CN100339939C - 半导体装置以及其制造方法、电光学装置和电子机器 - Google Patents
半导体装置以及其制造方法、电光学装置和电子机器 Download PDFInfo
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- CN100339939C CN100339939C CNB031082947A CN03108294A CN100339939C CN 100339939 C CN100339939 C CN 100339939C CN B031082947 A CNB031082947 A CN B031082947A CN 03108294 A CN03108294 A CN 03108294A CN 100339939 C CN100339939 C CN 100339939C
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
Abstract
Description
Claims (20)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP200293321 | 2002-03-28 | ||
JP2002093321 | 2002-03-28 | ||
JP2003076904A JP4329368B2 (ja) | 2002-03-28 | 2003-03-20 | 半導体装置及びその製造方法 |
JP200376904 | 2003-03-20 |
Publications (2)
Publication Number | Publication Date |
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CN1448987A CN1448987A (zh) | 2003-10-15 |
CN100339939C true CN100339939C (zh) | 2007-09-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB031082947A Expired - Lifetime CN100339939C (zh) | 2002-03-28 | 2003-03-27 | 半导体装置以及其制造方法、电光学装置和电子机器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7101729B2 (zh) |
JP (1) | JP4329368B2 (zh) |
KR (1) | KR100515774B1 (zh) |
CN (1) | CN100339939C (zh) |
TW (1) | TWI239078B (zh) |
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WO2004047057A1 (ja) * | 2002-11-19 | 2004-06-03 | Ishikawa Seisakusho,Ltd. | 画素制御素子の選択転写方法、画素制御素子の選択転写方法に使用される画素制御素子の実装装置、画素制御素子転写後の配線形成方法、及び、平面ディスプレイ基板 |
TWI366701B (en) | 2004-01-26 | 2012-06-21 | Semiconductor Energy Lab | Method of manufacturing display and television |
JP2006049800A (ja) * | 2004-03-10 | 2006-02-16 | Seiko Epson Corp | 薄膜デバイスの供給体、薄膜デバイスの供給体の製造方法、転写方法、半導体装置の製造方法及び電子機器 |
JP3956955B2 (ja) * | 2004-04-22 | 2007-08-08 | セイコーエプソン株式会社 | 半導体基板の製造方法、電気光学装置の製造方法 |
JP4016968B2 (ja) * | 2004-05-24 | 2007-12-05 | セイコーエプソン株式会社 | Da変換器、データ線駆動回路、電気光学装置、その駆動方法及び電子機器 |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
KR101260981B1 (ko) * | 2004-06-04 | 2013-05-10 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치 |
WO2006011664A1 (en) | 2004-07-30 | 2006-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
BRPI0612113A2 (pt) * | 2005-06-29 | 2016-09-06 | Koninkl Philips Electronics Nv | embalagem para pelo menos um dispositivo semicondutor, subconjunto, e, métodos para fabricar um subconjunto e para fabricar uma embalagem |
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SG172621A1 (en) * | 2006-07-05 | 2011-07-28 | Univ Arizona | Method of temporarily attaching a rigid carrier to a substrate |
US8581393B2 (en) * | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
KR100826982B1 (ko) * | 2006-12-29 | 2008-05-02 | 주식회사 하이닉스반도체 | 메모리 모듈 |
WO2009011699A1 (en) * | 2007-07-18 | 2009-01-22 | Nanolumens Acquisition, Inc. | Voltage partitioned display |
DE102007061473A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
CN101556966B (zh) * | 2008-04-10 | 2010-12-15 | 中芯国际集成电路制造(上海)有限公司 | 一种可减小等离子体损伤效应的mos管 |
JP5401831B2 (ja) * | 2008-04-15 | 2014-01-29 | 株式会社リコー | 表示装置 |
JP2010211647A (ja) * | 2009-03-11 | 2010-09-24 | Seiko Epson Corp | タッチパネル装置、電気光学装置および電子機器 |
US8305294B2 (en) * | 2009-09-08 | 2012-11-06 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
JP5356532B2 (ja) * | 2009-10-08 | 2013-12-04 | シャープ株式会社 | 発光部を有する複数のパネルを繋げてなる発光パネル装置、それを備えた画像表示装置および照明装置 |
CN102640200B (zh) * | 2009-12-03 | 2014-10-29 | 夏普株式会社 | 图像显示装置、面板和面板的制造方法 |
KR101221871B1 (ko) * | 2009-12-07 | 2013-01-15 | 한국전자통신연구원 | 반도체 소자의 제조방법 |
TWI490426B (zh) * | 2011-07-29 | 2015-07-01 | Light emitting device | |
US8704448B2 (en) * | 2012-09-06 | 2014-04-22 | Cooledge Lighting Inc. | Wiring boards for array-based electronic devices |
KR102049735B1 (ko) * | 2013-04-30 | 2019-11-28 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
JP6076270B2 (ja) * | 2014-01-08 | 2017-02-08 | パナソニック株式会社 | ディスプレイ装置及びパネルユニット |
KR102396760B1 (ko) * | 2015-04-08 | 2022-05-11 | 삼성디스플레이 주식회사 | 표시 장치 |
CN112542468A (zh) * | 2016-07-05 | 2021-03-23 | 群创光电股份有限公司 | 显示装置 |
KR102254606B1 (ko) * | 2016-10-19 | 2021-05-21 | 가부시키가이샤 오르가노 서킷 | 액티브 매트릭스 led 디스플레이 |
WO2019014036A1 (en) * | 2017-07-11 | 2019-01-17 | Corning Incorporated | MOSAIC SCREENS AND METHODS OF MAKING SAME |
KR102599722B1 (ko) * | 2018-12-28 | 2023-11-09 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 타일드 표시 장치 |
TWI694280B (zh) * | 2019-03-05 | 2020-05-21 | 友達光電股份有限公司 | 顯示裝置及其製造方法 |
KR102084353B1 (ko) * | 2019-05-21 | 2020-03-03 | 김종하 | 태양광을 이용한 시트지형 led 조명장치 및 그 제조방법 |
KR102105806B1 (ko) * | 2020-02-12 | 2020-04-28 | 김종하 | 태양광을 이용한 시트지형 led 조명장치 및 그 제조방법 |
WO2021235114A1 (ja) * | 2020-05-20 | 2021-11-25 | ソニーグループ株式会社 | 表示モジュール、表示装置、およびセンサモジュール |
CN112599030B (zh) * | 2020-12-11 | 2022-09-30 | 季华实验室 | 一种拼接缝隙填充装置以及led显示屏 |
KR20240007915A (ko) * | 2021-05-13 | 2024-01-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전자 기기 |
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- 2003-03-20 US US10/392,191 patent/US7101729B2/en not_active Expired - Lifetime
- 2003-03-27 TW TW092106986A patent/TWI239078B/zh not_active IP Right Cessation
- 2003-03-27 CN CNB031082947A patent/CN100339939C/zh not_active Expired - Lifetime
- 2003-03-27 KR KR10-2003-0019123A patent/KR100515774B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
JP2004006724A (ja) | 2004-01-08 |
KR100515774B1 (ko) | 2005-09-23 |
TW200403817A (en) | 2004-03-01 |
KR20030085471A (ko) | 2003-11-05 |
TWI239078B (en) | 2005-09-01 |
US20040080032A1 (en) | 2004-04-29 |
US7101729B2 (en) | 2006-09-05 |
JP4329368B2 (ja) | 2009-09-09 |
CN1448987A (zh) | 2003-10-15 |
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