CA2341417A1 - Electrically disbonding materials - Google Patents

Electrically disbonding materials Download PDF

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Publication number
CA2341417A1
CA2341417A1 CA002341417A CA2341417A CA2341417A1 CA 2341417 A1 CA2341417 A1 CA 2341417A1 CA 002341417 A CA002341417 A CA 002341417A CA 2341417 A CA2341417 A CA 2341417A CA 2341417 A1 CA2341417 A1 CA 2341417A1
Authority
CA
Canada
Prior art keywords
composition
functionality
electrolyte
matrix
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002341417A
Other languages
French (fr)
Other versions
CA2341417C (en
Inventor
Michael D. Gilbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIC Laboratories Inc
Original Assignee
Eic Laboratories, Inc.
Michael D. Gilbert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eic Laboratories, Inc., Michael D. Gilbert filed Critical Eic Laboratories, Inc.
Publication of CA2341417A1 publication Critical patent/CA2341417A1/en
Application granted granted Critical
Publication of CA2341417C publication Critical patent/CA2341417C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Electrotherapy Devices (AREA)
  • Insulators (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Walking Sticks, Umbrellas, And Fans (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

An electrochemically disbondable composition (10) is provided having a matrix functionality and an electrolyte functionality.
The matrix functionality provides an adhesive bond to a substrate (12, 14), and the electrolyte functionality provides suffi-cient ionic conductivity to the composition to support a faradaic reaction at an interface (16) with an electrically conductive surface in contact with the composition, whereby the adhesive bond is weakened at the interface. The composition may be a phase-separated composition having first regions of substantially matrix functionality and second regions of substantially electrolyte functionality Adhesive and coating compositions and methods of disbonding also are described.
CA002341417A 1999-07-14 2000-07-05 Electrically disbonding materials Expired - Fee Related CA2341417C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/352,976 US7332218B1 (en) 1999-07-14 1999-07-14 Electrically disbonding materials
US09/352,976 1999-07-14
PCT/US2000/018419 WO2001005584A1 (en) 1999-07-14 2000-07-05 Electrically disbonding materials

Publications (2)

Publication Number Publication Date
CA2341417A1 true CA2341417A1 (en) 2001-01-25
CA2341417C CA2341417C (en) 2008-01-15

Family

ID=23387243

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002341417A Expired - Fee Related CA2341417C (en) 1999-07-14 2000-07-05 Electrically disbonding materials

Country Status (9)

Country Link
US (4) US7332218B1 (en)
EP (1) EP1200252B1 (en)
JP (2) JP3361328B1 (en)
AT (1) ATE339301T1 (en)
CA (1) CA2341417C (en)
DE (1) DE60030727T2 (en)
ES (1) ES2270851T3 (en)
HK (1) HK1045965A1 (en)
WO (1) WO2001005584A1 (en)

Families Citing this family (135)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US7312255B2 (en) * 2001-03-05 2007-12-25 Chemetall Gmbh Water-based coating mixture, method for application of corrosion protection layer with said mixture, substrates coated thus and use thereof
US6617698B2 (en) * 2001-03-09 2003-09-09 International Business Machines Corporation Reworkable and thermally conductive adhesive and use thereof
EP1499687A1 (en) 2002-04-20 2005-01-26 Chemetall GmbH Mixture for applying a polymeric corrosion-proof electrically weldable covering and method for producing this covering
US7395882B2 (en) 2004-02-19 2008-07-08 Baker Hughes Incorporated Casing and liner drilling bits
US7624818B2 (en) 2004-02-19 2009-12-01 Baker Hughes Incorporated Earth boring drill bits with casing component drill out capability and methods of use
US7954570B2 (en) * 2004-02-19 2011-06-07 Baker Hughes Incorporated Cutting elements configured for casing component drillout and earth boring drill bits including same
EP1812480A4 (en) * 2004-10-14 2010-11-03 Tufts College Electrochemically degradable polymers
WO2006050340A2 (en) * 2004-11-01 2006-05-11 Polytechnic University Methods and apparatus for modifying gel adhesion strength
WO2007015674A1 (en) 2005-08-01 2007-02-08 Stora Enso Ab A package
EP1912869B1 (en) * 2005-08-01 2010-09-22 Stora Enso AB Method of holding together packages and components thereto
CN101233055A (en) * 2005-08-01 2008-07-30 斯托拉恩索公司 Package
EP1914285A1 (en) * 2005-08-09 2008-04-23 The Yokohama Rubber Co., Ltd. Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive
KR100812507B1 (en) * 2005-08-19 2008-03-11 주식회사 엘지화학 Acrylic Pressure Sensitive Adhesive Composition
JP4839044B2 (en) * 2005-08-30 2011-12-14 富士機工株式会社 Shift lever range position display device
TW200709035A (en) * 2005-08-30 2007-03-01 Realtek Semiconductor Corp Audio processing device and method thereof
US20070114366A1 (en) * 2005-11-21 2007-05-24 General Electric Company Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same
EP1981703A1 (en) * 2006-02-07 2008-10-22 Stora Enso Ab Laminate structure and method of producing the same
US7621351B2 (en) 2006-05-15 2009-11-24 Baker Hughes Incorporated Reaming tool suitable for running on casing or liner
US20070269659A1 (en) * 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
WO2007142600A1 (en) * 2006-06-05 2007-12-13 Stora Enso Ab An electrochemically weakable adhesive composition
US20070290378A1 (en) 2006-06-20 2007-12-20 International Business Machines Corporation Novel reworkable underfills for ceramic mcm c4 protection
US20080103578A1 (en) * 2006-10-31 2008-05-01 Medtronic, Inc. Implantable medical elongated member with in situ formed fixation element
US20080103580A1 (en) * 2006-10-31 2008-05-01 Medtronic, Inc. Implantable medical elongated member with dual purpose conduit
US9643004B2 (en) * 2006-10-31 2017-05-09 Medtronic, Inc. Implantable medical elongated member with adhesive elements
US7780419B1 (en) * 2007-03-06 2010-08-24 Florida Turbine Technologies, Inc. Replaceable leading edge insert for an IBR
WO2008150227A1 (en) * 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure
SE531351C2 (en) * 2007-06-05 2009-03-03 Stora Enso Ab Laminate structure including electrochemically weakenable adhesive
JP4416815B2 (en) * 2007-09-26 2010-02-17 シャープ株式会社 Toner cartridge, image forming apparatus including the same, and toner cartridge recycling method
JP4404926B2 (en) 2007-09-26 2010-01-27 シャープ株式会社 Ink cartridge and recycling method thereof
US8245797B2 (en) 2007-10-02 2012-08-21 Baker Hughes Incorporated Cutting structures for casing component drillout and earth-boring drill bits including same
US7954571B2 (en) 2007-10-02 2011-06-07 Baker Hughes Incorporated Cutting structures for casing component drillout and earth-boring drill bits including same
JP4971106B2 (en) * 2007-11-06 2012-07-11 Ｓｒｉスポーツ株式会社 Golf club and method for separating the same
JP4469888B2 (en) * 2007-12-28 2010-06-02 シャープ株式会社 Image forming apparatus
US7932342B2 (en) * 2008-01-16 2011-04-26 International Business Machines Corporation Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system
DE102008009766A1 (en) * 2008-02-19 2009-08-20 Lisa Dräxlmaier GmbH Material layer useful as lining- or trim part for interior decoration of motor vehicle, has cover material layer applied on upper side of the material layer, carrier material applied on lower side of the layer, and sandwich-like structure
US8488428B2 (en) 2008-05-14 2013-07-16 Nbcuniversal Media, Llc Enhanced security of optical article
JP5296446B2 (en) * 2008-07-31 2013-09-25 ビッグテクノス株式会社 Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling
JP5210078B2 (en) * 2008-07-31 2013-06-12 ビッグテクノス株式会社 Electrically peelable pressure-sensitive adhesive composition, electrically peelable adhesive product, and method for peeling
WO2010027716A1 (en) 2008-08-25 2010-03-11 Seeo, Inc Polymer electrolyte materials based on block copolymers
JP4621785B2 (en) 2008-10-10 2011-01-26 シャープ株式会社 Developing cartridge and image forming apparatus using the same
JP5441400B2 (en) * 2008-12-19 2014-03-12 キヤノン株式会社 Imaging apparatus, radiation imaging apparatus, and manufacturing method thereof
GB0900606D0 (en) 2009-01-15 2009-02-25 Downhole Products Plc Tubing shoe
US20100239918A1 (en) * 2009-03-17 2010-09-23 Seeo, Inc Nanoparticle-block copolymer composites for solid ionic electrolytes
JP2013506063A (en) * 2009-05-22 2013-02-21 プロテクト テクノロジーズ インコーポレーテッド Remote activation lock system and method
US8327944B2 (en) * 2009-05-29 2012-12-11 Varel International, Ind., L.P. Whipstock attachment to a fixed cutter drilling or milling bit
US8517123B2 (en) * 2009-05-29 2013-08-27 Varel International, Ind., L.P. Milling cap for a polycrystalline diamond compact cutter
SG175249A1 (en) * 2009-06-05 2011-11-28 Varel Int Ind Lp Casing bit and casing reamer designs
DE102009030742B4 (en) * 2009-06-26 2014-11-20 Leibniz-Institut Für Polymerforschung Dresden E.V. Reactive hot melt adhesive and its use
JP4973699B2 (en) * 2009-07-06 2012-07-11 横浜ゴム株式会社 Tire wheel assembly and disassembling method thereof
JP5503926B2 (en) * 2009-08-31 2014-05-28 ビッグテクノス株式会社 Electrically peelable adhesive product and peeling method thereof
US8333855B2 (en) * 2009-12-02 2012-12-18 Pitney Bowes Inc. Monitoring electrical continuity for envelope seal integrity
JP5731137B2 (en) * 2010-06-15 2015-06-10 電気化学工業株式会社 Method of dismantling the bonded body by excimer light irradiation
JP5548062B2 (en) * 2010-08-11 2014-07-16 株式会社日立製作所 Construction method of temporary member for piping module and transportation method of piping module
CA2834092C (en) * 2011-04-26 2019-07-23 Becton, Dickinson And Company Adhesive patch and method of use in a packaging system
KR101450378B1 (en) 2011-11-03 2014-10-15 (주)엘지하우시스 Adhesive composition for e-paper
DE102012203794A1 (en) 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Electrically releasable polyamide adhesive
EP2855574B1 (en) 2012-06-01 2016-07-13 Henkel AG & Co. KGaA Adhesives having adhesion promoters with sulphonamide groups
KR101617387B1 (en) * 2013-02-26 2016-05-02 주식회사 엘지화학 Coating composition and plastic film prepared therefrom
JP6152288B2 (en) * 2013-03-27 2017-06-21 リンテック株式会社 Electrically peelable adhesive composition, electrically peelable adhesive sheet, and method of using the electrically peelable adhesive sheet
CN105073938B (en) * 2013-03-27 2017-11-28 琳得科株式会社 The application method of electric Stripping adhesive compositeon, electric fissility bonding sheet and electric fissility bonding sheet
WO2014157408A1 (en) 2013-03-27 2014-10-02 リンテック株式会社 Electrically peelable adhesive composition, electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet
EP3031875B1 (en) 2013-09-27 2018-11-28 Lintec Corporation Electrically peelable adhesive agent composition, electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet
JP6398264B2 (en) * 2014-03-31 2018-10-03 富士通株式会社 Interposer structure and method for manufacturing semiconductor device
EP2957610A1 (en) 2014-06-20 2015-12-23 Nitto Denko Corporation Debondable adhesive composition
JP6558370B2 (en) 2014-07-25 2019-08-14 三菱ケミカル株式会社 Gas barrier laminated film
WO2016124202A1 (en) 2015-02-02 2016-08-11 Coloplast A/S Ostomy device
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
JP6770523B2 (en) * 2015-02-27 2020-10-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ Reactive hot melt adhesive that can be peeled off
DK3280368T3 (en) 2015-04-10 2019-09-23 Coloplast As STOMA DEVICE
JP6947635B2 (en) * 2015-10-16 2021-10-13 日東電工株式会社 Double-sided adhesive sheet, double-sided adhesive sheet joint, and method of joining and separating adherends
JP6768281B2 (en) * 2015-10-16 2020-10-14 日東電工株式会社 Adhesive sheet joint separation method
JP6767104B2 (en) * 2015-11-24 2020-10-14 日東電工株式会社 How to join / separate adherends
EP3199344B1 (en) * 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
US10707531B1 (en) 2016-09-27 2020-07-07 New Dominion Enterprises Inc. All-inorganic solvents for electrolytes
FR3062327B1 (en) * 2017-01-30 2019-04-19 Safran Aircraft Engines PROCESS FOR REMOVING A METALLIC ELEMENT ADHESIVE TO A COMPOUND MATERIAL ELEMENT
WO2018142370A1 (en) 2017-02-06 2018-08-09 Nitto Denko Corporation Composition and method for prevention of leading edge errosion in wind turbines
EP3357953A1 (en) 2017-02-06 2018-08-08 Nitto Denko Corporation Composition and method for prevention of leading edge erosion in wind turbines
US9737060B1 (en) 2017-02-23 2017-08-22 Jeffrey Racho Fishing apparatus
CN110382650B (en) * 2017-03-03 2022-04-05 日东电工株式会社 Adhesive composition for electric peeling, adhesive sheet and joined body
US10481021B2 (en) * 2017-05-25 2019-11-19 TacSense, Inc. Supercapacitive iontronic nanofabric sensing assemblies
CN107785614B (en) * 2017-07-02 2019-11-05 江汉大学 The preparation method of super corsslinking molecular gel composite electrolyte membrane based on PEO
US11747532B2 (en) 2017-09-15 2023-09-05 Southwall Technologies Inc. Laminated optical products and methods of making them
CN109721947A (en) 2017-10-27 2019-05-07 财团法人工业技术研究院 Composition epoxy resin
CN111630125B (en) 2017-11-21 2022-04-26 日东电工株式会社 Basic ionic liquid composition and element comprising same
FR3074480B1 (en) * 2017-12-01 2020-01-03 Arianegroup Sas TWO-SEPARATION OF LAUNCHES BELONGING TO A LAUNCHER
CN109870837B (en) * 2017-12-05 2021-10-15 华为终端有限公司 Display assembly, display, terminal and display disassembling method
JP7063660B2 (en) * 2018-03-08 2022-05-09 日東電工株式会社 How to join and separate electro-peelable adhesive sheets, joints, and adherends
JP2019156912A (en) * 2018-03-08 2019-09-19 日東電工株式会社 Electrically peelable type adhesive sheet, bonded body and peeling method of bonded body
JP2020164778A (en) * 2018-09-03 2020-10-08 日東電工株式会社 Adhesive composition, pressure sensitive adhesive sheet and conjugate
JP2019023304A (en) * 2018-09-27 2019-02-14 日東電工株式会社 Method for bonding and separating adherends
US11081898B2 (en) 2018-12-17 2021-08-03 Microsoft Technology Licensing, Llc Electrical battery de-bonding
EP3739664A1 (en) 2019-05-14 2020-11-18 Nitto Belgium NV Safety valve for electrochemical device casings
EP3739665A1 (en) 2019-05-14 2020-11-18 Nitto Belgium NV Safety valve with debonding function
US20220282125A1 (en) * 2019-08-09 2022-09-08 Nitto Denko Corporation Electrical debonding type adhesive sheet, joined body, and method for separating joined body
PL3835381T3 (en) * 2019-12-13 2023-06-26 Henkel Ag & Co. Kgaa Two component (2k) curable adhesive composition
EP3835386B8 (en) 2019-12-13 2024-01-10 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
PL3835383T3 (en) 2019-12-13 2023-09-11 Henkel Ag & Co. Kgaa One component (1k) curable adhesive composition
EP3835378A1 (en) * 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
CN111640949B (en) * 2020-06-12 2022-02-22 宁德新能源科技有限公司 Current collector, electrode plate, electrochemical device and electronic device
JP7028913B2 (en) * 2020-06-17 2022-03-02 日東電工株式会社 Adhesive sheet joint separation method
JP2020200481A (en) * 2020-09-16 2020-12-17 日東電工株式会社 Joint/separation method for adherend
JPWO2022065480A1 (en) * 2020-09-28 2022-03-31
JPWO2022065483A1 (en) * 2020-09-28 2022-03-31
CN112521886A (en) * 2020-12-14 2021-03-19 西南科技大学 Preparation and use methods of novel adhesive capable of being peeled and disassembled as required
EP4050040A1 (en) * 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
WO2022218630A1 (en) 2021-04-14 2022-10-20 Henkel Ag & Co. Kgaa Debondable structure based on a solvent-borne pressure sensitive adhesive (psa)
CN113136159B (en) * 2021-04-27 2022-07-19 西南科技大学 Preparation and use methods of epoxy structure adhesive capable of being peeled off as required when electrified
CN117412856A (en) * 2021-06-04 2024-01-16 3M创新有限公司 Articles containing adhesive compositions exhibiting on-demand debonding behavior
DE102022104817A1 (en) 2022-03-01 2023-09-07 Tesa Se pressure sensitive adhesive composition
WO2023241875A1 (en) 2022-06-17 2023-12-21 Henkel Ag & Co. Kgaa Two component (2k) curable adhesive composition
US11857013B1 (en) 2022-06-30 2024-01-02 Createme Technologies Inc. Methods of assembling apparel products having shape memory adhesives
US11634616B1 (en) 2022-06-30 2023-04-25 CreateMe Technologies LLC Methods of assembling apparel products having boronate adhesives
US11713405B1 (en) 2022-06-30 2023-08-01 CreateMe Technologies LLC Methods of disassembling apparel products having thioester adhesives
US11542412B1 (en) 2022-06-30 2023-01-03 CreateMe Technologies LLC Methods of disassembling apparel products having cyclodextrin-azobenzene adhesives
US11712873B1 (en) 2022-06-30 2023-08-01 CreateMe Technologies LLC Boronate adhesives for apparel products
US11632995B1 (en) * 2022-06-30 2023-04-25 CreateMe Technologies LLC Methods of assembling apparel products having disulfide adhesives
US11653709B1 (en) * 2022-06-30 2023-05-23 CreateMe Technologies LLC Methods of disassembling apparel products having disulfide adhesives
US11730215B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Thioester adhesives for apparel products
US11542413B1 (en) 2022-06-30 2023-01-03 CreateMe Technologies LLC Methods of disassembling apparel products having imine adhesives
US11732159B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Methods of disassembling apparel products having boronate adhesives
US11629272B1 (en) 2022-06-30 2023-04-18 CreateMe Technologies LLC Methods of assembling apparel products having thioester adhesives
US11692111B1 (en) 2022-06-30 2023-07-04 CreateMe Technologies LLC Methods of disassembling apparel products having shape memory adhesives
US11905440B1 (en) 2022-06-30 2024-02-20 Createme Technologies Inc. Disulfide adhesives for apparel products
US11530336B1 (en) 2022-06-30 2022-12-20 CreateMe Technologies LLC Methods of assembling apparel products having cyclodextrin-azobenzene adhesives
US11530340B1 (en) 2022-06-30 2022-12-20 CreateMe Technologies LLC Cyclodextrin-azobenzene adhesives for apparel products
US11730217B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Methods of disassembling apparel products having cycloalkene adhesives
US11752234B1 (en) 2022-06-30 2023-09-12 CreateMe Technologies LLC Shape memory adhesives for apparel products
US11849791B1 (en) 2022-06-30 2023-12-26 Createme Technologies Inc. Methods of assembling apparel products having imine adhesives
US11655397B1 (en) 2022-06-30 2023-05-23 CreateMe Technologies LLC Methods of assembling apparel products having cycloalkene adhesives
EP4332144A1 (en) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4332190A1 (en) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Debondable solvent-borne pressure sensitive adhesive (psa)
EP4353760A1 (en) 2022-10-13 2024-04-17 Henkel AG & Co. KGaA Curable and electrically debondable one-component (1k) structural adhesive composition

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3679534A (en) 1971-02-09 1972-07-25 American Cyanamid Co Electrochemical formation of bonded structures
JPS5141882B2 (en) * 1973-06-08 1976-11-12
US3909497A (en) 1974-04-12 1975-09-30 Stanford Research Inst Solid polymers thermally degradable to flowable compositions
US4171240A (en) 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS6123615A (en) 1984-06-18 1986-02-01 Takeda Chem Ind Ltd Curable resin composition
US4729797A (en) 1986-12-31 1988-03-08 International Business Machines Corporation Process for removal of cured epoxy
US4882399A (en) 1987-08-21 1989-11-21 Polytechnic University Epoxy resins having reversible crosslinks
US5100494A (en) 1989-09-05 1992-03-31 Hughes Aircraft Company Structural bonding and debonding system
US5219679A (en) 1991-01-17 1993-06-15 Eic Laboratories, Inc. Solid electrolytes
ATE141222T1 (en) * 1991-07-03 1996-08-15 Gurit Essex Ag RESOLVABLE ADHESIVE CONNECTIONS, METHOD FOR THE PRODUCTION THEREOF AND USE OF DEVICES FOR RELEASING SUCH ADHESIVE CONNECTIONS
JP2728106B2 (en) 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション Cleavable diepoxide for removable device protection in electronic packaging
JPH0594818A (en) 1991-10-01 1993-04-16 Nippon Telegr & Teleph Corp <Ntt> Battery positive electrode sheet and its manufacture
EP0555114B1 (en) 1992-01-20 1996-11-13 Nippon Telegraph And Telephone Corporation Solid polymer electrolyte and method of manufacture thereof
US5252413A (en) 1992-04-07 1993-10-12 Eic Laboratories, Inc. Solid polymer electrolyte lithium batteries
US5441830A (en) 1992-10-29 1995-08-15 Moulton; Russell D. Electrically-conducting adhesion-promoters on conductive plastic
US5489624A (en) 1992-12-01 1996-02-06 Minnesota Mining And Manufacturing Company Hydrophilic pressure sensitive adhesives
WO1994015374A1 (en) * 1992-12-25 1994-07-07 Tdk Corporation Lithium secondary cell
JPH06246228A (en) * 1993-02-24 1994-09-06 Nippon Paint Co Ltd Electric conductor having paint film easy in detachment
US5399447A (en) 1993-12-06 1995-03-21 Valence Technology, Inc. Acidity reduction of adhesion promoter layer and electrolytic cells produced therefrom
US6074747A (en) 1995-06-06 2000-06-13 Avery Dennison Corporation Ink-imprintable release coatings, and pressure sensitive adhesive constructions
JPH0912980A (en) * 1995-06-28 1997-01-14 Toshiba Corp Adhesive, adhesion using the same and peeling thereof
JPH09104849A (en) * 1995-10-09 1997-04-22 Dainippon Printing Co Ltd Forming of adhesive layer
JPH09199113A (en) 1996-01-23 1997-07-31 Toshiba Battery Co Ltd Polymer electrolyte secondary cell
US5824120A (en) 1996-04-10 1998-10-20 Valence Technology, Inc. Electrically conductive adhesion promoters for current collectors
JPH10147752A (en) 1996-11-19 1998-06-02 Nippon Avionics Co Ltd Method for electrolytically peeling bonded structure
JP3225864B2 (en) 1996-12-04 2001-11-05 三菱電機株式会社 Lithium ion secondary battery and method of manufacturing the same
US5760337A (en) 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
JP3225867B2 (en) 1996-12-18 2001-11-05 三菱電機株式会社 Lithium ion secondary battery and method of manufacturing the same
JPH10302843A (en) 1997-02-28 1998-11-13 Mitsubishi Electric Corp Adhesive for battery, battery using it, and its manufacture
JPH11134275A (en) 1997-10-27 1999-05-21 Nippon Telegr & Teleph Corp <Ntt> Communication connection method and communication interface device
JP3677390B2 (en) 1998-05-19 2005-07-27 京セラ株式会社 Crusher
JP3847003B2 (en) 1998-07-07 2006-11-15 日東電工株式会社 Gel composition and use thereof
JP2000129217A (en) * 1998-10-26 2000-05-09 Nitto Denko Corp Sheet-like adhesive composition, electronic component device prepared by using same, and method of repairing the device
JP3848490B2 (en) * 1999-05-14 2006-11-22 積水化学工業株式会社 Peeling method and peelable joined body
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
GB0108199D0 (en) 2001-04-02 2001-05-23 Dupont Teijin Films Us Ltd Multilayer film
US7018440B2 (en) 2001-07-18 2006-03-28 Sumitomo Chemical Company, Limited Granular coated fertilizer
US6960248B2 (en) 2003-05-22 2005-11-01 Arizona Chemical Company Cyclic bisamides useful in formulating inks for phase-change printing
KR100497251B1 (en) 2003-08-20 2005-06-23 삼성에스디아이 주식회사 Protective composition for negative electrode of lithium sulfur battery and lithium sulfur battery fabricated by using same

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US20080283415A1 (en) 2008-11-20
US7968188B2 (en) 2011-06-28
HK1045965A1 (en) 2002-12-20
US6620308B2 (en) 2003-09-16
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US20010031367A1 (en) 2001-10-18

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