CA2586290A1 - Single or multi-layer printed circuit board with improved via design - Google Patents

Single or multi-layer printed circuit board with improved via design Download PDF

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Publication number
CA2586290A1
CA2586290A1 CA002586290A CA2586290A CA2586290A1 CA 2586290 A1 CA2586290 A1 CA 2586290A1 CA 002586290 A CA002586290 A CA 002586290A CA 2586290 A CA2586290 A CA 2586290A CA 2586290 A1 CA2586290 A1 CA 2586290A1
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CA
Canada
Prior art keywords
circuit board
hole
conductive sheet
conductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002586290A
Other languages
French (fr)
Other versions
CA2586290C (en
Inventor
Kevin C. Olson
Alan E. Wang
Peter Elenius
Thomas W. Goodman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
Ppg Industries Ohio, Inc.
Kevin C. Olson
Alan E. Wang
Peter Elenius
Thomas W. Goodman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Industries Ohio, Inc., Kevin C. Olson, Alan E. Wang, Peter Elenius, Thomas W. Goodman filed Critical Ppg Industries Ohio, Inc.
Publication of CA2586290A1 publication Critical patent/CA2586290A1/en
Application granted granted Critical
Publication of CA2586290C publication Critical patent/CA2586290C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

Claims (36)

The Invention Claimed Is:
1. A multi-layer circuit board comprising:
a plurality of circuit boards, each circuit board comprising an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet, an insulating edge layer covering an edge of the conductive sheet and a circuit pattern defined on an outward facing surface of at least one of the top layer and bottom layer; and an insulating interlayer sandwiched between a top layer of a first circuit board of the plurality of circuit boards and a bottom layer of a second circuit board of the plurality of circuit boards.
2. The circuit board of claim 1, wherein the insulating edge layer includes at least one opening where at least part of the edge of the conductive sheet is exposed.
3. The circuit board of claim 1, further including at least one electrical conductor electrically connecting the circuit patterns on the first and second circuit boards by way of the insulating interlayer.
4. The circuit board of claim 1, wherein:
the circuit pattern of one of the circuit boards includes at least one electrical conductor on the top layer of the one circuit board and at least one electrical conductor on the bottom layer of the one circuit board; and a through-hole or via extends through the one circuit board, the through-hole having an electrical conducting interior surface extending therethrough electrically connecting the one electrical conductor on the top layer of the one circuit board and the one electrical conductor on the bottom layer of the one circuit board, the electrical conducting interior surface electrically isolated from the electrically conductive sheet by an insulating through-hole layer.
5. The circuit board of claim 4, wherein the interior surface of the through-hole converges from a position adjacent the top layer of the one circuit board to a position intermediate the top layer and the bottom layer of the one circuit board and diverges from the position intermediate the top layer and the bottom layer of the one circuit board to a position adjacent the bottom layer of the one circuit board.
6. The circuit board of claim 5, wherein, in cross section, the interior surface of one side of the through-hole has an arcuate outline from the position intermediate the top layer and the bottom layer to either the position adjacent the top layer or the position adjacent the bottom layer.
7. The circuit board of claim 6, wherein, in cross section, opposing sides of the interior surface of the through-hole have an outline generally in the shape of a hyperbola.
8. The circuit board of claim 1, wherein:
the circuit pattern of one of the circuit boards includes a plurality of electrical conductors on the top layer of the one circuit board and a plurality of electrical conductors on the bottom layer of the one circuit board; and a through-hole or via extends through the one circuit board, the through-hole having a plurality of through-hole conductors extending therethrough, each through-hole conductor electrically isolated from each other through-hole conductor, each through-hole conductor electrically connected to at least one electrical conductor on the top layer or the bottom layer of the one circuit board.
9. The circuit board of claim 8, wherein an interior surface of the through-hole converges from a position adjacent the top layer of the one circuit board to a position intermediate the top layer and the bottom layer of the one circuit board and diverges from the position intermediate the top layer and the bottom layer of the one circuit board to a position adjacent the bottom layer of the one circuit board.
10. The circuit board of claim 9, wherein, in cross section, either one of the through-hole conductors or one side of the insulating through-hole layer disposed between a pair of through-hole conductors has an arcuate outline from the position intermediate the top layer and the bottom layer to either the position adjacent the top layer or the position adjacent the bottom layer.
11. The circuit board of claim 10, wherein the cross section of either the one through-hole conductor or the one side of the insulating through-hole layer disposed between a pair of through-hole conductors has an outline generally in the shape of one side of a hyperbola.
2. A method of forming a multi-layer circuit board comprising:
(a) providing a plurality of circuit boards, each circuit board comprising an electrically conductive sheet conformally coated with an insulating material;
(b) forming a first circuit on one of the circuit boards;
(c) forming a second circuit on another of the circuit boards; and (d) laminating the plurality of circuit boards together with an insulating interlayer disposed between the one circuit board and the other circuit board, and with the first and second circuits electrically connected by way of the insulating interlayer.
13. The method of claim 12, wherein each circuit comprises at least one conductor.
14. The method of claim 12, wherein the conformally coated insulating material includes at least one opening where at least part of an edge of the conductive sheet is exposed.
15. The method of claim 14, wherein the one opening is on a tab that extends from the circuit board either within or outside a perimeter of the circuit board.
16. The method of claim 12, further including:
conformally coating a through-hole or via in the conductive sheet of the one circuit board with the insulating material; and forming at least one through-hole conductor on at least a portion of the insulating material in the through-hole, with the one through-hole conductor electrically connected to at least one conductor of the first circuit formed on one side of the first circuit board and to at least one conductor of the one circuit formed on the other side of the one circuit board.
17. The method of claim 16, further including forming a plurality of electrically isolated through-hole conductors on the insulating material in the through-hole, with each through-hole conductor electrically connected to at least one conductor of the first circuit formed on one side or on the other side of the first circuit board.
18. The circuit board of claim 17, wherein an interior surface of the through-hole converges from a position adjacent a top surface of the one circuit board to a position intermediate the top surface and the bottom surface of the one circuit board, and diverges from the position intermediate the top surface and the bottom surface of the one circuit board to a position adjacent the bottom surface of the one circuit board.
19. The circuit board of claim 18, wherein, in cross section, one side of the through-hole has an arcuate outline from the position intermediate the top surface and the bottom surface to either the position adjacent the top surface or the position adjacent the bottom surface.
20. The circuit board of claim 19, wherein the cross section of the one side of the through-hole has an outline generally in the shape of one side of a hyperbola.
21. A circuit board comprising:
an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet;
an electrical conductor on the top layer of the circuit board and an electrical conductor on the bottom layer of the circuit board; and a through-hole or via through the circuit board, the through-hole having a through-hole conductor extending therethrough electrically connecting the electrical conductor on the top layer and the electrical conductor on the bottom layer, the through-hole conductor electrically isolated from the electrically conductive sheet by an insulating through-hole layer.
22. The circuit board of claim 21, wherein the insulating edge layer includes at least one opening where at least part of the edge of the conductive sheet is exposed.
23. The circuit board of claim 21, wherein an interior surface of the through-hole converges from a position adjacent the top layer of the circuit board to a position intermediate the top layer and the bottom layer of the circuit board, and diverges from the position intermediate the top layer and the bottom layer of the circuit board to a position adjacent the bottom layer of the circuit board.
24. The circuit board of claim 23, wherein, in cross section, one side of the interior surface of the through-hole has an arcuate outline from the position intermediate the top layer and the bottom layer to either the position adjacent the top layer or the position adjacent the bottom layer.
25. The circuit board of claim 24, wherein, in cross section, opposing sides of the interior surface of the through-hole have an outline generally in the shape of a hyperbola.
26. The circuit board of claim 21, further including a plurality of electrical conductors on the top layer of the circuit board and a plurality of electrical conductors on the bottom layer of the circuit board, wherein:
the through-hole includes a plurality of through-hole conductors extending therethrough;
each through-hole conductor is electrically isolated from each other through-hole conductor; and each through-hole conductor is electrically connected to at least one electrical conductor on the top layer and at least one electrical conductor on the bottom layer.
27. The circuit board of claim 26, wherein an interior surface of the through-hole converges from a position adjacent the top layer of the circuit board to a position intermediate the top layer and the bottom layer of the circuit board and diverges from the position intermediate the top layer and the bottom layer of the circuit board to a position adjacent the bottom layer of the circuit board.
28. The circuit board of claim 27, wherein, in cross section, the interior surface of the through-hole has an arcuate outline from the position intermediate the top layer and the bottom layer to either the position adjacent the top layer or the position adjacent the bottom layer.
29. The circuit board of claim 28, wherein the cross section of the through-hole has an outline generally in the shape of one side of a hyperbola.
30. A method of forming a circuit board comprising:
(a) providing a circuit board having a through-hole or via therethrough;
(b) conformally coating the electrically conductive sheet, including an interior surface of the through-hole, with an insulating material;
(c) forming a conductor on one side of the conformally coated electrically conductive sheet;
(d) forming another conductor on the other side of the conformally coated electrically conductive sheet; and (e) forming a through-hole conductor on the insulating material in the through-hole, the through-hole conductor electrically connecting the conductor on the one side of the conformally coated electrically conductive sheet and the conductor on the other side of the conformally coated electrically conductive sheet.
31. The method of claim 30, wherein:
step (c) includes forming a plurality of conductors on the one side of the conformally coated electrically conductive sheet;

step (d) includes forming a plurality of conductors on the other side of the conformally coated electrically conductive sheet;

step (e) includes forming a plurality of through-hole conductors on the insulating material in the through-hole;

each through-hole conductor is electrically isolated from each other through-hole conductor; and each through-hole conductor is electrically connected to at least one conductor on the one side of the conformally coated electrically conductive sheet and at least one conductor on the other side of the conformally coated electrically conductive sheet.
32. The method of claim 31, wherein the conformally coated insulating material includes at least one opening where at least part of an edge of the conductive sheet is exposed.
33. The method of claim 32, wherein the at least part of the edge of the conductive sheet is on a tab that extends from the circuit board either within or outside a perimeter of the circuit board.
34. The circuit board of claim 30, wherein an interior surface of the through-hole converges from a position adjacent the one side of the conformally coated electrically conductive sheet to a position intermediate the one side and the other side of the conformally coated electrically conductive sheet, and diverges from the position intermediate the one side and the other side of the conformally coated electrically conductive sheet to a position adjacent the other side of the conformally coated electrically conductive sheet.
35. The circuit board of claim 34, wherein, in cross section, one side of the interior surface of the through-hole has an arcuate outline from the position intermediate the one side and the other side to either the position adjacent the one side or the position adjacent the other side.
36. The circuit board of claim 35, wherein the cross section of the one side of the interior surface of the through-hole has an outline generally in the shape of one side of a hyperbola.
CA2586290A 2004-11-11 2005-11-10 Single or multi-layer printed circuit board with improved via design Expired - Fee Related CA2586290C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/987,480 2004-11-11
US10/987,480 US7485812B2 (en) 2002-06-27 2004-11-11 Single or multi-layer printed circuit board with improved via design
PCT/US2005/040907 WO2006053206A1 (en) 2004-11-11 2005-11-10 Single or multi-layer printed circuit board with improved via design

Publications (2)

Publication Number Publication Date
CA2586290A1 true CA2586290A1 (en) 2006-05-18
CA2586290C CA2586290C (en) 2012-01-10

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Family Applications (1)

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CA2586290A Expired - Fee Related CA2586290C (en) 2004-11-11 2005-11-10 Single or multi-layer printed circuit board with improved via design

Country Status (11)

Country Link
US (1) US7485812B2 (en)
EP (1) EP1817947A1 (en)
JP (1) JP4739348B2 (en)
KR (1) KR100996781B1 (en)
CN (1) CN100571491C (en)
CA (1) CA2586290C (en)
HK (1) HK1109988A1 (en)
MX (1) MX2007005637A (en)
MY (1) MY149115A (en)
TW (1) TWI318550B (en)
WO (1) WO2006053206A1 (en)

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KR100722625B1 (en) * 2005-12-12 2007-05-28 삼성전기주식회사 Via hole having fine hole land and method thereof
US8008188B2 (en) * 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
JP2009088390A (en) * 2007-10-02 2009-04-23 Denso Corp Printed circuit board, method for manufacturing the printed circuit board, and electronic apparatus
US7743494B2 (en) * 2008-01-11 2010-06-29 Ppg Industries Ohio, Inc. Process of fabricating a circuit board
KR101609597B1 (en) * 2009-02-16 2016-04-07 삼성디스플레이 주식회사 Circuit board and display panel assembly having the same
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CA2586290C (en) 2012-01-10
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MX2007005637A (en) 2007-06-05
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KR20070058707A (en) 2007-06-08
WO2006053206A1 (en) 2006-05-18

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