed substrate of m piece, obtains the operation of the stand-by period of described other process chambers in described benchmark takes out at interval interval;

Is that benchmark takes out under the situation at interval in hypothesis with the processing time of handling the described processed substrate of n+1 piece in described other process chambers, obtains the operation of the stand-by period of the longest process chamber of in described benchmark takes out at interval interval described processing time;

Change described m, the polylith of obtaining described processed substrate is counted the stand-by period of the longest process chamber of the stand-by period of n, described other process chambers, described processing time, makes minimum m of stand-by period of the longest process chamber of stand-by period of described other process chambers and described processing time, the operation of n; With

Having determined m, the stand-by period of the process chamber that the stand-by period of described other process chambers during n and described processing time are the longest compares, under the situation below the stand-by period of stand-by period at described other process chambers of the longest process chamber of described processing time, described benchmark taken out be specified to the processing time of handling the processed substrate of m piece in the longest process chamber of described processing time at interval, and described processed substrate is taken out likening to of number be m: n, under the situation of stand-by period more than the stand-by period of described other process chambers of the longest process chamber of described processing time, described benchmark is taken out the processing time that is specified to the described processed substrate of processing n+1 piece in described other process chambers at interval, and the operation that is m: n+1 that likens to of described processed substrate being taken out number

The taking-up operation at interval of obtaining described processed substrate has following operation:

Ratio at the taking-up number of described processed substrate is under the situation of m: n, the taking-up number of the described processed substrate in the longest process chamber of described processing time is regarded as at interval with described benchmark and is taken out at interval every taking-ups m piece, should take out one interval in the processing time at each, and the taking-up number of the described processed substrate in described other process chambers is regarded as at interval at described benchmark and taken out the every taking-up n piece in interval, should take out one interval in the processing time at each;

Ratio at the taking-up number of described processed substrate is under the situation of m: n+1, the taking-up number of the described processed substrate in the longest process chamber of described processing time is regarded as at interval at described benchmark and is taken out at interval every taking-ups m piece, should take out one interval in the processing time at each, and the taking-up number of the described processed substrate in described other process chambers is regarded as at interval at described benchmark and taken out the every taking-up n+1 piece in interval, should take out one interval in the processing time at each.

Images