CA2263179A1 - Hybrid optical multi-axis beam steering apparatus - Google Patents
Hybrid optical multi-axis beam steering apparatusInfo
- Publication number
- CA2263179A1 CA2263179A1 CA002263179A CA2263179A CA2263179A1 CA 2263179 A1 CA2263179 A1 CA 2263179A1 CA 002263179 A CA002263179 A CA 002263179A CA 2263179 A CA2263179 A CA 2263179A CA 2263179 A1 CA2263179 A1 CA 2263179A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- hinge
- plate
- cavity
- beam steering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12104—Mirror; Reflectors or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3594—Characterised by additional functional means, e.g. means for variably attenuating or branching or means for switching differently polarized beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/08—Disposition or mounting of heads or light sources relatively to record carriers
- G11B7/085—Disposition or mounting of heads or light sources relatively to record carriers with provision for moving the light beam into, or out of, its operative position or across tracks, otherwise than during the transducing operation, e.g. for adjustment or preliminary positioning or track change or selection
- G11B7/08547—Arrangements for positioning the light beam only without moving the head, e.g. using static electro-optical elements
- G11B7/08564—Arrangements for positioning the light beam only without moving the head, e.g. using static electro-optical elements using galvanomirrors
Abstract
An optical beam steering apparatus has a substrate that defines one or more aligned cavities. A primary optical path means accommodates passage of a light beam. An upper cavity is provided in a portion of the substrate. The upper cavity is aligned to a predetermined degree of precision and is in direct communication with the primary optical path means. A beam steering means is provided in the upper cavity to controllably direct the beam.
Claims (61)
1. An optical beam steering apparatus comprising:
a substrate defining one or more aligned cavities;
a primary optical path means for accommodating the passage of a light beam;
an upper cavity provided in a portion of said substrate that is aligned to a predetermined degree of precision and in direct communication with said primary optical path means;
a beam steering means provided in said upper cavity for controllably directing said beam.
a substrate defining one or more aligned cavities;
a primary optical path means for accommodating the passage of a light beam;
an upper cavity provided in a portion of said substrate that is aligned to a predetermined degree of precision and in direct communication with said primary optical path means;
a beam steering means provided in said upper cavity for controllably directing said beam.
2. The apparatus according to Claim 1 wherein said beam steering means is placed at a predetermined orientation within said upper cavity for the purpose of controllably altering, in one or more directions, the optical path of an impinging beam emanating from or propagating towards said primary optical path means.
3. The apparatus according to Claim 1 wherein said primary optical path means comprises a waveguide.
4. The apparatus according to Claim 1 wherein said primary optical path means comprises a groove provided into said substrate for accommodating the passage of a light beam.
5. The apparatus according to Claim 4 further comprising a primary optical element means for accommodating a beam of light wherein said primary optical element means is provided within said groove.
6. The apparatus according to Claim 5 wherein said primary optical element means is selected from the group consisting of optical fibers, refractive optical elements, reflective optical elements, phase optical elements, light detectors, beam splitters, lasers, light emitting diodes, incandescent light sources, fluorescent light sources, natural light sources or plasma light sources.
7. The apparatus according to Claim 1 wherein said substrate comprises a crystal made of a material that has a differential etch rate between different crystallographic planes.
8. The apparatus according to Claim 1 wherein at least one cavity is anisotropically etched into said substrate.
9. The apparatus according to Claim 1 wherein said substrate is made of a solid material capable of having geometrically precise cavities molded within said substrate.
10. The apparatus according to Claim 1 which further comprises a cover plate means for sealing one or more said aligned cavities, wherein said cover plate is provided adjacent to a surface of said substrate.
11. The apparatus according to Claim 10 wherein said cover plate is comprised of one of an optically opaque, transparent, translucent, electrically conductive, or an electrical insulator material.
12. The apparatus according to Claim 1, further comprising:
a lower cavity provided into a bottom surface of said substrate and having a predetermined alignment with respect to said upper cavity;
a suspended bridge means for spanning said primary optical path means at a juncture between said primary optical path means and said upper cavity;
a cantilever hinge means flexibly anchoring said beam steering means to said suspended bridge means; and wherein said beam steering means has at least a reflective lower surface and is rotated downwards into said upper cavity providing an impinging beam of light emanating from said primary optical path means is to be controllably deflected in a generally downward direction through said bottom of said upper cavity and said lower cavity, and a beam of light entering from said lower cavity is controllably deflected towards said primary optical path means.
a lower cavity provided into a bottom surface of said substrate and having a predetermined alignment with respect to said upper cavity;
a suspended bridge means for spanning said primary optical path means at a juncture between said primary optical path means and said upper cavity;
a cantilever hinge means flexibly anchoring said beam steering means to said suspended bridge means; and wherein said beam steering means has at least a reflective lower surface and is rotated downwards into said upper cavity providing an impinging beam of light emanating from said primary optical path means is to be controllably deflected in a generally downward direction through said bottom of said upper cavity and said lower cavity, and a beam of light entering from said lower cavity is controllably deflected towards said primary optical path means.
13. The apparatus according to Claim 12 further comprising:
a secondary optical element means for accommodating a beam of light, wherein said secondary optical element means is disposed within said lower cavity; and an alignment means for aligning said secondary optical element within said lower cavity such, wherein said secondary optical element is substantially centered in the lower cavity and the optical axis of the secondary optical element is aligned to a predetermined angle with respect to a surface normal emanating from a lower surface of said substrate.
a secondary optical element means for accommodating a beam of light, wherein said secondary optical element means is disposed within said lower cavity; and an alignment means for aligning said secondary optical element within said lower cavity such, wherein said secondary optical element is substantially centered in the lower cavity and the optical axis of the secondary optical element is aligned to a predetermined angle with respect to a surface normal emanating from a lower surface of said substrate.
14. The apparatus according to Claim 13 wherein said secondary optical element means is selected from the group consisting of optical fibers, refractive optical elements, reflective optical elements, phase optical elements, light detectors, beam splitters, lasers, light emitting diodes, incandescent light sources, fluorescent light sources, natural light sources or plasma light sources.
15. The apparatus according to Claim 1 further comprising:
a cantilever hinge means flexibly connecting said beam steering means with an upper edge of said upper cavity that is not coincident with said primary optical path means; and wherein, said beam steering means has at least a reflective upper surface such that said beam steering means is disposed within said upper cavity causing an impinging beam of light emanating from said primary optical path means, to be controllably deflected in a generally upwards direction and a beam of light entering from above said upper cavity is controllably deflected towards said primary optical path means.
a cantilever hinge means flexibly connecting said beam steering means with an upper edge of said upper cavity that is not coincident with said primary optical path means; and wherein, said beam steering means has at least a reflective upper surface such that said beam steering means is disposed within said upper cavity causing an impinging beam of light emanating from said primary optical path means, to be controllably deflected in a generally upwards direction and a beam of light entering from above said upper cavity is controllably deflected towards said primary optical path means.
16. The apparatus according to Claim 15 further comprising:
a secondary optical element means for accommodating a beam of light, said secondary optical element means disposed adjacent to said upper cavity;
an alignment means for aligning said secondary optical element adjacent to said upper cavity, such that the secondary optical element is substantially centered above the upper cavity and the optical axis of the secondary optical element is aligned to a predetermined angle with respect to a surface normal emanating from an upper surface of said substrate.
a secondary optical element means for accommodating a beam of light, said secondary optical element means disposed adjacent to said upper cavity;
an alignment means for aligning said secondary optical element adjacent to said upper cavity, such that the secondary optical element is substantially centered above the upper cavity and the optical axis of the secondary optical element is aligned to a predetermined angle with respect to a surface normal emanating from an upper surface of said substrate.
17. The apparatus according to Claim 1 wherein said beam steering means comprises:
a gimbaled micromirror nested into one or more sets of gimbaled hinge means, wherein each set of gimbaled hinge means defines an independent axes of rotation of said gimbaled micromirror with respect to a frame holding an outermost set of said gimbaled hinge means and said outer most frame is connected at one edge with an upper surface of said substrate by a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed for positioning said gimbaled micromirror;
a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said gimbaled micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
a gimbaled micromirror nested into one or more sets of gimbaled hinge means, wherein each set of gimbaled hinge means defines an independent axes of rotation of said gimbaled micromirror with respect to a frame holding an outermost set of said gimbaled hinge means and said outer most frame is connected at one edge with an upper surface of said substrate by a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed for positioning said gimbaled micromirror;
a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said gimbaled micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
18. The apparatus according to Claim 17 wherein said gimbaled micromirror is provided with a conductive film adjacent to its surface and across said gimbaled hinge means such that said gimbaled micromirror is in electrical communication with said electronic control means.
19. The apparatus according to Claim 1 wherein said beam steering means comprises:
a cantilevered micromirror nested into one or more sets of cantilever hinge means, each of which, defines an independent axes of rotation of said cantilevered micromirror with respect to a frame holding the outer most cantilever hinge means;
wherein said outer most frame is connected at one edge with the surface of said substrate by a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed for positioning said cantilevered micromirror, a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said cantilevered micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
a cantilevered micromirror nested into one or more sets of cantilever hinge means, each of which, defines an independent axes of rotation of said cantilevered micromirror with respect to a frame holding the outer most cantilever hinge means;
wherein said outer most frame is connected at one edge with the surface of said substrate by a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed for positioning said cantilevered micromirror, a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said cantilevered micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
20. The apparatus according to Claim 19 wherein said cantilevered micromirror is provided with a conductive film adjacent to its surface and across said cantilever hinge means such that said cantilevered micromirror is in electrical communication with said electronic control means.
21. The apparatus according to Claim 1 wherein said beam steering means comprises:
a hybrid micromirror nested in any combination of cantilever hinge means and gimbaled hinge means providing one or more independent axes of rotation with respect to a frame holding the outer most hinge structure;.
wherein said outer most frame is connected at one edge with the surface of said substrate thereby forming a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed adjacent to said hybrid micromirror;
a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said hybrid micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
a hybrid micromirror nested in any combination of cantilever hinge means and gimbaled hinge means providing one or more independent axes of rotation with respect to a frame holding the outer most hinge structure;.
wherein said outer most frame is connected at one edge with the surface of said substrate thereby forming a cantilever hinge means such that said beam steering means is capable of deflecting downwards into said upper cavity;
a plurality of independently addressable electrodes disposed adjacent to said hybrid micromirror;
a plurality of electrical lines in direct electrical communication with said independently addressable electrodes;
an electronic control means in communication with said electrical lines, such that said hybrid micromirror is electrically driven to a predetermined angular orientation with respect to said outer most frame.
22. The apparatus according to Claim 21 wherein said hybrid micromirror is provided with a conductive film adjacent to its surface and across said cantilever hinge means and said gimbaled hinge means such that said hybrid micromirror is in electrical communication with said electronic control means.
23. The apparatus according to Claim 1 wherein said beam steering means is rigidly affixed in a predetermined orientation within said upper cavity.
24. The apparatus according to Claim 23 wherein a chemical bonding means for rigidly affixing said steering means is selected from the group consisting of one part or more liquid adhesives, ultraviolet radiation cured adhesives, or vapor phase applied adhesives.
25. The apparatus according to Claim 23 wherein surface forces such as surface tension, Van der Waals, residual surface charge, electrical discharge bonding, or the like, is employed to rigidly affix said steering means within said upper cavity.
26. The apparatus according to Claim 23 wherein a self soldering means is employed for rigidly affixing said beam steering means within said upper cavity.
27. The apparatus according to Claim 23 wherein a mechanical locking means for rigidly affixing said beam steering means within said upper cavity comprises one or more distal or lateral flaps extending beyond the distal or lateral edges, respectively, of said beam steering means such that when said beam steering means is deflected into said upper cavity, said distal or lateral flaps drag against one or more walls of said upper cavity and adhere to said wall by said surface forces.
28. The apparatus according to Claim 27 wherein said self solder means is provided on said distal or lateral flaps.
29. The apparatus according to Claim 23 wherein said mechanical locking means comprises one or more lockdown flaps extending beyond the edges of said upper cavity, such that after said beam steering means is deflected to said predetermined orientation within said upper cavity, said lockdown flaps are deflected downwards into said upper cavity until they adhere to said upper cavity wall by said surface forces, thereby preventing said beam steering means from deflecting upwards due to direct mechanical interference with said lockdown flaps.
30. The apparatus according to Claim 29 wherein said self solder means is provided on said lockdown flaps.
31. The apparatus according to Claim 23 wherein said mechanical locking means includes an incomplete anisotropic etch of said upper cavity wherein the floor of said upper cavity is etched to a predetermined depth such that mechanical interference between a fully deflected said beam steering means and said floor defines said predetermined orientation.
32. The apparatus according to Claim 31 wherein said self solder means is provided on distal end of said beam steering means.
33. A method for aligning an optical element within a cavity comprising:
providing substrate and a sacrificial pad disposed on a lower surface of said substrate for delineating an approximate extent of a lower most dimensions of said lower cavity;
depositing an etch resistant film over said sacrificial pad;
forming a hole through said etch resistant film, substantially centered on said sacrificial pad, said hole having a lateral dimensions sufficient to receive at least a portion of said optical element;
removing said sacrificial pad; and etching said lower cavity to form a rim of said etch resistant film that substantially confines said optical element inserted therein.
providing substrate and a sacrificial pad disposed on a lower surface of said substrate for delineating an approximate extent of a lower most dimensions of said lower cavity;
depositing an etch resistant film over said sacrificial pad;
forming a hole through said etch resistant film, substantially centered on said sacrificial pad, said hole having a lateral dimensions sufficient to receive at least a portion of said optical element;
removing said sacrificial pad; and etching said lower cavity to form a rim of said etch resistant film that substantially confines said optical element inserted therein.
34. A method for aligning and fixing an optical element with respect to a cavity of a substrate, comprising:
bonding said optical element to a cover plate with a predetermined orientation;
aligning said cover plate with respect to a surface of said substrate and said cavity; and bonding said cover plate to said surface of said substrate.
bonding said optical element to a cover plate with a predetermined orientation;
aligning said cover plate with respect to a surface of said substrate and said cavity; and bonding said cover plate to said surface of said substrate.
35. A method for aligning and fixing an optical element within a cavity of a substrate, comprising:
providing a cover plate;
forming a hole within said cover plate, said hole having a lateral dimensions sufficient to receive at least a portion of said optical element;
bonding said optical element at least partially withing said hole;
aligning said cover plate with respect to a surface of said substrate and said cavity; and bonding said cover plate to said surface of said substrate.
providing a cover plate;
forming a hole within said cover plate, said hole having a lateral dimensions sufficient to receive at least a portion of said optical element;
bonding said optical element at least partially withing said hole;
aligning said cover plate with respect to a surface of said substrate and said cavity; and bonding said cover plate to said surface of said substrate.
36. A method for thermally bonding a first microfabricated component to a second microfabricated component, comprising:
providing said first microfabricated component with a first surface and said second microfabricated component with a second surface;
micro-depositing and patterning a thermal adhesive material at a juncture site of the first surface and the second surface;
exposing said first surface and said second surface to a thermal environment for a sufficient time to form a mechanical bond between said first surface to said second surface.
providing said first microfabricated component with a first surface and said second microfabricated component with a second surface;
micro-depositing and patterning a thermal adhesive material at a juncture site of the first surface and the second surface;
exposing said first surface and said second surface to a thermal environment for a sufficient time to form a mechanical bond between said first surface to said second surface.
37. A method for electrothermally bonding a first microfabricated component to a second microfabricated, comprising:
providing said first microfabricated component with a first surface and said second microfabricated component with a second surface;
micro-depositing and patterning a thermal adhesive material at a juncture site of the first surface and the second surface;
positioning an electrically addressable heater means adjacent to and in thermal communication with said thermal adhesive material; and passing sufficient current through one or more said electrically addressable heater means to form a mechanical bond between said first surface to said second surface.
providing said first microfabricated component with a first surface and said second microfabricated component with a second surface;
micro-depositing and patterning a thermal adhesive material at a juncture site of the first surface and the second surface;
positioning an electrically addressable heater means adjacent to and in thermal communication with said thermal adhesive material; and passing sufficient current through one or more said electrically addressable heater means to form a mechanical bond between said first surface to said second surface.
38. A method for fabricating a hinge means coupled to a suspended plate, comprising:
providing an etchable substrate having a substrate surface, depositing a first thickness of a high fatigue strength material on said substrate surface;
depositing an etch resistant mask on said material and creatingopenings over a hinge area;
etching said hinge area to a second thickness in said material, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate surface;
etching said substrate to form a cavity beneath said plate; and dry etching said substrate, plate and said hinge area until said hinge area is etched below said substrate surface to a third predetermined thickness and a hinge is formed, wherein said plate with said first predetermined thickness is freely suspended above said cavity and integrally connected to said hinge, and said hinge is coupled to said material at a perimeter of said cavity.
providing an etchable substrate having a substrate surface, depositing a first thickness of a high fatigue strength material on said substrate surface;
depositing an etch resistant mask on said material and creatingopenings over a hinge area;
etching said hinge area to a second thickness in said material, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate surface;
etching said substrate to form a cavity beneath said plate; and dry etching said substrate, plate and said hinge area until said hinge area is etched below said substrate surface to a third predetermined thickness and a hinge is formed, wherein said plate with said first predetermined thickness is freely suspended above said cavity and integrally connected to said hinge, and said hinge is coupled to said material at a perimeter of said cavity.
39. A method for fabricating a hinge means coupled to a suspended plate, comprising:
providing an etchable substrate with a substrate surface and a sacrificial pad disposed on said surface of said substrate for delineating an approximate extent of said plate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
removing said sacrificial pad;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity.
providing an etchable substrate with a substrate surface and a sacrificial pad disposed on said surface of said substrate for delineating an approximate extent of said plate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
removing said sacrificial pad;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity.
40. A method for fabricating a hinge means coupled to a suspended plate, comprising:
providing an etchable substrate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
patterning an electrically conductive film over the substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said hinge areas to a third predetermined thickness, such that subsequent to an underetch of said plate, said hinges are sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity and an electrical path is provided across said hinge.
providing an etchable substrate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
patterning an electrically conductive film over the substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said hinge areas to a third predetermined thickness, such that subsequent to an underetch of said plate, said hinges are sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity and an electrical path is provided across said hinge.
41. A method for fabricating a hinge means for a suspended plate with integral, arbitrarily thin conductive hinges comprising the steps of:
providing an etchable substrate with a substrate surface and a sacrificial pad disposed on said surface of said substrate for delineating an approximate extent of said plate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
patterning an electrically conductive film over the substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said hinge areas to a third predetermined thickness, such that subsequent to an underetch of said plate, said hinges are sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
removing said sacrificial pad;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity and an electrical path is provided across said hinge.
providing an etchable substrate with a substrate surface and a sacrificial pad disposed on said surface of said substrate for delineating an approximate extent of said plate;
depositing a first layer with a first thickness of a high fatigue strength material on said substrate;
patterning an electrically conductive film over the substrate;
depositing an etch resistant mask on said material and creating openings over a hinge area;
etching said hinge area to a second thickness, such that subsequent to an underetch of said plate, said hinge area is sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
etching said hinge areas to a third predetermined thickness, such that subsequent to an underetch of said plate, said hinges are sufficiently stiff to prevent surface force induced sticking of said plate to said substrate;
removing said first etch resistant mask;
depositing a second etch resistant mask on said substrate with openings over areas defining free edges of said plate;
etching said free edges of said plate down to said substrate;
removing said sacrificial pad;
etching said substrate to form a cavity adjacent to said plate to produce an intermediate structure; and etching said intermediate structure until said hinge area is etched below said substrate surface to a third predetermined thickness and forming a hinge, wherein said plate of said first thickness is freely suspended above said cavity and coupled to said hinge, said hinge being coupled to said material of said first thickness disposed about a perimeter of said cavity and an electrical path is provided across said hinge.
42. A beam steering apparatus, comprising:
a reflective means;
a constraint means coupled to said reflective means to constrain movement of the reflective means in one or more degrees of freedom; and an independently addressable electrode configured to position said reflective means.
a reflective means;
a constraint means coupled to said reflective means to constrain movement of the reflective means in one or more degrees of freedom; and an independently addressable electrode configured to position said reflective means.
43. The apparatus of claim 42, wherein the constraint means constrains movement of the reflective means in two degrees of freedom.
44. The apparatus of claim 42, wherein the constraint means includes one or more elastically deformable members.
45. The apparatus of claim 42, wherein the apparatus is a laser printer engine and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
46. The apparatus of claim 42, wherein the apparatus is an optical storage head and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
47. The apparatus of claim 42, wherein the apparatus is a bar rastering projector and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
48. The apparatus of claim 42, wherein the apparatus is a laser plotter and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
49. The apparatus of claim 42, wherein the apparatus is a laser marking writing tool and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
50. The apparatus of claim 42, wherein the apparatus is a laser cutting apparatus and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
51. The apparatus of claim 42, wherein the apparatus is a surgical laser knife and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
52. The apparatus of claim 42, wherein the apparatus is an optical switch and further comprises:
a control means coupled to said addressable electrode.
a control means coupled to said addressable electrode.
53. The apparatus of claim 42, further comprising:
an electronic control means coupled with said addressable electrode.
an electronic control means coupled with said addressable electrode.
54. The apparatus of claim 53, wherein said reflective means is provided with a conductive film surface in communication with said electronic control means.
55. The apparatus of claim 42, wherein the constraint means is a gimbaled hinge means.
56. The apparatus of claim 42, wherein the constaint means is a cantilevered hinge means.
57. The apparatus of claim 42, wherein the constraint means is a gimbaled and cantilevered hinge means.
58. The apparatus of claim 42, wherein the constraint means is a compliant medium means.
59. The apparatus of claim 42, wherein said reflective means is moveably constrained in relation to said electrode.
60. The apparatus of claim 42, wherein said reflective means is deformable.
61. The apparatus of claim 42, wherein the beam steering means is at least partially micromachined.
Applications Claiming Priority (3)
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US08/695,717 US5872880A (en) | 1996-08-12 | 1996-08-12 | Hybrid-optical multi-axis beam steering apparatus |
US08/695,717 | 1996-08-12 | ||
PCT/US1997/011557 WO1998007060A1 (en) | 1996-08-12 | 1997-08-12 | Hybrid optical multi-axis beam steering apparatus |
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CA2263179A1 true CA2263179A1 (en) | 1998-02-19 |
CA2263179C CA2263179C (en) | 2010-05-11 |
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CA2263179A Expired - Fee Related CA2263179C (en) | 1996-08-12 | 1997-08-12 | Hybrid optical multi-axis beam steering apparatus |
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US (4) | US5872880A (en) |
EP (1) | EP0917660B1 (en) |
JP (1) | JP2001507469A (en) |
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DE3138968A1 (en) * | 1981-09-30 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | OPTICAL CONTROL DEVICE FOR CONTROLLING THE RADIATION GUIDED IN AN OPTICAL WAVE GUIDE, IN PARTICULAR OPTICAL SWITCHES |
JP2514343B2 (en) * | 1985-10-16 | 1996-07-10 | ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ | Optical device and optical waveguide coupling device |
FR2614702B1 (en) * | 1987-04-29 | 1989-06-09 | Angenieux P Ets | VARIABLE FOCAL LENS DEVICE AND ITS CONTROL METHOD |
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WO1995013638A1 (en) * | 1993-11-08 | 1995-05-18 | International Business Machines Corporation | Hybrid external coupled cavity semiconductor laser device |
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-
1996
- 1996-08-12 US US08/695,717 patent/US5872880A/en not_active Expired - Lifetime
-
1997
- 1997-08-12 EP EP97936949A patent/EP0917660B1/en not_active Expired - Lifetime
- 1997-08-12 AU AU39584/97A patent/AU3958497A/en not_active Abandoned
- 1997-08-12 CA CA2263179A patent/CA2263179C/en not_active Expired - Fee Related
- 1997-08-12 DE DE69718650T patent/DE69718650T2/en not_active Expired - Lifetime
- 1997-08-12 WO PCT/US1997/011557 patent/WO1998007060A1/en active IP Right Grant
- 1997-08-12 JP JP50970498A patent/JP2001507469A/en active Pending
- 1997-08-12 AT AT97936949T patent/ATE231626T1/en not_active IP Right Cessation
-
1998
- 1998-11-13 US US09/192,127 patent/US6137926A/en not_active Expired - Lifetime
- 1998-11-13 US US09/191,361 patent/US6086776A/en not_active Expired - Lifetime
-
2002
- 2002-08-16 US US10/223,078 patent/US7201824B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20050258133A9 (en) | 2005-11-24 |
JP2001507469A (en) | 2001-06-05 |
CA2263179C (en) | 2010-05-11 |
ATE231626T1 (en) | 2003-02-15 |
US20030141274A1 (en) | 2003-07-31 |
US6086776A (en) | 2000-07-11 |
AU3958497A (en) | 1998-03-06 |
EP0917660B1 (en) | 2003-01-22 |
DE69718650D1 (en) | 2003-02-27 |
US6137926A (en) | 2000-10-24 |
EP0917660A1 (en) | 1999-05-26 |
US7201824B2 (en) | 2007-04-10 |
WO1998007060A1 (en) | 1998-02-19 |
US5872880A (en) | 1999-02-16 |
DE69718650T2 (en) | 2003-10-30 |
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