CN100391318C - Electronic device with switching structure and its switching method - Google Patents
Electronic device with switching structure and its switching method Download PDFInfo
- Publication number
- CN100391318C CN100391318C CNB2003101036676A CN200310103667A CN100391318C CN 100391318 C CN100391318 C CN 100391318C CN B2003101036676 A CNB2003101036676 A CN B2003101036676A CN 200310103667 A CN200310103667 A CN 200310103667A CN 100391318 C CN100391318 C CN 100391318C
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- China
- Prior art keywords
- circuit board
- keyset
- building brick
- electronic building
- adapter structure
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Abstract
The present invention relates to an electronic device with an adaptor structure. The electronic device with the adaptor structure mainly comprises a first circuit board, an electronic component which is arranged on the first circuit board, an adapter board which is provided with a hollow part, and a second circuit board, wherein the adapter board is arranged between the first circuit board and the second circuit board; the electronic component is contained in the hollow part.
Description
Technical field
The present invention relates to a kind of electronic installation with adapter structure, particularly relate to a kind of can containment circuit board on the adapter structure of electronic building brick.
Background technology
Surface mount technology (surface mount technology, SMT) be pin with electronic building brick be welded in and electronic building brick with one side, this technology need not at the printed circuit board (PCB) upper drill hole, so the electronic building brick of can all burn-oning on the two sides of circuit board, so can increase the density that circuit board carries electronic building brick.Wherein with ball grid array (ball grid array, BGA) and leadless chip carrier (leadless chipcarrier, technology LCC) is the most common.
So-called ball grid array (BGA) technology is to place the weldering grain of one deck sphere between electronic building brick and circuit board, and the heater circuit plate makes the fusing of weldering grain then, can link to each other with circuit board and make chip need not lead-in wire.Between electronic building brick and circuit board the technology of available BGA, the connection of two circuit boards also can be used the technology of BGA, as shown in Figure 1a, circuit board 10 is equipped with electronic building brick 16, if circuit board 10 will be done with circuit board 20 and be electrically connected, then places one deck solder ball array 14 between circuit board 10 and circuit board 20, heater circuit plate 10 and circuit board 20, make solder ball array 14 fusings and make circuit board 10 be connected in circuit board 20, thus, the electronic signal of circuit board 10 can be sent to circuit board 20.
Shown in Fig. 1 b, if on the circuit board 10 except carrying electronic building brick 16, more be equipped with electronic building brick 18 at another side, and the height of electronic building brick 18 is during greater than the diameter of tin ball 14, then circuit board 10 is done to be connected with circuit board 20 usefulness BGA technology difficulty can be taken place, therefore must between circuit board 10 and circuit board 20, design a kind of structure that is connected, make when all being equipped with electronic building brick, circuit board 10 and circuit board 20 are electrically connected with the generation of BGA technology on the two sides of circuit board 10.
Except the BGA technology do be electrically connected, circuit board 10 and circuit board 20 also can be used leadless chip carrier (LCC) and do and be electrically connected.Shown in Fig. 1 c, the feature of LCC technology mainly is to offer groove at the edge of circuit board 100, simultaneously on circuit board 20, be provided with corresponding metal gasket (metal pad) corresponding to this each groove position, scolder is positioned on the metal gasket, heater circuit plate 100 and circuit board 20, can rise along groove by capillary effect from metal gasket after the scolder melted by heat, last cooled and solidified is finished being electrically connected of circuit board 100 and circuit board 20.Identical with the BGA technology, when the another side of circuit board 100 was equipped with electronic building brick 180, the LCC technology also met with and can't make circuit board 100 and circuit board 20 do the problem that is electrically connected, shown in Fig. 1 d.Therefore the structure that also needs a kind of connection when making the two sides of circuit board all be equipped with electronic building brick, also can make circuit board 100 produce with the LCC technology with circuit board 20 and be electrically connected.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of adapter structure, when making the two sides of a circuit board all carry electronic building brick, can be connected with another circuit board by this adapter structure.
Electronic installation with adapter structure of the present invention comprises: a first circuit board; One first electronic building brick is located on the first circuit board; One first keyset is provided with one first hollow bulb; One second circuit board; First keyset is arranged between first circuit board and the second circuit board, and first electronic building brick can be contained in first hollow bulb.By above-mentioned structure, first circuit board can be by first keyset be done with second circuit board and is electrically connected.
In a preferred embodiment of the present invention, this electronic installation with adapter structure comprises that a plurality of first tin balls are located on this first keyset, and is contacted with first circuit board, and a plurality of second tin ball is located on first keyset, and is contacted with second circuit board.By the setting of above-mentioned tin ball, can use the BGA technology and first circuit board and second circuit board be done be electrically connected.
Again, in another preferred embodiment, the edge of the first circuit board of electronic installation is provided with a plurality of first grooves, and the bearing of trend of first groove is provided with a plurality of second grooves at the edge of first keyset corresponding to first groove simultaneously perpendicular to this first, second circuit board.By above-mentioned structure, can use the LCC technology and first circuit board and second circuit board be done be electrically connected.
In another preferred embodiment of the present invention, electronic installation also comprises: one second electronic building brick is arranged on this second circuit board; And one second keyset, be provided with one second hollow bulb; This second keyset is arranged between this first keyset and this second circuit board, and this second electronic building brick is contained in this second hollow bulb.By above-mentioned structure, second keyset can hold second electronic building brick of being located on the second circuit board, and first circuit board is finished and being electrically connected of second circuit board.
In another preferred embodiment, electronic installation comprises that also a plurality of the 3rd tin balls are located on this first keyset, and be contacted with this first circuit board, a plurality of the 4th tin balls are located on this second keyset, and be contacted with this second circuit board, and a plurality of the 5th tin ball is located between this first keyset and this second keyset.By the setting of tin ball, can use the BGA technology and first circuit board and second circuit board be done be electrically connected.
In another preferred embodiment, first keyset of electronic installation can be provided with a plurality of connecting elementss, and above-mentioned connecting elements comprises one first contact site, one second contact site and a junction, and this connecting portion connects this first contact site and this second contact site.Wherein first contact site is contacted with first circuit board, and second contact site is contacted with second circuit board, and connecting portion is embedded in first keyset.By the setting of connecting elements, can finish being electrically connected of first circuit board and second circuit board equally.
Again, in another preferred embodiment, above-mentioned this each connecting elements centers on one first hollow bulb, and is staggered between the connecting elements individuality, constitutes a closely staggered array.By this arrangement mode, metal connecting elements can become the screen that is contained in first electronic building brick in the hollow bulb, to prevent electromagnetic interference.
The present invention also provides a kind of electronic installation with adapter structure, comprising: a first circuit board; One first electronic building brick is located on this first circuit board; One first keyset, it has one first and one second, and is provided with one first hollow bulb, and the edge of this first keyset is provided with a plurality of grooves, and the junction near the groove on the keyset on this first circuit board is provided with metal gasket; One second circuit board; Wherein, this first keyset is electrically connected with this first circuit board and this second circuit board respectively, and this first keyset is arranged between this first circuit board and this second circuit board, and this first electronic building brick is contained in this first hollow bulb.
Description of drawings
Fig. 1 a is the existing schematic diagram of using the connection of BGA technology between circuit board;
Fig. 1 b is that electronic building brick is all carried on the two sides of circuit board, and can't use the schematic diagram of BGA technology;
Fig. 1 c is the existing schematic diagram of using the connection of LCC technology between circuit board;
Fig. 1 d is that electronic building brick is all carried on the two sides of circuit board, and can't use the schematic diagram of LCC technology;
Fig. 2 a is the schematic diagram of the adapter structure of first embodiment of the invention;
Fig. 2 b is the front view of the keyset of first embodiment of the invention;
Fig. 2 c is the vertical view of the keyset of first embodiment of the invention;
Fig. 3 a is the schematic diagram of the adapter structure of second embodiment of the invention;
Fig. 3 b is the front view of the keyset of second embodiment of the invention;
Fig. 3 c is the vertical view of the keyset of second embodiment of the invention;
Fig. 4 a is the schematic diagram of the adapter structure of third embodiment of the invention;
Fig. 4 b is the front view of the keyset of third embodiment of the invention;
Fig. 4 c is the vertical view of the keyset of third embodiment of the invention;
Fig. 5 is the schematic diagram of the adapter structure of fourth embodiment of the invention;
Fig. 6 a is the schematic diagram of the adapter structure of fifth embodiment of the invention;
Fig. 6 b is the stereogram of the keyset of fifth embodiment of the invention;
Fig. 6 c is the cutaway view along the A-A line of Fig. 6 b.
Embodiment
First embodiment
Shown in Fig. 2 a, the one side of first circuit board 200 is equipped with electronic building brick 26, and another side is equipped with electronic building brick 28.First circuit board 200 was done by keyset 29 and second circuit board 20 and was electrically connected this moment, and 28 of electronic building bricks can be contained in the hollow bulb 23 of keyset 29.
Shown in Fig. 2 b, Fig. 2 c, because present embodiment is used the BGA technology, therefore a plurality of tin balls 22 are located on the adapter surface of keyset 29, then are provided with a plurality of tin balls 24 on another adapter surface of keyset 29.During assembling, tin ball 22 is contacted with first circuit board 200, and tin ball 24 is contacted with second circuit board 20, heating first circuit board 200 and second circuit board 20, and then tin ball 22,24 is understood fusing and is finished being electrically connected of first circuit board 200, keyset 29 and second circuit board 20.
Second embodiment
Shown in Fig. 3 a, the one side of first circuit board 300 is equipped with electronic building brick 36, and another side is equipped with electronic building brick 38.First circuit board 300 was done by keyset 39 and second circuit board 20 and was electrically connected this moment, and electronic building brick 38 can be contained in the hollow bulb 33 of keyset 39.
Shown in Fig. 3 b, Fig. 3 c,, therefore around keyset 39, a plurality of grooves 32 are set, and metal gasket 34 are set in the junction near the groove on the keyset 39 32 on the first circuit board 300 because present embodiment is used the LCC technology.During assembling, scolder places in the metal gasket 34, heats first circuit board 300 and keyset 39 then, and the scolder melted by heat also rises along groove 32 by capillary effect, finishes being electrically connected of first circuit board 300 and keyset 39 thus.And the connected mode of 39 of the electric connecting mode of keyset 39 and 20 of second circuit boards and above-mentioned first circuit board 300 and keysets is identical.Groove 32 places corresponding to keyset 39 on second circuit board are provided with corresponding metal gasket (not shown), then scolder are placed on this metal gasket, and heating second circuit board 20 and keyset 39 make solder fusing and rise to finish along groove 32 and be electrically connected.
The 3rd embodiment
Present embodiment is in conjunction with BGA technology and LCC technology, shown in Fig. 4 a, carries electronic building brick 26 and does by keyset 49 and second circuit board 20 with 28 first circuit board 200 and be electrically connected, and electronic building brick 28 is contained in the hollow bulb 43.
Shown in Fig. 4 b, Fig. 4 c, be provided with a plurality of grooves 42 around the keyset 49, simultaneously on keyset 49, be provided with a plurality of tin balls 44 and be contacted with first circuit board 200, thus, first circuit board 200 adopts the BGA technology with being connected of keyset 49, as described in first embodiment, and keyset 49 is to adopt the LCC technology with being connected of second circuit board 20, as described in second embodiment.
The 4th embodiment
The two sides of first circuit board 200 is equipped with electronic building brick 26 and 28 respectively, if an electronic building brick 52 is equipped on the second circuit board 20, and first circuit board 200 must be connected with second circuit board 20 at electronic building brick 52 whereabouts, then must use two-layer keyset can finish being electrically connected of first circuit board 200 and second circuit board 20.
As shown in Figure 5, between first circuit board 200 and second circuit board 20, be provided with first keyset 501 and second keyset 502, electronic building brick 28 is contained in first hollow bulb 5013 that is located at first keyset 501, and electronic building brick 52 then is contained in second hollow bulb 5023 that is located at second circuit board 20.Present embodiment is used the BGA technology, therefore between the first circuit board 200 and first keyset 501, be provided with a plurality of tin balls 5012, between first keyset 501 and second keyset 502, be provided with a plurality of tin balls 5014, be provided with a plurality of tin balls 5024 between second keyset 502 and second circuit board 20, heating makes 5012,5014,5024 fusings of tin ball and finishes being electrically connected of first circuit board 200 and second circuit board 20.
The 5th embodiment
Shown in Fig. 6 a, the one side of first circuit board 200 is equipped with electronic building brick 26, and another side is equipped with electronic building brick 28.First circuit board 200 was done by keyset 69 and second circuit board 20 and was electrically connected this moment, and 28 of electronic building bricks can be contained in the hollow bulb 63 of keyset 69.
Fig. 6 b represents the stereogram of the keyset 69 of present embodiment.Fig. 6 c is along the cutaway view of A-A line among Fig. 6 b.Keyset 69 is provided with a plurality of switching members 64, and shown in Fig. 6 c, switching member 64 is after inserting keyset 69 with the copper of sheet or column, to bend to the Contraband font, comprises first contact site 641, second contact site 642 and connecting portion 643.First contact site 641 is contacted with first circuit board 200, and second contact site 642 is contacted with second circuit board 20, inserting tin cream between first contact site 641 and the first circuit board 200 and between second contact site 642 and the second circuit board 20 during assembling, heating makes tin cream melt setting and hardening then then, finishes being electrically connected of first circuit board 200 and second circuit board 20 thus.
And for example shown in Fig. 6 b, Fig. 6 c, a plurality of connecting elementss made of copper 64 are arranged in concentric shape around hollow bulb 63 alternately, with regard to the electronic building brick in being contained in hollow bulb 63 28, connecting elements 64 so is staggered and can reaches effect as airtight metallic shield (shielding), add the shop copper (trace) that is provided with on first, second circuit board 200,20, can form as airtight metal veil electronic building brick 28, and reach the effect of shielding.
By keyset provided by the present invention, the two sides all can be carried the circuit board of electronic building brick and another circuit board does and is electrically connected, and but the BGA in the application surface mount technology and LCC technology are reached, by the setting of metal connecting elements, can reach the effect of shielding simultaneously to the electronic building brick that is contained in the hollow bulb.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit the present invention; any skilled personnel can do some change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined without departing from the spirit and scope of the present invention.
Claims (13)
1. electronic installation with adapter structure comprises:
One first circuit board;
One first electronic building brick is located on this first circuit board;
One first keyset, it has one first and one second, and is provided with one first hollow bulb, and this first face on this first keyset is provided with a plurality of first tin balls, and is electrically connected with this first circuit board;
One second circuit board;
Wherein, this first keyset is electrically connected with this first circuit board and this second circuit board respectively, and this first keyset is arranged between this first circuit board and this second circuit board, and this first electronic building brick is contained in this first hollow bulb.
2. the electronic installation with adapter structure as claimed in claim 1, it comprises that also a plurality of second tin balls are located on this first keyset this second, and is contacted with this second circuit board.
3. the electronic installation with adapter structure as claimed in claim 1 wherein is provided with a plurality of first grooves at the edge of this first circuit board, and the bearing of trend of this each first groove is perpendicular to this first, second circuit board.
4. the electronic installation with adapter structure as claimed in claim 3, wherein the edge of this first keyset is provided with a plurality of second grooves corresponding to this each first groove, and the bearing of trend of this each second groove is perpendicular to this first, second circuit board.
5. the electronic installation with adapter structure as claimed in claim 1, wherein the edge of this first keyset is provided with a plurality of the 3rd grooves, and the bearing of trend of this each the 3rd groove is perpendicular to this first, second circuit board.
6. the electronic installation with adapter structure as claimed in claim 1, it also comprises:
One second electronic building brick is arranged on this second circuit board; And
One second keyset is provided with one second hollow bulb;
This second keyset is arranged between this first keyset and this second circuit board, and this second electronic building brick is contained in this second hollow bulb.
7. electronic installation with adapter structure comprises:
One first circuit board;
One first electronic building brick is located on this first circuit board;
One first keyset, it has one first and one second, and be provided with one first hollow bulb, also have a plurality of connecting elementss, insert among this first keyset, this each connecting elements is for to be staggered to interlaced array individually, and wherein this each connecting elements comprises one first contact site, one second contact site and a junction;
One second circuit board;
Wherein, this first keyset is electrically connected with this first circuit board and this second circuit board respectively, and this first keyset is arranged between this first circuit board and this second circuit board, and this first electronic building brick is contained in this first hollow bulb.
8. the electronic installation with adapter structure as claimed in claim 7, wherein this connecting portion is embedded in this first keyset and with this first contact site and is connected with this second contact site, and this first contact site and this second contact site expose to this first and this second of this first keyset respectively.
9. the electronic installation with adapter structure as claimed in claim 8, this first contact site, this second contact site and this connecting portion are formed in one.
10. the electronic installation with adapter structure as claimed in claim 8, wherein this first contact site is contacted with this first circuit board, and this second contact site is contacted with this second circuit board.
11. the electronic installation with adapter structure as claimed in claim 7, wherein this each connecting elements is around this first hollow bulb setting.
12. the electronic installation with adapter structure as claimed in claim 7, wherein this connecting elements is to make with metal.
13. the electronic installation with adapter structure comprises:
One first circuit board;
One first electronic building brick is located on this first circuit board;
One first keyset, it has one first and one second, and is provided with one first hollow bulb, and the edge of this first keyset is provided with a plurality of grooves, and the junction near the groove on the keyset on this first circuit board is provided with metal gasket;
One second circuit board;
Wherein, this first keyset is electrically connected with this first circuit board and this second circuit board respectively, and this first keyset is arranged between this first circuit board and this second circuit board, and this first electronic building brick is contained in this first hollow bulb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101036676A CN100391318C (en) | 2003-11-11 | 2003-11-11 | Electronic device with switching structure and its switching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101036676A CN100391318C (en) | 2003-11-11 | 2003-11-11 | Electronic device with switching structure and its switching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1617652A CN1617652A (en) | 2005-05-18 |
| CN100391318C true CN100391318C (en) | 2008-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101036676A Expired - Fee Related CN100391318C (en) | 2003-11-11 | 2003-11-11 | Electronic device with switching structure and its switching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100391318C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686886B (en) * | 2017-01-18 | 2019-11-29 | 维沃移动通信有限公司 | A kind of printed circuit board and mobile terminal |
| CN106804093A (en) * | 2017-03-28 | 2017-06-06 | 捷开通讯(深圳)有限公司 | Intelligent worn device, pcb board exchanging structure and its method for designing |
| CN109561579B (en) * | 2018-11-30 | 2021-04-30 | Oppo（重庆）智能科技有限公司 | PCB assembly, manufacturing method of PCB assembly and electronic equipment |
| CN110636701B (en) * | 2019-10-29 | 2021-01-08 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN113766818A (en) * | 2021-08-06 | 2021-12-07 | 展讯通信（上海）有限公司 | Multi-layer stack packaging assembly and packaging method of multi-layer assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4648666A (en) * | 1985-07-03 | 1987-03-10 | Amp Incorporated | Electrical connector |
-
2003
- 2003-11-11 CN CNB2003101036676A patent/CN100391318C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4648666A (en) * | 1985-07-03 | 1987-03-10 | Amp Incorporated | Electrical connector |
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| Publication number | Publication date |
|---|---|
| CN1617652A (en) | 2005-05-18 |
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