CA2295180A1 - Gas injection disc assembly for cvd applications - Google Patents
Gas injection disc assembly for cvd applications Download PDFInfo
- Publication number
- CA2295180A1 CA2295180A1 CA002295180A CA2295180A CA2295180A1 CA 2295180 A1 CA2295180 A1 CA 2295180A1 CA 002295180 A CA002295180 A CA 002295180A CA 2295180 A CA2295180 A CA 2295180A CA 2295180 A1 CA2295180 A1 CA 2295180A1
- Authority
- CA
- Canada
- Prior art keywords
- insert
- outer ring
- gas
- plenum
- injectant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 title abstract 2
- 239000007924 injection Substances 0.000 title abstract 2
- 239000007789 gas Substances 0.000 abstract 11
- 238000007789 sealing Methods 0.000 abstract 4
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/4558—Perforated rings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
Abstract
A gas injection disc is provided which includes an outer ring and a tubular modular insert which slips into the outer ring. The outer ring is provided with an inner bore, a ring-shaped plenum located around the inner bore, an outer gas sealing surface around the plenum, and two gas feed paths extending from the periphery of the outer ring to the plenum. The gas feed paths are each provided with a gas feed attachment for coupling gas supply tubes thereto. The insert is provided with a plurality of radially aligned injectant holes, an inner gas sealing surface, and an axial bore. The insert is seated in the inner bore of the outer ring such that the inner and outer gas sealing surface face each other with a small gap provided therebetween which enables the insertion of the insert into the inner bore. The insert thereby substantially encloses the plenum, and the injectant holes are aligned with the plenum to receive injectant gases and direct the injectant gases into the axial bore of the insert. During the CVD process, the heat generated by the arc jet causes the insert to expand and eliminate the gap between the inner and outer sealing surfaces to thereby prevent undesirable gas leakage. Once the CVD operation is stopped the insert is permitted to cool and contract and return to its cooled dimensions unencumbered by the outer ring. The insert may then be removed for cleaning or for replacement with an insert having different characteristics.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/883,020 US5846330A (en) | 1997-06-26 | 1997-06-26 | Gas injection disc assembly for CVD applications |
US08/883,020 | 1997-06-26 | ||
PCT/US1998/013037 WO1999000533A1 (en) | 1997-06-26 | 1998-06-22 | Gas injection disc assembly for cvd applications |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2295180A1 true CA2295180A1 (en) | 1999-01-07 |
CA2295180C CA2295180C (en) | 2003-11-04 |
Family
ID=25381825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002295180A Expired - Fee Related CA2295180C (en) | 1997-06-26 | 1998-06-22 | Gas injection disc assembly for cvd applications |
Country Status (6)
Country | Link |
---|---|
US (1) | US5846330A (en) |
EP (1) | EP0991792B1 (en) |
JP (1) | JP2002508808A (en) |
CA (1) | CA2295180C (en) |
DE (1) | DE69804614T2 (en) |
WO (1) | WO1999000533A1 (en) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6110544A (en) | 1997-06-26 | 2000-08-29 | General Electric Company | Protective coating by high rate arc plasma deposition |
US6454860B2 (en) * | 1998-10-27 | 2002-09-24 | Applied Materials, Inc. | Deposition reactor having vaporizing, mixing and cleaning capabilities |
US6666920B1 (en) | 2000-08-09 | 2003-12-23 | Itt Manufacturing Enterprises, Inc. | Gas collector for providing an even flow of gasses through a reaction chamber of an epitaxial reactor |
US6325855B1 (en) | 2000-08-09 | 2001-12-04 | Itt Manufacturing Enterprises, Inc. | Gas collector for epitaxial reactors |
US6716289B1 (en) | 2000-08-09 | 2004-04-06 | Itt Manufacturing Enterprises, Inc. | Rigid gas collector for providing an even flow of gasses |
US6758909B2 (en) | 2001-06-05 | 2004-07-06 | Honeywell International Inc. | Gas port sealing for CVD/CVI furnace hearth plates |
US6797108B2 (en) * | 2001-10-05 | 2004-09-28 | Applied Materials, Inc. | Apparatus and method for evenly flowing processing gas onto a semiconductor wafer |
US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
US6916398B2 (en) * | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US6821347B2 (en) | 2002-07-08 | 2004-11-23 | Micron Technology, Inc. | Apparatus and method for depositing materials onto microelectronic workpieces |
US6884296B2 (en) * | 2002-08-23 | 2005-04-26 | Micron Technology, Inc. | Reactors having gas distributors and methods for depositing materials onto micro-device workpieces |
US7335396B2 (en) | 2003-04-24 | 2008-02-26 | Micron Technology, Inc. | Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers |
US7264849B2 (en) * | 2003-07-11 | 2007-09-04 | Optisolar, Inc. | Roll-vortex plasma chemical vapor deposition method |
US7235138B2 (en) | 2003-08-21 | 2007-06-26 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces |
US7344755B2 (en) | 2003-08-21 | 2008-03-18 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers |
US7422635B2 (en) | 2003-08-28 | 2008-09-09 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces |
US7282244B2 (en) * | 2003-09-05 | 2007-10-16 | General Electric Company | Replaceable plate expanded thermal plasma apparatus and method |
US7056806B2 (en) | 2003-09-17 | 2006-06-06 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces |
US7282239B2 (en) | 2003-09-18 | 2007-10-16 | Micron Technology, Inc. | Systems and methods for depositing material onto microfeature workpieces in reaction chambers |
US7323231B2 (en) | 2003-10-09 | 2008-01-29 | Micron Technology, Inc. | Apparatus and methods for plasma vapor deposition processes |
US7647886B2 (en) | 2003-10-15 | 2010-01-19 | Micron Technology, Inc. | Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers |
US7258892B2 (en) | 2003-12-10 | 2007-08-21 | Micron Technology, Inc. | Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition |
US7906393B2 (en) * | 2004-01-28 | 2011-03-15 | Micron Technology, Inc. | Methods for forming small-scale capacitor structures |
CN1965104A (en) * | 2004-03-09 | 2007-05-16 | 埃克阿泰克有限责任公司 | Expanding thermal plasma deposition system |
US7584942B2 (en) * | 2004-03-31 | 2009-09-08 | Micron Technology, Inc. | Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers |
US8133554B2 (en) | 2004-05-06 | 2012-03-13 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
US7699932B2 (en) | 2004-06-02 | 2010-04-20 | Micron Technology, Inc. | Reactors, systems and methods for depositing thin films onto microfeature workpieces |
DE102004029466A1 (en) * | 2004-06-18 | 2006-01-05 | Leybold Optics Gmbh | Medieninjektor |
US20070048456A1 (en) * | 2004-09-14 | 2007-03-01 | Keshner Marvin S | Plasma enhanced chemical vapor deposition apparatus and method |
US7562638B2 (en) * | 2005-12-23 | 2009-07-21 | Lam Research Corporation | Methods and arrangement for implementing highly efficient plasma traps |
US7554053B2 (en) * | 2005-12-23 | 2009-06-30 | Lam Research Corporation | Corrugated plasma trap arrangement for creating a highly efficient downstream microwave plasma system |
US7679024B2 (en) * | 2005-12-23 | 2010-03-16 | Lam Research Corporation | Highly efficient gas distribution arrangement for plasma tube of a plasma processing chamber |
US20080139003A1 (en) * | 2006-10-26 | 2008-06-12 | Shahid Pirzada | Barrier coating deposition for thin film devices using plasma enhanced chemical vapor deposition process |
US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
US20090120364A1 (en) * | 2007-11-09 | 2009-05-14 | Applied Materials, Inc. | Gas mixing swirl insert assembly |
US8291857B2 (en) | 2008-07-03 | 2012-10-23 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
TWI385042B (en) * | 2009-06-26 | 2013-02-11 | Iner Aec Executive Yuan | Multi-gas mixer and device for supplying mixed gas to plasma torch |
CN102762767B (en) * | 2010-03-12 | 2015-11-25 | 应用材料公司 | There is the atomic layer deposition chambers in multiple injections road |
US9574268B1 (en) | 2011-10-28 | 2017-02-21 | Asm America, Inc. | Pulsed valve manifold for atomic layer deposition |
US10035245B2 (en) | 2012-04-30 | 2018-07-31 | Eigen Systems Limited | Clamp foot air jet apparatus |
JP6473131B2 (en) | 2013-03-12 | 2019-02-20 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Multi-zone gas injection assembly with azimuthal and radial distribution control |
KR102156795B1 (en) * | 2013-05-15 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Deposition apparatus |
US10113232B2 (en) | 2014-07-31 | 2018-10-30 | Lam Research Corporation | Azimuthal mixer |
US9951421B2 (en) * | 2014-12-10 | 2018-04-24 | Lam Research Corporation | Inlet for effective mixing and purging |
US10662527B2 (en) | 2016-06-01 | 2020-05-26 | Asm Ip Holding B.V. | Manifolds for uniform vapor deposition |
CN113196444A (en) * | 2018-12-20 | 2021-07-30 | 应用材料公司 | Method and apparatus for supplying improved gas flow to a processing volume of a processing chamber |
US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
KR20210048408A (en) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor deposition reactor manifolds |
US20220122819A1 (en) * | 2020-10-15 | 2022-04-21 | Applied Materials, Inc. | Semiconductor chamber components for back diffusion control |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3914573A (en) * | 1971-05-17 | 1975-10-21 | Geotel Inc | Coating heat softened particles by projection in a plasma stream of Mach 1 to Mach 3 velocity |
US4019091A (en) * | 1974-05-30 | 1977-04-19 | U.S. Philips Corporation | Gas discharge electron gun for generating an electron beam by means of a glow discharge |
JPS61143579A (en) * | 1984-12-14 | 1986-07-01 | Nachi Fujikoshi Corp | Method for feeding plasma ion |
US4728863A (en) * | 1985-12-04 | 1988-03-01 | Wertheimer Michael R | Apparatus and method for plasma treatment of substrates |
GB8713986D0 (en) * | 1987-06-16 | 1987-07-22 | Shell Int Research | Apparatus for plasma surface treating |
US5144110A (en) * | 1988-11-04 | 1992-09-01 | Marantz Daniel Richard | Plasma spray gun and method of use |
US4990739A (en) * | 1989-07-07 | 1991-02-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Plasma gun with coaxial powder feed and adjustable cathode |
US5256205A (en) * | 1990-05-09 | 1993-10-26 | Jet Process Corporation | Microwave plasma assisted supersonic gas jet deposition of thin film materials |
US5188671A (en) * | 1990-08-08 | 1993-02-23 | Hughes Aircraft Company | Multichannel plate assembly for gas source molecular beam epitaxy |
US5200232A (en) * | 1990-12-11 | 1993-04-06 | Lam Research Corporation | Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors |
US5204145A (en) * | 1991-03-04 | 1993-04-20 | General Electric Company | Apparatus for producing diamonds by chemical vapor deposition and articles produced therefrom |
US5342660A (en) * | 1991-05-10 | 1994-08-30 | Celestech, Inc. | Method for plasma jet deposition |
JPH0558782A (en) * | 1991-08-27 | 1993-03-09 | Hitachi Koki Co Ltd | Device for vapor phase synthesis of diamond and method therefor |
US5571332A (en) * | 1995-02-10 | 1996-11-05 | Jet Process Corporation | Electron jet vapor deposition system |
US5746834A (en) * | 1996-01-04 | 1998-05-05 | Memc Electronics Materials, Inc. | Method and apparatus for purging barrel reactors |
-
1997
- 1997-06-26 US US08/883,020 patent/US5846330A/en not_active Expired - Fee Related
-
1998
- 1998-06-22 EP EP98931509A patent/EP0991792B1/en not_active Expired - Lifetime
- 1998-06-22 WO PCT/US1998/013037 patent/WO1999000533A1/en active IP Right Grant
- 1998-06-22 DE DE69804614T patent/DE69804614T2/en not_active Expired - Fee Related
- 1998-06-22 JP JP50566099A patent/JP2002508808A/en active Pending
- 1998-06-22 CA CA002295180A patent/CA2295180C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69804614T2 (en) | 2002-11-21 |
WO1999000533A1 (en) | 1999-01-07 |
EP0991792B1 (en) | 2002-04-03 |
US5846330A (en) | 1998-12-08 |
JP2002508808A (en) | 2002-03-19 |
EP0991792A1 (en) | 2000-04-12 |
DE69804614D1 (en) | 2002-05-08 |
CA2295180C (en) | 2003-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |