CA2318011A1 - Method and apparatus for manufacturing a device - Google Patents
Method and apparatus for manufacturing a device Download PDFInfo
- Publication number
- CA2318011A1 CA2318011A1 CA002318011A CA2318011A CA2318011A1 CA 2318011 A1 CA2318011 A1 CA 2318011A1 CA 002318011 A CA002318011 A CA 002318011A CA 2318011 A CA2318011 A CA 2318011A CA 2318011 A1 CA2318011 A1 CA 2318011A1
- Authority
- CA
- Canada
- Prior art keywords
- mold
- silicon
- mold cavity
- cavity
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
- B29C33/405—Elastomers, e.g. rubber
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
- A61M2037/0046—Solid microneedles
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
- A61M2037/0053—Methods for producing microneedles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/753—Medical equipment; Accessories therefor
- B29L2031/7544—Injection needles, syringes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/055—Microneedles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/034—Moulding
Abstract
A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A
microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.
microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.
Claims (28)
1. A method of making a molded device comprising the steps of:
providing a mold assembly having a mold section with a recess defining a mold cavity and. having a silicon mold member disposed in said mold cavity, said silicon mold member having a mold surface with a contoured surface defining an impression of said device facing said mold cavity;
introducing a plastic material into said mold cavity to fill said mold cavity and said contoured surface in said silicon mold member to form said molded device having a body and molded surface corresponding to said contoured surface; and removing said molded device from said mold section.
providing a mold assembly having a mold section with a recess defining a mold cavity and. having a silicon mold member disposed in said mold cavity, said silicon mold member having a mold surface with a contoured surface defining an impression of said device facing said mold cavity;
introducing a plastic material into said mold cavity to fill said mold cavity and said contoured surface in said silicon mold member to form said molded device having a body and molded surface corresponding to said contoured surface; and removing said molded device from said mold section.
2. The method of claim 1, wherein said molded device is a microneedle device having a plurality of microneedles, about 5 to 250 microns in length.
3. The method of claim 2, wherein said microneedles are hollow
4. The method of claim 1, wherein said silicon mold member releases of said device from the mold surface and said molding is in the absence of a release agent, whereby said molded device is substantially clean and sterile.
5. The method of claim 1, wherein said mold cavity has a plurality of side walls and a bottom surface, and said silicon mold member is bonded to said bottom surface.
6. The method of claim 5, wherein said silicon mold member has an outer. peripheral edge corresponding to the shape of said mold cavity, wherein said silicon mold member substantially covers said bottom surface of said mold cavity.
7. The method of claim 6, wherein said mold surface of said silicon mold member is substantially flat.
8. The method of claim 7, wherein said recesses in said mold surface are spaced apart uniformly to form rows and columns, each of said recesses having a depth of about 5 to about 250 microns and said recesses being spaced to provide a density of about 4 to about 100 of said recesses per mm2.
9. The method of claim 1, wherein said polymeric material is selected from the group consisting of polycarbonates, polyethylenes, polypropylene, polystyrene, polyesters and polyamides.
10. The method of claim 1, wherein said contoured surface of said silicon mold member has at least one recess, peak or ridge with at least one dimension ranging from about 0.5 micron to about 500 microns.
11. The method of claim 1, wherein said mold assembly includes an inlet in communication with said mold cavity, and said introducing step comprises injecting said plastic material through said inlet to said mold cavity.
12. The method of claim 1, wherein said introducing step comprises injecting a hot thermoplastic material into said mold cavity.
13. The method of claim 1, wherein said introducing step comprises introducing a thermoplastic material into said cavity and heating and compressing said thermoplastic material to mold said device.
14. The method of claim 1, wherein said introducing step comprises positioning a thermoplastic substrate on said mold cavity and pressing said mold assembly against said substrate to form said molded device.
15. A device made by the method of claim 1.
16. A method of injection molding a device, said method comprising the steps of:
providing a mold assembly having a mold section with a recess defining a .mold cavity, said recess having at least one side wall and a bottom wall, and a silicon mold member coupled to said mold section within said recess, said silicon mold member having a contoured mold surface facing said mold cavity and having at least one recess of about 5 to about 250 microns in at least one dimension;
closing said mold cavity and injecting a hot polymeric material into said mold cavity to substantially fill said mold cavity and to form a molded device, without said polymeric material adhering to said silicon mold member; and cooling the mold assembly and removing said molded device from said mold cavity, said molded device having a surface corresponding to said mold surface.
providing a mold assembly having a mold section with a recess defining a .mold cavity, said recess having at least one side wall and a bottom wall, and a silicon mold member coupled to said mold section within said recess, said silicon mold member having a contoured mold surface facing said mold cavity and having at least one recess of about 5 to about 250 microns in at least one dimension;
closing said mold cavity and injecting a hot polymeric material into said mold cavity to substantially fill said mold cavity and to form a molded device, without said polymeric material adhering to said silicon mold member; and cooling the mold assembly and removing said molded device from said mold cavity, said molded device having a surface corresponding to said mold surface.
17. The method of claim 16, wherein said molded device is molded substantially in the absence of a release agent on said silicon mold member or said maid surface.
18. The method of claim 16, wherein said silicon mold member has an outer peripheral edge corresponding to the shape of said mold cavity, wherein said silicon mold member substantially covers said bottom wall of said mold cavity.
19. The method of claim 16, wherein said mold surface includes a plurality of spaced apart recess to form rows and columns, and said recesses being spaced to provide a density of about 4 to about 100 of said recesses per mm2.
20. The method of claim 16, wherein said polymeric material is selected from the group consisting of polycarbonates, polyethylenes, polypropylene, polystyrene, polyesters and polyamides.
21. The method of claim 16, wherein said molded device is a microneedle device.
22. The method of claim 16, wherein said contoured surface of said silicon mold member has at least one recess, peak or ridge with at least one dimension ranging from about 0.5 micron to about 500 microns.
23. A mold assembly-comprising:
a mold section with a recess defining a mold cavity for receiving a molding material and forming a molded device; and a silicon mold member disposed in said mold cavity, said silicon mold member with a mold surface facing said mold cavity, said mold surface having a contoured surface defining an impression for molding said device.
a mold section with a recess defining a mold cavity for receiving a molding material and forming a molded device; and a silicon mold member disposed in said mold cavity, said silicon mold member with a mold surface facing said mold cavity, said mold surface having a contoured surface defining an impression for molding said device.
24. The assembly of claim 23, wherein said mold member includes a plurality of recesses, about 5 to 250 microns deep.
25. The assembly of claim 23, wherein said mold cavity has a plurality of side walls and a bottom surface, and said silicon mold member is bonded to said bottom surface.
26. The assembly of claim 25, wherein said silicon mold member has an outer peripheral edge corresponding to the shape of said mold cavity, wherein said silicon mold member substantially covers said bottom surface of said mold cavity.
27. The assembly of claim 26, wherein said mold surface of said silicon mold member is substantially flat.
28. The assembly of claim 23, wherein said recesses in said mold surface are spaced apart uniformly to form rows and columns, each of said recesses having a depth of about 5 to about 250 microns and said recesses being spaced to provide a density of about 4 to about 100 of said recesses per mm2.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/408,450 | 1999-09-29 | ||
US09/408,450 US6331266B1 (en) | 1999-09-29 | 1999-09-29 | Process of making a molded device |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2318011A1 true CA2318011A1 (en) | 2001-03-29 |
CA2318011C CA2318011C (en) | 2010-08-10 |
Family
ID=23616343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2318011A Expired - Fee Related CA2318011C (en) | 1999-09-29 | 2000-09-12 | Method and apparatus for manufacturing a device |
Country Status (8)
Country | Link |
---|---|
US (4) | US6331266B1 (en) |
EP (1) | EP1088642B1 (en) |
JP (1) | JP4709363B2 (en) |
AU (1) | AU778326B2 (en) |
CA (1) | CA2318011C (en) |
DE (1) | DE60019052T2 (en) |
ES (1) | ES2235726T3 (en) |
SG (1) | SG97931A1 (en) |
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US9289922B2 (en) | 2006-11-14 | 2016-03-22 | Atomic Energy Of Canada Limited/Energie | Device and method for surface replication |
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JP2001158031A (en) | 2001-06-12 |
CA2318011C (en) | 2010-08-10 |
SG97931A1 (en) | 2003-08-20 |
US20040222349A1 (en) | 2004-11-11 |
US20060197004A1 (en) | 2006-09-07 |
AU778326B2 (en) | 2004-11-25 |
DE60019052T2 (en) | 2006-02-16 |
AU5650800A (en) | 2001-04-05 |
EP1088642A1 (en) | 2001-04-04 |
DE60019052D1 (en) | 2005-05-04 |
ES2235726T3 (en) | 2005-07-16 |
US6331266B1 (en) | 2001-12-18 |
US20020053756A1 (en) | 2002-05-09 |
JP4709363B2 (en) | 2011-06-22 |
EP1088642B1 (en) | 2005-03-30 |
US7052268B2 (en) | 2006-05-30 |
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