CN100383573C - 多光源照明系统 - Google Patents

多光源照明系统 Download PDF

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CN100383573C
CN100383573C CNB200380109097XA CN200380109097A CN100383573C CN 100383573 C CN100383573 C CN 100383573C CN B200380109097X A CNB200380109097X A CN B200380109097XA CN 200380109097 A CN200380109097 A CN 200380109097A CN 100383573 C CN100383573 C CN 100383573C
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tube core
light
led tube
array
led
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CN1742217A (zh
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G·D·汉森
B·A·迪伯恩
M·A·梅森
J·C·舒尔茨
J·J·斯姆巴尔
R·D·戴维斯
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3M Innovative Properties Co
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60QARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0011Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor with light guides for distributing the light between several lighting or signalling devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/143Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/151Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/155Surface emitters, e.g. organic light emitting diodes [OLED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/24Light guides
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235Light guides
    • F21S43/251Light guides the light guides being used to transmit light from remote light sources
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073Light emitting diode [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/36642D cross sectional arrangements of the fibres
    • G02B6/36722D cross sectional arrangements of the fibres with fibres arranged in a regular matrix array
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/368Mechanical coupling means for mounting fibres to supporting carriers with pitch conversion between input and output plane, e.g. for increasing packing density
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/20Lighting for medical use
    • F21W2131/202Lighting for medical use for dentistry
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/20Lighting for medical use
    • F21W2131/205Lighting for medical use for operating theatres
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
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    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425Optical features
    • HELECTRICITY
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    • H01L2224/484Connecting portions
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    • H01L2224/48475Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
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    • H01L2224/48479Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/58Optical field-shaping elements

Abstract

照明系统(100)包括一组LED管芯(104)。还设置了一组相应的光波导(122),各波导具有第一与第二端,各第一端与相应的LED管芯保持光学联系。一相应无源光学元件阵列(120)插在多个LED管芯与多个光波导相应的第一端之间。该照明系统提供相当高的光耦效率和不相干光输出,对观察者来说,光输出似乎从单一光点产生。此外,可在一个或多个地点以一个或多个方向输出光。

Description

多光源照明系统
发明背景
发明领域
本发明涉及发光或照明组件与系统,尤其涉及高耦合效率的多光源照明系统。
背景技术
照明系统应用于各种场合,家庭、医院、牙科和工业场合都要求照明,同样地,飞机、轮船与汽车也要求高强度的照明束。
传统照明系统使用电气供电的灯丝或弧光灯,有时包括把产生的照明形成束的聚光镜和/或反射表面。但在有些场合,诸如游泳池照明,要求最后的光输出位于不希望电气接触的环境。在另一些场合,诸如汽车头灯,则希望把光源从外露的易损坏位置移到更安全的地点。而在还有一些场合,物理空间、易接近性等限制或设计因素,要求光源位于不同于要求最后照明的地点。
根据某些此类要求,已用光波导开发了把光从光源导向期望照明点的照明系统。一种流行方法是用明亮的单光源或者靠近在一起的成组光源构成单一照明源,该源发出的光利用聚光镜引入单个光波导诸如大纤芯塑料光纤,由后者把光射到远离该源的地方。在另一种方法中,用一束光纤取代了单根光纤。
目前诸方法的效率极低,有时产生的光要损耗约70%。在多光纤系统中,束内光纤间的暗填隙空间和把光引入光纤束的效率造成了这些损耗。在单纤系统中,单纤的直径大得足以捕获明亮照明场合所需的光量,因而变得太粗,失去了小范围内布设与弯曲的灵活性。
有些发光系统把激光器用作光源,利用其相干光输出和/或低发散角的优点,但激光源通常产生单波长输出色,而照明系统一般要求更宽带的白光源。例如,美国专利5,299,222讨论了用单波长大功率激光二极管把能量耦入波长敏感的增益媒体,与用作照明源相反。使用束形状不对称的特定激光二极管,为更有效地耦入光纤,要求广泛地使用光束整形元件。而且,有些激光二极管因操作时发热,要求严格的温度(如要求使用热电致冷器等),使用起来很昂贵。此外,集中的封装型LED阵列会导致热管理区问题。
要求有一种能用光源提供高强度照明的发光系统。
发明内容
本发明涉及一种发光或照明组件,尤其涉及一种高耦合效率照明系统,包括多个能远离照明输出排列的光源。
本发明的发光或照明系统,这里称为照明设备,包括多个LED管芯、相应的多个光波导和相应的光学元件阵列,其中各光波导具有第一与第二端,各第一端与相应的LED管芯保持光联系,而光学元件插在多个LED管芯与多个光波导相应第一端之间。
在诸实施例中,光源是各个LED管芯或芯片或激光二极管。波导包括光纤,诸如聚合物包层石英光纤。多个光波导的第一端接收光源发出的光,第二端可以成束或排列或受照射时形成单个光照明源。
光学元件包括无源光学元件,诸如输入导光或聚光元件阵列,其中各波导第一端与至少一个导光/聚光元件保持光学联系,而且该导光/聚光元件阵列插在LED管芯与多个光波导第一端之间与它们保持光学联系。
在一示例实施例中,该光学元件阵列包括一反射器阵列,这些反射器成形为保持LED管芯光源小的聚光本领(e′tendue),使该聚光本领与受光光纤的聚光本领(正比于纤芯面积与接受角的乘积)基本匹配。反射器阵列可以形成在衬底内,诸如多层光学膜(MOF)或金属化衬底或薄片。
该照明设备还包括至少一个输出导光元件,诸如准直、汇集或束成形元件,把来自第二端的光导成单一照明源、输出导光元件包括一导光元件阵列,其中各第二端与至少一个导光元件保持光学联系。
或者,多个波导包括多根光纤,输出导光元件在多根光纤各第二端上包括光纤透镜。同样地,光纤第一端还可包括光纤透镜。
在另一实施例中,照明设备还包括第二组LED管芯和第二组光波导,每组光波导都有第一端与第二端,第二组光波导各第一端与第二组LED管芯之一保持光学联系。在一示例实施例中,第二组光波导的第二端与第一组光波导的第二端包成束,受照射时构成单一光照明源。或者,第一组光波导的第二端形成在第一束内,第二组光波导的第二端形成在第二束内,构成以同向或不同方向引导的分离照明输出。
这些第一和第二光源的发射光谱可以不同。在一特定实施例中,第一组LED管芯的发射谱基本上是白光,而第二组LED管芯包括一红外源。在另一实施例中,两组(或更多组)LED管芯包括可混合非白色的不同色彩。第一和第二组LED管芯可以被逐一或一起照射,以改变照明源强度。
该系统还可包括至少一个输出光学元件和第二输出光学元件,前者被光耦成沿第一光路引导第一组光波导第二端的输出光,后者被光耦成沿第二光路引导第二组光波导第二端的输出光。
此类实施例可用作汽车或其它车辆或平台的头灯照明系统。在一实施例中,照射光源阵列特定数量的LED芯片,可控制头灯光源强度,例如可对低束照射第一组LED管芯,对高束照射第一和/或第二组LED管芯。
在另一实施例中,照明系统还包括一红外传感器,如用于碰撞探测、照明和/或遥测。
在另一实施例中,照明设备还包括
第二组LED管芯;
第二组光纤,各光纤具有第一和第二端,其中各第一端与第二组LED管芯的一LED管芯保持光学联系;和
其中光学元件阵列插在第一和第二组光纤一相应第一端与该相应LED管芯之间。
第二组光纤的第二端能与第一组光纤的第二端扎成束,在受照射时构成单一光照明源。
第一和第二组LED管芯的发射光谱可以不同。
第一和第二组波导能包括第一和第二组光纤,其中第一组光纤的第二端扎在第一束里,第二组光纤的第二端扎在第二束里,而第一束输出发射的第一方向与第二束输出发射的第二方向不同。
照明设备的该实施例还可包括:
第三组LED管芯,和
第三组光纤,各光纤具有第一与第二端,其中各第一端与第三组LED管芯的一LED管芯保持光学联系。
较佳地,第一组LED管芯发红光,第二组LED管芯发蓝光,而第三组LED管芯发绿光。
较佳地,LED管芯阵列的输出发射以选择的色温产生光。
以上的发明内容并不描述本发明的每个示例实施例或每一实施方法,附图和下面的详细将更具体地说明这些实施例。
附图简介
图1是本发明一实施例的照明系统透视图。
图2是用于本发明一实施例的照明系统的光源简化的截面侧视图。
图3是本发明一实施例中一部分光源和反射器表面的详图。
图4是表示反射器点曲线形绘图的曲线,假设最大发射角为80度,LED管芯与反射器的间距为30微米。
图5是本发明一实施例中聚光元件实施例的截面侧视图。
图6a示出一例单受光光纤,图6b示出一例受光光纤束。
图7是本发明一实施例中互连LED管芯阵列和用于照明系统的聚光元件阵列的部分分解图。
图8~11是本发明用于照明系统的光学连接器其它实施例的截面端视图。
图12简化示出电缆组件同时制造与端接的组装设备。
图13是本发明一实施例的车辆照明系统的分解透视图。
图14是一例多层高密度固态光源的结构。
图15和16是荧光粉封装的LED管芯的示例结构。
虽然本发明能改成各种修正与替代形式,但其特定形式以举例方式示于诸附图并将作详述。不过应理解,本发明并不限于所述的诸特定实施例,而是包括落在附权利要求限定的本发明范围内的所有修正、等效物与替代方案。
发明的详细描述
通常,以前的光纤照明设计都遇到过高耦合损失的问题,因而效能极差。本发明的照明系统保证了高得多的光耦效率,而且提供的不相干光输出可被观察者视为从单光点发出。另外,本发明诸实施例表明,可用LED管芯阵列提供可在一个或多个地点输出的高密度远地光源。再者,本发明诸实施例提供的LED管芯阵列,可形成一种在一个或多个地点单独或同时产生一色或多色的高密度远地光源。此外,当操作中使用条件改变时,可改变光源的色彩或色彩组合,以适合特定的应用要求。下面讨论其它诸示例实施例。
图1示出本发明实施例中远程发光系统100的第一实施例。明亮的LED管芯104阵列102被定位成光学对准光学元件阵列110,后者包括一组聚焦镜112等无源光学元件或反射器120(见图2)等聚光元件。光学元件阵列110再光学对准波导阵列124,后者包括一组光纤122等光波导。波导阵列124可以连接化,连接化包括支承和/或容纳光纤受光端122的连接器132,还可包括支承和/或容纳光纤输出端122的连接器130。示例的连接器结构示于图8~11,下面描述。阅读了本描述的本领域技术人员会明白,光纤122的输出端可成束为点状源有形阵列,诸如直线阵列、圆阵列或其它有形阵列。
阵列102由分立LED阵列104诸如单一LED管芯或芯片阵列组成,管芯或芯片逐一安装,具有独立的操控电气连接线(不是用其公共半导体衬底互连所有LED的LED阵列)。LED管芯能产生对称辐射图案,使它们成为本发明期望的光源。LED管芯有效地把电能转换成光,不像大多数激光二极管那样对温度敏感,因而与多种激光二极管相比,只要用合适的散热片就可正常工作。在一实施例中,各LED管芯与最近管芯的间距至少大于LED管芯的宽度。
此外,LED管芯可在-40~125℃温度内工作,工作寿命达100,00小时,相比之下,大多数激光二极管的寿命为10,000小时,卤素汽车头灯的寿命为500~1000小时。在一实施例中,各LED管芯的输出强度约50流明或以上。分立的大功率LED管芯可向Cree与Osram等公司购买。在一实施例中,各管芯的发光面积为300μm×300μm的LED管芯阵列(Cree制造),可形成聚焦的(小面积,大功率)光源。还可应用其它发光表面形状,诸如矩形或其它多边形。另在诸替代实施例中,可在顶面或低面设置所用的LED管芯的发光层。
在替代实施例中,用白VCSEL阵列代替了LED阵列,该光源光学元件阵列110可将各VCSEL发出的光再导入相应的光纤122。
图1所示实施例的一个方面是在各光源、相应的无源光学元件(透镜、聚焦、聚焦或反射元件)和相应波导之间的一一对应关系。通电时,各LED管芯104作为各个光源把它射相应的各根柔性光纤122。本实施例包括大纤芯(如400μm~100μm)聚合物包层石英光纤(如以商标TECS市售的光纤,由3M公司(St.Paul,MN)出售)。根据LED管芯光源的输出波长等参数,本发明诸实施例还可应用其它类型光纤,诸如常规或专用的玻璃光纤。
此外,如读过本说明书的技术人员所知,根据本说明书内容,还可应用其它波导类型,诸如平面波导、聚合物波导等。
光纤122的各输出端还可包括光纤透镜,同样地,各光纤受光端也可包括光纤透镜。光纤透镜的制造与构制在共同拥有和共同未决的美国专利申请号10/317,734与10/670,630中有描述,通过引用包括在这里。
示于图13、下面将详述的本发明一特定实施例,是用柔性TECS光纤使光源与头灯互连的LED驱动型汽车头灯的实施方案。该例的一个方面是以减少LED光源数量而产生所需亮度与光束图案的方式有效地把LED光耦入TECS光纤。
如图2所示,可对各LED管芯104加一个成形的反射器120,以把光从LED芯104再导入相应的光纤122,后者的示例纤芯直径约600μm~650μm。在一实施例中,各反射器结构向受光光纤提供非成像的照明光汇集与分布。成形反射器120可用多层光学薄膜(MOF)诸如购自3M公司(St.Paul,MN)的增强型镜面反射器(ESR)膜构成·MOF的实例通常在美国专利No.5,882,774与5,808,794中有详述,通过引用包括在这里。
或者,可将反射器120以合适形状形成在金属塑料基片内,并涂布反射材料,如银、铝或无机薄膜反射多层堆,例如形成注入模塑料膜或片。在其内形成的反射器腔涂布合适的反射材料。如本文所述,反射器阵列被定向成在LED管芯下面、周围或上方。此外,反射腔还可装填折射率匹配材料。
再参照图1,各根光纤122汇集一起在离原始光源某一距离作远程发光。在一特定实施例中,光纤122在输出连接器130中聚集成紧密束,而输出连接器代替例如聚光灯或头灯组件里的灯泡或灯丝。在题为“Solid State LightDevice”的共同未决与共同拥有的申请中(案卷号No.59349US002)中,进一步描述了作为灯泡替代而植入的LED基发光组件,通过引用包括在这里。
再参照图2,在一实施例中,应用了裸露的蓝色或紫外LED管芯。在有些实施例中,LED管芯较佳地在发光表面涂布荧光层106,诸如YAG:Ce荧光粉。荧光层106把LED管芯的蓝色输出转换成“白”光。
在一替代实施例中,可将一组红蓝绿LED管芯选排成一阵列,光纤阵列122收集得出的发射,当混合一致时,观察者将光纤输出端发出的光看成有色光或“白”光。
如图2所示,荧光层可以安装或形成在LED管芯的发射表面。在本发明一实施例中,如图15所示,为了基本上保持或减少LED管芯表面发射的聚光本领劣化,可以精密地限定荧光层506。“基本上保持”指LED管芯的聚光本领被维持或增大为二倍或不到一些。
如图15所示,荧光层506形成在LED管芯504上,后者是装在衬底540上的表面。在一实施例中,LED管芯504是蓝色或紫外表面发光LED。衬底540为LED管芯阴极与阳极接入提供导电表面,例如一个或多个引线键合545可从衬底的电接触表面541耦合到LED管芯504顶面的一个或多个键合片546,或者,引线键合545不必键合到LED管芯的顶面。
荧光层506位于LED管芯大体上对应于其发射表面的区域上或附近。应理解,LED管芯一般通过不止一个表面发射辐射。层506的厚度形成得基本上均匀(如75μm~150μm),层再固化(局部或全部)。该例中,层506接着通过消融。管芯切割或其它合适的技术转换成某种或多种形状,表面变形最小,与LED管芯发射表面相配。或者,还可使层506欠尺寸或过尺寸,或形成与LED管芯发射表面形状不同的形状。应用LED管芯阵列时,荧光层可直接形成在各LED管芯表面,或者该荧光层作为独立的涂膜部分,在LED管芯阵列表面或附近施加选择性图案的荧光粉。下面以及在题为“Multiple LED Sourceand Method for Assembling Same”(案卷号59376US002)的共同未决和共同拥有的申请中,再讨论另一种荧光粉定向,该申请内容通过引用包括在这里。
在一实施例中,把荧光层506形成为加荧光粉密封剂,例如可以应用YAG:Ce荧光粉和紫外固化环氧(诸如Nor/and NOA81紫外固化环氧)。加荧光粉密封剂能局部或全部固化。在局部固化态中,荧光粉密封剂在引线键合周围流动,使引线键合密封,并把荧光粉与引线键合都粘附于管芯表面。若使用疏水密封材料,可提高电气互连的可靠性。荧光粉密封剂可以是低模量材料,使LED管芯升降温引起的有害作用最小。此时,可用此种可变形密封剂补偿LED管芯材料与荧光材料之间的热膨胀系数(CTE)失配。
若荧光密封剂全固化,可在LED管芯表面设置一附加粘层(与引线键合一样厚),例如该附加粘层用淀积或浸涂术形成在LED管芯表面。这样,可用附加粘层密封引线键合,而荧光密封剂可与LED管芯表面作元空隙接触(通过粘剂)。
以上严格限定的荧光层结构可基本上保持LED管芯发光表面的聚光本领。该例中,荧光层面积基本上与发光表面面积一样。另外,由于荧光层具有增大的厚度,把把其厚度控制到合适的量,以提高其两侧发出的光量。此外,为确定特定场合的正确荧光层厚度,可使用色温与色均一些等参数。
在图16的替代实施例中,为大体上保持LED管芯源的聚光本领,可进一步限定荧光层形状。这里,LED管芯504经引线键合545耦合到衬底540,包括接触表面541。如上所述,在LED管芯发光表面504上形成荧光层506。此外,在荧光层506上用消融或划片技术形成倾斜表面507。
再参照图2,反射器120可将LED管芯104发出的光耦合光纤122。同样如图2所示,可形成在LED管芯上滑动的反射器,使其下面的开口123与LED管芯104周边紧配合。另一种反射器设计包括在支承LED管芯的衬底上附加使用一反射层。在题为“Reflective Light Coupler”的同时提交的共同拥有和共同未决的专利申请中(案卷号59121 US002),详细了其它反射器设计,通过引用包括在这里。
该光学系统一个重要方面是反射器120的反射表面121。反射器120可用注入模、转移模、精密复制、模压、冲压或热成形构成,其内形成反射120的基片(单独地或作为反射器阵列一部分)包括金属、热塑材料或MOF等各种材料。为提高其的反射率,构成反射器120的基片材料可涂布反射层或直接抛光。
反射器表面121的形状,被设计成将来自包括涂荧光粉LED管芯的LED管芯的各向同性发射转换成符合受光光纤如TECS光纤的接收角指标的光束,从而保持LED管芯发出的光的功率密度。一旦LED管芯发出的光被发射器收集并再导入受光光纤,则可用光纤通过全内反射把光送到远处,光学损失很低,但荧光光纤并不是运送光。此外,根据本发明诸实施例,通过把光纤从LED管芯阵列较宽的间距平移在较紧密的间距,诸如密实包装的光纤束,可将来自广泛分散的LED阵列的光有效地聚集成极小的区域。而且,该示例TECS纤芯与包层的光学设计,鉴于光纤输入端与输出端的数值孔径(NA),保证了对发自束端的光束的整形。如本文所述,受光光纤除了光传送外,还实行光聚集与光束成形。
聚光本领即ε可用下式计算:
ε=A×Ω≈π×A×sin2θ=π×A×NA2
式中Ω是发射或接收立体角(立体弧度),A为接收体或发射体面积,θ是发射或接收角,NA为数值孔径。
例如,假设NA为0.48、直径为600微米(μm)的纤芯,可被光纤接收与发射的聚光本领为0.2mm2立体弧度(sr)。还假设,示例LED管芯的最大发射表面为300μm×300μm(即90000μm2),而且在有荧光粉的示例实施法中,LED管芯具有接近各向同性或Lambertian强度分布。设半角为80度,则LED管芯的聚光本领约为0.28mm2sr。因此,使用本文所述的反射器表面设计与定向,虽然不是所有来自LED管芯的光都被该光纤收集到,但是大部分光(50%或以上)可被受光光纤收集并发射。
如上所述,在光输出用荧光层转换为“白”光的实施例中,为保持LED管芯发射表面的聚光本领,可以限制荧光层的大小和/或厚度。
改进或优化反射器形状,能使传入光纤的光增强或甚至最大。图3示出对近似Lambertion发射的分布型光源优化反射器形状的一般几何形状,图3是图2中反射器表面121的细部,添加了角度与坐标轴术语。
图3的一般几何图形表明,对一镜表面上的给定点,来自LED管芯的光以到达角θ:撞击镜表面。再者,镜上的该点位于(x,y),镜在该点相对于垂线成φj角,于是从镜表面反射的光束可被示成相对于该垂线成某一角度:
θi-2×φj=入射角
它将是光纤的入射角。
光纤和LED在该例中提出的发光约束条件为:
1.LED/荧光粉光源尺寸:直径300微米
2.LED/荧光汾发射角:±80°
3.TECS光纤尺寸:纤芯直径600微米
4.TECS光纤接收角:NA 0.48=入射角±28.7°
为简化分析,牺牲了某些通用性而作出一些假设。
以下分析的限制因素为:
·全光源尺寸不予考虑,因该模型为矩形而非圆形,实际光源尺寸为300μm×300μm的方形。
·忽略了LED管芯离反射器最近部分发出的大角度光。
·光以小于±28.7°接收角的角度反射入(或直接射入)光纤,故反射束约束条件为|θi-2φj|≤28.7°。
·LED/荧光粉的光发射角近似各向同性,故与垂线可变化8°~80°半角。80°最大角建立第一分析点坐标(x,y)。
·小于28.7°的发射角被认为直接入射光纤。
·结构呈旋转对称(见以上限制因素)。
分析中假设反射器曲线的最低点处于入射角,由最大发射角θI=90-80=10°控制。对-x值而言,这一假设限定了定向为φj的反射器的y值或位置。如在图2中,若假设反射器向LED 104右方移动30微米,则反射器上第一点的(x,y)位置计数为330×tan(90-80),即58微米。
知道了该反射器点的y位置,假设x坐标系在LED(本例假定为圆形)最远边缘移离300微米,就可把LED/荧光粉上与最近点的最小角度算为
Figure C20038010909700131
。对于y=58微米的反射点,最小发射角为27.3°。
有了计算的最小和最大发射角θI,可用公式1和第一约束条件算出最大和最小反射器角φj,使反射光线射入光纤。继续用该例,反射器角约为0.7°~25.7°。
对小于80°最大值的各种角度重复这种计算,可用数值估算反射器形状。表1中,该角度以1°增量递减到约29°的光纤接收角。
运用发射器的(x,y)值阵列,可根据离选择的(x,y)点最近的两个(x,y)对的偏导数(差值)估算该法产生的递增反射器角。在最大80°角的该例中,初始反射器角为17.5°。
根据该图表,对于该法生成的曲线,多项式回归拟合为y=5E-06x4-0.0068x3+3.6183x2-859.5x+76443(R2=1.0),如图3所示,坐标系原点在LED(假设为圆形)左边缘。
下面的表1对80度最大发射角和LED边缘与反射器边缘的间距为30微米的情况示出了示例的计算。根据表1,该表最后一例算出了实际曲线计算的φj值。若实际反射器把LED光反射入光纤,而且在斜体字中若有些LED光被反射在光纤接收角之外,这些值就以黑体字标记。计算表明,除了镜表面顶部,发射的光都可被反射入光纤。图4绘出了文中列出诸反射器点的曲线形状,假设最大发射角为80度,LED与反射器相隔30微米。该图示出圆管芯模型的三种表示,中央的y图代表LED管芯中心到最近边缘的最小内接圆,多项式(中央y)是中央y数据的多项式拟合。注意,四次多项式为准确拟合,二次多项式的R2=0.997。
表1
最大角  x        y          最小角      φmin     φmax    φj
80      330      58.2       27.3         ..0.7     25.7    17.5
79      332      64.5       26.4         ..1.2     25.2    17.2
78      334      71.0       25.6         ..1.5     24.7    16.9
77      336      77.6       24.9         ..1.9     24.2    16.6
76      338      84.3       24.3         ..2.2     23.7    16.3
75      340      91.1       23.7         ..2.5     23.2    16.0
74      342      98.1       23.2         ..2.8     22.7    15.7
73      344      105.2      22.7         ..3.0     22.2    15.4
72      346      112.4      22.3         ..3.2     21.7    15.1
71      348      119.8      21.8         ..3.4     21.2    14.8
70      350      127.4      21.4         ..3.6     20.7    14.5
69      352      135.1      21.0         ..3.8     20.2    14.2
68      354      143.0      20.7         ..4.0     19.7    13.9
67      356      151.1      20.3         ..4.2     19.2    13.6
66      358      159.4      20.0         ..4.3     18.7    13.3
65      360      167.9      19.7         ..4.5     18.2    13.0
64      362      176.6      19.3         ..4.7     17.7    12.7
63      364      185.5      19.0         ..4.8     17.2    12.3
62      366      194.6      18.7         ..5.0     16.7    12.0
61      368      204.0      18.4         ..5.1     16.2    11.7
60      370      213.6      18.1         ..5.3     15.7    11.4
59      372      223.5      17.9         ..5.4     15.2    11.1
58      374      233.7      17.6         ..5.6     14.7    10.8
57      376      244.2      17.3         ..5.7     14.2    10.5
56      378      255.0      17.0         ..5.8     13.7    10.2
55      380      266.1      16.7         ..6.0     13.2    9.9
54      382      277.5      16.5         ..6.1     12.7    9.6
53      384      289.4      16.2         ..6.2     12.2    9.3
52      386      301.6      15.9         ..6.4     11.7    9.0
最大角      x      y        最小角      φmin   φmax    φj
51          388    314.2    15.6        -6.5    11.2     8.7
50          390    327.2    15.4        -6.7    10.7     8.4
49          392    340.8    15.1        -6.8    10.2     8.1
48          394    354.8    14.8        -6.9     9.7      7.8
47          396    369.3    14.6        -7.1    9.2      7.6
46          398    384.3    14.3        -7.2    8.7      7.3
45          400    400.0    14.0        -7.3    8.2      7.0
44          402    416.3    13.8        -7.5    7.7      6.7
43          404    433.2    13.5        -7.6    7.2      6.5
42          406    450.9    13.2        -7.7    6.7      6.2
41          408    469.4    13.0        -7.9    6.2      5.9
40          410    488.6    12.7        -8.0    5.7      5.7
39          412    508.8    12.4        -8.1    5.2      5.4
38          414    529.9    12.1        -8.3    4.7      5.2
37          416    552.1    11.9        -8.4    4.2      4.9
36          418    575.3    11.6        -8.5    3.7      4.7
35          420    599.8    11.3        -8.7    3.2      4.4
34          422    625.6    11.0        -8.8    2.7      4.2
33          424    652.9    10.8        -9.0    2.2      4.0
32          426    681.7    10.5        -9.1    1.7      3.7
31          428    712.3    10.2        -9.2    1.2      3.5
30          430    744.8    9.9         -9.4    0.7      3.3
29          432    779.3    9.6         -9.5    0.2      3.1
28          434    816.2    9.3         -9.7    -0.3
使镜表面上部也将光反射入光纤的至少一种方法,将使曲线分段断续,例如使上面400微米部分直接垂直(φj=0)。
在若干不同实施法中,以上反射设计可按阵列方式实施,如图7的一例耦合至电气在连装置142的LED管芯光源阵列104,可设置在基片上的电路层141上(诸如柔性电路或半加性柔性电路,包括购自3M公司的3MTM柔性电路)。LED管芯104表面安装到层141,或者凹入柔性电路层里形成的接收孔。作为上述引线键合连接的替代法,在应用柔性电路时可作另一种LED阵列电气互连,比如通过化学除去介质如聚酰亚胺而形成悬臂引线,该工艺可让一根或二根引线伸出。与LED管芯上的电气触点作超声或引线键合。这类悬臂互连引线比引线键合引线更小,基本上平坦。
如上所述,荧光元件106可将LED管芯发射谱光的输出波长转换到期望的照明光谱。而且,相应的反射器阵列120可用来形成无源光学元件阵列110,该阵列被形成在精密复制的反射器层111中,有效地把来自LED管芯的光耦合到匹配的光纤阵列122,如图1所示。反射器层包括一MOF(如3M公司的产品),里面形成开口的反射器腔。或者,层111包括用注入模制材料构成的反射器120,反射层(如银、铝、金、无机介质堆等)设置或涂布在内壁上(如图2的表面121)。另外,反射器120可用模压或冲压的反射器形状的金属片形成。
另外,把一荧光材料图案配到阵列层110顶部或底部,可使前述的荧光层106有选择地形成图案。虽然图7示出方形的LED管芯阵列,但可根据应用要求,使用具有相关光学元件、电气互连、荧光元件和反射形状的规则或不规则的LED光源阵列。此外,运用这一示例设计,可用基准标记149对准备别阵列层。下面参照图14描述一例多LED管芯光源的多层结构。
图5示出一例LED管芯104的安装结构或基片140。基片140可提供一条LED管芯104散热的低阻热通路。在该实施例中,LED管芯104置于阱151中,通常常规连接,诸如应用焊料或金属(如Au-Su)回流管芯连接,可将裸露的LED管芯104连接至基片140。基片140还支承一电路层。该例中,可对基片140涂上反射膜143。另如图5所示,悬臂引线148可从互连电路层键合到LED管芯上。
图5中,荧光材料106设置在反射器底部,涂布在与反射器底部层迭的层上,在与反射器底部层迭的层上选择性形成图案,或以较佳的方法淀积在LED管芯顶上。
在一实施例中用硬性或柔性的互连电路层形成互连。本文描述的柔性电路材料购自3M公司。在图5实例中,柔性电路层的介质(如聚酰亚胺)部分145设置在反射膜143上。此外,柔性电路层的导电部分147,诸如铜导体和/或其它金属化(如Ni/Au)可设置在聚酰亚胺部分145上作互连。
或者,可将柔性电路层倒置,使裸露的LED管芯居于聚酰亚胺表面的凹部,直接在金属/电路层147上。在该实施法中,不必在基片材料140中形成阱。根据管芯电气连接要求,可在柔性电路的导电部分与基片之间设置热导率良好的电气绝缘材料。在题为“Illumination Assembly”的共同未决和共同拥有的申请中(案卷号59333US 002),描述了互连电路的示例实施法,通过引用包括在这里。
一种可能性能较低组成本较廉的替代实施例,包括用作电气互连的基于普遍FR4环氧的印刷线路板结构。在另一实施例中,通过在合适的基片上形成连接LED管芯阵列所需的导电环氧或导电油墨图案,可制备廉价电路。
如上所述,光纤与LED管芯的一对一关系能保证较高的照明效率。为示明该道理,图6a示出一种有纤芯125a和包层125b的单光纤125。图6b示出19根光纤125组成的束127。例如,要求照射束127的光束有效面积为0.0017平方英寸(0.011平方厘米),光纤125的外径各为0.028英寸,芯径为650微米。19根发光纤芯127的面积为0.0010平方英寸(0.0065平方厘米)。假设是一种均匀分布的光源,则耦入波导的光量正比于波导的输入面积;因此,图中的光耦效率比为0.0010/0.0017,即60%。
本发明的优点是有效地把光射入纤束各根光纤。若使用单光源,则效率明显下降,原因在于未控制的光发射角度和对光纤包层的光耦以及束内光纤间的间隙空间。因而不使各个LED与对应的光纤匹配的传统,会因束光纤间的暗区而损失25~40%的发射光,所以此类系统要求紧密的多光纤成束,但聚光仍较少。
但在本发明中,根据光纤直径,荧光光纤被形成极紧密的输出阵列,产生极密集的集中光发射。
由于本发明的各根受光光纤的直径较小,它们可像束那样而设和弯曲,束截面有多种几何形状,诸如图形、螺旋形、矩形或其它多边形。本发明诸实施例使远程供电的光源被聚集改向到通常不能有效得到照明电力的地方。
例如在诸如图13所示的车辆头灯应用中,本发明提供的高度聚集的光源,大小和形状类似于灯丝,故反射表面或折射中整形并投射发出的光。图13是汽车远程发光系统300的实施例,包括把汽车电源(未示出)耦至LED管芯阵列304的耦合器301。LED管芯304表面安装在互连电路层341上,后者置于由上述热传导材料制作的基片340上。该例中,可在该在连电路层上通过键合设置反射器形状阵列320,使各裸管芯通过反射表面围绕在其周边。由LED管芯发出并由发射器阵列收集/聚集的光,被有选择地指向透镜阵列312,而后者把发射的光集中到相应光纤322的输入端。
如图13所示,输入连接器332用来夹持光纤输入端322。该例的各别光纤可以成束为两组光纤351和352,在不同地点(如左右车辆头灯374和375)输出光。输出连接器331A和331B把成束的光纤组夹持在其各自的头灯里,这样就能使用“冷“头灯,因为热光源(即发光源--LED管芯阵列)远离最后的照明输出区。这种结构减少了对头灯内光学元件如反射器、涂膜、透镜与其它有关光学元件的热损伤。
在另一实施例中,诸如图13系统300的照明系统,还包括一红外传感器。该例中,一个或多个LED管芯阵列包括一红外发光LED管芯。这种红外LED管芯可以是普通IR LED管芯,如Honeywell的产品。该系统还包括一接收IR信号的普通IR检测器。该实施例可用于碰撞检测。此外,其它传感器比如环境光传感器,可用于自动灯光管制场合和/或自动接通有灰尘的灯具。因而在该例中,本发明的照明系统既能照明,又能遥测。或者,可包含一红外收发设备,把它与照明系统构成一体或分开。
图8~11示出各种连接器实施例,它们能提供廉价结构,用于本文描述的照明系统与组件。
图8示出的输入连接器132a的设计便于光纤122顶装或底装,保证n×n光纤阵列以预定节距对应于纤缆组件输入端上的光源阵列。该例的连接器132a为二件结构,有齿135的顶部133设计成接合底件134里的光纤122。连接器底部134包括接收光纤122的槽136和实现固定配合的齿135。该结构不仅保证了廉价组伯,还能以一步法组装二维阵列。其它二维连接器设计要求“堆迭”多层V槽连接器。
图9示出的n×n阵列输入选择器132b可从顶部与底部装光纤122。该例的连接器132b为三件结构,其中连接器包括中央部132,其光纤接收槽138被顶部133′和底部134′包封。或者,连接器132b由单一集成结构形成,这种设计也可用一步法制作二维连接器。为此,例如图12的组装机有两个光纤阵列代替一个宽的直线光纤阵列。
图10示出顶装或底装的输入连接器132c的设计,衬垫139用来设定光纤间的列节距。该设计把“衬垫”插入而形成二维阵列,不用堆迭V槽层。
图11示出纤缆组件输出连接器130的设计,用于顶装,适合密集封装光纤122而形成集中的照明源。本领域技术人员阅过本说明书后显然会明白,还可应用其它连接器设计。
图12示出可用来制造这些器件的自动化组装方法,图示的一列式纤缆组件(INCA)工艺能同时制造和端接纤缆组件。例如共同拥有的美国专利5,574,817和5,611,017描述了该INCA工艺,其内容通过引用包括在这里。INCA系统200由N个光纤卷盘阵列202组成,并盘具有向INCA组装机210进料的光纤。利用精密间隔开的导梳212使光纤222以特定的期望节距进入阵列,通常该节距是端接一特定连接器设计所需的节距。一旦按节距将光纤传到连接器组装台230,由至少连接器底部231与连接器盖232组成的器元件就移入光纤阵列的上下位置。连接器底部231和盖232以预定间隔沿光纤阵列长度组合在一起再对准,然后捕获阵列的光纤。连接器组件以机械法或粘合法,诸如通过使用层压辊240和粘带242与光纤接合而形成端接的纤缆组件。若组装单个连接器,则机器输出为连接化引出端(连接器在一端的纤缆)。在相对略隔开的位置装两只连接器,则机器输出连接化的跨接纤缆250(连接器在两端的纤缆)。从连接化观点出发,组装的连接器与光纤继续通过机器,在光纤阵列和连接器上安装保护纤缆套。
图14示出一例多层高密度固态光源400结构的分解图,按照上述诸实施例,该结构耦接光纤,形成远程光源。第一层即基片440被选为支承LED管芯阵列404的基片。如上所述,基片440包括铜等高热导率材料,而且基片440导电,可对LED管芯阵列404提供供电母线或接地母线。LED管芯404用常规技术包括焊、粘等接合到基片440,然后在LED管芯上设置粘层405。粘层405包括切口图案,切口对应于LED管芯的位置与节距。
为设置电气连接,再在图案化粘层405上设置图案化柔性电路层441,包括为LED管芯404提供接触的导电图案442。通常,在有些设计中,LED管芯要求两种电气连接,一种连接在LED管芯顶部,另一种连接在LED管芯底部,而在其它设计中,两种连接都在顶部。该例中,柔性电路层441包括对应于LED管芯阵列的切口。通过柔性电路层441上的电路图案442对LED管芯作顶部连接,通过基片440作底部连接。用标记449保证基片与柔性电路层441的正确对准。
无源光学元件阵列410诸如形成于精密复制反射器片411的反射器420,可将发自LED管芯的光耦合到相应的波导阵列。该例中,片411包括反射器阵列420。按照上述诸实施例,反射器420可形成在多层光学薄膜里,或包括模制、机制或模压的由反射(如塑料、金属)片构成的形状,反射片以与LED管芯一样的节距形成图案。反射器还可在反射器腔内包括一透镜形状。另外,图案化荧光粉可包含在反射器腔内或接合到片411顶部或底部。
用另一图案化粘层445将阵列410粘连于柔性电路层441,仍用标记449对准。选用能在基片与反射器阵列之间提供高接合强度和/或绝缘的粘料。另外,粘料还能减小基片与反射片的热膨胀系数(CTE)之间的失配所引起的应力。
在一替代实施例中,柔性电路层与反射器阵列的位置可以互换,例如柔性电路层引线可通过反射器腔布设而接到LED管芯接合片。
与原有系统相比,上述照明组件与系统有若干优点。首先,可应用较小的LED管芯,诸如上述的那些,照明强度无损失。在上述诸实例中,阵列中诸LED管芯在物理上分开,避免了安装结构中出现热点,该结构允许对LED管芯作更强的电驱动,输出照明更强(因而光纤输出端发出更明亮的输出束)。密集封装大量LED管芯是一长期可靠性问题,因而即使有整体有效的热传导机理,局部发热仍分缩短LED寿命,在极端情况下造成灾害性故障。把LED管芯分开得比其宽度更远,可使适用的热传导其片将热量从LED阵列中排出,不形成局部热点。若配有足够的排热能力,LED管芯还能安全地工作于比一般操作规范所述更高的电流与光输出。另与灯丝光源相比,本发明的LED管芯阵列在正向引导光束中不产生会导致灯丝发热的强烈发热。这种强烈发热会损伤有时用于发光元件诸如汽车头灯的聚合物透镜与反射器组件。
第二个优点是每个LED耦合一根光纤。原有系统把密集的LED阵列耦入大直接的光纤或光纤束。密集LED阵列存在前述的可靠性问题,但其实施已被证明将光耦入光纤的效率最佳(牺牲可靠性)。每个LED光源配一根光纤,使LED管芯在物理上分开,可将上述由密集LED产生的局部热效应减至最小。
另一优点是电气互连布线。如前述柔性电路举例说明的薄层电气布线(如25~50微米),提供了电气互连,对管芯发热有一定热传导作用,还可层迭平坦的电气互连结构。得出的结构在整体上为一极薄层,故其光学性能不成问题。该平薄层使整个阵列层迭为高可靠的实心或近似实心的材料块,LED阵列(基片上)接合至电气互连层,后者再接合到反射器片。在题为“IllaminationAssembly”的未决与共同拥有的申请中(案卷号59333 US002),描述了互连电路具体实施法的优点,通过引用包括在这里。
本文所述照明设备的另一优点是整个组件的层迭或封装。图LED阵列与反射器腔可以填充固体材料如环氧或模制聚碳酸酯,整个组件可层压为无空隙的块状。电气设备里的空隙在有些场合是个可靠性问题,因为水分容易汇集在聚合物空隙里,造成长期可靠性问题。
还可在LED管芯前面设置成束反射器,而且反射器结构可用MOF构成,在对可见光波长和宽入射角范围保持反射率的同时,把它形成反射器形状。
另一优点就是所描述的保证所选输出色彩的荧光粉安置。原先设想应用保持LED的腔内的荧光粉,大量荧光粉淀积需要大量较昂贵的荧光粉,而且因荧光粉各向同性的发光,使LED显得比其实际尺寸更大,本身就劣化了LED光源的聚光本领,这样接着又显著降低了光耦入光纤或另一波导的效率,如以上诸实施例所述。
如图5所示的荧光粉106,可以涂在片上再在反射器底或顶部层压入结构,或直接淀积在LED表面。在粘剂中用一层涂布的荧光汾形成一薄层极均匀的荧光粉,有效地把LED能量转换成“白”光。该荧光粉层被精密地限定成不明显增大LED光源的视在尺寸,从而保证LED的聚光本领并提高系统耦合效率。在把加荧光粉的环氧直接或间接地淀积到LED发射表面上时,通过精密容量淀积极少量荧光粉,可减少荧光粉量,精密地保持LED发射区的尺寸。
本发明另一优点是能修改LED管芯阵列发出的色谱。虽然组合LED管芯色彩可形成“白”光,但若干实施例却用一荧光层把蓝色或紫外辐射转换成宽谱即“白”光。应用跨越LED管芯阵列的不同荧光粉,能以期望的色温产生“白”光。同样地,修改跨越LED管芯所用的荧光粉可产生各种色彩。
尽管把涂荧光粉片置于反射器阵列顶部并不导致光能最有效地耦入光纤阵列(因光纤接收角有限),但这种结构有益于大表面的高度发散阵列,密集的LED也没有局部热点。
虽然参照诸较佳实施例描述了本发明,但本发明可按其它特定形式实现而不违背发明范围,如诸实施例见诸于汽车头灯领域,但本照明系统可用于飞机、轮船、医学、工业、家庭和其它机动场合。因此应该理解,本文描述和图示的诸实施例只是示例,不得视为限制本发明的范围。根据本发明的范围,可以作出其它各种变型与修正。

Claims (11)

1.一种照明设备,其特征在于包括:
多个独立可控的LED管芯(104),用于生成光辐射;
多个光波导(122),其中每个光波导包括第一端与第二端,每个第一端与所述多个LED管芯中一相应的LED管芯保持光学联系;和
多个非折射光学元件(120),其中各光学元件插在相应的第一端与相应的LED管芯之间,每个非折射光学元件经成形把相应LED管芯发出的聚集光反射到相应的光波导中。
2.如权利要求1所述的照明设备,其特征在于,所述多个非折射光学元件包括一聚光元件阵列。
3.如权利要求1所述的照明设备,其特征在于,所述多个非折射光学元件包括形成在多层光学薄膜内的反射器阵列或开口腔金属化反射器阵列。
4.如权利要求2所述的照明设备,其特征在于,一荧光层层压在所述聚光元件阵列的顶表面与底表面之一上。
5.如权利要求3所述的照明设备,其特征在于,所述反射器阵列相对所述LED管芯设置,基本上保持各LED管芯的聚光本领。
6.如权利要求1所述的照明设备,其特征在于,对至少一个LED管芯的表面涂上一荧光层。
7.如权利要求6所述的照明设备,其特征在于,所述荧光层为加荧光粉环氧。
8.如权利要求7所述的照明设备,其特征在于,所述加荧光粉环氧的量足以至少部分地将各LED管芯的输出转换到另一波长,从而基本上保持各LED管芯的聚光本领。
9.一种车辆头灯,它包括如权利要求1所述的照明设备。
10.如权利要求1所述的照明设备,其特征在于,所述多个非折射光学元件包括一反射器阵列,所述阵列中的每个反射器有一入射孔和一出射孔,各LED管芯的发射表面在所述入射孔下面留出间隔。
11.如权利要求9所述的车辆头灯,其特征在于,所述多个非折射光学元件包括一反射器阵列,所述阵列中的每个反射器有一入射孔和一出射孔,各LED管芯的发射表面在所述入射孔下面留出间隔。
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EP1567894A2 (en) 2005-08-31
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US7360924B2 (en) 2008-04-22
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US7658526B2 (en) 2010-02-09
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