CA2328750A1 - Thermally conductive sensor - Google Patents
Thermally conductive sensor Download PDFInfo
- Publication number
- CA2328750A1 CA2328750A1 CA 2328750 CA2328750A CA2328750A1 CA 2328750 A1 CA2328750 A1 CA 2328750A1 CA 2328750 CA2328750 CA 2328750 CA 2328750 A CA2328750 A CA 2328750A CA 2328750 A1 CA2328750 A1 CA 2328750A1
- Authority
- CA
- Canada
- Prior art keywords
- sensor strip
- sensor
- electrode substrate
- electrode
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
- G01N27/3272—Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels
Abstract
A sensor strip comprises an electrode substrate, an electrode set, on the electrode substrate, and a heat conducting layer, on the electrode substrate opposite the electrode set. A sensor instrument for use with this sensor strip comprises a temperature sensor, at a side of a gap for accepting the sensor strip, opposite electrical contacts. The invention provides an accurate determination of the temperature of a sample.
Claims (28)
1. A sensor strip, comprising:
(a) an electrode substrate, (b) an electrode set, on said electrode substrate, and (c) a heat conducting layer, on said electrode substrate opposite said electrode set.
(a) an electrode substrate, (b) an electrode set, on said electrode substrate, and (c) a heat conducting layer, on said electrode substrate opposite said electrode set.
2. The sensor strip of Claim 1, wherein said heat conducting layer comprises a metal or an alloy.
3. The sensor strip of Claim 2, wherein said metal or alloy comprises at least 2% by volume of said sensor strip.
4. The sensor strip of Claim 3, wherein said metal or alloy comprises at least 20% by volume of said sensor strip.
5. The sensor strip of Claim 2, further comprising:
(d) a base, between said electrode substrate and said heat conducting layer.
(d) a base, between said electrode substrate and said heat conducting layer.
6. The sensor strip of Claim 2, wherein said sensor strip has a thermal conductivity of at least 10W/m~K.
7. The sensor strip of Claim 6, wherein said sensor strip has a thermal conductivity of at least 85W/m~K.
8. The sensor strip of Claim 4, wherein said sensor strip has a thermal conductivity of at least 85W/m~K, and said heat conducting layer comprises copper, alloys of copper, aluminum, or alloys of aluminum.
9. The sensor strip of Claim 1, further comprising:
(e) a dielectric, on said electrode set, and (f) reagent on said electrode set.
(e) a dielectric, on said electrode set, and (f) reagent on said electrode set.
10. A sensor strip, comprising:
(a) an electrode substrate, and (b) an electrode set, on said electrode substrate, wherein said sensor strip has a thermal conductivity of at least 10 W/m~K.
(a) an electrode substrate, and (b) an electrode set, on said electrode substrate, wherein said sensor strip has a thermal conductivity of at least 10 W/m~K.
11 11. The sensor strip of Claim 10, further comprising:
(d) a base, between said electrode substrate and said heat conducting layer.
(d) a base, between said electrode substrate and said heat conducting layer.
12. The sensor strip of Claim 10, wherein said sensor strip has a thermal conductivity of at least 85W/m~K.
13. The sensor strip of Claim 10, further comprising:
(e) a dielectric, on said electrode set, and (f) reagent on said electrode set.
(e) a dielectric, on said electrode set, and (f) reagent on said electrode set.
14. In a sensor strip, including an electrode substrate and an electrode set on said electrode substrate, the improvement comprising: a heat conducting layer on said electrode substrate, opposite said electrode set.
15. The sensor strip of Claim 14, further comprising a base, between said electrode substrate and said heat conducting layer.
16. A sensor instrument for accepting a sensor strip, comprising:
a gap, electrical contacts at a first side of said gap, and a temperature sensor, at a second side of said gap, opposite said electrical contacts.
a gap, electrical contacts at a first side of said gap, and a temperature sensor, at a second side of said gap, opposite said electrical contacts.
17. In a sensor instrument for accepting a sensor strip, including electronics for electrochemical analysis, a gap having electrical contacts for contacting contact pads on the sensor strip, and having a temperature sensor, the improvement comprising:
a temperature sensor in the gap.
a temperature sensor in the gap.
18. A method of making a sensor strip, comprising:
forming an electrode set on an electrode substrate; and attaching said electrode set to a heat conducing layer.
forming an electrode set on an electrode substrate; and attaching said electrode set to a heat conducing layer.
19. The method of Claim 18, wherein said attaching is carried out before said forming.
20. The method of Claim 1, wherein said heat conducting layer comprises a metal or an alloy.
21. The method of Claim 20, wherein said metal or alloy comprises at least 2%
by volume of said sensor strip.
by volume of said sensor strip.
22. The method of Claim 21, wherein said metal or alloy comprises at least 20%
by volume of said sensor strip.
by volume of said sensor strip.
23. The method of Claim 21, wherein said sensor strip comprises a base, between said electrode substrate and said heat conducting layer.
24. The method of Claim 21, wherein said sensor strip has a thermal conductivity of at least 10W/m~K.
25. The method of Claim 24, wherein said sensor strip has a thermal conductivity of at least 85W/m~K.
26. The method of Claim 22, wherein said sensor strip has a thermal conductivity of at least 85W/m~K, and said heat conducting layer comprises copper, alloys of copper, aluminum, or alloys of aluminum.
27. The method of Claim 18, wherein said sensor strip comprises a dielectric, on said electrode set, and reagent on said electrode set.
28. Packaged sensor strips, comprising:
a plurality of the sensor strips of one of Claims 1 to 15, a vial, containing said plurality of said sensor strips, and a stopper, sealing said vial.
a plurality of the sensor strips of one of Claims 1 to 15, a vial, containing said plurality of said sensor strips, and a stopper, sealing said vial.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 2696661 CA2696661A1 (en) | 1999-12-23 | 2000-12-18 | Thermally conductive sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/471,570 | 1999-12-23 | ||
US09/471,570 US6780296B1 (en) | 1999-12-23 | 1999-12-23 | Thermally conductive sensor |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2696661 Division CA2696661A1 (en) | 1999-12-23 | 2000-12-18 | Thermally conductive sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2328750A1 true CA2328750A1 (en) | 2001-06-23 |
CA2328750C CA2328750C (en) | 2010-07-06 |
Family
ID=23872129
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2696661 Abandoned CA2696661A1 (en) | 1999-12-23 | 2000-12-18 | Thermally conductive sensor |
CA 2328750 Expired - Fee Related CA2328750C (en) | 1999-12-23 | 2000-12-18 | Thermally conductive sensor |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2696661 Abandoned CA2696661A1 (en) | 1999-12-23 | 2000-12-18 | Thermally conductive sensor |
Country Status (4)
Country | Link |
---|---|
US (2) | US6780296B1 (en) |
EP (1) | EP1114994A3 (en) |
JP (2) | JP3382604B2 (en) |
CA (2) | CA2696661A1 (en) |
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US9658182B2 (en) | 2008-11-28 | 2017-05-23 | Panasonic Healthcare Holdings Co., Ltd. | Method for measuring concentration of analyte in blood sample, and biosensor system |
US10690620B2 (en) | 2008-11-28 | 2020-06-23 | Phc Holdings Corporation | Method for measuring concentration of analyte in blood sample, and biosensor system |
US8859292B2 (en) | 2009-01-30 | 2014-10-14 | Panasonic Healthcare Co., Ltd. | Method for measuring temperature of biological sample, method for measuring concentration of biological sample, sensor chip and biosensor system |
US9395320B2 (en) | 2009-01-30 | 2016-07-19 | Panasonic Healthcare Holdings Co., Ltd. | Method for measuring temperature of biological sample, measuring device, and biosensor system |
US9664639B2 (en) | 2009-01-30 | 2017-05-30 | Panasonic Healthcare Holdings Co., Ltd. | Method for measuring temperature of biological sample, measuring device, and biosensor system |
US9874537B2 (en) | 2009-01-30 | 2018-01-23 | Panasonic Healthcare Holdings Co., Ltd. | Method for measuring temperature of biological sample, measuring device, and biosensor system |
US10520461B2 (en) | 2009-01-30 | 2019-12-31 | Phc Holdings Corporation | Method for measuring temperature of biological sample, measuring device, and biosensor system |
Also Published As
Publication number | Publication date |
---|---|
JP3595315B2 (en) | 2004-12-02 |
CA2328750C (en) | 2010-07-06 |
US20040238357A1 (en) | 2004-12-02 |
EP1114994A2 (en) | 2001-07-11 |
CA2696661A1 (en) | 2001-06-23 |
US6780296B1 (en) | 2004-08-24 |
JP2001235444A (en) | 2001-08-31 |
US7510643B2 (en) | 2009-03-31 |
JP3382604B2 (en) | 2003-03-04 |
EP1114994A3 (en) | 2004-01-07 |
JP2003042995A (en) | 2003-02-13 |
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