CA2383703A1 - Method and apparatus for cooling with a phase change material and heat pipes - Google Patents
Method and apparatus for cooling with a phase change material and heat pipes Download PDFInfo
- Publication number
- CA2383703A1 CA2383703A1 CA002383703A CA2383703A CA2383703A1 CA 2383703 A1 CA2383703 A1 CA 2383703A1 CA 002383703 A CA002383703 A CA 002383703A CA 2383703 A CA2383703 A CA 2383703A CA 2383703 A1 CA2383703 A1 CA 2383703A1
- Authority
- CA
- Canada
- Prior art keywords
- housing
- chamber
- heat
- absorbing material
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/14—Safety or protection arrangements; Arrangements for preventing malfunction for preventing damage by freezing, e.g. for accommodating volume expansion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/902—Heat storage
Abstract
A cooling apparatus (10) includes a housing defined by two aluminum parts (1 2, 13) which are brazed to each other. A plurality of sector-shaped recesses (2 1- 28) are provided within the housing, and collectively define a chamber havin g a plurality of ribs (41-48) extending therethrough. Each recess contains a sector-shaped piece of porous material (17, 18), which is brazed to surfaces of the housing parts. The remaining space within the chamber is filled with a phase change material. Each of the ribs has therein a respective radially extending opening (101-108) which contains a heat pipe (141). Expansion accumulators (151) are mounted on the housing, and communicate with the chamber therein, in order to accommodate expansion of the phase change material within the chamber as the phase change material is heated.
Claims (18)
1. An apparatus, comprising:
a housing having a chamber therein;
a heat absorbing material disposed within said chamber in said housing; and a heat pipe disposed within said housing and operative to facilitate heat distribution within said heat absorbing material.
a housing having a chamber therein;
a heat absorbing material disposed within said chamber in said housing; and a heat pipe disposed within said housing and operative to facilitate heat distribution within said heat absorbing material.
2. An apparatus according to Claim 1, wherein heat absorbing material is a phase change material.
3. An apparatus according to Claim 1, wherein said housing has a thermally conductive portion with an opening therein, and wherein said heat pipe is disposed within said opening in said thermally conductive portion.
4. An apparatus according to Claim 1, including a plurality of further heat pipes; wherein said housing includes a plurality of thermally conductive ribs extending within said chamber and each having therein an opening; and wherein each said opening has therein a respective one of said heat pipes.
5. An apparatus according to Claim 4, wherein each said opening has a first end which communicates through a passageway in said housing with a location external to said housing.
6. An apparatus according to Claim 5, wherein each said opening has a second end which is remote from said first end and which opens outwardly through an outer surface of said housing.
7. An apparatus according to Claim 4, wherein said chamber includes a plurality of portions which are substantially separated from each other by said ribs, and wherein said chamber includes a plurality of channels which are provided in said housing and which facilitate fluid communication between said portions of said chamber.
8. An apparatus according to Claim 7, wherein said housing includes a thermally conductive first part having a plurality of recesses provided in one side thereof, each said portion of said chamber being in a respective one of said recesses; wherein said ribs are portions of said first part which are disposed between said recesses; wherein said housing further includes a thermally conductive second part which is disposed against said one side of said first part;
and wherein said channels are each a transverse groove provided in a respective said rib on a side thereof adjacent said second part.
and wherein said channels are each a transverse groove provided in a respective said rib on a side thereof adjacent said second part.
9. An apparatus according to Claim 7, wherein said ribs extend radially in respective different directions;
wherein said openings in said ribs extend radially; and wherein said portions of said chamber are each sector-shaped, and are each disposed between a respective pair of said ribs.
wherein said openings in said ribs extend radially; and wherein said portions of said chamber are each sector-shaped, and are each disposed between a respective pair of said ribs.
10. An apparatus according Claim 7, including an expansion accumulator which is in fluid communication with said chamber, which receives a portion of said heat absorbing material from said chamber when said heat absorbing material expands in response to an increase in temperature, and which returns said portion of said heat absorbing material to said chamber when said heat absorbing material contracts in response to a decrease in temperature.
11. An apparatus according to Claim 7, including in each said portion of said chamber a thermally conductive member made of a porous material.
12. An apparatus according to Claim 11, wherein said housing and said thermally conductive members are all made of a metal, and wherein said thermally conductive members are each brazed to surfaces of said housing which define said chamber.
13. An apparatus according to Claim 1, including an antenna system which is coupled to said housing and which generates heat that is transferred to said housing.
14. A method of cooling, comprising the steps of:
transferring heat to a housing which has therein a chamber that contains a heat absorbing material;
distributing said heat within said heat absorbing material, including the step of using a heat pipe within said housing to facilitate distribution of said heat; and causing said heat absorbing material to absorb said heat.
transferring heat to a housing which has therein a chamber that contains a heat absorbing material;
distributing said heat within said heat absorbing material, including the step of using a heat pipe within said housing to facilitate distribution of said heat; and causing said heat absorbing material to absorb said heat.
15. A method according to Claim 14, including the step of using a phase change material as said heat absorbing material.
16. A method according to Claim 15, including the step of providing within said chamber a porous material which is thermally conductive, and which is in contact with said heat absorbing material.
17. A method according to Claim 14, wherein said step of distributing said heat is carried out using a plurality of heat pipes.
18. A method according to Claim 17, wherein said step of distributing said heat includes the steps of providing said housing with a plurality of ribs which are thermally conductive and each extend within said chamber, and providing a respective said heat pipe within each of said ribs.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/397,481 | 1999-09-16 | ||
US09/397,481 US7069975B1 (en) | 1999-09-16 | 1999-09-16 | Method and apparatus for cooling with a phase change material and heat pipes |
PCT/US2000/025297 WO2001020713A1 (en) | 1999-09-16 | 2000-09-14 | Method and apparatus for cooling with a phase change material and heat pipes |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2383703A1 true CA2383703A1 (en) | 2001-03-22 |
CA2383703C CA2383703C (en) | 2012-05-15 |
Family
ID=23571372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2383703A Expired - Fee Related CA2383703C (en) | 1999-09-16 | 2000-09-14 | Method and apparatus for cooling with a phase change material and heat pipes |
Country Status (7)
Country | Link |
---|---|
US (2) | US7069975B1 (en) |
EP (1) | EP1218965B1 (en) |
JP (1) | JP4357780B2 (en) |
AU (1) | AU7582300A (en) |
CA (1) | CA2383703C (en) |
DE (1) | DE60033165T2 (en) |
WO (1) | WO2001020713A1 (en) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE0103040D0 (en) * | 2001-09-13 | 2001-09-13 | Wahlberg & Selin Ab | Mobile satellite link terminal |
AU2003288566A1 (en) * | 2002-12-23 | 2004-07-14 | Bae Systems Plc | Deformable-mirror cooling |
US7106777B2 (en) * | 2003-01-07 | 2006-09-12 | The Boeing Company | Phase-change heat exchanger |
IL173373A0 (en) * | 2006-01-26 | 2006-09-05 | Nuclear Res Ct Negev | Thermal energy storage apparatus |
US7447029B2 (en) * | 2006-03-14 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber for dissipation heat generated by electronic component |
JP2011524966A (en) | 2008-02-22 | 2011-09-08 | ダウ グローバル テクノロジーズ エルエルシー | Thermal energy storage material |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
EP2154462A1 (en) * | 2008-08-13 | 2010-02-17 | BAE Systems PLC | Latent heat storage body |
WO2010037872A1 (en) * | 2008-10-02 | 2010-04-08 | Ibérica Del Espacio, S.A. | Spaceship heat module |
US8045329B2 (en) * | 2009-04-29 | 2011-10-25 | Raytheon Company | Thermal dissipation mechanism for an antenna |
US9395123B1 (en) | 2009-06-29 | 2016-07-19 | Paragon Space Development Corporation | Cooling systems |
US8342454B1 (en) | 2009-06-29 | 2013-01-01 | Paragon Space Development Corporation | Cooling systems |
KR20110026193A (en) * | 2009-09-07 | 2011-03-15 | 삼성전자주식회사 | System for cooling heated member and sytem for cooling battery |
US20110100583A1 (en) * | 2009-10-29 | 2011-05-05 | Freund Sebastian W | Reinforced thermal energy storage pressure vessel for an adiabatic compressed air energy storage system |
JP2013518243A (en) * | 2010-01-29 | 2013-05-20 | ダウ グローバル テクノロジーズ エルエルシー | Thermal energy storage |
CN101792025B (en) * | 2010-04-07 | 2012-08-08 | 北京交通大学 | Driving device suitable for space environment |
EP2568789B1 (en) | 2011-09-06 | 2014-04-16 | ABB Research Ltd. | Heat exchanger |
EP2568792A1 (en) * | 2011-09-06 | 2013-03-13 | ABB Research Ltd. | Apparatus |
US9223138B2 (en) | 2011-12-23 | 2015-12-29 | Microsoft Technology Licensing, Llc | Pixel opacity for augmented reality |
US9606586B2 (en) | 2012-01-23 | 2017-03-28 | Microsoft Technology Licensing, Llc | Heat transfer device |
US8934235B2 (en) * | 2012-01-23 | 2015-01-13 | Microsoft Corporation | Heat transfer device with phase change material |
US9297996B2 (en) | 2012-02-15 | 2016-03-29 | Microsoft Technology Licensing, Llc | Laser illumination scanning |
US9726887B2 (en) | 2012-02-15 | 2017-08-08 | Microsoft Technology Licensing, Llc | Imaging structure color conversion |
US9779643B2 (en) | 2012-02-15 | 2017-10-03 | Microsoft Technology Licensing, Llc | Imaging structure emitter configurations |
US9578318B2 (en) | 2012-03-14 | 2017-02-21 | Microsoft Technology Licensing, Llc | Imaging structure emitter calibration |
US11068049B2 (en) | 2012-03-23 | 2021-07-20 | Microsoft Technology Licensing, Llc | Light guide display and field of view |
US9558590B2 (en) | 2012-03-28 | 2017-01-31 | Microsoft Technology Licensing, Llc | Augmented reality light guide display |
US10191515B2 (en) | 2012-03-28 | 2019-01-29 | Microsoft Technology Licensing, Llc | Mobile device light guide display |
US9717981B2 (en) | 2012-04-05 | 2017-08-01 | Microsoft Technology Licensing, Llc | Augmented reality and physical games |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
WO2013169774A2 (en) | 2012-05-07 | 2013-11-14 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
US10502876B2 (en) | 2012-05-22 | 2019-12-10 | Microsoft Technology Licensing, Llc | Waveguide optics focus elements |
US8989535B2 (en) | 2012-06-04 | 2015-03-24 | Microsoft Technology Licensing, Llc | Multiple waveguide imaging structure |
US9311909B2 (en) | 2012-09-28 | 2016-04-12 | Microsoft Technology Licensing, Llc | Sensed sound level based fan speed adjustment |
US10192358B2 (en) | 2012-12-20 | 2019-01-29 | Microsoft Technology Licensing, Llc | Auto-stereoscopic augmented reality display |
US9296496B2 (en) * | 2013-03-04 | 2016-03-29 | Raytheon Company | Thermal management system and method for space and air-borne sensors |
US9316445B2 (en) | 2013-03-14 | 2016-04-19 | Crom, Llc | Spider diffuser system |
JP2016516387A (en) * | 2013-03-15 | 2016-06-02 | フィンシックス コーポレイションFinsix Corporation | Method and apparatus for controlling heat in a power conversion system |
CZ2013278A3 (en) * | 2013-04-11 | 2014-10-22 | Halla Visteon Climate Control Corporation | Heat-exchange apparatus |
US20150211805A1 (en) * | 2014-01-29 | 2015-07-30 | Kunshan Jue-Chung Electronics Co., Ltd. | Thermostat module |
US10151542B2 (en) | 2014-04-03 | 2018-12-11 | Raytheon Company | Encapsulated phase change material heat sink and method |
US10408544B2 (en) * | 2014-05-20 | 2019-09-10 | Bell Helicopter Textron Inc. | Composite top case with embedded heat pipes |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
US9304235B2 (en) | 2014-07-30 | 2016-04-05 | Microsoft Technology Licensing, Llc | Microfabrication |
US10678412B2 (en) | 2014-07-31 | 2020-06-09 | Microsoft Technology Licensing, Llc | Dynamic joint dividers for application windows |
US10254942B2 (en) | 2014-07-31 | 2019-04-09 | Microsoft Technology Licensing, Llc | Adaptive sizing and positioning of application windows |
US10592080B2 (en) | 2014-07-31 | 2020-03-17 | Microsoft Technology Licensing, Llc | Assisted presentation of application windows |
US10018844B2 (en) | 2015-02-09 | 2018-07-10 | Microsoft Technology Licensing, Llc | Wearable image display system |
US10317677B2 (en) | 2015-02-09 | 2019-06-11 | Microsoft Technology Licensing, Llc | Display system |
US9535253B2 (en) | 2015-02-09 | 2017-01-03 | Microsoft Technology Licensing, Llc | Display system |
US9827209B2 (en) | 2015-02-09 | 2017-11-28 | Microsoft Technology Licensing, Llc | Display system |
US9423360B1 (en) | 2015-02-09 | 2016-08-23 | Microsoft Technology Licensing, Llc | Optical components |
US9513480B2 (en) | 2015-02-09 | 2016-12-06 | Microsoft Technology Licensing, Llc | Waveguide |
US9429692B1 (en) | 2015-02-09 | 2016-08-30 | Microsoft Technology Licensing, Llc | Optical components |
US9372347B1 (en) | 2015-02-09 | 2016-06-21 | Microsoft Technology Licensing, Llc | Display system |
US11086216B2 (en) | 2015-02-09 | 2021-08-10 | Microsoft Technology Licensing, Llc | Generating electronic components |
US10477724B2 (en) * | 2015-03-09 | 2019-11-12 | Datalogic IP Tech, S.r.l. | Efficient heat exchange systems and methods |
SE539955C2 (en) * | 2015-06-23 | 2018-02-13 | Ali Mohamed Mansour | A Solar Thermal Energy Accumulator |
WO2017044718A1 (en) * | 2015-09-09 | 2017-03-16 | Finsix Corporation | Control of power delivery based on temperature of a power module |
US10123456B2 (en) | 2015-10-28 | 2018-11-06 | Raytheon Company | Phase change material heat sink using additive manufacturing and method |
US11530877B2 (en) * | 2016-08-01 | 2022-12-20 | Lockheed Martin Corporation | Heat exchange using phase change material |
EP3301391B1 (en) * | 2016-09-28 | 2020-09-23 | Alcatel Lucent | A heat transfer structure |
DE102017213227A1 (en) | 2017-08-01 | 2019-02-07 | Audi Ag | Rotor for an electric machine |
US20190137123A1 (en) * | 2017-11-09 | 2019-05-09 | Rensselaer Polytechnic Institute | System for heating and cooling system with stand-alone modular units |
US20220205768A1 (en) * | 2019-04-10 | 2022-06-30 | Mbda Uk Limited | Missile comprising electronics and a jumping-drop vapour chamber |
US10641556B1 (en) * | 2019-04-26 | 2020-05-05 | United Arab Emirates University | Heat sink with condensing fins and phase change material |
AU2022218491A1 (en) * | 2021-11-02 | 2023-05-18 | Ametek, Inc. | Circuit card assemblies |
CN114909934B (en) * | 2022-05-05 | 2023-08-18 | 南京艾科美热能科技有限公司 | Self-adaptive heat reservoir |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2677367A (en) | 1951-04-25 | 1954-05-04 | Telkes Maria | Heat storage unit |
US3132688A (en) | 1963-04-08 | 1964-05-12 | Welville B Nowak | Electronic cold and/or hot compress device |
US3909118A (en) | 1974-03-04 | 1975-09-30 | Textron Inc | Fluid cooled mirror |
US4099853A (en) | 1975-06-04 | 1978-07-11 | Jersey Nuclear-Avco Isotopes, Inc. | Low distortion mirror for high power laser beams including a rear reflective surface |
DE2602530B1 (en) * | 1976-01-23 | 1977-05-18 | Inst Fuer Kerntechnik & Energ | LATENTHEAT STORAGE |
US4047198A (en) | 1976-04-19 | 1977-09-06 | Hughes Aircraft Company | Transistor cooling by heat pipes having a wick of dielectric powder |
US4268558A (en) | 1977-07-01 | 1981-05-19 | Boardman Energy Systems, Inc. | Thermal storage material and process for making |
US4143946A (en) | 1977-12-05 | 1979-03-13 | The United States Of America As Represented By The Secretary Of The Navy | Impingement cooled deformable laser mirror |
US4381818A (en) | 1977-12-19 | 1983-05-03 | International Business Machines Corporation | Porous film heat transfer |
US4178722A (en) * | 1978-01-18 | 1979-12-18 | The United States Of America As Represented By The Secretary Of The Navy | Grinding and polishing tool |
US4178727A (en) | 1978-02-01 | 1979-12-18 | Architectural Research Corporation | Heat absorbing panel |
US4200148A (en) * | 1978-04-03 | 1980-04-29 | Rockwell International Corporation | Storing and extracting latent heat |
JPS5596892A (en) | 1979-01-18 | 1980-07-23 | Hisaka Works Ltd | Heat transfer plate for plate type evaporator |
US4250958A (en) | 1979-07-16 | 1981-02-17 | Wasserman Kurt J | Double tubular thermal energy storage element |
US4306613A (en) * | 1980-03-10 | 1981-12-22 | Christopher Nicholas S | Passive cooling system |
US4341262A (en) | 1980-05-05 | 1982-07-27 | Alspaugh Thomas R | Energy storage system and method |
DE3038723A1 (en) | 1980-10-14 | 1982-05-06 | L. & C. Steinmüller GmbH, 5270 Gummersbach | HEAT STORAGE FOR REGENERATIVE HEAT EXCHANGE |
US4673030A (en) | 1980-10-20 | 1987-06-16 | Hughes Aircraft Company | Rechargeable thermal control system |
US4512388A (en) | 1981-06-19 | 1985-04-23 | Institute Of Gas Technology | High-temperature direct-contact thermal energy storage using phase-change media |
US4446916A (en) | 1981-08-13 | 1984-05-08 | Hayes Claude Q C | Heat-absorbing heat sink |
US4494171A (en) | 1982-08-24 | 1985-01-15 | Sundstrand Corporation | Impingement cooling apparatus for heat liberating device |
US4528208A (en) | 1983-10-13 | 1985-07-09 | Zymet, Inc. | Method and apparatus for controlling article temperature during treatment in vacuum |
JPS60232496A (en) | 1984-05-04 | 1985-11-19 | Fujitsu Ltd | Heat exchanger |
SE456547B (en) | 1984-12-07 | 1988-10-10 | Ericsson Telefon Ab L M | DEVICE FOR COOLING CIRCUITS |
JP2569003B2 (en) | 1986-03-20 | 1997-01-08 | 株式会社日立製作所 | Heat conduction device |
US4832118A (en) | 1986-11-24 | 1989-05-23 | Sundstrand Corporation | Heat exchanger |
JPH068716B2 (en) | 1986-12-11 | 1994-02-02 | 東レ株式会社 | Flexible heat transfer element |
JPS62248992A (en) * | 1987-03-30 | 1987-10-29 | Fujikura Ltd | Heat accumulating device |
JPS6474798A (en) | 1987-09-16 | 1989-03-20 | Nec Corp | Integrated type power amplifier |
JPH01147294A (en) | 1987-12-03 | 1989-06-08 | Nippon Denso Co Ltd | Heat exchanger |
US4998181A (en) | 1987-12-15 | 1991-03-05 | Texas Instruments Incorporated | Coldplate for cooling electronic equipment |
US4898234A (en) | 1988-08-19 | 1990-02-06 | Mcdonnell Douglas Corporation | Air heat exchanger |
JPH02208497A (en) | 1989-02-03 | 1990-08-20 | Ishikawajima Harima Heavy Ind Co Ltd | Two-phase flow cold plate |
US5007478A (en) | 1989-05-26 | 1991-04-16 | University Of Miami | Microencapsulated phase change material slurry heat sinks |
DE59010109D1 (en) | 1989-06-06 | 1996-03-21 | Gerd Hoermansdoerfer | Latent heat storage media and their use |
US5063476A (en) | 1989-12-05 | 1991-11-05 | Digital Equipment Corporation | Apparatus for controlled air-impingement module cooling |
US4966226A (en) | 1989-12-29 | 1990-10-30 | Digital Equipment Corporation | Composite graphite heat pipe apparatus and method |
US4976308A (en) * | 1990-02-21 | 1990-12-11 | Wright State University | Thermal energy storage heat exchanger |
US5000252A (en) * | 1990-02-22 | 1991-03-19 | Wright State University | Thermal energy storage system |
US5039577A (en) | 1990-05-31 | 1991-08-13 | Hughes Aircraft Company | Hybrid metal matrix composite chassis structure for electronic circuits |
JP2583343B2 (en) | 1990-06-12 | 1997-02-19 | 株式会社フジクラ | Heat pipe type electronic component cooler |
US5123982A (en) | 1990-06-29 | 1992-06-23 | The United States Of American As Represented By The United States Department Of Energy | Process of making cryogenically cooled high thermal performance crystal optics |
US5128689A (en) | 1990-09-20 | 1992-07-07 | Hughes Aircraft Company | Ehf array antenna backplate including radiating modules, cavities, and distributor supported thereon |
JPH04143526A (en) | 1990-10-05 | 1992-05-18 | I N R Kenkyusho:Kk | Heat radiating or absorbing radiator and panel |
US5272491A (en) | 1990-10-31 | 1993-12-21 | Hewlett-Packard Company | Thermal ink jet print device having phase change cooling |
DK17791D0 (en) | 1991-02-01 | 1991-02-01 | Novo Nordisk As | CONTAINER INSPECTION |
JP2591525Y2 (en) * | 1991-05-29 | 1999-03-03 | 横浜ゴム株式会社 | Crawler shoe |
US5263536A (en) | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
US5404272A (en) | 1991-10-24 | 1995-04-04 | Transcal | Carrier for a card carrying electronic components and of low heat resistance |
FR2683115A1 (en) | 1991-10-24 | 1993-04-30 | Transcal | LOW THERMAL RESISTANCE ELECTRONIC COMPONENT CARD HOLDER. |
US5225964A (en) | 1991-10-31 | 1993-07-06 | Rockwell International Corporation | Integrated lightweight card rack |
JPH0634287A (en) | 1992-07-14 | 1994-02-08 | Matsushita Electric Works Ltd | Heat storage board |
US5267611A (en) | 1993-01-08 | 1993-12-07 | Thermacore, Inc. | Single phase porous layer heat exchanger |
JPH06291480A (en) | 1993-04-05 | 1994-10-18 | Mitsubishi Electric Corp | Electronic circuit module |
US5293171A (en) | 1993-04-09 | 1994-03-08 | Cherrette Alan R | Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power |
US5325913A (en) | 1993-06-25 | 1994-07-05 | The United States Of America As Represented By The Secretary Of The Navy | Module cooling system |
US5523260A (en) * | 1993-08-02 | 1996-06-04 | Motorola, Inc. | Method for heatsinking a controlled collapse chip connection device |
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
US5386701A (en) | 1994-02-03 | 1995-02-07 | Cao; Yiding | Human body cooling suit with heat pipe transfer |
US5852548A (en) | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
US5579830A (en) | 1995-11-28 | 1996-12-03 | Hudson Products Corporation | Passive cooling of enclosures using heat pipes |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6220337B1 (en) * | 1998-04-27 | 2001-04-24 | Shi-Li Chen | Heat pipe circuit type thermal battery |
-
1999
- 1999-09-16 US US09/397,481 patent/US7069975B1/en not_active Expired - Lifetime
-
2000
- 2000-09-14 DE DE60033165T patent/DE60033165T2/en not_active Expired - Lifetime
- 2000-09-14 WO PCT/US2000/025297 patent/WO2001020713A1/en active IP Right Grant
- 2000-09-14 AU AU75823/00A patent/AU7582300A/en not_active Abandoned
- 2000-09-14 JP JP2001524187A patent/JP4357780B2/en not_active Expired - Fee Related
- 2000-09-14 CA CA2383703A patent/CA2383703C/en not_active Expired - Fee Related
- 2000-09-14 EP EP00965034A patent/EP1218965B1/en not_active Expired - Lifetime
-
2006
- 2006-06-30 US US11/428,004 patent/US7416017B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU7582300A (en) | 2001-04-17 |
DE60033165D1 (en) | 2007-03-15 |
CA2383703C (en) | 2012-05-15 |
DE60033165T2 (en) | 2007-11-15 |
US20060293086A1 (en) | 2006-12-28 |
WO2001020713A1 (en) | 2001-03-22 |
EP1218965A1 (en) | 2002-07-03 |
JP2003509870A (en) | 2003-03-11 |
JP4357780B2 (en) | 2009-11-04 |
US7069975B1 (en) | 2006-07-04 |
EP1218965B1 (en) | 2007-01-24 |
US7416017B2 (en) | 2008-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2383703A1 (en) | Method and apparatus for cooling with a phase change material and heat pipes | |
US4777561A (en) | Electronic module with self-activated heat pipe | |
US11035621B2 (en) | Electronics cooling with multi-phase heat exchange and heat spreader | |
US11114713B2 (en) | Thermal management systems for battery cells and methods of their manufacture | |
EP2439821B1 (en) | Method and system for cooling a fiber laser or amplifier | |
WO2005057097A3 (en) | Cooling system for high density heat load | |
US3831664A (en) | Heat pipe interfaces | |
CN103424020A (en) | Cooling device using loop type heat pipe | |
CA2940035A1 (en) | Thermal management system | |
CA2389458A1 (en) | High performance cold plate | |
WO2001069159A8 (en) | High performance heat exchange assembly | |
WO2002079657A3 (en) | Bearing assembly with bypass cooling | |
KR101988621B1 (en) | Heat Pipe For Battery Cooling | |
WO2005015104A2 (en) | Tower heat sink with sintered grooved wick | |
US8356410B2 (en) | Heat pipe dissipating system and method | |
CN108064430A (en) | Rotary antenna equipment | |
KR20030058784A (en) | Apparatus for exchanging heat | |
US10240873B2 (en) | Joint assembly of vapor chambers | |
CN109099740B (en) | Truss type vapor-liquid phase change heat transfer device and assembly welding method thereof | |
KR102166569B1 (en) | Structure of heat storage heat exchanger using phase change material | |
US20130039819A1 (en) | Vapor chamber and method of manufacturing same | |
CN108519009B (en) | Heat pipe device | |
GB2129112A (en) | Refrigerator | |
JP2003258173A (en) | Antenna for mounting on mobile | |
US20220290926A1 (en) | Apparatus for transferring heat from a heat source to air |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20200914 |