CA2389314A1 - Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices - Google Patents

Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices Download PDF

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Publication number
CA2389314A1
CA2389314A1 CA002389314A CA2389314A CA2389314A1 CA 2389314 A1 CA2389314 A1 CA 2389314A1 CA 002389314 A CA002389314 A CA 002389314A CA 2389314 A CA2389314 A CA 2389314A CA 2389314 A1 CA2389314 A1 CA 2389314A1
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force
target
target device
component
component device
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CA002389314A
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French (fr)
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CA2389314C (en
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Carl F. Edman
Michael J. Heller
Rachel Formosa
Christian Gurtner
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Gamida for Life BV
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
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    • C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
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Abstract

Methods and apparatus are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices.
Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces.

Claims (23)

1. A method for the fabrication of microscale and nanoscale devices comprising the steps of:
providing a target device having at least one target electrode, providing a first component device and a fluidic medium in contact with the target device, placing the first component device relative to the target device through action of at least electroosmotic force from the target device to the component device, and attaching the component device to the target device.
2. The method of claim 1 wherein the electroosmotic force is created at least in part by the target electrode.
3. The method of claim 1 wherein the target device is further provided with a drive electrode.
4. The method of claim 3 wherein the drive electrode is provided proximal to the target electrode.
5. The method of claim 3 wherein the electroosmotic force is generated at least in part by the drive electrode.
6. The method of claim 1 wherein the attachment step includes a solder reflow step.
7. The method of claim 1 further including the step of electrical activation of the component device attached to the target device.
8. The method of claim 1 wherein the component device is a microelectronic component device.
9. The method of claim 8 wherein the microelectronic device is a light emitting diode (LED).
10. The method of claim 1 wherein the component device is a micromechanical device.
11. The method of claim 1 wherein the placing step includes an electrophoretic force in addition to the electroosmotic force.
12. The method of claim 1 wherein the placing step includes an electrostatic force in addition to the electroosmotic force.
13. The method of claim 1 wherein the placing step includes an dielectrophoretic force in addition to the electroosmotic force.
14. The method of claim 1 wherein the placing step involves serial steps of placement of a single component device.
15. The method of claim 1 wherein multiple component devices are placed in parallel.
16. The method of claim 1 wherein the component device is provided with a blending system for attachment to the target device.
17. The method of claim 16 wherein the binding system includes nucleic acid.
18. The method of claim 1 wherein the placement step includes providing a surface feature to affect the motion of the target device.
19. The method of claim 18 wherein the surface feature includes a stop.
20. The method of claim 18 wherein the surface feature includes a recess.
21. The method of claim 1 wherein at least certain of the steps are performed in a low gravity environment.
22. A method for the fabrication of microscale and nanoscale devices comprising the steps of:
providing a target device having at least one target electrode, providing a first component device and a fluidic medium in contact with the target device, placing the first component device relative to the target device through action of an electronic force from the target device to the component device and a fluidic force, and attaching the component device to the target device.
23. The method of claim 22 wherein the electronic force includes electroosmotic force.
CA2389314A 1999-11-08 2000-11-03 Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices Expired - Fee Related CA2389314C (en)

Applications Claiming Priority (3)

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US09/436,311 1999-11-08
US09/436,311 US6569382B1 (en) 1991-11-07 1999-11-08 Methods apparatus for the electronic, homogeneous assembly and fabrication of devices
PCT/US2000/030480 WO2001034765A1 (en) 1999-11-08 2000-11-03 Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices

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CA2389314C CA2389314C (en) 2011-07-12

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