CA2247442A1 - Method for isolating ultrafine and fine particles and resulting particles - Google Patents

Method for isolating ultrafine and fine particles and resulting particles

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Publication number
CA2247442A1
CA2247442A1 CA002247442A CA2247442A CA2247442A1 CA 2247442 A1 CA2247442 A1 CA 2247442A1 CA 002247442 A CA002247442 A CA 002247442A CA 2247442 A CA2247442 A CA 2247442A CA 2247442 A1 CA2247442 A1 CA 2247442A1
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CA
Canada
Prior art keywords
particles
acid
encapsulant material
metal
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002247442A
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French (fr)
Other versions
CA2247442C (en
Inventor
Berhan Tecle
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Individual
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Individual
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Publication of CA2247442A1 publication Critical patent/CA2247442A1/en
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Publication of CA2247442C publication Critical patent/CA2247442C/en
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Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/006—Coating of the granules without description of the process or the device by which the granules are obtained
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/0004—Preparation of sols
    • B01J13/0043—Preparation of sols containing elemental metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/30—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic using agents to prevent the granules sticking together; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/12—Making metallic powder or suspensions thereof using physical processes starting from gaseous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C09C1/627—Copper
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    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/67—Particle size smaller than 100 nm
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/68—Particle size between 100-1000 nm
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or Groups 14 to 16 of the Periodic system
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S977/776—Ceramic powder or flake
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2989—Microcapsule with solid core [includes liposome]

Abstract

A method of making isolated particles including the step of at least substantially encapsulating particles present in a highly dispersed colloidal suspension with an encapsulant material, such that the encapsulated particles remain independent and discrete upon separation from the suspension. Also, independent and discrete particles at least substantially encapsulated with the encapsulant material.

Claims (57)

1. A method for isolating particles, comprising the steps of:
preparing a highly dispersed colloidal suspension of solid particles, including a solvent that has been dried and degassed;

adding to the suspension an encapsulant material and allowing the encapsulant material to directly contact said solid particles, thereby at least partially covering the surfaces of individual particles to encapsulate said individual particles;

allowing the individually encapsulated particles to flocculate and settle out of the suspension thereby forming two phases, including a layer rich in the individually encapsulated particles and a solvent-rich layer; and isolating independent and discrete, individually encapsulated particles by separating the layer rich in said particles from the solvent-rich layer.
2. The method of claim 1, wherein the solvent is vacuum distilled.
3. The method of claim 1 or 2, wherein the encapsulated particles are ultrafine particles having a diameter of 100 nm or less.
4. The method of claim 1 or 2, wherein the encapsulated particles are fine particles having a diameter greater than 100 nm and less than 1500 nm.
5. The method of claim 1 or 2, wherein the encapsulated particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 30 or 72 to 82.
6. The method of claim 1 or 2, wherein the encapsulated particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
7. The method of claim 1 or 2, wherein the encapsulant material is at least one compound selected from an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate, a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
8. The method of claim 1 or 2, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-caynoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothizole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, undecanethiol, diundecyl disulfide, trimethyl-ethoxysilane, isopropyltriisostearoyl-titanate, neoalkoxyltrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropyl-napthalene sulfonate, and cetyltrimethyliammonium bromide, and derivatives thereof.
9. The method of claim 8, wherein the encapsulant material is at least one compound selected from malonic acid, oleic acid, 1,2,6-hexanetriol, and triethanolamine.
10. A method of isolating metal particles, comprising the steps of:

preparing a highly dispersed colloidal suspension of solid particles comprising at least one metal in an organic solvent that has been dried and degassed;

adding to the suspension an encapsulant material and allowing the encapsulant material to directly contact said solid particles, thereby at least partially covering the surfaces of individual metal particles to encapsulate said individual particles;

allowing the individually encapsulated metal particles to flocculate and settle out of the suspension thereby forming two phases, including a layer rich in the individually encapsulated metal particles and a solvent-rich layer; and isolating independent and discrete, individually encapsulated metal particles by separating the layer rich in said particles from the solvent-rich layer.
11. The method of claim 10, wherein the solvent is vacuum distilled.
12. The method of claim 10 or 11, wherein the organic solvent is a polar organic liquid.
13. The method of claim 10 or 11, wherein the encapsulated metal particles are ultrafine particles having a diameter of 100 nm or less.
14. The method of claim 10 or 11, wherein the encapsulated metal particles are fine particles having a diameter greater than 100 nm and less than 1500 nm.
15. The method of claim 10 or 11, wherein the highly dispersed colloidal suspension is prepared by the steps of:

vaporizing the metal or metals to obtain atoms and atom clusters of the metal or metals;

capturing the metal atoms and atom clusters in a vaporized state in the organic solvent;

freezing or substantially freezing the atom- and atom cluster-containing solvent to form a solid matrix;
and warming the solid matrix to substantially room temperature to form a highly dispersed colloidal suspension of metal particles.
16. The method of claim 15, wherein the solid matrix is warmed by adding solvent cooled to within 15°C of its freezing point to the solid matrix while agitating the solvent, and allowing the solvent and the matrix to warm to substantially room temperature.
17. The method of claim 15, wherein the solid matrix is warmed by contacting the solid matrix with solvent cooled to within 15°C of its freezing point while agitating the solvent, and allowing the solvent and the matrix to warm to substantially room temperature.
18. The method of claim 15, wherein the encapsulated particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
19. The method of claim 18, wherein the particles comprise at least one metal selected from cobalt, nickel, copper, palladium, silver, platinum, gold, tin, lead, and an alloy or mixture thereof.
20. The method of claim 10 or 11, wherein the encapsulant material is at least one compound selected from an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
21. The method of claim 20, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, undecanethiol, diundecyl disulfide, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, and derivatives thereof.
22. The method of claim 21, wherein the encapsulant material is at least one compound selected from malonic acid, oleic acid, 1,2,6-hexanetriol, and triethanolamine.
23. The method of claim 10 or 11, wherein the encapsulated metal particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
24. The method of claim 23, wherein the metal particles comprise at least one metal selected from the group consisting of cobalt, nickel, copper, palladium, silver, platinum, gold, tin, lead, and an alloy or mixture thereof.
25. The method of claim 24, wherein the metal particles comprise at least one metal selected from the group consisting of copper, tin, lead, and an alloy or mixture thereof.
26. The method of claim 22, wherein the encapsulant material is a mixture of malonic acid and triethanolamine.
27. The method of claim 12, wherein the organic solvent is selected from the group consisting of acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, triethylamine, benzaldehyde, acetaldehyde, tetrahydrofuran, and dimethyl sulfoxide.
28. The method of claim 27, wherein the organic solvent is selected from the group consisting of acetone, tetrahydrofuran, methanol, ethanol, 1-propanol, and 2-propanol.
29. The method of claim 28, wherein the organic solvent is tetrahydrofuran.
30. The method of claim 28, wherein the organic solvent is isopropanol.
31. The method of claim 1 or 2, wherein the particles are selected from the group consisting of silica, silicon, and alumina.
32. The method of claim 31, wherein the encapsulant material is selected form the group consisting of organosilanes, titanates, zirconates, and zircoaluminates.
33. The method of claim 32, wherein the encapsulant material is selected from the group consisting of trimethylethoxysilane, isopropyltriisostearoyltitanate, and neoalkoxytrisneodecanoylzirconate.
34. The method of claim 1 or 2, wherein the encapsulant material is selected from the group consisting of carboxylates, stearates, sulfates, sulfonates, and ammonium salts.
35. The method of claim 34, wherein the encapsulant material is selected from the group consisting of sodium stearate, sodium cetyl sulfate, sodium diisopropylnapthalene, sulfonate, and cetyltrimethylammonium bromide.
36. Independent and discrete ultrafine particles having a diameter of 100 nm or less encapsulated with an encapsulant material, wherein the encapsulant material is in direct contact with the surface of each ultrafine particle and is selected from at least one of an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate., a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
37. The particles of claim 36, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)-pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutryonitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chloro-benzotriazole, 2,4,6-triallyloxy-1,3,5-trazine, undecanethiol, diundecyl disulfide, trimethyl-ethoxysilane, isopropyltriisostearoyltitanate, neoaloxytrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropylnapthalene sulfonate, and cetyltrimethylammonium bromide, and derivatives thereof.
38. The particles of claim 37, wherein the encapsulant material is at least one compound selected from malonic acid, oleic acid, 1,2,6-hexanetriol, and triethanolamine.
39. The particles of claim 36, wherein the ultrafine particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
40. The particles of claim 36, wherein the encapsulated particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
41. Independent and discrete fine particles having a diameter greater than 100 nm and less than 1500 nm encapsulated with an encapsulant material, wherein the encapsulant material is in direct contact with the surface of each fine particle and is selected from at least one of an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate, a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
42. The particles of claim 41, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, a propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, undecanethiol, diundecyl disulfide, trimethylethoxysilane, isopropyltriisostearoyl-titante, neoalkoxytrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropyl-napthalene sulfonate, and cetyltrimethylammonium bromide, and derivatives thereof.
43. The particles of claim 42, wherein the encapsulant material is at least one compound selected from malonic acid, oleic acid, 1,2,6-hexanetriol, and triethanolamine.
44. The particles of claim 41, wherein the fine particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
45. The particles of claim 41, wherein the encapsulant particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
46. A method of coating a fiber, comprising the step of:
applying to the fiber discrete ultrafine or fine particles coated with an encapsulant material, wherein the encapsulant material is in direct contact with the surface of each ultrafine or fine particles and is selected from at least one of an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate, a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
47. The method of claim 46, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, undecanethiol, diundecyl disulfide, trimethyl-ethoxysilane, isopropyltriisostearoyl-titanate, neoalkoxytrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropyl-napthalene sulfonate, and cetyltrimethylammonium bromide,, and derivatives thereof.
48. The method of claim 46, wherein the particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
49. The method of claim 46, wherein the encapsulated particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
50. A method of forming a coating on a substrate, comprising the step of:

applying to the substrate a composition discrete ultrafine or fine particles coated with an encapsulant material, wherein the encapsulant material is in direct contact with the surface of each ultrafine or fine particle and is selected from at least one of an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate, a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof.
51. The method of claim 50, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, undecanethiol, diundecyl disulfide, trimethyl-ethoxysilane, isopropyltriisostearoyl-titanate, neoalkoxytrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropyl-napthalene sulfonate, and cetyltrimethylammonium bromide, and derivatives thereof.
52. The method of claim 50, wherein the particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
53. The method of claim 50, wherein the encapsulated particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
54. A method of joining metal to a substrate, comprising the steps of:

applying to the substrate discrete ultrafine or fine particles coated with an encapsulant material, wherein the encapsulant material is in direct contact with the surface of each ultrafine or fine particle and is selected from at least one of an amine, an ether, a thiol, a sulfide, a carboxylic acid, a hydroxy acid, a sulfonic acid, a polyhydroxy alcohol, an organosilane, a titanate, a zirconate, a zircoaluminate, a carboxylate, a sulfate, a sulfonate, an ammonium salt, a pyrrole, a furan, a thiophene, an imidazole, an oxazole, a thiazole, a pyrazole, a pyrroline, a pyrrolidine, a pyridine, a pyrimidine, a purine, a triazole, a triazine, and derivatives thereof; and placing said metal to be joined in contact with the discrete ultrafine or find particles.
55. The method of claim 54, wherein the encapsulant material is at least one compound selected from triethanol amine, ethylenediamine, oleic acid, malonic acid, hydroxyacetic acid, dimethyl sulfoxide, propylene glycol, hexanetriol, dioxane, diethylene glycol dimethyl ether, dimethylformamide, 1-(2-cyanoethyl)pyrrole, 3-(2-furyl)acrylonitrile, 3-thiophenemalonic acid, mercaptobenzimidazole, 2-mercaptobenzoxazole, 6-aminobenzothiazole, 3-(2-aminoethyl)pyrazole, 1-pyrrolidinebutyronitrile, 3-pyridineacrylic acid, 4,6-dihydroxypyrimidine, 6-mercaptopurine, 1-chlorobenzotriazole, 2,4,6-triallyloxy-1,3,5-triazine, undecanethiol, diundecyl disulfide, trimethyl-ethoxysilane, isopropyltriisostearoyl-titanate, neoalkoxytrisneodecanoylzirconate, sodium stearate, sodium cetyl sulfate, sodium diisopropyl-napthalene sulfonate, and cetyltrimethylammonium bromide, and derivatives thereof.
56. The method of claim 54, wherein the particles comprise at least one metal having an atomic number ranging from 21 to 32, 39 to 50 or 72 to 82.
57. The method of claim 54, wherein the encapsulated particles comprise at least one of metal elements, organic or inorganic compounds capable of forming colloidal suspensions of particles, and solid non-metal elements capable of forming colloidal suspensions of particles.
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